RGB lamp bead with high luminous efficiency

Abstract

The utility model provides a high-luminous-efficiency RGB (Red, Green and Blue) lamp bead, which comprises an LED (Light Emitting Diode) bracket and a packaging structure arranged in the LED bracket, the packaging structure comprises a first bonding wire part, a second bonding wire part, a third bonding wire part, a first green light chip, a second green light chip, a red light chip and a blue light chip, wherein the first bonding wire part, the second bonding wire part and the third bonding wire part are arranged in the LED bracket; the first green light chip and the second green light chip are arranged close to the first bonding wire part; the red light chip is arranged close to the second bonding wire part; the two green light chips, the red light chip and the blue light chip are sequentially arranged, the first bonding wire part is connected with the two green light chips through a first bonding wire, the second bonding wire part is connected with the red light chip through a second bonding wire, and the third bonding wire part is connected with the blue light chip through a third bonding wire. According to the RGB lamp bead with the high luminous efficiency, on the basis of an original packaging structure, the overall performance of the lamp bead is improved by changing a die bonding process structure, increasing the number of the green light chips and improving the brightness of the chips in the light emitting process.

Description

Technical Field

[0001] The utility model relates to the technical field of LED production and manufacturing, in particular to an RGB lamp bead with high light efficiency. Background Art

[0002] With the widespread application of display technology and the diversification of application scenarios, LED display devices, a key component of display screens, have become increasingly important. Consequently, the requirements for the optoelectronic performance of LEDs are becoming increasingly stringent. From the perspective of LED technology, packaging technology and product structure have a significant impact on their optoelectronic parameters. The early LED process generally involved die bonding, wire bonding, glue dispensing, blanking, beam splitting, taping, packaging, and shipping. However, with increasingly demanding market requirements and a wider range of operating environments, higher brightness requirements are being placed on displays. Consequently, the brightness requirements for RGB devices are also increasing.

[0003] In the field of LED packaging, improving brightness has long been a key focus for researchers. Therefore, the overall trend in the LED industry is to modify existing packaging structures to achieve reasonably low packaging costs, high brightness, and high-efficiency products, as well as reliability research. Since display products do not incorporate phosphors, the luminous intensity is primarily determined by the chip itself, making improvements in light intensity even more dependent on chip selection. However, due to cost pressures and mature chip technology, product brightness has not improved. Relying solely on raw materials to increase product brightness and luminous efficiency is no longer realistic. Improving product brightness and luminous efficiency requires addressing both the packaging structure and the packaging process. Utility Model Content

[0004] In view of the shortcomings of the existing technology, the purpose of the present invention is to provide a high-light-efficiency RGB lamp bead, aiming to solve the technical problems mentioned in the background technology.

[0005] In order to achieve the above purpose, the present invention is implemented through the following technical solutions:

[0006] A high-light-efficiency RGB lamp bead includes an LED bracket and a packaging structure arranged in the LED bracket. The packaging structure includes a first bonding wire portion, a second bonding wire portion, a third bonding wire portion, a first green light chip and a second green light chip arranged near the first bonding wire portion, a red light chip arranged near the second bonding wire portion, and a blue light chip arranged near the third bonding wire portion. The two green light chips, the red light chip, and the blue light chip are arranged in sequence. The first bonding wire portion is connected to the two green light chips via a first bonding wire, the second bonding wire portion is connected to the red light chip via a second bonding wire, and the third bonding wire portion is connected to the blue light chip via a third bonding wire.

[0007] According to one aspect of the above technical solution, the first green chip and the second green chip are arranged side by side, and the first bonding portion includes a first bonding area below the first green chip and a second bonding area on the side of the second green chip.

[0008] According to one aspect of the above technical solution, the red light chip is located below the second green light chip, and the second bonding portion includes a third bonding area located on the side of the red light chip, and the third bonding area is located below the second bonding area.

[0009] According to one aspect of the above technical solution, the blue light chip is located below the red light chip, and the third bonding wire portion includes a fourth bonding wire area and a fifth bonding wire area located on both sides of the blue light chip, the fourth bonding wire area is located below the first bonding wire area, and the fifth bonding wire area is located below the third bonding wire area.

[0010] According to one aspect of the above technical solution, the LED bracket includes a bowl body and a bowl cup, and the packaging structure is located in the bowl cup.

[0011] According to one aspect of the above technical solution, the LED bracket is made of PPA material, a metal pin is embedded in the bowl body, and the first welding wire part, the second welding wire part and the third welding wire part are all connected to the metal pin.

[0012] According to one aspect of the above technical solution, the packaging structure further includes packaging glue filled in the bowl.

[0013] According to one aspect of the above technical solution, the red light chip is connected to the bowl cup via silver glue, the silver glue is connected to the metal pin, and the bowl cup is respectively connected to the green light chip and the blue light chip via insulating glue.

[0014] Compared with the prior art, the beneficial effects of the present invention are:

[0015] Since the green chip is the main source of brightness for the RGB lamp beads, in order to improve the brightness, based on the original product, two small-sized green chips are selected and fixed in the bracket bowl cup by die-bonding glue. The positive and negative poles of the two green chips are connected by bonding wires in the middle to form a series circuit; the positions of the R chip and the G chip are swapped, and the die-bonding process remains unchanged. They are fixed in the bracket bowl cup, and the chip and the bracket are electrically connected by bonding wires, in parallel with each other. Then, the encapsulation glue is applied to complete the dispensing. Finally, after baking, the chips are blanked into individual lamp beads, which are convenient, reliable and practical to use.

[0016] Based on the packaging structure of the original RGB lamp bead product, the utility model changes the solid crystal process structure, increases the number of green light chips, improves the brightness of the chips when emitting light, and improves the overall performance of the lamp beads. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic diagram of the structure of RGB lamp beads in the prior art;

[0018] Figure 2 This is a schematic diagram of the front structure of the high-light-efficiency RGB lamp bead in an embodiment of the present utility model;

[0019] Figure 3 This is a schematic diagram of the cross-sectional structure of a high-light-efficiency RGB lamp bead in an embodiment of the present utility model;

[0020] Figure 4 This is a diagram of the die bonding wires for the high-light-efficiency RGB lamp beads in the embodiment of the present utility model;

[0021] Description of main component symbols:

[0022] Red light chip 33 Greenlight Chip 50 Blu-ray chip 34 bowls and cups 11 Bowl 12 LED bracket 10 First bonding area 21 Second bonding area 22 The third bonding area 23 Fourth bonding area 24 Fifth bonding area 25 The first green chip 31 Second green chip 32 Second bond wire 72 Third bond wire 73 packaging glue 41 Metal pins 42 Insulation glue 61 Silver glue 62 First bond wire 71

[0023] The following specific embodiments will further illustrate the present invention in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0024] To facilitate understanding of the present invention, a more comprehensive description of the present invention will be provided below with reference to the accompanying drawings. The drawings illustrate several embodiments of the present invention. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and comprehensive understanding of the present invention.

[0025] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be an intermediate element. When an element is referred to as being "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only.

[0026] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this invention pertains. The terms used herein in the specification of this invention are intended only to describe specific embodiments and are not intended to limit the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0027] See also Figures 2 to 4, shown is a high-light-efficiency RGB lamp bead in an embodiment of the present invention, including an LED bracket 10 and a packaging structure provided in the LED bracket 10, the packaging structure including a first bonding wire portion, a second bonding wire portion, a third bonding wire portion, a first green chip 31 and a second green chip 32 arranged near the first bonding wire portion, a red chip 33 arranged near the second bonding wire portion, and a blue chip 34 arranged near the third bonding wire portion. The two green chips, the red chip 33, and the blue chip 34 are arranged in sequence, the first bonding wire portion is connected to the two green chips through a first bonding wire 71, the second bonding wire portion is connected to the red chip 33 through a second bonding wire 72, and the third bonding wire portion is connected to the blue chip 34 through a third bonding wire 73.

[0028] It can be understood that since the green chip is the main source of brightness of the RGB lamp beads, in order to improve the brightness, the utility model selects a small-sized first green chip 31 and a second green chip 32 on the basis of the original product, fixes the two in the bracket bowl cup 11 by using a solid crystal glue, and connects the positive and negative poles of the two green chips in the middle by a bonding wire to form a series circuit; the positions of the R chip and the G chip are swapped, and the solid crystal process remains unchanged from the original process. They are fixed in the bracket bowl cup 11, and the chip and the bracket are electrically connected by bonding wires, and are connected in parallel with each other. Then, the packaging glue 41 is applied to complete the dispensing, and finally, the material is baked and blanked into lamp beads, which are convenient and reliable to use and have strong practicality.

[0029] Based on the packaging structure of the original RGB lamp bead product, the utility model changes the solid crystal process structure, increases the number of green light chips, improves the brightness of the chips when emitting light, and improves the overall performance of the lamp beads.

[0030] Specifically, in this embodiment, the first green chip 31 and the second green chip 32 are arranged side by side. The first bonding portion includes a first bonding area 21 located below the first green chip 31 and a second bonding area 22 located to the side of the second green chip 32. The red chip 33 is located below the second green chip 32. The second bonding portion includes a third bonding area 23 located to the side of the red chip 33. The third bonding area 23 is located below the second bonding area 22. The blue chip 34 is located below the red chip 33. The third bonding portion includes a fourth bonding area 24 and a fifth bonding area 25 located on both sides of the blue chip 34. The fourth bonding area 24 is located below the first bonding area 21, and the fifth bonding area 25 is located below the third bonding area 23.

[0031] See also Figure 1, it can be understood that the existing RGB lamp bead layout is that the red light chip 33, the green light chip 50 and the blue light chip 34 are arranged in sequence from top to bottom. Since the positive and negative poles of the red light chip 33 are respectively located at the upper and lower ends, only one bonding wire is needed to connect to the bonding area. Therefore, the red light chip 33 has a bonding area on only one side. The utility model utilizes this feature to replace the red light chip 33 with the green light chip, so that the red light chip 33 is placed in the middle. The red light chip 33 is connected to the third bonding area 23 on its right side, and a second green light chip 32 is arranged in the position of the original red light chip 33. Since there is no bonding area on one side of the red light chip 33, a first green light chip 31 can be arranged. The two green light chips are connected in series and are respectively connected to the first bonding area 21 and the second bonding area 22 through the first bonding wire 71. The utility model can increase the number of green light chips without affecting the size of the lamp bead, thereby improving the lighting efficiency.

[0032] Furthermore, the LED bracket 10 includes a bowl body 12 and a bowl cup 11, and the packaging structure is located in the bowl cup 11; the LED bracket 10 is made of PPA material, and a metal pin 42 is embedded in the bowl body 12, and the first welding wire part, the second welding wire part and the third welding wire part are all connected to the metal pin 42.

[0033] It can be understood that the green chip is electrically connected to the metal pin 42 through the first bonding wire 71 and the first bonding wire portion, and the blue chip 34 is electrically connected to the metal pin 42 through the third bonding wire 73 and the third bonding wire portion.

[0034] Furthermore, the red light chip 33 is connected to the bowl cup 11 via silver glue 62 , the silver glue 62 is connected to the metal pin 42 , and the bowl cup 11 is connected to the green light chip and the blue light chip 34 via insulating glue 61 .

[0035] It can be understood that one end of the red light chip 33 is electrically connected to the metal pin 42 through the second bonding wire 72 and the third bonding wire area 23, and the other end is electrically connected to the metal pin 42 through the silver glue 62. Because the silver glue 62 has a conductive function, the green light chip and the blue light chip 34 have already been electrically connected to the metal pin 42 through the bonding wire, so they only need to be fixed to the bowl cup 11 through the insulating glue 61.

[0036] Furthermore, the packaging structure also includes a packaging glue 41 filled in the bowl cup 11.

[0037] It is understandable that the light emitted by the green chip, the red chip 33 and the blue chip 34 can be diffused through the packaging glue 41 to improve the light efficiency.

[0038] In summary, the high-light-efficiency RGB lamp beads in the above embodiments of the present invention, since the green light chip is the main brightness source of the RGB lamp beads, in order to improve the brightness, by selecting small-sized green light chips on the basis of the original product, fixing two of them in the bracket bowl cup by die-bonding glue, and connecting the positive and negative poles of the two green light chips in the middle by bonding wires to form a series circuit; the positions of the R chip and the G chip are swapped, and the die-bonding process remains the same as the original process, fixed in the bracket bowl cup, and electrically connected to the chip and the bracket by bonding wires, and connected in parallel with each other, and then the packaging glue is applied to complete the dispensing, and finally baked and blanked into lamp beads, which are convenient and reliable to use and highly practical;

[0039] Based on the packaging structure of the original RGB lamp bead product, the utility model changes the solid crystal process structure, increases the number of green light chips, improves the brightness of the chips when emitting light, and improves the overall performance of the lamp beads.

[0040] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "examples," "specific examples," or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with that embodiment or example are included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0041] The above-described embodiments merely represent several implementation methods of the present invention. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that a person skilled in the art would be able to make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements fall within the scope of protection of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

Claims

1. A high-light-efficiency RGB lamp bead, characterized in that: The invention comprises an LED bracket and a packaging structure arranged in the LED bracket, wherein the packaging structure comprises a first bonding wire portion, a second bonding wire portion, a third bonding wire portion, a first green light chip and a second green light chip arranged near the first bonding wire portion, a red light chip arranged near the second bonding wire portion, and a blue light chip arranged near the third bonding wire portion. The two green light chips, the red light chip and the blue light chip are arranged in sequence. The first bonding wire portion is connected to the two green light chips through a first bonding wire, the second bonding wire portion is connected to the red light chip through a second bonding wire, and the third bonding wire portion is connected to the blue light chip through a third bonding wire.

2. The high-light-efficiency RGB lamp bead according to claim 1, characterized in that: The first green chip and the second green chip are arranged side by side, and the first bonding portion includes a first bonding area located below the first green chip and a second bonding area located on the side of the second green chip.

3. The high-light-efficiency RGB lamp bead according to claim 2, characterized in that: The red light chip is located below the second green light chip. The second bonding wire portion includes a third bonding wire area located on the side of the red light chip. The third bonding wire area is located below the second bonding wire area.

4. The high-light-efficiency RGB lamp bead according to claim 3, characterized in that: The blue light chip is located below the red light chip, and the third bonding wire portion includes a fourth bonding wire area and a fifth bonding wire area located on both sides of the blue light chip. The fourth bonding wire area is located below the first bonding wire area, and the fifth bonding wire area is located below the third bonding wire area.

5. The high-light-efficiency RGB lamp bead according to claim 1, characterized in that: The LED bracket includes a bowl body and a bowl cup, and the packaging structure is located in the bowl cup.

6. The high-light-efficiency RGB lamp bead according to claim 5, characterized in that: The LED bracket is made of PPA material, a metal pin is embedded in the bowl body, and the first welding wire part, the second welding wire part and the third welding wire part are all connected to the metal pin.

7. The high-light-efficiency RGB lamp bead according to claim 5, characterized in that: The packaging structure further includes packaging glue filled in the bowl.

8. The high-light-efficiency RGB lamp bead according to claim 5, characterized in that: The red light chip is connected to the bowl cup via silver glue, and the bowl cup is connected to the green light chip and the blue light chip via insulating glue respectively.

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