Assembling mechanism for semiconductor test probe
Through the assembly mechanism that cooperates with the robotic arm body and the support assembly, the problems of blockage and inaccurate positioning of the suction structure are solved, and high-precision assembly and stable fixation of the semiconductor test probe are achieved, improving the accuracy and applicability of the assembly.
Patent Information
- Application Number
- CN202422558780.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-23
- Publication Date
- 2025-08-22
- Estimated Expiration
- 2034-10-23
AI Technical Summary
In the prior art, the assembly mechanism of the semiconductor test probe is susceptible to dust and impurities, and the suction structure may be blocked, resulting in unsolid adsorption and insufficient positioning accuracy, which affects the assembly accuracy and the accuracy of the test results.
The assembly mechanism that combines the robotic arm body and the support assembly is adopted to achieve a tight fit and fixation of the needle tube through the mutual cooperation of multiple composite springs, connecting rods and sliding plates, and fixing and installing the needle tube using the L-shaped positioning plate and positioning bolts, combining rubber gaskets and anti-slip rubber pads to improve positioning accuracy and stability.
It improves the accuracy and applicability of probe assembly, ensures the fixed limit of needle tubes of different specifications, simplifies the assembly process, and improves the practicality of assembly and the reliability of test results.
Smart Images

Figure CN223251718U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of semiconductor test probes, and in particular to an assembly mechanism for semiconductor test probes. Background Art
[0002] As we all know, semiconductor test probes are mainly used as tools for conducting conductivity tests between semiconductors and PCB boards. The probes need to be assembled before use. The assembly process mainly involves pressing the probe tip onto the needle tube.
[0003] At present, in the relevant technology, after searching, the utility model with patent publication number CN218639018U discloses an assembly mechanism for a semiconductor test probe, including a pressure head and an air suction structure, the air suction structure is arranged on the pressure head, and the air suction structure is used to adsorb the needle head of the semiconductor probe on the pressure head; it also includes a positioning jig, the pressure head and the positioning jig are arranged correspondingly up and down, and the positioning jig is used to position and fix the needle tube of the semiconductor probe.
[0004] Regarding the above-mentioned related technologies, although the suction method is used to firmly suck the needle to avoid collision and wear of the needle tip and to protect the needle to the maximum extent, the applicant found that the following usage defects still exist. Since the suction structure is easily affected by dust, impurities, etc., the suction hole may be blocked by dust and impurities, resulting in loose adsorption and affecting the accuracy of probe assembly. Secondly, the positioning fixture is used to position and fix the needle tube, but there may be a problem of insufficient positioning accuracy. If the positioning of the needle tube is inaccurate, it may cause deviations in the probe assembly, affecting the accuracy of the test results and insufficient practicality.
[0005] Therefore, we propose an assembly mechanism for semiconductor test probes. Utility Model Content
[0006] The purpose of the present utility model is to provide an assembly mechanism for semiconductor test probes to solve the problems raised in the above background technology.
[0007] To achieve the above objectives, the present invention provides the following technical solutions:
[0008] An assembly mechanism for a semiconductor test probe, comprising:
[0009] base;
[0010] A robotic arm body, the robotic arm body being arranged in the base through a mounting slot, and a control panel being provided on the robotic arm body;
[0011] A rectangular seat, which is detachably connected to the base via a connecting assembly and has a placement hole formed therein;
[0012] Two sliding plates, both of which are slidably connected to the rectangular seat through an adjustment groove, one end of the sliding plate is connected to the inner wall of the adjustment groove through a plurality of composite springs, and the other end of the sliding plate is fixedly connected to two connecting rods, the connecting rods extend through the connecting holes into the placement holes and are fixedly connected to positioning rubber blocks;
[0013] The support assembly is arranged in the base and is used to support the base and place it in the use position.
[0014] As a further solution of the present invention: the connecting assembly includes two L-shaped positioning plates, and the two L-shaped positioning plates are fixedly connected to the base through a plurality of positioning bolts, and the two L-shaped positioning plates are tightly fitted with the rectangular seat.
[0015] As a further solution of the present invention: rubber pads are fixedly connected to opposite ends of the two L-shaped positioning plates.
[0016] As a further solution of the present invention: the support assembly includes four support columns, and the four support columns are all arranged in the base through connecting grooves, and the other ends of the support columns are fixedly connected to the support seat.
[0017] As a further solution of the present invention: the other ends of the plurality of support seats are fixedly connected with anti-slip rubber pads.
[0018] As a further solution of the present invention: two groups of rubber gaskets are correspondingly arranged in the placement holes.
[0019] Compared with the prior art, the beneficial effects of the present invention are:
[0020] By setting up a support component, with the cooperation of multiple support columns and support seats, the base support is placed in the use position. At the same time, by setting up a connecting component, with the cooperation of the L-shaped positioning plate and the positioning bolt, the rectangular seat is fixedly installed on the base, and then the needle tube to be processed is placed into the placement hole. At the same time, with the cooperation of multiple composite springs, connecting rods, and sliding plates, the positioning rubber block is tightly fitted with the needle tube to be processed, so as to achieve the purpose of fixing and limiting the needle tube to be processed. Then, by setting up a control panel, the robot arm body is started, and the probe is taken out of the robot arm body and combined with the needle tube. The overall structure is relatively simple, which is convenient for combining the probe and the needle tube, and compared with the existing technology, the accuracy of the probe assembly is improved. At the same time, it is convenient to fix and limit needle tubes of different specifications, which improves applicability, has good practicality, and is conducive to promotion and use. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] Figure 1 This is a schematic diagram of the overall main view of the three-dimensional structure of the utility model;
[0022] Figure 2 It is a schematic diagram of the three-dimensional structure of the utility model in a partially cutaway view of the entire main view;
[0023] Figure 3 For this utility model Figure 2 Schematic diagram of the local enlarged structure at A in the middle;
[0024] Figure 4 It is a schematic diagram of the overall main plan structure of the utility model.
[0025] In the figure: 1. Base; 2. Robotic arm body; 3. Control panel; 4. Rectangular seat; 5. Sliding plate; 6. Composite spring; 7. Connecting rod; 8. Positioning rubber block; 9. L-shaped positioning plate; 10. Positioning bolt; 11. Rubber pad; 12. Support column; 13. Support seat; 14. Anti-slip rubber pad; 15. Rubber gasket. DETAILED DESCRIPTION
[0026] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.
[0027] The present application is further described in detail below with reference to the accompanying drawings.
[0028] See also Figures 1 to 4 In an embodiment of the present invention, an assembly mechanism for a semiconductor test probe includes:
[0029] Base 1;
[0030] The robot arm body 2 is arranged in the base 1 through a mounting slot, and a control panel 3 is provided on the robot arm body 2;
[0031] The rectangular seat 4 is detachably connected to the base 1 through a connecting assembly, and a placement hole is opened in the rectangular seat 4;
[0032] Two sliding plates 5, both of which are slidably connected to the rectangular seat 4 through the adjustment groove, one end of the sliding plate 5 is connected to the inner wall of the adjustment groove through a plurality of composite springs 6, and the other end of the sliding plate 5 is fixedly connected to two connecting rods 7, which extend through the connecting hole into the placement hole and are fixedly connected to the positioning rubber block 8;
[0033] The support assembly is arranged in the base 1 and is used to support the base 1 and place it in the use position.
[0034] The assembly mechanism for the semiconductor test probe can, when in use, be able to support and place its base 1 in the use position by setting a support component, and then fix its rectangular seat 4 on the base 1 by setting a connecting component, and then put the needle tube to be processed into the placement hole, and then, through the mutual cooperation of multiple composite springs 6, connecting rods 7, and sliding plates 5, make its positioning rubber block 8 fit tightly with the needle tube to be processed, playing the role of fixing and limiting the needle tube to be processed, and then, by setting a control panel 3, the robot arm body 2 is adjusted, and the probe is taken up by the robot arm body 2 and combined with the needle tube.
[0035] exist Figure 1-3 Middle: The connecting assembly includes two L-shaped positioning plates 9, which are fixedly connected to the base 1 through multiple positioning bolts 10. The two L-shaped positioning plates 9 fit tightly with the rectangular seat 4, and the opposite ends of the two L-shaped positioning plates 9 are fixedly connected with rubber pads 11.
[0036] The assembly mechanism for the semiconductor test probe, through the setting of this structure, facilitates the fixed installation of its rectangular seat 4 on the base 1 with the cooperation of two L-shaped positioning plates 9 and multiple positioning bolts 10. Its detachable connection method facilitates the corresponding maintenance and repair of the structural components in the rectangular seat 4.
[0037] exist Figure 1-4 Middle: The support assembly includes four support columns 12, and the four support columns 12 are all arranged in the base 1 through connecting grooves. The other end of the support column 12 is fixedly connected to the support seat 13, and the other ends of the multiple support seats 13 are fixedly connected to the anti-slip rubber pad 14 that increases the friction between the support seat 13 and the placement ground. Two groups of rubber gaskets 15 are correspondingly arranged in the placement hole to prevent the needle tube from making hard contact with the placement hole.
[0038] In this embodiment, the robot arm body 2 is a well-known device purchased directly from the market by technicians in this field. It can be customized or selected according to actual needs. Here we only use it and do not make any structural and functional improvements to it. We will not go into details here. The robot arm body 2 is provided with a control switch that matches it. The installation position of the control switch is selected according to actual use needs to facilitate the operator to operate and control. The technology is very mature and can be implemented.
[0039] The implementation principle of an assembly mechanism for a semiconductor test probe in an embodiment of the present application is as follows: first, through the mutual cooperation of multiple support columns 12 and support seats 13, its base 1 is supported and placed in the use position, and at the same time, through the mutual cooperation of L-shaped positioning plates 9 and positioning bolts 10, the rectangular seat 4 is fixedly installed on the base 1. The user then places the needle tube to be processed into the placement hole, and then through the mutual cooperation of multiple composite springs 6, connecting rods 7, and sliding plates 5, the positioning rubber block 8 is tightly fitted with the needle tube to be processed, which plays a role in fixing and limiting the needle tube to be processed. Then, the control panel 3 is set to control the robot arm body 2, and the probe is taken up through the robot arm body 2 to combine it with the needle tube.
[0040] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. An assembly mechanism for a semiconductor test probe, characterized in that: include: Base (1); A robotic arm body (2), the robotic arm body (2) being arranged in the base (1) via a mounting slot, and a control panel (3) being arranged on the robotic arm body (2); A rectangular seat (4), wherein the rectangular seat (4) is detachably connected to the base (1) via a connecting assembly, and a placement hole is provided in the rectangular seat (4); Two sliding plates (5), both of which are slidably connected to the rectangular seat (4) through the adjustment groove, one end of the sliding plate (5) is connected to the inner wall of the adjustment groove through a plurality of composite springs (6), and the other end of the sliding plate (5) is fixedly connected to two connecting rods (7), and the connecting rods (7) extend into the placement hole through the connecting hole and are fixedly connected to the positioning rubber block (8); A support assembly is provided in the base (1) and is used to support the base (1) and place it in a use position.
2. The assembly mechanism for a semiconductor test probe according to claim 1, characterized in that: The connection assembly includes two L-shaped positioning plates (9), and the two L-shaped positioning plates (9) are fixedly connected to the base (1) through a plurality of positioning bolts (10). The two L-shaped positioning plates (9) are tightly fitted with the rectangular seat (4).
3. The assembly mechanism for a semiconductor test probe according to claim 2, wherein: The opposite ends of the two L-shaped positioning plates (9) are both fixedly connected with rubber pads (11).
4. The assembly mechanism for a semiconductor test probe according to claim 1, wherein: The support assembly comprises four support columns (12), each of which is arranged in the base (1) through a connection groove, and the other end of each support column (12) is fixedly connected to a support seat (13).
5. The assembly mechanism for semiconductor test probes according to claim 4, characterized in that: The other ends of the plurality of support seats (13) are all fixedly connected with anti-slip rubber pads (14).
6. The assembly mechanism for semiconductor test probes according to claim 1, characterized in that: Two groups of rubber gaskets (15) are correspondingly arranged in the placement holes.