Circuit verification device
By setting up jumper modules and packaging modules on the circuit board, flexible connections for circuit verification are achieved, and problems of high circuit verification costs and waste of resources in the prior art are solved, and flexible circuit verification solutions are provided.
Patent Information
- Application Number
- CN202421295772.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-06
- Publication Date
- 2025-08-22
- Estimated Expiration
- 2034-06-06
AI Technical Summary
The existing circuit verification method uses flying wire to make physical circuits with problems such as the welding points being easily disconnected, resulting in failure of verification and high cost and serious waste of resources.
Set up jumper modules and multiple package modules on the circuit board to achieve circuit verification through jumper connections. It is suitable for devices of various package types, and supports rapid installation and disassembly of devices to avoid welding damage.
It realizes the flexibility and reuse of circuit verification, reduces design costs, avoids resource waste, and is suitable for the verification needs of most circuits.
Smart Images
Figure CN223259833U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of integrated circuit testing, and in particular to a circuit verification device. Background Art
[0002] When designing a circuit, it is often necessary to verify the circuit's functionality and improve the circuit based on the verification results. However, the current circuit verification method still involves fabricating a physical circuit based on the designed circuit diagram and then performing measurement verification.
[0003] Because the circuit primarily uses SMT (Surface Mount Technology) components, creating a physical circuit using flying leads is cumbersome. Furthermore, since the solder at the fly lead soldering points is low, even slightly higher currents can cause the solder at these points to melt, disconnecting the fly lead and causing circuit verification failure. Furthermore, due to the high trial-and-error costs of hardware production, creating a physical circuit each time for verification typically results in higher design costs and a waste of resources. Utility Model Content
[0004] In view of this, the main purpose of this application is to provide a circuit verification device, which can be used for the verification of multiple circuits by setting multiple packaging modules corresponding to multiple packaging devices on the circuit board, and jumpering the jumper terminals of each packaging module into multiple circuits to be verified.
[0005] To achieve the above-mentioned object, the present application provides a circuit verification device, comprising at least one jumper module and a plurality of packaging modules provided on a circuit board, wherein the plurality of packaging modules correspond to devices of various packaging types used in the circuit verification process;
[0006] Each of the package modules comprises at least one package base for mounting a device of a corresponding package type and a plurality of jumper terminals connected to pins of the package base;
[0007] The jumper module includes a plurality of jumper terminals, and at least one jumper terminal is connected to a plurality of other jumper terminals at the same time;
[0008] When performing circuit verification, the verification test of the circuit to be verified is achieved by installing each device in the circuit to be verified into the corresponding packaging modules respectively, and connecting the jumper terminals of each packaging module and the jumper module according to the connection relationship of the circuit to be verified.
[0009] From the above, the present application provides a circuit verification device, which sets a jumper module and multiple packaging modules on a circuit board, wherein the packaging bases of the multiple packaging modules can correspond to the installation of devices of multiple packaging types used in the circuit verification process, and the pins of each packaging base are respectively connected to the jumper terminals. When circuit verification is required, the devices required for circuit verification can be installed on the packaging base of the corresponding packaging module, and the corresponding jumper terminals are connected by jumpers according to the connection relationship of the circuit to be verified, so that the function of the connected circuit can be verified. When circuit verification needs to be performed, the present application can install the relevant devices on the packaging module and use jumper connections to form the circuit to be verified. It can be reused to meet the verification requirements of most circuits.
[0010] Optionally, it further includes a signal input terminal and a signal output terminal provided on the circuit board, wherein the signal input terminal and the signal output terminal are connected to the jumper terminals of the packaging module and the jumper module via a jumper.
[0011] As described above, by setting the signal input terminal and the signal output terminal on the circuit board, and when connecting the circuit, according to the circuit design, the signal input terminal and the signal output terminal are connected to the jumper terminals of the packaging module and the jumper module by using jumpers.
[0012] Optionally, each device in the circuit to be verified is mounted on the packaging base of the packaging module in a patch manner.
[0013] As described above, the components in the circuit to be verified are attached to the package base of the package module by patch mounting, so that they can be quickly disassembled after the circuit verification is completed without causing damage to the package base and components, so that the package module can be reused.
[0014] Optionally, the packaging type includes at least one of the following:
[0015] SOP package, SOT package, SOD package, SMT package, 0402 package.
[0016] Optionally, the device includes at least one of the following:
[0017] Resistors, capacitors, inductors, transistors, chips.
[0018] From the above, by setting up multiple packaging modules and corresponding to devices of different packaging types, such as resistors, capacitors, inductors, transistors, chips, etc., most of the devices commonly used in circuits can be covered, and when there is a need to use new devices, the circuit verification device of the present application can be more widely applicable by adding packaging modules.
[0019] Optionally, each pin of the package base is connected to a jumper terminal of the package base via a jumper or wiring of the circuit board.
[0020] From the above, the pins of the package base can be connected to the corresponding jumper terminals by using circuit board wiring, or the pins of the package base can be connected to the corresponding jumper terminals by using jumper connection to meet the freedom of circuit connection.
[0021] Optionally, at least one jumper terminal of the jumper module is simultaneously connected to several other jumper terminals through a jumper or wiring of the circuit board.
[0022] As shown above, the jumper module is used to expand the jumper terminals. By setting multiple jumper terminals and connecting at least one of the jumper terminals to multiple other jumper terminals at the same time through circuit board wiring or jumper connection, it can meet the need to connect multiple pins to one pin of some devices during circuit verification.
[0023] Optionally, the at least one jumper module and the plurality of packaging modules are arranged on the circuit board in partitions in an isolated manner.
[0024] As described above, the jumper module and the packaging module are arranged on the circuit board in an isolated manner and are connected only by jumpers, which can avoid mutual interference between the modules.
[0025] These and other aspects of the present application will become more apparent from the following description of the embodiment(s). BRIEF DESCRIPTION OF THE DRAWINGS
[0026] Figure 1 A schematic diagram of a circuit verification device provided in an embodiment of the present application;
[0027] Figure 2 A circuit diagram of a jumper module provided in an embodiment of the present application;
[0028] Figure 3 A circuit diagram of a package module suitable for 0402 packaging provided in an embodiment of the present application;
[0029] Figure 4 A circuit diagram of a package module suitable for SOT-23-3L packaging provided in an embodiment of the present application;
[0030] Figure 5 A circuit diagram of a package module suitable for SOT-23-5L packaging provided in an embodiment of the present application;
[0031] Figure 6 A circuit diagram of a package module suitable for SOT-23-6L package provided in an embodiment of the present application;
[0032] Figure 7 A circuit diagram of a package module suitable for SOT-23-8 package provided in an embodiment of the present application;
[0033] Figure 8 A circuit diagram of a packaging module suitable for SOP packaging provided in an embodiment of the present application;
[0034] Figure 9 A circuit diagram of a packaging module suitable for SMT packaging provided in an embodiment of the present application;
[0035] Figure 10 A circuit diagram of a pulse-per-second level conversion circuit to be verified provided in an embodiment of the present application. DETAILED DESCRIPTION
[0036] In order to make the purpose, technical solutions and advantages of this application clearer, this application will be further described in detail below with reference to the accompanying drawings.
[0037] An embodiment of the present application provides a circuit verification device, which can be used to verify multiple circuits by arranging multiple packaging modules corresponding to multiple packaging devices on a circuit board and jumpering the jumper terminals of each packaging module to form multiple circuits to be verified.
[0038] like Figure 1 As shown, an embodiment of the present application provides a circuit verification device, including at least one jumper module 100 and several packaging modules 200 that are isolated from each other and arranged on a circuit board. The several packaging modules 200 correspond to devices of various packaging types used in the circuit verification process, and can be applicable to the vast majority of devices commonly used in circuits. For example, the various packaging types can include SOP packaging, SOT packaging, SOD packaging, SMT packaging, 0402 packaging, etc.
[0039] Among them, each of the packaging modules 200 includes at least one packaging base for installing a device of the corresponding packaging type and multiple jumper terminals connecting the pins of the packaging base; the jumper module 200 is used for terminal expansion, which includes multiple jumper terminals, and at least one jumper terminal is simultaneously connected to several other jumper terminals.
[0040] When performing circuit verification, each device in the circuit to be verified is installed in the corresponding packaging module 200 respectively, and the jumper terminals of each packaging module 200 and the jumper module 100 are jumpered according to the connection relationship of the circuit to be verified to achieve verification testing of the circuit to be verified.
[0041] In some embodiments, signal input terminals and signal output terminals may also be set on the circuit board. When performing circuit verification, the signal input terminals and signal output terminals may be jumpered to the jumper terminals of the above-mentioned packaging module 200 and the jumper module 100 according to the connection relationship of the circuit to be verified, so as to provide a test signal for the circuit to be verified through an external signal output device, or to collect the signal output by the circuit to be verified through an external detection device.
[0042] Figure 2 A circuit diagram of a jumper module provided in an embodiment of the present application, such as Figure 2 As shown, the jumper module of the embodiment of the present application includes multiple jumper terminals, which are respectively connected by connecting wires to form multiple paths, wherein some jumper terminals can be connected to multiple other jumper terminals at the same time, thereby achieving the purpose of connecting one pin of the device to multiple pins at the same time during circuit verification. The multiple jumper terminals can be connected through circuit board wiring, or during circuit verification, according to the connection relationship of the circuit to be verified, one of the jumper terminals can be jumpered to the jumper terminal of the packaging module where the corresponding device is installed, and the jumper terminal of the jumper module can be jumpered to the other multiple jumper terminals at the same time, so as to meet the purpose of connecting one pin of the device in the packaging module to multiple pins at the same time.
[0043] Refer to the following Figure 3-Figure 9 The various packaging modules of the embodiments of the present application are illustrated with examples.
[0044] Figure 3 A circuit diagram of a package module suitable for 0402 package provided in an embodiment of the present application is shown in FIG. Figure 3 As shown, this packaging module is suitable for 0402 package type devices, such as resistors, capacitors, inductors, etc. It includes multiple package bases and can simultaneously mount multiple devices. When performing circuit verification, the resistors, capacitors, and inductors in the circuit to be verified are installed on the package base of the packaging module respectively. According to the connection relationship of the circuit to be verified, the jumper terminals of the package base are connected accordingly, thereby connecting the resistors, capacitors, and inductors to the circuit to be verified.
[0045] Figure 4 A circuit diagram of a package module suitable for SOT-23-3L package provided in an embodiment of the present application is shown in FIG. Figure 4 As shown, the packaging module can be suitable for SOT-23-3L package type devices, such as transistors such as triodes and MOS tubes. When performing circuit verification, the transistors in the circuit to be verified are respectively installed on the packaging base of the packaging module, and the jumper terminals of the packaging base are connected accordingly according to the connection relationship of the circuit to be verified, thereby connecting the transistors to the circuit to be verified.
[0046] Figure 5-Figure 9 The circuit diagram of the package module provided in the embodiment of the present application is applicable to other different packages. When performing circuit verification, the components in the circuit to be verified are respectively installed on the package base of the corresponding package module, and the jumper terminals of the package base are connected accordingly according to the connection relationship of the circuit to be verified, thereby connecting the transistor to the circuit to be verified. Figure 5 The package module shown is suitable for devices with SOT-23-5L package type, such as Figure 6 The package module shown is suitable for devices with SOT-23-6L package type, such as Figure 7 The package module shown is suitable for devices with SOT-23-8 package type, such as Figure 8 The package module shown is suitable for devices of SOP8 package type, such as Figure 9 The package module shown is suitable for SMT package type devices.
[0047] Refer to the following Figure 10 Describe the principle of the circuit verification process. Figure 10 This is a circuit diagram of a second pulse level conversion circuit to be verified. Figure 10 The circuit connection relationship can be established by attaching the resistors R935, R937, and R938 in the circuit to be verified to the Figure 3 In the package module suitable for 0402 package shown in FIG, the transistor Q905 in the circuit to be verified can also be attached to Figure 4 In the packaging module suitable for SOT-23-3L packaging shown, and according to the connection relationship of the circuit to be verified, the jumper terminals of the packaging module with resistors R935, R937, and R938 and the jumper terminals of the packaging module with transistor Q905 are jumper-connected to form the circuit to be verified, and power signals and test signals are provided to the circuit to be verified through external power supply equipment and signal output equipment, and the signals output by the circuit to be verified are collected through external detection equipment to realize functional verification of the circuit to be verified.
[0048] When performing verification of the circuit to be verified composed of the above connection, when the 1PPS end is connected to the 3.3VPPS second pulse, the PPS_IN0 end signal is tested, and it is found that the second pulse signal output from the PPS_IN0 end is at a high level of 1.8V and a low level of about 0.9V, and cannot drop to 0V. At this time, the circuit to be verified can be analyzed according to the verification results. After analysis, it is found that the resistance values of resistors R935 and R938 are too low. At this time, two resistors with higher resistance values can be reselected to replace the original resistors R935 and R938, and the output second pulse can be tested again. At this time, the second pulse signal output from the PPS_IN0 end is at a high level of 1.8V and a low level of 0V. The test result is normal, and the functional verification of the circuit is completed.
[0049] In summary, the embodiment of the present application provides a circuit verification device, which sets a jumper module and multiple packaging modules on a circuit board, wherein the packaging bases of the multiple packaging modules can correspond to the devices of multiple packaging types used in the circuit verification process, and the pins of each packaging base are respectively connected to the jumper terminals. When circuit verification is required, the devices required for circuit verification can be installed on the packaging base of the corresponding packaging module, and the corresponding jumper terminals are connected by jumpers according to the connection relationship of the circuit to be verified, so that the function of the connected circuit can be verified. When circuit verification is required, the present application can install the relevant devices on the packaging module and use jumper connections to form the circuit to be verified. It can be reused to meet the verification requirements of most circuits.
[0050] It should be noted that the "one embodiment" or "embodiment" mentioned in this specification means that the specific features, structures or characteristics described in conjunction with the embodiment are included in at least one embodiment of the present application. Therefore, the terms "in one embodiment" or "in an embodiment" appearing in various places in this specification do not necessarily refer to the same embodiment, but may refer to the same embodiment. In addition, in the various embodiments of the present application, unless otherwise specified and there is no logical conflict, the terms and / or descriptions between different embodiments are consistent and can be referenced to each other, and the technical features in different embodiments can be combined to form new embodiments according to their inherent logical relationships.
[0051] Note that the above are only preferred embodiments of the present application and the technical principles employed. Those skilled in the art will understand that the present application is not limited to the specific embodiments described herein, and that various obvious changes, readjustments, and substitutions can be made by those skilled in the art without departing from the scope of protection of the present application. Therefore, although the present application has been described in more detail through the above embodiments, the present application is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the scope of protection of the present application, all of which fall within the scope of protection of the present application.
Claims
1. A circuit verification device, characterized in that: It includes at least one jumper module and a plurality of packaging modules provided on a circuit board, wherein the plurality of packaging modules correspond to devices of various packaging types used in a circuit verification process; Each of the package modules comprises at least one package base for mounting a device of a corresponding package type and a plurality of jumper terminals connected to pins of the package base; The jumper module includes a plurality of jumper terminals, and at least one jumper terminal is connected to a plurality of other jumper terminals at the same time; When performing circuit verification, the verification test of the circuit to be verified is achieved by installing each device in the circuit to be verified into the corresponding packaging modules respectively, and connecting the jumper terminals of each packaging module and the jumper module according to the connection relationship of the circuit to be verified.
2. The device according to claim 1, characterized in that It also includes a signal input terminal and a signal output terminal arranged on the circuit board, and the signal input terminal and the signal output terminal are connected to the packaging module and the jumper terminal of the jumper module through a jumper.
3. The device according to claim 1, characterized in that Each device in the circuit to be verified is mounted on the packaging base of the packaging module in a patch manner.
4. The device according to claim 1, characterized in that The packaging type includes at least one of the following: SOP package, SOT package, SOD package, SMT package, 0402 package.
5. The device according to claim 1, characterized in that The device includes at least one of the following: Resistors, capacitors, inductors, transistors, chips.
6. The device according to claim 1, characterized in that Each pin of the package base is connected to a jumper terminal of the package base through a jumper or wiring of the circuit board.
7. The device according to claim 1, characterized in that At least one jumper terminal of the jumper module is simultaneously connected to several other jumper terminals through a jumper or wiring of the circuit board.
8. The device according to claim 1, characterized in that The at least one jumper module and the plurality of packaging modules are arranged on the circuit board in a partitioned manner in an isolated manner.