Chip packaging device of position fine adjustment adaptation structure

Abstract

The utility model discloses a chip packaging device of a position fine adjustment adaptation structure, and belongs to the technical field of chip packaging. The device comprises a conveying frame, a conveying guide rail is arranged at the top of the conveying frame, a feeding frame is arranged at the top of the conveying guide rail, a plurality of sets of adaptive frames are arranged at the top of the feeding frame, and top dismounting plates are arranged in the adaptive frames; according to the utility model, self-adaptive limiting conveying can be carried out on packaging of chips of different models, the jacking cylinder assists the feeding frame in use, the adaptive frame for loading the chips is promoted to carry out plug-in type limiting locking at a fixed position, the chips to be packaged can be slightly lifted conveniently, follow-up fine adjustment processing can be carried out on the chips conveniently, and the production efficiency is improved. According to the utility model, the adaptive frame is pressed downwards to limit the adaptive frame, so that the chip is prevented from shaking during fine tuning, the chip which is slightly lifted can be centered, and the chip is kept at the center of the top frame before being packaged, so that the subsequent packaging processing is facilitated.

Description

Technical Field

[0001] The utility model relates to the technical field of chip packaging, in particular to a chip packaging device with a position fine-tuning adaptation structure. Background Art

[0002] In the modern electronics manufacturing industry, with the continuous development of chip technology, chip packaging equipment is also constantly being upgraded and improved to meet the packaging needs of higher performance, smaller size and higher integration chips. Chip packaging equipment is an important device used to package and protect chips and connect them to external circuits. The performance of chip packaging equipment directly affects the packaging quality, reliability and production efficiency of chips. For example, high-precision pick and place systems can reduce chip damage during the packaging process, advanced wire bonding equipment can provide more stable and reliable electrical connections, and efficient plastic encapsulation systems can improve the speed and quality of packaging.

[0003] In conjunction with the above, it should be noted that during the automated packaging process of existing chips, the chips are clamped by a placement device and placed on the packaging conveyor production line. Due to the conveying process and the compatibility between the chip model and the fixture, the chip position fluctuates, resulting in defects in the chip packaging.

[0004] In view of the above technical defects, a solution is now proposed. Utility Model Content

[0005] The purpose of the present utility model is to provide a chip packaging device with a position fine-tuning adaptation structure to solve the problem raised.

[0006] The purpose of the utility model can be achieved by the following technical solutions: A chip packaging device with a position fine-tuning adaptation structure, comprising a conveyor frame, a conveyor guide rail is provided on the top of the conveyor frame, and a feeder frame is provided on the top of the conveyor guide rail, a plurality of adapter frames are provided on the top of the feeder frame, a top disassembly plate is provided inside the adapter frame, and a plurality of slide frames are provided outside the adapter frame;

[0007] The end surface of the conveying frame is provided with the packaging machine body side by side, and the top of the conveying frame is provided with a pressing frame connected to the packaging machine body, and the bottom of the pressing frame is provided with a pressing plate.

[0008] Preferably, one end of the conveying frame extends to the interior of the packaging machine body, and a lifting cylinder located below the pressing frame is provided on the surface of one end of the conveying frame.

[0009] Preferably, a center depression at the bottom of the adapter frame is provided with an embedding groove, and a top frame is provided on the top of the embedding groove, and reels embedded in the adapter frame are provided on both sides of the embedding groove.

[0010] Preferably, a mainspring is provided on the central axis of the reel, and a traction line is provided on the outer periphery of the reel, which passes through the embedded groove and is connected to the top frame.

[0011] Preferably, a spring damper 1 is provided at the bottom of the slide, a sleeve frame is provided at the top of the adapter frame, an adjustment block is provided on the inner wall of the sleeve frame, and a spring damper 2 is provided on the top of the adjustment block.

[0012] Preferably, a downward pressure cylinder connected to a pressure plate is provided through the top of the pressure frame, and a plurality of groups of protrusions are provided at the bottom of the pressure plate.

[0013] Beneficial effects of the utility model:

[0014] (1) The utility model realizes adaptive limited conveying of chip packages of different models by using an adapter frame in conjunction with a feed frame and a conveyor frame, and then uses a lifting cylinder to assist the feed frame, so that the adapter frame loaded with chips is locked in a fixed position by plug-in limit, which is convenient for slightly lifting the chip to be packaged, and for subsequent fine-tuning, thereby ensuring the chip packaging effect;

[0015] (2) The utility model is used by using a pressure frame in conjunction with a limited adapter frame, and using a convex block to push the slide from top to bottom, so that it can not only constitute a downward pressure limit for the adapter frame to avoid shaking during the fine-tuning of the chip, but also use the falling movement process of the slide to drive the adjustment block to extend and move together synchronously, so as to achieve centering processing of the slightly lifted chip and keep the chip in the center of the top frame before packaging, so as to facilitate subsequent packaging processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The present invention will be further described below with reference to the accompanying drawings;

[0017] Figure 1 This is a three-dimensional diagram of the overall structure of the utility model;

[0018] Figure 2 This is a structural diagram of the conveyor frame of the utility model;

[0019] Figure 3 This is a structural diagram of the feeding rack of the utility model;

[0020] Figure 4 It is a structural diagram of the adapter frame of the utility model;

[0021] Figure 5 It is a structural diagram of the press frame of the present utility model.

[0022] Legend: 1. Conveyor rack; 101. Conveyor guide rail; 102. Lifting cylinder; 2. Pressing rack; 201. Pressing cylinder; 202. Pressing plate; 203. Bump; 3. Packaging machine body; 4. Feeding rack; 401. Adapter rack; 402. Remove top plate; 403. Frame; 404. Slide; 405. Adjustment block; 406. Top rack; 407. Groove; 408. Reel; 409. Drag line; 410. Spring damper 1; 411. Spring damper 2. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0024] Example 1:

[0025] This embodiment is used to solve the problem that during the process of automated packaging of existing chips, the chips are clamped by the delivery equipment and placed on the packaging conveying production line. Due to the conveying process and the compatibility of the chip model with the clamp, the chip position fluctuates, resulting in defects in the chip packaging.

[0026] See also Figure 1 - Figure 5 As shown, this embodiment is a chip packaging device with a position fine-tuning adaptation structure, comprising a conveyor frame 1, a conveyor guide rail 101 is provided on the top of the conveyor frame 1, and a feeder frame 4 is provided on the top of the conveyor guide rail 101, a plurality of adapter frames 401 are provided on the top of the feeder frame 4, a top removal plate 402 is provided inside the adapter frame 401, and a plurality of slide frames 404 are provided outside the adapter frame 401. When the chip to be packaged is placed on the top removal plate 402 inside the adapter frame 401 by an external delivery device, the conveyor frame 1 drives the feeder frame 4 to move close to the packaging machine body 3 through the conveyor guide rail 101;

[0027] One end of the conveyor frame 1 extends to the inside of the packaging machine body 3, and a lifting cylinder 102 is provided on the surface of one end of the conveyor frame 1 and is located below the pressing frame 2. When the feed rack 4 approaches the packaging machine body 3 and is located below the pressing frame 2, the conveyor frame 1 pauses the movement of the feed rack 4, and the lifting cylinder 102 runs and extends upward until the insert block provided on the top of the lifting cylinder 102 is inserted into the bottom of the feed rack 4, and the insert block passes through the feed rack 4 and contacts the lifting frame 406. During the period when the insert block is inserted into the feed rack 4, the feed rack 4 is further locked with the conveyor frame 1 at multiple points of contact through the insert block.

[0028] The bottom center of the adapter frame 401 is recessed with an embedding groove 407, and a top frame 406 is provided on the top of the embedding groove 407. Reels 408 embedded in the inside of the adapter frame 401 are provided on both sides of the embedding groove 407; a clockwork is provided on the central axis of the reel 408, and a traction line is provided on the outer periphery of the reel 408, which passes through the embedding groove 407 and is connected to the top frame 406. The top frame 406 slides up under the thrust, and the top frame 406 drives the top demolition plate 402 to slide up axially. During this process, the top frame 406 slides up and drags the traction line, and the traction line drives the reel 408 to rotate. While the reel 408 rotates and unwinds the traction line, the clockwork on the central axis of the reel 408 is forced to coil. After the external force pushes away, the reel 408 is reset under the drive of the clockwork, and the traction line drags the top frame 406 to slide down synchronously with the plug block.

[0029] A spring damper 410 is provided at the bottom of the slide 404, a sleeve frame 403 is provided on the top of the adapter frame 401, an adjustment block 405 is provided on the inner wall of the sleeve frame 403, and a spring damper 2 411 is provided on the top of the adjustment block 405. After waiting for fine-tuning to be completed, the downward pressure cylinder 201 drives the pressure plate 202 to reset, and the spring damper 1 410 and the spring damper 2 411 respectively drive the slide 404 and the adjustment block 405 to reset, and the conveying guide rail 101 further drives the feeding rack 4 to transfer the adjusted chip to the packaging machine body 3 for packaging processing.

[0030] Embodiment 2: A chip packaging device with a position fine-tuning adaptation structure of this embodiment includes a conveyor frame 1 with a packaging machine body 3 arranged side by side on its end face, and a pressing frame 2 is provided on the top of the conveyor frame 1 and the packaging machine body 3, and a pressing plate 202 is provided on the bottom of the pressing frame 2;

[0031] The downward pressure cylinder 201 on the pressing frame 2 drives the pressing plate 202 downward, and the pressing plate 202 drives the protrusion 203 downward and contacts the slide 404. The protrusion 203 is adapted to connect with the slider and push the slider to continue entering the adapter frame 401. When the slide 404 enters the adapter frame 401, the slide 404 pushes the spring damper 1 410 to be compressed. The drag line 409 at the bottom of the slide 404 is pushed and pulled, and the adjustment block 405 connected to the other end of the drag line 409 is pulled by the force to slide along the inner wall of the adapter frame 401 toward the chip.

[0032] A downward pressure cylinder 201 connected to the pressure plate 202 is provided on the top of the pressure frame 2, and multiple groups of protrusions 203 are provided at the bottom of the pressure plate 202. During the movement of the adjustment block 405, the spring damper 2 411 is compressed, and the multiple groups of adjustment blocks 405 are close to each other, causing the chip located on the top removal plate 402 to be limited and pushed all around. The chip is pushed and fine-tuned until the center point of the chip is consistent with the center point on the top removal plate 402, thereby achieving fine-tuning and adaptation of the chip.

[0033] Combining Example 1 and Example 2, it is possible to realize adaptive limiting conveying of chip packages of different types, and when the lifting cylinder 102 is used to assist the feeding rack 4, the adapter rack 401 loaded with chips is forced to perform plug-in limiting locking in a fixed position, so as to facilitate slight lifting of the chip to be packaged, and subsequent fine-tuning thereof, thereby ensuring the chip packaging effect, constituting a downward limit on the adapter rack 401, and avoiding shaking during the fine-tuning of the chip. The falling movement process of the slide 404 can also be used to drive the adjustment block 405 to extend and approach synchronously, so as to realize centering of the slightly lifted chip and keep the chip in the center of the top rack 406 before packaging, so as to facilitate subsequent packaging processing.

[0034] The above content is merely an example and explanation of the structure of the present invention. Those skilled in the art may make various modifications or additions to the described specific embodiments or replace them in a similar manner. As long as they do not deviate from the structure of the invention or exceed the scope defined by the claims, they should all fall within the scope of protection of the present invention.

[0035] Throughout this specification, references to terms such as "one embodiment," "example," or "specific example" indicate that the specific features, structures, materials, or characteristics described in conjunction with that embodiment or example are included in at least one embodiment or example of the present invention. In this specification, schematic representations of these terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0036] The preferred embodiments of the present invention disclosed above are intended only to help illustrate the present invention. These preferred embodiments do not exhaustively describe all details, nor do they limit the present invention to specific embodiments. Obviously, many modifications and variations are possible based on the contents of this specification. These embodiments are selected and described in detail in this specification to better explain the principles and practical applications of the present invention, thereby enabling those skilled in the art to better understand and utilize the present invention. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A chip packaging device with a position fine-tuning adaptation structure, comprising a conveyor frame (1), characterized in that: A conveying guide rail (101) is provided on the top of the conveying frame (1), and a feeding frame (4) is provided on the top of the conveying guide rail (101), a plurality of adapter frames (401) are provided on the top of the feeding frame (4), a top disassembly plate (402) is provided inside the adapter frame (401), and a plurality of slide frames (404) are provided outside the adapter frame (401); The end surface of the conveying frame (1) is provided with a packaging machine body (3) in parallel, and a pressing frame (2) is provided on the top of the conveying frame (1) and is connected to the packaging machine body (3), and a pressing plate (202) is provided on the bottom of the pressing frame (2).

2. The chip packaging device with a position fine-tuning and adapting structure according to claim 1, characterized in that: One end of the conveying frame (1) extends into the interior of the packaging machine body (3), and a lifting cylinder (102) located below the pressing frame (2) is provided on the surface of one end of the conveying frame (1).

3. The chip packaging device with a position fine-tuning and adapting structure according to claim 1, characterized in that: The bottom center of the adapter frame (401) is recessed with an embedding groove (407), and a top frame (406) is provided on the top of the embedding groove (407). Rollers (408) embedded in the adapter frame (401) are provided on both sides of the embedding groove (407).

4. The chip packaging device with a position fine-tuning and adapting structure according to claim 3, characterized in that: A spring is provided on the central axis of the reel (408), and a traction line is provided on the outer periphery of the reel (408), which passes through the embedding groove (407) and is connected to the top frame (406).

5. The chip packaging device with a position fine-tuning and adapting structure according to claim 4, characterized in that: A spring damper 1 (410) is provided at the bottom of the slide (404), a sleeve frame (403) is provided at the top of the adapter frame (401), an adjustment block (405) is provided on the inner wall of the sleeve frame (403), and a spring damper 2 (411) is provided on the top of the adjustment block (405).

6. The chip packaging device with a position fine-tuning and adapting structure according to claim 1, characterized in that: A downward pressure cylinder (201) connected to a pressure plate (202) is provided through the top of the pressure frame (2), and a plurality of groups of protrusions (203) are provided at the bottom of the pressure plate (202).

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