Sound production unit and electronic equipment

Abstract

The utility model provides a sound production unit and electronic equipment. The sounding unit comprises piezoelectric ceramics and a shell, the shell comprises a substrate, and the substrate is connected with the piezoelectric ceramics through an adhesive; the substrate is provided with a plurality of sound production channels along the peripheral side of the piezoelectric ceramic, and the sound production channels are used for air flow to pass through. The high-audio frequency of the electronic equipment can be improved.

Description

Technical Field

[0001] The present application relates to the technical field of sound-emitting devices, and more specifically, to a sound-emitting unit and an electronic device. Background Art

[0002] In existing technology, the sound-generating unit is constructed by rigidly attaching piezoelectric ceramics to a thick metal frame. The contraction and expansion of the piezoelectric ceramics upon powering the device causes the metal frame to flex, which in turn drives air vibrations to achieve high-frequency acoustic compensation. However, due to the high bending stiffness and high resonance point of the piezoelectric ceramics and metal frame, the deformation release effect of the piezoelectric ceramics is poor, which in turn seriously affects the high-frequency response of the electronic device.

[0003] Therefore, it is necessary to provide a new technical solution to solve the above technical problems. Utility Model Content

[0004] One purpose of the present application is to provide a new technical solution for a sound unit and an electronic device.

[0005] According to a first aspect of the present application, a sound-emitting unit is provided, wherein the sound-emitting unit comprises:

[0006] Piezoelectric ceramics;

[0007] The shell includes a substrate connected to the piezoelectric ceramic via an adhesive; the substrate is provided with a plurality of sound outlet channels along the circumference of the piezoelectric ceramic, and the sound outlet channels are used for allowing airflow to pass through.

[0008] Optionally, the piezoelectric ceramic includes a first surface layer, an ineffective layer and a second surface layer, and the ineffective layer is arranged between the first surface layer and the second surface layer;

[0009] The thickness of the ineffective layer is greater than one third of the thickness of the first surface layer; or, the thickness of the ineffective layer is greater than one third of the thickness of the second surface layer.

[0010] Optionally, the piezoelectric ceramic is circular or cross-shaped.

[0011] Optionally, the substrate includes a connecting surface, and the connecting surface is connected to the piezoelectric ceramic via a first adhesive.

[0012] Optionally, the piezoelectric ceramic includes a first surface layer, an ineffective layer and a second surface layer, and the ineffective layer is arranged between the first surface layer and the second surface layer;

[0013] The connecting surface is connected to the second surface layer through a first adhesive, and the Young's modulus of the first adhesive is less than 100 MPa; or, the connecting surface is connected to the edge of the second surface layer through a first adhesive, and the Young's modulus of the first adhesive is greater than 100 MPa.

[0014] Optionally, the substrate includes a through hole; the piezoelectric ceramic is connected to the substrate via a second adhesive and covers the through hole;

[0015] The Young's modulus of the second adhesive is in the range of 200 to 400 MPa.

[0016] Optionally, the substrate includes a raised portion and a hollow portion, the raised portion is connected to the piezoelectric ceramic via a third adhesive, and the hollow portion is connected to the sound outlet channel to form a hollow structure;

[0017] The Young's modulus of the third adhesive is in the range of 300 to 500 MPa.

[0018] Optionally, the area of ​​the hollow structure is greater than 30% of the area of ​​the substrate.

[0019] Optionally, the housing further comprises a surrounding plate arranged along a circumference of the substrate;

[0020] An inner cavity is formed between the substrate and the enclosure; or an inner cavity is formed between the substrate, the enclosure and the piezoelectric ceramic.

[0021] According to a second aspect of the present application, an electronic device is provided, comprising a sound-emitting unit as described in any one of the first aspects.

[0022] In the sound unit of the present invention, the adhesive creates a flexible connection between the piezoelectric ceramic and the substrate, eliminating the need for a rigid metal frame. The sound unit's high-frequency acoustic compensation capability is enhanced solely through the deformation of the piezoelectric ceramic itself. Furthermore, the substrate houses the sound output channel for the bass voice coil driver, without affecting the sound release of the dynamic coil driver. Consequently, the treble response of the electronic device is enhanced.

[0023] Other features and advantages of the present application will become apparent from the following detailed description of exemplary embodiments of the present application with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the application and, together with the description, serve to explain the principles of the application.

[0025] Figure 1 It is a top view of the sound unit in the first embodiment of the present application.

[0026] Figure 2 This is a structural diagram of the first embodiment of the present application in which the sound-emitting unit is not provided with piezoelectric ceramics.

[0027] Figure 3 It is a cross-sectional view of the sound unit in the first embodiment of the present application.

[0028] Figure 4 It is a schematic structural diagram of the piezoelectric ceramic in the first embodiment of the present application.

[0029] Figure 5 It is a structural diagram of the sound-emitting unit in the second embodiment of the present application.

[0030] Figure 6 This is a structural diagram of the second embodiment of the present application in which the sound-emitting unit is not provided with piezoelectric ceramics.

[0031] Figure 7 It is a cross-sectional view of the sound unit in the second embodiment of the present application.

[0032] Figure 8 It is a structural diagram of the sound-emitting unit in the third embodiment of the present application.

[0033] Figure 9 This is a structural diagram of the third embodiment of the present application in which the sound-emitting unit is not provided with piezoelectric ceramics.

[0034] Figure 10 It is a cross-sectional view of the sound unit in the third embodiment of the present application.

[0035] Description of reference numerals:

[0036] 1. piezoelectric ceramic; 11. first surface layer; 12. ineffective layer; 13. second surface layer;

[0037] 2. Housing; 21. Base plate; 211. Sound outlet channel; 212. Connecting surface; 213. Through hole; 214. Raised portion; 2141. Adhesive portion; 215. Hollow portion; 22. Enclosure;

[0038] 3. First adhesive;

[0039] 4. Second adhesive;

[0040] 5. The third adhesive;

[0041] 6. Inner chamber. DETAILED DESCRIPTION

[0042] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that unless otherwise specifically stated, the relative arrangements of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present application.

[0043] The embodiments of the present application will be described in detail below, and examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and should not be understood as limiting the present application. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of this application.

[0044] It should be noted that like reference numerals and letters refer to like items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0045] According to one embodiment of the present application, a sound-emitting unit is provided, which includes a piezoelectric ceramic 1 and a shell 2, wherein the shell 2 includes a substrate 21, and the substrate 21 is connected to the piezoelectric ceramic 1 by an adhesive; the substrate 21 is provided with a plurality of sound outlet channels 211 along the circumference of the piezoelectric ceramic 1, and the sound outlet channels 211 are used for allowing airflow to pass through.

[0046] Specifically, the piezoelectric ceramic 1 described in the embodiment of the present application is a thin bi-crystal ceramic structure. The thin bi-crystal ceramic structure refers to the presence of two or more grain layers with different crystal orientations in the ceramic material, and these grain layers constitute a special microstructure on a macroscopic level. This special microstructure can be prepared into grain layers of different thicknesses by a specific process method, such as by a template method, a seed crystal method or a specific sintering technology. Among them, grain layers of different thicknesses have different properties. For example, in order to improve the deformation effect of the thin bi-crystal ceramic structure to enhance the high-frequency acoustic compensation capability of the sound unit, this can be achieved by adjusting the thickness of the grain layer.

[0047] The shell 2 is used to support the piezoelectric ceramic 1 and can connect the sound unit to the electronic device. The shell 2 has a certain rigidity and lightness to ensure that the sound unit can respond quickly when vibrating and provide clear and accurate sound quality. The material of the shell 2 includes at least one of aluminum alloy, titanium alloy, magnesium alloy, ABS (Acrylonitrile Butadiene Styrene, acrylonitrile-butadiene-styrene plastic), nylon, carbon fiber and special ceramics to ensure the frequency response, damping characteristics of the sound unit, and the overall sound effect of the electronic device.

[0048] like Figure 1 and Figure 3As shown, the housing 2 includes a substrate 21, which is connected to the piezoelectric ceramic 1 via an adhesive to form an integral structure. The substrate 21 is provided with a plurality of sound outlet channels 211 for the bass voice coil drive unit along the circumference of the piezoelectric ceramic 1. The sound outlet channels 211 are used to release the sound airflow of the dynamic coil drive unit.

[0049] When the power generation unit is energized, the piezoelectric ceramic 1 drives air vibrations through its own contraction and expansion, achieving high-frequency acoustic compensation for the power generation unit. Furthermore, because the substrate 21 is connected to the piezoelectric ceramic 1 via an adhesive, the adhesive creates a certain height difference between the substrate 21 and the piezoelectric ceramic 1. This height difference enables the piezoelectric ceramic 1 to better drive air vibrations during deformation, thereby effectively enhancing the high-frequency acoustic compensation effect of the power generation unit. Furthermore, because the adhesive also creates a flexible connection between the substrate 21 and the piezoelectric ceramic 1, compared to the prior art method of rigidly attaching the piezoelectric ceramic 1 to a thick metal frame, the present application eliminates the need for a metal frame. This also avoids the problem of poor deformation release of the piezoelectric ceramic 1 due to the high bending stiffness and high resonance point of the piezoelectric ceramic 1 and the metal frame. Furthermore, because the substrate 21 also provides the sound output channel 211 for the woofer voice coil driver, the sound-generating unit does not affect the sound release of the dynamic coil driver. Therefore, the power generation unit described in the present application effectively improves the high-frequency sound of the electronic device through the above-mentioned configuration.

[0050] In one embodiment, the piezoelectric ceramic 1 includes a first surface layer 11, an invalid layer 12 and a second surface layer 13, and the invalid layer 12 is arranged between the first surface layer 11 and the second surface layer 13; the thickness of the invalid layer 12 is greater than one third of the thickness of the first surface layer 11; or, the thickness of the invalid layer 12 is greater than one third of the thickness of the second surface layer 13.

[0051] Specifically, if Figure 4 As shown, the ineffective layer 12 described in the embodiment of the present application refers to a grain layer in the multi-layer grain layer that is not properly polarized or has defects, resulting in the inability to produce the desired piezoelectric effect. Although these grain layers do not contribute to the piezoelectric effect and may even reduce the overall performance of the piezoelectric ceramic 1, a grain layer with a certain thickness can reduce the internal loss of the piezoelectric ceramic 1 when it is bent, making the piezoelectric ceramic 1 more effective in driving air vibrations, thereby further improving the high-frequency acoustic compensation of the power generation unit.

[0052] The thicker the ineffective layer 12 is, the smaller the internal loss of the piezoelectric ceramic 1 during bending. However, in order to better meet the needs of miniaturization and micro-manufacturing of electronic devices, the overall thickness of the piezoelectric ceramic 1 is preferably 0.1 to 1 mm.

[0053] In addition, the piezoelectric ceramic 1 can be a three-layer thin bimorph ceramic structure. For example, the piezoelectric ceramic 1 includes a first surface layer 11 , an ineffective layer 12 and a second surface layer 13 , and the ineffective layer 12 is arranged between the first surface layer 11 and the second surface layer 13 .

[0054] Among them, in order to ensure that the three-layer thin bi-crystal ceramic structure has lower internal loss when bent, the thickness of the ineffective layer 12 is preferably greater than one-third of the thickness of the first surface layer 11; or, the thickness of the ineffective layer 12 is greater than one-third of the thickness of the second surface layer 13.

[0055] Of course, the piezoelectric ceramic 1 described in the embodiment of the present application may also be a two-layer, four-layer or multi-layer thin bimorph ceramic structure. Those skilled in the art may make a choice according to actual needs, and the present application does not impose any specific restrictions here.

[0056] In one embodiment, the piezoelectric ceramic 1 is circular or cross-shaped.

[0057] Specifically, if Figure 1 、 Figure 5 and Figure 8 As shown, the piezoelectric ceramic 1 described in the embodiment of the present application can be designed with different structural forms according to the shape differences of the sound outlet holes of the bass voice coil drive unit.

[0058] Among them, since the piezoelectric ceramic 1 described in this application drives air vibration through its own contraction and expansion to achieve high-frequency acoustic compensation for the power generation unit, in order to ensure the high-frequency acoustic compensation effect of the piezoelectric ceramic 1 on the power generation unit, the piezoelectric ceramic 1 is preferably circular or cross-shaped.

[0059] When the piezoelectric ceramic 1 is circular, the symmetry of the circular structure results in a more uniform stress distribution, allowing it to withstand greater mechanical pressure, thus improving the mechanical stability of the piezoelectric ceramic 1. However, since the substrate 21 of the present application is provided with a sound outlet channel 211 for releasing the sound airflow of the dynamic drive unit, the circular piezoelectric ceramic 1 has low space utilization and a smaller overall size. Therefore, the circular piezoelectric ceramic 1 is suitable for electronic devices requiring higher stability.

[0060] A cross-shaped piezoelectric ceramic 1 can provide piezoelectric response in multiple directions and utilize space more efficiently. However, compared to a circular structure, the cross-shaped structure has uneven stress distribution, which can lead to poor mechanical stability of the piezoelectric ceramic 1. Therefore, the cross-shaped piezoelectric ceramic 1 is suitable for electronic devices that require multi-directional detection or actuation, as well as compact layouts.

[0061] In one embodiment, the substrate 21 includes a connecting surface 212 , and the connecting surface 212 is connected to the piezoelectric ceramic 1 via a first adhesive 3 .

[0062] Specifically, if Figures 1 to 3 As shown, the substrate 21 in the embodiment of the present application includes a connecting surface 212 , which is connected to the piezoelectric ceramic 1 via a first adhesive 3 , and a plurality of sound outlet channels 211 are provided around the connecting surface 212 .

[0063] The present application provides the connection surface 212 on the substrate 21, thereby enabling the housing 2 to form a non-hollow structure. Thus, the integral casting of the housing 2 effectively improves the reliability, stability, and durability of the housing 2, better isolates external noise, enhances the listening experience of the electronic device, and significantly reduces the intrusion of dust and earwax, maintaining the cleanliness of the interior of the electronic device.

[0064] In one embodiment, the piezoelectric ceramic 1 includes a first surface layer 11, an invalid layer 12 and a second surface layer 13, and the invalid layer 12 is arranged between the first surface layer 11 and the second surface layer 13; the connecting surface 212 is connected to the second surface layer 13 through a first adhesive 3, and the Young's modulus of the first adhesive 3 is less than 100 MPa; or, the connecting surface 212 is connected to the edge of the second surface layer 13 through a first adhesive 3, and the Young's modulus of the first adhesive 3 is greater than 100 MPa.

[0065] Specifically, if Figure 3 As shown, the connection surface 212 of the embodiment of the present application can be fully connected to the side of the second surface layer 13 near the connection surface 212 by the first adhesive 3, that is, the first adhesive 3 is in full contact with the side of the second surface layer 13 near the connection surface 212, thereby effectively ensuring the reliability and stability of the connection between the piezoelectric ceramic 1 and the substrate 21. Specifically, after the power generation unit is energized, in order to ensure the shrinkage and expansion effect of the piezoelectric ceramic 1 itself, the Young's modulus of the first adhesive 3 is preferably less than 100 MPa to avoid poor deformation release effect of the piezoelectric ceramic 1 caused by an overly hard first adhesive 3.

[0066] In addition, the connection surface 212 of the embodiment of the present application can also be connected to the edge of the second surface layer 13 via the first adhesive 3. This further enhances the contraction and expansion effect of the central portion of the piezoelectric ceramic 1 after the power generation unit is energized, thereby better driving air vibration and improving the high-frequency acoustic compensation capability of the power generation unit. To ensure the reliability and stability of the connection between the piezoelectric ceramic 1 and the substrate 21, the Young's modulus of the first adhesive 3 is preferably greater than 100 MPa.

[0067] In one embodiment, the substrate 21 includes a through hole 213 ; the piezoelectric ceramic 1 is connected to the substrate 21 via a second adhesive 4 , and covers the through hole 213 ; the Young's modulus of the second adhesive 4 is in the range of 200 to 400 MPa.

[0068] Specifically, if Figures 5 to 7 As shown, the substrate 21 of the present embodiment includes a through hole 213, and multiple sound outlet channels 211 are arranged along the periphery of the through hole 213. The piezoelectric ceramic 1 is connected to the substrate 21 via a second adhesive 4, covering the through hole 213. In other words, the piezoelectric ceramic 1 is mounted on the through hole 213 by connecting the edge of the piezoelectric ceramic 1 to the substrate 21.

[0069] In this application, the housing 2 is partially hollowed out by providing the through-holes 213 on the substrate 21. Thus, the partially hollowed-out structure can provide the sound unit with a relatively open sound experience, improving the sound field and spatial sense of the sound unit. Furthermore, the partially hollowed-out structure can reduce material usage, making the sound unit lighter.

[0070] In addition, since the piezoelectric ceramic 1 is connected to the substrate 21 through its edge, in order to ensure the reliability and stability of the connection between the piezoelectric ceramic 1 and the substrate 21 , the Young's modulus of the second adhesive 4 is preferably in the range of 200 to 400 MPa.

[0071] In one embodiment, the substrate 21 includes a protrusion 214 and a hollow portion 215, the protrusion 214 is connected to the piezoelectric ceramic 1 through a third adhesive 5, and the hollow portion 215 is connected to the sound outlet channel 211 to form a hollow structure; the Young's modulus of the third adhesive 5 ranges from 300 to 500 MPa.

[0072] Specifically, if Figures 8 to 10As shown, the substrate 21 described in the embodiment of the present application includes a protruding portion 214 and a hollow portion 215, and the protruding portion 214 is provided with a bonding portion 2141, and the protruding portion 214 can be connected to the piezoelectric ceramic 1 through the bonding portion 2141; the hollow portion 215 is connected to the sound outlet channel 211, so that the shell 2 forms a larger hollow structure.

[0073] Therefore, by setting up a larger hollow structure, a more open sound experience can be provided for the sound-emitting unit, thereby better improving the sound field and spatial sense of the sound-emitting unit. In addition, the larger hollow structure can further reduce the use of materials, making the sound-emitting unit lighter.

[0074] The substrate 21 is provided with four protrusions 214 , and the piezoelectric ceramic 1 is in a cross shape. The four protrusions 214 can be connected to the four end points of the cross-shaped piezoelectric ceramic 1 and expose the sound outlet channel 211 .

[0075] Of course, the protrusions 214 may be provided in two, three or more forms, and the piezoelectric ceramic 1 may be provided in a circular or other form of structure. Those skilled in the art may make a choice according to actual needs, and this application does not impose any specific restrictions here.

[0076] In addition, since the piezoelectric ceramic 1 is connected to the protrusion 214 via the adhesive portion 2141 , in order to ensure the reliability and stability of the connection between the piezoelectric ceramic 1 and the substrate 21 , the Young's modulus of the third adhesive 5 is preferably in the range of 300 to 500 MPa.

[0077] In one embodiment, the area of ​​the hollow structure is greater than 30% of the area of ​​the substrate 21 .

[0078] Specifically, if Figure 9 As shown, since the hollow structure can provide the sound unit with a more open sound experience and a better sound release effect, in order to make the sound unit have a better bass release effect, the area of ​​the hollow structure is preferably greater than 30% of the area of ​​the substrate 21.

[0079] In one embodiment, the shell 2 further includes a surrounding plate 22 arranged along the periphery of the substrate 21; an inner cavity 6 is formed between the substrate 21 and the surrounding plate 22; or, an inner cavity 6 is formed between the substrate 21, the surrounding plate 22 and the piezoelectric ceramic 1.

[0080] Specifically, if Figure 3 、 Figure 7 and Figure 10As shown, when the substrate 21 is provided with a connection surface 212, the inner cavity 6 is formed between the substrate 21 and the enclosure 22. Alternatively, when the substrate 21 is provided with a through hole 213, and when the substrate 21 is provided with a raised portion 214 and a hollow portion 215, the inner cavity 6 is formed between the substrate 21, the enclosure 22, and the piezoelectric ceramic 1. The inner cavity 6 is used to improve the performance of the sound field, making the sound positioning more accurate, thereby providing the sound unit with a more natural and three-dimensional auditory experience.

[0081] Among them, since the inner chamber 6 can be formed by different structures, different inner chambers 6 can be formed according to the actual needs of the electronic device to achieve adaptation to a variety of different sound units. Therefore, the present application forms different inner chambers 6 through different structures, so that the sound unit can form a more reasonable chamber, and then through the reasonable setting of the inner chamber 6, the high-frequency response of the sound unit is better enhanced, making the high-frequency sound of the sound unit clearer and louder. In addition, the reasonable setting of the inner chamber 6 can also reduce the interference of the mechanical vibration of the sound unit on other frequencies, and reduce the interference of external noise, so that the use effect of the sound unit is better.

[0082] According to another embodiment of the present application, an electronic device is provided, which includes the sound unit described in the embodiment of the present application.

[0083] The above embodiments focus on the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. Considering the simplicity of the text, they will not be repeated here.

[0084] Although some specific embodiments of the present application have been described in detail by way of examples, it should be understood by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the present application. It should be understood by those skilled in the art that the above embodiments may be modified without departing from the scope and spirit of the present application. The scope of the present application is defined by the appended claims.

Claims

1. A sound unit, characterized in that: include: Piezoelectric ceramics (1); A shell (2), the shell (2) comprising a substrate (21), the substrate (21) being connected to the piezoelectric ceramic (1) via an adhesive; the substrate (21) being provided with a plurality of sound outlet channels (211) along the circumference of the piezoelectric ceramic (1), the sound outlet channels (211) being used for allowing airflow to pass through.

2. The sound unit according to claim 1, characterized in that The piezoelectric ceramic (1) comprises a first surface layer (11), an ineffective layer (12) and a second surface layer (13), wherein the ineffective layer (12) is arranged between the first surface layer (11) and the second surface layer (13); The thickness of the ineffective layer (12) is greater than one third of the thickness of the first surface layer (11); or, the thickness of the ineffective layer (12) is greater than one third of the thickness of the second surface layer (13).

3. The sound unit according to claim 1, wherein: The piezoelectric ceramic (1) is circular or cross-shaped.

4. The sound unit according to claim 1, characterized in that The substrate (21) comprises a connecting surface (212), and the connecting surface (212) is connected to the piezoelectric ceramic (1) via a first adhesive (3).

5. The sound unit according to claim 4, characterized in that: The piezoelectric ceramic (1) comprises a first surface layer (11), an ineffective layer (12) and a second surface layer (13), wherein the ineffective layer (12) is arranged between the first surface layer (11) and the second surface layer (13); The connecting surface (212) is connected to the second surface layer (13) via a first adhesive (3), and the Young's modulus of the first adhesive (3) is less than 100 MPa; or, the connecting surface (212) is connected to the edge of the second surface layer (13) via a first adhesive (3), and the Young's modulus of the first adhesive (3) is greater than 100 MPa.

6. The sound unit according to claim 1, characterized in that The substrate (21) includes a through hole (213); the piezoelectric ceramic (1) is connected to the substrate (21) via a second adhesive (4) and covers the through hole (213); The Young's modulus of the second adhesive (4) is in the range of 200 to 400 MPa.

7. The sound unit according to claim 1, characterized in that The substrate (21) comprises a raised portion (214) and a hollow portion (215), the raised portion (214) being connected to the piezoelectric ceramic (1) via a third adhesive (5), and the hollow portion (215) being connected to the sound outlet channel (211) to form a hollow structure; The Young's modulus of the third adhesive (5) is in the range of 300 to 500 MPa.

8. The sound unit according to claim 7, characterized in that: The area of ​​the hollow structure is greater than 30% of the area of ​​the substrate (21).

9. The sound generating unit according to claim 1, wherein: The housing (2) further includes a surrounding plate (22) arranged along the circumference of the base plate (21); An inner cavity (6) is formed between the substrate (21) and the enclosure (22); or, an inner cavity (6) is formed between the substrate (21), the enclosure (22) and the piezoelectric ceramic (1).

10. An electronic device, characterized in that: The invention comprises the sound-emitting unit according to any one of claims 1 to 9.

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