Alloy-state active brazing filler metal wire preparation device

Through vacuum smelting and powder addition, combined with alloy-state active brazing wire preparation device, the problem of limited solid solubility of Ti elements in Ag-based alloys and Cu-based alloys is solved, and the preparation and high plastic processing of active brazing wire are realized.

CN223264532UActive Publication Date: 2025-08-26BEIJING INST OF NONFERROUS METALS & RARE EARTH
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Patent Information

Application Number
CN202422445342.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-10-10
Publication Date
2025-08-26
Estimated Expiration
2034-10-10

AI Technical Summary

Technical Problem

The prior art is difficult to prepare active brazing wire materials, mainly because Ti elements have limited solid solubility in Ag-based alloys and Cu-based alloys, and are prone to react with atmospheres such as oxygen, hydrogen, and nitrogen, resulting in failure of the ingot and poor plasticity of the alloy, making it difficult to process.

Method used

A variety of technologies of vacuum smelting, powder addition, solid-liquid stirring and mixing and rapid solidification vertical casting are adopted, combined with the alloy active brazing wire preparation device, including the master alloy smelting tank, solid-liquid mixing tank and vertical casting device, to ensure that the active element Ti is dispersed and distributed in the form of particles and is combined with the master alloy metallurgy to avoid oxidation and reaction.

Benefits of technology

The active brazing wire material with uniform composition was successfully prepared, which improved the alloy processing plasticity and could mass produce active brazing wire material with a diameter of 0.3mm, which was suitable for the preparation of wire material of a variety of doping materials.

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Abstract

The utility model relates to an alloyed active brazing filler metal wire preparation device, and belongs to the field of non-ferrous metal brazing material processing equipment. The preparation device comprises a mother alloy smelting pool, a solid-liquid mixing pool, a flow guide pipe and a vertical pull casting device, the mother alloy smelting pool is connected with the solid-liquid mixing pool through the flow guide pipe, and the vertical pull casting device is arranged at the lower end of the solid-liquid mixing pool; the mother alloy smelting pool comprises a first crucible, a furnace cover, a quartz glass observation hole, a first exhaust port, a first air inlet and a medium-frequency induction coil; the solid-liquid mixing pool comprises a second crucible, a furnace cover, a second exhaust port, a second air inlet, a rotating blade, a stainless steel funnel and a resistance heating bag. The device is complete equipment, mother alloy and active brazing filler metal alloy can be in a vacuum environment in a molten state, the contact reaction between active elements and materials such as a crucible and a mold is effectively reduced, it is ensured that the active element Ti is dispersed and distributed in the alloy in a particle form, and the problem that an active brazing filler metal alloy state wire product cannot be formed is solved.
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Description

Technical Field

[0001] The utility model relates to an alloy-state active solder wire material preparation device, which is mainly used for preparing active solder and gold-state wire material products and belongs to the field of nonferrous metal brazing material processing equipment. Background Art

[0002] Due to the complex structural design of vacuum electronic devices, many T-joints, shaft hole connections, and rib wall structures require wire-shaped active solder to complete brazing connections. Active solder wire products are rarely seen in the market, and there are also few reports on the preparation methods of active solder wire. The main reasons are analyzed as follows: 1. The active element Ti and other elements have limited solid solubility in Ag-based alloys and Cu-based alloys. The traditional casting method is likely to cause Ti element segregation, resulting in ingot failure; 2. The active element Ti in the free state is very easy to come into contact and react with the crucible, mold, etc. in the preparation process, and it is impossible to prepare active solder in the gold state; 3. The Ti element is very easy to react with atmospheres such as oxygen, hydrogen, and nitrogen. General preparation methods such as non-vacuum and hot processing will lead to a decrease in product performance; 4. The Ti element is distributed in the Ag-based alloy and Cu-based alloy as needle-shaped intermetallic compounds, resulting in extremely poor plasticity of the alloy and basically unable to be processed; 5. The specific gravity of the Ti element is small, and there is a big difference in physical properties between the Ti element and the Ag-based alloy and the Cu-based alloy, which further affects the wire forming of the alloy. Utility Model Content

[0003] In response to the difficulties existing in the above-mentioned prior art, the purpose of the present utility model is to provide a device for preparing alloy-state active solder wire. The preparation device has a novel design and combines multiple technologies such as vacuum melting, powder addition, solid-liquid stirring and mixing, rapid solidification vertical casting, etc., and can be widely used in the field of preparing various doped material wires such as particle reinforcement and fiber reinforcement.

[0004] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0005] A device for preparing alloy-state active solder wire mainly includes a mother alloy smelting pool, a solid-liquid mixing pool, a guide pipe and a vertical drawing device, etc. The mother alloy smelting pool is connected to the solid-liquid mixing pool by a guide pipe, and the vertical drawing device is arranged at the lower end of the solid-liquid mixing pool; the mother alloy smelting pool includes a first crucible, a furnace cover, a quartz glass observation hole, a first exhaust port, a first air inlet and a medium-frequency induction coil, etc. The furnace cover is arranged at the upper end of the first crucible, and the furnace cover is provided with a quartz glass observation hole, a first exhaust port and a first air inlet, and the medium-frequency induction coil is arranged outside the first crucible; the solid-liquid mixing pool includes a second crucible, a furnace cover, a second exhaust port, a second air inlet, a rotating blade, a stainless steel funnel and a resistance heating package, etc. The furnace cover is arranged at the upper end of the second crucible, and the furnace cover is provided with a second exhaust port and a second air inlet, the rotating blade and the stainless steel funnel are arranged on the upper part of the second crucible, and the resistance heating package is arranged outside the second crucible.

[0006] Furthermore, the vertical casting device includes a graphite crystallizer, a pulling guide roller, an alloy rod, etc., and the graphite crystallizer, the pulling guide roller, and the alloy rod are sequentially connected to the bottom of the second crucible.

[0007] Furthermore, the first crucible is made of alumina, and the second crucible and the rotating blades are made of tungsten.

[0008] Furthermore, the first crucible contains a master alloy melt, and the second crucible contains a solid-liquid alloy melt.

[0009] Furthermore, the guide tube is provided with a control valve, which can control the flow rate of the master alloy melt vertically entering the second crucible along the guide tube.

[0010] Furthermore, a heating and heat preservation device is provided outside the guide tube.

[0011] Furthermore, the bottom of the first crucible and the top of the second crucible are connected through a flow guide tube.

[0012] Advantages of this utility model:

[0013] 1. The active solder wire preparation device of the present invention realizes that the master alloy and the active solder alloy are in a vacuum environment in a molten state, avoiding air absorption oxidation, etc.; it also effectively reduces the contact reaction between the active elements and materials such as the crucible and the mold, and ensures that the active element Ti is dispersed in the alloy in the form of particles and is metallurgically bonded with the master alloy, reducing the dissolution of the active element Ti in the alloy and the formation of brittle intermetallic compounds during solidification, thereby providing a strong guarantee for the drawing preparation of ultra-fine active solder wires.

[0014] 2. The active solder wire preparation device of the utility model has a novel design. It combines multiple technologies such as vacuum melting, powder addition, solid-liquid stirring and mixing, rapid solidification vertical casting, etc., and can be widely used in the field of preparing wires of various doped materials such as particle reinforcement and fiber reinforcement.

[0015] 3. The active solder wire preparation device of this utility model successfully produced alloyed active solder wire. The method employed was to uniformly disperse spherical titanium powder in a master alloy through a "solid-liquid mixing and stirring followed by rapid casting and solidification" process, and then vertically cast a uniform alloy rod. The resulting alloy rod is characterized by the titanium particles encapsulating the alloy, and the metallurgical bonding between the Ti particle surface and the alloy, resulting in a dense connection. During the alloy processing process, the spherical titanium powder easily slips in the swaging and drawing directions, effectively improving the alloy's processing plasticity. Consequently, active solder wire with a diameter of 0.3 mm can be produced through cold swaging and cold drawing. This process is also suitable for mass production. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the overall assembly of the active solder wire preparation device;

[0017] Figure 2 This is a schematic diagram of the master alloy melting pool of the active solder wire preparation device;

[0018] Figure 3 This is a schematic diagram of the solid-liquid mixing tank and vertical casting of the active solder wire preparation device;

[0019] Figure 4 This is a cross-sectional view of the overall assembly of the active solder wire preparation device.

[0020] Description of main reference numerals:

[0021] 1-first crucible, 2-first exhaust port, 3-medium frequency induction coil, 4-first air inlet, 5-quartz glass observation hole, 6-master alloy melt, 7-draft guide tube, 8-second crucible, 9-resistance heating package, 10-rotating blade, 11-stainless steel funnel, 12-solid-liquid alloy melt, 13-second exhaust port, 14-second air inlet, 15-graphite crystallizer, 16-traction guide roller, 17-alloy rod. DETAILED DESCRIPTION

[0022] The following is a further description of the method for preparing active solder wire of the present invention in conjunction with an example of specific ingredient calculation.

[0023] like Figure 1-4As shown, the apparatus for preparing alloyed active solder wire of the present invention primarily comprises a first crucible 1, a first exhaust port 2, a medium-frequency induction coil 3, a first air inlet 4, a quartz glass observation port 5, a master alloy melt 6, a flow guide tube 7, a second crucible 8, a resistance heating package 9, a rotating blade 10, a stainless steel funnel 11, a solid-liquid alloy melt 12, a second exhaust port 13, a second air inlet 14, a graphite crystallizer 15, a pulling roller 16, and an alloy rod 17. This complete apparatus ensures that the master alloy and active solder alloy remain molten in a vacuum environment, preventing absorption and oxidation. It also effectively reduces contact reactions between active elements and materials such as the crucible and mold, ensuring that the active element Ti is dispersed in the alloy in particulate form and metallurgically bonded to the master alloy, reducing the risk of active element Ti being dissolved in the alloy and solidifying to form brittle intermetallic compounds.

[0024] like Figure 1-4 As shown, the alloy-state active solder wire preparation device of the present invention mainly includes a mother alloy smelting pool, a solid-liquid mixing pool, a guide pipe 7 and a vertical drawing device. The mother alloy smelting pool and the solid-liquid mixing pool are connected by a guide pipe 7, and the vertical drawing device is arranged at the lower end of the solid-liquid mixing pool.

[0025] like Figure 2 As shown, the master alloy smelting pool includes a first crucible 1, a furnace cover, a quartz glass observation hole 5, a first exhaust port 2, a first air inlet 4 and a medium-frequency induction coil 3. The furnace cover is provided on the upper end of the first crucible 1, a quartz glass observation hole 5 is provided in the middle of the furnace cover, a first exhaust port 2 and a first air inlet 4 are provided on both sides of the furnace cover, and a medium-frequency induction coil 3 is provided outside the first crucible 1; the first crucible 1 is made of alumina, and the inside of the first crucible 1 is the master alloy melt 6.

[0026] like Figure 3-4 As shown, the solid-liquid mixing tank includes a second crucible 8, a furnace cover, a second exhaust port 13, a second air inlet 14, a rotating blade 10, a stainless steel funnel 11, and a resistance heating package 9. The furnace cover is arranged at the upper end of the second crucible 8, and is provided with a second exhaust port 13 and a second air inlet 14. The rotating blade 10 and the stainless steel funnel 11 are arranged on the upper part of the second crucible 8, and the resistance heating package 9 is arranged outside the second crucible 8. The second crucible 8 and the rotating blade 10 are made of tungsten, and the second crucible 8 contains a solid-liquid alloy melt 12.

[0027] like Figure 3 As shown, the vertical drawing device includes a graphite crystallizer 15 , a pulling guide roller 16 and an alloy rod 17 , etc. The graphite crystallizer 15 , the pulling guide roller 16 and the alloy rod 17 are sequentially connected to the lower part of the second crucible 8 .

[0028] like Figure 4As shown, the bottom of the first crucible 1 is connected to the top of the second crucible 8 via a flow conduit 7. A control valve is provided on the flow conduit 7 to control the flow rate of the master alloy melt 6 vertically entering the second crucible 8 along the flow conduit 7. A heating and heat preservation device is provided on the outside of the flow conduit 7.

[0029] The method for preparing alloyed active solder wire using the preparation device of the utility model comprises the following steps:

[0030] Step I: Weigh the master alloy and place it in an alumina crucible (master alloy melting pool). Secure the furnace cover and evacuate the furnace through the first exhaust port. Heat the master alloy using a medium-frequency induction coil. Once the master alloy is completely melted, observe through the quartz glass observation hole. Maintain the refining temperature at 50°C above the master alloy liquidus temperature, ensuring that the master alloy is completely molten in a vacuum environment and has good fluidity.

[0031] Step II: After the master alloy melt obtained in Step I is refined, the first air inlet is opened and inert argon is introduced. The control valve in the flow tube is then opened, allowing the master alloy melt to flow vertically along the flow tube into the solid-liquid alloy pool. The melt's own weight and the pressure of the gas flow control the melt's flow rate into the solid-liquid mixing pool, thereby controlling the master alloy composition ratio.

[0032] Step III: Before the master alloy melt flows in Step II, place proportionally weighed spherical titanium powder in a stainless steel funnel. Evacuate the interior of the second crucible (made of tungsten) through the second exhaust port. Turn on the resistance heating pack to preheat the second crucible to the master alloy liquidus temperature and maintain that temperature. After the master alloy melt flows in, lower the rotating blades (made of tungsten) into the melt and start rotating. Simultaneously, open the stainless steel funnel to control the spherical titanium powder's drop into the solid-liquid alloy pool. The crucible and rotating blades are made of tungsten to avoid reaction with the active solder in the solid-liquid mixed state, ensuring impurity control and extending the equipment's service life. The spherical titanium powder's particle size, tapped density, and bulk density, along with the stainless steel funnel design, ensure proportional addition of the titanium powder and prevent premature interaction with the master alloy melt, dissolution, and formation of brittle intermetallic compounds.

[0033] Step IV: After the master alloy melt and the spherical titanium powder in step III are stirred by the rotating blades, inert argon gas is introduced from the second air inlet; the graphite crystallizer is opened, and the alloy rod is pulled downward by the traction guide roller to prepare an active solder alloy rod.

[0034] The master alloy is not limited to one of Ag-28Cu, Ag-35Cu, Ag-50Cu, Ag-30Cu-10Sn, Ag-24Cu-17Sn, Ag-26Cu-14In, Ag-21Cu-20In, Ag-19Cu-30In, Ag-22Cu-13In-7Sn, Cu-8Sn, Cu-10Sn and Cu-12Sn.

[0035] This preparation device is a complete set of equipment that can keep the master alloy and active solder alloy in a vacuum environment in the molten state, avoiding air absorption oxidation, etc.; it effectively reduces the contact reaction between the active elements and materials such as crucibles and molds, and also ensures that the active element Ti is dispersed in the alloy in the form of particles and achieves metallurgical bonding with the master alloy, reducing the dissolution of the active element Ti in the alloy and solidification to form brittle intermetallic compounds.

Claims

1. A device for preparing alloy active solder wire, characterized by: It includes a mother alloy smelting pool, a solid-liquid mixing pool, a guide pipe and a vertical drawing device. The mother alloy smelting pool is connected to the solid-liquid mixing pool through a guide pipe, and the vertical drawing device is arranged at the lower end of the solid-liquid mixing pool; the mother alloy smelting pool includes a first crucible, a furnace cover, a quartz glass observation hole, a first exhaust port, a first air inlet and a medium frequency induction coil. The furnace cover is arranged at the upper end of the first crucible, and the furnace cover is provided with a quartz glass observation hole, a first exhaust port and a first air inlet, and the medium frequency induction coil is arranged outside the first crucible; the solid-liquid mixing pool includes a second crucible, a furnace cover, a second exhaust port, a second air inlet, a rotating blade, a stainless steel funnel and a resistance heating package. The furnace cover is arranged at the upper end of the second crucible, and the furnace cover is provided with a second exhaust port and a second air inlet. The rotating blade and the stainless steel funnel are arranged on the upper part of the second crucible, and the resistance heating package is arranged outside the second crucible.

2. The device for preparing alloyed active solder wire according to claim 1, characterized in that: The vertical drawing casting device comprises a graphite crystallizer, a pulling guide roller and an alloy rod, and the graphite crystallizer, the pulling guide roller and the alloy rod are sequentially connected to the bottom of the second crucible.

3. The device for preparing alloyed active solder wire according to claim 1, characterized in that: The first crucible is made of alumina, and the second crucible and the rotating blades are made of tungsten.

4. The device for preparing alloyed active solder wire according to claim 3, characterized in that: The first crucible contains a master alloy melt, and the second crucible contains a solid-liquid alloy melt.

5. The device for preparing alloyed active solder wire according to claim 1, characterized in that: The guide pipe is provided with a control valve.

6. The device for preparing alloyed active solder wire according to claim 1, characterized in that: A heating and heat preservation device is arranged outside the guide pipe.

7. The device for preparing alloyed active solder wire according to claim 1, characterized in that: The bottom of the first crucible and the top of the second crucible are connected through a flow guide tube.