Circuit and test structure capable of cleaning dirt of chip component detection probe

Abstract

The utility model provides a line and test structure capable of cleaning dirt of a chip component detection probe, which comprises a main control chip, two relays, a plurality of switches and a digital source meter power supply, the components work cooperatively, and the test process is managed through the connection and disconnection of a control circuit; wherein the digital source meter power supply not only provides a power supply required by the test, but also can remove an oxidation film and dirt on a detection contact at the front end of the probe through direct current heating, so that the cleanness and reliability of the test contact are kept. In addition, the structure is equipped with a bearing assembly to stably place a component to be detected, a probe assembly performs accurate testing, and a power assembly realizes accurate positioning of a probe. The whole system can be remotely operated and monitored through a controller and a network interface, so that the automation degree and the convenience of user interaction are enhanced; according to the utility model, not only is the accuracy of a test result improved, but also the overall operation cost is reduced by reducing manual intervention and maintenance requirements.

Description

Technical Field

[0001] The utility model relates to the technical field of detection equipment, in particular to a circuit and a test structure capable of cleaning dirt on a chip component detection probe. Background Art

[0002] With the increasing popularity and development of electronic products, chip components (such as resistors and capacitors) are widely used in various electronic products. To ensure the quality and performance of these components, their electrical parameters must be accurately measured. However, in the actual production process, due to environmental factors or long-term use, the component detection contacts are prone to accumulation of dirt and oxide film, affecting the accuracy of test results. Therefore, it is particularly important to develop a system that can effectively clean the detection contacts and perform high-precision testing.

[0003] Deficiencies of existing technology:

[0004] 1. Lack of cleaning function: Existing testing equipment often does not have an automatic cleaning function, and the contacts need to be cleaned manually on a regular basis, which not only increases the workload but also may lead to human errors.

[0005] 2. Inconvenience in switching between multiple stations: Traditional test equipment can usually only be used for a single type of test item. When multiple electrical parameter tests are required, it is necessary to frequently replace the test equipment or manually switch the test stations, which is inefficient.

[0006] 3. Low degree of automation: Currently, the testing equipment on the market has a low degree of automation, and many steps still require manual intervention, such as placing components and switching test modes, which makes it difficult to meet the high efficiency requirements of large-scale production lines.

[0007] Therefore, the existing technology has deficiencies and needs further improvement. Utility Model Content

[0008] In view of the problems existing in the prior art, the utility model provides a circuit and a test structure capable of cleaning dirt on a chip component detection probe.

[0009] To achieve the above purpose, the specific solutions of the present utility model are as follows:

[0010] The utility model provides a circuit structure capable of cleaning chip components and detecting dirt on contacts, comprising:

[0011] Main control chip (STMicroelectronics 4981), first relay K7, second relay K8, switch K1, switch K2; switch K3, switch K4, switch K5, switch K6, digital source meter power supply (2601B);

[0012] One end of the switch K1, switch K2, switch K3, and switch K4 are connected to the interface A1, interface B1, interface A2, and interface B2 respectively, and the other end is connected to the port 3 of the first relay K7;

[0013] One end of the switch K5 and the switch K6 are connected to the interface G1 and the interface G2 respectively, and the other end is connected to the port 3 of the second relay K8;

[0014] Port 1 of the first relay K7 is connected to both port 1 and port 2 of the main control chip;

[0015] Port 1 of the second relay K8 is connected to ports 3 and 4 of the main control chip at the same time;

[0016] The first relay K7 is normally closed between port 3 and port 1, and normally open between port 3 and port 2;

[0017] The second relay K8 is normally closed between port 3 and port 1, and normally open between port 3 and port 2;

[0018] The port 2 of the first relay K7 is connected to the port 2 of the second relay;

[0019] Port 1 and port 2 of the digital source meter power supply are connected to port 2 of the second relay K8 and a measuring needle respectively, and the measuring needle is used to contact the terminals of the chip components to perform electrical performance testing;

[0020] The digital source instrument power supply is used to provide test power, and the main control chip is used to control the switching of the first relay K7 and the second relay K8, thereby controlling the connection and disconnection of the main control chip and the digital source instrument power supply with switches K1, K2, K3, K4, K5, and K6, and further controlling the connection and disconnection of the main control chip and the digital source instrument power supply with ports A1, B1, A2, B2, G1, and G2;

[0021] The test items corresponding to the interface A1, interface B1, interface A2, interface B2, interface G1, and interface G2 respectively include: capacitance C value / loss D value, insulation resistance IR, withstand voltage TV, equivalent series resistance ESR, equivalent series inductance ESL, and DC bias characteristics;

[0022] The digital source meter power supply is used to provide direct current for heating to remove the oxide film and dirt on the detection contact at the front end of the measuring needle.

[0023] The utility model also provides a test structure capable of cleaning chip components and detecting contact dirt, comprising the above-mentioned test circuit capable of cleaning chip components and detecting contact dirt; the test structure comprises:

[0024] Supporting assembly, used for supporting chip components to be tested;

[0025] The stylus assembly is arranged below the support assembly and is used to perform performance testing on the chip components to be tested;

[0026] The power assembly includes a first cylinder, which is arranged below the stylus assembly and is used to drive the stylus assembly to move up and down to contact or move away from the chip component to be tested;

[0027] A control mainboard is provided with the test circuit capable of cleaning chip components and detecting contact dirt.

[0028] Furthermore, the stylus assembly includes a stylus group, a first fixed block, a first slider, a first slide rail, and a second slide rail;

[0029] The first slide rail and the second slide rail are arranged side by side on a mounting back plate in the vertical direction;

[0030] The first sliding block is slidably mounted on the first sliding rail and the second sliding rail;

[0031] The first slider is provided with a first fixing block for mounting a measuring needle assembly;

[0032] Each measuring needle group is composed of a number of measuring needles. The control mainboard is installed on the back of the installation backboard, and the test circuits on the control mainboard are connected to the measuring needles.

[0033] Furthermore, the probe group is composed of two or three probes, and the number of probes is determined according to the number of terminals to be tested of the chip component to be tested;

[0034] The distances between the measuring pins gradually decrease from bottom to top.

[0035] Furthermore, the first cylinder is mounted on the lower left end of the mounting back plate;

[0036] The telescopic rod of the first cylinder is connected to the left side of the first slider, and is used to drive the first slider to move up and down, thereby driving the measuring needle group installed on the first fixed block to move up and down.

[0037] Furthermore, a solenoid valve is installed at the lower right end of the mounting back plate, and the solenoid valve is connected to the first cylinder to control the telescopic action of the telescopic rod of the first cylinder;

[0038] An air inlet interface is provided at the lower end of the solenoid valve.

[0039] Furthermore, the supporting assembly includes: a first supporting plate, a second supporting plate, and a third supporting plate;

[0040] The second supporting plate is provided with a first through slot running vertically therethrough, and the third supporting plate is embedded in the first through slot;

[0041] The second support plate is arranged on the first support plate;

[0042] The third supporting plate is provided with oblique through holes corresponding to the number and positions of the measuring needles;

[0043] A first groove is provided on the first supporting plate at a position corresponding to the oblique through hole for the measuring needle to pass through.

[0044] Furthermore, a controller is provided in the middle of the lower end of the mounting back plate. The controller is connected to the solenoid valve and is used to control the start and stop of the solenoid valve. The controller is also connected to the control main board.

[0045] Furthermore, a network interface is provided at the lower end of the controller for network communication.

[0046] The technical solution of the present invention has the following beneficial effects:

[0047] 1. Automated cleaning function: The integrated digital source meter power supply provides DC heating to remove oxide films and dirt on the detection contacts at the front end of the probe, realizing an automated cleaning process, reducing the need for manual intervention and improving work efficiency.

[0048] 2. Multifunctional testing capability: This utility model can complete the testing of multiple electrical parameters including capacitance C value / loss D value, insulation resistance IR, withstand voltage TV, equivalent series resistance ESR, equivalent series inductance ESL and DC bias characteristics, so that a single device can meet different testing requirements, improving the flexibility and applicability of the equipment.

[0049] High-precision test results: By cleaning the dirt on the contacts, good contact between the probe and the component terminals is ensured, thus obtaining more accurate and reliable test data.

[0050] Intelligent control system: The main control chip controls the switching state of the relay to realize automatic management of the test circuit, reducing the human error that may be introduced by manual switching and enhancing the stability and reliability of the system.

[0051] Modular design: The design of the probe assembly allows the number and layout of probes to be adjusted according to the number of terminals of different components, enhancing the equipment's adaptability to chip components of different specifications.

[0052] Convenient operation process: The rational layout of the support assembly, probe assembly and power assembly simplifies the operation steps, allowing users to quickly complete the component placement and testing process.

[0053] Remote monitoring and management: The combination of the controller and the network interface enables remote monitoring and data exchange of the equipment through the network, facilitating centralized management and maintenance.

[0054] Compact structure and easy maintenance: The overall design takes into account space utilization and maintainability, making the equipment not only compact but also more convenient and quick to maintain. BRIEF DESCRIPTION OF THE DRAWINGS

[0055] Figure 1 It is a circuit diagram of the utility model;

[0056] Figure 2 is a diagram of a circuit board corresponding to the circuit of the present utility model;

[0057] Figure 3 It is a three-dimensional diagram of the test structure of the utility model;

[0058] Figure 4 It is an exploded view of the test structure of the utility model;

[0059] Figure 5 It is a three-dimensional diagram of the measuring needle of the present utility model;

[0060] Figure 6 It is a three-dimensional diagram of the third supporting plate of the present utility model.

[0061] In the picture:

[0062] 1. Stylus; 2. First fixed block; 3. First slider; 4. First slide rail; 5. Second slide rail;

[0063] 6. Install the back panel; 7. Solenoid valve; 8. Air intake port;

[0064] 9. First pallet; 10. Second pallet; 11. Third pallet;

[0065] 12. First through slot; 13. Oblique through hole; 14. First groove; 15. Controller;

[0066] 16. Network interface; 17. First cylinder; 18. Chip components to be tested;

[0067] 19. Main control chip; 20. Control main board; 21. Digital source meter power supply. DETAILED DESCRIPTION

[0068] The present invention will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are intended only to illustrate the present invention and are not intended to limit the present invention. It should also be noted that, for ease of description, the accompanying drawings only illustrate portions relevant to the present invention, not all of its components.

[0069] In the description of this utility model, unless otherwise specified or limited, the terms "connected," "connect," and "fixed" should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.

[0070] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0071] In the description of this embodiment, terms such as "upper," "lower," "front," "rear," "left," and "right" are used to refer to positions or locations based on the positions or locations shown in the accompanying drawings. These terms are intended solely to facilitate description and simplify operation, and are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this invention. Furthermore, the terms "first" and "second" are used solely for descriptive purposes and have no special meaning.

[0072] Combine Figures 1-6 As shown, the utility model provides a circuit structure capable of cleaning chip components and detecting contact dirt, comprising:

[0073] Main control chip 19 (STMicroelectronics 4981), first relay K7, second relay K8, switch K1, switch K2; switch K3, switch K4, switch K5, switch K6, digital source meter power supply 21 (2601B);

[0074] One end of the switch K1, switch K2, switch K3, and switch K4 are connected to the interface A1, interface B1, interface A2, and interface B2 respectively, and the other end is connected to the port 3 of the first relay K7;

[0075] One end of the switch K5 and the switch K6 are connected to the interface G1 and the interface G2 respectively, and the other end is connected to the port 3 of the second relay K8;

[0076] Port 1 of the first relay K7 is connected to both port 1 and port 2 of the main control chip 19;

[0077] Port 1 of the second relay K8 is connected to ports 3 and 4 of the main control chip 19 at the same time;

[0078] The first relay K7 is normally closed between port 3 and port 1, and normally open between port 3 and port 2;

[0079] The second relay K8 is normally closed between port 3 and port 1, and normally open between port 3 and port 2;

[0080] The port 2 of the first relay K7 is connected to the port 2 of the second relay;

[0081] Port 1 and port 2 of the digital source meter power supply 21 are connected to port 2 of the second relay K8 and probe 1 respectively, and probe 1 is used to contact the terminals of the chip components to perform electrical performance testing;

[0082] The digital source instrument power supply 21 is used to provide test power, and the main control chip 19 is used to control the switching of the first relay K7 and the second relay K8, thereby controlling the connection and disconnection of the main control chip 19 and the digital source instrument power supply 21 with the switch K1, switch K2, switch K3, switch K4, switch K5, and switch K6, and further controlling the connection and disconnection of the main control chip 19 and the digital source instrument power supply 21 with the port A1, port B1, port A2, port B2, port G1, and port G2;

[0083] The test items corresponding to the interface A1, interface B1, interface A2, interface B2, interface G1, and interface G2 respectively include: capacitance C value / loss D value, insulation resistance IR, withstand voltage TV, equivalent series resistance ESR, equivalent series inductance ESL, and DC bias characteristics;

[0084] The digital source meter power supply 21 is used to provide direct current to generate heat to remove the oxide film and dirt on the front end detection contact of the probe 1.

[0085] Digital SourceMeter Power Supply 21

[0086] The utility model also provides a test structure capable of cleaning chip components and detecting contact dirt, comprising the above-mentioned test circuit capable of cleaning chip components and detecting contact dirt; the test structure comprises:

[0087] A supporting assembly for supporting the chip component 18 to be tested;

[0088] The stylus 1 assembly is provided below the support assembly and is used to perform performance testing on the chip component 18 to be tested;

[0089] The power assembly includes a first cylinder 17, which is arranged below the stylus 1 assembly and is used to drive the stylus 1 assembly to move up and down, contacting or moving away from the chip component 18 to be tested;

[0090] The control main board 20 is provided with the test circuit capable of cleaning the chip components and detecting dirt on the contacts.

[0091] The stylus 1 assembly includes a stylus 1 group, a first fixed block 2, a first slider 3, a first slide rail 4, and a second slide rail 5;

[0092] The first slide rail 4 and the second slide rail 5 are arranged side by side in the up-down direction on a mounting back plate 6;

[0093] The first slider 3 is slidably mounted on the first slide rail 4 and the second slide rail 5;

[0094] A first fixing block 2 is provided on the first sliding block 3 for mounting a set of measuring needles 1;

[0095] Each measuring probe group 1 is composed of a plurality of measuring probes 1 . The control mainboard 20 is mounted on the back of the mounting backboard 6 . The test circuits on the control mainboard 20 are connected to the measuring probes 1 .

[0096] The probe group 1 is composed of two or three probes 1, and the number of probes 1 is determined according to the number of terminals to be tested of the chip component 18 to be tested;

[0097] The distances between the measuring pins 1 gradually decrease from bottom to top.

[0098] The first cylinder 17 is mounted on the lower left end of the mounting back plate 6;

[0099] The telescopic rod of the first cylinder 17 is connected to the left side of the first slider 3 and is used to drive the first slider 3 to move up and down, thereby driving the measuring needle group 1 installed on the first fixed block 2 to move up and down.

[0100] A solenoid valve 7 is also installed at the lower right end of the mounting back plate 6, and the solenoid valve 7 is connected to the first cylinder 17 for controlling the telescopic action of the telescopic rod of the first cylinder 17;

[0101] An air inlet port 8 is provided at the lower end of the solenoid valve 7 .

[0102] The supporting assembly includes: a first supporting plate 9, a second supporting plate 10, and a third supporting plate 11;

[0103] The second support plate 10 is provided with a first through slot 12 running through it from top to bottom, and the third support plate 11 is embedded in the first through slot 12;

[0104] The second support plate 10 is arranged on the first support plate 9;

[0105] The third support plate 11 is provided with oblique through holes 13 corresponding in number and position to the stylus 1;

[0106] A first groove 14 is provided on the first supporting plate 9 at a position corresponding to the oblique through hole 13 for the measuring needle 1 to pass through.

[0107] A controller 15 is further provided in the middle of the lower end of the mounting back plate 6 . The controller 15 is connected to the solenoid valve 7 for controlling the start and stop of the solenoid valve 7 . The controller 15 is also connected to the control main board 20 .

[0108] The lower end of the controller 15 is further provided with a network interface 16 for network communication.

[0109] The principle of this utility model is as follows:

[0110] 1. Working principle of cleaning and testing circuit structure

[0111] Main components

[0112] Main control chip 19 (STMicroelectronics 4981): responsible for the control logic of the entire system.

[0113] The first relay K7 and the second relay K8 are used to control the connection and disconnection of the circuit.

[0114] Switches K1, K2, K3, K4, K5, K6: used to connect different test interfaces.

[0115] SourceMeter power supply 21 (2601B): provides the power required for testing and can remove dirt on probe 1 through DC heating.

[0116] Port 2 of the digital source meter power supply 21 is connected to the probe 1, and port 1 is connected to A1 through the first relay K7. A resistor is connected in series between A1 and the probe 1 to form a loop, and the current generates heat for decontamination.

[0117] Workflow

[0118] Control and connection:

[0119] The main control chip 19 controls the states of the first relay K7 and the second relay K8, thereby controlling the connection and disconnection of each switch.

[0120] The first relay K7 is normally closed between port 3 and port 1, and normally open between port 3 and port 2; similarly, the second relay K8 is also configured in this way.

[0121] When testing is required, the main control chip 19 changes the state of the relay according to the test requirements, thereby controlling the connection between the digital source meter power supply 21 and the test pin 1.

[0122] Testing process:

[0123] Switches K1 to K6 are respectively connected to different interfaces (A1, B1, A2, B2, G1, G2) and are connected to the source instrument power supply 21 through relays.

[0124] The digital source meter power supply 21 contacts the terminals of the chip components through the probe 1 to perform electrical performance testing.

[0125] Test items include: capacitance C value / loss D value, insulation resistance IR, withstand voltage TV, equivalent series resistance ESR, equivalent series inductance ESL and DC bias characteristics.

[0126] Cleaning process:

[0127] The digital source meter power supply 21 also provides a DC heating function for removing the oxide film and dirt on the detection contact at the front end of the probe 1.

[0128] The cleaning process and the testing process can be performed independently or in combination to ensure that the probe 1 is in good contact with the component.

[0129] 2. How the test structure works

[0130] Main components

[0131] Support assembly: used to fix the chip component 18 to be tested.

[0132] Probe 1 assembly: includes 1 set of probes, fixing blocks, sliders, slide rails, etc., used to contact components for testing.

[0133] Power assembly: includes a first cylinder 17, which is used to drive the stylus 1 assembly to move up and down.

[0134] Control mainboard 20: integrates the above test circuit structure and is responsible for controlling the entire test process.

[0135] Workflow

[0136] Component positioning:

[0137] The chip components are placed on the supporting assembly, which is designed with structures such as a support plate and a through slot to ensure that the components are placed correctly.

[0138] Stylus 1 movement:

[0139] The first cylinder 17 in the power assembly drives the stylus 1 assembly to move up and down through the telescopic rod, so that the stylus 1 contacts or separates from the component terminal.

[0140] The test circuit on the control main board 20 controls the action of the cylinder to ensure that the measuring needle 1 can be tested at the correct position.

[0141] Automation control:

[0142] The control main board 20 controls the actions of the relays, switches and cylinders through the main control chip 19 to achieve automated testing.

[0143] The controller 15 is connected to the solenoid valve 7 to control the start and stop of the solenoid valve 7, thereby controlling the extension and contraction of the cylinder.

[0144] Network Communication:

[0145] The controller 15 is also provided with a network interface 16, which can perform remote monitoring and data exchange, and is convenient for management and maintenance.

[0146] Through the above working principle, the utility model realizes the process of automated cleaning and testing, improves the testing efficiency and accuracy, and through reasonable mechanical design and control system, makes the entire testing process more efficient and reliable.

[0147] The above description is only a preferred embodiment of the present invention and does not limit the patent scope of the present invention. All equivalent structural transformations made by using the contents of the present invention specification and drawings under the practical concept of the present invention, or direct / indirect application in other related technical fields are included in the protection scope of the present invention.

Claims

1. A circuit structure capable of cleaning chip components and detecting contact dirt, characterized in that: include: Main control chip, first relay K7, second relay K8, switch K1, switch K2, switch K3, switch K4, switch K5, switch K6, digital source meter power supply; One end of the switch K1, switch K2, switch K3, and switch K4 are connected to the interface A1, interface B1, interface A2, and interface B2 respectively, and the other end is connected to the port 3 of the first relay K7; One end of the switch K5 and the switch K6 are connected to the interface G1 and the interface G2 respectively, and the other end is connected to the port 3 of the second relay K8; Port 1 of the first relay K7 is connected to both port 1 and port 2 of the main control chip; Port 1 of the second relay K8 is connected to ports 3 and 4 of the main control chip at the same time; The first relay K7 is normally closed between port 3 and port 1, and normally open between port 3 and port 2; The second relay K8 is normally closed between port 3 and port 1, and normally open between port 3 and port 2; The port 2 of the first relay K7 is connected to the port 2 of the second relay; Port 1 and port 2 of the digital source meter power supply are connected to port 2 of the second relay K8 and a measuring needle respectively, and the measuring needle is used to contact the terminals of the chip components to perform electrical performance testing; The digital source instrument power supply is used to provide test power, and the main control chip is used to control the switching of the first relay K7 and the second relay K8, thereby controlling the connection and disconnection of the main control chip and the digital source instrument power supply with switches K1, K2, K3, K4, K5, and K6, and further controlling the connection and disconnection of the main control chip and the digital source instrument power supply with ports A1, B1, A2, B2, G1, and G2; The test items corresponding to the interface A1, interface B1, interface A2, interface B2, interface G1, and interface G2 respectively include: capacitance C value / loss D value, insulation resistance IR, withstand voltage TV, equivalent series resistance ESR, equivalent series inductance ESL, and DC bias characteristics; The digital source meter power supply is used to provide direct current for heating to remove the oxide film and dirt on the detection contact at the front end of the measuring needle.

2. A test structure capable of cleaning chip components and detecting contact dirt, comprising the test circuit capable of cleaning chip components and detecting contact dirt according to claim 1; characterized in that: include: Supporting assembly, used for supporting chip components to be tested; The stylus assembly is arranged below the support assembly and is used to perform performance testing on the chip components to be tested; The power assembly includes a first cylinder, which is arranged below the stylus assembly and is used to drive the stylus assembly to move up and down to contact or move away from the chip component to be tested; A control mainboard is provided with the test circuit capable of cleaning chip components and detecting contact dirt.

3. The test structure capable of cleaning chip components and detecting contact dirt according to claim 2, characterized in that: The stylus assembly includes a stylus group, a first fixed block, a first slider, a first slide rail, and a second slide rail; The first slide rail and the second slide rail are arranged side by side on a mounting back plate in the vertical direction; The first sliding block is slidably mounted on the first sliding rail and the second sliding rail; The first slider is provided with a first fixing block for mounting a measuring needle assembly; Each measuring needle group is composed of a number of measuring needles. The control mainboard is installed on the back of the installation backboard, and the test circuits on the control mainboard are connected to the measuring needles.

4. The test structure capable of cleaning chip components and detecting contact dirt according to claim 3, characterized in that: The probe group consists of two or three probes, and the number of probes is determined according to the number of terminals to be tested of the chip component to be tested; The distances between the measuring pins gradually decrease from bottom to top.

5. The test structure capable of cleaning chip components and detecting contact dirt according to claim 4, characterized in that: The first cylinder is mounted on the lower left end of the mounting back plate; The telescopic rod of the first cylinder is connected to the left side of the first slider, and is used to drive the first slider to move up and down, thereby driving the measuring needle group installed on the first fixed block to move up and down.

6. The test structure capable of cleaning chip components and detecting contact dirt according to claim 5, characterized in that: A solenoid valve is also installed at the lower right end of the mounting back plate, and the solenoid valve is connected to the first cylinder to control the telescopic action of the telescopic rod of the first cylinder; An air inlet interface is provided at the lower end of the solenoid valve.

7. The test structure capable of cleaning chip components and detecting contact dirt according to claim 3, characterized in that: The supporting assembly includes: a first supporting plate, a second supporting plate, and a third supporting plate; The second supporting plate is provided with a first through slot running vertically therethrough, and the third supporting plate is embedded in the first through slot; The second support plate is arranged on the first support plate; The third supporting plate is provided with oblique through holes corresponding to the number and positions of the measuring needles; A first groove is provided on the first supporting plate at a position corresponding to the oblique through hole for the measuring needle to pass through.

8. The test structure capable of cleaning chip components and detecting contact dirt according to claim 6, characterized in that: A controller is also provided in the middle of the lower end of the mounting back plate. The controller is connected to the solenoid valve and is used to control the start and stop of the solenoid valve. The controller is also connected to the control main board.

9. The test structure capable of cleaning chip components and detecting contact dirt according to claim 8, characterized in that: The lower end of the controller is also provided with a network interface for network communication.

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