Miniaturized solar wing driving mechanism controller

Abstract

A miniaturized solar wing driving mechanism controller comprises a main SADE and a backup SADE, and each of the main SADE and the backup SADE comprises a communication interface, a secondary power supply module, a main chip MCU and a stepping motor driving chip. In the main SADE / backup SADE, a communication interface is connected with a main chip MCU (Microprogrammed Control Unit), is connected to satellite service computers and is used for CAN (Controller Area Network) point-to-point communication between the satellite service computers; the main chip MCU is connected with the stepping motor driving chip, and the stepping motor driving chip is connected to a stepping motor main winding / stepping motor backup winding of the SADM and used for driving the SADM; the backup SADE or the main SADE further comprises an unfolding mechanism driving chip connected with the main chip MCU, and the unfolding mechanism driving chip is connected with an unfolding mechanism of the solar wing and used for driving the unfolding mechanism. And the secondary power supply module converts the bus input voltage of the external primary power supply and supplies the converted bus input voltage to each chip for power supply. According to the controller, the unfolding driving of the solar wing and the driving of the SADM are realized in a smaller and more integrated manner.

Description

Technical Field

[0001] The present application relates to solar wing drive technology, and in particular to a miniaturized solar wing drive mechanism controller. Background Art

[0002] The Solar Array Drive Controller (SADE) is a crucial component of the Solar Array Drive Assembly (SADA). Based on integrated computer control instructions, the SADE first drives the deployment mechanism motor to assist in deploying the solar arrays and adjusts tension in orbit. It then drives the single-axis Solar Array Drive Mechanism (SADM) to achieve solar array orientation and tracking. In recent years, with the development of commercial spaceflight, the demand for small spaceflight has continued to increase. To reduce the size and cost of satellites, the demand for small, low-cost SADAs has increased dramatically. The existing drive method, which uses bulky circuit modules, is no longer suitable for this requirement and requires improvement. Utility Model Content

[0003] In order to address the above-mentioned deficiencies in the prior art, the present application provides a miniaturized solar wing drive mechanism controller, which realizes the drive of the solar wing deployment and the drive of the SADM in a smaller and more integrated manner.

[0004] In order to achieve the above purpose, the utility model adopts the following technologies:

[0005] A miniaturized solar wing drive mechanism controller includes a primary SADE and a backup SADE, each of which includes a communication interface, a secondary power module, a main chip MCU, a stepper motor driver chip, etc.

[0006] In the primary SADE / backup SADE, the communication interface is connected to the main chip MCU and to the satellite service computer for CAN point-to-point communication with the satellite service computer; the main chip MCU is connected to the stepper motor driver chip, and the stepper motor driver chip is connected to the stepper motor main winding / stepper motor backup winding of the SADM to drive the SADM;

[0007] The backup SADE or the main SADE also includes a deployment mechanism driving chip connected to the main chip MCU, and the deployment mechanism driving chip is connected to the deployment mechanism of the solar wing for driving the deployment mechanism;

[0008] The secondary power supply module is used to convert the bus input voltage of the external primary power supply and provide power to each chip.

[0009] Furthermore, both the main SADE and the backup SADE also include an AD acquisition circuit connected to the main chip MCU; the AD acquisition circuit of the main SADE / backup SADE is connected to the stepper motor main angular position sensor / stepper motor backup angular position sensor, which is used to collect the stepper motor main angular position information / stepper motor backup angular position information.

[0010] Furthermore, both the main SADE and the backup SADE also include a first temperature acquisition circuit connected to the main chip MCU; the first temperature acquisition circuit of the main SADE / backup SADE is connected to the SADM main shell temperature sensor / SADM backup shell temperature sensor, which is used to obtain the SADM main shell temperature sensor data / SADM backup shell temperature sensor data.

[0011] Furthermore, both the main SADE and the backup SADE also include a first thermal control circuit connected to the main chip MCU; the first thermal control circuit of the main SADE / backup SADE is connected to the heating plate resistor located in the SADM main shell / the heating plate resistor located in the SADM backup shell, and is used to control the heating plate resistor in the SADM main shell / the heating plate resistor located in the SADM backup shell for heating.

[0012] Furthermore, a backup SADE or main SADE of the deployment mechanism driving chip is provided, and a second temperature acquisition circuit connected to the main chip MCU is also provided. The second temperature acquisition circuit is connected to the deployment mechanism shell temperature sensor for obtaining deployment mechanism shell temperature sensor data.

[0013] Furthermore, a backup SADE or main SADE of the unfolding mechanism driving chip is provided, and a second thermal control circuit connected to the main chip MCU is also provided. The second thermal control circuit is connected to the heating plate resistor located in the unfolding mechanism shell and is used to control the heating plate resistor of the unfolding mechanism shell for heating.

[0014] Furthermore, the primary SADE and the backup SADE are arranged on the same board, the board is installed in a frame, a heat sink is installed in the frame, a VPX connector connected to the board is installed outside the frame, the VPX connector is connected to the communication interface and the secondary power supply module, and the VPX connector is used to connect to the expansion mechanism, SADM, and primary power supply externally.

[0015] The beneficial effects of the utility model are:

[0016] 1. Compared with the existing technology that uses discrete devices to build the stepper motor drive circuit and the deployment mechanism drive circuit, this solution uses integrated chips instead, which can realize the drive of the solar wing deployment and the SADM in a smaller and more integrated way;

[0017] 2. The temperature acquisition circuit obtains the shell temperature of the SADM and the shell temperature of the deployment mechanism, so that the main chip can control the thermal control circuit to heat the heating plate resistors located on the SADM shell and the deployment mechanism shell to maintain the required temperature of the SADM and the deployment mechanism when needed; and the thermal control circuit has a simple structure, and the heating plate resistors can be turned on or off only by the high and low levels of the control signal, thereby facilitating the turning on / off of heating. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a circuit schematic diagram of the miniaturized solar wing drive mechanism controller of an embodiment of the present application.

[0019] Figure 2 This is a circuit example of the first thermal control circuit / second thermal control circuit in an embodiment of the present application.

[0020] Figure 3 It is a schematic diagram of the physical structure of the miniaturized solar wing drive mechanism controller of an embodiment of the present application. DETAILED DESCRIPTION

[0021] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the implementation methods of the present invention are described in detail below with reference to the accompanying drawings. However, the embodiments described in the present invention are only part of the embodiments of the present invention, rather than all the embodiments.

[0022] The embodiment of the present application provides a miniaturized solar wing drive mechanism controller, including a primary SADE and a backup SADE, such as Figure 1 As shown, both the main SADE and the backup SADE include a communication interface, a secondary power supply module, a main chip MCU, a stepper motor driver chip, an expansion motor driver chip, etc.

[0023] Within the primary and backup SADEs, the communication interface connects to the main MCU and the satellite control computer, enabling CAN point-to-point communication with the satellite control computer. The main MCU connects to the stepper motor driver chip, which in turn connects to the primary and backup windings of the stepper motors in the SADM to drive the SADM. Specifically, the stepper motor driver chip uses the DRV8434 integrated circuit.

[0024] In this example, an integrated chip replaces the existing discrete driver circuitry used in existing technologies. This significantly reduces the size of the overall controller, facilitating its implementation in a smaller board format and ensuring product miniaturization and cost-effectiveness. The stepper motor driver chip controls the current in the stepper motor's main winding and backup winding based on signals from the main MCU.

[0025] Optionally, the main MCU uses a low-power XYA32 microprocessor chip. As a multi-purpose MCU compatible with the Cortex-M4 core, it integrates ADC, DAC, CAN, and SPI bus controllers, thereby saving board space and reducing the number of chips, with the advantages of low cost and miniaturization. Specifically, the main MCU is connected to the stepper motor driver chip via the SPI interface.

[0026] The deployment motor driver chip is located in one of the backup SADE or the main SADE and is connected to the corresponding main chip MCU. The deployment mechanism driver chip is connected to the deployment mechanism of the solar wing to drive the deployment mechanism. Figure 1 In the example shown, the deployment mechanism driver chip is located in the backup SADE. Alternatively, the deployment mechanism driver circuit can utilize TI's integrated driver chip, the DRV8871, replacing the existing multiple relay control method. This ensures product miniaturization and low cost, and controls the deployment mechanism motor speed via pulse-width modulation (PWM) of the input.

[0027] The secondary power module converts the busbar input voltage of the external primary power supply and provides power to the various chips. Optionally, this module utilizes a miniaturized, isolated DC-DC power module, utilizing a PCB surface mount process, dual-in-line mounting, and a potted metal housing. The secondary power module boosts the primary power supply's busbar input +12V voltage to the +28V secondary power required by the stepper motor driver chip and the deployment mechanism driver chip.

[0028] Specifically, such as Figure 1 As shown, both the primary and backup SADEs also include an AD acquisition circuit connected to the main chip MCU. The AD acquisition circuits of the primary and backup SADEs are connected to the primary and backup stepper motor angular position sensors to collect information about the primary and backup stepper motor angular positions. The secondary power module also converts the bus input voltage of the external primary power supply into ±12V power and provides it to the AD acquisition circuit.

[0029] Both the main SADE and the backup SADE also include a first temperature acquisition circuit connected to the main chip MCU; the first temperature acquisition circuit of the main SADE / backup SADE is connected to the SADM main shell temperature sensor / SADM backup shell temperature sensor, used to obtain the SADM main shell temperature sensor data / SADM backup shell temperature sensor data.

[0030] Both the primary SADE and the backup SADE also include a first thermal control circuit connected to the main chip MCU. The first thermal control circuits of the primary SADE and the backup SADE are connected to the heater resistors located in the primary SADM housing and the backup SADM housing, respectively, to control heating of the heater resistors located in the primary SADM housing and the backup SADM housing. The secondary power module is also used to convert the bus input voltage of the external primary power supply into a 12V power supply to power the first thermal control circuit.

[0031] In the backup SADE or main SADE with the expansion mechanism drive chip, specifically, Figure 1 In the example shown, a second temperature acquisition circuit connected to the main chip MCU is provided in the backup SADE. The second temperature acquisition circuit is connected to the deployment mechanism shell temperature sensor to obtain deployment mechanism shell temperature sensor data.

[0032] In the backup SADE or main SADE with the expansion mechanism drive chip, specifically, Figure 1 In the example shown, the backup SADE includes a second thermal control circuit connected to the main MCU. This second thermal control circuit is connected to the heater resistor located in the deployment mechanism housing, controlling the heating of the heater resistor. The secondary power module also converts the busbar input voltage of the external primary power supply into a 12V power supply for the second thermal control circuit.

[0033] like Figure 2 The figure shows an optional example of a first thermal control circuit and a second thermal control circuit, including a resistor R1, a transistor T1, a transistor T2, and a freewheeling diode D1. One end of the resistor R1 is connected to the main chip MCU for receiving control signals, and the other end is connected to the B pole of the transistor T1. The E pole of the transistor T1 is connected to the ground. The C pole of the transistor T1 is connected to the B pole of the transistor T2, and the connection point is A. The C pole of the transistor T2 is connected to +12V, where the +12V is provided by the secondary power supply module. The E pole of the transistor T2 is connected to the cathode of the freewheeling diode D1. The cathode and anode of the freewheeling diode D1 are respectively connected to the positive line and the return line, which are respectively connected to the two ends of the heater resistor. The anode of the freewheeling diode D1 is connected to the ground.

[0034] When the control signal received by resistor R1 is high, transistor T1 turns on, and connection point A is low, which turns on transistor T2. The +12V is connected to the heater resistor via the positive line, and the return line is connected to the heater. The freewheeling diode D1 placed in parallel at both ends of the heater resistor is used to keep the current flowing.

[0035] Under the control of the main MCU, the controller's communication interface communicates with the satellite control computer via the CAN bus, receiving control commands and returning status telemetry information to drive the SADM motor and deployment motor. The primary power supply supplies controlled power to the primary and backup SADEs, providing power to only one set of circuits, thereby achieving cold backup of the primary and backup SADEs. This cold backup also enables CAN point-to-point communication between the two circuits and the satellite control computer.

[0036] When the system starts operating, power is first supplied to the backup SADE, which drives the deployment motor to deploy the solar panels. Upon detecting the deployment completion signal, the backup SADE is de-energized. The primary SADE is then powered on, driving the primary windings of the SADM stepper motor to oscillate the solar panels within a predetermined range of positive and negative angles. If the deployment completion signal fails, the backup SADE is switched to drive the deployment motor to deploy the solar panels again.

[0037] Normally, the primary SADE is in operation, while the backup SADE is in cold standby mode. If the primary SADE experiences an abnormal operating condition, the satellite control computer disconnects the primary SADE, placing it in cold standby mode, and supplies power to the backup SADE, placing it in operation. For example, the SPI interface of the main chip MCU controls the stepper motor drive circuit and transmits data to the primary stepper motor winding, enabling controlled operation of the stepper motor. The AD acquisition circuit is interconnected with the primary stepper motor angular position sensor. The primary SADE uses the AD acquisition circuit to collect and resolve stepper motor angular position information for position control. Similarly, the primary temperature acquisition circuit is interconnected with the SADM case temperature sensor. The primary SADE collects and resolves the SADM case temperature through the first temperature acquisition circuit and transmits it to the satellite control computer via the communication interface. Similarly, the backup SADE drives the backup stepper motor winding, collects and resolves the backup stepper motor angular position information, collects and resolves temperature information such as the SADM case temperature and the deployment mechanism case temperature, and determines whether to heat the motor using the thermal control circuit, achieving closed-loop temperature control.

[0038] The controller in this example uses a single-board 3U VPX architecture, with the primary and backup SADEs placed on the same board. Figure 3 The figure shows an example schematic diagram of a board installed in a frame 1. The board is installed in the middle area of ​​the frame 1. A heat sink 2 is also installed in the frame 1. A VPX connector 3 connected to the board is installed outside the frame 1. The VPX connector 3 is connected to the communication interface, the secondary power supply module, and the first temperature acquisition circuit, the second thermal control circuit, the second temperature acquisition circuit, and the second thermal control circuit. The VPX connector 3 is used to connect to the primary power supply, SADM, and the deployment mechanism.

[0039] Specifically, the heat sink 2 can cover the secondary power module to facilitate heat dissipation. The external VPX connector 3 is located at the end of the board and is locked in place by a locking mechanism to prevent loosening. The only external connector is the VPX connector 3, making it easy to plug in and out and replace.

[0040] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Obviously, those skilled in the art can make various changes and modifications to the present application without departing from the spirit and scope of the present application.

Claims

1. A miniaturized solar wing drive mechanism controller, comprising a primary SADE and a backup SADE, characterized in that: Both the main SADE and the backup SADE include a communication interface, a secondary power module, a main chip MCU, and a stepper motor driver chip; In the primary SADE / backup SADE, the communication interface is connected to the main chip MCU and to the satellite service computer for CAN point-to-point communication with the satellite service computer; the main chip MCU is connected to the stepper motor driver chip, and the stepper motor driver chip is connected to the stepper motor main winding / stepper motor backup winding of the SADM to drive the SADM; The backup SADE or the main SADE also includes a deployment mechanism driving chip connected to the main chip MCU, and the deployment mechanism driving chip is connected to the deployment mechanism of the solar wing for driving the deployment mechanism; The secondary power supply module is used to convert the bus input voltage of the external primary power supply and provide power to each chip.

2. The miniaturized solar wing drive mechanism controller according to claim 1, characterized in that: Both the primary SADE and the backup SADE further include an AD acquisition circuit connected to the main chip MCU; The AD acquisition circuit of the main SADE / backup SADE is connected to the main angular position sensor of the stepper motor / the backup angular position sensor of the stepper motor, and is used to collect the main angular position information of the stepper motor / the backup angular position information of the stepper motor.

3. The miniaturized solar wing drive mechanism controller according to claim 1, characterized in that: The main SADE and the backup SADE also include a first temperature acquisition circuit connected to the main chip MCU; The first temperature acquisition circuit of the master SADE / backup SADE is connected to the SADM master shell temperature sensor / SADM backup shell temperature sensor for acquiring data from the SADM master shell temperature sensor / SADM backup shell temperature sensor.

4. The miniaturized solar wing drive mechanism controller according to claim 3, characterized in that: The primary SADE and the backup SADE each further include a first thermal control circuit connected to the main chip MCU; The first thermal control circuit of the main SADE / backup SADE is connected to the heating plate resistor located in the SADM main shell / the heating plate resistor located in the SADM backup shell, and is used to control the heating plate resistor of the SADM main shell / the heating plate resistor located in the SADM backup shell for heating.

5. The miniaturized solar wing drive mechanism controller according to claim 4, characterized in that: The backup SADE or main SADE of the deployment mechanism driving chip is also provided with a second temperature acquisition circuit connected to the main chip MCU. The second temperature acquisition circuit is connected to the deployment mechanism shell temperature sensor for obtaining deployment mechanism shell temperature sensor data.

6. The miniaturized solar wing drive mechanism controller according to claim 5, characterized in that: A backup SADE or main SADE with an unfolding mechanism driving chip is also provided with a second thermal control circuit connected to the main chip MCU. The second thermal control circuit is connected to the heating plate resistor located in the unfolding mechanism shell and is used to control the heating plate resistor of the unfolding mechanism shell for heating.

7. The miniaturized solar wing drive mechanism controller according to claim 6, characterized in that: The first thermal control circuit / the second thermal control circuit includes a resistor R1, a transistor T1, a transistor T2 and a freewheeling diode D1. One end of the resistor R1 is connected to the main chip MCU, and the other end is connected to the B pole of the transistor T1. The E pole of the transistor T1 is connected to the ground, the C pole of the transistor T1 is connected to the B pole of the transistor T2, the C pole of the transistor T2 is connected to the +12V provided by the secondary power supply module, and the E pole of the transistor T2 is connected to the negative pole of the freewheeling diode D1. The negative pole and positive pole of the freewheeling diode D1 are respectively connected to the positive line and the return line, which are respectively used to connect to the two ends of the heating plate resistor. The positive pole of the freewheeling diode D1 is connected to the ground.

8. The miniaturized solar wing drive mechanism controller according to claim 1, characterized in that: The stepper motor driver chip uses the integrated chip DRV8434.

9. The miniaturized solar wing drive mechanism controller according to claim 1, characterized in that: The expansion mechanism drive chip uses the integrated chip DRV8871.

10. The miniaturized solar wing drive mechanism controller according to claim 1, characterized in that: The primary SADE and backup SADE are installed on the same board, which is installed in a frame. A heat sink is installed in the frame, and a VPX connector connected to the board is installed outside the frame. The VPX connector is connected to the communication interface and the secondary power supply module. The VPX connector is also used to connect to the primary power supply, SADM and deployment mechanism.

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