Earphone and earphone assembly

Abstract

The utility model discloses an earphone assembly, the earphone assembly comprises an earphone and a charging box used for accommodating the earphone, the charging box comprises a box body and a box cover rotatably connected with the box body, the box body comprises a box body shell and a box body lining, the box body lining is provided with two earphone grooves arranged at intervals, and the earphone grooves are used for accommodating the earphone; the earphone groove comprises a top groove and a bottom groove which are located in the box body, the top groove is used for placing an ear muff of the earphone, and the bottom groove is used for accommodating an ear rod of the earphone; the box body comprises a top face facing the box cover, an opening of the top groove and an opening of the bottom groove are both located in the top face of the box body, and the opening of the bottom groove is lower than the opening of the top groove. The box body comprises a top surface facing the box cover, the box cover comprises a bottom surface facing the box body, and when the charging box is closed, the top surface of the box body is opposite to the bottom surface of the box cover; the top surface of the box body is connected with the bottom surface of the box cover to form a parting surface of the charging box, and the parting surface is inclined relative to the thickness direction of the charging box and is inclined relative to the height direction of the charging box.

Description

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on June 21, 2022, with application number 202210705712.8 and application name “Earphones and Earphone Components”, the entire contents of which are incorporated by reference into this application; this application also claims priority to the Chinese patent application filed with the China Patent Office on August 19, 2022, with application number 202211000419.8 and application name “Earphones and Earphone Components”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of audio technology, and in particular to an earphone and an earphone assembly. Background Art

[0003] Wireless headphones are gaining popularity among consumers because they eliminate traditional wired connections and are more convenient to use. However, the pursuit of miniaturization in wireless headphones has resulted in a compact layout of components such as speakers, motherboards, and batteries. This makes the speaker coils susceptible to interference from the motherboard's (or battery's) magnetic field, generating induced currents and, in turn, noise, resulting in poor sound quality. Utility Model Content

[0004] The present application provides an earphone and an earphone assembly including the earphone, wherein the risk of the earphone speaker generating current noise is lower and the sound quality of the earphone is better.

[0005] In the first aspect, the implementation method of the present application provides an earphone. The earphone includes a shell, a speaker, a main circuit board and a battery, and the speaker, the main circuit board and the battery are all installed in the shell. The main circuit board is located between the speaker and the battery. At this time, the speaker and the battery are respectively placed at the two ends of the long side of the main circuit board, and the speaker, the main circuit board and the battery are roughly shaped like a "dumbbell". The main circuit board is tilted relative to the speaker. That is, the fabric plane of the main circuit board is not parallel to the diaphragm plane of the speaker. The fabric plane of the main circuit board refers to the board surface of the main circuit board used for arranging components. The diaphragm plane of the speaker refers to the plane where the diaphragm of the speaker is located when it is in a balanced position.

[0006] In this implementation, since the battery and the speaker are located at both ends of the long side of the main circuit board, the distance between the battery and the speaker is far, and the induced magnetic field generated by the battery has basically no effect on the voice coil of the speaker, thereby eliminating the risk of current sound caused by the battery. At the same time, the fabric plane of the main circuit board is not parallel to the diaphragm plane of the speaker, so that the induced magnetic field generated by the inductance or current loop on the main circuit board has less influence on the speaker, and the risk of current sound caused by the induced magnetic field of the main circuit board is reduced. Therefore, this implementation eliminates or weakens the adverse effects of the induced magnetic field of the main circuit board and the battery on the speaker by optimizing the positional relationship between the speaker, the main circuit board and the battery, reduces the risk of generating current sound, and ensures the sound quality of the speaker, so that the earphones have better sound quality.

[0007] In some possible implementations, the angle between the fabric plane of the main circuit board and the diaphragm plane of the speaker is in the range of 10° to 60°. At this time, the angle between the fabric plane of the main circuit board and the diaphragm plane of the speaker is relatively large, which can greatly reduce the impact of the induced magnetic field generated by the inductance or current loop on the main circuit board on the speaker, so that the risk of current sound caused by the induced magnetic field of the main circuit board is significantly reduced. In addition, the range control of the angle between the fabric plane of the main circuit board and the diaphragm plane of the speaker is also conducive to reducing the difficulty of arranging the speaker, main circuit board and battery in the shell of the earphone, reducing the limitations on the appearance design of the shell of the earphone due to the position requirements of the speaker, main circuit board and battery, and making the shape design of the shell of the earphone more flexible.

[0008] Among them, the angle between the fabric plane of the main circuit board and the diaphragm plane of the speaker can be in the range of 20° to 50°, so as to further reduce the risk of current sound generated by the induced magnetic field of the main circuit board to the speaker, and at the same time better match the installation space of the earphone shell and reduce the difficulty of installation.

[0009] In some possible implementations, the battery is tilted relative to the main circuit board. The central axis of the battery is not perpendicular to the main circuit board's fabric plane. In this case, the induced magnetic field generated by the battery has less impact on magnetic field-sensitive devices on the main circuit board (such as inductors), providing a better operating environment for the devices on the main circuit board. For example, the angle between the central axis of the battery and the main circuit board's fabric plane can be in the range of 30° to 80°.

[0010] In some implementations, the main circuit board can be in the form of a long strip to provide a larger surface area for layout. In this case, the distance between the speaker and the battery is also larger, which helps reduce the risk of current noise in the speaker.

[0011] In some possible implementations, the battery is a button battery, and the speaker is a dynamic speaker.

[0012] In some possible implementations, the earphones include ear cups and ear stems, which can also be called handles. The top of the ear stem is connected to the back of the ear cup. The outer surface of the earphones is a smoothly transitioned geometric curve. From the end connected to the ear cup toward the end away from the ear cup, the outer contour of the ear stem first contracts, then expands, and then contracts again, giving it a rounded and natural feel, like a freely falling water drop.

[0013] In some possible implementations, the housing includes a main housing and a front housing. The front housing is fixed to the front side of the main housing, and the interior space of the front housing communicates with the interior space of the main housing. When the earphones are worn, the front housing faces the user's ear. The main housing includes a first end contacting the front housing and a second end distal from the front housing. In a direction from the first end to the second end, the outer contour of the main housing first contracts and then expands.

[0014] Among them, the situations where the outer contour of the main shell shrinks first and then expands include: the first situation is that the outer contour of the main shell shrinks first, then expands, and then shrinks again; the second situation is that the outer contour of the main shell shrinks first and then expands.

[0015] In the first scenario, the portion of the main shell located at the ear cup contracts from the first end toward the second end, while the portion of the main shell located at the ear stem contracts, then expands, and then contracts again. The bottom of the main shell can be formed with a curved or nearly curved surface to create a rounded shape. In this case, the shape of the main shell allows the ear stem to resemble a freely falling water drop.

[0016] In the second scenario, the portion of the main shell located at the ear cup contracts from the first end toward the second end, while the portion located at the ear stem first contracts and then expands. This means that the bottom of the main shell can be formed by a flat or nearly flat surface. In this second scenario, the bottom of the main shell may have a slightly rounded transition area connecting to the bottom end surface. The morphological changes in this transition area are minimal and can be ignored.

[0017] In some possible implementations, the interior space of the main housing includes a top space, a middle space, and a bottom space, with the top space of the main housing proximate the first end of the main housing and the bottom space of the main housing proximate the second end of the main housing. The speaker is mounted in the interior space of the front housing and / or the top space of the main housing, the battery is mounted in the bottom space of the main housing, and the main circuit board is mounted in the middle space of the main housing, with both ends of the main circuit board extending into the top space and the bottom space of the main housing, respectively.

[0018] In this implementation, the speaker and battery are large in size and roughly in the shape of a flat cylinder, while the main circuit board is a long and narrow plate-like structure. At the same time, the internal space of the front shell, the top space of the main shell, and the bottom space of the main shell are large, while the middle space of the main shell is small. Therefore, the arrangement of the speaker, main circuit board and battery in this implementation can not only reduce the risk of the speaker generating current sound, but also make full use of the internal space of the shell, improve the space utilization rate of the shell, and is conducive to the miniaturization of the headphones.

[0019] In some possible implementations, the main housing has a spine line extending from the first end of the main housing to the second end of the main housing. The spine line is located on the rear side of the main housing and on the center plane of the earphone. The spine line is a smooth curve.

[0020] For example, as the spine line extends from the first end of the main shell to the second end, it first extends backward and then forward. The portion of the main shell corresponding to the segment where the spine line extends backward first contracts and then expands, while the portion of the main shell corresponding to the segment where the spine line extends forward contracts. In this implementation, the shape of the spine line allows the back of the earphone to slide freely, resulting in a natural and aesthetically pleasing overall appearance.

[0021] The spine line may include a plurality of smoothly connected arc segments, wherein the radius of the plurality of arc segments first increases and then decreases in the extension direction of the spine line, wherein the arc segment with the largest radius may be arranged corresponding to the middle space of the main shell.

[0022] In some possible implementations, the angle between the main circuit board's plane and the speaker's diaphragm plane is within a range of 20° to 50°. In this case, the relative position of the speaker and the main circuit board perfectly matches the relative position of the top and middle spaces of the main housing, making installation easy and simple.

[0023] In some possible implementations, the cross-sectional area of ​​the top space of the main shell is larger than the cross-sectional area of ​​the middle space of the main shell, and the cross-sectional area of ​​the bottom space of the main shell is larger than the cross-sectional area of ​​the middle space of the main shell. In this implementation, the main shell is a shell structure, and the morphological changes of the internal space of the main shell are the same as or similar to the morphological changes of the outer contour of the main shell.

[0024] In some possible implementations, the main housing includes a main housing member and a cover member. The main housing member has a first opening and a second opening spaced apart from each other. When the earphones are worn, the first opening and the second opening both face the user's ears. The front housing is mounted to the first opening, and the cover member is mounted to the second opening. The cover member and a portion of the main housing member together enclose a bottom space of the main housing.

[0025] In this embodiment, the housing is composed of three main components: a front housing, a main housing, and a cover. This reduces the number of components, results in a simple structure, and is easy to assemble. Furthermore, the central portion of the main housing is a complete structure without openings, which improves the structural strength of the main housing and enhances the overall structural strength of the main housing and housing.

[0026] In some possible implementations, the main shell also includes a main shell component, a cover component and a back cover component. The main shell component has a first opening, a second opening and a third opening that are spaced apart. When the earphones are in a worn state, the first opening and the second opening are both facing the user's ears, and the third opening is facing away from the user's ears. The third opening is located between the first opening and the second opening; the front shell is installed at the first opening, the cover component is installed at the second opening, the cover component and part of the main shell component jointly enclose the bottom space of the main shell, and the back cover component is installed at the third opening, and the back cover component and part of the main shell component jointly enclose the middle space of the main shell.

[0027] In this implementation, since the middle part of the main shell forms an opening structure through the third opening, it helps to smoothly demold the main shell, simplifies the demolding structure and demolding process of the main shell, and improves the production efficiency and yield of the main shell.

[0028] Furthermore, the parting line between the cover and the main shell is hidden on the secondary exterior surface, while the back cover is located on the primary exterior surface. Although the back cover somewhat disrupts the integrity of the primary exterior surface, its smaller area allows the primary exterior surface of the earphones to maintain a good visual integrity. In some implementations, the differentiated design of the back cover and the main shell can also achieve richer and more diverse appearances.

[0029] In some possible implementations, the main housing is an integrally formed structural member. For example, the main housing can be formed by injection molding. In this implementation, the main housing has high structural strength, which helps improve the overall structural strength of the headset.

[0030] In some implementations, the housing includes a front housing and a main housing, wherein the main housing includes a main housing member and a cover member. The main housing member has a first opening and a second opening spaced apart from each other, both facing forward. The main housing member includes a top portion, a middle portion, and a bottom portion connected in sequence. The first opening is formed at the top portion of the main housing member, and the second opening extends from the bottom portion of the main housing member, through the middle portion of the main housing member, to the top portion of the main housing member.

[0031] In this implementation, since the second opening portion is arranged in the middle of the main shell, there is an opening structure in the middle of the main shell, which helps to smoothly demold the main shell, simplifies the demolding structure and demolding process of the main shell, and improves the production efficiency and yield of the main shell.

[0032] Furthermore, the parting line between the cover and the main housing is mostly hidden within the secondary exterior surface, with a small portion exposed on the primary exterior surface. Therefore, this parting line minimally disrupts the primary exterior surface, essentially preserving its integrity and giving the earphones a better visual overall appearance. Furthermore, the portion of the parting line between the cover and the main housing that disrupts the primary exterior surface is primarily located on the underside of the main housing's top. When the earphones are worn, the underside of the main housing's top rests against the user's ear and is not exposed. Therefore, the visual overall appearance of the earphones when worn is not disrupted by the parting line between the cover and the main housing, resulting in a better user experience.

[0033] In some implementations, the housing includes a front housing and a main housing, the main housing including a main housing member and a back cover member, the main housing member having a first opening and a third opening spaced apart from each other, the first opening facing forward and the third opening facing rearward. The main housing member includes a top portion, a middle portion, and a bottom portion connected in sequence, the first opening being formed in the top portion of the main housing member, and the third opening being formed continuously in the top, middle, and bottom portions of the main housing member. The front housing is mounted to the first opening, and the back cover member is mounted to the third opening.

[0034] In this implementation, since the middle part of the main shell forms an opening structure through the third opening, it helps to smoothly demold the main shell, simplifies the demolding structure and demolding process of the main shell, and improves the production efficiency and yield of the main shell.

[0035] The parting line between the main shell and the back cover can be partially hidden in the secondary appearance surface and partially located on the primary appearance surface, so as to reduce damage to the integrity of the primary appearance surface.

[0036] In some implementations, the housing includes a front housing and a main housing, the main housing including a main housing member and a bottom cover member. The main housing member has a first opening and a fourth opening spaced apart from each other, with the first opening facing forward and the fourth opening facing downward. The front housing is mounted to the first opening, and the bottom cover member is mounted to the fourth opening. The back cover member and the bottom cover member are stacked one on top of the other. The fourth opening is located at the location of the bottom of the main housing member where the cross-sectional area is the largest.

[0037] In some possible implementations, the main housing includes an abutting end surface, the abutting end surface being located on the main housing member and surrounding the first opening, the abutting end surface contacting the front housing. The main housing member has a first projection on a plane containing the abutting end surface, and the cover member has a second projection on the plane containing the abutting end surface, with the first projection covering the second projection.

[0038] The surface of the earphones in the rear view angle is the primary appearance surface, that is, when viewed from the back to the front, the surface exposed by the earphones is the primary appearance surface; the surface of the earphones in the front view angle is the secondary appearance surface, that is, when viewed from the front to the back, the surface exposed by the earphones is the primary appearance surface; when the earphones are in the wearing state, the secondary appearance surface faces the user's ears and is hidden, while the primary appearance surface faces away from the user's ears and is exposed. The main shell is projected from the back to the front to form a first projection, and the cover is projected from the back to the front to form a second projection. Because the first projection covers the second projection, in the rear view angle of the earphones, the main shell obscures the cover, and the earphones hide the parting line between the cover and the main shell in the secondary appearance surface, leaving the primary appearance surface of the earphones intact and maintaining a good visual integrity. The parting line between the cover and the main shell is the line formed on the appearance surface of the earphones where the cover and the main shell meet.

[0039] In some possible implementations, the earphones further include a partition assembly mounted in the top space of the main housing, located between the speaker and the main circuit board. The housing's internal space includes a front cavity, a rear cavity, and a mainboard cavity. The front cavity is located between the front housing and the speaker, the rear cavity is located between the speaker and the partition assembly, and the mainboard cavity is located on the side of the partition assembly facing away from the speaker. The mainboard cavity can be sealed, enhancing the reliability of earphone components within the cavity and extending the life of the earphones.

[0040] In some possible implementations, the separation component includes one or more magnetic isolation members to reduce the risk of electric current sound in the speaker.

[0041] In some possible implementations, the distance between the center point of the bottom surface of the speaker and the center point of the battery in a first direction is in a range of 12 mm to 20 mm, and in a second direction is in a range of 6 mm to 15 mm, where the first direction is parallel to the plane of the speaker diaphragm, and the second direction is perpendicular to the first direction. Alternatively, the distance between the center point of the bottom surface of the speaker and the center point of the battery is in a range of 10 mm to 30 mm.

[0042] In this implementation, the positional relationship between the speaker and the battery is conducive to taking into account both the miniaturization requirements of the earphone and the low-current sound requirements.

[0043] In some possible implementations, the main circuit board includes a first end adjacent to the speaker and a second end adjacent to the battery; the earphones also include a first flexible circuit board and a second flexible circuit board, the first flexible circuit board and the speaker are located on the same side of the main circuit board, the first flexible circuit board electrically connects the speaker to the first end of the main circuit board, the second flexible circuit board and the battery are located on the same side of the main circuit board, and the second flexible circuit board electrically connects the battery to the second end of the main circuit board.

[0044] In this embodiment, the main circuit board is a rigid printed circuit board (PCB), providing sufficient structural strength to accommodate a large number of components on the surface of the assembly. This also allows for double-sided assembly, increasing component integration. The first and second flexible circuit boards are bendable and can be flexibly arranged to suit the internal shape of the earphones and the configuration of other components. This allows the circuitry of the circuit assembly to smoothly extend outward from the main PCB to establish electrical connections with other earphone components (e.g., speakers, battery).

[0045] In some possible implementations, the main circuit board and the first flexible circuit board are fixedly connected using a BOF process, and the main circuit board and the second flexible circuit board are fixedly connected using a BOF process. In this implementation, the electrical connections between the main circuit board and the first and second flexible circuit boards utilize a double-sided BOF process, effectively saving space for the main circuit board layout and internal stacking space for the earphones, thereby reducing costs.

[0046] In a second aspect, embodiments of the present application provide a headset. The headset includes a housing, a first circuit board, and an antenna. The first circuit board and the antenna are both located within the housing and stacked. The first circuit board and the antenna are independent structural components, and the first circuit board is located between the antenna and the housing. The first circuit board has a touch sensor on the side facing the housing. The touch sensor is used to detect touch actions on the housing, and the antenna is used to transmit and receive radio frequency signals.

[0047] In the present application, the side of the touch sensor used to detect user touch operations is the touch side, and the other side of the touch sensor is the non-touch side. That is, the side of the touch sensor facing the shell is the touch side, and the side of the touch sensor facing away from the shell is the non-touch side. Since the antenna is located on the non-touch side of the touch sensor and the antenna is a conductor structure, the antenna can be used as a reference ground for the touch sensor to shield the clutter signals from the non-touch side of the touch sensor, thereby reducing or eliminating the signal interference of the clutter signals on the touch sensor and improving the accuracy of the touch detection of the touch sensor. In addition, since the antenna itself radiates high-frequency current and the touch sensor senses low-frequency current, the antenna has no effect on the touch detection of the touch sensor.

[0048] In this application, the antenna is used to transmit and receive radio frequency signals and also provides a reference ground for the touch sensor. Based on the relative positions of the housing, touch sensor, and antenna, the antenna achieves dual functions within a single structure: enabling wireless communication with the headset and serving as a reference ground for the touch sensor, shielding against clutter and improving touch detection accuracy.

[0049] Furthermore, the coexistence of the headset's touch sensor and antenna in the same spatial area minimizes space usage and facilitates miniaturization. Furthermore, the antenna's radiation area and the touch sensor's touch control area can be implemented within the same area of ​​the housing. Given a given housing volume, both the antenna's radiation area and the touch sensor's touch control area can occupy larger areas, resulting in better antenna transmission and reception performance and the ability to detect a wider variety of touch operations.

[0050] In some possible implementations, the projection of the antenna on the first circuit board covers the touch sensor. In this case, the antenna can better provide a reference ground for the touch sensor, thereby improving the detection accuracy of the touch sensor. It is understood that the cases where the projection of the antenna on the first circuit board "covers" the touch sensor include "complete coverage" and "basic coverage". When the projection of the antenna covers more than 80% of the touch sensor, it is considered to meet the "basic coverage" situation. Specifically, the coverage of the touch sensor by the antenna mainly refers to the coverage of the touch sensor by the radiating part of the antenna. In the location where the touch sensor may be interfered by a relatively concentrated interference source, the coverage of the touch sensor by the radiating part of the antenna is as complete as possible.

[0051] In some possible implementations, the first circuit board includes a conductive layer, and the conductive layer includes the touch sensor. In this case, the first circuit board has a small thickness while forming the touch sensor to facilitate installation.

[0052] In some possible implementations, the touch sensor includes at least three touch blocks arranged in a strip-shaped touch area and spaced apart from each other. The extension direction of the strip-shaped touch area corresponds to the extension direction of the antenna. In this case, the touch sensor has a slider sensing structure. When the capacitance of the at least three touch blocks changes sequentially, it can be determined that the user has applied a sliding action. The touch sensor can also detect user actions such as single clicks, double clicks, and long presses.

[0053] In some possible implementations, the distance between two adjacent touch blocks is within a range of 0.5mm to 2mm. In this case, having at least three touch blocks can prevent the user from simultaneously touching two touch blocks and misjudging a sliding action. Conversely, if the distance between two adjacent touch blocks is too small, false touches are more likely to occur. If the distance between two adjacent touch blocks is too large, the user may not be able to touch the touch blocks, resulting in low touch efficiency.

[0054] In some possible implementations, the headset further includes a main circuit board, a processor, and a radio frequency circuit. The main circuit board is located on a side of the antenna facing away from the first circuit board. The processor and radio frequency circuit are both fixed to and electrically connected to the main circuit board. The radio frequency circuit is electrically connected to the antenna and the processor. The processor is electrically connected to the plurality of touch blocks.

[0055] In this implementation, the main circuit board, the antenna, and the first circuit board are stacked, which can fully utilize the internal space of the headset, improve the space utilization of the headset, and is conducive to the miniaturization of the headset.

[0056] In some possible implementations, the headset also includes a high-frequency blocking circuit, which is connected in series between the multiple touch blocks and the processor. Exemplarily, the high-frequency blocking circuit can be fixed and electrically connected to the second circuit board. The high-frequency blocking circuit generally adopts an inductive Choke circuit, and each touch block is connected to the main circuit board after passing through the high-frequency blocking circuit. Among them, the low-frequency signal generated by the touch sensor during the touch detection process can be transmitted to the processor through the high-frequency blocking circuit. The antenna of the headset usually operates in the high-frequency Bluetooth frequency band, so the high-frequency blocking circuit can block the antenna signal from forming a path on multiple touch blocks, thereby eliminating the coupling effect of multiple touch blocks on the antenna, to ensure that the antenna's transceiver performance is not affected or is less affected.

[0057] In some possible implementations, the headset further includes a second circuit board, one end of the second circuit board being connected to the first circuit board, and the other end of the second circuit board being connected to the main circuit board, and the high-frequency blocking circuit being fixed and electrically connected to the second circuit board. The second circuit board and the first circuit board may be integrally formed components, for example, each being two parts of a flexible circuit board.

[0058] In some possible implementations, the antenna includes an antenna bracket and a first metal member, the antenna bracket being located between the first circuit board and the main circuit board, the first metal member being fixed to the antenna bracket, and the first metal member being electrically connected to the main circuit board. In this implementation, the antenna is simple in structure and easy to implement.

[0059] In some possible implementations, the antenna includes an antenna bracket, a first metal part, and a second metal part. The antenna bracket is located between the first circuit board and the main circuit board. The first metal part is fixed to the antenna bracket. The first metal part is electrically connected to the main circuit board. The second metal part is fixed and electrically connected to the first metal part.

[0060] In this implementation, the first metal part and the second metal part can jointly form the radiating part of the antenna. The radiating part of the antenna is larger in size, which increases the radiation area of ​​the antenna and improves the antenna's transceiver performance, thereby improving the wireless communication performance of the headset.

[0061] Among them, the antenna bracket, the first metal part and the second metal part can all be roughly strip-shaped, and the antenna as a whole is roughly strip-shaped, so as to better match the shape of the earphone shell with a larger radiation area and reduce the difficulty of installation.

[0062] In some possible implementations, the first metal member is formed on the antenna bracket by a laser direct forming process. In this case, the size and shape of the first metal member are less restricted, and the pattern of the first metal member is easy to adjust.

[0063] In some possible implementations, the antenna bracket includes a plate body and multiple legs fixed to the plate body. The plate body is spaced apart from the main circuit board, and the multiple legs are fixed to the main circuit board. A space is formed between the plate body of the antenna bracket and the main circuit board, through which components can be arranged on the main circuit board. The first metal member includes a main portion and a connecting portion. The main portion is fixed to the side of the plate body facing away from the main circuit board. The connecting portion connects to the main portion and extends to at least one of the multiple legs. The connecting portion is soldered to the main circuit board. In this case, the connecting portion of the first metal member is fixed and electrically connected to the main circuit board via soldering, enabling the main circuit board to feed power to the antenna.

[0064] In this implementation, the first metal member forms the antenna's radiating element, or a portion of it. The first metal member and the main circuit board reuse the antenna bracket's legs. These legs serve both as structural connections and as feed points for the antenna, eliminating the need for traditional spring-loaded feed points. This saves significant board space and facilitates antenna placement in small spaces. Furthermore, since signal transmission between the antenna and the main circuit board doesn't require an electrical connector, this reduces antenna signal noise and improves the wireless communication quality of the headset.

[0065] The antenna bracket can be an integrally formed structural member, which has high structural strength and low cost.

[0066] In some possible implementations, there are multiple connecting portions, each connected to different locations on the main body and fixed to different legs. In this implementation, the headset can implement a multi-point feeding antenna solution, thereby enabling a MIMO antenna solution in some embodiments.

[0067] In some possible implementations, the antenna includes an extended circuit board, which includes a second metal member. The extended circuit board can form the second metal member from its conductive layer. The extended circuit board can be a flexible circuit board. In this implementation, the second metal member is formed by the extended circuit board. The extended circuit board is thin, bendable, and requires minimal installation space, making it easily deployable in confined spaces, such as the interior of an ear stem. This expands the antenna's radiation area in these confined spaces.

[0068] In other possible implementations, the second metal member may also be a metal sheet, such as a steel plate or a structural member such as a metal bracket. Similarly, the antenna can also achieve the purpose of expanding the antenna's radiation area in a narrow space by utilizing the thin thickness and easy bendability of the second metal member.

[0069] In some possible implementations, the first circuit board includes a stacked conductive layer, an insulating layer, and a second conductive layer. The conductive layer is located on a side of the insulating layer facing the housing and includes a touch sensor. The second conductive layer is located on a side of the insulating layer facing away from the housing. The projection of the antenna on the first circuit board covers a portion of the touch sensor, and the second conductive layer covers another portion of the touch sensor.

[0070] In this implementation, the antenna and the second conductive layer simultaneously provide a reference ground for the touch sensor, ensuring coverage of the touch sensor and improving touch sensor detection accuracy. The second conductive layer and the antenna are roughly staggered. Since there is only one second conductive layer, and its area is significantly smaller than that of the insulating layer, the overall thickness of the first circuit board remains very thin, making installation simple.

[0071] In some possible implementations, the housing includes a main housing and a front housing. The front housing is fixed to the front side of the main housing, and the interior space of the front housing communicates with the interior space of the main housing. When the earphones are worn, the front housing faces the user's ear. The main housing includes a first end connected to the front housing and a second end remote from the front housing. In a direction from the first end to the second end of the main housing, the outer contour of the main housing first contracts and then expands. A first circuit board is fixed to the inner wall of the main housing. When the earphones are worn, the first circuit board faces away from the user's ear.

[0072] In this implementation, the touch sensor is a capacitive sensor (cap sensor), and the first circuit board is arranged against the inner wall of the main shell of the shell and is located close to the back side of the main shell. Therefore, when the earphones are in the worn state, they are facing away from the user's ears and exposed relative to the user's ears. When the user approaches or touches the back of the main shell, the touch sensor can detect the user's touch action to achieve human-computer interaction.

[0073] In some possible implementations, the interior space of the main housing includes a top space, a neck space, and a bottom space. The cross-sectional area of ​​the top space of the main housing is larger than the cross-sectional area of ​​the neck space of the main housing, and the cross-sectional area of ​​the bottom space of the main housing is larger than the cross-sectional area of ​​the neck space of the main housing. The first circuit board extends from the top space of the main housing to the bottom space of the main housing. In this case, the larger area of ​​the first circuit board allows for a larger layout area for the touch sensors, thereby enabling detection of a wider variety of touch actions.

[0074] In some possible implementations, the earphones also include a third circuit board, which is located in the top space of the main shell, one end of the third circuit board is connected to the first circuit board or the second circuit board, the other end of the third circuit board is bent to the side of the antenna facing away from the first circuit board, and is fixed to the main shell, and the side of the third circuit board facing the main shell has a wearing detection sensor.

[0075] In this implementation, the wearing detection sensor is a capacitive sensor. When the user wears headphones, the intertragus notch on the ear corresponds to the location of the wearing detection sensor. The wearing detection sensor can detect whether the user's skin is in contact with the headphones, thereby cooperating to detect whether the headphones are in a wearing state. The wearing detection sensor has high detection accuracy.

[0076] The headset uses both a proximity sensor and a wear detection sensor to determine whether the headset is being worn. For example, if both the proximity sensor and the wear detection sensor detect that the headset is approaching or touching the user, the headset determines that it is being worn. If either sensor detects that the user is not approaching or touching the user, the headset determines that it is not being worn. Wear detection can be a prerequisite for the touch sensor to detect user touch operations. Only when the headset determines that it is being worn will the touch sensor sense the user's touch operations.

[0077] In some possible implementations, the first circuit board of the detection circuit board can be fixedly connected to the inner wall of the main shell by a hot melt adhesive film, the third circuit board can be fixedly connected to the inner wall of the main shell by double-sided tape, and the other parts of the detection circuit board can also be fixedly connected to the inner wall of the main shell by double-sided tape. In particular, the area of ​​the main shell for the third circuit board is located near the first opening, and the opening area of ​​the first opening is large, which is easy to adhere to, so that the third circuit board can be easily and tightly attached to the main shell in one go by double-sided tape. The first circuit board is relatively long and needs to be extended from the top space of the main shell to the bottom space of the main shell during assembly. By adopting the hot melt adhesive film to fix it, the first circuit board can be inserted into the main shell first during the assembly process without any accidental adhesion. After the first circuit board is inserted into place, the hot melt adhesive film is heated (for example, to 80 or 90 degrees) so that the first circuit board is adhered to the main shell. The semi-molten state of the hot melt adhesive film can better absorb the gap between the first circuit board and the main shell, and the two are better fitted. During the assembly of the earphones, the detection circuit board can be installed in the main shell first, and then the main circuit board can be installed, and then the detection circuit board can be fastened to the main circuit board to achieve electrical connection.

[0078] In some possible implementations, the third circuit board and the first circuit board are integrally formed structural components to reduce the cost and assembly difficulty of the earphones.

[0079] In a third aspect, an embodiment of the present application provides an earphone comprising a housing, a speaker, a bracket, and a microphone. The housing has a first through hole and a second through hole spaced apart from each other. The speaker is fixed within the housing. The bracket is fixed within the housing, forming a rear cavity between the bracket and the speaker. The bracket is provided with a bass tube channel, a sound pickup channel, and a sound pickup cavity. One end of the bass tube channel is connected to the rear cavity, and the other end is connected to the first through hole. The sound pickup channel is separated from the bass tube channel, and one end of the sound pickup channel is connected to the sound pickup cavity, and the other end is connected to the second through hole. The microphone is mounted in the sound pickup cavity.

[0080] In the embodiment of the present application, the bass tube channel and the sound pickup channel are integrated into the bracket, which achieves a high level of integration and high utilization of the internal space of the headphones, thus facilitating the miniaturization of the headphones. The integrated bracket design also reduces assembly difficulty, improves production yield, and brings cost advantages, further enhancing the competitiveness of the product.

[0081] In some possible implementations, the bracket has a front side and a rear side disposed opposite each other, and further has a peripheral side disposed circumferentially between the front side and the rear side. The front side of the bracket is disposed toward the speaker, forming a rear cavity between the bracket and the speaker, and the front side of the bracket is disposed toward the rear cavity. The rear side of the bracket is disposed away from the speaker, that is, toward the mainboard cavity. The peripheral side of the bracket is disposed toward the housing.

[0082] The bass tube channel forms a first opening on the front side of the bracket and a second opening on the circumference of the bracket, the second opening communicating with the first through hole. This allows air in the rear chamber of the earphone to travel through the bass tube channel and the first through hole to the outside of the earphone.

[0083] In some possible implementations, the bass duct channel forms a strip-shaped groove on the front side of the bracket, and the earphones further include a first cover plate, which is fixed to the front side of the bracket and covers a portion of the opening of the strip-shaped groove, and the other portion of the opening of the strip-shaped groove forms a first opening. In this case, the bass duct channel is formed by the bracket and the first cover plate. The first cover plate can be first positioned with the bracket by a positioning structure on the bracket (such as a positioning column, a protrusion, etc.), and then fixed to the bracket by ultrasonic welding to ensure the reliability of the bass duct sealing. In some other embodiments, the first cover plate can also be fixed to the bracket by adhesive materials such as glue or double-sided tape.

[0084] In the embodiment of the present application, when the speaker of the earphone is working, the air resonates in the bass tube channel, driving the resonance of the air in the rear cavity, thereby affecting the vibration of the diaphragm of the speaker to improve the bass performance of the earphone. The size of the bass tube channel of the earphone affects the frequency response result. The length and / or cross-sectional area of ​​the bass tube channel can be adjusted to improve the low-frequency sensitivity based on sound quality / noise reduction considerations. In addition, the cross-sectional area of ​​the bass tube channel is limited and cannot be too large or too small; if the cross-sectional area of ​​the bass tube channel is too small, the acoustic viscous damping will increase, affecting the resonance effect; if the cross-sectional area of ​​the bass tube channel is too large, the volume of the earphone will be too large.

[0085] For example, the cross-sectional area of ​​the bass tube channel can be 0.8 mm 2 to 1.7mm 2 range, for example, within 0.94 mm 2 to 1.54mm 2 In the range, for example 1.126mm 2 , 1.20mm 2 , 1.24mm 2 , 1.28mm 2 etc.; the length of the bass tube channel may be in the range of 7mm to 16mm, for example, in the range of 9.8mm to 13.8mm, such as 9.8mm, 10.4mm, 11.2mm, etc., to obtain better low-frequency sensitivity.

[0086] In some embodiments, the first cover plate can be made of a plastic material. In this case, the first cover plate is lightweight, which helps reduce the weight of the headset. Furthermore, when the bracket is also made of plastic, the first cover plate and the bracket can be secured together using ultrasonic welding technology. This not only meets the requirements of securing and sealing, but also does not occupy additional space due to the connection, which facilitates miniaturization. Of course, the first cover plate can also be secured to the bracket using adhesive materials such as glue or double-sided tape.

[0087] In other embodiments, the first cover plate can also be made of metal. In this case, the first cover plate and the main body still maintain a sealed connection, for example, by using adhesive such as glue or double-sided tape. Furthermore, since the first cover plate is located between the speaker and the main circuit board, when the first cover plate is made of metal, it can also serve as a magnetic shield, isolating the magnetic field. This can reduce the adverse effects of the induced magnetic field generated by components on the main circuit board on the speaker, further reducing the risk of current noise.

[0088] In some other embodiments, the first cover plate may also include a plurality of stacked plates, at least one of which is made of metal. In this case, the first cover plate can be reused as a magnetic isolation member. Among them, at least one of the plurality of plates may be made of plastic material. In this case, the first cover plate is a composite cover plate. For example, the first cover plate may include a stacked plastic plate and a metal plate, the plastic plate being arranged on a side close to the bracket. The first cover plate can be ultrasonically welded to the bracket through the plastic plate. In addition, the first cover plate can also achieve magnetic isolation through the metal plate to reduce the risk of current noise in the speaker.

[0089] In some possible implementations, the area of ​​the bracket surrounding the second opening is sealed to the inner wall of the housing. For example, a gap between the area of ​​the bracket surrounding the second opening and the inner wall of the housing can be sealed with an adhesive layer to improve the sealing of the bass tube passage.

[0090] In some possible implementations, the sound pickup channel forms a third opening on the circumference of the bracket, the third opening being spaced apart from the second opening and communicating with the second through-hole. The third opening and the second opening can be located on different sides of the bracket to align with the first and second through-holes of the housing, thereby matching the design of the earphones.

[0091] In some possible implementations, the earphones further include a fifth mesh secured to the periphery of the bracket and covering the third opening. The fifth mesh allows sound to pass through and is used to prevent external dust from entering the sound pickup channel through the third opening, thereby enhancing sound pickup accuracy by the second microphone. The fifth mesh can be secured to the bracket via an adhesive layer, which can be a material such as adhesive dispenser or double-sided tape. Alternatively, the fifth mesh can be secured to the bracket via other methods.

[0092] In some possible implementations, the area of ​​the bracket surrounding the third opening is sealed to the inner wall of the housing. For example, the area of ​​the bracket surrounding the third opening can be sealed to the inner wall of the housing by an adhesive layer to improve the sealing of the sound pickup channel.

[0093] In some possible implementations, the sound pickup cavity is formed on the front side of the bracket, and the earphone further includes a second cover plate, which is fixed to the front side of the bracket and covers the sound pickup cavity. The second cover plate can be fixed to the bracket by an adhesive layer, which can be a material such as adhesive or double-sided tape. In other embodiments, the second cover plate can also be fixed to the bracket by ultrasonic welding or other methods.

[0094] The second cover is sealed to the bracket to seal the pickup cavity and isolate the rear cavity from the pickup cavity, preventing the second microphone located in the pickup cavity from picking up the sound of the speaker, causing self-excitation and howling. The isolation of the second cover is greater than 30dB to meet the isolation requirements between the second microphone and the speaker. In some examples, the thickness of the second cover can be in the range of 0.15mm to 0.45mm, such as 0.23mm, 0.3mm, 0.35mm, etc.

[0095] In some possible implementations, the second cover plate is made of plastic material or metal material; or the second cover plate includes a plurality of stacked plates, at least one of which is made of metal material. Specifically:

[0096] In some embodiments, the second cover plate can be made of plastic. In this case, the second cover plate is lightweight, which helps reduce the weight of the headset. Furthermore, when the bracket is also made of plastic, the second cover plate and the bracket can be secured together using ultrasonic welding technology. This not only meets the requirements of securing and sealing, but also does not occupy additional space due to the connection, facilitating miniaturization. Of course, the second cover plate can also be secured to the bracket using adhesives such as glue or double-sided tape.

[0097] In other embodiments, the second cover plate can also be made of metal. In this case, the second cover plate and the main body still maintain a sealed connection. For example, the two can be fixed together using adhesive materials such as glue or double-sided tape. Furthermore, since the second cover plate is located between the speaker and the main circuit board, when the second cover plate is made of metal, it can also serve as a magnetic shield, isolating the magnetic field. This can reduce the adverse effects of the induced magnetic field generated by components on the main circuit board on the speaker, further reducing the risk of current noise. For example, the second cover plate can be made of SPCC material.

[0098] In some other embodiments, the second cover plate may also include a plurality of stacked plates, at least one of which is made of metal. In this case, the second cover plate can be reused as a magnetic isolation member. Among them, at least one of the plurality of plates may be made of plastic material. In this case, the second cover plate is a composite cover plate. For example, the second cover plate may include a stacked plastic plate and a metal plate, the plastic plate being arranged on a side close to the bracket. The second cover plate can be ultrasonically welded to the bracket through the plastic plate. In addition, the second cover plate can also achieve magnetic isolation through the metal plate to reduce the risk of current noise in the speaker.

[0099] In some possible implementations, the earphones further include a sixth mesh, which is fixed to the bottom wall of the sound pickup cavity and covers the opening of the sound pickup channel in the bottom wall of the sound pickup cavity. The sixth mesh can be fixed to the bottom wall of the sound pickup cavity using glue 83 or other methods. The glue layer can be a material such as adhesive or double-sided tape.

[0100] In some possible implementations, the earphones further include a first flexible circuit board, a portion of the first flexible circuit board extends from the front side of the bracket into the sound pickup cavity, and the microphone is fixed and electrically connected to the first flexible circuit board. The second microphone is fixed to the first portion of the first flexible circuit board. The first flexible circuit board can be wound from the rear side of the bracket to the front side of the bracket, the first portion of the first flexible circuit board can be located in the sound pickup cavity, and the second microphone is located in the sound pickup cavity to collect the sound entering the sound pickup cavity. The first portion of the first flexible circuit board can be fixed to the side of the sixth mesh cloth facing away from the sound pickup channel by an adhesive layer. The first flexible circuit board can also have a partial structure fixed to the front side of the bracket to make the relative position of the first flexible circuit board and the bracket stable and reliable.

[0101] In some possible implementations, the microphone is positioned so that its sound pickup direction faces away from the speaker. This effectively isolates the second microphone from the speaker, thereby improving the second microphone's signal-to-noise ratio. For example, the first portion of the first flexible printed circuit board includes a through-hole, through which the sound pickup hole of the second microphone connects to the sound pickup channel. This allows sound to pass through the sound pickup channel, the through-hole in the first portion, and the sound pickup hole of the second microphone, thereby allowing the second microphone to pick up sound.

[0102] In some possible implementations, the sound pickup channel forms a connecting groove on the rear side of the bracket, the rear side of the bracket being positioned away from the speaker, one end of the connecting groove communicating with the sound pickup cavity, and the other end of the connecting groove communicating with the third opening. The earphone further includes a third cover plate secured to the rear side of the bracket and covering the connecting groove.

[0103] In this implementation, the sound pickup channel forms a curved portion at both ends of the connecting groove. The sound pickup channel extends from the sound pickup cavity to the third opening, first from the front side of the bracket to the rear side of the bracket, and then extends a distance on the rear side of the bracket, and then goes around from the rear side of the bracket to the circumference of the bracket to form a curved channel.

[0104] The third cover plate can be secured to the bracket via an adhesive layer, which can be made of adhesive such as glue or double-sided tape. In other embodiments, the third cover plate can be secured to the bracket via ultrasonic welding to ensure a reliable seal in the sound pickup channel. The third cover plate can be made of plastic, metal, or a composite panel structure.

[0105] In some possible implementations, the sound pickup channel includes at least one curved portion. In this case, the sound pickup channel is a curved channel to prevent external sound (such as wind) from directly entering the sound pickup cavity, thereby improving wind protection and reducing wind noise, thereby improving the sound pickup accuracy of the second microphone.

[0106] In some possible implementations, the bracket further comprises a rear leakage channel, which is separate from the bass tube channel and the sound pickup channel. The rear leakage channel forms a fourth opening on the front side of the bracket and a fifth opening on the circumference of the bracket, the fifth opening communicating with the first through hole. Air in the rear chamber of the earphone can be discharged to the external space of the earphone through the rear leakage channel and the first through hole.

[0107] In this implementation, the bass tube channel, pickup channel, and rear exhaust channel are integrated into the bracket, resulting in a high degree of integration and efficient utilization of the internal space of the earphones, which is conducive to miniaturization of the earphones. The integrated bracket design also reduces assembly difficulty, improves production yield, brings cost advantages, and further enhances product competitiveness.

[0108] The fifth opening is positioned adjacent to the second opening, that is, adjacent to the openings of the bass tube channel and the rear drain channel on the circumferential side of the bracket. This allows the fifth opening and the second opening to communicate with the first through hole, thereby reducing the opening area of ​​the first through hole and avoiding the formation of a large hole in the housing, thereby improving the visual integrity of the earphone. In other embodiments, the fifth opening and the second opening may also communicate and merge into a single opening.

[0109] The area of ​​the bracket surrounding the fifth opening is sealed to the inner wall of the housing. For example, an adhesive layer can be used to seal the area of ​​the bracket surrounding the fifth opening to the inner wall of the housing to improve the sealing of the sound pickup channel. The adhesive layer can surround both the fifth opening and the second opening, so that the areas of the bracket surrounding the fifth opening and the second opening are sealed to the area of ​​the inner wall of the housing surrounding the first through hole.

[0110] The seventh mesh is fixed to the front side of the bracket and covers the fourth opening. The seventh mesh can be fixed to the bracket by an adhesive layer, or can be fixed to the bracket by other means.

[0111] In some possible implementations, the distance between the fifth opening and the third opening on the circumferential side of the bracket is greater than or equal to 10 mm. In this case, a certain distance exists between the fifth opening and the third opening to meet isolation requirements between the sound pickup channel and the rear exhaust channel. For example, an isolation requirement of greater than or equal to 30 dB can be achieved to improve the sound pickup accuracy of the second microphone. The first through hole of the housing is provided corresponding to the fifth opening, and the second through hole is provided corresponding to the third opening. The distance between the first through hole and the second through hole also needs to meet certain requirements, for example, a distance of greater than or equal to 10 mm on the outer surface of the housing.

[0112] In some possible implementations, the earphones further include a third exterior mesh secured to the inner wall of the housing and covering the second through-hole. The third exterior mesh may be secured to the inner wall of the housing via an adhesive layer. The third exterior mesh may include a main body and a flange, the flange circumferentially connected to the periphery of the main body, the flange secured to the inner wall of the housing, and the main body embedded in the second through-hole.

[0113] The third net is made of a conductive material and is grounded. This prevents electric shock. The third net may also include an extension connected to the flange, electrically connected to the first flexible printed circuit board, and thus grounding the third net. In this embodiment, the third net is a conductive member, and the extension is secured and electrically connected to the first flexible printed circuit board via welding. This welding connection is reliable, simple, and low-cost.

[0114] In some possible implementations, the bracket is an integrally formed structural member. In this case, the bracket has high structural strength, making the overall structure of the bracket and the associated cover plate more stable. In other embodiments, the bracket can also be assembled from multiple structures to form an integrated structure to meet modular assembly requirements.

[0115] In some embodiments, the bracket can be made of plastic material to achieve lightness. In other embodiments, the bracket itself can also be made of magnetic conductive material (such as metal, etc.), or at least partially covered with a magnetic isolation sheet to achieve magnetic isolation and reduce the risk of electric current sound in the speaker.

[0116] In some possible implementations, the housing includes a main shell and a front shell. The front shell is fixed to the front side of the main shell, and the interior space of the front shell is connected to the interior space of the main shell. When the earphones are in the worn state, the front shell faces the user's ear. The main shell includes a first end connected to the front shell and a second end remote from the front shell. In the direction from the first end to the second end of the main shell, the outer contour of the main shell first contracts and then expands. The interior space of the main shell includes a top space, a middle space, and a bottom space. The cross-sectional area of ​​the top space of the main shell is larger than the cross-sectional area of ​​the middle space of the main shell, and the cross-sectional area of ​​the bottom space of the main shell is larger than the cross-sectional area of ​​the middle space of the main shell.

[0117] The speaker is located within the interior space of the front housing and the top space of the main housing, and is fixedly connected to the front housing. The earphones also include a magnetic element. The magnetic element and bracket are both located in the top space of the main housing and fixedly connected to the main housing. The magnetic element is located on the bottom side of the bracket. In this case, the size and position of the magnetic element can meet the magnetic attraction requirements when the earphones are inserted into the box.

[0118] The magnetic element and the bracket, facing away from the speaker, form a mainboard cavity. The mainboard cavity can be a sealed cavity. For example, the bracket and associated cover form a partition assembly with the magnetic element. The bracket is sealed to the magnetic element, and the periphery of the partition assembly is sealed to the inner wall of the housing, ensuring a reliable seal of the mainboard cavity.

[0119] The separation component may include a magnetic isolation member to reduce the risk of current noise in the speaker. For example, the magnetic isolation member may be implemented by the bracket, the first cover plate, the second cover plate, and / or the third cover plate. Furthermore, the magnetic member may be a soft magnet (e.g., a metal block such as iron), in which case the magnetic member can also serve as a magnetic isolation member.

[0120] In some possible implementations, the front housing has a first communication hole and a second communication hole spaced apart. The front housing is generally shaped like a cover and may include a front housing portion and a peripheral housing portion, the front housing portion being disposed forward and the peripheral housing portion being connected to and surrounding the front housing portion. The first communication hole may be provided in the front housing portion, and the second communication hole may be provided in the peripheral housing portion.

[0121] Among them, the first component and the second component of the audio auxiliary component are both installed in the internal space of the front shell and can be located in the front cavity of the earphone. The first component is arranged corresponding to the first connecting hole and covers the first connecting hole, and the second component is arranged corresponding to the second connecting hole and covers the second connecting hole.

[0122] In some embodiments, the first assembly includes a first base, a first exterior mesh, a first grounding member, a first mesh, a fixing plate, and multiple adhesive layers. The first base is provided with a front leakage hole and a light-transmitting area. The front leakage hole is a through-hole structure that allows sound to pass through. The light-transmitting area allows light to pass through. The light-transmitting area is spaced apart from the front leakage hole and can be located to one side of the front leakage hole or surrounding the front leakage hole, without strict limitation.

[0123] Exemplarily, the first base may include a main body and a flange, the flange being circumferentially connected to the periphery of the main body. The front leakage hole and the light-transmitting area may be formed in the main body. The first base may be an integrally formed structural member, and the first base is a light-transmitting structural member, so that the corresponding structure of the light-transmitting area allows light to pass through. The first base may have a black or nearly black appearance, but allow light to pass through. For example, the first base may include a transparent substrate and a black film layer, the black film layer being fixed to the transparent substrate, and the black film layer being hollowed out or having a relatively thin thickness at a position corresponding to the light-transmitting area.

[0124] The first base can be secured to the front housing via an adhesive layer. When the first base is mounted on the front housing, the main body of the first base can be embedded in the first communication hole of the front housing, and the flange can be connected to the inner wall of the front housing via the adhesive layer. The adhesive layer can be a continuous rubber ring to achieve a seal between the first base and the front housing while also connecting them. The adhesive layer can be made of double-sided tape, glue, or other adhesive materials. The main body of the first base forms part of the exterior appearance of the earphones.

[0125] Exemplarily, the first appearance net may include a main body and a flange, and the flange is circumferentially connected to the periphery of the main body. The first appearance net is fixed to the rear side of the first seat body and covers the front leakage hole. The main body of the first appearance net is embedded in the front leakage hole, and the flange of the first appearance net is fixed to the inner wall of the first seat body. The first appearance net forms part of the appearance of the earphone. The first appearance net may be a metal mesh to increase the fashion sense and mechanical reliability of the earphone, reduce the risk of components located on the rear side of the first appearance net being damaged by external forces, for example, it can prevent external sharp objects from piercing, so as to increase the service life of the earphone. The first appearance net may be an integrally formed structural part, for example, the first appearance net may be stamped by a metal mesh.

[0126] Exemplarily, the first grounding member includes a fixing portion and a connecting portion, and one end of the connecting portion is connected to the fixing portion. The fixing portion may be ring-shaped. The first grounding member is fixed to the side of the first appearance net facing away from the first base body, and the fixing portion of the first grounding member may be fixedly connected to the first appearance net in a circumferential manner, such as a flange fixedly connected to the first appearance net. The fixing portion of the first grounding member may also be partially located on the inner side of the main body of the first appearance net. At this time, the first grounding member is arranged around the front leakage hole. The first grounding member is made of conductive material, such as metal material. The first grounding member may be an integrally formed structural member, for example, the first grounding member may be stamped by a metal sheet. Wherein, the first grounding member is grounded to prevent electric shock problems from occurring in the first component.

[0127] Illustratively, the first mesh is secured to the side of the first grounding member facing away from the first exterior mesh via an adhesive layer. The first mesh is used to prevent external dust from entering the earphones and adversely affecting the sound quality. The first mesh is breathable.

[0128] In this implementation, air can pass through the first exterior net, the first grounding piece, the first mesh cloth and multiple adhesive layers, so that the front cavity of the earphone is connected to the outside of the earphone to balance the air pressure in the front cavity of the earphone and the outside of the earphone. The first component provides a front leakage channel for the speaker of the earphone.

[0129] Exemplarily, the second portion of the first flexible circuit board is secured to the rear side of the first base via an adhesive layer, and a proximity sensor is positioned corresponding to the light-transmitting area of ​​the first base. The proximity sensor transmits and receives light signals via the light-transmitting area to detect whether the earphones are being worn. A fixing plate can be secured to the side of the second portion of the first flexible circuit board facing away from the proximity sensor via an adhesive layer. The fixing plate serves to increase the structural strength of the second portion of the first flexible circuit board. The fixing plate can also be fixedly connected to the first base to securely connect the second portion of the first flexible circuit board to the first base, thereby improving the assembly stability of the first assembly.

[0130] The connecting portion of the first grounding member can be fixedly and electrically connected to the second portion of the first flexible printed circuit board to achieve grounding. For example, the connecting portion of the first grounding member can be soldered to the second portion of the first flexible printed circuit board. In other embodiments, the first component may not include the first grounding member, and the first exterior mesh may be made of a conductive material and electrically connected to the first flexible printed circuit board to achieve grounding.

[0131] In some embodiments, the second component includes a second base, a second mesh, a second exterior mesh, a second grounding member, a third mesh, and a plurality of adhesive layers.

[0132] Exemplarily, the second base body has a first surface and a second surface, wherein the first surface is located on one side of the second base body, and the second surface is connected to the periphery of the first surface and is inclined relative to the first surface. The second base body is provided with a first hole, a sound pickup channel, and a second hole. The first hole extends from the first surface to the other side of the second base body, one end of the sound pickup channel opens on the first surface, and the other end opens and extends to the other side surface of the second base body, and the sound pickup channel is separated from the first hole. The sound pickup channel can be a curved channel. The second hole extends from the first surface or the second surface to the other side of the second base body, and the second hole is separated from the sound pickup channel and the first hole.

[0133] The second base is fixed to the inner side of the front shell, the second base is located in the front cavity, the first surface of the second base faces the second communicating hole, and the second surface faces the inner wall of the front shell.

[0134] Exemplarily, the second mesh is secured to the first surface of the second base via an adhesive layer. The second mesh prevents external dust from entering the earphones and adversely affecting the sound quality. The second mesh covers the first hole of the second base and the opening of the sound pickup channel on the first surface. In some embodiments, the second mesh can cover the first surface of the second base, and the shape of the adhesive layer can be adapted to the shape of the first surface.

[0135] Exemplarily, the second grounding member includes a fixing portion and a connecting portion, and one end of the connecting portion is connected to the fixing portion. The fixing portion may be ring-shaped. The second grounding member is fixed to the side of the second mesh cloth facing away from the second base body, and the fixing portion of the second grounding member may be fixedly connected to the second mesh cloth in a circumferential manner, for example, by fixing the periphery of the second mesh cloth through an adhesive layer. The connecting portion of the second grounding member may extend to the other side of the second base body through the second hole of the second base body. The second grounding member is made of a conductive material, such as a metal material. The second grounding member may be an integrally formed structural member, for example, the second grounding member may be stamped and formed by a metal sheet. The second grounding member is grounded to prevent electric shock problems in the second component.

[0136] Exemplarily, the second appearance net includes a central portion and a peripheral portion, the peripheral portion being circumferentially connected to the peripheral edge of the central portion. The central portion may be raised relative to the peripheral portion, forming a bulged structure; alternatively, the central portion may be flat, with the second appearance net forming a planar mesh structure. The peripheral portion of the second appearance net may be secured to the side of the second grounding member facing away from the second mesh cloth via an adhesive layer, and the central portion of the second appearance net may be raised away from the second base.

[0137] The second exterior mesh can be a metal mesh to enhance the earphones' stylish appearance and mechanical reliability, and to reduce the risk of external damage to components behind the second exterior mesh. For example, it can prevent penetration by sharp objects, thereby extending the lifespan of the earphones. The second exterior mesh can be an integrally formed structural component, for example, stamped from a metal mesh. In other embodiments, the second exterior mesh can also be made of plastic or other materials.

[0138] Exemplarily, the second exterior mesh, second grounding member, and second mesh cloth are all located between the second connecting hole of the front housing and the second base. The periphery of the second exterior mesh is connected to the inner wall of the front housing via an adhesive layer, and both the second exterior mesh and second mesh cloth cover the second connecting hole. When speaker 31 is operating, it pushes the air in the front chamber to vibrate, generating sound. This sound then passes through the first hole of the second base, the second mesh cloth, the second exterior mesh, and the second connecting hole of the front housing, propagating to the outside of the earphones, thereby producing sound. The second component forms the sound output channel of speaker 31.

[0139] The opening area of ​​the first hole of the second base body must meet the sound output requirements of the speaker. If there are multiple first holes, the multiple first holes are spaced apart, the area of ​​each first hole is relatively small, and the total area of ​​the multiple first holes meets the sound output requirements. In this case, the structural strength of the second base body is relatively high.

[0140] For example, the third mesh can be secured to the side of the second base body facing away from the first surface via an adhesive layer, covering the opening of the sound pickup channel. The third portion of the first flexible circuit board can be secured to the side of the third mesh facing away from the second base body via an adhesive layer. The third portion of the first flexible circuit board has a through hole, through which the first microphone secured to the third portion of the first flexible circuit board can receive sound. The third mesh covers the through hole.

[0141] In this implementation, the sound outside the earphone can enter the first microphone through the second appearance net, the second mesh cloth, the sound pickup channel, the third mesh cloth, and the through hole of the third part of the first flexible circuit board in sequence. The earphone collects external sound through the first microphone to achieve sound pickup.

[0142] The connecting portion of the second grounding member can be fixedly and electrically connected to the third portion of the first flexible circuit board to achieve grounding. For example, the connecting portion of the second grounding member can be soldered to the third portion of the first flexible circuit board. In other embodiments, the second component may not include a second grounding member, and the second exterior mesh may be made of a conductive material and electrically connected to the first flexible circuit board to achieve grounding.

[0143] In some possible implementations, a loudspeaker includes a frame, a magnetic circuit assembly, and a diaphragm. The magnetic circuit assembly and the diaphragm are fixedly connected to the frame. A second space is formed between the diaphragm and the magnetic circuit assembly, and a third space is formed on the side of the magnetic circuit assembly facing away from the diaphragm. The frame is provided with a first through hole or a second through hole, connecting the second space with the third space. A third through hole is provided in the middle of the magnetic circuit assembly, connecting the second space with the third space.

[0144] In this implementation, a first space is formed on the side of the diaphragm facing away from the magnetic circuit assembly, a second space is formed between the diaphragm and the magnetic circuit assembly, and a third space is formed on the side of the magnetic circuit assembly facing away from the diaphragm. When the speaker is installed in the earphone, the first space corresponds to the front cavity, and the third space corresponds to the rear cavity. The first through hole, the second through hole, and the third through hole all connect the second space and the third space, and the first through hole, the second through hole, and the third through hole form the rear leakage hole of the speaker. In the embodiment of the present application, the speaker significantly increases the opening area of ​​the rear leakage hole of the speaker by adding the third through hole, which is beneficial to reducing the overall acoustic impedance of the earphone, so that the resonance effect between the speaker and the bass tube channel is better, and the low-frequency performance of the earphone is better.

[0145] Among them, the overall acoustic impedance of the earphones includes the mechanical acoustic impedance of the speaker's diaphragm, the acoustic impedance of the speaker's rear vent, the acoustic impedance of the bass tube channel, and the acoustic impedance of the sound outlet; among them, the mechanical acoustic impedance of the diaphragm is the resistance encountered when the diaphragm vibrates; the acoustic impedance of the speaker's rear vent refers to the acoustic impedance of the mesh covering the speaker's rear vent, which in this implementation is the acoustic impedance of the first mesh, the second mesh, and the third mesh; the acoustic impedance of the bass tube channel is the acoustic impedance of the mesh at the opening of the bass tube channel, which in this implementation is the acoustic impedance of the mesh at the position where the bass tube channel is connected to the outside world; the acoustic impedance of the sound outlet is the acoustic impedance of the mesh at the position where the front cavity of the earphone is connected to the outside world, that is, the acoustic impedance of the second mesh covering the second connecting hole.

[0146] For example, the overall acoustic impedance of the earphone is less than or equal to 10 7 pa*s / mm 3 , to ensure better resonance between the speaker and bass tube channel.

[0147] In some possible implementations, the opening area of ​​the third through hole is less than or equal to 3.14 mm 2 , ensuring sufficient magnetic field strength in the speaker's magnetic circuit assembly while reducing the overall acoustic impedance. The third through hole can be a circular hole, a square hole, or a hole of another shape. When the third through hole is a circular hole, its diameter is less than or equal to 2 mm.

[0148] In a fourth aspect, an embodiment of the present application further provides an earphone assembly, the earphone assembly comprising a charging box and the earphone of any one of the first items above, the charging box being used to store the earphone.

[0149] In a fifth aspect, an embodiment of the present application further provides an earphone assembly, comprising a charging box, a first earphone, and a second earphone. The charging box has a first earphone slot and a second earphone slot spaced apart. The charging box includes a first electrode, a second electrode, a third electrode, and a fourth electrode, wherein the first electrode and the second electrode are at least partially located in the first earphone slot, the third electrode and the fourth electrode are at least partially located in the second earphone slot, the second electrode and the third electrode are located between the first electrode and the fourth electrode, the first electrode and the third electrode have the same polarity, and the second electrode and the fourth electrode have the same polarity.

[0150] The first earphone includes a first contact and a second contact spaced apart from each other, the second earphone includes a first contact and a second contact spaced apart from each other, the first contact of the second earphone has the same polarity as the first contact of the first earphone, and the second contact of the second earphone has the same polarity as the second contact of the first earphone.

[0151] The first earphone is detachably accommodated in the first earphone slot, the first contact of the first earphone contacts the first electrode, and the second contact of the first earphone contacts the second electrode; the second earphone is detachably accommodated in the second earphone slot, the first contact of the second earphone contacts the third electrode, and the second contact of the second earphone contacts the fourth electrode.

[0152] In the present application, when the first earphone and the second earphone are correctly placed in the charging box, the contact polarity of the first earphone and the second earphone corresponds to the polarity of the multiple electrodes of the charging box, which is positive connection, and the first earphone and the second earphone can communicate and charge normally with the charging box. When the first earphone is placed in the second earphone slot, the second earphone is placed in the first earphone slot, and the first earphone and the second earphone are mistakenly placed in the charging box in a reversed manner, the first contact of the second earphone contacts the first electrode, the second contact of the second earphone contacts the second electrode, the first contact of the first earphone contacts the third electrode, and the second contact of the first earphone contacts the fourth electrode. The contact polarity of the first earphone and the second earphone still corresponds to the polarity of the multiple electrodes of the charging box, which is positive connection, so it can effectively avoid damaging the post-stage circuits of the first earphone and the second earphone, so that the service life of the earphones and earphone components is longer.

[0153] The polarities of the first to fourth electrodes of the charging box can be arranged in the order of positive, negative, positive, negative, or negative, positive, negative, positive. When the first earphone and the second earphone are correctly placed in the charging box, the polarities of the multiple contacts of the first earphone and the second earphone are arranged in the order of positive, negative, positive, negative, or negative, positive, negative, positive.

[0154] In some possible implementations, the first contact of the first earphone and the second contact of the first earphone are both fixed to the housing of the first earphone and exposed relative to the housing of the first earphone; the first contact of the second earphone and the second contact of the second earphone are both fixed to the housing of the second earphone and exposed relative to the housing of the second earphone. The housings of the first earphone and the second earphone are symmetrical in structure, the first contact of the first earphone and the second contact of the second earphone are symmetrically arranged, and the second contact of the first earphone and the first contact of the second earphone are symmetrically arranged.

[0155] Specifically, when the first earphone is placed in the first earphone slot and is incorrectly placed in the charging box by rotating it upside down, the first contact of the first earphone contacts the second electrode, and the second contact of the first earphone contacts the first electrode. The polarity of the contacts of the first earphone is opposite to the polarity of the multiple electrodes of the charging box, resulting in reverse connection. When the first earphone is placed in the second earphone slot and is incorrectly placed in the charging box by rotating it upside down, the first contact of the first earphone contacts the fourth electrode, and the second contact of the first earphone contacts the third electrode. The polarity of the contacts of the first earphone is opposite to the polarity of the multiple electrodes of the charging box, resulting in reverse connection.

[0156] In the two reverse connection situations described above, the earphone assembly can be equipped with an anti-reverse connection circuit in the first earphone and the second earphone. The anti-reverse connection circuit is connected in series between the first contact or the second contact and the charging circuit. The anti-reverse connection circuit is configured to conduct when the first earphone or the second earphone is connected to the charging box in a positive direction and disconnect when the connection is reversed, thereby effectively preventing damage to the subsequent circuits of the first earphone and the second earphone when the first earphone or the second earphone is incorrectly placed in the charging box. The anti-reverse connection circuit may include one or more components such as MOS transistors, resistors, capacitors, diodes, and magnetic beads.

[0157] In some possible implementations, in the first earphone, the first earphone includes an anti-reverse polarity circuit and a charging circuit. The anti-reverse polarity circuit is connected in series between the first contact or the second contact and the charging circuit. The anti-reverse polarity circuit is used to be turned on when the first contact contacts the first electrode and the second contact contacts the second electrode, and is also used to be turned off when the first contact contacts the second electrode and the second contact contacts the first electrode.

[0158] In this implementation, the anti-reverse connection circuit is turned on when the first earphone is connected to the charging box in the forward direction, and is turned off when the first earphone is connected to the charging box in the reverse direction, thereby effectively preventing damage to the subsequent circuit when the first earphone is mistakenly placed in the charging box.

[0159] The anti-reverse connection circuit can be turned on or off when the first contact contacts the third electrode and the second contact contacts the fourth electrode; the anti-reverse connection circuit is turned off when the first contact contacts the fourth electrode and the second contact contacts the third electrode.

[0160] Exemplarily, the processor of the first headset is electrically connected to the anti-reverse connection circuit, and the processor is used to control the working state of the anti-reverse connection circuit. The processor can send an enable signal to the anti-reverse connection circuit, and the enable signal is used to instruct the anti-reverse connection circuit to work.

[0161] In some possible implementations, the reverse polarity protection circuit includes an NMOS transistor, the drain of the NMOS transistor being electrically connected to the first contact or the second contact, and the source of the NMOS transistor being electrically connected to the charging circuit. In this implementation, the reverse polarity protection circuit uses the NMOS transistor to achieve the functions of conducting when connected in a forward direction and disconnecting when connected in a reverse direction.

[0162] In some possible implementations, the first earphone further includes a processor, the processor is electrically connected to the gate of the NMOS transistor, and the processor is used to control the working state of the anti-reverse connection circuit.

[0163] For example, the drain of the NMOS transistor is electrically connected to the second contact, the source of the NMOS transistor is electrically connected to the second port of the charging circuit, and the gate of the NMOS transistor can be electrically connected to the processor. Alternatively, the drain of the NMOS transistor is electrically connected to the first contact, the source of the NMOS transistor is electrically connected to the first port of the charging circuit, and the gate of the NMOS transistor can be electrically connected to the processor. When the first earphone is connected to the charging box in the positive direction, the Vgs of the NMOS transistor is greater than Vth, and the NMOS transistor is turned on. When the first earphone is connected to the charging box in the reverse direction, the Vgs of the NMOS transistor is less than Vth, and the NMOS transistor is turned off.

[0164] The equivalent circuit of the NMOS transistor may include a parallel MOS transistor portion, a parasitic capacitor, and a body diode.

[0165] In some possible implementations, the first earphone further includes a first resistor and a second resistor, which form a voltage divider circuit. The first resistor and the second resistor are connected in series between the first contact and the second contact, and the gate of the NMOS transistor is electrically connected between the first resistor and the second resistor. When the first earphone is properly connected to the charging box, a first voltage exists between the first contact and the second contact, and the first resistor and the second resistor divide the voltage, so that a voltage exists at the gate of the NMOS transistor, and the NMOS transistor is turned on.

[0166] In some usage scenarios, the first earphone is correctly placed in the first earphone slot of the charging box. When the box entry detection is performed through the first contact and the second contact, there is a detection voltage between the first contact and the second contact, and the first resistor and the second resistor divide the voltage so that there is a voltage on the gate of the NMOS tube, and the NMOS tube is turned on; when the first earphone communicates with the charging box, if the charging box outputs a 1 signal (high level), the first resistor and the second resistor divide the voltage so that there is a voltage on the gate of the NMOS tube, and the NMOS tube is turned on. If the charging box outputs a 0 signal (low level), the processor outputs an enable signal so that there is a voltage on the gate of the NMOS tube, and the NMOS tube is turned on; when the charging box charges the first earphone, there is a charging voltage between the first contact and the second contact, and the first resistor and the second resistor divide the voltage so that there is a voltage on the gate of the NMOS tube, and the NMOS tube is turned on.

[0167] In some possible implementations, the first earphone further includes a first transient diode, wherein two ends of the first transient diode are electrically connected to the first contact and the second contact, respectively; and / or, the first earphone further includes a second transient diode, wherein two ends of the second transient diode are electrically connected to the drain and source of the NMOS tube, respectively.

[0168] In this implementation, the transient diode is a high-efficiency protection device in the form of a diode. By providing a first transient diode and a second transient diode, it is used to prevent the first earphone from generating static electricity, thereby improving reliability and user experience.

[0169] In some possible implementations, the first earphone may further include a diode, with the positive electrode of the diode connected to the processor and the negative electrode connected to the gate of the NMOS tube, to prevent voltage from flowing back into the processor and reduce the risk of damage to the processor.

[0170] In some possible implementations, the reverse connection prevention circuit includes an NMOS transistor. In this case, the reverse connection prevention circuit has fewer components, simple logic, easy control, and low cost.

[0171] In some possible implementations, the anti-reverse connection circuit includes multiple NMOS tubes, and the multiple NMOS tubes are connected in series or in parallel. When the NMOS tubes are connected in parallel, the impedance of the anti-reverse connection circuit can be reduced, the current can be increased, and thus the charging efficiency can be improved. In addition, the risk of damage to the NMOS tube can also be reduced. When the NMOS tubes are connected in series, the reliability of the anti-reverse connection circuit is higher, which can effectively prevent the risk of damage to the subsequent circuit of the first earphone when the first earphone is reversely connected to the charging box.

[0172] In some possible implementations, the first earphone further includes a third resistor, with two ends of the third resistor respectively connected to the two ports of the charging circuit, wherein the third resistor is used to achieve impedance matching.

[0173] In some possible implementations, the anti-reverse connection circuit can also cooperate with the software of the earphones to ensure that the first earphone and the second earphone can communicate and charge normally when they are connected to the charging box. At the same time, when the first earphone and the second earphone are connected to the charging box in reverse, the circuit protects the charging circuit of the charging box and other devices, and protects the charging circuit of the earphones and other subsequent circuits, so as to improve the reliability of the earphone components.

[0174] In some possible implementations, the software of the first and second earphones enables the reverse connection protection function by default. That is, the processor sends an enable signal to the reverse connection protection circuit by default, so that the reverse connection protection circuit is in an operational state. In this case, when the first and second earphones are connected to the charging box in the normal direction, charging and communication can be achieved; when the first and second earphones are connected to the charging box in the reverse direction, the subsequent circuits of the first and second earphones are normal.

[0175] In some other possible implementations, the software of the first earphone and the second earphone does not enable the anti-reverse connection function by default, but enables the anti-reverse connection function in some scenarios. Exemplarily, the first earphone and the second earphone can confirm whether the anti-reverse connection function is enabled based on the entry and exit detection status. For example, the first earphone includes an entry detection component (such as a Hall sensor), and the entry detection component is electrically connected to the processor. The entry detection component is used to detect whether the first earphone is placed in the first earphone slot of the charging box, and the processor is used to control the anti-reverse connection circuit to work when the first earphone is placed in the first earphone slot. Among them, the first earphone and the second earphone can also confirm whether the anti-reverse connection function is enabled based on other state changes of the earphones, including but not limited to changes in status registers such as sensors and charging circuits.

[0176] In some possible implementations, in the first earphone, the first earphone includes a processor, a charging circuit, and a box entry detection component, the processor is electrically connected to the charging circuit and the box entry detection component, the charging circuit is electrically connected to the first contact and the second contact, the box entry detection component is used to detect whether the first earphone is placed in the first earphone slot, and the processor is used to control the charging circuit to operate when the first earphone is placed in the first earphone slot.

[0177] Among them, the first earphone and the second earphone can also control the working status of their charging circuits to ensure that the first earphone and the second earphone can communicate and charge normally when they are connected to the charging box, while not damaging the subsequent circuit when the first earphone and the second earphone are connected to the charging box in reverse, thereby improving the reliability of the earphone assembly.

[0178] In some possible implementations, in the charging box, the charging box also includes a processor and a charging circuit, the charging circuit is electrically connected to the processor, the first electrode and the second electrode, the processor is used to obtain the power of the first earphone through the charging circuit, the first electrode and the second electrode when the first earphone is placed in the first earphone slot, and when the power of the first earphone is less than or equal to a threshold, control the charging circuit to charge the first earphone.

[0179] The operating modes of the charging circuit include communication mode and charging mode, and the two modes are time-shared. In some usage scenarios, after the charging box is opened, the charging circuit is in communication mode, and the processor continuously patrols the charging circuit to detect whether the first earphone is in the box. After detecting that the first earphone is in the box, the processor obtains the power level of the first earphone through the charging circuit and determines whether the first earphone needs to be charged. When the power level of the first earphone is less than or equal to a threshold, the processor determines that the first earphone needs to be charged, controls the charging circuit to switch to charging mode, and charges the first earphone. After charging for a certain period of time, the processor controls the charging circuit to switch to communication mode, reads the power level of the first earphone again, and determines whether the first earphone needs to be charged again. This cycle is repeated one or more times, and when the processor determines that the first earphone is fully charged, charging stops. When the processor determines that the charge level of the first earphone is sufficient (for example, higher than 90%) or the voltage of the first earphone is sufficient, the charging circuit can be controlled to reduce the charging current.

[0180] In this implementation, the first earphone adopts a dual-contact solution and the charging box correspondingly adopts a dual-electrode solution. Therefore, during the working process of the first earphone assembly, the dual contacts of the first earphone and the dual electrodes of the charging box switch between communication mode and charging mode.

[0181] In some possible implementations, the housing of the first earphone is asymmetrical, the first earphone slot is asymmetrical, and the shape of the first earphone slot is the same as the housing of the first earphone. Similarly, the housing of the second earphone is asymmetrical, the second earphone slot is asymmetrical, and the shape of the second earphone slot is the same as the housing of the second earphone. When the first and second earphones are placed in the charging box incorrectly, the first and second earphones cannot be placed in place, and the user can be reminded to re-place them, which is beneficial to improving the user experience.

[0182] In some possible implementations, in a first earphone, the housing includes a main shell and a front shell. The front shell is fixed to the front side of the main shell, and the interior space of the front shell is connected to the interior space of the main shell. When the earphone is worn, the front shell faces the user's ear. The main shell includes a first end contacting the front shell and a second end away from the front shell. In a direction from the first end to the second end of the main shell, the outer contour of the main shell first contracts and then expands.

[0183] The first contact and the second contact are both fixed to the main shell and exposed relative to the main shell.

[0184] In this implementation, the shape design of the main shell enables the ear stem of the earphone to have a shape similar to a "freely falling water drop", with a delicate appearance.

[0185] In some possible implementations, in the first earphone, the main housing includes a main housing member, the main housing member includes a top portion, a middle portion, and a bottom portion connected in sequence, the top portion of the main housing member is connected to the front housing, and the first contact and the second contact are both fixed to the bottom portion of the main housing member. The first earphone slot includes a first bottom slot and a first top slot located in the case body of the charging box. When the first earphone is placed in the first earphone slot, the bottom portion of the main housing member is located in the first bottom slot, the front housing member and the top portion of the main housing member are both partially located in the first top slot and partially located outside the case body, and the middle portion of the main housing member is located outside the case body.

[0186] In this implementation, when the first earphone is placed in the first earphone slot, a larger portion of the first earphone is exposed relative to the charging box, making it easier for the user to pick up the earphone and improving the user experience. Furthermore, the two contacts are located at the bottom of the main housing, facilitating smooth contact between the two contacts and the electrodes of the charging box, ensuring a reliable electrical connection.

[0187] In a sixth aspect, embodiments of the present application provide a charging case having two spaced-apart earphone slots for accommodating earphones. The earphone slots comprise a case body and a lid, the lid being rotatably connected to the case body. The earphone slots comprise a top slot and a bottom slot located in the case body, the top slot being used to accommodate the earbuds of the earphones, and the bottom slot being used to accommodate the ear stems of the earphones. The case body comprises a top surface facing the lid, the top slot opening and the bottom slot opening both being located on the top surface of the case body, and the bottom slot opening being lower than the top slot opening.

[0188] In the embodiment of the present application, the display surface of the charging box is an inclined surface. When the earphones are placed in the earphone slots, more of the earphones are exposed relative to the charging box, making it easier for users to take them. This improves the user experience of taking the earphones from the charging box, while also ensuring a certain aesthetics and enhancing the sophistication of the product's appearance.

[0189] In some possible implementations, the bottom slot opening is spaced apart from the top slot opening. In this case, the bottom slot opening is closer to one end of the top slot opening and lower than the end of the top slot opening closer to the bottom slot opening. In this implementation, the bottom slot opening can be significantly lower than the top slot opening, so that when the earphones are placed in the earphone slot, more of the earphones are exposed relative to the charging case.

[0190] In some possible implementations, the lowest point of the bottom wall of the top groove is not lower than the lowest edge of the opening of the bottom groove. In this implementation, when the earphones are placed in the earphone groove, more of the earphones are exposed relative to the charging box.

[0191] In some possible implementations, the box body has a first end and a second end disposed opposite to each other, the box cover has a first end and a second end disposed opposite to each other, the first end of the box cover is rotatably connected to the first end of the box body, and the second end of the box cover is away from the second end of the box body to open relative to the box body, or the second end of the box cover is close to the second end of the box body to close relative to the box body. The top groove is closer to the first end of the box body than the bottom groove.

[0192] In some possible implementations, the first end of the box body is higher than the second end of the box body.

[0193] In some possible implementations, the case includes an outer shell and an inner liner. The inner liner is fixed to the inner side of the outer shell and has a top groove and a bottom groove. The top of the inner liner is raised relative to the outer shell. In this case, the top surface of the outer shell is raised relative to the top surface of the inner liner, making it easier for users to pick up earphones placed in the charging case, thereby improving the user experience.

[0194] In some possible implementations, the top surface of the box body shell is flat to reduce the difficulty of processing the box body shell and the box cover shell, and also make the box body shell and the box cover shell easier to close. The parting surface of the charging box is flat, and the appearance of the charging box is exquisite and simple. In some other embodiments, the parting surface of the charging box can also be a curved surface, which is not strictly limited in the embodiments of the present application.

[0195] The top surface of the box lining is curved so that the shapes of the top and bottom slot openings better match and support the earphones. In this case, the earphones are placed stably and reliably in the charging box, and are also convenient for users to pick up. In addition, the display surface of the charging box is beautiful and exquisite. In some other embodiments, the top surface of the box shell can also be flat, and this embodiment of the application is not strictly limited to this.

[0196] In some possible implementations, the charging box has a width direction, thickness direction, and height direction that are perpendicular to each other, the two earphone slots are arranged in the width direction of the charging box, the size of the charging box in the height direction is larger than the size of the charging box in the thickness direction, and the top surface of the box body shell is inclined relative to the thickness direction of the charging box, and inclined relative to the height direction of the charging box.

[0197] In some possible implementations, the charging case includes a magnet that is fixed to the case's inner lining and located between the top and bottom slots. In this implementation, there is a large space between the top and bottom slots, allowing for the placement of a larger magnet to increase the magnetic attraction for the earphones. When the earphones are placed in the earphone slots, the earphones' magnetic elements are positioned opposite the magnets in the charging case, with the two being close together and spaced relatively close together, thereby generating sufficient magnetic attraction to stably hold the first earphone in the charging case.

[0198] In some possible implementations, the charging box also includes a battery and a circuit board. Both the battery and the circuit board are fixed to the inside of the box shell and located below the box lining. The circuit board is located below the bottom groove, and the battery is located below the top groove. In this case, the battery and the circuit board can be arranged to fully utilize the space inside the box, and the charging box has high space utilization.

[0199] In some possible implementations, the charging box further includes a hinge assembly, the hinge assembly includes a hinge and a hinge bracket, the hinge bracket is fixed to the box body, and the box cover is connected to the hinge bracket by rotating the hinge to rotate and connect to the box body.

[0200] In some possible implementations, the charging box also includes a wireless charging coil, which is fixed in the box body; the hinge bracket includes a metal part and a plastic part, the plastic part is located between the metal part and the wireless charging coil, and the hinge is plugged into the metal part.

[0201] In this implementation, the hinge bracket can ensure the strength of the connection structure while reducing the adverse effects of metal parts on the charging box during the wireless charging process, thereby ensuring the wireless charging performance of the earphone assembly.

[0202] The rotating shaft bracket may be an integrally formed structural component to have a high structural strength. For example, the rotating shaft bracket may be formed by a metal injection molding (MIM) process, a metal insert injection molding process, or the like.

[0203] In some possible implementations, the lid includes an adapter block that is rotatably connected to the hinge bracket via a hinge. The case body is provided with a notch, and when the lid is closed relative to the case body, the adapter block covers the notch. In this manner, the charging case has a complete appearance.

[0204] In some possible implementations, the rotating shaft assembly further includes a decorative piece, which is fixed to the outside of the adapter block and covers the outer side surface of the adapter block.

[0205] In this implementation, the decorative piece covers the outer side surface of the adapter block. When the charging box is closed, the decorative piece covers the notch of the box body and together with the box body forms the appearance of the charging box.

[0206] In some possible implementations, the decorative parts are made of aluminum alloy. This provides aesthetic appeal and high structural strength, while also minimizing the impact on the wireless charging process of the charging box. The decorative parts can be formed by bending sheet metal, offering high structural strength, ease of fabrication, and low cost.

[0207] In some possible implementations, the decorative component includes a first plate, a second plate and a third plate. The second plate and the third plate are respectively connected to the two ends of the first plate and are bent relative to the first plate. The first plate covers the outer side surface of the adapter block, and the rotating shaft is inserted into the second plate and the third plate.

[0208] In this implementation, since the decorative part is designed with a shaft passing through both ends, the problem of uneven gap between the traditional post-attached decorative parts and the decorative part and the box body is solved, the aesthetics is improved, and the support for the rotating shaft is also increased, so that the structural strength of the rotating shaft assembly is higher and the reliability is improved.

[0209] In some possible implementations, the shaft assembly further includes a torsion spring, one end of which is connected to the shaft bracket, and the other end of which is connected to the adapter block. In this implementation, the provision of the torsion spring gives the charging box a lid-opening feel.

[0210] In some possible implementations, the charging box includes a first electrode, a second electrode, a third electrode and a fourth electrode, the first electrode and the second electrode are at least partially located in one of the earphone slots, the third electrode and the fourth electrode are at least partially located in the other earphone slot, the second electrode and the third electrode are located between the first electrode and the fourth electrode, the first electrode and the third electrode have the same polarity, and the second electrode and the fourth electrode have the same polarity.

[0211] In this implementation, when the earphones are correctly placed in the charging case, the polarity of the earphone contacts corresponds to the polarity of the multiple electrodes of the charging case, forming a positive connection, and the earphones can communicate and charge normally with the charging case. If the earphones are incorrectly placed in the charging case with both ears in the wrong position, the polarity of the earphone contacts still corresponds to the polarity of the multiple electrodes of the charging case, forming a positive connection, thus effectively preventing damage to the earphones' downstream circuitry and extending the service life of the earphones and earphone components.

[0212] In a seventh aspect, an embodiment of the present application further provides an earphone assembly, which includes two earphones and a charging box of any one of the above items. BRIEF DESCRIPTION OF THE DRAWINGS

[0213] Figure 1A is a rear view of the earphones provided by the present application in some embodiments;

[0214] Figure 1B yes Figure 1A a left side view of the headset shown;

[0215] Figure 2 yes Figure 1A Schematic diagram of the structure of the headset in some usage scenarios;

[0216] Figure 3 yes Figure 1A A schematic diagram of a partially exploded structure of the earphone shown;

[0217] Figure 4 yes Figure 1A The cross-sectional structure diagram of the earphone shown is taken along AA;

[0218] Figure 5 yes Figure 1A A schematic block diagram of part of the circuit of the headset shown;

[0219] Figure 6 yes Figure 3 A schematic diagram of the exploded structure of the housing shown;

[0220] Figure 7 yes Figure 3 A schematic diagram of the internal structure of the housing shown;

[0221] Figure 8A yes Figure 6 Schematic diagram 1 of the demoulding process of the middle shell shown;

[0222] Figure 8B yes Figure 6 Schematic diagram of the demoulding process of the middle shell shown Figure 2 ;

[0223] Figure 9A is a rear view of the housing of the earphone provided by the present application in some other embodiments;

[0224] Figure 9B yes Figure 9A a left side view of the housing shown;

[0225] Figure 10A is a rear view of the housing of the earphone provided by the present application in some other embodiments;

[0226] Figure 10B yes Figure 10A a left side view of the housing shown;

[0227] Figure 11Ais a schematic structural diagram of the earphone housing provided by the present application in other embodiments;

[0228] Figure 11B is a schematic structural diagram of the earphone housing provided by the present application in other embodiments;

[0229] Figure 11C is a schematic structural diagram of the earphone housing provided by this application in other embodiments;

[0230] Figure 11D is a schematic structural diagram of the earphone housing provided by the present application in other embodiments;

[0231] Figure 12A It is a schematic diagram of the partial structure of a traditional headset;

[0232] Figure 12B It is a partial structural diagram of another traditional headset;

[0233] Figure 13 yes Figure 1A A schematic diagram of a portion of the structure of the earphone shown;

[0234] Figure 14 yes Figure 4 A schematic diagram of part of the structure of the earphone shown;

[0235] Figure 15 yes Figure 1A A schematic diagram of a portion of the structure of the earphone shown;

[0236] Figure 16 yes Figure 15 A schematic structural diagram of the first flexible circuit board and some components shown;

[0237] Figure 17 yes Figure 15 A schematic structural diagram of the second flexible circuit board and some components shown;

[0238] Figure 18 yes Figure 1A A schematic diagram of a portion of the structure of the earphone shown at another angle;

[0239] Figure 19 yes Figure 3 A schematic diagram of the exploded structure of the first component shown;

[0240] Figure 20 yes Figure 18 A schematic diagram of a partial cross-section of the earphone at the BB;

[0241] Figure 21 yes Figure 3 A schematic diagram of the exploded structure of the second component shown;

[0242] Figure 22yes Figure 21 A schematic structural diagram of the second base body of the second assembly shown at another angle;

[0243] Figure 23 yes Figure 18 Another schematic diagram of the cross-sectional structure of the earphone at the BB is shown;

[0244] Figure 24 yes Figure 1A A schematic diagram of a portion of the structure of the earphone shown;

[0245] Figure 25 yes Figure 3 A schematic structural diagram of the fifth component of the audio auxiliary component shown;

[0246] Figure 26 yes Figure 25 A schematic diagram of a partially exploded structure of the fifth component shown;

[0247] Figure 27 yes Figure 25 The structure diagram of the fifth component shown is from another angle;

[0248] Figure 28 yes Figure 27 A schematic diagram of a partially exploded structure of the fifth component shown;

[0249] Figure 29A yes Figure 25 A schematic diagram of a simulation of a possible implementation of the relationship between the length of the bass tube channel of the fifth component and the frequency response of the earphone;

[0250] Figure 29B yes Figure 25 A schematic diagram of a simulation of a possible implementation of the relationship between the cross-sectional area of ​​the bass tube channel of the fifth component and the frequency response of the earphone;

[0251] Figure 30A yes Figure 1A A schematic diagram of part of the internal structure of the earphone shown;

[0252] Figure 30B yes Figure 30A The schematic diagram of the cross-sectional structure of the partial structure shown is along FF;

[0253] Figure 31A yes Figure 3 A schematic diagram of the structure of the loudspeaker shown;

[0254] Figure 31B yes Figure 31A The cross-sectional structure diagram of the loudspeaker at EE is shown;

[0255] Figure 31C yes Figure 31A A schematic diagram of the exploded structure of the loudspeaker shown;

[0256] Figure 31D yes Figure 1A Schematic diagram of the overall frequency response curve of the headset in some possible implementations;

[0257] Figure 32A yes Figure 3 A schematic structural diagram of the antenna of the earphone shown;

[0258] Figure 32B yes Figure 32A A schematic diagram of the structure of the antenna shown at another angle;

[0259] Figure 33A yes Figure 3 The schematic diagram of the structure of the antenna and the main circuit board is shown;

[0260] Figure 33B yes Figure 33A A schematic diagram of the structure shown at another angle;

[0261] Figure 34A yes Figure 3 Schematic diagram of the assembly structure of the main circuit board, antenna and detection circuit board;

[0262] Figure 34B yes Figure 34A A schematic diagram of the structure shown at another angle;

[0263] Figure 35 yes Figure 4 A schematic diagram of a portion of the structure of the earphone shown;

[0264] Figure 36 yes Figure 34A A schematic diagram of a portion of the structure of the first circuit board shown;

[0265] Figure 37 yes Figure 34A Schematic diagram of the structure of the first circuit board and the antenna in other embodiments;

[0266] Figure 38 yes Figure 35 The schematic diagram of the structure of the detection circuit board and related adhesive layer shown;

[0267] Figure 39 yes Figure 6 A schematic diagram of a portion of the structure of the main housing shown;

[0268] Figure 40 yes Figure 6 A schematic diagram of another part of the structure of the main shell shown;

[0269] Figure 41 yes Figure 3 A schematic structural diagram of the first contact of the earphone shown;

[0270] Figure 42 yes Figure 3 A schematic diagram of a portion of the sixth component of the earphone shown;

[0271] Figure 43 yes Figure 1A A schematic diagram of the internal structure of a portion of the earphone shown;

[0272] Figure 44 yes Figure 43 An enlarged view of the structure at position A is shown;

[0273] Figure 45 yes Figure 43 An enlarged view of the structure at position B is shown;

[0274] Figure 46 is a schematic structural diagram of an earphone assembly provided by an embodiment of the present application in some embodiments;

[0275] Figure 47 yes Figure 46 A schematic structural diagram of the earphone assembly shown in another usage state;

[0276] Figure 48A yes Figure 47 A schematic diagram of the structure of the charging box of the earphone assembly shown in another usage state;

[0277] Figure 48B yes Figure 48A The schematic diagram of the charging box shown is from another angle;

[0278] Figure 49 yes Figure 47 A schematic diagram of a partially exploded structure of the charging box shown;

[0279] Figure 50 yes Figure 48A Schematic diagram of the cross-sectional structure at CC;

[0280] Figure 51 yes Figure 48A Schematic diagram of the cross-sectional structure at DD;

[0281] Figure 52 yes Figure 46 A schematic structural diagram of the earphone assembly shown at another angle;

[0282] Figure 53 yes Figure 49 A schematic diagram of a portion of the structure of the charging box shown;

[0283] Figure 54 yes Figure 53 Schematic diagram of the assembly structure of the middle part structure 1;

[0284] Figure 55 yes Figure 53 Schematic diagram of the assembly structure of the middle part Figure 2 ;

[0285] Figure 56 yes Figure 51 A schematic diagram of a portion of the structure of the charging box shown;

[0286] Figure 57 yes Figure 49 Schematic diagram of the exploded structure of part of the charging box shown;

[0287] Figure 58 yes Figure 46 A schematic diagram of a portion of the structure of the earphone assembly shown;

[0288] Figure 59A yes Figure 46 A schematic diagram of the structure of the earphone assembly shown in another usage state;

[0289] Figure 59B yes Figure 59A A schematic diagram of a portion of the structure of the earphone assembly shown;

[0290] Figure 60A yes Figure 46 A schematic diagram of the structure of the earphone assembly shown in another usage state;

[0291] Figure 60B yes Figure 60A A schematic diagram of a portion of the structure of the earphone assembly shown;

[0292] Figure 61A yes Figure 46 A schematic diagram of the structure of the earphone assembly shown in another usage state;

[0293] Figure 61B yes Figure 61A A schematic diagram of a portion of the structure of the earphone assembly shown;

[0294] Figure 62 yes Figure 46 A schematic diagram of a portion of the circuitry of an earphone assembly in some embodiments is shown;

[0295] Figure 63 yes Figure 62 Schematic diagram of a part of the circuit of the first earphone in some other embodiments;

[0296] Figure 64 yes Figure 62 Schematic diagram of a part of the circuit of the first earphone in some other embodiments;

[0297] Figure 65 yes Figure 62 Schematic diagram of part of the circuit of the first earphone in some other embodiments. DETAILED DESCRIPTION

[0298] The technical solutions in the embodiments of the present application will be described below in conjunction with the accompanying drawings. In the description of the embodiments of the present application, unless otherwise specified, " / " represents or, for example, A / B can represent A or B; "and / or" in the text is merely a description of the association relationship between associated objects, indicating that three relationships can exist. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, in the description of the embodiments of the present application, "multiple" refers to two or more than two.

[0299] In the following, the terms "first", "second", etc. are used for descriptive purposes only and should not be understood to imply or suggest relative importance or implicitly indicate the number of technical features indicated. Therefore, features defined as "first" or "second" may explicitly or implicitly include one or more of such features.

[0300] The directional terms mentioned in the embodiments of the present application, such as "front", "back", "left", "right", "inside", "outside", "side", "top", "bottom", "up", "down", etc., are only references to the directions in the drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of the present application, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the embodiments of the present application.

[0301] In the description of the embodiments of the present application, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," "connected," and "disposed on..." should be understood in a broad sense. For example, "connected" can mean a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. "Fixed connection" means that the two devices are connected to each other and their relative positional relationship remains unchanged after connection. "Electrically connected" means that electrical signals can be conducted between them.

[0302] About the overall shape and classification of headphones:

[0303] Please refer to Figure 1A 、 Figure 1B as well as Figure 2 , Figure 1A is a rear view of the earphone 10 provided in some embodiments of the present application, Figure 1B yes Figure 1A A left side view of the earphone 10 is shown, Figure 2 yes Figure 1A Schematic diagrams of the structure of the headset 10 in some usage scenarios are shown.

[0304] The present application provides a headset 10. The headset 10 is a wireless headset, such as a TWS (True Wireless Stereo) headset. For the convenience of the following description, the headset 10 is defined as having relative directions "top" and "bottom," corresponding to the height of the headset 10; the headset 10 has relative directions "left" and "right," corresponding to the width of the headset 10; and the headset 10 has relative directions "front" and "back," corresponding to the thickness of the headset 10. In the description of some embodiments, the direction "top" corresponds to the direction "top," and the direction "bottom" corresponds to the direction "bottom."

[0305] The earphone 10 includes an ear cup 10a and an ear stem 10b. The ear stem 10b can also be called a handle, and the top of the ear stem 10b is connected to the back side of the ear cup 10a. The outer surface of the earphone 10 is a geometric surface with a smooth transition. In the direction from the end connected to the ear cup 10a to the end away from the ear cup 10a, the outer contour of the ear stem 10b first shrinks, then expands, and then shrinks again. The ear stem 10b is as round and natural as a freely falling water drop. Exemplarily, the earphone 10 may have a central plane 10c, and the central axis 10d of the ear cup 10a may be inclined relative to the central plane 10c. When the earphone 10 is used as a left earphone, the bottom end of the central axis 10d of the ear cup 10a can be deflected to the left relative to the center plane 10c, and the top end of the central axis 10d of the ear cup 10a can be deflected to the right relative to the center plane 10c. When the earphone 10 is used as a right earphone, the bottom end of the central axis 10d of the ear cup 10a can be deflected to the right relative to the center plane 10c, and the top end of the central axis 10d of the ear cup 10a can be deflected to the left relative to the center plane 10c. For example, the outer contour of the ear stem 10b can be symmetrically arranged relative to the center plane 10c.

[0306] When the earphone 10 is worn on the ear of the consumer, the front side of the earphone 10 faces the ear, and the back side of the earphone 10 faces away from the ear. The front side of the earphone 10 is mostly an invisible area, and the back side of the earphone 10 is mostly a visible area. The ear bag 10a of the earphone 10 is inserted into the concha cavity of the ear, the top of the ear stem 10b is located in the concha cavity, and the bottom of the ear stem 10b is located outside the concha cavity. Among them, the tragus, intertragic notch, and antitragus of the ear can just surround the contraction part of the ear stem 10b, so that by clamping the contraction part of the ear stem 10b, the wearing stability of the earphone 10 is improved, and the wearing comfort can also be taken into account, so as to improve the user experience.

[0307] Please refer to Figure 3 and Figure 4 , Figure 3 yes Figure 1A The partially exploded structural diagram of the earphone 10 is shown. Figure 4 yes Figure 1AThe cross-sectional structure diagram of the earphone 10 is shown along the line AA, where the line AA corresponds to the center plane 10 c of the earphone 10 .

[0308] In some embodiments, the earphone 10 includes a shell 1 and multiple components installed in the shell 1, including but not limited to a circuit component 2, an audio component 3, an audio auxiliary component 4, a detection component 5, an antenna 6, a first contact 71, a second contact 72, a battery 73 and a magnetic component 81.

[0309] Exemplarily, the circuit assembly 2 may include a main circuit board 21, a first flexible circuit board 22, and a second flexible circuit board 23. Multiple devices may be fixed on each circuit board. For example, a main control chip 211 may be arranged on the main circuit board 21, and the main control chip 211 may be a system-on-chip (SOC). The main control chip 211 may integrate multiple circuits. One end of the first flexible circuit board 22 is electrically connected to the main circuit board 21, and one end of the second flexible circuit board 23 is electrically connected to the main circuit board 21 to achieve electrical connection between the devices on each circuit board. The circuit assembly 2 is electrically connected to other functional devices, modules, etc. of the headset 10.

[0310] Exemplarily, the audio component 3 may include a speaker 31 and multiple microphones for sound playback and sound pickup. The speaker 31, also known as a "speaker," is used to convert audio electrical signals into sound signals. The microphone is used to convert sound signals into electrical signals. It is mainly used to collect sounds outside the headset 10 and convert them into electrical signals for transmission to the main control chip 211 for processing, thereby enabling the headset 10 to perform active noise reduction, voice calls, call noise reduction, ambient sound mode, voice assistant wake-up and other functions.

[0311] Among them, the multiple microphones may include a first microphone 32, a second microphone 33 and a third microphone 34. In the present application, the first microphone 32 and the second microphone 33 of the audio component 3 of the headset 10 are used in an active noise cancellation (ANC) design system. Active noise cancellation is a method of identifying unwanted sound sources as noise, and eliminating the original noise by generating an "anti-noise" signal, thereby eliminating the noise in real time. Among them, the second microphone 33 can be an FF (Feed Forward topology) microphone. The FF microphone is a reference microphone facing the outside of the user's ear, used to sense the main noise signal, and can be used as a reference signal for the forward active noise cancellation filter. The first microphone 32 can be an FB (Feed Back Topology) microphone. The FB microphone is an error microphone, used to collect signals entering the user's ear as a reference signal for the feedback active noise cancellation filter. The third microphone 34 can be a call microphone.

[0312] Exemplarily, the audio auxiliary component 4 is used to provide multiple channels to assist the audio component 3 in achieving sound playback, sound pickup, etc. The audio auxiliary component 4 may include a first component 41, a second component 42, a third component 43, a fourth component 44, a fifth component 45, and a sixth component 46. The above components are installed at different positions of the housing 1 to provide corresponding channels for multiple components of the audio component 3.

[0313] Exemplarily, the detection component 5 includes multiple sensors, which may include a proximity sensor 51, a wearing detection sensor 52, a Hall sensor (not shown in the figure), a touch sensor 54, a gravity sensor (g-sensor) (not shown in the figure), etc. Among them, the proximity sensor 51 and the wearing detection sensor 52 are used to detect the wearing of the headset 10; the Hall sensor is used to detect whether the headset 10 is in the box; the touch sensor 54 is used to detect the user's touch action, and the gravity sensor is used to detect the posture change of the headset 10. The touch sensor 54 and the gravity sensor are used to improve the human-computer interaction experience of the headset 10. Among them, the wearing detection sensor 52 and the touch sensor 54 can be capacitive sensors (Cap-sensors). Among them, the detection component 5 may include a detection circuit board 56, and the detection circuit board 56 forms the above-mentioned wearing detection sensor 52 and touch sensor 54.

[0314] Among them, in some usage scenarios, the earphones 10 can use the wearing detection function to determine whether the user is wearing / taking off the earphones 10 to automatically play / pause music. In other usage scenarios, if the user takes off the earphones 10 and does not wear them for a long time and does not put them back into the charging box, the earphones 10 will automatically sleep / shut down to save power. In other usage scenarios, in order to improve the experience of single / dual ear use of the earphones 10, when two earphones 10 are worn, both earphones 10 play music. When one earphone 10 is taken off and the other earphone 10 is worn, the earphone 10 in the non-worn state stops playing music, and the earphone 10 in the worn state continues playing, achieving seamless switching.

[0315] Among them, in some usage scenarios, the earphones 10 can detect different touch actions or operation actions of the user through the human-computer interaction function, and realize the functions of playing / pausing music, switching between previous and next songs, adjusting the volume, and intelligent voice wake-up of the earphones 10, so that the earphones 10 can be separated from the terminal (mobile phone, tablet, etc.) to which it is connected to to a certain extent when in use, making the operation more convenient and quick, which is conducive to improving the user experience.

[0316] Exemplarily, the antenna 6 is used to realize wireless communication between the headset 10 and other terminals (such as mobile phones, tablets, etc.). The battery 73 is used to power the headset 10. The first contact 71 and the second contact 72 are used to realize communication between the headset 10 and the charging box when the headset 10 is stored in the charging box, and the charging process of the headset 10 by the charging box. The magnetic member 81 is used to form a magnetic attraction between the headset 10 and the charging box when the headset 10 is placed in the box, so that the headset 10 can be stably placed in the charging box.

[0317] In other embodiments of the present application, the headset 10 may include more or fewer components than those in the above embodiment, or may combine or separate certain components, or may have different component arrangements. The components of the headset 10 may be implemented in hardware, software, or a combination of software and hardware.

[0318] See also Figure 5 , Figure 5 yes Figure 1A A schematic block diagram of part of the circuit of the earphone 10 is shown.

[0319] In some embodiments, the headset 10 may include a processor 2a, a memory 2b, an audio processing circuit 2c, a radio frequency circuit 2d, a radio frequency front end 2e, a power management circuit 2f, a charging circuit 2g, etc. The processor 2a is electrically connected to the memory 2b.

[0320] Among them, the speaker 31, the first microphone 32, the second microphone 33, and the third microphone 34 are all electrically connected to the audio processing circuit 2c, and the audio processing circuit 2c is electrically connected to the processor 2a. The audio processing circuit 2c is used to convert digital audio information into analog audio signal output, and is also used to convert analog audio input into digital audio signals. The audio processing circuit 2c can also be used to encode and decode audio signals. In some embodiments, the audio processing circuit 2c can also be provided in the processor 2a, or some functional modules of the audio processing circuit 2c can be provided in the processor 2a.

[0321] The antenna 6 is connected to the RF front end 2e, which is connected to the RF circuit 2d, which is connected to the processor 2a. The RF circuit 2d is used to modulate or demodulate the RF signal, and the RF front end 2e is used to filter and amplify the RF signal. The RF front end 2e may include one or more of a power amplifier (PA), a filter, a switch, and a low noise amplifier (LNA). The filter may be a surface acoustic wave (SAW) filter.

[0322] The first contact 71 and the second contact 72 are electrically connected to the charging circuit 2g, which is electrically connected to the processor 2a, the power management circuit 2f, and the battery 73. The charging circuit 2g is configured to receive charging input via the first contact 71 and the second contact 72. The power management circuit 2f is electrically connected to the processor 2a. The power management circuit 2f receives input from the battery 73 and / or the charging circuit 2g to power the processor 2a, the memory 2b, and other components. In other embodiments, the power management circuit 2f may be located within the processor 2a. In still other embodiments, the power management circuit 2f and the charging circuit 2g may be located within the same device.

[0323] Among them, the proximity sensor 51, the wearing detection sensor 52, the Hall sensor 53, the touch sensor 54, and the gravity sensor 55 are all electrically connected to the processor 2a.

[0324] Among them, the processor 2a, memory 2b, audio processing circuit 2c, RF circuit 2d, and power management circuit 2f can be integrated into the main control chip 211. The RF front end 2e and charging circuit 2g can be formed in other chips respectively. In some other embodiments, the above circuits can also have other implementation structures. For example, the main control chip 211 can integrate more or fewer circuits. For example, the RF circuit 2d can be independent of the main control chip 211 and implemented by a RF chip. This embodiment of the present application is not strictly limited to this.

[0325] The following describes the various components / assemblies of the headset 10 by way of example.

[0326] Regarding the housing 1 of the earphone 10:

[0327] Please refer to Figure 1A 、 Figure 1B 、 Figure 6 as well as Figure 7 , Figure 6 yes Figure 3 The exploded structural diagram of the housing 1 is shown in FIG. Figure 7 yes Figure 3 A schematic diagram of the internal structure of the housing 1 is shown.

[0328] In some embodiments, the housing 1 includes a main housing 11 and a front housing 12. The front housing 12 is fixed to the front side of the main housing 11, and the interior space 121 of the front housing 12 is connected to the interior space 111 of the main housing 11. When the earphone 10 is worn, the front housing 12 faces the user's ear. Specifically, the front housing 12 can be located in the cavum concha, contact the cavum concha, and face the ear canal of the user's ear. The portion of the structure connecting the front housing 12 to the main housing 11 forms the outer shell of the ear cup 10a of the earphone 10, and the other portion of the main housing 11 forms the outer shell of the ear stem 10b of the earphone 10.

[0329] The main shell 11 includes a first end 11a and a second end 11b. The first end 11a of the main shell 11 is close to and contacts the front shell 12, and the second end 11b of the main shell 11 is away from the front shell 12. The main shell 11 has a spine line 112, which extends from the first end 11a of the main shell 11 to the second end 11b of the main shell 11. The spine line 112 is located on the rear side of the main shell 11 and on the center plane 10c of the earphone 10. The spine line 112 is a smooth curve. Figure 1B As shown, when the earphone 10 is viewed from the left, the contour line of the rear side of the main shell 11 (i.e., the side facing away from the front shell 12) corresponds to the spine line 112. The spine line 112 can be a solid line or a non-solid line, which is not strictly limited in this embodiment of the application.

[0330] For example, in the direction from the first end 11a of the main shell 11 to the second end 11b of the main shell 11, the outer contour of the main shell 11 first shrinks and then expands. The cases where the outer contour of the main shell 11 shrinks and then expands include: a first case where the outer contour of the main shell 11 shrinks first, then expands, and then shrinks again; a second case where the outer contour of the main shell 11 shrinks first, then expands.

[0331] In the first case, the portion of the main shell 11 located at the ear cup 10a contracts as it moves from the first end 11a of the main shell 11 toward the second end 11b. The portion of the main shell 11 located at the ear stem 10b contracts, then expands, and then contracts again. The bottom of the main shell 11 can be formed with a curved or nearly curved surface to create a rounded shape. In this case, the shape of the main shell 11 allows the ear stem 10b of the earphone 10 to resemble a freely falling water drop.

[0332] In the second scenario, the portion of the main shell 11 located at the ear cup 10a contracts from the first end 11a of the main shell 11 toward the second end 11b. The portion of the main shell 11 located at the ear stem 10b contracts first and then expands. This means that the bottom of the main shell 11 can be formed by a flat or nearly flat surface. In this second scenario, the bottom of the main shell 11 may have a slightly rounded transition area connecting to the bottom end surface. The morphological changes in this transition area are minimal and can be ignored.

[0333] For example, Figure 7As shown, the interior space 111 of the main housing 11 includes a top space 111a, a middle space 111b, and a bottom space 111c, which are sequentially connected. The top space 111a of the main housing 11 is located near the first end 11a of the main housing 11, while the bottom space 111c is located near the second end 11b of the main housing 11. The top space 111a of the main housing 11 is connected to the interior space 121 of the front housing 12. From the first end 11a of the main housing 11 toward the second end 11b of the main housing 11, the interior space 111 of the main housing 11 first contracts and then expands. The cross-sectional area of ​​the top space 111a of the main housing 11 is substantially larger than that of the middle space 111b of the main housing 11, while the cross-sectional area of ​​the bottom space 111c of the main housing 11 is substantially larger than that of the middle space 111b of the main housing 11. In other words, the narrowest point of the interior space 111 of the main housing 11 is located in the middle space 111b of the main housing 11. In this embodiment, the main housing 11 is a shell structure, and the shape change of the internal space 111 of the main housing 11 is the same as or similar to the shape change of the outer contour of the main housing 11 .

[0334] It can be understood that the division positions of the top space 111a, the middle space 111b and the bottom space 111c of the main shell 11 in the drawings of the embodiments of the present application are exemplary positions, and are not strict and unique position divisions. The overall design of the earphone 10 only requires that the internal space 111 of the main shell 11 is contracted to the narrowest in its middle space 111b. The division positions of the top space 111a, the middle space 111b and the bottom space 111c of the main shell 11 can be adaptively changed according to actual conditions.

[0335] For example, as the spine line 112 extends from the first end 11a of the main housing 11 to the second end 11b of the main housing 11, it first extends rearward and then forward. The portion of the main housing 11 corresponding to the rearward extension of the spine line 112 first contracts and then expands, while the portion of the main housing 11 corresponding to the forward extension of the spine line 112 contracts. In this embodiment, the shape of the spine line 112 allows the back of the earphone 10 to slide freely, resulting in a natural and aesthetically pleasing overall appearance.

[0336] The spine line 112 may include a plurality of smoothly connected arc segments, wherein the radii of the plurality of arc segments first increase and then decrease in the extending direction of the spine line 112. The arc segment with the largest radius may be arranged corresponding to the middle space 111b of the main shell 11.

[0337] In some embodiments, such as Figure 1B 、 Figure 6 as well as Figure 7As shown, the main shell 11 includes a main shell part 113 and a cover part 114. The main shell part 113 has a first opening 1131 and a second opening 1132 spaced apart, and the first opening 1131 and the second opening 1132 are both arranged forward. That is, when the earphone 10 is in a wearing state, the first opening 1131 and the second opening 1132 are both facing the user's ear. The main shell part 113 includes a top part 113a, a middle part 113b and a bottom part 113c connected in sequence, the first opening 1131 is formed at the top 113a of the main shell part 113, and the second opening 1132 is formed at the bottom 113c of the main shell part 113. The front shell 12 is installed at the first opening 1131, and the cover part 114 is installed at the second opening 1132. The cover part 114 is located on the front side of the bottom 113c of the main shell part 113. Wherein, as Figure 7 As shown, the inner space of the top 113a of the main housing member 113 forms the top space 111a of the main housing 11, the inner space of the middle portion 113b of the main housing member 113 forms the middle space 111b of the main housing 11, and the cover member 114 and a portion of the main housing member 113 (i.e., the bottom 113c of the main housing member 113) together enclose the bottom space 111c of the main housing 11. The main housing member 113 may be an integrally formed structural member, for example, the main housing member 113 may be formed by an injection molding process.

[0338] In this embodiment, the housing 1 is composed of three main components: a front housing 12, a main housing member 113, and a cover member 114. These components are relatively few in number, simple in structure, and easy to assemble. Furthermore, the central portion 113b of the main housing member 113 is a complete structure without openings, which improves the structural strength of the main housing member 113 and, consequently, enhances the overall structural strength of the main housing 11 and the housing 1.

[0339] For example, see Figure 1A 、 Figure 6 as well as Figure 7 The main housing 11 includes an abutting end surface 113d. This abutting end surface 113d is located on the main housing member 113 and surrounds the first opening 1131. The abutting end surface 113d contacts the front housing 12. The plane on which the abutting end surface 113d lies is perpendicular to the center plane 10c of the earphone 10. The main housing member 113 has a first projection on the plane on which the abutting end surface 113d lies. The cover member 114 has a second projection on the plane on which the abutting end surface 113d lies, with the first projection covering the second projection.

[0340] The surface of the earphone 10 in the rear view is the primary appearance surface, that is, the surface exposed when viewed from the back to the front. The surface of the earphone 10 in the front view is the secondary appearance surface, that is, the surface exposed when viewed from the front to the back. When the earphone 10 is worn, the secondary appearance surface faces the user's ear and is hidden, while the primary appearance surface faces away from the user's ear and is exposed. The main housing 113 is projected from the back to the front to form a first projection, and the cover 114 is projected from the back to the front to form a second projection. Because the first projection covers the second projection, when viewed from the rear, the main housing 113 obscures the cover 114. The earphone 10 hides the parting line between the cover 114 and the main housing 113 in the secondary appearance surface, leaving the primary appearance surface intact and maintaining a good visual integrity. The parting line between the cover 114 and the main housing 113 is the line formed on the appearance surface of the earphone 10 where the cover 114 and the main housing 113 intersect. The maximum outline of the main housing 113 in the left and right directions is as follows: Figure 1B As shown by the dotted line, the parting line between the cover member 114 and the main housing member 113 is located in front of the maximum contour line.

[0341] In some embodiments, the overall height of the earphone 10 can be in the range of 35 mm to 45 mm, such as 38 mm, 39.56 mm, 41.5 mm, 43.21 mm, etc.; the overall width of the earphone 10 can be in the range of 19 mm to 26 mm, such as 21 mm, 22.83 mm, 24.5 mm, etc. The overall height of the main housing 113 can be in the range of 35 mm to 45 mm, such as 37 mm, 39.38 mm, 41.2 mm, 42.8 mm, etc. The thickness of the bottom 113 c of the main housing 113 at its thickest point can be in the range of 8 mm to 12 mm, such as 8.2 mm, 9 mm, 9.74 mm, 10.11 mm, 10.53 mm, etc.; the width of the bottom 113 c of the main housing 113 at its widest point can be in the range of 11 mm to 16 mm, such as 12 mm, 12.8 mm, 13.53 mm, 14.2 mm, etc. The thickness of the main housing member 113 at its narrowest point in the front-to-back direction can be in the range of 6mm to 8.5mm, such as 6.5mm, 7.2mm, or 7.4mm. The width of the main housing member 113 at its narrowest point in the left-to-right direction can be in the range of 5mm to 8.5mm, such as 6.47mm. The front-to-back spacing between the cover member 114 and the front housing 12 can be in the range of 5mm to 8mm, such as 5.7mm, 6mm, 6.54mm, or 7.12mm. The angle between the central axis 10d of the ear cup 10a and the center plane 10c can be in the range of 50° to 70°, such as 55°, 60°, or 67°. The angle between the boundary between the ear cup 10a and the ear stem 10b and the abutting end surface 113d of the main housing member 113 can be in the range of 7° to 10°, such as 7.6°, 8.4°, or 9.2°. In some other embodiments, one or more of the aforementioned dimensions of the earphone 10 may also be adjusted as needed.

[0342] In traditional earphones, the housing of the ear stem is usually set in a regular geometric shape, such as a cuboid or cylinder, to facilitate mold release during the shell injection molding process. However, the housing 1 of the earphone 10 of the present application adopts an irregular geometric shape. Therefore, the present application has designed a mold solution for the housing 1 that uses a rear mold oblique core pull and a rear mold oblique inner slider to meet and seal the glue to facilitate demolding, as follows:

[0343] Please refer to Figure 8A and Figure 8B , Figure 8A yes Figure 6 Schematic diagram of the demoulding process of the middle shell shown in FIG1. Figure 8B yes Figure 6 Schematic diagram of the demoulding process of the middle shell shown Figure 2 . Figure 8B The demoulding process shown is followed by Figure 8A after.

[0344] In some embodiments, the mold 13 includes a front mold slider 131, a rear mold core 132, a rear mold oblique core puller 133, a rear mold oblique inner slider 134, and a rear mold slider shovel base 135. Before demolding, the front mold slider 131 and the rear mold core 132 cooperate to clamp the main housing 113 from above. Part of the rear mold core 132 extends into the interior of the main housing 113 through the first opening 1131 of the main housing 113. The rear mold oblique inner slider 134 and the rear mold slider shovel base 135 are both inserted into the rear mold core 132 and the front mold slider 131 and extend into the interior of the main housing 113 through the second opening 1132 of the main housing 113. The rear mold oblique inner slider 134 and the rear mold slider shovel base 135 both abut the inner wall of the main housing 113. The rear mold core 132 has an orientation slot 1321, and one end of the rear mold oblique inner slider 134 is mounted in the orientation slot 1321. The rear mold oblique core 133 is inserted into the rear mold core 132 and extends into the inner side of the main case 113 through the second opening 1132 of the main case 113 , and then abuts against the rear mold oblique inner slider 134 and the inner wall of the main case 113 . During the demolding process, the front mold slider 131 is first slid left and right to disengage from the main shell 113. Then, the rear mold oblique core puller 133 is pulled, disengaging from the rear mold oblique inner slider 134 and the inner wall of the main shell 113, avoiding the undercut position of the main shell 113. After that, the rear mold slider shovel base 135 is pulled, disengaging from the main shell 113. Driven by the rear mold slider shovel base 135 and constrained by the directional groove 1321, the rear mold oblique inner slider 134 slides obliquely downward, disengaging from the inner wall of the main shell 113, avoiding the undercut position of the main shell 113. Finally, the main shell 113 is pushed upward to complete the demolding. The implementation of the demolding scheme of this embodiment helps to achieve mass production of the main shell 113.

[0345] It is understandable that the above-mentioned mold 13 structure and demoulding process are only an example. In some other embodiments, the mold 13 structure and demoulding process may also be implemented in other ways, and the embodiments of the present application do not strictly limit this.

[0346] In the present application, the housing 1 of the earphone 10 may also have other structures, which are illustrated below with examples.

[0347] Please refer to Figure 9A and Figure 9B , Figure 9A is a rear view of the housing 1 of the earphone 10 provided in this application in some other embodiments, Figure 9B yes Figure 9A The left side view of the housing 1 is shown. Figure 9A and Figure 9B The schematic housing 1 may include most of the features of the housing 1 of the previous embodiment. The following mainly describes the differences between the two, and the same parts of the two are not repeated.

[0348] In some embodiments, the housing 1 includes a front housing 12 and a main housing 11. The main housing 11 includes a main housing member 113, a cover member 114, and a back cover member 115. The main housing member 113 has a first opening 1131, a second opening 1132, and a third opening 1133 spaced apart from each other. The first opening 1131 and the second opening 1132 are both forward-facing, while the third opening 1133 is rearward-facing. That is, when the earphones 10 are being worn, the first opening 1131 and the second opening 1132 are both facing the user's ears, while the third opening faces away from the user's ears. The third opening 1133 is located between the first opening 1131 and the second opening 1132. The main case member 113 includes a top portion 113a, a middle portion 113b, and a bottom portion 113c, which are sequentially connected. A first opening 1131 is formed in the top portion 113a of the main case member 113, a second opening 1132 is formed in the bottom portion 113c of the main case member 113, and a third opening 1133 is formed in the middle portion 113b of the main case member 113. In other embodiments, the third opening 1133 may extend to the top portion 113a and / or the bottom portion 113c of the main case member 113.

[0349] The front housing 12 is mounted in the first opening 1131, the cover 114 is mounted in the second opening 1132, and the back cover 115 is mounted in the third opening 1133. The space inside the top 113a of the main housing 113 forms the top space of the main housing 11. The cover 114 and a portion of the main housing 113 (i.e., the bottom 113c of the main housing 113) together enclose the bottom space of the main housing 11. The back cover 115 and a portion of the main housing 113 (i.e., the middle portion 113b of the main housing 113) together enclose the middle space of the main housing 11.

[0350] In this embodiment, since the middle portion 113b of the main shell 113 forms an opening structure through the third opening 1133, it helps to smoothly demold the main shell 113, simplifies the demolding structure and demolding process of the main shell 113, and improves the production efficiency and yield of the main shell 113.

[0351] Furthermore, the parting line between the cover 114 and the main housing 113 is hidden on the secondary exterior surface, while the back cover 115 is located on the primary exterior surface. Although the back cover 115 somewhat disrupts the integrity of the primary exterior surface, its relatively small area allows the primary exterior surface of the earphone 10 to maintain a good visual integrity. In some embodiments, the differentiated design of the back cover 115 and the main housing 113 can be used to achieve a richer and more diverse appearance.

[0352] Please refer to Figure 10A and Figure 10B , Figure 10A is a rear view of the housing 1 of the earphone 10 provided in this application in some other embodiments, Figure 10B yes Figure 10AThe left side view of the housing 1 is shown. Figure 10A and Figure 10B The schematic housing 1 may include most of the features of the housing 1 of the previous embodiment. The following mainly describes the differences between the two, and the same parts of the two are not repeated.

[0353] In some embodiments, the housing 1 includes a front housing 12 and a main housing 11. The main housing 11 includes a main housing member 113 and a cover member 114. The main housing member 113 has a first opening 1131 and a second opening 1132 spaced apart from each other, and both the first opening 1131 and the second opening 1132 are disposed forward. The main housing member 113 includes a top portion 113a, a middle portion 113b, and a bottom portion 113c connected in sequence. The first opening 1131 is formed at the top portion 113a of the main housing member 113. The second opening 1132 extends from the bottom portion 113c of the main housing member 113, through the middle portion 113b of the main housing member 113, to the top portion 113a of the main housing member 113.

[0354] In this embodiment, since the second opening 1132 is partially arranged in the middle portion 113b of the main shell component 113, an opening structure exists in the middle portion 113b of the main shell component 113, which helps to smoothly demold the main shell component 113, simplifies the demolding structure and demolding process of the main shell component 113, and improves the production efficiency and yield of the main shell component 113.

[0355] Furthermore, the parting line between the cover member 114 and the main housing member 113 is mostly hidden within the secondary exterior surface, with a small portion exposed on the primary exterior surface. Therefore, this parting line minimally disrupts the primary exterior surface, essentially preserving the integrity of the primary exterior surface and giving the earphone 10 a better visual overall appearance. Furthermore, the portion of the parting line between the cover member 114 and the main housing member 113 that disrupts the primary exterior surface is primarily located on the underside of the top portion 113a of the main housing member 113. When the earphone 10 is worn, the underside of the top portion 113a of the main housing member 113 rests against the user's ear and is not exposed. Therefore, the visual overall appearance of the earphone 10 when worn is not disrupted by the parting line between the cover member 114 and the main housing member 113, resulting in a better user experience.

[0356] See also Figure 11A , Figure 11A Schematic diagram of the structure of the housing 1 of the earphone 10 provided in this application in other embodiments. Figure 11A The schematic housing 1 may include most of the features of the housing 1 of the previous embodiment. The following mainly describes the differences between the two, and the same parts of the two are not repeated.

[0357] In some embodiments, the housing 1 includes a front housing 12 and a main housing 11. The main housing 11 includes a main housing member 113 and a back cover member 115. The main housing member 113 has a first opening 1131 and a third opening 1133 spaced apart from each other, with the first opening 1131 facing forward and the third opening 1133 facing rearward. The main housing member 113 includes a top portion 113a, a middle portion 113b, and a bottom portion 113c, which are sequentially connected. The first opening 1131 is formed in the top portion 113a of the main housing member 113, and the third opening 1133 is continuously formed in the top, middle, and bottom portions 113c of the main housing member 113. The front housing 12 is mounted in the first opening 1131, and the back cover member 115 is mounted in the third opening 1133.

[0358] In this embodiment, since the middle portion 113b of the main shell 113 forms an opening structure through the third opening 1133, it helps to smoothly demold the main shell 113, simplifies the demolding structure and demolding process of the main shell 113, and improves the production efficiency and yield of the main shell 113.

[0359] The parting line between the main shell 113 and the back cover 115 may be partially hidden in the secondary appearance surface and partially located on the primary appearance surface, so as to reduce damage to the integrity of the primary appearance surface.

[0360] See also Figure 11B , Figure 11B Schematic diagram of the structure of the housing 1 of the earphone 10 provided in this application in other embodiments. Figure 11B The schematic housing 1 and Figure 11A The difference of the illustrated shell 1 is that the opening area of ​​the third opening 1133 of the main shell 113 is smaller, the area of ​​the back cover 115 is smaller, and the parting line between the main shell 113 and the back cover 115 can be partially located at the maximum contour line.

[0361] See also Figure 11C , Figure 11C Schematic diagram of the structure of the housing 1 of the earphone 10 provided in this application in other embodiments. Figure 11C The schematic housing 1 and Figure 11A The difference of the illustrated housing 1 is that the top of the back cover 115 extends to connect to the front housing 12, the area of ​​the back cover 115 is larger, and the main housing 113 and the back cover 115 are a front-to-back stacked structure.

[0362] See also Figure 11D , Figure 11D Schematic diagram of the structure of the housing 1 of the earphone 10 provided in this application in other embodiments. Figure 11D The schematic housing 1 may include most of the features of the housing 1 of the previous embodiment. The following mainly describes the differences between the two, and the same parts of the two are not repeated.

[0363] In some embodiments, the housing 1 includes a front housing 12 and a main housing 11. The main housing 11 includes a main housing member 113 and a bottom cover member 116. The main housing member 113 has a first opening 1131 and a fourth opening 1134 spaced apart from each other. The first opening 1131 faces forward, and the fourth opening 1134 faces downward. The front housing 12 is mounted in the first opening 1131, and the bottom cover member 116 is mounted in the fourth opening 1134. The back cover member 115 and the bottom cover member 116 are stacked one above the other. The fourth opening 1134 is located at the bottom of the main housing member 113 where the cross-sectional area is the largest.

[0364] It is understandable that the above description of the structure of the shell 1 is only an exemplary description. In some other embodiments, the shell 1 may also have other structures, and this application does not strictly limit this.

[0365] Regarding the speaker 31, main circuit board 21 and battery 73 of the headset 10:

[0366] See also Figure 12A , Figure 12A It is a partial structural diagram of a traditional earphone 40.

[0367] In a conventional headset 40 with an ear stem, the speaker 401 and the main board 402 are located in the ear cup, and the battery 403 is located in the ear stem. Due to space limitations in the ear cup, the main board 402 is generally placed close to the speaker 401 and roughly parallel to the speaker 401. After vector summation, the onboard current on the main board 402 can be equivalent to a powered coil. According to Ampere's law, a powered coil generates a magnetic field when energized. Similarly, the inductance of the main board 402 also generates a magnetic field when energized. When the main board 402 is placed close to the speaker 401, according to Faraday's law, the magnetic flux lines of the magnetic field generated by the onboard current and / or inductance on the main board 402 will pass through the inside of the voice coil of the speaker 401, causing the magnetic flux in the voice coil to change, thereby generating an electric potential, causing the speaker 401 to generate current sound.

[0368] See also Figure 12B , Figure 12B It is a partial structural diagram of another traditional earphone 50.

[0369] In the traditional bean-shaped earphones 50, the speaker 501 and battery 503 are located in the ear cup, and the main board 502 is located behind the battery 503. Due to the limitation of the ear cup space, the battery 503 is generally placed close to the speaker 501 and roughly parallel to the speaker 501. For the battery 503, such as a button battery, since the electrodes of the battery 503 are wound and the lengths of the positive and negative poles of the battery 503 are different, the positive and negative magnetic fields of the battery 503 are not completely offset when the battery 503 outputs electricity. The battery 503 will generate an induced magnetic field, and the direction of the induced magnetic field is parallel to the central axis of the battery 503. When the battery 503 is placed close to the speaker 501, according to Faraday's law, the magnetic flux lines of the magnetic field generated by the battery 503 will pass through the inside of the voice coil of the speaker 501, causing the magnetic flux in the voice coil to change, thereby generating an electric potential, causing the speaker 501 to generate current sound.

[0370] Therefore, in traditional headphones, the speaker coil is easily disturbed by the magnetic field of the motherboard or battery, generating induced current, which in turn generates current noise, resulting in poor sound quality of the headphones.

[0371] See also Figure 13 , Figure 13 yes Figure 1A A schematic diagram of a portion of the structure of the earphone 10 is shown.

[0372] In some embodiments, the main circuit board 21 is located between the speaker 31 and the battery 73. At this time, the speaker 31 and the battery 73 are respectively placed at the two ends of the long side of the main circuit board 21, and the speaker 31, the main circuit board 21 and the battery 73 are roughly shaped like a "dumbbell". Among them, the main circuit board 21 is tilted relative to the speaker 31, that is, the fabric plane 212 of the main circuit board 21 is not parallel to the diaphragm plane 311 of the speaker 31. The fabric plane 212 of the main circuit board 21 refers to the board surface of the main circuit board 21 used for arranging components. The diaphragm plane 311 of the speaker 31 refers to the plane where the diaphragm of the speaker 31 is located when it is in a balanced position.

[0373] In this embodiment, because the battery 73 and speaker 31 are located at opposite ends of the long side of the main circuit board 21 and the distance between the battery 73 and the speaker 31 is great, the induced magnetic field generated by the battery 73 has essentially no effect on the voice coil of the speaker 31, thereby eliminating the risk of current noise caused by the battery 73. Furthermore, the fabric plane 212 of the main circuit board 21 is not parallel to the diaphragm plane 311 of the speaker 31, which reduces the effect of the induced magnetic field generated by the inductance or current loop on the main circuit board 21 on the speaker 31, thereby reducing the risk of current noise caused by the induced magnetic field of the main circuit board 21. Therefore, by optimizing the positional relationship between the speaker 31, the main circuit board 21, and the battery 73, this embodiment eliminates or weakens the adverse effects of the induced magnetic fields of the main circuit board 21 and battery 73 on the speaker 31, reduces the risk of current noise, and thus ensures the sound quality of the speaker 31, resulting in the earphone 10 having better sound quality.

[0374] Illustratively, the angle α between the fabric plane 212 of the main circuit board 21 and the diaphragm plane 311 of the speaker 31 is in the range of 10° to 60°, such as 20.2°, 28.5°, 30°, 35.21°, 45°, 48.5°, 50°, 55°, etc. In this case, the larger angle between the fabric plane 212 of the main circuit board 21 and the diaphragm plane 311 of the speaker 31 can significantly reduce the impact of the induced magnetic field generated by the inductance or current loop on the main circuit board 21 on the speaker 31, thereby significantly reducing the risk of current noise caused by the induced magnetic field of the main circuit board 21. In addition, controlling the range of the angle between the fabric plane 212 of the main circuit board 21 and the diaphragm plane 311 of the speaker 31 is also beneficial to reducing the difficulty of arranging the speaker 31, the main circuit board 21 and the battery 73 in the shell 1 of the earphone 10, and reducing the limitations on the appearance design of the shell 1 of the earphone 10 due to the position requirements of the speaker 31, the main circuit board 21 and the battery 73, so that the shape design of the shell 1 of the earphone 10 is more flexible.

[0375] Among them, the angle α between the fabric plane 212 of the main circuit board 21 and the diaphragm plane 311 of the speaker 31 can be in the range of 20° to 50°, so as to further reduce the risk of current sound generated by the induced magnetic field of the main circuit board 21 on the speaker 31, and at the same time can better match the installation space of the shell 1 of the earphone 10 and reduce the difficulty of installation.

[0376] For example, the battery 73 is tilted relative to the main circuit board 21. The central axis 731 of the battery 73 is not perpendicular to the surface 212 of the main circuit board 21. In this configuration, the induced magnetic field generated by the battery 73 has minimal impact on magnetic field-sensitive components (such as inductors) on the main circuit board 21, providing a better operating environment for these components.

[0377] Exemplarily, the angle between the central axis 731 of the battery 73 and the fabric plane 212 of the main circuit board 21 can be in the range of 30° to 80°, for example, 32°, 35.21°, 45°, 48.5°, 50°, 55°, 57.5°, 63.4°, 69.5°, etc.

[0378] For example, the end surface 732 of the battery 73 may be parallel to the diaphragm plane 311 of the speaker 31. The end surface 732 of the battery 73 is perpendicular to the central axis 731 of the battery 73. At this time, the central axis 731 of the battery 73 is perpendicular to the diaphragm plane 311 of the speaker 31.

[0379] In some embodiments, the main circuit board 21 may be in the form of an elongated plate to provide a larger surface area for the layout 212. In this case, the distance between the speaker 31 and the battery 73 is also larger, which helps to reduce the risk of current noise in the speaker 31.

[0380] Exemplarily, speaker 31 is a dynamic coil speaker. In this embodiment, speaker 31 produces sound by driving the diaphragm to vibrate due to the vibration of the voice coil in a permanent magnetic field. In other embodiments, speaker 31 may also employ other types of speakers with voice coil structures, such as a dynamic iron speaker or a dynamic iron speaker, and this embodiment of the present application is not strictly limited to this.

[0381] Exemplarily, battery 73 is a button cell battery. A button cell battery is a cylindrical battery whose diameter is greater than its height. In other embodiments, battery 73 may also be a battery of other types in which electrodes are repeatedly bent, stacked, or wound, and this embodiment of the present application is not strictly limited to this.

[0382] Illustratively, the distance between the center point 312 of the bottom surface of the speaker 31 and the center point 733 of the battery 73 in the first direction is in the range of 12 mm to 20 mm, such as 13.2 mm, 14 mm, 16.2 mm, or 18.8 mm; and the distance between the center point 312 of the bottom surface of the speaker 31 and the center point 733 of the battery 73 in the second direction is in the range of 6 mm to 15 mm, such as 8.4 mm, 9.2 mm, 10.5 mm, 12.3 mm, or 13.8 mm. The center point 733 of the battery 73 is located on the central axis 731 of the battery 73. The first direction is parallel to the diaphragm plane 311 of the speaker 31, and the second direction is perpendicular to the first direction. The first direction may be parallel to the height direction of the earphone 10, and the second direction may be parallel to the thickness direction of the earphone 10.

[0383] For example, the distance between the center point 312 of the bottom surface of the speaker 31 and the center point 733 of the battery 73 is in the range of 10 mm to 30 mm, such as 15 mm, 18.2 mm, 19.2 mm, 22.2 mm, 26.8 mm, etc. The above-mentioned positional relationship between the speaker 31 and the battery 73 helps to balance the miniaturization requirements of the earphone 10 and the low current sound requirements.

[0384] In the embodiment of the present application, the earphone 10 can reasonably arrange the speaker 31, the main circuit board 21, and the battery 73 based on the relative positions of the speaker 31, the main circuit board 21, and the battery 73, the shape of the housing 1, and the shape of the internal space 11 of the housing 1. As follows:

[0385] See also Figure 14 , Figure 14 yes Figure 4 A schematic diagram of part of the structure of the earphone 10 is shown.

[0386] In some embodiments, the speaker 31, main circuit board 21, and battery 73 are all installed within the housing 1. For example, the speaker 31 can be installed in the interior space 121 of the front housing 12 and / or the top space 111a of the main housing 11; the battery 73 can be installed in the bottom space 111c of the main housing 11; and the main circuit board 21 is installed in the middle space 111b of the main housing 11, with both ends of the main circuit board 21 extending into the top space 111a and the bottom space 111c of the main housing 11, respectively.

[0387] In this embodiment, the speaker 31 and the battery 73 are relatively large and are roughly flat cylindrical, while the main circuit board 21 is a long and narrow plate-like structure. At the same time, the internal space 121 of the front shell 12, the top space 111a of the main shell 11, and the bottom space 111c of the main shell 11 are relatively large, while the middle space 111b of the main shell 11 is relatively small. Therefore, the arrangement of the speaker 31, the main circuit board 21 and the battery 73 of this embodiment can not only reduce the risk of the speaker 31 generating current sound, but also make full use of the internal space of the shell 1, thereby improving the space utilization rate of the shell 1 and facilitating the miniaturization of the earphone 10.

[0388] For example, the angle between the fabric plane 212 of the main circuit board 21 and the diaphragm plane 311 of the speaker 31 is within a range of 20° to 50°. In this case, the relative positions of the speaker 31 and the main circuit board 21 perfectly match the relative positions of the top space 111a and the middle space 111b of the main housing 11, making installation easy and simple.

[0389] It is understandable that in some other embodiments, the earphones 10 can also be designed or matched with shells of other shapes while satisfying the relative position relationship of the speaker 31, the main circuit board 21 and the battery 73 to obtain a more diverse appearance. The embodiments of the present application do not strictly limit this.

[0390] Regarding the circuit component 2 of the earphone 10:

[0391] Please refer to Figure 3 and Figure 15 , Figure 15 yes Figure 1A A schematic diagram of a portion of the structure of the earphone 10 is shown.

[0392] In some embodiments, the main circuit board 21 includes a first end 21a and a second end 21b opposite each other. The first end 21a of the main circuit board 21 is adjacent to the speaker 31, and the second end 21b of the main circuit board 21 is adjacent to the battery 73. The first flexible circuit board 22 and the speaker 31 are located on the same side of the main circuit board 21, and the first flexible circuit board 22 electrically connects the speaker 31 to the first end 21a of the main circuit board 21. The second flexible circuit board 23 and the battery 73 are located on the same side of the main circuit board 21, and the second flexible circuit board 23 electrically connects the battery 73 to the second end 21b of the main circuit board 21.

[0393] In this embodiment, the main circuit board 21 is a rigid printed circuit board (PCB) with sufficient structural strength to accommodate a large number of components on the surface of the assembly. This also allows for double-sided assembly, improving component integration. The first and second flexible circuit boards 22, 23 are bendable and can be flexibly arranged based on the internal shape of the earphone 10 and the structure of other components. This allows the circuitry of the circuit assembly 2 to smoothly extend outward from the main circuit board 21 and establish electrical connections with other components of the earphone 10 (e.g., the speaker 31 and battery 73).

[0394] The first flexible circuit board 22 can be wrapped around the back of the speaker 31 to the front of the speaker 31. Multiple portions of the first flexible circuit board 22 at different locations can be connected to different components, thereby improving the device integration of the earphone 10. The second flexible circuit board 23 partially surrounds the battery 73. Multiple portions of the second flexible circuit board 23 at different locations can be connected to different components, thereby improving the device integration of the earphone 10.

[0395] For example, the main circuit board 21 is fixedly connected to the first flexible circuit board 22 via a BOF (Board on FPC) process, and the main circuit board 21 is fixedly connected to the second flexible circuit board 23 via a BOF process. The BOF process refers to the process of directly attaching the main circuit board 21 to an FPC. In this embodiment, the electrical connections between the main circuit board 21 and the first and second flexible circuit boards 22, 23 utilize a double-sided BOF process, effectively saving space for the main circuit board 21 and the internal stacking space of the earphones 10, thereby reducing costs.

[0396] In some other embodiments, the electrical connection between the first flexible circuit board 22, the second flexible circuit board 23 and the main circuit board 21 can also be implemented in other ways, for example, the electrical connection can be achieved through a board-to-board (BTB) connector, a zero insertion force (Zero Insertion Force, ZIF) connector, or the electrical connection can be achieved through a soft-hard combination board solution.

[0397] like Figure 15 As shown, the two opposing surfaces of the main circuit board 21 are both fabric planes 212. The main circuit board 21 is double-sided, fully utilizing the board space and improving the internal space utilization of the headset 10. In this embodiment, the main circuit board 21 is a single-board structure. In other embodiments, the main circuit board 21 may also have a multi-board structure, such as a sandwich structure (i.e., a circuit board-device-circuit board structure), which is not strictly limited in this embodiment of the present application.

[0398] For example, in addition to the main control chip 211, other components of the earphone 10, such as a gravity sensor, a Hall sensor, a radio frequency front end, etc., can also be arranged on the main circuit board 21. This application does not strictly limit the specific components arranged on the main circuit board 21.

[0399] See also Figure 16 , Figure 16 yes Figure 15 The structure diagram of the first flexible circuit board 22 and some components is shown.

[0400] In some embodiments, the first flexible circuit board 22 includes an interface portion 221 and multiple connecting portions. The multiple connecting portions can have various arrangements and connection structures. The multiple connecting portions are all electrically connected to the interface portion 221, which is used to electrically connect to the main circuit board 21. The multiple connecting portions can include a first portion 222, a second portion 223, a third portion 224, and a fourth portion 225. For example, the second microphone 33 is fixed to and electrically connected to the first portion 222, which can also be fixed to and electrically connected to a mating component of the second microphone 33; the proximity sensor 51 is electrically connected to the second portion 223, which can also be fixed to and electrically connected to a mating component of the proximity sensor 51; the first microphone 32 is fixed to and electrically connected to the third portion 224, which can also be fixed to and electrically connected to a mating component of the first microphone 32; and the fourth portion 225 is used to electrically connect to the speaker 31. Part(s) of the first flexible circuit board 22 can also be used to secure it to other components, ensuring a stable and reliable installation of the first flexible circuit board 22 in the headset 10. Part(s) of the first flexible circuit board 22 may also be used to arrange other circuit components. Part(s) of the first flexible circuit board 22 used to fix components may be provided with a reinforcing plate to increase support strength and improve reliability.

[0401] See also Figure 17 , Figure 17 yes Figure 15 The schematic diagram of the structure of the second flexible circuit board 23 and some components is shown.

[0402] In some embodiments, the second flexible circuit board 23 includes an interface portion 231 and multiple connecting portions. The multiple connecting portions can have various arrangements and connection structures. The multiple connecting portions are all electrically connected to the interface portion 231, which is used to electrically connect to the main circuit board 21. The multiple connecting portions may include a first portion 232, a second portion 233, a third portion 234, and a fourth portion 235. For example, the first portion 232 is used to electrically connect to the battery 73 and may also be secured with a charging circuit 2g and its supporting components. The third microphone 34 is electrically connected to the second portion 233, which may also be secured to and electrically connected to the supporting components of the third microphone 34. The third portion 234 and the fourth portion 235 may be used to connect to the first contact 71 and the second contact 72, respectively, as described later. Part(s) of the second flexible circuit board 23 may also be used to secure the second flexible circuit board 23 to other components, ensuring a stable and reliable installation of the second flexible circuit board 23 in the headset 10. Part(s) of the second flexible circuit board 23 may also be used to accommodate other circuit components. The portion of the second flexible circuit board 23 used for fixing components may be provided with a reinforcement plate to increase support strength and improve reliability.

[0403] About the cavity division of earphone 10:

[0404] Please refer to the Figure 3 and Figure 4 The magnetic component 81 of the earphone 10 is located below the fifth component 45 of the audio auxiliary component 4. The fifth component 45 and the magnetic component 81 together form a partition component 8. The partition component 8 is installed in the top space 111a of the main housing 11 and is located between the speaker 31 and the main circuit board 21. The internal space 14 of the housing 1 includes a front cavity 14a, a rear cavity 14b, and a mainboard cavity 14c. The front cavity 14a is located between the front housing 12 and the speaker 31, the rear cavity 14b is located between the speaker 31 and the partition component 8, and the mainboard cavity 14c is located on the side of the partition component 8 facing away from the speaker 31.

[0405] Among them, the main circuit board 21, the second flexible circuit board 23, the antenna 6, the battery 73, etc. can be located in the main board cavity 14c; the first flexible circuit board 22 can extend from the main board cavity 14c to the rear cavity 14b and the front cavity 14a; some components in the audio auxiliary component 4 are located in the main board cavity 14c, and some components are located in the front cavity 14a.

[0406] Exemplarily, the periphery of the speaker 31 is sealed to the inner wall of the front housing 12. In this case, the front cavity 14a and the rear cavity 14b are separated and disconnected. The front housing 12 is sealed to the main housing 11, the fifth component 45 is sealed to the magnetic element 81, and the periphery of the partition component 8 is sealed to the inner wall of the main housing 11. The mainboard cavity 14c can be designed as a sealed cavity.

[0407] Regarding the front shell 12 of the earphone 10, the first component 41 and the proximity sensor 51 of the audio auxiliary component 4, the second component 42 and the first microphone 32 of the audio auxiliary component 4:

[0408] Please refer to Figure 1A and Figure 6 As shown, the front shell 12 has a first connecting hole 122 and a second connecting hole 123 that are spaced apart. The front shell 12 is generally in the shape of a cover, and the front shell 12 may include a front shell portion and a peripheral shell portion, the front shell portion is arranged forward, and the peripheral shell portion is connected to the front shell portion and arranged around the front shell portion. The first connecting hole 122 can be provided in the front shell portion of the front shell 12, and the second connecting hole 123 can be provided in the peripheral shell portion of the front shell 12. The second connecting hole 123 can also be called a sound outlet. The front shell 12 can have a center plane 124, and the center plane 124 of the front shell 12 corresponds to the central axis 10d of the ear bag 10a of the earphone 10. The outer contour of the front shell 12 can be symmetrically arranged relative to the center plane 124 of the front shell 12, and the first connecting hole 122 and the second connecting hole 123 can intersect with the center plane 124 of the front shell 12.

[0409] Please refer to Figure 4 and Figure 18 , Figure 18 yes Figure 1A The schematic diagram of the partial structure of the earphone 10 shown is from another angle.

[0410] In some embodiments, the first component 41 and the second component 42 of the audio auxiliary component 4 are both installed in the internal space 121 of the front shell 12, and can be located in the front cavity 14a of the earphone 10. The first component 41 is arranged corresponding to the first connecting hole 122 and covers the first connecting hole 122, and the second component 42 is arranged corresponding to the second connecting hole 123 and covers the second connecting hole 123.

[0411] Please refer to Figure 19 and Figure 20 , Figure 19 yes Figure 3 The exploded structural diagram of the first component 41 is shown. Figure 20 yes Figure 18 The schematic diagram of the partial cross-section structure of the earphone 10 at BB is shown. Figure 20 Relative perspective Figure 18 The perspective shown is rotated.

[0412] In some embodiments, the first component 41 includes a first base 411, a first exterior mesh 412, a first grounding member 413, a first mesh 414, a fixing plate 415, and multiple adhesive layers. The first base 411 is provided with a front leakage hole 4111 and a light-transmitting area 4112. The front leakage hole 4111 is a through-hole structure that allows sound to pass through. The light-transmitting area 4112 allows light to pass through. The light-transmitting area 4112 is spaced apart from the front leakage hole 4111. The light-transmitting area 4112 can be located on one side of the front leakage hole 4111 or arranged around the front leakage hole 4111, and this is not strictly limited here.

[0413] Exemplarily, the first base body 411 may include a main body 4113 and a flange 4114, and the flange 4114 is circumferentially connected to the periphery of the main body 4113. The main body 4113 may protrude forward relative to the flange 4114, and a plurality of grooves are formed on the rear side of the main body 4113 to accommodate other components. The front leakage hole 4111 and the light-transmitting area 4112 may be formed in the main body 4113. Among them, the first base body 411 may be an integrally formed structural member, and the first base body 411 is a light-transmitting structural member so that the corresponding structure of the light-transmitting area 4112 allows light to pass through. The first base body 411 may have a black or nearly black appearance, but allows light to pass through. For example, the first base body 411 may include a transparent substrate and a black film layer, the black film layer is fixed to the transparent substrate, and the black film layer is hollowed out or has a thin thickness corresponding to the position of the light-transmitting area 4112. In other embodiments, the first base body 411 may also include a first portion and a second portion, wherein the first portion is a light-transmitting structural member to form the light-transmitting region 4112, and the second portion is a non-light-transmitting structural member, with the first portion being embedded in the through hole of the second portion. It is understood that the first base body 411 may also have other implementation structures, and this embodiment of the present application is not strictly limited thereto.

[0414] The first base 411 can be fixed to the front shell 12 via an adhesive layer 4161. When the first base 411 is installed on the front shell 12, the main body 4113 of the first base 411 can be embedded in the first connecting hole 122 of the front shell 12, and the flange 4114 is connected to the inner wall of the front shell 12 via the adhesive layer 4161. The adhesive layer 4161 can be a continuous rubber ring to achieve a seal between the first base 411 and the front shell 12 when connecting them. The adhesive layer 4161 can be made of double-sided tape, glue, or other adhesive materials. The main body 4113 of the first base 411 forms part of the appearance of the earphone 10.

[0415] Illustratively, the first exterior mesh 412 may include a main body 4121 and a flange 4122, the flange 4122 circumferentially connected to the periphery of the main body 4121. The first exterior mesh 412 is secured to the rear side of the first base 411 and covers the front vent 4111. The main body 4121 of the first exterior mesh 412 is embedded in the front vent 4111, and the flange 4122 of the first exterior mesh 412 is secured to the inner wall of the first base 411. The first exterior mesh 412 forms part of the exterior appearance of the earphone 10. The first exterior mesh 412 may be a metal mesh to enhance the stylishness and mechanical reliability of the earphone 10 and reduce the risk of external damage to components located behind the first exterior mesh 412, for example, by preventing penetration by sharp external objects, thereby increasing the lifespan of the earphone 10. The first exterior mesh 412 may be an integrally formed structural component, for example, stamped from a metal mesh. In other embodiments, the first exterior mesh 412 may also be made of plastic or other materials.

[0416] Exemplarily, the first grounding member 413 includes a fixing portion 4131 and a connecting portion 4132, and one end of the connecting portion 4132 is connected to the fixing portion 4131. The fixing portion 4131 can be ring-shaped. The first grounding member 413 is fixed to the side of the first appearance net 412 facing away from the first base body 411. The fixing portion 4131 of the first grounding member 413 can be fixedly connected to the first appearance net 412 in a circumferential manner, for example, fixedly connected to the flange of the first appearance net 412. The fixing portion 4131 of the first grounding member 413 can also be partially located on the inner side of the main body of the first appearance net 412. At this time, the first grounding member 413 is arranged around the front leakage hole 4111. The first grounding member 413 is made of a conductive material, such as a metal material. The first grounding member 413 can be an integrally formed structural member, for example, the first grounding member 413 can be stamped by a metal sheet. Among them, the first grounding member 413 is grounded to prevent electric shock problems from occurring in the first component 41.

[0417] Illustratively, the first mesh 414 is secured to the side of the first grounding member 413 facing away from the first exterior mesh 412 via an adhesive layer 4162. The first mesh 414 is used to prevent external dust from entering the earphones 10 and adversely affecting the sound quality of the earphones 10. The first mesh 414 is breathable. In this embodiment of the present application, the mesh can have a mesh structure and can be made of materials such as nylon and metal, although this embodiment is not strictly limited to this.

[0418] In this embodiment, air can pass through the first exterior net 412, the first grounding piece 413, the first mesh 414 and multiple adhesive layers, so that the front cavity 14a of the earphone 10 is connected to the outside of the earphone 10 to balance the air pressure in the front cavity 14a of the earphone 10 and the outside of the earphone 10. The first component 41 provides a front leakage channel for the speaker 31 of the earphone 10.

[0419] Exemplarily, the second portion 223 of the first flexible circuit board 22 is secured to the rear side of the first base 411 via an adhesive layer 4163, and the proximity sensor 51 is positioned corresponding to the light-transmitting area 4112 of the first base 411. The proximity sensor 51 transmits and receives light signals via the light-transmitting area 4112 to detect whether the headset 10 is being worn. A fixing plate 415 can be secured to the side of the second portion 223 of the first flexible circuit board 22 facing away from the proximity sensor 51 via an adhesive layer 4164. The fixing plate 415 serves to increase the structural strength of the second portion 223 of the first flexible circuit board 22. The fixing plate 415 can also be fixedly connected to the first base 411, thereby securing the second portion 223 of the first flexible circuit board 22 to the first base 411 and improving the assembly stability of the first assembly 41.

[0420] The connecting portion 4132 of the first grounding member 413 can be fixedly and electrically connected to the second portion 223 of the first flexible circuit board 22 to achieve grounding. For example, the connecting portion 4132 of the first grounding member 413 can be soldered to the second portion 223 of the first flexible circuit board 22. In other embodiments, the first component 41 may not include the first grounding member 413, and the first exterior mesh 412 may be made of a conductive material and electrically connected to the first flexible circuit board 22 to achieve grounding.

[0421] Please refer to Figures 21 to 23 , Figure 21 yes Figure 3 The exploded structural diagram of the second component 42 is shown. Figure 22 yes Figure 21 The second seat of the second assembly 42 is shown in another structural diagram at another angle. Figure 23 yes Figure 18 The schematic diagram of another partial cross-sectional structure of the earphone 10 at BB is shown. Figure 23 Relative perspective Figure 18 The perspective shown is rotated.

[0422] In some embodiments, the second component 42 includes a second base 421 , a second mesh 422 , a second exterior mesh 423 , a second grounding member 424 , a third mesh 425 , and a plurality of adhesive layers.

[0423] Exemplarily, the second base 421 has a first surface 4211 and a second surface 4212. The first surface 4211 is located on one side of the second base 421, and the second surface 4212 is connected to the periphery of the first surface 4211 and is inclined relative to the first surface 4211. The second base 421 is provided with a first hole 4213, a sound pickup channel 4214, and a second hole 4215. The first hole 4213 extends from the first surface 4211 to the other side of the second base 421. The number of first holes 4213 can be one or more. One end of the sound pickup channel 4214 is open on the first surface 4211, and the other end extends to the other side surface of the second base 421. The sound pickup channel 4214 is separated from the first hole 4213. The sound pickup channel 4214 can be a curved channel. The second hole 4215 passes through the first surface 4211 or the second surface 4212 to the other side of the second base 421 . The second hole 4215 is separated from the sound pickup channel 4214 and the first hole 4213 .

[0424] The second base 421 is fixed to the inner side of the front shell 12 and is located in the front cavity 14 a . The first surface 4211 of the second base 421 faces the second communication hole 123 , and the second surface 4212 faces the inner wall of the front shell 12 .

[0425] Illustratively, the second mesh 422 is secured to the first surface 4211 of the second base 421 via an adhesive layer 4261. The second mesh 422 is used to prevent external dust from entering the earphone 10 and adversely affecting the sound quality of the earphone 10. The second mesh 422 covers the first hole 4213 of the second base 421 and the opening of the sound pickup channel 4214 on the first surface 4211. In some embodiments, the second mesh 422 can cover the first surface 4211 of the second base 421, and the shape of the adhesive layer 4261 can be adapted to the shape of the first surface 4211.

[0426] Exemplarily, the second grounding member 424 includes a fixing portion 4241 and a connecting portion 4242, and one end of the connecting portion 4242 is connected to the fixing portion 4241. The fixing portion 4241 can be ring-shaped. The second grounding member 424 is fixed to the side of the second mesh 422 facing away from the second base 421. The fixing portion 4241 of the second grounding member 424 can be fixedly connected to the second mesh 422 in a circumferential manner, for example, fixedly connected to the periphery of the second mesh 422 through an adhesive layer 4262. The connecting portion 4242 of the second grounding member 424 can extend to the other side of the second base 421 through the second hole 4215 of the second base 421. The second grounding member 424 is made of a conductive material, such as a metal material. The second grounding member 424 can be an integrally formed structural member, for example, the second grounding member 424 can be stamped and formed by a metal sheet. The second grounding member 424 is grounded to prevent electric shock problems in the second component 42.

[0427] Illustratively, the second exterior mesh 423 includes a central portion 4231 and a peripheral portion 4232, which is circumferentially connected to the periphery of the central portion 4231. The central portion 4231 can be raised relative to the peripheral portion 4232, forming a bulged structure; alternatively, the central portion 4231 can be flat, with the second exterior mesh 423 forming a planar mesh structure. The peripheral portion 4232 of the second exterior mesh 423 can be secured to the side of the second grounding member 424 facing away from the second mesh 422 via an adhesive layer 4263, while the central portion 4231 of the second exterior mesh 423 can be raised away from the second base 421.

[0428] The second exterior mesh 423 can be a metal mesh to enhance the fashion sense and mechanical reliability of the earphones 10 and reduce the risk of external damage to components located behind the second exterior mesh 423. For example, it can prevent external sharp objects from piercing the earphones 10, thereby increasing the service life of the earphones 10. The second exterior mesh 423 can be an integrally formed structural component, for example, it can be stamped from a metal mesh. In other embodiments, the second exterior mesh 423 can also be made of plastic or other materials.

[0429] Illustratively, the second exterior mesh 423, second grounding member 424, and second mesh cloth 422 are all located between the second connecting hole 123 of the front housing 12 and the second base 421. The perimeter 4232 of the second exterior mesh 423 is connected to the inner wall of the front housing 12 via an adhesive layer 4264. Both the second exterior mesh 423 and the second mesh cloth 422 cover the second connecting hole 123. When the speaker 31 is operating, it pushes the air in the front cavity 14a to vibrate, generating sound. This sound then passes through the first hole 4213 of the second base 421, the second mesh cloth 422, the second exterior mesh 423, and the second connecting hole 123 of the front housing 12, propagating to the exterior of the earphone 10, thereby producing sound. The second component 42 forms the sound output channel for the speaker 31.

[0430] The opening area of ​​the first hole 4213 of the second base 421 must meet the sound output requirements of the speaker 31. When there are multiple first holes 4213, the multiple first holes 4213 are spaced apart from each other, and the area of ​​each first hole 4213 is relatively small. The total area of ​​the multiple first holes 4213 meets the sound output requirements. In this case, the structural strength of the second base 421 is relatively high.

[0431] For example, the third mesh 425 can be secured to the side of the second base 421 facing away from the first surface 4211 via an adhesive layer 4265, covering the opening of the sound pickup channel 4214. The third portion 224 of the first flexible circuit board 22 can be secured to the side of the third mesh 425 facing away from the second base 421 via an adhesive layer 4266. The third portion 224 of the first flexible circuit board 22 defines a through hole 2241, through which the first microphone 32 secured to the third portion 224 of the first flexible circuit board 22 can receive sound. The third mesh 425 covers the through hole 2241.

[0432] In this embodiment, the sound outside the earphone 10 can pass through the second appearance net 423, the second mesh 422, the sound pickup channel 4214, the third mesh 425, and the through hole 2241 of the third part 224 of the first flexible circuit board 22 in sequence, and enter the first microphone 32. The earphone 10 collects external sound through the first microphone 32 to achieve sound pickup.

[0433] The connecting portion 4242 of the second grounding member 424 can be fixedly and electrically connected to the third portion 224 of the first flexible circuit board 22 to achieve grounding. For example, the connecting portion 4242 of the second grounding member 424 can be soldered to the third portion 224 of the first flexible circuit board 22. In other embodiments, the second component 42 may not include the second grounding member 424, and the second exterior mesh 423 may be made of a conductive material and electrically connected to the first flexible circuit board 22 to achieve grounding.

[0434] Regarding the main housing 113 of the earphone 10, the third component 43 and the fourth component 44 of the audio auxiliary component 4:

[0435] Please refer to the Figure 1A and Figure 6 In some embodiments, the main shell member 113 of the housing 1 has a first through hole 1135 and a second through hole 1136 spaced apart from each other. The first through hole 1135 and the second through hole 1136 are both located on the rear side of the main shell member 113, that is, on the side of the main shell 11 facing away from the front shell 12. The first through hole 1135 and the second through hole 1136 are respectively located on both sides of the spine line 112. The first through hole 1135 and the second through hole 1136 can be roughly located at the intersection of the ear bag 10a and the ear stem 10b. When the user wears the earphones 10, the first through hole 1135 and the second through hole 1136 face away from the user's ears and are exposed.

[0436] In this embodiment, the positions of the first through holes 1135 and the second through holes 1136 are approximately symmetrical, which helps to improve the exquisite appearance of the earphone 10.

[0437] Please refer to Figure 1A and Figure 24 , Figure 24 yes Figure 1A A schematic diagram of a portion of the structure of the earphone 10 is shown.

[0438] In some embodiments, the third component 43 of the audio auxiliary assembly 4 includes a fourth mesh 431 and an adhesive layer 432. The fourth mesh 431 can be secured to the inner wall of the main housing 113 via the adhesive layer 432, with the fourth mesh 431 covering the first through-hole 1135. The fourth mesh 431 is used to prevent external dust from entering the earphone 10 through the first through-hole 1135. The fourth mesh 431 also prevents direct visibility of the internal structure of the earphone 10 from the outside, providing a decorative effect. In other embodiments, the third component 43 may not include an adhesive layer, and the fourth mesh 431 may be secured to the inner wall of the main housing 113 via other means, which is not strictly limited in this embodiment of the present application.

[0439] In some embodiments, the fourth component 44 of the audio auxiliary component 4 includes a third exterior mesh 441 and an adhesive layer 442. The third exterior mesh 441 can be secured to the inner wall of the main housing 113 via the adhesive layer 442, with the third exterior mesh 441 covering the second through-hole 1136. The third exterior mesh 441 can include a main body 4411 and a flange 4412, wherein the flange 4412 is circumferentially connected to the periphery of the main body 4411 and secured to the inner wall of the main housing 113, and the main body 4411 is embedded in the second through-hole 1136.

[0440] Exemplarily, the third exterior mesh 441 is made of a conductive material and is grounded. This prevents electric shock. The third exterior mesh 441 may also include an extension 4413 connected to the flange 4412. The extension 4413 is used to electrically connect to the first flexible circuit board 22, thereby grounding the third exterior mesh 441. In this embodiment, the third exterior mesh 441 is a conductive member, and its extension 4413 is secured and electrically connected to the first flexible circuit board 22 via welding. This welding connection is reliable, simple, and cost-effective.

[0441] The third appearance mesh 441 forms part of the exterior of the earphones 10. The third appearance mesh 441 can be a metal mesh to enhance the stylishness and mechanical reliability of the earphones 10 and reduce the risk of external damage to components located behind the third appearance mesh 441. For example, it can prevent penetration by sharp objects, thereby increasing the service life of the earphones 10. The third appearance mesh 441 can be an integrally formed structural component, for example, it can be stamped from a metal mesh.

[0442] In some other embodiments, the fourth component 44 may also include a grounding member, and the fourth component 44 is grounded through the grounding member to prevent electric shock. In this case, the third exterior mesh 441 may be made of metal, plastic, or other materials.

[0443] Regarding the fifth component 45 of the audio auxiliary component 4 of the earphone 10:

[0444] Please refer to Figures 25 to 28 , Figure 25 yes Figure 3 The schematic structural diagram of the fifth component 45 of the audio auxiliary component 4 is shown. Figure 26 yes Figure 25 The partially exploded structural diagram of the fifth component 45 is shown, Figure 27 yes Figure 25 The fifth component 45 is shown in another structural diagram at another angle. Figure 28 yes Figure 27 A schematic diagram of a partially exploded structure of the fifth component 45 is shown. Figure 27 Relative perspective Figure 25 The perspective has been flipped.

[0445] In some embodiments, the fifth component 45 of the audio auxiliary component 4 includes a bracket 451, a first cover 452, a second cover 453, a third cover 454, a fifth mesh 455, a sixth mesh 456, a seventh mesh 457 and multiple adhesive layers.

[0446] Exemplarily, the bracket 451 has a front side 451a and a rear side 451b disposed opposite to each other, and further has a peripheral side 451c located around the front side 451a and the rear side 451b. Figure 4 The front side 451a of the bracket 451 faces the speaker 31, forming a rear cavity 14b between the bracket 451 and the speaker 31. The front side 451a of the bracket 451 faces the rear cavity 14b. The rear side 451b of the bracket 451 faces away from the speaker 31 and toward the main circuit board 21, that is, toward the mainboard cavity 14c. The peripheral side of the bracket 451 faces the housing 1. The fifth component 45 can be fixedly connected to the inner wall of the main housing member 113 via the peripheral side 451c of the bracket 451, thereby being fixed within the housing 1.

[0447] In some embodiments, such as Figure 25 and Figure 26As shown, the bracket 451 is provided with a bass tube channel 4511 having two openings formed therein, connecting different spaces located at different locations on the bracket 451. When the fifth component 45 is installed in the housing 1, one end of the bass tube channel 4511 connects to the rear cavity 14b, and the other end connects to the first through-hole 1135 of the main housing 113. This allows air in the rear cavity 14b of the earphone 10 to travel through the bass tube channel 4511 and the first through-hole 1135 to the space outside the earphone 10. For example, the bass tube channel 4511 forms a first opening 4511a on the front side 451a of the bracket 451, and a second opening 4511b on the circumferential side 451c of the bracket 451. The second opening 4511b connects to the first through-hole 1135. In this manner, the bass tube channel 4511 connects the rear cavity 14b with the space outside the earphone 10.

[0448] The area of ​​the bracket 451 surrounding the second opening 4511b is sealed to the inner wall of the housing 1. For example, a layer of glue can be used to seal the gap between the area of ​​the bracket 451 surrounding the second opening 4511b and the inner wall of the main housing 113 to improve the sealing of the bass tube passage 4511.

[0449] The bass duct channel 4511 can have a variety of implementation structures. For example, the bass duct channel 4511 can form a strip groove 4511c on the front side 451a of the bracket 451. The first cover plate 452 is fixed to the front side 451a of the bracket 451 and covers a portion of the opening of the strip groove 4511c. The other portion of the opening of the strip groove 4511c forms the first opening 4511a. In this case, the bass duct channel 4511 is formed by the bracket 451 and the first cover plate 452. The first cover plate 452 can first be positioned with the bracket 451 by a positioning structure (such as a positioning column, a protrusion, etc.) on the bracket 451, and then fixed to the bracket 451 by ultrasonic welding to ensure the reliability of the bass duct sealing. In some other embodiments, the first cover plate 452 can also be fixed to the bracket 451 by adhesive materials such as glue or double-sided tape.

[0450] In the embodiment of the present application, when the speaker 31 of the earphone 10 is working, the air resonates in the bass tube channel 4511, driving the air in the rear cavity 14b to resonate, thereby affecting the diaphragm vibration of the speaker 31 to improve the bass performance of the earphone 10.

[0451] Among them, the simplified calculation formula of the resonant frequency of the acoustic system is: in, C ms is the mechanical compliance coefficient of the loudspeaker, S Dis the diaphragm area of ​​the loudspeaker, ρ is the air density, L is the length of the bass tube channel, R is the equivalent radius of the cross-sectional area of ​​the bass tube channel, and S is the cross-sectional area of ​​the bass tube channel.

[0452] It can be seen that the size of the bass tube channel 4511 of the earphone 10 affects the frequency response result, and the low-frequency sensitivity can be improved based on sound quality / noise reduction considerations by adjusting the length and / or cross-sectional area of ​​the bass tube channel 4511. Figure 25 The dotted line briefly illustrates the extension direction of the bassoon channel 4511 . The dimension of the bassoon channel 4511 in the extension direction is the length. The cross section of the bassoon channel 4511 is perpendicular to the extension direction. The cross-sectional area of ​​the bassoon channel 4511 is the area of ​​the cross section of the bassoon channel 4511 .

[0453] In addition, the cross-sectional area of ​​the bass tube channel 4511 is limited and cannot be too large or too small; if the cross-sectional area of ​​the bass tube channel 4511 is too small, the acoustic viscous damping will increase, affecting the resonance effect; if the cross-sectional area of ​​the bass tube channel 4511 is too large, the volume of the earphone 10 will be too large.

[0454] Please refer to Figure 29A and Figure 29B , Figure 29A yes Figure 25 FIG. 4 is a simulation diagram showing a possible embodiment of the relationship between the length of the bass tube channel 4511 of the fifth component 45 and the frequency response of the earphone 10. Figure 29B yes Figure 25 A schematic diagram of a simulation of the relationship between the cross-sectional area of ​​the bass tube channel 4511 of the fifth component 45 and the frequency response of the earphone 10 in a possible implementation is shown. Figure 29A and Figure 29B The horizontal axis is frequency in Hertz (Hz), and the vertical axis is sound pressure level in decibels (dB).

[0455] Figure 29A The multiple curves correspond to frequency response curves when the lengths of the bass tube channel 4511 are 9.8 mm, 10.8 mm, 11.8 mm, 12.8 mm, and 13.8 mm, respectively. The arrows in the figure correspond to the frequency response change trend of the earphone 10 when the length of the bass tube channel 4511 increases. Figure 29B The multiple curves corresponding to the cross-sectional areas of the bass tube channel 4511 are 1.54mm 2 , 1.44mm 2 , 1.34mm 2 , 1.24mm 2 , 1.14mm 2 , 1.04mm 2 , 0.94mm 2The arrow in the figure corresponds to the frequency response trend of the earphone 10 when the cross-sectional area of ​​the bass tube channel 4511 is reduced. Figure 29A and Figure 29B As shown, when the length of the bass tube channel 4511 increases or the cross-sectional area decreases, the resonance peak frequency near 100 Hz will shift forward, the resonance valley depth near 1.5 kHz will decrease, and the sensitivity of the 100-1 kHz frequency band will decrease.

[0456] In the embodiment of the present application, for example, the cross-sectional area of ​​the bass tube channel 4511 can be 0.8 mm 2 to 1.7mm 2 range, for example, within 0.94 mm 2 to 1.54mm 2 In the range, for example 1.126mm 2 , 1.20mm 2 , 1.24mm 2 , 1.28mm 2 etc.; the length of the bass tube channel 4511 may be in the range of 7 mm to 16 mm, for example, in the range of 9.8 mm to 13.8 mm, for example, 9.8 mm, 10.4 mm, 11.2 mm, etc., to obtain better low-frequency sensitivity.

[0457] In the embodiment of the present application, for example, the cross-section of the bassoon channel 4511 may be rectangular, circular, or other shapes; the bassoon channel 4511 may include straight extension portions and / or curved extension portions to meet the length requirements and spatial arrangement requirements of the bassoon channel 4511. The embodiment of the present application does not strictly limit the specific structural shape of the bassoon channel 4511.

[0458] In some embodiments, the first cover plate 452 can be made of a plastic material. In this case, the first cover plate 452 is relatively lightweight, which helps reduce the weight of the headset 10. Furthermore, when the bracket 451 is also made of a plastic material, the first cover plate 452 and the bracket 451 can be secured to each other using ultrasonic welding technology. This not only meets the requirements of securing and sealing, but also does not occupy additional space due to the connection, which facilitates miniaturization. Of course, the first cover plate 452 can also be secured to the bracket 451 using adhesive materials such as glue or double-sided tape.

[0459] In some other embodiments, the first cover plate 452 may also be made of metal material. In this case, the first cover plate 452 and the main body still maintain a sealed connection relationship. For example, the two can be fixed by glue, double-sided tape, or other adhesive materials. At the same time, since the fifth component 45 is located between the speaker 31 and the main circuit board 21, when the first cover plate 452 is made of metal material, the first cover plate 452 can also be used as a magnetic isolation member to isolate the magnetic field, thereby reducing the adverse effects of the induced magnetic field generated by the components on the main circuit board 21 on the speaker 31, and further reducing the risk of current noise. Exemplarily, the first cover plate 452 can be made of SPCC material, that is, generally cold-rolled carbon steel sheet and steel strip, where S-Steel, P-Plate, C-cold, and the fourth C-common.

[0460] In some other embodiments, the first cover plate 452 may also include a plurality of plate bodies arranged in a stacked manner, and at least one of the plurality of plate bodies is made of metal material. In this case, the first cover plate 452 can be reused as a magnetic isolation member. Among them, at least one of the plurality of plate bodies may be made of plastic material. In this case, the first cover plate 452 is a composite cover plate. For example, the first cover plate 452 may include a plastic plate and a metal plate arranged in a stacked manner, and the plastic plate is arranged on a side close to the bracket 451. The first cover plate 452 can be ultrasonically welded to the bracket 451 through the plastic plate. In addition, the first cover plate 452 can also achieve magnetic isolation through the metal plate to reduce the risk of current noise in the speaker 31.

[0461] In some other embodiments, the bass tube channel 4511 may also have other implementation structures. Correspondingly, the audio auxiliary component 4 may not include the first cover plate 452, or may include other structures.

[0462] In some embodiments, such as Figures 25 to 28 As shown, the bracket 451 also has a sound pickup channel 4512 and a sound pickup cavity 4513. The sound pickup channel 4512 is separate from the bass tube channel 4511. One end of the sound pickup channel 4512 communicates with the sound pickup cavity 4513, while the other end is formed in the bracket 451, connecting the sound pickup cavity 4513 with the space outside the bracket 451. When the fifth component 45 is installed in the housing 1, the end of the sound pickup channel 4512 away from the sound pickup cavity 4513 communicates with the second through-hole 1136 of the main housing 113, allowing sound from outside the earphone 10 to enter the sound pickup cavity 4513 through the second through-hole 1136 and the sound pickup channel 4512. The sound pickup cavity 4513 is used to accommodate the second microphone 33; the second microphone 33 of the audio component 3 is installed in the sound pickup cavity 4513 and can collect external sound entering the sound pickup cavity 4513.

[0463] The sound pickup channel 4512 forms a third opening 4512a on the circumferential side 451c of the bracket 451. The third opening 4512a is spaced apart from the second opening 4511b and communicates with the second through-hole 1136. The third opening 4512a and the second opening 4511b are located on different sides of the bracket 451 to correspond to the positions of the first through-hole 1135 and the second through-hole 1136 of the main housing 113, thereby matching the appearance of the earphone 10.

[0464] The fifth mesh 455 can be fixed to the side 451c of the bracket 451 and cover the third opening 4512a. The fifth mesh 455 allows sound to pass through and prevents external dust from entering the sound pickup channel 4512 through the third opening 4512a, thereby ensuring that the second microphone 33 can pick up sound with higher accuracy. The fifth mesh 455 can be fixed to the bracket 451 via an adhesive layer 4581. The adhesive layer 4581 can be made of adhesive such as glue or double-sided tape. The fifth mesh 455 can also be fixed to the bracket 451 by other means, which are not strictly limited in this embodiment of the present application.

[0465] The area of ​​the bracket 451 surrounding the third opening 4512a is sealed to the inner wall of the housing 1. For example, the area of ​​the bracket 451 surrounding the third opening 4512a can be sealed to the inner wall of the main housing 113 by an adhesive layer to improve the sealing of the sound pickup channel 4512.

[0466] Illustratively, the sound pickup cavity 4513 is formed on the front side 451a of the bracket 451, and the second cover 453 is fixed to the front side 451a of the bracket 451 and covers the sound pickup cavity 4513. The second cover 453 can be fixed to the bracket 451 via an adhesive layer 4582, which can be a material such as adhesive or double-sided tape. In other embodiments, the second cover 453 can also be fixed to the bracket 451 via ultrasonic welding or other methods.

[0467] The second cover plate 453 seals the connection bracket 451 to enclose the pickup cavity 4513, isolating the rear cavity 14b from the pickup cavity 4513. This prevents the second microphone 33 within the pickup cavity 4513 from picking up sound from the speaker 31, which could cause self-excitation and howling. The second cover plate 453 has an isolation rating greater than 30 dB, meeting the required isolation between the second microphone 33 and the speaker 31. In some examples, the thickness of the second cover plate 453 can be in the range of 0.15 mm to 0.45 mm, such as 0.23 mm, 0.3 mm, or 0.35 mm.

[0468] In some embodiments, the second cover 453 can be made of a plastic material. In this case, the second cover 453 is relatively lightweight, which helps reduce the weight of the headset 10. Furthermore, when the bracket 451 is also made of a plastic material, the second cover 453 and the bracket 451 can be secured to each other using ultrasonic welding technology. This not only meets the requirements of securing and sealing, but also does not occupy additional space due to the connection, which facilitates miniaturization. Of course, the second cover 453 can also be secured to the bracket 451 using adhesive materials such as glue or double-sided tape.

[0469] In some other embodiments, the second cover plate 453 may also be made of metal material. In this case, the second cover plate 453 and the main body still maintain a sealed connection relationship. For example, the two can be fixed by glue, double-sided tape, or other adhesive materials. At the same time, since the fifth component 45 is located between the speaker 31 and the main circuit board 21, when the second cover plate 453 is made of metal material, the second cover plate 453 can also be used as a magnetic isolation member to isolate the magnetic field, thereby reducing the adverse effects of the induced magnetic field generated by the components on the main circuit board 21 on the speaker 31, and further reducing the risk of current noise. Exemplarily, the second cover plate 453 can be made of SPCC material, that is, generally cold-rolled carbon steel sheet and steel strip, where S-Steel, P-Plate, C-cold, and the fourth C-common.

[0470] In some other embodiments, the second cover plate 453 may also include a plurality of plate bodies arranged in a stacked manner, and at least one of the plurality of plate bodies is made of metal material. In this case, the second cover plate 453 can be reused as a magnetic isolation member. Among them, at least one of the plurality of plate bodies can also be made of plastic material. In this case, the second cover plate 453 is a composite cover plate. For example, the second cover plate 453 may include a plastic plate and a metal plate arranged in a stacked manner, and the plastic plate is arranged on a side close to the bracket 451. The second cover plate 453 can be ultrasonically welded to the bracket 451 through the plastic plate. In addition, the second cover plate 453 can also achieve magnetic isolation through the metal plate to reduce the risk of current noise in the speaker 31.

[0471] The sound pickup channel 4512 may form an opening 4512b on the bottom wall of the sound pickup cavity 4513 to communicate with the sound pickup cavity 4513. The sixth mesh 456 is located within the sound pickup cavity 4513, fixed to the bottom wall of the sound pickup cavity 4513, and covers the opening 4512b of the sound pickup channel 4512 on the bottom wall of the sound pickup cavity 4513. The sixth mesh 456 may be fixed to the bottom wall of the sound pickup cavity 4513 by an adhesive layer 4583 or other means. The adhesive layer 4583 may be a material such as adhesive or double-sided tape.

[0472] Exemplarily, the sound pickup channel 4512 can be configured as a curved channel, for example, including at least one curved portion to prevent sound outside the earphone 10 (e.g., wind) from directly entering the sound pickup cavity 4513, thereby improving wind protection and reducing wind noise, thereby improving the sound pickup accuracy of the second microphone 33. For example, the sound pickup channel 4512 can form a connecting groove 4512c on the rear side 451b of the bracket 451, with one end of the connecting groove 4512c communicating with the sound pickup cavity 4513 and the other end of the connecting groove 4512c communicating with the third opening 4512a; the third cover 454 is fixed to the rear side 451b of the bracket 451 and covers the connecting groove 4512c. At this point, the sound pickup channel 4512 forms curved portions at both ends of the connecting slot 4512c. The sound pickup channel 4512 extends from the sound pickup cavity 4513 to the third opening 4512a, first from the front side 451a of the bracket 451 to the rear side 451b of the bracket 451. After extending a distance along the rear side 451b of the bracket 451, it curves from the rear side 451b of the bracket 451 to the circumferential side 451c of the bracket 451, forming a curved channel. In other embodiments, the sound pickup channel 4512 may also have other implementation structures, which are not strictly limited in this embodiment of the present application.

[0473] The third cover plate 454 can be fixedly connected to the bracket 451 via an adhesive layer 4584. The adhesive layer 4584 can be made of adhesive such as glue or double-sided tape. In other embodiments, the third cover plate 454 can be fixedly connected to the bracket 451 via ultrasonic welding to ensure a reliable seal of the sound pickup channel 4512. The third cover plate 454 can be made of plastic, metal, or a composite plate structure.

[0474] In some embodiments, such as Figure 25 and Figure 26 As shown, the bracket 451 may also be provided with a rear leakage channel 4514, which is separate from the bass tube channel 4511 and the sound pickup channel 4512. The rear leakage channel 4514 has two openings formed on the bracket 451 to connect different spaces located at different positions within the bracket 451. When the fifth component 45 is installed within the housing 1, one end of the rear leakage channel 4514 connects to the rear cavity 14b, and the other end connects to the first through-hole 1135 of the main housing 113. This allows air in the rear cavity 14b of the earphone 10 to be transferred to the space outside the earphone 10 through the rear leakage channel 4514 and the first through-hole 1135. For example, the rear leakage channel 4514 forms a fourth opening 4514a on the front side 451a of the bracket 451, and a fifth opening 4514b on the circumferential side 451c of the bracket 451. The fifth opening 4514b connects to the first through-hole 1135. At this time, the rear leakage channel 4514 can connect the rear cavity 14 b with the external space of the earphone 10 .

[0475] The fifth opening 4514b is disposed adjacent to the second opening 4511b, that is, the bass tube channel 4511 and the rear drain channel 4514 are disposed adjacent to the openings on the peripheral side 451c of the bracket 451. This reduces the opening area of ​​the first through hole 1135 when both the fifth opening 4514b and the second opening 4511b are connected to the first through hole 1135, thereby avoiding the formation of a large hole in the exterior of the housing 1 and improving the visual integrity of the earphone 10. In other embodiments, the fifth opening 4514b and the second opening 4511b may be connected and combined into a single opening, which is not strictly limited in this embodiment of the present application.

[0476] The area of ​​the bracket 451 surrounding the fifth opening 4514b is sealed to the inner wall of the housing 1. For example, an adhesive layer can be used to seal the area of ​​the bracket 451 surrounding the fifth opening 4514b to the inner wall of the main housing 113 to improve the sealing of the sound pickup channel 4512. The adhesive layer can surround both the fifth opening 4514b and the second opening 4511b, so that the area of ​​the bracket 451 surrounding the fifth opening 4514b and the second opening 4511b is sealed to the area of ​​the inner wall of the main housing 113 surrounding the first through hole 1135.

[0477] The seventh mesh 457 is fixed to the front side 451a of the bracket 451 and covers the fourth opening 4514a. The seventh mesh 457 can be fixed to the bracket 451 via an adhesive layer 4585 or other methods.

[0478] Illustratively, a certain distance exists between the fifth opening 4514b and the third opening 4512a, for example, the distance between the fifth opening 4514b and the third opening 4512a on the circumferential side 451c of the bracket 451 is greater than or equal to 10 mm, to meet isolation requirements between the sound pickup channel 4512 and the rear leakage channel 4514, for example, an isolation of greater than or equal to 30 dB, thereby improving the sound pickup accuracy of the second microphone 33. The first through hole 1135 of the main housing 113 is provided corresponding to the fifth opening 4514b, and the second through hole 1136 is provided corresponding to the third opening 4512a. The distance between the first through hole 1135 and the second through hole 1136 also needs to meet certain requirements, for example, a distance on the outer surface of the main housing 113 of greater than or equal to 10 mm.

[0479] In this embodiment, the present application integrates the bass tube channel 4511, the pickup channel 4512, and the rear discharge channel 4514 into the bracket 451. The fifth component 45 has a high degree of integration and a high utilization rate of the internal space of the earphone 10, which is conducive to the miniaturization of the earphone 10. The fifth component 45 adopts an integrated bracket design, which can also reduce the difficulty of assembly, improve production yield, bring cost advantages, and further enhance the competitiveness of the product. In addition, part or all of the cover plate in the fifth component 45 can also serve as a magnetic isolation member, so that the fifth component 45 can reduce the risk of current noise in the speaker 31 and improve the sound quality of the earphone 10.

[0480] In some embodiments, bracket 451 may be an integrally formed structural member. In this case, bracket 451 has high structural strength, and the overall structural stability of fifth assembly 45 is improved. In other embodiments, bracket 451 may be assembled from multiple components to form an integrated structure, so that fifth assembly 45 meets modular assembly requirements.

[0481] In some embodiments, the bracket 451 can be made of plastic to achieve lightweight. In other embodiments, the bracket 451 itself can also be made of a magnetic conductive material (such as metal, etc.), or at least partially covered with a magnetic isolation sheet to achieve magnetic isolation and reduce the risk of electric current sound from the speaker 31.

[0482] In some other embodiments, the rear leakage channel 4514 can also be implemented by other structural components, and this application does not strictly limit this.

[0483] Regarding the installation of the separation component 8 of the earphone 10:

[0484] In some embodiments, such as Figure 4 As shown, the partition assembly 8 is located in the top space 111a of the main housing 11 and is fixedly connected to the main housing 11. The magnetic member 81 is located on the bottom side of the bracket 451 of the fifth assembly 45. The size and position of the magnetic member 81 meet the magnetic attraction requirements for the earphones 10 when inserted into the box. During the assembly process of the earphones 10, the third assembly 43 and the fourth assembly 44 are first installed into the main housing 113. Then, the fifth assembly 45, which already contains the second microphone 33, is installed into the main housing 113. The magnetic member 81 is then installed. Finally, the partition assembly 8 is fixed and sealed to the main housing 113 using glue.

[0485] Separation assembly 8 may include a magnetic isolation member to reduce the risk of electric current noise in speaker 31. As previously described, the magnetic isolation member may be implemented by bracket 451, first cover plate 452, second cover plate 453, and / or third cover plate 454 of fifth assembly 45. Furthermore, magnetic member 81 may be a soft magnet (e.g., a metal block such as iron), in which case magnetic member 81 may also function as a magnetic isolation member.

[0486] For example, Figure 6 and Figure 24 As shown, the inner side of the main housing 113 is provided with at least two rubber retaining ribs, for example, a first rubber retaining rib 11310 and a second rubber retaining rib 11320. The first rubber retaining rib 11310 is positioned near and partially surrounds the first through-hole 1135, while the second rubber retaining rib 11320 is positioned near and partially surrounds the second through-hole 1136. After the third component 43 is assembled to the main housing 113, the first rubber retaining rib 11310 partially surrounds the third component 43. After the fourth component 44 is assembled to the main housing 113, the second rubber retaining rib 11320 partially surrounds the fourth component 44.

[0487] Please refer to Figure 26 、 Figure 30A as well as Figure 30B , Figure 30A yes Figure 1A The schematic diagram of part of the internal structure of the earphone 10 is shown. Figure 30B yes Figure 30A The schematic diagram of the cross-sectional structure of the partial structure shown is along the FF point. Figure 30A Relative perspective Figure 1A The perspective is flipped.

[0488] In some embodiments, a portion of the first flexible circuit board 22 extends from the front side 451a of the bracket 451 into the sound pickup cavity 4513, and the second microphone 33 is fixed and electrically connected to the first flexible circuit board 22. Figure 16 As shown, the second microphone 33 is fixed to the first portion 222 of the first flexible circuit board 22. Figure 30A In the embodiment, the first flexible circuit board 22 can be wound from the rear side 451b of the bracket 451 to the front side 451a of the bracket 451, the first portion 222 of the first flexible circuit board 22 can be located in the sound pickup cavity 4513, and the second microphone 33 is located in the sound pickup cavity 4513 to collect the sound entering the sound pickup cavity 4513. Figure 30B As shown, the first portion 222 of the first flexible circuit board 22 can be fixed to the side of the sixth mesh 456 facing away from the sound pickup channel 4512 via an adhesive layer 4586. Part of the first flexible circuit board 22 can also be fixed to the front side 451a of the bracket 451 to ensure a stable and secure relative position between the first flexible circuit board 22 and the bracket 451.

[0489] For example, the sound pickup direction of the second microphone 33 can be set back to the speaker 31. Figure 30B As shown, the first portion 222 of the first flexible circuit board 22 is provided with a through hole, and the sound pickup hole of the second microphone 33 is connected to the sound pickup channel 4512 through the through hole, so that the sound can enter the second microphone 33 through the sound pickup channel 4512 and the through hole of the first portion 222, and the second microphone 33 can pick up the sound. Figure 30A and Figure 30B As shown, the sound pickup direction of the second microphone 33 is facing away from the second cover plate 453, that is, facing away from the back cavity 14b of the earphone 10. Figure 4 Since the rear cavity 14b of the earphone 10 is located between the speaker 31 and the fifth component 45, the second microphone 33 picks up sound facing away from the speaker 31. In this case, the isolation between the second microphone 33 and the speaker 31 is better, which is conducive to improving the signal-to-noise ratio of the sound picked up by the second microphone 33.

[0490] For example, during the process of assembling the fifth component 45 into the main housing 113, glue can be applied to the first glue rib 11310 and the second glue rib 11320 (e.g., Figure 24 (shown by the bold dashed line in the figure), the fifth component 45 is then installed into the main housing 113, and glue is then dispensed at locations surrounding the third component 43 and the fourth component 44, so that the two colloids formed by the two dispenses surround the third component 43 and the fourth component 44, respectively, and seal the bracket 451 of the fifth component 45 with the inner wall of the main housing 113, thereby ensuring that the channel provided by the fifth component 45 is reliably sealed. At this point, one of the two colloids can seal the area of ​​the bracket 451 around the second opening 4511b and the fifth opening 4514b to the inner wall of the main housing 113, and the other colloid can seal the area of ​​the bracket 451 around the third opening 4512a to the inner wall of the main housing 113.

[0491] After the fifth component 45 is installed on the main housing 113, the magnetic component 81 is installed in the main housing 113, and the magnetic component 81 is positioned with the main housing 113 and the bracket 451. Finally, glue is applied to the matching positions of the bracket 451 and the main housing 113, the matching positions of the bracket 451 and the magnetic component 81, the matching positions of the magnetic component 81 and the main housing 113, and the matching positions of the second cover 453 and the main housing 113 to seal (as shown in FIG. Figure 30A The partition assembly 8 is assembled with the main housing 113. At this point, the sealing connection between the partition assembly 8 and the main housing 11 is reliable, and the partition assembly 8 can well separate the rear cavity 14b from the mainboard cavity 14c, so that the mainboard cavity 14c is reliably sealed.

[0492] Among them, multiple limiting structures or guide structures can be provided on the inner wall of the main shell 113, so that when the fifth component 45 is installed into the main shell 113, it can be directly installed to the correct position under the guidance of the limiting structure or guide structure, so as to reduce the assembly difficulty of the earphone 10 and improve the assembly accuracy and product yield of the earphone 10.

[0493] Regarding the speaker 31 of the earphone 10:

[0494] Please refer to Figures 31A to 31C , Figure 31A yes Figure 3 The schematic structural diagram of the loudspeaker 31 is shown. Figure 31B yes Figure 31A The cross-sectional structural diagram of the loudspeaker 31 at EE is shown. Figure 31C yes Figure 31A A schematic diagram of the exploded structure of the speaker 31 is shown.

[0495] In some embodiments, the speaker 31 includes a basket 313 , a magnetic circuit assembly 314 , a diaphragm 315 , a connecting ring 316 , and a voice coil 317 .

[0496] The basin frame 313 may be substantially annular and may be provided with a first through hole 3131 and a second through hole 3132 , which are spaced apart from each other. For example, the first through hole 3131 and the second through hole 3132 may be formed on both sides of the basin frame 313 , respectively.

[0497] The magnetic circuit assembly 314 is fixedly connected to the frame 313. The magnetic circuit assembly 314 covers the interior space of the frame 313 and may be partially located within the interior space of the frame 313. A third through-hole 3141 is provided in the middle of the magnetic circuit assembly 314, connecting the spaces on both sides of the magnetic circuit assembly 314. For example, the magnetic circuit assembly 314 may include a first magnetic conductive sheet 3142, a first magnet 3143, a second magnetic conductive sheet 3144, a second magnet 3145, and a third magnetic conductive sheet 3146. The first magnetic conductive sheet 3142 may be generally annular and fixed to the frame 313, with at least a portion of it exposed within the interior space of the frame 313. For example, the first magnetic conductive sheet 3142 may be embedded in the frame 313, and the first magnetic conductive sheet 3142 and the frame 313 may be formed into an integrally formed structural component using methods such as in-mold injection molding. The first magnet 3143 can be roughly annular in shape and is fixed to one side of the first magnetic conductive sheet 3142. The second magnetic conductive sheet 3144 is fixed to the side of the first magnet 3143 facing away from the first magnetic conductive sheet 3142. A first hole 3147 is defined in the middle of the second magnetic conductive sheet 3144. The second magnet 3145 is fixed to the side of the second magnetic conductive sheet 3144 facing the first magnet 3143. The second magnet 3145 is located inside the first magnet 3143 and forms a first gap with the first magnet 3143. The second magnet 3145 also has a second hole 3148, which communicates with the first hole 3147. The third magnetic conductive sheet 3146 is fixed to the side of the second magnet 3145 facing away from the second magnetic conductive sheet 3144. The third magnetic conductive sheet 3146 is located inside the first magnetic conductive sheet 3142 and forms a second gap with the first magnetic conductive sheet 3142, which communicates with the first gap. The third magnetic conductive sheet 3146 defines a third hole 3149, which communicates with the second hole 3148. The third hole 3149, the second hole 3148, and the first hole 3147 collectively form a third through hole 3141. The magnetic circuit assembly 314 can be fixedly connected to the basin frame 313 via adhesives 319. There can be one or more adhesives 319.

[0498] The diaphragm 315 is fixedly connected to the frame 313. The diaphragm 315 covers the inner space of the frame 313. For example, the periphery of the diaphragm 315 can be fixedly connected to the frame 313 via a connecting ring 316. The voice coil 317 is located in the inner space of the frame 313. One end of the voice coil 317 is fixedly connected to the diaphragm 315, and the other end of the voice coil 317 is located in the second gap and the first gap.

[0499] For example, the speaker 31 may further include a mesh assembly 318, which includes a first mesh 3181, a first adhesive layer 3182, a second mesh 3183, a second adhesive layer 3184, a third mesh 3185, and a third adhesive layer 3186. The first mesh 3181 is secured to the side of the frame 313 facing away from the diaphragm 315 via the first adhesive layer 3182, and covers the first through-hole 3131. The second mesh 3183 is secured to the side of the frame 313 facing away from the diaphragm 315 via the second adhesive layer 3184, and covers the second through-hole 3132. The third mesh 3185 is secured to the side of the second magnetic conductive sheet 3144 facing away from the diaphragm 315 via the third adhesive layer 3186, and covers the third through-hole 3141. In other embodiments, the first mesh 3181, the second mesh 3183, and / or the third mesh 3185 may be secured in other ways, which are not strictly limited in this embodiment of the present application.

[0500] In this embodiment, the side of the diaphragm 315 facing away from the magnetic circuit assembly 314 forms a first space, the space between the diaphragm 315 and the magnetic circuit assembly 314 forms a second space, and the side of the magnetic circuit assembly 314 facing away from the diaphragm 315 forms a third space. When the speaker 31 is installed in the earphone 10, the first space corresponds to the front cavity 14a, and the third space corresponds to the rear cavity 14b. The first through hole 3131, the second through hole 3132, and the third through hole 3141 all connect the second space and the third space, forming the rear leakage hole of the speaker. In this embodiment of the present application, the addition of the third through hole 3141 significantly increases the opening area of ​​the rear leakage hole of the speaker 31, which helps reduce the overall acoustic impedance of the earphone 10, improves the resonance effect between the speaker 10 and the bass tube channel 4511, and improves the low-frequency performance of the earphone 10.

[0501] The overall acoustic impedance of the earphone 10 includes the mechanical acoustic impedance of the diaphragm 315 of the speaker 31, the acoustic impedance of the rear vent of the speaker 31, the acoustic impedance of the bass duct channel 4511, and the acoustic impedance of the sound outlet. The mechanical acoustic impedance of the diaphragm 315 is the resistance encountered by the diaphragm 315 during vibration. The acoustic impedance of the rear vent of the speaker 31 is the acoustic impedance of the mesh covering the rear vent of the speaker 31. In this embodiment, the first mesh 3181, the second mesh 3183, and the third mesh 3185 are included. The acoustic impedance of the bass duct channel 4511 is the acoustic impedance of the mesh at the opening of the bass duct channel 4511. In this embodiment, the mesh at the location where the bass duct channel 4511 communicates with the outside world (i.e., the fourth mesh 431, see FIG. 3 ). Figure 24 The acoustic impedance of the sound outlet is the acoustic impedance of the mesh at the position where the front cavity 14a of the earphone 10 is connected to the outside world, that is, the second mesh 422 covering the second communicating hole 123 (see Figure 23 ) of the acoustic impedance.

[0502] Specifically, when the speaker 31 is provided with only the first and second through holes 3131 and 3132 as rear vents, the first and second through holes 3131 and 3132 are formed in the frame 313. Due to the structural dimensions of the frame 313, the opening area of ​​the first and second through holes 3131 and 3132 is limited, and it is difficult to expand the opening area, resulting in a high overall acoustic impedance of the earphone 10. However, by providing the third through hole 3141 in the magnetic circuit assembly 314, the opening size of the third through hole 3141 can be controlled to effectively increase the opening area of ​​the speaker 31's rear vent while taking into account the magnetic field strength of the magnetic circuit assembly 314, thereby reducing the overall acoustic impedance of the earphone 10.

[0503] See also Figure 31D , Figure 31D yes Figure 1A The schematic diagram of the frequency response curve of the headset 10 in some possible implementations is shown. Figure 31D The horizontal axis is frequency in Hertz (Hz), and the vertical axis is sound pressure level in decibels (dB). Figure 31D The solid line corresponds to the frequency response curve when the speaker 31 of the earphone 10 is provided with the first through hole 3131, the second through hole 3132, and the third through hole 3141. The dotted line corresponds to the frequency response curve when the speaker 31 of the earphone 10 is provided with the first through hole 3131 and the second through hole 3132, but without the third through hole 3141. In some possible implementations, the acoustic impedance of the entire device when the speaker 31 is not provided with the third through hole 3141 is 2.5*10 7 pa*s / mm 3 The speaker 31 has a third through hole 3141. The third through hole 3141 is a circular hole with a diameter of 2 mm. The acoustic impedance of the whole device is 9*10 6 pa*s / mm 3 The overall acoustic impedance of the speaker 31 is significantly reduced, and the overall frequency response curve shows a resonance peak characteristic in the frequency band of 20Hz to 200Hz, thereby enhancing the low-frequency resonance near 100Hz, making the low-frequency performance of the earphone 10 better.

[0504] For example, the overall acoustic impedance of the earphone 10 is less than or equal to 10 7 pa*s / mm 3 to ensure better resonance between the speaker 10 and the bass tube channel 4511.

[0505] For example, the opening area of ​​the third through hole 3141 is less than or equal to 3.14 mm 2, to ensure sufficient magnetic field strength of the magnetic circuit assembly 314 of the speaker 31 while reducing the overall acoustic impedance. The third through hole 3141 can be a circular hole, a square hole, or a hole of another shape. When the third through hole 3141 is a circular hole, the diameter of the third through hole 3141 is less than or equal to 2 mm.

[0506] It is understandable that the speaker 31 may also adopt other structures different from those described above. For example, the structure of the basin frame 313 may be different, the structure of the magnetic circuit assembly 314 may be different, the connection structure between the magnetic circuit assembly 314 and the basin frame 313 may be different, and the connection structure between the basin frame 313 and the diaphragm 315 may be different. The embodiments of the present application do not strictly limit the specific structure of the speaker 31.

[0507] In other embodiments, the speaker 31 may have only one through hole on its frame 313, for example, without the first through hole 3131 or the second through hole 3132. Alternatively, the speaker 31 may have three or more through holes, which are not strictly limited in this embodiment of the present application. In other embodiments, when the opening areas of the first through hole 3131 and the second through hole 3132 are large enough to provide a sufficient area for the rear drain hole of the speaker 31, the speaker 31 may not have the third through hole 3141.

[0508] About antenna 6 of earphone 10:

[0509] Please refer to Figure 32A and Figure 32B , Figure 32A yes Figure 3 The schematic structural diagram of the antenna 6 of the earphone 10 is shown. Figure 32B yes Figure 32A The schematic diagram of the structure of the antenna 6 shown is from another angle.

[0510] In some embodiments, the antenna 6 includes an antenna bracket 61 , a first metal member 62 , and a second metal member 63 .

[0511] The antenna bracket 61 includes a plate 611, and legs 612 and protrusions 613 fixed to the plate 611. The legs 612 and protrusions 613 are located on the same side of the plate 611 and are spaced apart from each other. There can be multiple legs 612, spaced apart from each other, and fixed to all four sides of the plate 611. There can be one or more protrusions 613, which can be fixed to one end of the plate 611. The antenna bracket 61 can be an integrally formed structural component.

[0512] The first metal member 62 is a patterned metal layer that can be formed onto the antenna support 61 using the Laser Direct Structuring (LDS) process to secure it to the antenna support 61. This reduces constraints on the size and shape of the first metal member 62, making its pattern easily adjustable. The first metal member 62 includes a main portion 621, a connecting portion 622, and an extending portion 623. The main portion 621 is secured to the top side of the plate 611 of the antenna support 61. The connecting portion 622 connects to the main portion 621 and extends to at least one of the multiple legs 612 of the antenna support 61. For example, there can be multiple connecting portions 622, each connected to different locations on the main portion 621 and secured to different legs 612 of the antenna support 61. Alternatively, there can be only one connecting portion 622, secured to one of the multiple legs 612. The number of connecting portions 622 can be the same as or different from the number of legs 612 of the antenna bracket 61, and this is not strictly limited in this embodiment of the present application. The connecting portions 622 can partially or completely wrap around the corresponding legs 612 of the antenna bracket 61. The extension portion 623 connects to the main portion 621 and extends to the protrusion 613 of the antenna bracket 61. The extension portion 623 can partially or completely wrap around the protrusion 613 of the antenna bracket 61.

[0513] The second metal member 63 is fixed to and electrically connected to the first metal member 62. For example, one end of the second metal member 63 is fixed to and electrically connected to one end of the first metal member 62, and the other end of the second metal member 63 extends away from the first metal member 62. For example, the second metal member 63 may have a through hole 631, through which the second metal member 63 is positioned relative to the protrusion 613 of the antenna bracket 61. The second metal member 63 may be fixed to and electrically connected to the extension 623 of the first metal member 62 by soldering.

[0514] In this embodiment, the first metal member 62 and the second metal member 63 can collectively form the radiating portion of the antenna 6. The larger size of the radiating portion of the antenna 6 increases the radiation area of ​​the antenna 6, improving the transceiver performance of the antenna 6, and thus improving the wireless communication performance of the headset 10. For example, the antenna bracket 61, the first metal member 62, and the second metal member 63 can all be roughly bar-shaped, and the antenna 6 as a whole can be roughly bar-shaped. This allows for a larger radiation area and better compatibility with the shape of the housing 1 of the headset 10, thus reducing installation difficulty.

[0515] In some examples, the antenna 6 may include an extended circuit board that connects the antenna bracket 61 and the first metal member 62. The extended circuit board includes a second metal member 63, wherein the extended circuit board can form the second metal member 63 from its conductive layer. The extended circuit board can be a flexible circuit board. In this embodiment, the second metal member 63 is formed by the extended circuit board. The extended circuit board is thin and can be bent and deformed, requiring little installation space and can be easily arranged in confined spaces, such as the interior space of the ear stem 10b, thereby expanding the radiation area of ​​the antenna 6 in a confined space.

[0516] In other examples, the second metal member 63 may also be a metal sheet, such as a metal plate such as a steel sheet, or a structural member such as a metal bracket 451. Similarly, the antenna 6 can also achieve the purpose of expanding the radiation area of ​​the antenna 6 in a narrow space by utilizing the thin thickness and easy bendability of the second metal member 63.

[0517] In some other embodiments, the antenna bracket 61 may not be provided with the protrusion 613, the extension portion 623 of the first metal part 62 may be adaptively changed, and the second metal part 63 may adopt other structures to be fixed to and electrically connected to the first metal part 62. The embodiments of the present application do not strictly limit this.

[0518] In some other embodiments, the antenna 6 may not be provided with the second metal member 63 . The antenna 6 includes an antenna bracket 61 and a first metal member 62 . The first metal member 62 forms the radiation portion of the antenna 6 .

[0519] In other embodiments, antenna 6 may also have other implementation structures. For example, antenna 6 may include a circuit board, and the conductive layer in the circuit board forms the radiation portion of antenna 6. The circuit board may be a flexible circuit board, a rigid-flex board, or a rigid board, and this is not strictly limited in the present embodiment.

[0520] Please refer to Figure 33A and Figure 33B , Figure 33A yes Figure 3 The schematic diagram of the structure of the antenna 6 and the main circuit board 21 is shown. Figure 33B yes Figure 33A A schematic diagram of the structure shown at another angle.

[0521] In some embodiments, the antenna 6 is fixedly connected to the main circuit board 21. The antenna 6 is located on one side of the main circuit board 21. The plate 611 of the antenna bracket 61 is spaced apart from the main circuit board 21. The multiple legs 612 of the antenna bracket 61 are fixed to the main circuit board 21 to secure the antenna 6 relative to the main circuit board 21. A space is formed between the plate 611 of the antenna bracket 61 and the main circuit board 21, allowing components to be arranged on the main circuit board 21.

[0522] The main portion 621 of the first metal member 62 is located on the side of the antenna bracket 61's plate 611 facing away from the main circuit board 21. The connecting portion 622 of the first metal member 62 is soldered to the main circuit board 21. The connecting portion 622 of the first metal member 62 is secured and electrically connected to the main circuit board 21 via soldering, enabling the main circuit board 21 to feed power to the antenna 6. The main circuit board 21 is provided with a radio frequency circuit, which is electrically connected to the antenna 6 and the processor.

[0523] In this embodiment, the first metal member 62 forms the radiating portion, or a portion thereof, of the antenna 6. The first metal member 62 and the main circuit board 21 reuse the legs 612 of the antenna bracket 61. These legs 612 serve both as a structural connection and as a feed point for the antenna 6. This eliminates the need for a conventional spring-loaded feed point, saving significant board space and facilitating the placement of the antenna 6 in a compact space. Furthermore, since signal transmission between the antenna 6 and the main circuit board 21 does not require an electrical connector, this reduces antenna 6 signal noise and improves the wireless communication quality of the headset 10.

[0524] Among them, the support legs 612 of the antenna bracket 61 and the connecting portion 622 of the first metal part 62 can be multiple to realize a multi-point feeding antenna solution, thereby realizing a MIMO (Multiple-Input Multiple-Output) antenna solution in some embodiments.

[0525] In some other embodiments, the electrical connection relationship between the first metal part 62 and the main circuit board 21 can also be implemented in other structures, that is, the main circuit board 21 can also use other feeding structures to feed the antenna 6. For example, a conductive spring can be mounted on the main circuit board 21, and the first metal part 62 and / or the second metal part 63 are pressed by the conductive spring; or, the first metal part 62 and / or the second metal part 63 are pressed by the conductive spring; or, the second metal part 63 is welded to the main circuit board 21, etc. The embodiment of the present application does not strictly limit the feeding structure of the antenna 6.

[0526] Regarding the touch sensor 54 of the earphone 10:

[0527] Please refer to Figure 34A and Figure 34B , Figure 34A yes Figure 3 The schematic diagram of the assembly structure of the main circuit board 21, the antenna 6 and the detection circuit board 56 is shown. Figure 34B yes Figure 34A A schematic diagram of the structure shown at another angle.

[0528] In some embodiments, the detection circuit board 56 includes a first circuit board 561, a second circuit board 562, and a third circuit board 563. The first circuit board 561 and the third circuit board 563 are electrically connected to the second circuit board 562. The first circuit board 561, the second circuit board 562, and the third circuit board 563 can be integrally formed components, each being a portion of the detection circuit board 56. The detection circuit board 56 can be a flexible circuit board, allowing the first circuit board 561, the second circuit board 562, and the third circuit board 563 to bend and deform to meet assembly and connection requirements. The detection circuit board 56 and the antenna 6 are independent components.

[0529] Among them, the first circuit board 561 can have a touch sensor 54, and the touch sensor 54 can be electrically connected to other structures through the second circuit board 562; the third circuit board 563 can form a wearing detection sensor 52, and the wearing detection sensor 52 can be electrically connected to other structures through the second circuit board 562.

[0530] For example, the first circuit board 561 and the antenna 6 are independent structural components. The first circuit board 561 can be arranged on the side of the antenna 6 facing away from the main circuit board 21, and can be stacked with the antenna 6. There is a certain overlap between the first circuit board 561 and the antenna 6. For example, the first circuit board 561 and the first metal member 62 and / or the second metal member 63 of the antenna 6 (see Figure 32A ) are stacked, with some overlap. In this case, the antenna 6 is located between the first circuit board 561 and the main circuit board 21. One end of the third circuit board 563 can be connected to either the first circuit board 561 or the second circuit board 562, while the other end of the third circuit board 563 is bent to the side of the main circuit board 21 facing away from the first circuit board 561. In this case, the third circuit board 563 is also located on the side of the antenna 6 facing away from the first circuit board 561.

[0531] In some other embodiments, the third circuit board 563 and the first circuit board 561 may also be independent circuit boards, that is, different circuit boards, and the wearing detection sensor 52 on the third circuit board 563 may also be electrically connected to the main circuit board 21 in other ways. The embodiments of the present application do not strictly limit this.

[0532] See also Figure 35 , Figure 35 yes Figure 4 A schematic diagram of a portion of the structure of the earphone 10 is shown.

[0533] In some embodiments, the main circuit board 21, antenna 6, and detection circuit board 56 are all located within the housing 1. The first circuit board 561 of the detection circuit board 56 is located between the antenna 6 and the housing 1. The first circuit board 561 has a touch sensor 54 on the side facing the housing 1. The touch sensor 54 is used to detect touch actions applied to the housing 1.

[0534] The first circuit board 561 can be fixed to the inner wall of the main shell 11 of the housing 1. The first circuit board 561 is positioned toward the back line 112 of the main shell 11. That is, when the earphones are worn, the first circuit board 561 faces away from the user's ears. In this embodiment, the touch sensor 54 is a capacitive sensor. The first circuit board 561 is positioned against the inner wall of the main shell 11 of the housing 1 and is located near the back line 112 of the main shell 11. Therefore, when the earphones are worn, it faces away from the user's ears and is exposed relative to the user's ears. When the user approaches or touches the back of the main shell 11, the touch sensor 54 can detect the user's touch action, thereby realizing human-computer interaction.

[0535] Among them, the first circuit board 561 can extend from the top space 111a of the main shell 11 to the bottom space 111c of the main shell 11. The area of ​​the first circuit board 561 is large, so that the touch sensor has a larger arrangement area, thereby being able to detect more diverse touch actions.

[0536] Exemplarily, the third circuit board 563 can be located in the top space 111a of the main shell 11. The third circuit board 563 can be fixed to the main shell 11, and the side of the third circuit board 563 facing the main shell 11 forms the wearing detection sensor 52. In this embodiment, the wearing detection sensor 52 is a capacitive sensor. When the user wears the earphones 10, the intertragic notch of the ear corresponds to the location of the wearing detection sensor 52. The wearing detection sensor 52 can detect whether the user's skin is in contact with the earphones 10, thereby cooperating to detect whether the earphones 10 are being worn. The detection accuracy of the wearing detection sensor 52 is high.

[0537] The earphone 10 uses the proximity sensor 51 and the wearing detection sensor 52 to determine whether the earphone 10 is being worn. For example, when both the proximity sensor 51 and the wearing detection sensor 52 detect that the earphone 10 is approaching or in contact with the user, the earphone 10 determines that it is being worn. If either sensor detects that the user is not approaching or in contact with the user, the earphone 10 determines that it is not being worn. Wearing detection of the earphone 10 can be a prerequisite for the touch sensor 54 to detect user touch operations. Only when the earphone 10 determines that it is being worn does the touch sensor 54 sense the user's touch operations.

[0538] Please refer to Figures 34A to 35The side of the touch sensor 54 used to detect user touch operations is the touch side, and the other side of the touch sensor 54 is the non-touch side. In this embodiment, the side of the touch sensor 54 facing the main housing 11 is the touch side, and the side of the touch sensor 54 facing away from the main housing 11 is the non-touch side. Since the antenna 6 is located on the non-touch side of the touch sensor 54 and the antenna 6 is a conductor structure, the antenna 6 can be used as a reference ground for the touch sensor 54 to shield clutter signals from the non-touch side of the touch sensor 54 (such as signals generated by devices on the main circuit board 21), thereby reducing or eliminating clutter signals from interfering with the signal of the touch sensor 54 and improving the accuracy of touch detection by the touch sensor 54. In addition, since the antenna 6 itself radiates high-frequency current and the touch sensor 54 senses low-frequency current, the antenna 6 has no effect on the touch detection of the touch sensor 54.

[0539] Exemplarily, the projection of antenna 6 on first circuit board 561 covers touch sensor 54, thereby providing a better reference ground for touch sensor 54 and improving the detection accuracy of touch sensor 54. It is understood that the projection of antenna 6 on first circuit board 561 "covers" touch sensor 54 in two ways: "complete coverage" and "substantial coverage." "Substantial coverage" is considered to be achieved when the projection of antenna 6 covers more than 80% of touch sensor 54. Specifically, the coverage of touch sensor 54 by antenna 6 primarily refers to the coverage of touch sensor 54 by the radiating portion of antenna 6. In locations where touch sensor 54 may be subject to concentrated interference sources, the radiating portion of antenna 6 should provide as complete coverage of touch sensor 54 as possible.

[0540] In this embodiment, antenna 6 is used for both transmitting and receiving radio frequency signals and providing a reference ground for touch sensor 54. Based on the relative positions of main housing 11, touch sensor 54, and antenna 6, antenna 6 in this embodiment of the present application utilizes a single structure to achieve two functions: wireless communication with earphone 10 and a reference ground for touch sensor 54, thereby shielding clutter signals and improving touch detection accuracy.

[0541] In this embodiment, the touch sensor 54 and antenna 6 of the headset 10 coexist in the same spatial area, minimizing space occupation and facilitating miniaturization of the headset 10. Furthermore, the radiation area of ​​the antenna 6 and the touch control area of ​​the touch sensor 54 can be implemented within the same area of ​​the main housing 11. Given a fixed volume of the main housing 11, both the radiation area of ​​the antenna 6 and the touch control area of ​​the touch sensor 54 can occupy larger areas. This allows the headset 10 to achieve better antenna 6 transceiver performance while also enabling detection of a wider variety of touch operations.

[0542] Illustratively, the touch sensor 54 includes at least three touch blocks 541 arranged in a strip-shaped touch area and spaced apart from each other. The strip-shaped touch area extends in the same direction as the antenna 6. In this case, the touch sensor 54 is a slider sensor structure. When the capacitance of the at least three touch blocks 541 changes sequentially, it can be determined that the user has applied a sliding action. The touch sensor 54 can also detect user actions such as single clicks, double clicks, and long presses.

[0543] The provision of at least three touch blocks 541 can prevent the user from simultaneously touching two touch blocks 541 and misjudging a sliding action. For example, the spacing between two adjacent touch blocks 541 can be within a range of 0.5 mm to 2 mm. Conversely, if the spacing between two adjacent touch blocks 541 is too small, false touches are more likely to occur. If the spacing between two adjacent touch blocks 541 is too large, the user may not be able to touch the touch block 541, resulting in low touch efficiency.

[0544] When the touch sensor 54 includes a plurality of touch blocks 541 , the projection of the antenna 6 on the first circuit board 561 “substantially covers” the touch sensor 54 , and should cover more than 80% of the area of ​​each touch block 541 .

[0545] Please combine Figure 36 , Figure 36 yes Figure 34A A partial structural diagram of the first circuit board 561 is shown.

[0546] In some embodiments, the first circuit board 561 includes an insulating layer 5611 and a conductive layer 5612 stacked together. The conductive layer 5612 is located on the side of the insulating layer 5611 facing the housing 1 (see FIG. Figure 35 ), that is, on the side facing away from the antenna 6, the conductive layer 5612 includes the touch sensor 54, and the conductive layer 5612 may include at least three touch blocks 541. The insulating layer 5611 may be a polyimide (PI) layer, and the conductive layer 5612 may be a copper foil layer.

[0547] For example, the first circuit board 561 can be a single-layer structure, that is, the number of conductive layers of the first circuit board 561 is one, so as to have a small thickness while forming the touch sensor 54. In other embodiments, the positions of the insulating layer 5611 and the conductive layer 5612 of the first circuit board 561 can be interchanged; in other embodiments, the number of insulating layers of the first circuit board 561 can also be two, located on both sides of the conductive layer 5612.

[0548] For example, Figure 34AAs shown, the main circuit board 21 is located on the side of the antenna 6 facing away from the first circuit board 561. The processor on the main circuit board 21 (which can be integrated into the main control chip 211) is electrically connected to the multiple touch blocks 541 of the touch sensor 54. Among them, one end of the second circuit board 562 is connected to the first circuit board 561, and the other end is connected to the main circuit board 21. The multiple touch blocks 541 can be electrically connected to the main circuit board 21 via the second circuit board 562. Among them, the processor can determine the user's touch operation based on the corresponding changes in the capacitance values ​​of the multiple touch blocks 541. In some other embodiments, a detection circuit can also be set on the main circuit board 21. The detection circuit is connected in series between the multiple touch blocks 541 and the processor. The detection circuit is used to perform preliminary processing on the electrical signals of the multiple touch blocks 541 to reduce the amount of calculation required by the processor.

[0549] Among them, the earphone 10 also includes a high-frequency blocking circuit 5621, which is connected in series between the multiple touch blocks 541 and the processor. Exemplarily, the high-frequency blocking circuit 5621 can be fixed and electrically connected to the second circuit board 562. The high-frequency blocking circuit 5621 generally adopts an inductive Choke circuit, and each touch block 541 is connected to the main circuit board 21 after passing through the high-frequency blocking circuit 5621. Among them, the low-frequency signal generated by the touch sensor 54 during the touch detection process can be transmitted to the processor through the high-frequency blocking circuit 5621. The antenna 6 of the earphone 10 usually operates in the high-frequency Bluetooth frequency band, so the high-frequency blocking circuit 5621 can block the antenna 6 signal from forming a path on the multiple touch blocks 541, thereby eliminating the coupling effect of the multiple touch blocks 541 on the antenna 6, so as to ensure that the receiving and transmitting performance of the antenna 6 is not affected or is less affected.

[0550] See also Figure 37 , Figure 37 yes Figure 34A Schematic diagrams of the structures of the first circuit board 561 and the antenna 6 in other embodiments are shown.

[0551] In some embodiments, when the antenna 6 does not include the second metal member 63, or when the radiating area of ​​the antenna 6 is not large enough, the projection of the antenna 6 on the first circuit board 561 may not cover a portion of the touch blocks 541 of the touch sensor 54. In this case, a second conductive layer 5613 corresponding to the portion of the touch blocks 541 and serving as a reference ground can be provided on the first circuit board 561. In this case, the second conductive layer 5613 and the antenna 6 are substantially staggered.

[0552] Illustratively, the first circuit board 561 includes a stacked conductive layer 5612, an insulating layer 5611, and a second conductive layer 5613. The conductive layer 5612 is located on the side of the insulating layer 5611 facing the housing 1 and includes the touch sensor 54. The second conductive layer 5613 is located on the side of the insulating layer 5611 facing away from the housing 1. The projection of the antenna 6 on the first circuit board 561 covers a portion of the touch sensor 54, while the second conductive layer 5613 covers another portion of the touch sensor 54. In this case, the second conductive layer 5613 can provide a reference ground for the touch sensor 54. In this embodiment, the second conductive layer 5613 comprises only one layer, and its area is significantly smaller than that of the insulating layer 5611. This allows the overall thickness of the first circuit board 561 to remain very thin, simplifying installation.

[0553] Please refer to Figure 35 and Figure 38 , Figure 38 yes Figure 35 The schematic diagram of the structure of the detection circuit board 56 and the related adhesive layer is shown.

[0554] In some embodiments, the first circuit board 561 of the detection circuit board 56 can be fixedly connected to the inner wall of the main housing 11 via a hot melt adhesive film 564, and the third circuit board 563 can be fixedly connected to the inner wall of the main housing 11 via double-sided adhesive tape 565. Other parts of the detection circuit board 56 can also be fixedly connected to the inner wall of the main housing 11 via double-sided adhesive tape. The area of ​​the main housing 11 for the third circuit board 563 is located near the first opening 1131, and the first opening 1131 has a large opening area, making it easier to adhere. This allows the third circuit board 563 to be easily and tightly attached to the main housing 11 in one go using the double-sided adhesive tape 565. The first circuit board 561 is relatively long and needs to be extended from the top space 111a of the main shell 11 to the bottom space 111c of the main shell 11 during assembly. By using the hot melt adhesive film 564 to fix it, the first circuit board 561 can be first extended into the main shell 11 during the assembly process, and no mis-bonding will occur during the process. After the first circuit board 561 is extended into place, the hot melt adhesive film 564 is heated (for example, to 80 or 90 degrees) so that the first circuit board 561 is bonded to the main shell 11. The semi-molten state of the hot melt adhesive film 564 can better absorb the gap between the first circuit board 561 and the main shell 11, and the fit between the two is better. During the assembly process of the earphone 10, the detection circuit board 56 can be installed in the main shell 11 first, and then the main circuit board 21 can be installed. Then, the detection circuit board 56 is snapped onto the main circuit board 21 to achieve electrical connection.

[0555] Regarding the main housing 113 of the earphone 10, the first contact 71, the second contact 72, the sixth component 46 of the audio auxiliary component 4, and the third microphone 34:

[0556] Please refer to Figure 6 、 Figure 39 as well as Figure 40 , Figure 39 yes Figure 6 The schematic diagram of the partial structure of the main shell 113 is shown. Figure 40 yes Figure 6 Another partial structural diagram of the main housing 113 is shown.

[0557] In some embodiments, the main housing member 113 of the main housing 11 further has a first mounting slot 1137, a second mounting slot 1138, and a third mounting slot 1139. The third mounting slot 1139 is located at or near the center of the bottom 113c of the main housing member 113. The first mounting slot 1137 and the second mounting slot 1138 are located at the bottom 113c of the main housing member 113, respectively, on either side of the third mounting slot 1139. The first mounting slot 1137 and the second mounting slot 1138 can be symmetrically arranged relative to the center plane 10c of the earphone 10.

[0558] like Figure 39 As shown, for example, the first mounting groove 1137 may include a recessed portion 1137a and a connecting portion 1137b. The opening of the recessed portion 1137a is located on the outer surface of the main housing 113, and the connecting portion 1137b connects the recessed portion 1137a with the inner space of the main housing 113. The shape of the recessed portion 1137a may be roughly oval (also referred to as a runway shape). A first protrusion 1137c and a second protrusion 1137d may be provided on the bottom wall of the recessed portion 1137a. The first protrusion 1137c is provided around the connecting portion 1137b, and the second protrusion 1137d is provided spaced apart from the first protrusion 1137c. There may be two second protrusions 1137d, one on each side of the first protrusion 1137c. The shape of the second mounting groove 1138 may be the same as that of the first mounting groove 1137, and will not be further described here.

[0559] like Figure 40 As shown, the third mounting groove 1139 can include a first recessed portion 1139a, a second recessed portion 1139b, and a connecting portion 1139c that are sequentially connected. The first recessed portion 1139a can be roughly round (also known as a runway shape). The third mounting groove 1139 can also include two third recessed portions 1139d, both of which are connected to the first recessed portion 1139a and are located on either side of the first recessed portion 1139a.

[0560] See also Figure 41 , Figure 41 yes Figure 3 A schematic structural diagram of the first contact 71 of the earphone 10 is shown.

[0561] In some embodiments, the first contact 71 includes a main body 711 and an ejector portion 712, with the ejector portion 712 protruding from one side of the main body 711. The main body 711 may be generally oval (also referred to as a racetrack shape). A groove 713 may be provided on the side of the main body 711 facing the ejector portion 712, with the groove 713 being disposed adjacent to and surrounding the ejector portion 712.

[0562] The first contact 71 is made of a conductive material and can be an integrally formed structural member.

[0563] Please refer to Figure 3 and Figure 42 , Figure 42 yes Figure 3 A partial structural diagram of the sixth component 46 of the earphone 10 is shown.

[0564] In some embodiments, the sixth component 46 includes a fourth exterior mesh 461. The fourth exterior mesh 461 may include a main body 4611 and two protrusions 4612. The main body 4611 is provided with a plurality of through-holes 4613 to form a mesh structure. The main body 4611 may be generally round (also referred to as a racetrack shape). The two protrusions 4612 are fixed to the same side of the main body 4611 and are located at opposite ends of the main body 4611.

[0565] The fourth exterior mesh 461 can be a metal mesh to enhance the fashion sense and mechanical reliability of the earphones 10 and reduce the risk of external damage to components located behind the fourth exterior mesh 461. For example, it can prevent external sharp objects from piercing the earphones 10, thereby increasing the service life of the earphones 10. The fourth exterior mesh 461 can be an integrally formed structural component, for example, it can be stamped from a metal mesh. In other embodiments, the fourth exterior mesh 461 can also be made of plastic or other materials.

[0566] Please refer to Figures 43 to 45 , Figure 43 yes Figure 1A The internal structure diagram of part of the structure of the earphone 10 is shown. Figure 44 yes Figure 43 The enlarged view of the structure at A is shown. Figure 45 yes Figure 43 An enlarged view of the structure at position B is shown.

[0567] In some embodiments, part of the structure of the second flexible circuit board 23 is fixed to the bottom 113c of the main case 113. For example, the second part 233 of the second flexible circuit board 23 is fixed to the area of ​​the inner wall of the main case 113 corresponding to the third mounting groove 1139, the third part 234 of the second flexible circuit board 23 is fixed to the area of ​​the inner wall of the main case 113 corresponding to the first mounting groove 1137, and the fourth part 235 of the second flexible circuit board 23 is fixed to the area of ​​the inner wall of the main case 113 corresponding to the second mounting groove 1138.

[0568] For example, Figure 43 and Figure 44 As shown, the first contact 71 is mounted in the first mounting slot 1137 of the main housing 113 and is exposed relative to the main housing 113. The first contact 71 is fixed to and electrically connected to the third portion 234 of the second flexible circuit board 23. The main portion 711 of the first contact 71 is located in the recessed portion 1137a of the first mounting slot 1137, abutting against the second protrusion 1137d in the first mounting slot 1137. The ejector pin 712 of the first contact 71 extends through the connecting portion 1137b of the first mounting slot 1137 into the inner space of the main housing 113 and is soldered to the third portion 234 of the second flexible circuit board 23, achieving both fixation and electrical connection.

[0569] The bottom wall of the recessed portion 1137a of the first mounting groove 1137 can be fixed and sealed to the main body 711 of the first contact 71 via an adhesive layer 714. The first protrusion 1137c in the first mounting groove 1137 can face or partially extend into the groove 713 of the first contact 71, forming a sealed path with a curved portion. This improves the seal between the first contact 71 and the main housing 113, prevents external moisture from entering the inner space of the main housing 113 through the first mounting groove 1137, and ensures the sealing of the mainboard cavity 14c of the earphone 10.

[0570] The second contact 72 is mounted in the second mounting slot 1138 of the main housing 113 and is exposed relative to the main housing 113. The second contact 72 is fixed to and electrically connected to the fourth portion 235 of the second flexible circuit board 23. The connection structure between the second contact 72 and the main housing 113 and the fourth portion 235 of the second flexible circuit board 23 can be similar to the connection structure between the first contact 71 and the main housing 113 and the third portion 234 of the second flexible circuit board 23, and will not be further described here.

[0571] In this embodiment, the earphone 10 can be electrically connected to the charging box through the first contact 71 and the second contact 72 to achieve communication and charging.

[0572] For example, Figure 43 and Figure 45As shown, the fourth exterior net 461 is installed in the third mounting slot 1139 and is exposed relative to the main housing 113. The main body 4611 of the fourth exterior net 461 is located in the first recessed portion 1139a of the third mounting slot 1139, and the two protrusions 4612 of the fourth exterior net 461 extend into the third recessed portion 1139d of the third mounting slot 1139. The fourth exterior net 461 and the third mounting slot 1139 are secured and sealed by an adhesive layer 4614. The adhesive layer 4614 can be partially located between the main body 4611 of the fourth exterior net 461 and the wall surface of the first recessed portion 1139a of the third mounting slot 1139, and can also be partially located between the two protrusions 4612 of the fourth exterior net 461 and the wall surface of the third recessed portion 1139d of the third mounting slot 1139. This long, curved sealing path enhances sealing effectiveness. The plurality of through holes 4613 on the main body 4611 of the fourth exterior net 461 may be disposed directly opposite to the second recessed portion 1139 b of the third mounting slot 1139 .

[0573] Illustratively, the sixth component 46 may further include a baffle 462, one or more eighth meshes 463, and multiple adhesive layers. The baffle 462 may be mounted in the second recessed portion 1139b of the third mounting slot 1139 and secured to the bottom wall of the second recessed portion 1139b of the third mounting slot 1139 via the adhesive layer. The baffle 462 covers the connecting portion 1139c of the third mounting slot 1139. The baffle 462 defines a through hole 4621 that connects the first recessed portion 1139a of the third mounting slot 1139 with the connecting portion 1139c of the third mounting slot 1139.

[0574] One or more eighth meshes 463 are secured to the inner wall of the main housing 113 and cover the connecting portion 1139c of the third mounting slot 1139. If there are multiple eighth meshes 463, they can be stacked and secured to each other via an adhesive layer. The eighth meshes 463 can be secured to the inner wall of the main housing 113 via the adhesive layer. The eighth meshes 463 are used to prevent dust from outside the earphone 10 from entering the interior of the earphone 10 through the third mounting slot 1139.

[0575] The second portion 233 of the second flexible circuit board 23 is fixed to the side of the eighth mesh cloth 463 facing away from the main housing 113, and the third microphone 34 is fixed to the side of the second portion 233 of the second flexible circuit board 23 facing away from the eighth mesh cloth 463. The second portion 233 of the second flexible circuit board 23 is provided with a connecting hole 2331, which connects to the interior of the third microphone 34. The eighth mesh cloth 463 covers the connecting hole 2331. The eighth mesh cloth 463 is used to prevent dust from entering the third microphone 34.

[0576] The connecting hole 2331 of the second flexible circuit board 23 and the through hole 4621 of the baffle 462 are offset by two portions, and their projections on the eighth mesh 463 at least partially do not overlap. The through holes 4613 of the fourth exterior mesh 461, the through holes 4621 of the baffle 462, the connecting portion 1139c of the third mounting slot 1139, the eighth mesh 463, and the connecting hole 2331 of the second flexible circuit board 23 form a continuous, curved sound pickup channel. Sound outside the earphone 10 can pass through the sound pickup channel and enter the third microphone 34, where it is picked up.

[0577] In this embodiment, since the sound pickup channel is curved, it can prevent the sound outside the earphone 10 (such as wind sound) from directly entering the third microphone 34, thereby improving the windproof effect and thus improving the sound pickup accuracy of the third microphone 34.

[0578] Exemplarily, the periphery of the second part 233 of the second flexible circuit board 23 is sealed to the inner wall of the main shell 113, for example, by a sealing layer of glue, to prevent external moisture from entering the interior of the main shell 113, thereby ensuring the sealing of the mainboard cavity 14c of the earphone 10.

[0579] Please refer again Figure 3 and Figure 6 The earphones 10 may further include a battery holder 9, which may be mounted in the bottom space 111c of the main housing 11. The battery holder 9 cooperates with the main housing 113 to secure the battery 73, thereby improving the assembly stability of the battery 73. The battery holder 9 may also be used to support and / or secure the second flexible circuit board 23. The battery holder 9 may also be used to provide a support surface, which faces the front of the earphones 10. The support surface ma...

Claims

1. An earphone assembly, characterized in that: The earphone assembly includes an earphone and a charging box, the charging box includes a box body and a box cover, the box cover is rotatably connected to the box body, the box body includes a box shell and a box lining, the box lining has two earphone slots spaced apart, and the earphone slots are used to accommodate the earphones; The earphone slot includes a top slot and a bottom slot located on the box body, the top slot is used to place the earphone earbud, and the bottom slot is used to accommodate the earphone ear stem. The box body includes a top surface facing the box cover, and the openings of the top slot and the bottom slot are both located on the top surface of the box body, and the opening of the bottom slot is lower than the opening of the top slot. The box body includes a top surface facing the box cover, and the box cover includes a bottom surface facing the box body. When the charging box is closed, the top surface of the box body is opposite to the bottom surface of the box cover; The top surface of the box body is connected to the bottom surface of the box cover to form a parting surface of the charging box. The parting surface is inclined relative to the thickness direction of the charging box and is inclined relative to the height direction of the charging box.

2. The earphone assembly according to claim 1, wherein: The opening of the bottom groove is spaced apart from the opening of the top groove.

3. The earphone assembly according to claim 1 or 2, characterized in that: The lowest point of the bottom wall of the top groove is not lower than the lowest edge of the opening of the bottom groove.

4. The earphone assembly according to claim 1 or 2, characterized in that: The box body lining is fixed to the inner side of the box body shell, the box body lining has the top groove and the bottom groove, and the top of the box body lining is raised relative to the box body shell.

5. The earphone assembly according to claim 4, wherein: The top surface of the box shell is a plane, and the top surface of the box lining is a plane.

6. The earphone assembly according to claim 5, wherein: The charging box has a width direction, a thickness direction and a height direction that are perpendicular to each other. The top surface of the box shell is inclined relative to the thickness direction of the charging box and is inclined relative to the height direction of the charging box.

7. The earphone assembly according to claim 5 or 6, characterized in that: The charging box has a width direction, a thickness direction and a height direction that are perpendicular to each other. The top surface of the box body lining is inclined relative to the thickness direction of the charging box and is inclined relative to the height direction of the charging box.

8. The earphone assembly according to claim 1 or 2, characterized in that: The box body has a first end and a second end opposite to each other, and the box cover has a first end and a second end opposite to each other, the first end of the box cover is rotatably connected to the first end of the box body, and the second end of the box cover is away from the second end of the box body to open relative to the box body, or the second end of the box cover is close to the second end of the box body to close relative to the box body; The top groove is closer to the first end of the box body relative to the bottom groove; the first end of the box body is higher than the second end of the box body.

9. The earphone assembly according to claim 1 or 2, characterized in that: The charging box includes a magnet, which is fixed to the inner lining of the box body and located between the top groove and the bottom groove.

10. The earphone assembly according to claim 1 or 2, characterized in that: The charging box also includes a battery and a circuit board. The battery and the circuit board are fixed to the inner side of the box shell and are located below the box body lining. The circuit board is located below the bottom groove and the battery is located below the top groove.

11. The earphone assembly according to claim 1, wherein The charging box also includes a shaft assembly, which includes a shaft and a shaft bracket. The shaft bracket is fixed to the box body, and the box cover is rotatably connected to the shaft bracket through the shaft to rotatably connect to the box body.

12. The earphone assembly according to claim 11, wherein The charging box further includes a wireless charging coil, which is fixed inside the box body; The rotating shaft bracket includes a metal part and a plastic part, the plastic part is located between the metal part and the wireless charging coil, and the rotating shaft is plugged into the metal part.

13. The earphone assembly according to claim 11 or 12, characterized in that: The box cover includes a transfer block, and the transfer block is rotatably connected to the rotation shaft bracket via the rotation shaft; The box body is provided with a notch, and when the box cover is closed relative to the box body, the adapter block covers the notch.

14. The earphone assembly according to claim 13, wherein: The rotating shaft assembly further includes a decorative piece, which is fixed to the outer side of the adapter block and covers the outer side surface of the adapter block.

15. The earphone assembly according to claim 14, wherein: The decorative part is made of aluminum alloy.

16. The earphone assembly according to claim 14 or 15, characterized in that: The decorative component includes a first plate, a second plate and a third plate. The second plate and the third plate are respectively connected to the two ends of the first plate and are bent relative to the first plate. The first plate covers the outer side surface of the adapter block, and the rotating shaft is inserted into the second plate and the third plate.

17. The earphone assembly according to claim 13, wherein: The rotating shaft assembly further includes a torsion spring, one end of which is connected to the rotating shaft bracket, and the other end of which is connected to the adapter block.

18. The earphone assembly according to claim 1 or 2, characterized in that: The charging box includes a first electrode, a second electrode, a third electrode and a fourth electrode. The first electrode and the second electrode are at least partially located in one of the earphone slots, the third electrode and the fourth electrode are at least partially located in the other earphone slot, the second electrode and the third electrode are located between the first electrode and the fourth electrode, the first electrode and the third electrode have the same polarity, and the second electrode and the fourth electrode have the same polarity.

19. The earphone assembly according to claim 1 or 2, characterized in that: The earphone includes an ear bag and an ear rod, the ear rod includes a first end close to the ear bag and a second end away from the ear bag, and the outer contour of the ear rod is at least partially in a contracted state in the direction from the first end to the second end.

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