Circuit board, connector assembly and medical equipment

Abstract

The utility model discloses a circuit board, a connector assembly and medical equipment, and relates to the technical field of wave soldering. The circuit board comprises a circuit board main body, a first group of bonding pads and a second group of bonding pads; the first group of bonding pads comprises a composite bonding pad and first pin bonding pads, the composite bonding pad comprises a first main body and a second main body, and the first main body is positioned among the plurality of first pin bonding pads; the size of the second body in the first direction is equal to or larger than the overall size of all the first pin bonding pads in the direction, the first direction is suitable for being crossed with the solder backflow direction, and the composite bonding pad is used for being in signal connection with an electronic device and preventing redundant solder from flowing back during wave soldering. According to the utility model, the packaging structure of the circuit board is improved, the solder backflow is effectively prevented, the gap between the welding ring copper foils of the adjacent bonding pads is increased, the risk of short circuit caused by tin connection in wave-soldering is reduced, the first pass yield of wave-soldering is improved, the handling capacity of rework and maintenance is greatly reduced, and the production cost is saved.

Description

Technical Field

[0001] The utility model relates to the technical field of wave soldering, in particular to a circuit board, a connector assembly and medical equipment. Background Art

[0002] As electronic products tend to be miniaturized today, the distance between the pins of many plug-in components is less than 2mm, which undoubtedly increases the difficulty of soldering.

[0003] The circuit board pads of existing plug-in connectors are distributed in a circular shape on the substrate. When wave soldering is used, the substrate surface is relatively flat, and excess liquid tin will flow back to the soldering point, causing a tin short circuit. The pass rate of wave soldering is low, and many defective products need to be reworked and repaired. Utility Model Content

[0004] The main purpose of the utility model is to provide a circuit board, a connector assembly and a medical device, which aims to prevent excess liquid tin from flowing back to the welding point, reduce the risk of short circuit in wave soldering, improve the pass rate of wave soldering, reduce the processing volume of rework and repair, and save production costs.

[0005] To achieve the above objectives, the present invention provides a circuit board, comprising:

[0006] a circuit board body having opposing soldering and mounting surfaces;

[0007] a first group of pads disposed on the soldering surface of the circuit board body, the first group of pads comprising a composite pad respectively connected to pin signals of the electronic device and at least two first pin pads, the composite pad comprising a first body and a second body connected to the first body, the first body being located between the plurality of first pin pads, the second body having a size in a first direction equal to or greater than a size of all the first pin pads in the first direction, the first direction being adapted to intersect a direction of solder reflow, the composite pad being configured to connect to the electronic device signal and prevent excess solder from reflowing to the first pin pads; and

[0008] A second group of solder pads is provided on the mounting surface of the circuit board body. The second group of solder pads includes a plurality of second pin solder pads. The plurality of second pin solder pads are arranged at intervals on the mounting surface of the circuit board body and correspond one-to-one to and penetrate at least two of the first pin solder pads and the composite solder pad.

[0009] Optionally, the width of the first body gradually increases toward the second body, and the second body is fan-shaped and is arranged around a side of the first pin pad where excess solder flows out during wave soldering.

[0010] Optionally, the composite pad is in a T-shape as a whole.

[0011] Optionally, the surface of the composite pad is non-smooth or smooth.

[0012] Optionally, at least one of two adjacent first pin pads is provided with a first distance-increasing edge opposite to the other first pin pad, and the first distance-increasing edge is used to increase the gap between the two adjacent first pin pads.

[0013] Optionally, the plurality of first pin pads are arranged into two oppositely disposed sub-pad groups, one end of the first body extends into a region between the two sub-pad groups, and the second body is connected to the other end of the sub-pad group.

[0014] Optionally, both side edges of the first body are respectively arranged opposite to and parallel to the first distance-increasing edge of the first pin pad opposite thereto.

[0015] Optionally, the first distance-increasing edge is a straight edge or an arc edge.

[0016] Optionally, each of the first pin pads is provided with an extension portion extending in a direction not close to the first pin pad adjacent thereto, so as to increase the copper foil area of ​​the first pin pad.

[0017] Optionally, the width of the extension portion gradually decreases from a side close to the center of the first pin pad to a side away from the center of the first pin pad.

[0018] Optionally, at least one of the two adjacent second pin pads is provided with a second distance-increasing edge opposite to the other second pin pad, and the second distance-increasing edge is used to increase the gap between the two adjacent second pin pads.

[0019] Optionally, the second distance-increasing edge is a straight edge or an arc edge.

[0020] To achieve the above objectives, the present invention provides a connector assembly, comprising the above-mentioned circuit board and a connector soldered to the circuit board, wherein the circuit board comprises:

[0021] a circuit board body having opposing soldering and mounting surfaces;

[0022] a first group of pads disposed on the soldering surface of the circuit board body, the first group of pads comprising a composite pad respectively connected to pin signals of the electronic device and at least two first pin pads, the composite pad comprising a first body and a second body connected to the first body, the first body being located between the plurality of first pin pads, the second body having a size in a first direction equal to or greater than a size of all the first pin pads in the first direction, the first direction being adapted to intersect a direction of solder reflow, the composite pad being configured to connect to the electronic device signal and prevent excess solder from reflowing to the first pin pads; and

[0023] A second group of solder pads is provided on the mounting surface of the circuit board body. The second group of solder pads includes a plurality of second pin solder pads. The plurality of second pin solder pads are arranged at intervals on the mounting surface of the circuit board body and correspond one-to-one to and penetrate at least two of the first pin solder pads and the composite solder pad.

[0024] To achieve the above objectives, the present invention further provides a medical device comprising the connector assembly described above.

[0025] In the technical solution of the present utility model, the circuit board includes a circuit board body, a first group of solder pads and a second group of solder pads; the circuit board body has a relative welding surface and a mounting surface; the first group of solder pads is arranged on the welding surface of the circuit board body, the first group of solder pads includes a composite solder pad and at least two first pin solder pads respectively connected to the pin signals of the electronic device, the composite solder pad includes a first body and a second body connected to the first body, the first body is located between multiple first pin solder pads, the size of the second body in the first direction is equal to or greater than the overall size of all first pin solder pads in the first direction, the first direction is suitable for crossing the direction of solder reflow, the composite solder pad is used to connect to the electronic device signal and prevent excess liquid tin or other solder from reflowing to the first pin solder pad during wave soldering; the second group of solder pads is arranged on the mounting surface of the circuit board body, the second group of solder pads includes a plurality of second pin solder pads, and the plurality of second pin solder pads are arranged at intervals on the mounting surface of the circuit board body and correspond one-to-one to and pass through the at least two first pin solder pads and the composite solder pad. It can be understood that the utility model prevents excess liquid tin from flowing back to the first pin pad during wave soldering by arranging a composite solder pad on the soldering surface, effectively preventing excess liquid tin from flowing back to the soldering point, reducing the risk of short circuit in wave soldering, and improving the pass rate of wave soldering, thereby reducing the amount of rework and repair processing and saving production costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0027] Figure 1 This is a schematic structural diagram of the welding surface of an embodiment of a circuit board of the present invention;

[0028] Figure 2 This is a schematic structural diagram of the first group of pads on the welding surface of an embodiment of the circuit board of the present invention;

[0029] Figure 3 This is a schematic structural diagram of a first pin pad of a first group of pads on a soldering surface of an embodiment of a circuit board of the present invention;

[0030] Figure 4 This is a structural diagram of the mounting surface of an embodiment of the circuit board of the present invention;

[0031] Figure 5 This is a schematic structural diagram of the second group of pads on the mounting surface of an embodiment of the circuit board of the present invention;

[0032] Figure 6 This is a schematic structural diagram of the second pin pad of the second group of pads on the mounting surface of an embodiment of the circuit board of the present invention.

[0033] Description of Figure Numbers:

[0034] 10. Circuit board body; 20. First group of pads; 30. Second group of pads; 21. Composite pad; 22. First pin pad; 211. First body; 212. Second body; 31. Second pin pad; 221. First extended edge; 222. Extension; 311. Second extended edge; 301. Metallized through hole; 302. Solder ring; 303. Base material; 101. Wave soldering board direction mark; 102. Connector silk screen mark; 103. Green oil between pads.

[0035] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0036] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0037] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the various components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indications will also change accordingly.

[0038] In the description of this utility model, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections, electrical connections; direct connections, indirect connections through an intermediate medium, and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.

[0039] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of such features. In addition, if the meaning of "and / or" appearing in the full text is to include three parallel schemes, taking "A and / or B" as an example, it includes scheme A, or scheme B, or a scheme in which A and B are satisfied at the same time. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is mutually contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0040] The present invention provides a circuit board that can be used as a plug-in connector circuit board for medical equipment, etc., but is not limited here.

[0041] Reference Figures 1 to 6 In one embodiment of the present invention, the circuit board includes a circuit board body 10, a first set of pads 20, and a second set of pads 30; the circuit board body 10 has a relative welding surface and a mounting surface; Figures 1 to 3As shown, the first group of pads 20 is provided on the soldering surface of the circuit board body 10. The first group of pads 20 includes a composite pad 21 respectively connected to the pin signals of the electronic device and at least two first pin pads 22. The composite pad 21 includes a first body 211 and a second body 212 connected to the first body 211. The first body 211 is located between the plurality of first pin pads 22. The size of the second body 212 in the first direction is equal to or greater than the overall size of all the first pin pads 22 in the first direction. The first direction is suitable for crossing the direction of solder reflow such as liquid tin, that is, the second body 212 extends in a direction that can block solder reflow. The composite pad 21 is used to connect to the electronic device signal and prevent excess liquid tin from reflowing to the first pin pad 22 during wave soldering; as shown Figures 4 to 6 As shown, the second group of pads 30 is arranged on the mounting surface of the circuit board body 10, and the second group of pads 30 includes a plurality of second pin pads 31. The plurality of second pin pads 31 are arranged at intervals on the mounting surface of the circuit board body 10 and correspond one-to-one to and penetrate at least two first pin pads 22 and the composite pad 21. The through hole is a metallized through hole 301. The first pin pad 22 and the second pin pad 31 can both include a solder ring 302 and a substrate 303 arranged on the periphery of the solder ring 302. The shape of the solder ring 302 of each pad can be the same or different, which is not limited here.

[0042] In this embodiment, Figures 4 to 6 As shown, the circuit board main body 10 may be provided with connector silk screen identification 102, wave soldering board direction identification 101 and other identifications to facilitate the assembly and soldering of connectors, which helps to improve production efficiency. Specifically, the connector silk screen identification 102 may be a white oil silk screen for connector installation identification. The wave soldering board direction identification 101 may also be a white oil silk screen to indicate the direction of the board through wave soldering. The connector pins may be left out or processed to a suitable length according to the thickness of the circuit board, the wave soldering equipment may be set with suitable process parameters, the connector may be installed into the circuit board main body 10 according to the connector silk screen identification 102, and the wave soldering direction may be determined according to the wave soldering board direction identification 101, wherein the composite pad 21 is the last wave soldering pad relative to the other pads of the connector.

[0043] In this embodiment, the first group of solder pads 20 and the second group of solder pads 30 may be arranged in a ring shape, etc., and may be adapted and designed according to the structure of the specific connector pins, which is not limited here.

[0044] like Figure 2 As shown, the composite pad 21 is generally approximately T-shaped, etc., without limitation. The surface of the composite pad 21 may be smooth or non-smooth. The composite pad 21 has a larger overall area than a typical pad, providing signal connection and preventing liquid tin from reflowing. Furthermore, all pads mentioned herein may preferably be made of copper foil, without limitation.

[0045] It can be understood that the utility model prevents excess liquid tin from flowing back to the first pin pad 22 during wave soldering by arranging a composite solder pad 21 on the soldering surface, effectively preventing excess liquid tin from flowing back to the soldering point, reducing the risk of short circuit in wave soldering, and improving the pass rate of wave soldering, thereby reducing the amount of rework and repair processing and saving production costs.

[0046] In order to further enhance the effect of preventing excess liquid tin from reflowing, refer to Figure 2 Preferably, the width of the first body 211 gradually increases toward the direction approaching the second body 212, and the second body 212 is fan-shaped. The second body 212 is arranged around the side of the first pin pad 22 where excess liquid tin flows out during wave soldering, and the first direction can be set to be perpendicular to the direction of liquid tin flow during wave soldering, so that the second body 212 of the composite pad 21 can cover all reflow paths of the liquid tin, thereby cutting off the possibility of liquid tin reflow as much as possible, and effectively preventing the liquid tin from flowing back to the pin pad.

[0047] In existing technology, the multiple pads on the circuit board of the plug-in connector are arranged in a circular pattern on the substrate. The spacing between the pads is small, which easily causes solder shorts during wave soldering, which is also one of the factors affecting the first-pass yield of wave soldering. In addition, due to the small pad spacing, manual soldering is also prone to solder shorts, requiring maintenance, low efficiency, poor board cleanliness, and affecting reliability.

[0048] In this regard, the present invention also makes improvements to the structure of the pin pad, as follows:

[0049] Based on the aforementioned embodiment, further, at least one of the two adjacent first pin pads 22 is provided with a first distance-increasing edge 221 that is opposite to the other first pin pad 22. The first distance-increasing edge 221 is used to increase the gap between the two adjacent first pin pads 22. The first distance-increasing edge 221 can be a single straight edge or an arc edge, or can be composed of two or more edges connected together. By adopting such a structural arrangement, the present invention increases the distance between the two adjacent pin pads, effectively preventing the adjacent pads from connecting and causing a short circuit during wave soldering, further improving the wave soldering pass rate, reducing the amount of rework and repair processing, and saving production costs.

[0050] In this embodiment, the first distance-increasing edge 221 may be a cutting edge formed by copper cutting of the original circular pad, or may be directly processed into a pad with the distance-increasing edge, which is not limited here.

[0051] In order to ensure that the composite pad 21 has a better effect of preventing the liquid tin from reflowing, and at the same time make the distance between the first pin pads 22 as large as possible to reduce the risk of bridging tin there, further, as Figure 2 As shown, the plurality of first lead pads 22 are arranged into two opposing sub-pad groups. One end of the first body 211 extends into the area between the two sub-pad groups, and the second body 212 is connected to the other end of the sub-pad group. In this embodiment, both sides of the first body 211 are opposite and parallel to the first extended edge 221 of the first lead pad 22.

[0052] In one embodiment, combining Figures 1 to 3 , each of the first pin pads 22 is provided with an extension portion 222 extending in a direction not close to the adjacent first pin pad 22, so as to increase the copper foil area of ​​the first pin pad 22. In this embodiment, the width of the extension portion 222 can be gradually reduced from the side close to the center of the first pin pad 22 to the side away from the center of the first pin pad 22. In this way, the reliability of the signal connection between the pad and the pin of the electronic device can be ensured, and compared with the conventional circular pad structure, since the width of the first pin pad 22 in the extension portion 222 of the first pin pad 22 of this embodiment gradually decreases in the direction of its extension, and the adjacent first pin pad 22 can also be set in this way, it is beneficial to make the distance between the two pads at the extension portion 222 at a moderate size, which can further avoid the short circuit of the tin at this location and reduce the amount of material used.

[0053] The extension directions of the extension portions 222 of the two sub-pad groups may be opposite to each other. Figure 1 The extension part 222 of the sub-pad group at the bottom of the circuit board body 10 extends vertically downward and perpendicular to the horizontal direction. The width of the extension part 222 gradually decreases, and the edge part is a smooth transition arc. Figure 1 The extended portion 222 of the sub-pad group on the upper portion of the circuit board body 10 extends vertically upward, perpendicular to the horizontal direction. The width of the extended portion 222 gradually decreases, and the edges can also be smoothly rounded. Furthermore, the composite pad 21 can extend horizontally to the right, initially gradually increasing in width before transitioning to a T-shaped shape through a circular arc, thereby forming the aforementioned second body 212.

[0054] In this embodiment, the extension portion 222 may also be formed by cutting the original circular pad, or directly processed into a pad with the extension portion 222 , which is not limited here.

[0055] Similarly, in order to reduce the risk of soldering of two adjacent second pin pads 31, refer to Figures 5 and 6In one embodiment, at least one of the two adjacent second pin pads 31 may also be provided with a second distance-increasing edge 311 opposite to the other second pin pad 31. The second distance-increasing edge 311 is used to increase the gap between the two adjacent second pin pads 31. The second distance-increasing edge 311 may also be a straight edge or an arc edge.

[0056] In this embodiment, the second distance-increasing edge 311 may also be a cutting edge formed by copper cutting of the original circular pad, or may be directly processed into a pad with the distance-increasing edge, which is not limited here.

[0057] The present invention creates a composite solder pad 21 by cutting and extending the original solder pad, creating a pad that functions as both a signal connection and a solder pad that steals solder. The solder ring 302 of the extended and enlarged composite solder pad 21 has a larger copper foil area, similar to a "T"-shaped structure. It surrounds the other solder pads and is located behind them in the direction of wave soldering, allowing for solder stealing during soldering. During wave soldering, the larger copper foil uses tension to hold excess liquid tin, preventing it from flowing back into the connector pins and reducing the risk of short circuits during wave soldering. The cutout portion of each pin solder pad increases the distance from the other solder pads, which helps improve solder connection.

[0058] It is worth mentioning that the distance between the pads on the existing circuit board is too small, making it impossible to produce green oil. However, the first pin pad 22 and the second pin pad 31 on the circuit board of the utility model are cut. In addition to increasing the gap between the copper foils of the adjacent pin pad solder rings 302, it can also make the green oil 103 between the pads on the soldering surface of the circuit board body 10 and the green oil 103 between the pads on the mounting surface. Figure 2 and Figure 5 The utility model can further reduce the risk of short circuit in wave soldering by applying green oil between the solder pads.

[0059] In summary, the present invention provides a wraparound, fine-pitch plug-in connector with an anti-soldering circuit board packaging structure. The tail portion relative to the wave soldering direction is provided with a composite pad 21 that first gradually becomes larger and then suddenly changes to a "T" shape through an arc. The composite pad 21 has signal connection and solder stealing functions. Each pin pad is cut between its adjacent pin pads to increase the gap between the pads. In addition, the adjacent sides of each adjacent pin pad are cut to form a special-shaped pad extending in a specified direction, thereby increasing the gap between the pads at that location.

[0060] The present invention also proposes a connector assembly, which includes a circuit board and a connector soldered to the circuit board. The specific structure of the circuit board refers to the above-mentioned embodiment. Since the connector assembly proposed by the present invention includes all schemes of all embodiments of the above-mentioned circuit board, it has at least the same technical effects as the above-mentioned circuit board, which will not be elaborated here one by one.

[0061] The present invention also proposes a medical device, which includes a connector assembly. The specific structure of the connector assembly refers to the above-mentioned embodiment. Since the medical device proposed by the present invention includes all schemes of all embodiments of the above-mentioned connector assembly, it has at least the same technical effects as the above-mentioned connector assembly, which will not be elaborated here one by one.

[0062] The above description is merely an optional embodiment of the present invention and does not limit the patent scope of the present invention. All equivalent structural transformations made by utilizing the contents of the present invention specification and drawings under the inventive concept of the present invention, or direct / indirect application in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A circuit board, characterized in that: include: a circuit board body having opposing soldering and mounting surfaces; a first group of pads disposed on the soldering surface of the circuit board body, the first group of pads comprising a composite pad respectively connected to pin signals of the electronic device and at least two first pin pads, the composite pad comprising a first body and a second body connected to the first body, the first body being located between the plurality of first pin pads, the second body having a size in a first direction equal to or greater than a size of all the first pin pads in the first direction, the first direction being adapted to intersect a direction of solder reflow, the composite pad being configured to connect to the electronic device signal and prevent excess solder from reflowing to the first pin pads; and A second group of solder pads is provided on the mounting surface of the circuit board body. The second group of solder pads includes a plurality of second pin solder pads. The plurality of second pin solder pads are arranged at intervals on the mounting surface of the circuit board body and correspond one-to-one to and penetrate at least two of the first pin solder pads and the composite solder pad.

2. The circuit board according to claim 1, wherein: The width of the first body gradually increases toward the second body. The second body is fan-shaped and is arranged around a side of the first pin pad where excess solder flows out during wave soldering.

3. The circuit board according to claim 1, wherein: The composite pad is in a "T" shape as a whole.

4. The circuit board according to claim 1, wherein: The surface of the composite pad is non-smooth or smooth.

5. The circuit board according to claim 1, wherein: At least one of the two adjacent first pin pads is provided with a first distance-increasing edge opposite to the other first pin pad, and the first distance-increasing edge is used to increase the gap between the two adjacent first pin pads.

6. The circuit board according to claim 5, wherein: The first pin pads are arranged into two oppositely disposed sub-pad groups, one end of the first body extends into the area between the two sub-pad groups, and the second body is connected to the other end of the sub-pad group.

7. The circuit board according to claim 6, wherein: Both side edges of the first body are respectively opposite to and parallel to the first distance-increasing edge of the first pin pad.

8. The circuit board according to claim 5, wherein: The first distance-increasing edge is a straight edge or an arc edge.

9. The circuit board according to claim 1, wherein: Each of the first pin pads is provided with an extension portion extending in a direction not approaching the first pin pad adjacent thereto, so as to increase the copper foil area of ​​the first pin pad.

10. The circuit board according to claim 9, wherein: The width of the extension portion gradually decreases from a side close to the center of the first pin pad to a side away from the center of the first pin pad.

11. The circuit board according to claim 1, wherein: At least one of the two adjacent second pin pads is provided with a second distance-increasing edge opposite to the other second pin pad, and the second distance-increasing edge is used to increase the gap between the two adjacent second pin pads.

12. The circuit board according to claim 11, wherein: The second distance-increasing edge is a straight edge or an arc edge.

13. A connector assembly, characterized in that: It comprises a circuit board as described in any one of claims 1 to 12 and a connector soldered on the circuit board.

14. A medical device, characterized in that Comprising the connector assembly of claim 13.

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