Positioning die for improving alignment precision of air pump type riveting machine

Abstract

The utility model provides a positioning die for improving the alignment precision of an air pump type riveting machine. The positioning die is at least provided with a riveting machine working hole set and a PIN nail positioning hole set. The PIN nail positioning hole groups are arranged on the four side edges of the hard board, are distributed in a cross shape by taking the central point of the hard board as a reference, correspond to the PIN nail positioning hole groups on the board edges of the daughter boards and the prepregs in the multi-layer PCB, and are used for integrally aligning and fixing the positioning mold, the daughter boards and the prepregs in the multi-layer PCB and the like; the riveting machine working hole is arranged on the long edge of the hard board, and a first notch is formed in the edge of the riveting machine working hole and corresponds to a rivet alignment hole set arranged on the board edge of the multi-layer PCB, and it is guaranteed that all rivet alignment holes are fully exposed. And meanwhile, an impact head of the riveting machine can enter the working area of the riveting machine from the area of the first notch and is guided and adjusted to the corresponding rivet positioning hole to be riveted to be matched with the rivet positioning hole, so that the alignment precision of the riveting machine on the surface of the multi-layer PCB is improved.

Description

Technical Field

[0001] The utility model belongs to the field of PCB manufacturing, and more specifically relates to a positioning die for improving the alignment accuracy of an air pump type riveting machine. Background Art

[0002] PCBs (Printed Circuit Boards), also known as printed circuit boards, are important electronic components that support electronic components and enable electrical interconnection. With the rapid development and widespread use of integrated circuits, the types and applications of electronic devices have rapidly expanded, and electronic products have become more intelligent and miniaturized. To match this, PCB varieties are constantly being updated, the number of PCB layers is constantly increasing, and the number of circuits on PCBs is becoming more numerous and denser. In the prior art, a continuous lamination process is usually used to increase the circuit capacity within a PCB board. Specifically, the continuous lamination process is a process in which the inner layer boards required for the PCB are first manufactured through one or more lamination processes, and then multiple inner layer boards are pressed into an overall PCB at one time through a single lamination process. However, during the continuous lamination process of the PCB, since the inner layer boards have undergone the lamination process, the inner layer boards have a certain amount of expansion and contraction on their surface. Therefore, it is relatively easy for them to be offset and misaligned during the total lamination process to form a complete PCB board. In particular, when multiple inner layer boards are pressed together to form a high-layer PCB, when stacking the boards, it is easy for the number of inner layer boards to be too high and the stacking to result in poor alignment, thereby aggravating the offset or misalignment of each inner layer board in the subsequent lamination process, and further affecting the overall precision and reliability of the PCB. Therefore, during the continuous lamination process, it is necessary to pre-align the inner layer boards that make up the PCB to ensure the alignment accuracy of the PCB before the total lamination.

[0003] The traditional lamination process for multi-layer PCBs typically emphasizes the use of a pin-alignment system (PIN LAM) for fixed lamination. The rigidity of PINs improves the alignment and fixation of PCB layers during lamination. However, during the overall lamination process, this rigidity can also make it more susceptible to issues such as board warping, which can affect the thickness uniformity and reliability of the multi-layer PCB. Therefore, during the continuous lamination of a multi-layer PCB, to improve the alignment accuracy between the multiple inner layers and prepregs that comprise the PCB and prevent stacking slippage, pre-fusion or riveting is first performed on the PCB edges to pre-fix the layers. Pin-alignment systems are then used to secure the entire PCB before lamination. This ensures alignment during the continuous lamination of the multi-layer PCB and improves its reliability.

[0004] In the continuous pressing and positioning of multi-layer PCBs, rivet positioning is more stable and efficient than pre-fusion positioning. Furthermore, the rivet holes designed on the board edge are smaller, saving more board edge space. Hydraulic rivet machines or air pump rivet machines are commonly used for circuit board pressing and positioning, each with its own advantages and disadvantages. Hydraulic rivet machines are simple to operate and have high control precision. They do not require pre- or post-processing of the riveted workpiece and allow for interlayer and multi-layer connections within the workpiece. The connection points formed by riveting are firm and reliable, and the connection area is free of thermal stress, which will not damage the workpiece surface. However, they are generally large in size, making them prone to leakage, contamination, and noise. Furthermore, due to the high stamping speed during the riveting process, a high level of operator proficiency is required. Pressure shocks and uneven force distribution can lead to damage to the workpiece. Air pump rivet machines also have the advantages of not requiring pre- or post-processing of the riveted workpiece, allowing for interlayer and multi-layer connections within the workpiece, ensuring a strong and reliable connection point, and free of thermal stress in the connection area, which will not damage the workpiece surface. Furthermore, they offer high speed and efficiency during riveting, with minimal impact on the workpiece, less risk of damage, and no noise pollution or oil leakage during use, making them energy-efficient and environmentally friendly. However, air pump rivet machines have low transmission stability and are subject to certain limitations in stroke adjustment and riveting force. Therefore, when using an air pump rivet machine to align and fix multi-layer PCBs, it is necessary to employ some auxiliary devices to eliminate the air pump rivet machine's shortcomings in transmission stability and stroke accuracy, guide the air pump rivet machine to work at the appropriate location for riveting, improve the alignment accuracy of the air pump rivet machine, and thereby improve the connection alignment accuracy of the multi-layer PCB and ensure its reliability. Utility Model Content

[0005] The utility model aims to overcome at least one defect of the above-mentioned prior art and provide a positioning die for improving the positioning accuracy of an air pump riveting machine, thereby improving the positioning accuracy when an air pump riveting machine is used to align rivets on a PCB during the PCB pressing and manufacturing process.

[0006] The technical solution adopted by the utility model is to provide a positioning die for improving the positioning accuracy of an air pump riveting machine. The positioning die is a rectangular hard plate with a plurality of through holes formed on the hard plate. The holes at least include: a riveting machine working hole group and a PIN nail positioning hole group according to their functions;

[0007] The PIN positioning hole group includes four PIN positioning holes, which are arranged on four sides of the hard plate and are distributed in a cross shape with the center point of the hard plate as the reference;

[0008] The rivet machine working hole group includes four rivet machine working holes, which are arranged on the long side of the hard plate and symmetrically distributed with the center line of the hard plate as the reference; the rivet machine working holes form a first notch on the edge of the long side of the hard plate.

[0009] In this technical solution, the positioning mold is a rectangular rigid plate with a plurality of through-holes formed therein. The through-holes, depending on their functions, include at least a riveter working hole group and a PIN positioning hole group. During use, the positioning mold covers the surface of the multi-layer PCB, protecting the circuit distribution area on the multi-layer PCB surface while exposing the riveting connection area and PIN mating area at the board edge. The PIN mating area is used to align the positioning mold with the surface of the multi-layer PCB stacked structure, and the riveting connection area facilitates the engagement of the riveter and guides the rivet punch of the riveter to correctly align with the riveting point to be riveted, thereby improving the alignment accuracy of the air pump riveter. The PIN positioning hole groups are arranged on the four sides of the rigid plate and are arranged in a cross-shaped pattern with the center point of the rigid plate as the reference point. The PIN positioning hole groups correspond to the edges of each sub-board and prepreg in the multi-layer PCB, and are used to align and secure the positioning mold, each sub-board, and prepreg in the multi-layer PCB, thereby facilitating the riveting operation of the riveter on the aligned multi-layer PCB stacked structure. The rivet machine working holes are arranged on the long sides of the rigid board and are symmetrically distributed around the centerline of the rigid board. That is, there are at least four rivet machine working holes on the rigid board, corresponding to the rivet alignment hole groups set on the edge of the multi-layer PCB and ensuring that all rivet alignment holes are fully exposed. Preferably, at least one rivet alignment hole set on the edge of the multi-layer PCB is exposed within each rivet machine working hole, allowing the multi-layer PCB to be fixedly connected through the at least four rivet alignment holes set on the edge of the board, thereby improving the alignment accuracy and thickness uniformity of the multi-layer PCB. Furthermore, the rivet machine working hole is a first notch formed on the long edge of the rigid board. This first notch avoids the area on the surface of the multi-layer PCB where the circuit pattern is set, exposing only the edge of the multi-layer PCB. This allows the rivet machine's impact head to enter the rivet machine's working area from the area of ​​the first notch and be guided and adjusted to the corresponding rivet positioning hole to be riveted, thereby improving the alignment accuracy of the rivet machine on the surface of the multi-layer PCB. At the same time, the symmetrically arranged first notches symmetrically expose the long side edge areas of the multi-layer PCB. By symmetrically pressing the exposed long side areas, the positioning mold can be easily separated from the multi-layer PCB surface, so that the riveted multi-layer PCB stacking structure is evenly stressed during demoulding, thereby ensuring the connection stability and board surface flatness of the riveted multi-layer PCB stacking structure.

[0010] Furthermore, in order to improve the stability of the positioning mold and ensure the positioning accuracy of the positioning mold so that it can be firmly and flatly covered on the surface of the stacked structure of the multi-layer PCB, the thickness of the hard plate is set to be no less than 200 mil, thereby ensuring the mechanical properties of the positioning mold.

[0011] Preferably, in order to facilitate the entry of the impact head of the riveting machine and its stroke adjustment range, while ensuring that all rivet alignment holes set on the edge of the multi-layer PCB board are fully exposed, the length of the first notch located at the edge of the long side of the hard board is set to cover 50%-90% of the length of the long side of the hard board.

[0012] Preferably, the notch formed by the working hole of the rivet machine is in an arc shape. The arc shape is convenient for taking and cooperating with the impact head of the pre-rivet machine, which can better protect the circuit area on the surface of the multi-layer PCB and will not scratch the defense line of the board surface. Further preferably, in order to cooperate with the impact head of the air pump riveter machine and its stroke adjustment range, while ensuring that all rivet alignment holes set on the edge of the multi-layer PCB are fully exposed, the central angle corresponding to the arc shape is set to 120°-180°.

[0013] Optionally, in order to match the board size of the multi-layer PCB and cooperate with the impact head of the air pump riveter and its stroke adjustment range, the radius corresponding to the arc shape is set to 100-160 mil.

[0014] Optionally, in order to match the board size of the multi-layer PCB, cooperate with the impact head of the air pump riveter and its stroke adjustment range, and ensure the mechanical properties of the positioning mold, the spacing between the two riveter working holes set on the same side is 55-75mm.

[0015] Preferably, in order to match the board size of the multi-layer PCB and ensure the fixed connection performance of the positioning mold, the distance between the edge of the PIN positioning hole and the edge of the adjacent hard board is set to 5-20 mil.

[0016] Furthermore, in order to facilitate the removal of the positioning mold from the surface of the multi-layer PCB, a demolding hole group is also opened on the hard board, wherein the demolding hole group includes at least four demolding holes, and the demolding holes are arranged on the short side of the hard board, symmetrically distributed with the center line of the hard board as the reference, and the demolding holes form a second notch on the edge of the short side of the hard board; by setting the demolding hole group to cooperate with the working hole group of the rivet machine, a certain area is symmetrically exposed on the long side and short side of the positioning mold, and the positioning mold can be easily separated from the multi-layer PCB by symmetrically pressing the exposed areas of the long side and short side. At the same time, due to the symmetry of the pressing area, the long side and the short side can also be alternately pressed to demold, which further improves the uniformity of the force on the riveted multi-layer PCB stacked structure during demolding, and further ensures the connection stability and board surface flatness of the riveted multi-layer PCB stacked structure.

[0017] Preferably, to better protect the multi-layer PCB surface and prevent scratches on the board surface, the second notch is also configured to be arc-shaped. Optionally, to match the size of the multi-layer PCB board surface and facilitate simultaneous demolding by pressing the two second notch areas on the same side, the spacing between the two demolding holes on the same side is configured to be 50-70 mm.

[0018] Furthermore, to ensure the structural rigidity of the positioning mold while reducing its weight and facilitating its transfer and use, an auxiliary hole group is provided in the center of the rigid plate surface. This auxiliary hole group comprises a plurality of auxiliary holes arranged in an array, and the placement of the auxiliary hole group avoids the PIN positioning hole group, the rivet machine working hole group, and the demolding hole group. Preferably, the area of ​​the auxiliary hole group is configured to not exceed 60% of the total area of ​​the rigid plate. This ensures the positioning mold is sufficiently lightweight while also maintaining its rigidity and durability.

[0019] Furthermore, in order to facilitate the production of various through holes on the positioning mold, and at the same time provide a positioning reference for the stroke control of the air pump rivet machine during the use of the positioning mold, auxiliary targets are also provided on the hard plate. There are at least 3 auxiliary targets, and the auxiliary targets are set at the four corners of the hard plate and avoid the first notch and the second notch.

[0020] The beneficial effects of the utility model are:

[0021] 1. A positioning mold is provided to cover the surface of the laminated structure of the multi-layer PCB. The positioning mold is provided with at least a riveter working hole group and a PIN positioning hole group. When in use, the positioning mold covers the surface of the laminated structure of the multi-layer PCB, protecting the circuit distribution area on the surface of the multi-layer PCB while exposing the riveted connection area and PIN matching area of ​​the board edge. The PIN matching area is used to cover the positioning mold on the surface of the laminated structure of the multi-layer PCB and align it. The riveted connection area facilitates the cooperation with the riveter and guides the punch head of the riveter to correctly correspond to the riveting position to be riveted, thereby improving the alignment accuracy of the air pump riveter. Specifically, the working holes of the rivet machine are arranged on the long sides of the positioning mold and are symmetrically distributed with the center line of the positioning mold as the reference, that is, at least two mutually symmetrical working holes of the rivet machine are provided on the long sides of each hard plate of the positioning mold, corresponding to the rivet alignment hole group set on the edge of the multi-layer PCB and ensuring that all rivet alignment holes are fully exposed; at the same time, the working holes of the rivet machine are formed as a first notch on the edge of the long side of the positioning mold. The first notch avoids the area where the circuit pattern is set on the surface of the multi-layer PCB and only exposes the board edge of the multi-layer PCB, so that the impact head of the rivet machine can enter the working area of ​​the rivet machine from the area of ​​the first notch and be guided and adjusted to the corresponding rivet positioning hole to be riveted and cooperate, thereby improving the alignment accuracy of the rivet machine on the surface of the multi-layer PCB.

[0022] 2. The symmetrically arranged first notches symmetrically expose the long edge areas of the multi-layer PCB. By symmetrically pressing the exposed long edge areas, the positioning mold can be easily separated from the multi-layer PCB surface, so that the riveted multi-layer PCB stack structure is evenly stressed during demoulding, thereby ensuring the connection stability and board surface flatness of the riveted multi-layer PCB stack structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 The utility model is a structural schematic diagram of a positioning die for improving the alignment accuracy of an air pump riveting machine.

[0024] Figure 2 This is a schematic diagram of the structure of the positioning mold and the stacked structure of the multi-layer PCB in the present invention.

[0025] Reference numerals: positioning mold 10 , laminate structure 20 , rivet machine working hole 100 , PIN nail positioning hole 200 , demoulding hole 300 , auxiliary hole 400 , auxiliary target point 500 . DETAILED DESCRIPTION

[0026] The drawings in this utility model are for illustrative purposes only and are not to be construed as limiting the scope of this utility model. To better illustrate the following embodiments, some components in the drawings may be omitted, enlarged, or reduced in size, and do not represent the actual dimensions of the products. It is understandable to those skilled in the art that some well-known structures and their descriptions may be omitted from the drawings.

[0027] Example 1

[0028] like Figure 1-Figure 2 As shown, this embodiment provides a positioning mold 10 for improving the positioning accuracy of an air pump riveting machine. The positioning mold 10 is a rectangular hard plate with a plurality of through holes on the edge of the hard plate. The holes at least include: a riveting machine working hole group and a PIN positioning hole group, which are used to cover the surface of a multi-layer PCB, protecting the circuit distribution area on the surface of the multi-layer PCB while exposing the riveted connection area and the PIN matching area of ​​the board edge.

[0029] Specifically, the PIN positioning hole group includes four PIN positioning holes 200, which are arranged on the four sides of the hard board and are distributed in a cross shape with the center point of the hard board as the reference; the PIN positioning hole group corresponding to each sub-board and semi-cured sheet edge in the multi-layer PCB is used to align and fix the positioning mold 10 and each sub-board and semi-cured sheet in the multi-layer PCB as a whole, so as to facilitate the riveting machine to perform riveting operations on the aligned multi-layer PCB stacking structure 20.

[0030] The riveter working hole group 100 includes four riveter working holes 100. These holes are arranged along the long sides of the rigid board and are symmetrically distributed about the centerline of the rigid board, corresponding to the rivet alignment hole group set on the edge of the multi-layer PCB and ensuring that all rivet alignment holes are fully exposed. The riveter working holes 100 form a first notch on the long edge of the rigid board. This first notch facilitates the entry of the riveter's impact head into the riveter's working area, while guiding and adjusting it to the corresponding rivet positioning hole to be riveted, thereby improving the riveter's alignment accuracy on the multi-layer PCB surface. Furthermore, the symmetrical arrangement of the first notches symmetrically exposes the long edge areas of the multi-layer PCB. By symmetrically pressing the exposed long edge areas, the positioning mold 10 can be easily separated from the multi-layer PCB surface, ensuring uniform force on the riveted multi-layer PCB stack 20 during demolding, thereby ensuring the connection stability and board surface flatness of the riveted multi-layer PCB stack 20.

[0031] Furthermore, in order to ensure that the positioning mold 10 can be stably and evenly covered on the surface of the multi-layer PCB stacking structure 20, the thickness of the hard plate is set to be no less than 200 mil, thereby improving the use stability and positioning accuracy of the positioning mold 10.

[0032] Preferably, to facilitate the entry of the rivet machine's impact head and its stroke adjustment range, while ensuring full exposure of all rivet alignment holes set along the edge of the multi-layer PCB, the length of the first notch located along the long side of the rigid board is set to cover 50%-90% of the length of the rigid board's long side. Furthermore, preferably, the notch formed by the rivet machine's working hole 100 is arc-shaped, with the central angle of the arc set to 120°-180°.

[0033] Optionally, in order to match the board size of the multi-layer PCB and cooperate with the impact head of the air pump riveter and its stroke adjustment range, the radius corresponding to the arc is set to 100-160mil; preferably, in order to simultaneously ensure the mechanical properties of the positioning mold 10, the spacing between the two rivet machine working holes 100 set on the same side is 55-75mm.

[0034] Preferably, in order to match the board size of the multi-layer PCB and ensure the fixed connection performance of the positioning mold 10, the distance between the edge of the PIN positioning hole 200 and the edge of the adjacent hard board is set to 5-20 mil.

[0035] Furthermore, a group of demolding holes 300 is provided on the hard plate, wherein the demolding hole group includes at least four demolding holes 300, and the demolding holes 300 are arranged on the short side of the hard plate, symmetrically distributed with the center line of the hard plate as the reference, and the demolding holes 300 form a second notch on the edge of the short side of the hard plate; by providing the demolding hole group to cooperate with the working hole group of the rivet machine, by symmetrically pressing the exposed areas of the long side and the short side, preferably, the demolding can also be performed alternately from the long side and the short side, thereby further improving the uniformity of the force on the riveted multi-layer PCB stacked plate structure 20 during demolding, and further ensuring the connection stability and board surface flatness of the riveted multi-layer PCB stacked plate structure 20.

[0036] Preferably, the second notch is also arc-shaped. Optionally, to match the size of the multi-layer PCB and facilitate simultaneous pressing of the two second notch areas on the same side for demolding, the spacing between the two demolding holes 300 provided on the same side is set to 50-70 mm.

[0037] Furthermore, to ensure the structural rigidity of the positioning mold 10 while reducing its own weight and facilitating its transfer and use, an auxiliary hole group is provided in the center of the rigid panel. This auxiliary hole group comprises a plurality of auxiliary holes 400 arranged in an array, and the auxiliary hole group is positioned to avoid the PIN positioning hole group, the rivet machine working hole group, and the demolding hole group. Preferably, the area of ​​the auxiliary hole group is set so that it does not exceed 60% of the total area of ​​the rigid panel. This ensures that the positioning mold 10 is sufficiently lightweight while also maintaining its rigidity and durability.

[0038] Furthermore, in order to facilitate the production of various through holes on the positioning mold 10, and at the same time provide a positioning reference for the stroke control of the air pump rivet machine during the use of the positioning mold 10, auxiliary target points 500 are also provided on the hard plate. There are at least 3 auxiliary target points 500, and the auxiliary target points 500 are set at the four corners of the hard plate and avoid the first notch and the second notch.

[0039] Obviously, the above embodiments of the present invention are merely examples for the purpose of clearly illustrating the technical solution of the present invention, and are not intended to limit the specific implementation methods of the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the claims of the present invention shall be included within the scope of protection of the claims of the present invention.

Claims

1. A positioning die for improving the alignment accuracy of an air pump riveting machine, characterized in that: The positioning mold is a rectangular hard plate with a plurality of through holes formed thereon, which at least include: a riveting machine working hole group and a PIN nail positioning hole group according to their functions; The PIN positioning hole group includes four PIN positioning holes, which are arranged on four sides of the hard plate and are distributed in a cross shape with the center point of the hard plate as the reference; The rivet machine working hole group includes four rivet machine working holes, which are arranged on the long side of the hard plate and symmetrically distributed with the center line of the hard plate as the reference; the rivet machine working holes form a first notch on the edge of the long side of the hard plate.

2. The positioning mold according to claim 1, characterized in that: The thickness of the hard plate is not less than 200 mil.

3. The positioning mold according to claim 1, characterized in that: The length of the first notch located at the long side edge of the hard plate covers 50%-90% of the length of the long side of the hard plate.

4. The positioning mold according to claim 3, characterized in that: The notch formed by the working hole of the rivet machine is in an arc shape.

5. The positioning mold according to claim 4, characterized in that: The central angle of the arc is 120°-180°.

6. The positioning mold according to claim 1, characterized in that: The hard plate is also provided with a demolding hole group, which includes at least four demolding holes. The demolding holes are arranged on the short sides of the hard plate and are symmetrically distributed with the center line of the hard plate as the reference; the demolding holes form a second notch on the edge of the short side of the hard plate.

7. The positioning mold according to claim 6, characterized in that: The first notch and the second notch avoid the PIN positioning hole.

8. The positioning mold according to any one of claims 1 to 7, characterized in that: An auxiliary hole group is also provided in the center of the surface of the hard plate, and the auxiliary hole group includes a plurality of auxiliary holes arranged in an array; the setting position of the auxiliary hole group avoids the PIN nail positioning hole group, the rivet machine working hole group and the demoulding hole group.

9. The positioning mold according to claim 8, characterized in that: The setting area of ​​the auxiliary hole group does not exceed 60% of the entire area of ​​the hard plate.

10. The positioning mold according to any one of claims 6 to 7, characterized in that: Auxiliary target points are also provided on the hard plate. There are at least three auxiliary target points. The auxiliary target points are arranged at the four corners of the hard plate and avoid the first notch and the second notch.

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