RFID electronic tag device capable of providing stable fixation for chip

Abstract

The utility model discloses an RFID electronic tag device capable of providing stable fixation for a chip, relates to the technical field of electronic tag equipment, and aims to solve the problem of lack of stable fixation strength when a chip in an existing electronic tag is fixed. The pressing plate is installed in the upper cover body plate mechanism, rubber protection covers are arranged on one side of the pressing plate, the number of the rubber protection covers is three, inner cavities are formed in the three rubber protection covers correspondingly, strong telescopic springs are arranged in the inner cavities correspondingly, and the number of the strong telescopic springs is three. The two ends of the three powerful telescopic springs are fixedly connected with the inner wall of the upper cover body plate mechanism and one side of the pressing plate correspondingly.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic tag equipment, in particular to an RFID electronic tag device capable of providing stable fixation for a chip. Background Art

[0002] An electronic tag is also known as a radio frequency tag, transponder, or data carrier; a reader is also known as a readout device, scanner, reader head, communicator, or reader / writer (depending on whether the tag can be wirelessly rewritten). The radio frequency signal is spatially coupled (contactlessly) between the electronic tag and the reader via a coupling element. Within the coupling channel, energy transfer and data exchange are achieved based on timing relationships.

[0003] For example, the announcement number is CN209044673U, and the name of the Chinese authorized patent is (electronic tag identification device), which includes: a main body, an electronic tag and an identification code. When the main body is fixed to the object to be identified, the main body is in direct contact with the object to be identified. The main body has a reflective area. The electronic tag is arranged on the side of the main body away from the reflective area. The identification code is arranged in the reflective area, and the identification code and the electronic tag are both used to store information for identifying the object to be identified. When the environment in which the object to be identified is dim or the chip inside the electronic tag fails and cannot quickly identify the object to be identified, the reflective area has a reflective effect and can provide sufficient light to ensure that the object to be identified can be identified by the identification code set on the electronic tag.

[0004] However, the chip in the existing electronic tag has a problem of lacking stable fixing strength when being fixed; therefore, it does not meet the existing needs. In this regard, we propose an RFID electronic tag device that can provide stable fixing for the chip. Utility Model Content

[0005] The purpose of this utility model is to provide an RFID electronic tag device that can provide stable fixation for the chip, so as to solve the problem of the chip in the existing electronic tag lacking stable fixation strength when fixed in the background art.

[0006] To achieve the above objectives, the present invention provides the following technical solutions: an RFID electronic tag device capable of providing stable fixation for a chip, comprising: an upper cover plate mechanism and a lower cover plate mechanism, wherein both sides of the outer walls of the upper cover plate mechanism and the lower cover plate mechanism are provided with gripping areas, and the gripping areas are provided in two groups, and the two groups of gripping areas are respectively formed integrally with the upper cover plate mechanism and the lower cover plate mechanism;

[0007] Also includes:

[0008] A pressure plate is installed inside the upper cover plate mechanism, and a rubber protective cover is provided on one side of the pressure plate, and three rubber protective covers are provided, and an inner cavity is provided inside the three rubber protective covers, and a strong telescopic spring is provided inside the inner cavity, and three strong telescopic springs are provided, and the two ends of the three strong telescopic springs are respectively fixedly connected to the inner wall of the upper cover plate mechanism and one side of the pressure plate.

[0009] Preferably, an embedded cavity is provided inside the lower cover plate mechanism, a chip mechanism is provided inside the embedded cavity, a silicone heat dissipation layer is provided on the lower side of the embedded cavity, and the silicone heat dissipation layer is hot-melt connected to the inner wall of the lower cover plate mechanism.

[0010] Preferably, four connecting columns are provided at the four corners of the inner wall of the upper cover plate mechanism, and there are four connecting columns, and the four connecting columns are formed integrally with the upper cover plate mechanism.

[0011] Preferably, the four corners of the upper cover plate mechanism and the interior of the connecting column are all provided with first reserved installation holes, and the four corners of the lower cover plate mechanism are provided with second reserved installation holes.

[0012] Preferably, the four connecting columns are all installed inside the second installation reserved hole, and the upper cover plate mechanism is bolted to the lower cover plate mechanism through a hexagonal bolt, and one end of the hexagonal bolt passes through the first installation reserved hole and the connecting column and extends to the inside of the second installation reserved hole.

[0013] Preferably, a sealing strip is provided on the end surface of the lower cover plate mechanism, and the sealing strip is embedded in the end surface of the lower cover plate mechanism.

[0014] Compared with the prior art, the beneficial effects of the present invention are:

[0015] 1. The utility model adopts a pressure plate provided under the upper cover plate mechanism and a strong telescopic spring in the rubber protective cover. The chip mechanism is installed in the embedded cavity of the lower cover plate mechanism. The closed upper cover plate mechanism then compresses the strong telescopic spring on one side of the pressure plate, so that the pressure plate clamps the chip mechanism, providing a strong clamping fixation for the chip mechanism when it is fixed, effectively avoiding the problem of lack of stable fixing strength when the chip in the existing electronic tag is fixed.

[0016] 2. Through the connecting column set on the upper cover plate mechanism and the second mounting reserved hole set inside the lower cover plate mechanism, the connecting column on the upper cover plate mechanism is installed in the second mounting reserved hole of the lower cover plate mechanism, and then the hexagonal bolt is inserted through it to make the upper cover plate mechanism and the lower cover plate mechanism threadedly connected, maximizing the alignment of the external cover body and avoiding installation deviation. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0018] Figure 2 This is a schematic diagram of the separation structure of the upper cover plate mechanism and the lower cover plate mechanism of the present invention;

[0019] Figure 3 This is a schematic diagram of the internal structure of the lower cover plate mechanism of the present utility model;

[0020] Figure 4 This is a schematic diagram of the internal structure of A of the present utility model;

[0021] In the figure: 100, upper cover plate mechanism; 101, first reserved hole for installation; 102, hexagonal bolt; 103, rubber protective cover; 104, pressure plate; 105, inner cavity; 106, strong telescopic spring; 107, connecting column; 200, lower cover plate mechanism; 201, second reserved hole for installation; 202, embedded cavity; 203, silicone heat dissipation layer; 204, sealing strip; 300, gripping area; 400, chip mechanism. DETAILED DESCRIPTION

[0022] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0023] Example 1

[0024] See also Figure 1-4 The present invention provides an embodiment of an RFID electronic tag device capable of providing stable fixation for a chip, comprising: an upper cover plate mechanism 100 and a lower cover plate mechanism 200, wherein gripping areas 300 are provided on both sides of the outer walls of the upper cover plate mechanism 100 and the lower cover plate mechanism 200, and the gripping areas 300 are provided in two groups, and the two groups of gripping areas 300 are respectively formed integrally with the upper cover plate mechanism 100 and the lower cover plate mechanism 200;

[0025] Also includes:

[0026] The pressure plate 104 is installed inside the upper cover plate mechanism 100. A rubber protective cover 103 is provided on one side of the pressure plate 104, and there are three rubber protective covers 103. The three rubber protective covers 103 are each provided with an inner cavity 105 inside. The inner cavity 105 is each provided with a strong telescopic spring 106, and there are three strong telescopic springs 106. The two ends of the three strong telescopic springs 106 are respectively fixedly connected to the inner wall of the upper cover plate mechanism 100 and one side of the pressure plate 104.

[0027] The chip mechanism 400 is installed in the embedded cavity 202 of the lower cover plate mechanism 200, and then the closed upper cover plate mechanism 100 compresses the strong telescopic spring 106 on one side of the pressure plate 104, so that the pressure plate 104 clamps the chip mechanism 400, providing a strong clamping fixation for the chip mechanism 400 when it is fixed.

[0028] Example 2

[0029] See also Figure 2 and Figure 3 The lower cover plate mechanism 200 is provided with an embedded cavity 202, and the embedded cavity 202 is provided with a chip mechanism 400. A silicone heat dissipation layer 203 is provided on the lower side of the embedded cavity 202, and the silicone heat dissipation layer 203 is hot-melt connected to the inner wall of the lower cover plate mechanism 200. The four corners of the inner wall of the upper cover plate mechanism 100 are provided with connecting columns 107, and there are four connecting columns 107. The four connecting columns 107 are all formed integrally with the upper cover plate mechanism 100. The four corners of the upper cover plate mechanism 100 and the interior of the connecting columns 107 are provided with first installation reserved holes 101, and the four corners of the lower cover plate mechanism 200 are provided with second installation reserved holes 201.

[0030] The setting of the silicone heat dissipation layer 203 can evenly and quickly conduct the heat inside the device.

[0031] See also Figure 1 、 Figure 2 and Figure 3 The four connecting columns 107 are all installed inside the second installation reserved hole 201. The upper cover plate mechanism 100 is bolted to the lower cover plate mechanism 200 through the hexagonal bolt 102. One end of the hexagonal bolt 102 passes through the first installation reserved hole 101 and the connecting column 107 and extends to the inside of the second installation reserved hole 201. The end face of the lower cover plate mechanism 200 is provided with a sealing strip 204, and the sealing strip 204 is embedded in the end face of the lower cover plate mechanism 200.

[0032] The connecting column 107 extends into the second reserved installation hole 201, which can effectively fix the closed position of the upper cover plate mechanism 100 and the lower cover plate mechanism 200 to avoid deviation.

[0033] Working principle: Install the connecting column 107 on the upper cover plate mechanism 100 in the second mounting reserved hole 201 of the lower cover plate mechanism 200, and then insert the hexagonal bolt 102 to thread the upper cover plate mechanism 100 and the lower cover plate mechanism 200, and the chip mechanism 400 is installed in the embedded cavity 202 of the lower cover plate mechanism 200, and then the closed upper cover plate mechanism 100 compresses the strong telescopic spring 106 on one side of the pressure plate 104, so that the pressure plate 104 clamps the chip mechanism 400, providing a strong clamping fixation for the chip mechanism 400 when it is fixed.

[0034] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the present invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be encompassed within the present invention. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

Claims

1. An RFID electronic tag device capable of providing stable fixation for a chip, comprising an upper cover plate mechanism (100) and a lower cover plate mechanism (200), wherein both sides of the outer walls of the upper cover plate mechanism (100) and the lower cover plate mechanism (200) are provided with a gripping area (300), and the gripping area (300) is provided in two groups, and the two groups of the gripping areas (300) are respectively formed integrally with the upper cover plate mechanism (100) and the lower cover plate mechanism (200); Its characteristics are: Also includes: A pressure plate (104) is installed inside the upper cover plate mechanism (100), a rubber protective cover (103) is provided on one side of the pressure plate (104), and three rubber protective covers (103) are provided. An inner cavity (105) is provided inside each of the three rubber protective covers (103), and a strong telescopic spring (106) is provided inside each of the inner cavities (105). Three strong telescopic springs (106) are provided, and two ends of the three strong telescopic springs (106) are fixedly connected to the inner wall of the upper cover plate mechanism (100) and one side of the pressure plate (104), respectively.

2. The RFID electronic tag device capable of providing stable fixation of a chip according to claim 1, characterized in that: An embedded cavity (202) is provided inside the lower cover plate mechanism (200), a chip mechanism (400) is provided inside the embedded cavity (202), a silicone heat dissipation layer (203) is provided on the lower side of the embedded cavity (202), and the silicone heat dissipation layer (203) is connected to the inner wall of the lower cover plate mechanism (200) by thermal melting.

3. The RFID electronic tag device capable of providing stable fixation for a chip according to claim 1, characterized in that: Connecting columns (107) are provided at the four corners of the inner wall of the upper cover plate mechanism (100), and there are four connecting columns (107). The four connecting columns (107) are all formed integrally with the upper cover plate mechanism (100).

4. The RFID electronic tag device capable of providing stable fixation for a chip according to claim 1, characterized in that: The four corners of the upper cover plate mechanism (100) and the interior of the connecting column (107) are all provided with first reserved installation holes (101), and the four corners of the lower cover plate mechanism (200) are provided with second reserved installation holes (201).

5. The RFID electronic tag device capable of providing stable fixation for a chip according to claim 3, characterized in that: The four connecting columns (107) are all installed inside the second reserved installation hole (201), and the upper cover plate mechanism (100) is bolted to the lower cover plate mechanism (200) via a hexagonal bolt (102), and one end of the hexagonal bolt (102) passes through the first reserved installation hole (101) and the connecting column (107) and extends to the inside of the second reserved installation hole (201).

6. The RFID electronic tag device capable of providing stable fixation for a chip according to claim 1, characterized in that: The end surface of the lower cover plate mechanism (200) is provided with a sealing strip (204), and the sealing strip (204) is embedded in the end surface of the lower cover plate mechanism (200).

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