Anti-scratch structure for MIC (Microphone) rubber sleeve of mobile phone

Abstract

The utility model relates to an anti-scratch structure of a mobile phone MIC rubber sleeve. The anti-scratch structure comprises a middle frame body, an MIC rubber sleeve, a PCB, an outer frame body, a rear shell and an MIC device, a sound guide channel is formed in the bottom of the middle frame body, a rubber sleeve containing part is formed in the end face of one side of the sound guide channel, and the MIC rubber sleeve is installed in the rubber sleeve containing part; the PCB is arranged above the rubber sleeve accommodating part, and one side of the PCB abuts against one side of the middle frame body; an outer frame body is mounted above the PCB, and the rear shell covers the top of the middle frame body and the top of the outer frame body; the conveying middle frame body, the PCB, the outer frame body and the rear shell are enclosed to form an accommodating cavity, and the MIC device is accommodated in the accommodating cavity and fixedly mounted on the PCB; the side, abutting against the middle frame body, of the PCB is provided with a chamfer. According to the mobile phone MIC rubber sleeve scratch-resistant structure provided by the utility model, one side of the PCB is provided with the C-shaped chamfer, so that the rubber sleeve can be prevented from being damaged due to the fact that the edges and corners of the PCB rub the rubber sleeve.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic products, in particular to an anti-scratch structure of a mobile phone MIC rubber sleeve. Background Art

[0002] With the popularity of smart phones and the rapid development of science and technology, consumers' technical demands for smart phones are constantly increasing. In order to adapt to diverse application scenarios, the waterproof performance of mobile phones has become one of the important factors that many consumers cannot ignore when choosing smart phones.

[0003] To achieve waterproofing in smartphones, phone manufacturers have made improvements to the structure of their phones in three key areas: 1. Using precise molds and processes to minimize gaps between components, thereby preventing water intrusion; 2. Using waterproof membranes or breathable membranes to protect components that need to conduct sound, such as speakers and microphones; and 3. Using waterproof rubber rings and adhesives to seal the screen-to-frame seam, USB jack, and physical buttons. To prevent water from entering the microphone hole and damaging the device, a waterproof rubber ring is installed on the side of the sound channel near the device. The PCB board, which houses the device, is assembled to the phone frame at an angle. During installation, the PCB scratched the waterproof rubber ring, causing it to break, impacting sound quality and sealing. Utility Model Content

[0004] In order to overcome the deficiencies of the prior art, the utility model provides a scratch-proof structure for a mobile phone MIC rubber sleeve, which can solve the technical problem of the rubber sleeve being damaged by scratches during PCB board assembly and improve the assembly yield of mobile phones.

[0005] A mobile phone MIC rubber cover anti-scratch structure, comprising a middle frame, a MIC rubber cover, a PCB board, an outer frame, a back cover and a MIC device;

[0006] A sound guide channel is provided at the bottom of the middle frame, and a rubber sleeve receiving portion is provided on one end face of the sound guide channel, and the MIC rubber sleeve is installed in the rubber sleeve receiving portion; the PCB board is arranged above the rubber sleeve receiving portion, and one side of the PCB board is abutted against one side of the middle frame; an outer frame is installed above the PCB board, and the back shell covers the top of the middle frame and the outer frame; the middle frame, PCB board, outer frame and back shell together form a receiving cavity, and the MIC device is received in the receiving cavity and fixedly mounted on the PCB board; a chamfer is provided on the side of the PCB board abutting against the middle frame.

[0007] In one embodiment, the middle frame includes a main body at the bottom and a side extending vertically from one side of the main body toward the rear shell, and the chamfered slope faces the connection between the main body and the side of the middle frame.

[0008] In one embodiment, the extension width of the chamfer is greater than the length of the MIC rubber sleeve.

[0009] In one embodiment, the chamfer is a C-shaped chamfer, and the inclination angle of the chamfer is 45°.

[0010] In one embodiment, the length of the right-angle side of the chamfer is 0.3 mm.

[0011] In one embodiment, the edges of the PCB board at both ends of the chamfer are configured as arc surfaces.

[0012] In one embodiment, the sound guide channel includes a horizontal portion and a longitudinal portion, which are connected in an L-shape; and the rubber sleeve receiving portion is arranged on the end surface of the longitudinal portion.

[0013] In one embodiment, the MIC device is provided with a MIC hole, and the PCB board is provided with a sound guide hole. The MIC hole and the sound guide hole are opposite to the sound guide channel to form a sound guide passage.

[0014] In one embodiment, a dustproof net assembly is provided between the MIC rubber sleeve and the sound guide channel.

[0015] In one embodiment, the MIC rubber sleeve is a circular silicone sleeve.

[0016] The utility model provides a scratch-resistant structure for a mobile phone MIC rubber sleeve. A PCB is assembled with an intermediate frame via diagonal insertion. The waterproof rubber sleeve of the MIC device is positioned within the rubber sleeve receiving portion of the intermediate frame and sealed to the PCB after assembly. A C-shaped chamfer is provided on one side of the PCB assembly where the intermediate frame is assembled. During diagonal insertion, the chamfer and the main body of the intermediate frame move parallel to each other above the rubber sleeve, preventing the rubber sleeve from being scratched or damaged by the PCB's sharp edges, thereby maintaining the rubber sleeve's sealing and waterproof properties. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0018] Figure 1This is a schematic cross-sectional view of the anti-scratch structure of a mobile phone MIC rubber cover in one embodiment of the present invention;

[0019] Figure 2 This is a partial cross-sectional diagram of the anti-scratch structure of the mobile phone MIC rubber cover in one embodiment of the present utility model;

[0020] Figure 3 This is a schematic diagram of a portion of the PCB board of the anti-scratch structure of the mobile phone MIC rubber cover in one embodiment of the present invention at a certain viewing angle;

[0021] Figure 4 This is a schematic structural diagram of a MIC rubber sleeve in an embodiment of the present utility model. DETAILED DESCRIPTION

[0022] The following is a clear and complete description of the technical solutions in the embodiments of the present invention, in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts are within the scope of protection of the present invention.

[0023] In addition, the descriptions of "first", "second", etc. in the present invention are for descriptive purposes only and should not be understood as indicating or implying their relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of such features. In addition, the technical solutions between the various embodiments can be combined with each other, but this must be based on the fact that they can be implemented by ordinary technicians in this field. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0024] See also Figure 1 and Figure 2 , Figure 1 This is a schematic cross-sectional view of the anti-scratch structure of the mobile phone MIC rubber cover in one embodiment of the present invention. Figure 2 The figure is a partial cross-sectional diagram of the anti-scratch structure of the mobile phone MIC rubber cover in one embodiment of the present invention.

[0025] A mobile phone MIC rubber cover anti-scratch structure includes a middle frame 1, a MIC rubber cover 2, a PCB board 3, an outer frame 4, a back cover 5 and a MIC device 6;

[0026] A sound guide channel 11 is provided at the bottom of the middle frame 1, and a rubber sleeve receiving portion 12 is provided on one end face of the sound guide channel 11, and the MIC rubber sleeve 2 is installed in the rubber sleeve receiving portion 12; the PCB board 3 is arranged above the rubber sleeve receiving portion 12, and one side of the PCB board 3 is abutted against one side of the middle frame 1; an outer frame 4 is installed above the PCB board 3, and the back shell 5 covers the top of the middle frame 1 and the outer frame 4; the middle frame 1, PCB board 3, outer frame 4 and back shell 5 together form an accommodating cavity, and the MIC device 6 is accommodated in the accommodating cavity and fixedly mounted on the PCB board 3; a chamfer 31 is provided on the side of the PCB board 3 abutting against the middle frame 1.

[0027] Waterproof mobile phones are assembled using a submersible assembly process. This process involves a complex and sophisticated set of designs and techniques designed to keep the phone dry when exposed to water, preventing damage such as short circuits and corrosion. During assembly, the PCB board must be inserted into the phone at an angle and assembled with the middle frame. The waterproof rubber sleeve for the MIC device is installed near the point where the PCB and middle frame meet. Because the PCB has angular edges, the rubber sleeve can easily be scratched during the oblique insertion and movement of the PCB, causing damage. The present invention aims to address this issue.

[0028] In this embodiment of the present invention, the intermediate frame 1 includes a main body 13 at the bottom and a side 14 extending vertically from one side of the main body toward the rear housing. The cross-section of the connection between the main body 13 and the side 14 is L-shaped. The rubber sleeve receiving portion 12 is provided in the main body 13; the bottom of the PCB board 3 is sealed to the main body 13, and one side of the PCB board 3 abuts the side 14.

[0029] See also Figure 3 , Figure 3 This is a schematic diagram of the partial structure of the PCB board at a certain angle of view of the anti-scratch structure of the mobile phone MIC rubber cover in an embodiment of the present invention. In some possible implementation modes, a chamfer 31 is provided on the side where the PCB board 3 abuts the middle frame 1. The chamfer 31 is arranged at the bottom of the PCB board 3, and the inclined surface of the chamfer 31 faces the connection between the main part 13 and the side 14 of the middle frame 1.

[0030] The position of the chamfer 31 corresponds to the position of the rubber sleeve receiving portion 12. When the PCB board 3 is tilted to contact the middle frame 1, the tilt angle is the same as the angle of the chamfer 31. That is, the chamfer 31 and the main portion 13 of the middle frame 1 are in parallel contact with each other to prevent scratches on the MIC rubber sleeve 2 located in the rubber sleeve receiving portion 12. The extended width of the chamfer 31 is greater than the length of the MIC rubber sleeve 2, ensuring that the chamfer 31 can cover the range of the MIC rubber sleeve 2 during assembly, ensuring that the MIC rubber sleeve 2 is not worn by the sharp edges of the PCB board 3. Furthermore, the edges of the PCB board 3 at both ends of the chamfer 31 are configured as curved surfaces to reduce friction during the processing process while improving the appearance and feel of the part.

[0031] Chamfering refers to the process of cutting the edges and corners of a workpiece into a certain inclined surface. In this embodiment, the chamfer is a C-shaped (square) chamfer, and the inclination angle of the chamfer is 45°, that is, the two sides of the chamfer are equal in length. In some embodiments, the length of the right-angled side of the chamfer is 0.3 mm. In mechanical processing, the most common chamfer angle is 45°. The 45° chamfer performs well in removing burrs and facilitating assembly, so it is a standard angle. In other embodiments, the inclination angle of the chamfer can also be other angles, which can be adjusted according to the angle of the oblique insertion assembly of the PCB board. The length of the side of the chamfer is also adaptively adjusted with the angle.

[0032] See also Figure 4 , Figure 4 This is a schematic diagram of the structure of a MIC rubber sleeve in one embodiment of the present invention. In some embodiments, the MIC rubber sleeve 2 is a circular silicone sleeve with a circular rubber ring protrusion on the top. The bottom of the PCB board 3 is pressed against the silicone sleeve and forms an interference fit with the silicone sleeve, thereby achieving a sealing effect and ensuring tightness. In other embodiments, the MIC rubber sleeve 2 can have other shapes, which are not limited here.

[0033] In the present invention, the MIC device 6 is provided with a MIC hole 61, and the PCB board 3 is provided with a sound guide hole 32. The MIC hole 61 and the sound guide hole 32 are opposite to the sound guide channel 11 to form a sound guide passage. The MIC rubber sleeve 2 is arranged between the PCB board 3 and the sound guide channel 11 to seal the MIC device and prevent external moisture from invading through the sound guide channel, thereby ensuring sealing and waterproof properties. A dustproof net assembly 7 is also provided between the MIC rubber sleeve 2 and the sound guide channel 11. The two sides of the dustproof net assembly 7 are respectively sealed and connected to the end faces of the MIC rubber sleeve 2 and the sound guide channel 11 through adhesive backing. The sound guide channel 11 includes a horizontal part and a longitudinal part, which are connected in an L-shape; the rubber sleeve receiving portion 12 is arranged on the end face of the longitudinal part, and the other end of the horizontal part extends to the outside of the mobile phone. The sound guide channel with an L-shaped structure can further prevent dust and moisture from entering, thereby increasing the service life of the rubber sleeve and improving the sealing performance.

[0034] Compared to the prior art, the present invention provides a scratch-resistant structure for the MIC rubber sleeve of a mobile phone. The PCB board is assembled with the intermediate frame by oblique insertion. The waterproof rubber sleeve of the MIC device is arranged in the rubber sleeve receiving portion of the intermediate frame and is sealed with the PCB board after assembly. A C-shaped chamfer is provided on one side of the assembly where the PCB board and the intermediate frame are assembled. During the oblique insertion process, the chamfer is parallel to the main body of the intermediate frame to prevent the sharp corners of the PCB board from scratching the rubber sleeve, causing damage to the rubber sleeve and affecting its sealing and waterproof properties. The present invention provides a chamfer on one side of the PCB board, which can effectively protect the rubber sleeve, improve the rubber sleeve life, and increase the yield rate of mobile phones before delivery.

[0035] The above embodiments are only used to provide a detailed description of the technical solutions of the present application. However, the description of the above embodiments is only used to help understand the methods of the embodiments of the present application and should not be understood as limiting the present application. Any changes or substitutions that can be easily thought of by those skilled in the art should be included in the scope of protection of the embodiments of the present application.

Claims

1. A scratch-proof structure for a mobile phone MIC cover, characterized by: Including middle frame, MIC rubber sleeve, PCB board, outer frame, back cover and MIC device; A sound guide channel is provided at the bottom of the middle frame, and a rubber sleeve receiving portion is provided on one end face of the sound guide channel, and the MIC rubber sleeve is installed in the rubber sleeve receiving portion; the PCB board is arranged above the rubber sleeve receiving portion, and one side of the PCB board is abutted against one side of the middle frame; an outer frame is installed above the PCB board, and the back shell covers the top of the middle frame and the outer frame; the middle frame, PCB board, outer frame and back shell together form a receiving cavity, and the MIC device is received in the receiving cavity and fixedly mounted on the PCB board; a chamfer is provided on the side of the PCB board abutting against the middle frame.

2. The anti-scratch structure for a mobile phone MIC cover according to claim 1, characterized in that: The middle frame includes a main body at the bottom and a side extending vertically from one side of the main body toward the rear shell, and the chamfered slope faces the connection between the main body and the side of the middle frame.

3. The anti-scratch structure for a mobile phone MIC cover according to claim 1, characterized in that: The extended width of the chamfer is greater than the length of the MIC rubber sleeve.

4. The anti-scratch structure for a mobile phone MIC cover according to claim 1, characterized in that: The chamfer is a C-shaped chamfer, and the inclination angle of the chamfer is 45°.

5. The anti-scratch structure for a mobile phone MIC cover according to claim 4, characterized in that: The length of the right-angle side of the chamfer is 0.3 mm.

6. The anti-scratch structure for a mobile phone MIC cover according to claim 1, characterized in that: The edges of the PCB board at both ends of the chamfer are configured as arc surfaces.

7. The anti-scratch structure for a mobile phone MIC cover according to claim 1, characterized in that: The sound guide channel includes a horizontal part and a longitudinal part, which are connected in an L-shape; the rubber sleeve receiving portion is arranged on the end surface of the longitudinal part.

8. The anti-scratch structure for a mobile phone MIC cover according to claim 1, characterized in that: The MIC device is provided with a MIC hole, and the PCB board is provided with a sound guide hole. The MIC hole and the sound guide hole are opposite to the sound guide channel to form a sound guide passage.

9. The anti-scratch structure for a mobile phone MIC cover according to claim 1, characterized in that: A dustproof net component is provided between the MIC rubber sleeve and the sound guide channel.

10. The anti-scratch structure for a mobile phone MIC cover according to claim 1, characterized in that: The MIC rubber sleeve is a circular silicone sleeve.

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