Heat dissipation film and display device

Abstract

The utility model provides a heat dissipation film and a display device. The heat dissipation film comprises a heat conduction layer, a first sub-buffer layer and a second sub-buffer layer. Wherein the first sub-buffer layer is located on one side of the heat conduction layer, and the density of the first sub-buffer layer is smaller than that of the heat conduction layer. The second sub-buffer layer is located on the side, away from the heat conduction layer, of the first sub-buffer layer. The tensile modulus of the first sub-buffer layer is smaller than that of the heat conducting layer and larger than that of the second sub-buffer layer. The heat dissipation film has good heat conduction performance, and heat on one side of the second sub-buffer layer can be conducted out through the heat conduction layer, so that the internal temperature of the display device is reduced, and local overheating of the display device is prevented. In addition, the heat dissipation film further has good impact resistance and die mark resistance, meanwhile, the heat dissipation film has good strength and low weight, the overall weight of the display device can be reduced, and the portability and use comfort of the display device can be improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a heat dissipation film and a display device. Background Art

[0002] Heat dissipation films can conduct heat generated by the display device to the outside world, effectively reducing the operating temperature of the display device. Heat dissipation films can also provide mechanical protection for the display device, preventing the display device from deformation or damage under the influence of external forces.

[0003] The existing heat dissipation film is heavy, which increases the overall weight of the display device and affects the user's carrying experience. Utility Model Content

[0004] The present application provides a heat dissipation film and a display device.

[0005] A first aspect of an embodiment of the present application provides a heat dissipation film, comprising:

[0006] Thermal conductive layer;

[0007] a first sub-buffer layer, located on one side of the heat-conducting layer; the density of the first sub-buffer layer is less than the density of the heat-conducting layer;

[0008] The second sub-buffer layer is located on a side of the first sub-buffer layer away from the heat conducting layer; the tensile modulus of the first sub-buffer layer is smaller than the tensile modulus of the heat conducting layer and larger than the tensile modulus of the second sub-buffer layer.

[0009] In one embodiment, the thickness of the second sub-buffer layer is greater than the thickness of the first sub-buffer layer.

[0010] In one embodiment, the second sub-buffer layer is adhesive.

[0011] In one embodiment, the heat dissipation film further includes an adhesive layer located on a side of the first sub-buffer layer facing the heat conducting layer, and a tensile modulus of the adhesive layer is smaller than a tensile modulus of the heat conducting layer.

[0012] In one embodiment, the material of the adhesive layer is the same as that of the second sub-buffer layer.

[0013] In one embodiment, the thickness of the adhesive layer and the second sub-buffer layer is greater than the thickness of the first sub-buffer layer.

[0014] In one embodiment, the heat dissipation film includes two or more first sub-buffer layers located between the heat conductive layer and the second sub-buffer layer, and the adhesive layer is provided on a side of each first sub-buffer layer facing the heat conductive layer.

[0015] In one embodiment, the tensile modulus of the first sub-buffer layer is greater than 5 GPa; the tensile modulus of the second sub-buffer layer is in the range of 15 KPa to 30 KPa.

[0016] In one embodiment, the first sub-buffer layer is a polyimide buffer layer or a polyethylene terephthalate buffer layer; and the second sub-buffer layer is a silicone gel buffer layer.

[0017] In one embodiment, the thickness of the first sub-buffer layer ranges from 20 μm to 30 μm; the thickness of the second sub-buffer layer ranges from 120 μm to 135 μm.

[0018] In one embodiment, the tensile modulus of the thermally conductive layer is greater than 90 GPa.

[0019] In one embodiment, the thickness of the heat conducting layer ranges from 15 μm to 30 μm.

[0020] The second aspect of the present application provides a display device, which includes a display panel and the above-mentioned heat dissipation film, wherein the heat dissipation film is attached to the side of the display panel away from the light-emitting surface, and the second sub-buffer layer is located between the display panel and the first sub-buffer layer.

[0021] The heat dissipation film provided in the embodiments of the present application has excellent thermal conductivity, allowing heat from the second sub-buffer layer to be transferred through the thermally conductive layer, thereby reducing the internal temperature of the display device and preventing local overheating. The heat dissipation film also exhibits excellent impact resistance and mold resistance, while offering good strength and low weight, reducing the overall weight of the display device and improving its portability and user comfort.

[0022] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0024] Figure 1 A schematic structural diagram of a heat dissipation film provided in one embodiment of the present application;

[0025] Figure 2 A schematic structural diagram of a heat dissipation film provided in another embodiment of the present application;

[0026] Figure 3 A schematic structural diagram of a display device provided in one embodiment of the present application. DETAILED DESCRIPTION

[0027] Here, the technical solutions in the embodiments (or "implementations") of the present application will be clearly and completely described in conjunction with the accompanying drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements.

[0028] If there are terms related to directional indications or positional relationships in the embodiments of this application (such as up, down, left, right, front, back, inside, outside, top, bottom, center, vertical, horizontal, longitudinal, transverse, length, width, counterclockwise, clockwise, axial, radial, circumferential, etc.), such terms are only used to explain the relative positional relationship, movement, etc. between the components in a specific posture (as shown in the accompanying drawings); if the specific posture changes, the directional indication or positional relationship will also change accordingly. In addition, the terms "first" and "second" in the embodiments of this application are only used for the purpose of convenience of description and should not be understood as indicating or implying relative importance.

[0029] The heat dissipation film and the display device of the embodiment of the present application are described in detail below with reference to the accompanying drawings. In the absence of conflict, the features of the following embodiments and implementations can complement or be combined with each other.

[0030] The embodiment of the present application provides a heat dissipation film. Figure 1 As shown, the heat dissipation film 100 includes a heat conducting layer 10 , a first sub-buffer layer 11 and a second sub-buffer layer 12 .

[0031] The first sub-buffer layer 11 is located on one side of the thermal conductive layer 10, and the density of the first sub-buffer layer 11 is lower than that of the thermal conductive layer 10. The second sub-buffer layer 12 is located on a side of the first sub-buffer layer 11 away from the thermal conductive layer 10, and the tensile modulus of the first sub-buffer layer 11 is lower than that of the thermal conductive layer 10 and higher than that of the second sub-buffer layer 12.

[0032] The thermal conductive layer 10 is used to conduct heat to the outside. It also has a high density and tensile modulus, which can improve the anti-stenciling performance of the heat dissipation film 100. The second sub-buffer layer 12 has a low tensile modulus and greater flexibility, which can absorb more impact energy and improve the impact resistance of the heat dissipation film 100.

[0033] To achieve lightweight heat dissipation film 100, the thickness of thermal conductive layer 10 needs to be designed to be relatively thin. However, a thinner thermal conductive layer will reduce the strength of the heat dissipation film. Therefore, to ensure that the heat dissipation film is lightweight while maintaining sufficient strength, a first sub-buffer layer 11 is provided between the thermal conductive layer 10 and the second sub-buffer layer 12. The tensile modulus of the first sub-buffer layer 11 is between that of the thermal conductive layer 10 and the second sub-buffer layer 12. Therefore, the first sub-buffer layer 11 helps to enhance the strength of the heat dissipation film 100. Thus, while ensuring the strength of the heat dissipation film 100, the thickness of the stronger thermal conductive layer 10 can be reduced. Since the density of the first sub-buffer layer 11 is lower than that of the thermal conductive layer 10, it helps to reduce the overall weight of the heat dissipation film 100. In addition, the first sub-buffer layer 11 helps to enhance the impact resistance of the heat dissipation film 100.

[0034] The heat dissipation film 100 of the present application has excellent thermal conductivity, allowing heat from the second sub-buffer layer 12 to be conducted through the thermally conductive layer 10, thereby reducing the internal temperature of the display device and preventing local overheating. The heat dissipation film 100 also has excellent impact resistance and mold resistance, and possesses good strength and low weight, which can reduce the overall weight of the display device, thereby improving the portability and user comfort of the display device.

[0035] In one embodiment, the tensile modulus of the heat conducting layer 10 is greater than 90 GPa. When the heat conducting layer 10 has a higher tensile modulus, it is less likely to produce indentations under the action of external forces, which is beneficial to improving the anti-stenciling performance of the heat dissipation film 100.

[0036] In one embodiment, the heat-conducting layer 10 may be a copper foil layer. The copper foil layer has good thermal conductivity and high strength, which is beneficial to improving the heat dissipation performance and anti-mold capability of the heat dissipation film 100 .

[0037] In one embodiment, the thickness of the thermal conductive layer 10 ranges from 15 μm to 30 μm. This configuration ensures that the thermal conductive layer 10 not only has sufficient thermal conductivity and mechanical strength but also is lightweight, facilitating lightweighting of the heat dissipation film 100. In some embodiments, the thickness of the thermal conductive layer 10 can be 15 μm, 20 μm, 25 μm, 30 μm, etc.

[0038] In one embodiment, the tensile modulus of the first sub-buffer layer 11 is greater than 5 GPa. The first sub-buffer layer 11 has certain mechanical strength as well as certain flexibility and cushioning properties, which is beneficial to improving the anti-stenciling and impact resistance of the heat dissipation film 100.

[0039] In one embodiment, the first sub-buffer layer 11 is a polyimide buffer layer or a polyethylene terephthalate buffer layer. Specifically, the material of the first sub-buffer layer 11 is polyimide or polyethylene terephthalate. Polyimide or polyethylene terephthalate buffer layers possess certain strength and flexibility, as well as high thermal stability, which helps improve the overall performance of the heat dissipation film.

[0040] In one embodiment, the thickness of the first sub-buffer layer 11 ranges from 20 μm to 30 μm. This configuration avoids the first sub-buffer layer 11 being too thin, which would negatively impact the strength of the heat dissipation film, or the first sub-buffer layer 11 being too thick, which would result in a thicker heat dissipation film. Within this range, the first sub-buffer layer 11 can have a certain strength and flexibility while allowing the heat dissipation film 100 to be relatively thin. In some embodiments, the thickness of the first sub-buffer layer 11 can be 20 μm, 23 μm, 27 μm, 30 μm, etc.

[0041] In one embodiment, the tensile modulus of the second sub-buffer layer 12 ranges from 15 kPa to 30 kPa. This configuration provides the second buffer layer 12 with excellent flexibility and cushioning properties, effectively absorbing external shocks and vibrations and improving the impact resistance of the heat dissipation film 100. In some embodiments, the tensile modulus of the second sub-buffer layer 12 can be 15 kPa, 20 kPa, 25 kPa, 30 kPa, etc.

[0042] In one embodiment, the second sub-buffer layer 12 is adhesive. One side of the second sub-buffer layer 12 is bonded to the side of the first sub-buffer layer 11 away from the thermal conductive layer 10, and the other side is bonded to the display panel of the display device, thereby ensuring that the heat dissipation film 100 is closely attached to the display panel and improving heat dissipation efficiency.

[0043] In one embodiment, the second sub-buffer layer 12 is a silicone gel buffer layer. Specifically, the second sub-buffer layer 12 is made of silicone gel. The silicone gel buffer layer is flexible and can effectively absorb energy generated by external impacts, improving the impact resistance of the heat dissipation film. The silicone gel buffer layer also has adhesive properties, ensuring a tight fit between the heat dissipation film 100 and the display panel. Furthermore, the silicone gel buffer layer has excellent thermal stability, making it suitable for high-temperature environments.

[0044] In one embodiment, the thickness of the second sub-buffer layer 12 is greater than that of the first sub-buffer layer 11. The thicker second sub-buffer layer 12 provides better cushioning performance, absorbing more impact energy and reducing the impact of external impacts on the display device. The thinner first sub-buffer layer 11 improves the overall strength of the heat dissipation film without significantly increasing its weight. Furthermore, the thinner first sub-buffer layer 11 facilitates rapid heat conduction.

[0045] In one embodiment, the thickness of the second sub-buffer layer 12 ranges from 120 μm to 135 μm. When the thickness of the second sub-buffer layer 12 is larger, it has better buffering performance, which can prevent the display device from being damaged by external forces, and the thicker second sub-buffer layer 12 can adapt to uneven surfaces, so that the heat dissipation film and the display panel fit more closely. When the second sub-buffer layer 12 is sticky, the thicker second sub-buffer layer 12 can maintain good adhesion after long-term use and is not prone to falling off or peeling. In some embodiments, the thickness of the second sub-buffer layer 12 may be 120 μm, 125 μm, 130 μm, 135 μm, etc.

[0046] In one embodiment, Figure 1 As shown, the heat dissipation film 100 further includes an adhesive layer 13 located on the side of the first sub-buffer layer 11 facing the thermally conductive layer 10. The tensile modulus of the adhesive layer 13 is smaller than that of the thermally conductive layer 10. The adhesive layer 13 ensures tight adhesion between the thermally conductive layer 10 and the first sub-buffer layer 11, reducing the risk of delamination of the heat dissipation film. Furthermore, the adhesive layer 13 has a smaller tensile modulus, allowing it to better adapt to deformation when subjected to external forces, thereby reducing stress concentration in the heat dissipation film.

[0047] In one embodiment, the material of the bonding layer 13 is the same as the material of the second sub-buffer layer 12, so that the bonding effect between the bonding layer 13 and the first sub-buffer layer 11 is basically the same as the bonding effect between the second sub-buffer layer 12 and the first sub-buffer layer 11, thereby ensuring that the peeling force on both sides of the first sub-buffer layer 11 is basically the same, and the delamination or peeling of the heat dissipation film can be avoided.

[0048] In one embodiment, the thickness of the adhesive layer 13 and the second sub-buffer layer 12 are both greater than the thickness of the first sub-buffer layer 11. This can improve the adhesion between the first sub-buffer layer 11 and the thermal conductive layer 10, as well as the adhesion between the first sub-buffer layer 11 and the display panel, thereby preventing the heat dissipation film from delaminating or falling off the display panel.

[0049] In one embodiment, Figure 2As shown, the heat dissipation film 100 includes two or more first sub-buffer layers 11 located between the thermal conductive layer 10 and the second sub-buffer layer 12. Each first sub-buffer layer 11 is provided with the adhesive layer 13 on the side facing the thermal conductive layer 10. The multiple first sub-buffer layers 11 are connected by the adhesive layer 13. The first sub-buffer layer 11 closest to the thermal conductive layer 10 is bonded to the thermal conductive layer 10 via an adhesive layer, and the first sub-buffer layer 11 farthest from the thermal conductive layer 10 is bonded to the display panel of the display device via the second sub-buffer layer 12. The provision of multiple first sub-buffer layers 11 can increase the mechanical strength of the heat dissipation film 100 without significantly increasing the weight of the heat dissipation film 100, which is conducive to achieving lightweight heat dissipation film.

[0050] The present application tests multiple first sub-buffer layers, and the materials, thicknesses, and measured tensile moduli of the first sub-buffer layers are shown in Table 1.

[0051] Table 1

[0052] Serial number A B C D Thickness / μm 25±5 25±5 25±5 25±5 Material PET PET PI PET Tensile modulus / Gpa 1.5 5.19 8.5 6.7

[0053] In Table 1, the material of the first sub-buffer layer numbered A, B, and D is PET (Polyethylene Terephthalate) material; the material of the first sub-buffer layer numbered C is PI (Polyimide) material.

[0054] This application tests four different heat dissipation films, and the materials, thicknesses, and anti-printing capabilities of each film layer of the four heat dissipation films are shown in Table 2. The materials of the adhesive layer and the second sub-buffer layer of the four heat dissipation films are SEPA (silicone gel).

[0055] Table 2

[0056]

[0057]

[0058] Table 2 shows that in all four heat dissipation films, the thermal conductive layer is made of copper and has a thickness of 18 microns; the adhesive layer is made of silicone gel and has a thickness of 40 microns; the second sub-buffer layer is made of silicone gel and has a thickness of 100 microns; and the total thickness of the heat dissipation film is 183 microns. The first sub-buffer layers in the four heat dissipation films are the four first sub-buffer layers numbered A to D in Table 1. Table 2 shows that when the tensile modulus of the first sub-buffer layer is greater than 5 GPa, the heat dissipation film exhibits good anti-stenciling properties.

[0059] The embodiment of the present application also conducted a performance comparison test on the heat dissipation film in the related art and the heat dissipation film of the present application, and the test results are shown in Table 3.

[0060] Table 3

[0061]

[0062]

[0063] As shown in Table 3, the heat dissipation film of the related art consists solely of a thermally conductive layer made of copper and a second sub-buffer layer made of silicone gel. Compared to the heat dissipation film of the related art, the thermally conductive layer of the present application is thinner, and the total weight of the heat dissipation film of the present application is 2.62 grams lighter than the heat dissipation film of the related art. The test values ​​for the heat dissipation film of the present application in terms of mold resistance and ball drop resistance are both greater than those of the heat dissipation film of the related art, demonstrating that the heat dissipation film of the present application not only has a lighter weight but also exhibits excellent mold resistance and impact resistance.

[0064] The present application also provides a display device, such as Figure 3 As shown, the display device includes a display panel 200 and the aforementioned heat dissipation film 100. The heat dissipation film 100 is attached to the side of the display panel 200 away from the light-emitting surface. The second sub-buffer layer is located between the display panel and the first sub-buffer layer. The heat dissipation film 100 can conduct heat generated by the display panel during operation through the thermal conductive layer and dissipate it.

[0065] In one embodiment, Figure 3 As shown, a flexible circuit board 600 is provided on the side of the heat dissipation film 100 of the display device away from the display panel 200 , and a polarizer 300 , an optical adhesive layer 400 and a cover plate 500 are sequentially stacked on the side of the display panel 200 away from the heat dissipation film 100 .

[0066] This application does not impose any specific restrictions on the applicability of display devices. It can be any product or component with display function, such as televisions, laptops, tablets, wearable display devices, mobile phones, car displays, navigation, e-books, digital photo frames, advertising light boxes, etc.

[0067] It should be noted that the technical solutions or technical features described in the above embodiments can be combined or supplemented with each other without conflict. The scope of protection of this application is not limited to the precise structures described in the above embodiments and shown in the accompanying drawings; all modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of this application shall be included in the scope of protection of this application.

Claims

1. A heat dissipation film, characterized in that: The heat dissipation film comprises: Thermal conductive layer; a first sub-buffer layer, located on one side of the heat-conducting layer; the density of the first sub-buffer layer is less than the density of the heat-conducting layer; The second sub-buffer layer is located on a side of the first sub-buffer layer away from the heat conducting layer; the tensile modulus of the first sub-buffer layer is smaller than the tensile modulus of the heat conducting layer and larger than the tensile modulus of the second sub-buffer layer.

2. The heat dissipation film according to claim 1, wherein The thickness of the second sub-buffer layer is greater than that of the first sub-buffer layer.

3. The heat dissipation film according to claim 1, wherein The second sub-buffer layer has adhesiveness.

4. The heat dissipation film according to claim 1, wherein The heat dissipation film further includes an adhesive layer located on a side of the first sub-buffer layer facing the heat conducting layer, and a tensile modulus of the adhesive layer is smaller than a tensile modulus of the heat conducting layer.

5. The heat dissipation film according to claim 4, characterized in that The material of the bonding layer is the same as that of the second sub-buffer layer.

6. The heat dissipation film according to claim 5, characterized in that The thickness of the bonding layer and the second sub-buffer layer is greater than the thickness of the first sub-buffer layer.

7. The heat dissipation film according to claim 4, characterized in that The heat dissipation film includes two or more first sub-buffer layers located between the heat-conducting layer and the second sub-buffer layer, and the adhesive layer is provided on a side of each first sub-buffer layer facing the heat-conducting layer.

8. The heat dissipation film according to claim 1, wherein The tensile modulus of the first sub-buffer layer is greater than 5 GPa; the tensile modulus of the second sub-buffer layer is in the range of 15 KPa to 30 KPa.

9. The heat dissipation film according to claim 1, wherein The first sub-buffer layer is a polyimide buffer layer or a polyethylene terephthalate buffer layer; the second sub-buffer layer is a silicone gel buffer layer.

10. The heat dissipation film according to claim 1, wherein The thickness of the first sub-buffer layer ranges from 20 μm to 30 μm; the thickness of the second sub-buffer layer ranges from 120 μm to 135 μm.

11. The heat dissipation film according to claim 1, wherein The tensile modulus of the thermal conductive layer is greater than 90 GPa.

12. The heat dissipation film according to claim 1, wherein The thickness of the heat conducting layer ranges from 15 μm to 30 μm.

13. A display device, characterized in that: The display device includes a display panel and the heat dissipation film according to any one of claims 1 to 12, wherein the heat dissipation film is attached to a side of the display panel away from a light emitting surface, and the second sub-buffer layer is located between the display panel and the first sub-buffer layer.

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