Display panel, display device and mask plate assembly

By setting an isolation structure and pattern layer in the OLED display panel, the problem of short circuit of the light emitting device is solved, the reliability of the light emitting device and the yield of the lithography process are improved, and the preparation difficulty is reduced.

CN223298010UActive Publication Date: 2025-09-02BOE TECHNOLOGY GROUP CO LTD +1
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Patent Information

Application Number
CN202421986442.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-08-15
Publication Date
2025-09-02
Estimated Expiration
2034-08-15

AI Technical Summary

Technical Problem

The existing OLED display panels have reliability problems when the light-emitting device is lit, which is prone to short circuits, affecting the yield of the lithography process.

Method used

By providing an isolation structure in the display panel, including a first isolation pattern and a second isolation pattern, a first recessed structure is formed, and a light emitting functional layer is prevented from being connected to the conductive film layer, short circuit is avoided, and a first pattern layer and a second pattern layer are provided on the isolation pattern to control the etching speed and size, thereby improving the reliability of the light emitting device.

Benefits of technology

It effectively prevents short circuits of light emitting devices, improves the yield of the lithography process and the reliability of the light emitting devices, and reduces the difficulty of preparation.

✦ Generated by Eureka AI based on patent content.

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Abstract

The embodiment of the utility model provides a display panel, a display device and a mask plate assembly, relates to the technical field of display, and is used for improving the reliability when a light-emitting device is lightened. The display panel comprises a substrate, an isolation structure and a light emitting device. The isolation structure defines a pixel opening; the isolation structure comprises a first isolation pattern and a second isolation pattern; the first isolation pattern comprises a first part and a second part; the second part comprises a first edge part, and the first edge part extends in the direction close to the center line of the adjacent pixel opening relative to the first part. The light-emitting device is arranged in the pixel opening and comprises a first electrode, a first light-emitting function layer and a second electrode which are stacked in the direction away from the substrate, and the second electrode makes contact with and is electrically connected with the second isolation pattern; the light-emitting function layer is located between the plane where the surface, close to the substrate, of the first edge part is located and the first electrode. The display panel can be used for displaying.
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Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a display panel, a display device, and a mask assembly. Background Art

[0002] OLED (Organic Light Emitting Diode) display substrates are widely used in display screens such as mobile phones, tablets, and car displays due to their advantages such as full solid-state, fast response speed, and wide operating temperature range. Summary of the Invention

[0003] An object of the embodiments of the present disclosure is to provide a display panel, a display device, and a mask assembly for improving the reliability of a light-emitting device when it is illuminated.

[0004] To achieve the above objectives, the embodiments of the present disclosure provide the following technical solutions:

[0005] On the one hand, a display panel is provided. The display panel includes a substrate, an isolation structure, and a light-emitting device. The isolation structure is provided on the substrate; the isolation structure defines a pixel opening, and the isolation structure includes a first isolation pattern and a second isolation pattern stacked in a direction away from the substrate; the material of the first isolation pattern includes an insulating material, and the first isolation pattern includes a first portion and a second portion stacked in a direction away from the substrate; the second portion includes a first edge portion, and the first edge portion extends relative to the first portion in a direction close to the center line of the adjacent pixel opening. The light-emitting device is provided in the pixel opening, and includes a first electrode, a light-emitting functional layer, and a second electrode stacked in a direction away from the substrate, and the second electrode is in contact with and electrically connected to the second isolation pattern; along the first direction, the light-emitting functional layer is located between the plane where the surface of the first edge portion close to the substrate is located and the first electrode, and the first direction is the thickness direction of the substrate.

[0006] It can be understood that by configuring the second portion to include a first edge portion, and the first edge portion to extend relative to the first portion in a direction close to the center line of the adjacent pixel opening, a first recessed structure (also referred to as a first undercut structure) can be formed on the first isolation pattern. The material of the light-emitting functional layer has difficulty climbing the first recessed structure, so that the material of the light-emitting functional layer cannot completely fill the first recessed structure. In this way, along the first direction, the light-emitting functional layer can be confined between the plane where the surface of the first edge portion close to the substrate is located and the first electrode, preventing the light-emitting functional layer from connecting to the material of the conductive film layer distributed on the side of the first edge portion away from the substrate, and thus preventing current transmission between the light-emitting functional layer and the material of the conductive film layer located on the side of the first edge portion away from the substrate. In this way, even if the material of the conductive film layer distributed on the side of the first edge portion away from the substrate overlaps the second isolation pattern, it will not be electrically conductive to the first electrode. In this way, a short circuit between the first electrode and the second isolation pattern can be prevented, and the second electrode can be prevented from being unable to connect to the drive signal due to a short circuit. This can improve the reliability of the light-emitting device when it is illuminated, thereby improving the yield of the light-emitting device manufactured by the photolithography process.

[0007] In some embodiments, the display panel further comprises a first pattern layer. The first pattern layer is located on a side of the first edge portion away from the substrate. The light-emitting functional layer is made of the same material as the first pattern layer. The first pattern layer and the light-emitting functional layer are spaced apart in the first direction.

[0008] In some embodiments, the material of the first portion includes a first insulating material; the material of the second portion includes a second insulating material, and the first insulating material is different from the second insulating material.

[0009] In some embodiments, under the same etching conditions, an etching rate of the first insulating material is greater than an etching rate of the second insulating material.

[0010] In some embodiments, a dimension of the first portion along the first direction is greater than a dimension of the second portion along the first direction.

[0011] In some embodiments, the first isolation pattern further includes a third portion. The third portion is located between the first portion and the substrate, and includes a second edge portion. The second edge portion surrounds the centerline of the adjacent pixel opening and extends relative to the first portion toward the centerline of the pixel opening. A dimension of the first portion along the first direction is greater than a dimension of the third portion along the first direction.

[0012] In some embodiments, the material of the third portion is the same as the material of the second portion.

[0013] In some embodiments, an edge of the second edge portion is closer to a center line of an adjacent pixel opening than an edge of the first edge portion.

[0014] In some embodiments, the edge of the first portion close to the pixel opening covers the edge of the first electrode; or, the first isolation pattern further includes a third portion, and the edge of the second edge portion of the third portion close to the pixel opening covers the edge of the first electrode.

[0015] In some embodiments, the material of the first portion includes silicon nitride; and / or, the material of the second portion includes silicon oxide.

[0016] In some embodiments, the second isolation pattern includes a fourth portion and a fifth portion stacked in a direction away from the substrate. The fifth portion includes a plurality of third edge portions, the third edge portions surrounding the center lines of adjacent pixel openings and extending relative to the fourth portion toward the center lines of the adjacent pixel openings. The second electrode contacts and is electrically connected to the fourth portion.

[0017] In some embodiments, the display panel further includes a second pattern layer. The second pattern layer is located on a side of the third edge portion away from the substrate. The light-emitting functional layer is made of the same material as the second pattern layer. The first pattern layer and the second pattern layer of the display panel are spaced apart in the first direction.

[0018] In some embodiments, a dimension of the fourth portion along the first direction is greater than a dimension of the fifth portion along the first direction.

[0019] In some embodiments, the second isolation pattern further includes a sixth portion. The sixth portion is located between the fourth portion and the first isolation pattern. The sixth portion includes a fourth edge portion, the fourth edge portion encircling the centerline of adjacent pixel openings and extending relative to the fourth portion toward the centerline of the adjacent pixel openings. The second electrode contacts and is electrically connected to the fourth edge portion. A dimension of the fourth portion along the first direction is greater than a dimension of the sixth portion along the first direction.

[0020] In some embodiments, a surface of the second electrode remote from the substrate is closer to the substrate in the first direction than a surface of the isolation structure remote from the substrate. The display panel further includes an encapsulation pattern. The encapsulation pattern covers the light-emitting device, the sidewalls of the pixel opening, the surface of the third edge of the fifth portion near the substrate, the side surface of the fifth portion, and at least a portion of the surface of the fifth portion remote from the substrate.

[0021] In some embodiments, the encapsulation pattern includes a first sub-pattern and a second sub-pattern stacked in a direction away from the substrate, wherein the density of the first sub-pattern is higher than the density of the second sub-pattern.

[0022] In some embodiments, the light-emitting device included in the display panel includes a first light-emitting device and a second light-emitting device; the first light-emitting device and the second light-emitting device emit different colors; and the encapsulation pattern includes a first encapsulation pattern covering the first light-emitting device and a second encapsulation pattern covering the second light-emitting device; the first encapsulation pattern and the second encapsulation pattern have different thicknesses.

[0023] In some embodiments, the light-emitting device included in the display panel includes a first light-emitting device and a second light-emitting device, the first light-emitting device includes a first light-emitting functional layer, and the second light-emitting device includes a second light-emitting functional layer; the light-emitting colors of the first light-emitting device and the second light-emitting device are different. The display panel also includes a first partition film group and a second partition film group. The first partition film group includes a first partition layer and a second partition layer stacked in a direction away from the substrate, the first partition layer and the first light-emitting functional layer are made of the same material, and the second partition layer and the second electrode are made of the same material. The second partition film group includes a third partition layer and a fourth partition layer stacked in a direction away from the substrate, the third partition layer and the second light-emitting functional layer are made of the same material, and the fourth partition layer and the second electrode are made of the same material. The first partition film group and the second partition film group are both located on the side of the second isolation pattern away from the substrate.

[0024] In some embodiments, in the second direction, one of the first partition film group and the second partition film group located between the first light-emitting device and the second light-emitting device adjacent to the first light-emitting device is partially overlapped with the side of the other away from the substrate; the second direction is parallel to the connection between the center of the first light-emitting device and the center of the second light-emitting device.

[0025] In some embodiments, the first barrier film group includes a first edge portion distal to the first light-emitting device, the first edge portion gradually decreasing in size in the first direction; and / or the second barrier film group includes a second edge portion distal to the second light-emitting device, the second edge portion gradually decreasing in size in the first direction. The first edge portion and the second edge portion between the first light-emitting device and the second light-emitting device adjacent to the first light-emitting device overlap each other.

[0026] In some embodiments, the first partition film group further includes a first partition portion connected to the first edge portion, the first partition portion being closer to the first light-emitting device than the first edge portion. The second partition film group further includes a second partition portion connected to the second edge portion, the second partition portion being closer to the second light-emitting device than the second edge portion. In a region between the first light-emitting device and a second light-emitting device adjacent to the first light-emitting device, the maximum value of the sum of the dimensions of the first edge portion and the second edge portion in the first direction is less than the sum of the dimensions of the first partition portion and the second partition portion in the first direction.

[0027] In some embodiments, the light-emitting device included in the display panel further includes a third light-emitting device, the third light-emitting device includes a third light-emitting functional layer, and the light-emitting colors of the first light-emitting device, the second light-emitting device, and the third light-emitting device are all different. The display panel also includes a third partition film group. The third partition film group is located on the side of the second isolation pattern away from the substrate. The third partition film group includes a fifth partition layer and a sixth partition layer stacked in a direction away from the substrate. The fifth partition layer and the third light-emitting functional group are made of the same material, and the sixth partition layer and the second electrode are made of the same material. The third partition film group includes a third edge portion away from the third light-emitting device, and the size of the third edge portion gradually decreases in the first direction. The first edge portion and the third edge portion located between the first light-emitting device and the third light-emitting device adjacent to the first light-emitting device overlap each other; and / or, the second edge portion and the third edge portion located between the second light-emitting device and the third light-emitting device adjacent to the second light-emitting device overlap each other.

[0028] In some embodiments, the third partition film group further includes a third partition portion connected to the third edge portion, the third partition portion being closer to the third light-emitting device than the third edge portion. In a region between the first light-emitting device and a third light-emitting device adjacent to the first light-emitting device, the maximum value of the sum of the dimensions of the first edge portion and the third edge portion in the first direction is smaller than the sum of the dimensions of the first partition portion and the third partition portion in the first direction; and / or in a region between the second light-emitting device and the third light-emitting device adjacent to the second light-emitting device, the maximum value of the sum of the dimensions of the second edge portion and the third edge portion in the first direction is smaller than the sum of the dimensions of the second partition portion and the third partition portion in the first direction.

[0029] In some embodiments, the first partition film group and the second partition film group have a spacing in the second direction, and the second direction is parallel to the line connecting the center of the first light-emitting device and the center of the second light-emitting device; or, the boundary of the first partition film group away from the first light-emitting device coincides with the boundary of the second partition film group away from the second light-emitting device.

[0030] In some embodiments, the display panel further includes a first encapsulation pattern and a second encapsulation pattern. The first encapsulation pattern covers the first light-emitting device and a portion of the surface of the second barrier layer away from the substrate; the first barrier film set further includes a portion of the first encapsulation pattern covering the surface of the second barrier layer away from the substrate. The second encapsulation pattern covers the second light-emitting device and a portion of the surface of the fourth barrier layer away from the substrate; the second barrier film set further includes a portion of the second encapsulation pattern covering the surface of the fourth barrier layer away from the substrate.

[0031] On the other hand, a display panel is provided. The display panel includes a substrate, an isolation structure, a plurality of light-emitting devices, a first isolation film group, and a second isolation film group. The isolation structure is provided on the substrate, and the isolation structure defines a first pixel opening and a second pixel opening. The plurality of light-emitting devices include a first light-emitting device and a second light-emitting device. The first light-emitting device is provided in the first pixel opening. The second light-emitting device is provided in the second pixel opening. The first light-emitting device and the second light-emitting device emit different colors of light. The first light-emitting device and the second light-emitting device each include a first electrode and a second electrode arranged opposite to each other along a first direction, the first electrode being closer to the substrate than the second electrode, the first direction being the thickness direction of the substrate, and the second electrode being in contact with and electrically connected to the isolation structure. The first light-emitting device also includes a first light-emitting functional layer located between the first electrode and the second electrode of the first light-emitting device. The second light-emitting device also includes a second light-emitting functional layer located between the first electrode and the second electrode of the second light-emitting device. The first isolation film group includes a first isolation layer and a second isolation layer stacked in a direction away from the substrate, the first isolation layer and the first light-emitting functional layer being made of the same material, and the second isolation layer and the second electrode being made of the same material. The second partition film group includes a third partition layer and a fourth partition layer stacked in a direction away from the substrate. The third partition layer and the second light-emitting functional layer are made of the same material, and the fourth partition layer and the second electrode are made of the same material. The first and second partition film groups are both located on the side of the isolation structure away from the substrate. The first partition film group includes a first edge portion away from the first light-emitting device, the first edge portion gradually decreasing in size in a first direction; and / or the second partition film group includes a second edge portion away from the second light-emitting device, the second edge portion gradually decreasing in size in the first direction; the first and second edge portions between the first light-emitting device and a second light-emitting device adjacent to the first light-emitting device overlap.

[0032] It can be understood that through the above-mentioned arrangement, the first partition film group and the second partition film group can be overlapped with each other through the first edge portion and the second edge portion. In this way, firstly, it is beneficial to improve the structural integrity of the fifth part; secondly, it can reduce the difficulty of preparing the display panel; thirdly, it can make the size change of the overlapping part of the first partition film group and the second partition film group in the first direction relatively gentle. In this way, it can prevent the packaging structure from cracking due to the appearance of corner areas and can improve the packaging performance.

[0033] In some embodiments, the first partition assembly further includes a first partition portion connected to the first edge portion, the first partition portion being closer to the first light-emitting device than the first edge portion. The second partition assembly further includes a second partition portion connected to the second edge portion, the second partition portion being closer to the second light-emitting device than the second edge portion. In a region between the first light-emitting device and a second light-emitting device adjacent to the first light-emitting device, the maximum value of the sum of the dimensions of the first edge portion and the second edge portion in the first direction is less than the sum of the dimensions of the first partition portion and the second partition portion in the first direction.

[0034] In some embodiments, the plurality of light-emitting devices further include a third light-emitting device. The third light-emitting device includes a third light-emitting functional layer. The first light-emitting device, the second light-emitting device, and the third light-emitting device all have different luminous colors. The display panel further includes a third partition film group. The third partition film group is located on the side of the isolation structure away from the substrate. The third partition film group includes a fifth partition layer and a sixth partition layer stacked in a direction away from the substrate. The fifth partition layer and the third light-emitting functional layer are made of the same material, and the sixth partition layer and the second electrode are made of the same material. The third partition film group includes a third edge portion away from the third light-emitting device, and the size of the third edge portion gradually decreases in the first direction. The first edge portion and the second edge portion between the first light-emitting device and the third light-emitting device adjacent to the first light-emitting device overlap each other; and / or, the second edge portion and the third edge portion between the second light-emitting device and the third light-emitting device adjacent to the second light-emitting device overlap each other.

[0035] In some embodiments, the third partition film group further includes a third partition portion connected to the third edge portion, the third partition portion being closer to the third light-emitting device than the third edge portion. In a region between the first light-emitting device and a third light-emitting device adjacent to the first light-emitting device, the maximum value of the sum of the dimensions of the first edge portion and the third edge portion in the first direction is smaller than the sum of the dimensions of the first partition portion and the third partition portion in the first direction; and / or in a region between the second light-emitting device and the third light-emitting device adjacent to the second light-emitting device, the maximum value of the sum of the dimensions of the second edge portion and the third edge portion in the first direction is smaller than the sum of the dimensions of the second partition portion and the third partition portion in the first direction.

[0036] In some embodiments, the display panel further includes a first encapsulation pattern, a second encapsulation pattern, and a third encapsulation pattern. The first encapsulation pattern covers the first light-emitting device and a portion of the surface of the second partition layer away from the substrate. The first blocking pattern also includes a portion of the first encapsulation pattern covering the surface of the second partition layer away from the substrate. The second encapsulation pattern covers the second light-emitting device and a portion of the surface of the fourth partition layer away from the substrate. The second blocking pattern also includes a portion of the second encapsulation pattern covering the surface of the fourth partition layer away from the substrate. The third encapsulation pattern covers the third light-emitting device and a portion of the surface of the sixth partition layer away from the substrate. The third blocking pattern also includes a portion of the third encapsulation pattern covering the surface of the sixth partition layer away from the substrate.

[0037] In another aspect, a display device is provided. The display device includes a circuit board and a display panel according to any of the above embodiments. The circuit board and the display panel are electrically connected.

[0038] The beneficial effects that can be achieved by the above-mentioned display device are the same as the beneficial effects that can be achieved by the above-mentioned display panel, and will not be described in detail here.

[0039] In another aspect, a mask assembly is provided, comprising at least one mask plate including a sub-pixel pattern corresponding to a sub-pixel of a display panel, wherein a boundary of the sub-pixel pattern has a microstructure.

[0040] It can be understood that when the boundary of the sub-pixel pattern has a microstructure, the material in the mask layer opposite to the boundary of the sub-pixel pattern is in a semi-exposed state, so that after the mask layer is developed, the portion of the mask layer opposite to the boundary of the sub-pixel pattern is retained, and the thickness of the retained mask layer is less than the thickness before etching, and a film thickness gradient region can be formed. In this way, when etching the film group to be etched, the etching amount of the film group to be etched opposite to the boundary of the sub-pixel pattern is less than the etching amount of the film group to be etched away from the pixel opening; the partition film group in the display panel can include an edge portion, so that adjacent edge portions can overlap each other. In this way, firstly, it is beneficial to improve the flatness of the display panel and improve the packaging performance; secondly, the partition film group can better cover the fifth part, which is beneficial to improve the structural integrity of the fifth part; thirdly, it can reduce the difficulty of preparing the display panel.

[0041] In some embodiments, the mask includes a light-shielding substrate defining an opening, the opening being a sub-pixel pattern, and the microstructure is formed on the light-shielding substrate. Alternatively, the mask includes a light-transmitting substrate and a blocking pattern provided on the light-transmitting substrate, the blocking pattern being a sub-pixel pattern, and the microstructure is formed on the blocking pattern.

[0042] In some embodiments, the microstructure includes a plurality of sub-patterns arranged along a boundary of the sub-pixel pattern.

[0043] In some embodiments, at least one mask plate includes a first mask plate and a second mask plate. The first mask plate is used to form a first light-emitting device of a display panel, and the second mask plate is used to form a second light-emitting device of the display panel. The microstructure of the first mask plate includes a plurality of first sub-patterns, and the microstructure of the second mask plate includes a plurality of second sub-patterns. The first sub-patterns and the second sub-patterns have the same shape; and / or the spacing between two adjacent first sub-patterns is the same as the spacing between two adjacent second sub-patterns.

[0044] In some embodiments, at least one mask plate further includes a third mask plate. The third mask plate is used to fabricate a third light-emitting device of the display panel. The microstructure of the third mask plate includes a plurality of third sub-patterns. The first sub-pattern, the second sub-pattern, and the third sub-pattern have the same shape; and / or the spacing between two adjacent first sub-patterns, the spacing between two adjacent second sub-patterns, and the spacing between two adjacent third sub-patterns are the same.

[0045] In some embodiments, the sub-graphic is in the shape of a rectangle, a square, a triangle, or a trapezoid. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] To more clearly illustrate the technical solutions of the present disclosure, the following briefly introduces the drawings required for use in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure, and those skilled in the art can also derive other drawings based on these drawings. Furthermore, the drawings described below are schematic diagrams and are not intended to limit the actual dimensions of the products, actual processes of the methods, actual timing of signals, and the like involved in the embodiments of the present disclosure.

[0047] Figure 1 is a structural diagram of a display device according to some embodiments;

[0048] Figure 2 is a structural diagram of a display panel according to some embodiments;

[0049] Figure 3 is a structural diagram of a first light emitting device according to some embodiments;

[0050] Figure 4A is a structural diagram of a first light emitting device according to some further embodiments;

[0051] Figure 4B is a structural diagram of a display panel according to some further embodiments;

[0052] Figure 5 is a structural diagram of a display panel according to some further embodiments;

[0053] Figure 6is a partial diagram of the microscopic morphology of a display panel according to some embodiments;

[0054] Figure 7 is a structural diagram of a display panel according to some further embodiments;

[0055] Figure 8 is a partial diagram of the microscopic morphology of a display panel according to still other embodiments;

[0056] Figure 9A is a structural diagram of a display panel according to some further embodiments;

[0057] Figure 9B is a structural diagram of a display panel according to some further embodiments;

[0058] Figure 9C is a structural diagram of a display panel according to some further embodiments;

[0059] Figure 10A is a flow chart of a process for preparing a display panel according to some embodiments;

[0060] Figure 10B is a flow chart of a process for preparing a display panel according to yet other embodiments;

[0061] Figure 11A is a diagram showing steps of a process for preparing a display panel according to some embodiments;

[0062] Figure 11B are step diagrams of a process for manufacturing a display panel according to yet other embodiments;

[0063] Figure 11C are step diagrams of a process for manufacturing a display panel according to yet other embodiments;

[0064] Figure 11D are step diagrams of a process for manufacturing a display panel according to yet other embodiments;

[0065] Figure 11E are step diagrams of a process for manufacturing a display panel according to yet other embodiments;

[0066] Figure 11F are step diagrams of a process for manufacturing a display panel according to yet other embodiments;

[0067] Figure 11G are step diagrams of a process for manufacturing a display panel according to yet other embodiments;

[0068] Figure 11H are step diagrams of a process for manufacturing a display panel according to yet other embodiments;

[0069] Figure 11Iare step diagrams of a process for manufacturing a display panel according to yet other embodiments;

[0070] Figure 11J are step diagrams of a process for manufacturing a display panel according to yet other embodiments;

[0071] Figure 12A are step diagrams of a process for manufacturing a display panel according to yet other embodiments;

[0072] Figure 12B are step diagrams of a process for manufacturing a display panel according to yet other embodiments;

[0073] Figure 12C are step diagrams of a process for manufacturing a display panel according to yet other embodiments;

[0074] Figure 12D are step diagrams of a process for manufacturing a display panel according to yet other embodiments;

[0075] Figure 12E are step diagrams of a process for manufacturing a display panel according to yet other embodiments;

[0076] Figure 12F are step diagrams of a process for manufacturing a display panel according to yet other embodiments;

[0077] Figure 12G are step diagrams of a process for manufacturing a display panel according to yet other embodiments;

[0078] Figure 12H are step diagrams of a process for manufacturing a display panel according to yet other embodiments;

[0079] Figure 12I are step diagrams of a process for manufacturing a display panel according to yet other embodiments;

[0080] Figure 12J are step diagrams of a process for manufacturing a display panel according to yet other embodiments;

[0081] Figure 13A is an arrangement diagram of a first projection, a second projection, and a third projection of a mask assembly on a reference plane according to some embodiments;

[0082] Figure 13B is an arrangement diagram of the first projection, the second projection, and the third projection of the mask assembly on the reference plane according to some further embodiments;

[0083] Figure 14A is a structural diagram of a first mask according to some embodiments;

[0084] Figure 14B is a structural diagram of a first mask according to some further embodiments;

[0085] Figure 15A is a structural diagram of a second mask according to some embodiments;

[0086] Figure 15B is a structural diagram of a second mask according to some further embodiments;

[0087] Figure 16A is an arrangement diagram of the first projection, the second projection, and the third projection of the mask assembly on the reference plane according to some further embodiments;

[0088] Figure 16B is an arrangement diagram of a first projection, a second projection, and a third projection on a reference plane in a projection unit of a mask assembly according to some embodiments;

[0089] Figure 17A is a structural diagram of a third mask according to some embodiments;

[0090] Figure 17B is a structural diagram of a third mask according to yet other embodiments;

[0091] Figure 18A is an arrangement diagram of the first projection, the second projection, and the third projection of the mask assembly on the reference plane according to some further embodiments;

[0092] Figure 18B is an arrangement diagram of the first projection, the second projection, and the third projection on the reference plane in the projection unit of the mask assembly according to still other embodiments;

[0093] Figure 19A is an arrangement diagram of the first projection, the second projection, and the third projection of the mask assembly on the reference plane according to some further embodiments;

[0094] Figure 19B is an arrangement diagram of the first projection, the second projection, and the third projection on the reference plane in the projection unit of the mask assembly according to still other embodiments;

[0095] Figure 20A is an arrangement diagram of the first projection, the second projection, and the third projection of the mask assembly on the reference plane according to some further embodiments;

[0096] Figure 20B is an arrangement diagram of the first projection, the second projection, and the third projection on the reference plane in the projection unit of the mask assembly according to still other embodiments;

[0097] Figure 21A is an arrangement diagram of the first projection, the second projection, and the third projection of the mask assembly on the reference plane according to some further embodiments;

[0098] Figure 21B 1 is an arrangement diagram of the first projection, the second projection, and the third projection on the reference plane in the projection unit of the mask assembly according to some further embodiments. DETAILED DESCRIPTION

[0099] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in some embodiments of the present disclosure. Obviously, the embodiments described are only some embodiments of the present disclosure, not all embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of the present disclosure.

[0100] Unless the context requires otherwise, throughout the specification and claims, the term "comprise" and its other forms, such as the third person singular form "comprises" and the present participle form "comprising", are to be interpreted as open and inclusive, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" or "some examples" are intended to indicate that the particular features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the particular features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0101] In the following, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more.

[0102] “At least one of A, B and C” has the same meaning as “at least one of A, B or C” and both include the following combinations of A, B and C: A only, B only, C only, the combination of A and B, the combination of A and C, the combination of B and C, and the combination of A, B and C.

[0103] “A and / or B” includes the following three combinations: A only, B only, and a combination of A and B.

[0104] The use of "adapted to" or "configured to" herein is intended to be open and inclusive language that does not exclude devices adapted or configured to perform additional tasks or steps.

[0105] As used herein, "about," "substantially," or "approximately" includes the stated value and an average value that is within an acceptable range of deviation from the particular value as determined by one of ordinary skill in the art taking into account the measurements in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system).

[0106] As used herein, "parallel", "perpendicular", and "equal" include the situations described and situations similar to the situations described, and the range of the similar situations is within an acceptable deviation range, wherein the acceptable deviation range is as determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the specific quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, wherein the acceptable deviation range of approximate parallelism can be, for example, a deviation within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, wherein the acceptable deviation range of approximate perpendicularity can also be, for example, a deviation within 5°. "Equal" includes absolute equality and approximate equality, wherein the acceptable deviation range of approximate equality can be, for example, that the difference between the two equals is less than or equal to 5% of either one.

[0107] It will be understood that when a layer or element is referred to as being on another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may be present therebetween.

[0108] Exemplary embodiments are described herein with reference to cross-sectional and / or plan views that are idealized exemplary drawings. In the drawings, the thickness of layers and the area of ​​regions are exaggerated for clarity. Therefore, variations in shape relative to the drawings due to, for example, manufacturing techniques and / or tolerances are contemplated. Therefore, the exemplary embodiments should not be construed as limited to the shapes of the regions shown herein, but rather include deviations in shape due to, for example, manufacturing. For example, an etched region shown as a rectangle will typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shape of regions of the device and are not intended to limit the scope of the exemplary embodiments.

[0109] It should be noted that, for example, 11-1 in the drawings of this disclosure indicates that component 11 belongs to component 1, for example, Figure 5220A~200A indicate that the first light-emitting functional layer 220A belongs to the first light-emitting device 200A, and other similar reference numerals in the drawings also follow the above description. For example, 1 / 2 in the drawings of this disclosure indicates that component 1 and component 2 can refer to the same component, such as the attached Figure 5 200A / 200 in the figure indicates that the first light emitting device 200A is selected, and the light emitting device 200 can be represented by this component. Other similar reference numerals appearing in the drawings also follow the above description.

[0110] like Figure 1 As shown, some embodiments of the present disclosure provide a display device 400 , which includes: a display panel 300 .

[0111] The display device 400 may be, for example, an OLED (Organic Light Emitting Diode) display device.

[0112] For example, Figure 1 As shown, the display device 400 further includes a circuit board 410. The circuit board 410 is electrically connected to the display panel 300. The circuit board 410 is used to input various signals required for displaying images, such as control signals, power supply voltage signals, and data signals, to the display panel 300.

[0113] In addition, the display device 400 may also include an under-screen camera and an under-screen fingerprint recognition sensor, so that the display device 400 can realize various functions such as taking pictures, recording videos, fingerprint recognition or face recognition.

[0114] The display device 400 can be any display device that displays either moving (e.g., video) or fixed (e.g., still images), and whether textual or graphical. More specifically, it is contemplated that the display device 400 of the embodiments described herein can be implemented in or associated with a variety of electronic devices, such as, but not limited to, mobile phones, wireless devices, personal data assistants (PDAs), handheld or portable computers, GPS receivers / navigators, cameras, MP4 video players, video cameras, game consoles, watches, clocks, calculators, television monitors, flat-panel displays, computer monitors, automotive displays (e.g., speedometer displays), navigation systems, cockpit controls and / or displays, camera view displays (e.g., displays for rearview cameras in vehicles), electronic photographs, electronic billboards or signs, projectors, architectural structures, packaging, and aesthetic structures (e.g., displays for images of a piece of jewelry), and the like.

[0115] In some examples, the display device 400 is an AR display device or a VR display device with a high pixel density. In this case, the display panel 300 can be an AMOLED display panel, so that the high contrast of the AMOLED display panel can be utilized to improve the display performance.

[0116] In some embodiments, as Figure 2 As shown, the display panel 300 includes a substrate 310 .

[0117] For example, the material of the substrate 310 may be a rigid material, such as glass, to realize a rigid substrate display; or, the material of the substrate 310 may be a flexible material, such as polyimide (PI), to realize a flexible substrate display.

[0118] For example, the material of substrate 310 may include an inorganic material, such as soda-lime glass, quartz glass, or sapphire glass. Alternatively, the material of substrate 310 may include an organic material, such as one or a combination of polymethyl methacrylate, polyvinyl alcohol, polyvinylphenol, polyethersulfone, polyimide, polyamide, polyacetal, polycarbonate, polyethylene terephthalate, and polyethylene naphthalate. Alternatively, the material of substrate 310 may include both organic and inorganic materials.

[0119] In some embodiments, as Figure 2 As shown, the display panel 300 includes a light emitting device 200 and an isolation structure 100 disposed on a substrate 310. The isolation structure 100 defines a pixel opening Q. The light emitting device 200 is disposed within the pixel opening Q.

[0120] Exemplarily, the display panel 300 includes a plurality of light-emitting devices 200 , the isolation structure 100 defines a plurality of pixel openings Q, and the plurality of light-emitting devices 200 are correspondingly disposed in the plurality of pixel openings Q.

[0121] It is understood that when the isolation structure 100 includes a plurality of pixel openings Q and the light-emitting device 200 is disposed within the pixel openings Q, the isolation structure 100 can be configured to define the pixel openings Q for forming the light-emitting device 200. In this way, the light emitted by the light-emitting device 200 can be emitted from a predetermined area of ​​the display panel 300, thereby preventing color crosstalk.

[0122] In some embodiments, as Figure 5 As shown, the isolation structure 100 includes a first isolation pattern 110 and a second isolation pattern 120 stacked in a direction away from the substrate 310. The first isolation pattern 110 is made of an insulating material.

[0123] It should be understood that when the isolation structure 100 includes the first isolation pattern 110 and the second isolation pattern 120 , the first isolation pattern 110 and the second isolation pattern 120 jointly define the pixel opening Q.

[0124] In some embodiments, the material of the second isolation pattern 120 includes a conductive material.

[0125] In some examples, such as Figure 2 As shown, the display panel 300 further includes an array layer 320 disposed between the substrate 310 and the plurality of light-emitting devices 200. The array layer 320 includes a plurality of pixel driving circuits 321, wherein the pixel driving circuits 321 include a plurality of transistors TFT. Each pixel driving circuit 321 is electrically connected to a light-emitting device 200 for driving the light-emitting device 200 to emit light.

[0126] For example, in the display panel 300, the pixel driving circuit 321 can generate a driving current. Each light-emitting device 200 can emit light under the driving action of the driving current generated by the corresponding pixel driving circuit 321. The light emitted by multiple light-emitting devices 200 cooperates with each other, thereby enabling the display panel 300 to achieve a display function.

[0127] In some examples, such as Figure 2 and Figure 5 As shown, the display panel 300 further includes an encapsulation structure 330 covering the isolation structure 100 and a side of the plurality of light-emitting devices 200 away from the substrate 310 .

[0128] It can be understood that the packaging structure 330 covers the light-emitting device 200 and encapsulates the light-emitting device 200 to prevent moisture and oxygen in the external environment from entering the display panel 300 and damaging the materials (e.g., organic materials) in the light-emitting device 200, thereby shortening the life of the display panel 300.

[0129] For example, the plurality of light emitting devices 200 may be arranged in a direction parallel to the plane where the substrate 310 is located.

[0130] In some embodiments, as Figure 4B As shown, the plurality of light-emitting devices 200 of the display panel 300 include at least one red light-emitting device 200R, at least one green light-emitting device 200G, and at least one blue light-emitting device 200B. Under the action of a driving voltage, the red light-emitting device 200R is configured to emit red light, the green light-emitting device 200G is configured to emit green light, and the blue light-emitting device 200B is configured to emit blue light.

[0131] In this way, by setting up multiple light-emitting devices 200 including at least one red light-emitting device 200R, at least one green light-emitting device 200G and at least one blue light-emitting device 200B, the brightness (grayscale) of the red light-emitting device 200R, the green light-emitting device 200G and the blue light-emitting device 200B can be adjusted respectively, and the display of multiple colors can be achieved through color combination and superposition, thereby realizing full-color display of the display panel 300.

[0132] In some examples, the plurality of light emitting devices 200 of the display panel 300 further include at least one white light emitting device configured to emit white light. By doing so, the white light emitting device can be used to improve the brightness of the light emitted by the display panel 300.

[0133] In some embodiments, as Figures 3 to 5 As shown, the light emitting device 200 includes a first electrode 210, a light emitting functional layer 220, and a second electrode 230 stacked in a direction away from a substrate 310. The light emitting functional layer 220 includes at least one light emitting layer 221.

[0134] In some embodiments, as Figure 5 As shown, the second electrode 230 contacts and is electrically connected to the second isolation pattern 120 .

[0135] In some examples, when the second electrode 230 contacts and is electrically connected to the second isolation pattern 120 , the second electrode 230 is a structure that is not connected throughout the entire surface, that is, the second electrode 230 is a non-full-surface electrode.

[0136] By configuring in this way, the second electrode 230 can be electrically connected to the second isolation pattern 120 , and the second electrodes 230 of the plurality of light-emitting devices 200 can obtain the same reference voltage signal, which is, for example, a signal from a VSS signal line.

[0137] For example, when the second electrode 230 is in contact with and electrically connected to the second isolation pattern 120, the first light-emitting device 200A can be a light-emitting device manufactured using a photolithography process. When the light-emitting device 200 is manufactured using a photolithography process, the patterning of the light-emitting functional layer 220 is achieved using a photolithography process. For example, a fully connected initial light-emitting functional layer can be first formed, and then the initial light-emitting functional layer located in areas other than the selected pixel area can be removed using a photolithography process, while the initial light-emitting functional layer located in the selected pixel area is retained. In this way, the initial light-emitting functional layer located in the selected pixel area can form a light-emitting functional layer.

[0138] In some examples, after patterning the initial light-emitting functional layer, the remaining initial light-emitting functional layer includes a portion located within the pixel opening and a portion located on the side of the isolation structure away from the substrate. Therefore, it is necessary to use the isolation structure to separate these two portions to prevent crosstalk between adjacent sub-pixels.

[0139] In some examples, a second initial electrode layer for forming a plurality of second electrodes is further provided on the side of the initial light-emitting functional layer away from the substrate. During the process of patterning the initial light-emitting functional layer, the second initial electrode layer is also patterned, so that the second initial electrode layer located in the selected pixel area forms a second electrode. In this case, when the isolation structure disconnects the above-mentioned initial light-emitting functional layer, the second initial electrode layer is also disconnected. Therefore, the second electrode formed is a structure that is not connected to the entire surface, that is, the second electrodes located in each pixel opening are arranged at intervals. In order to enable the second electrodes in each pixel opening to obtain the same reference voltage signal, the second electrodes can be electrically connected. Therefore, by setting the second electrode in contact with and electrically connected to the second isolation pattern, electrical connection between the second electrodes can be achieved.

[0140] It should be noted that Figure 3 、 Figure 4A and Figure 4B This is a simplified schematic diagram obtained after removing all film layers in the display panel 300 except for the film layers related to the light-emitting device 200.

[0141] In some examples, such as Figure 3 and Figure 4A As shown, the first electrode 210 is an anode and the second electrode 230 is a cathode. In this case, the light emitting device 200 can be called a normal light emitting device. In other examples, the first electrode 210 is a cathode and the second electrode 230 is an anode. In this case, the light emitting device 200 can be called an inverted light emitting device.

[0142] For example, the anode material may be a conductive metal oxide material, such as indium tin oxide (ITO) or indium zinc oxide (IZO). Alternatively, the anode may be a composite electrode comprising multiple materials, such as ITO / Ag / ITO, Ag / IZO, CNT / ITO, CNT / IZO, GO / ITO, or GO / IZO, where Ag represents silver, CNT represents carbon nanotubes, and GO represents graphene oxide.

[0143] For example, the material of the cathode can be a metal material, a metal oxide or a metal alloy, such as aluminum (Al), silver (Ag), gold (Au), magnesium (Mg), calcium (Ca), ytterbium (Yb), indium (In), lithium (Li), potassium (K), sodium (Na), tin (Sn), titanium (Ti), lead (Pb), samarium (Sm), yttrium (Y), indium tin oxide (ITO), magnesium silver alloy (Mg:Ag), ytterbium gold alloy (Yb:Au), ytterbium silver alloy (Yb:Ag), lithium aluminum alloy (Li:Al) or lithium calcium magnesium alloy (Li:Ca:Al), etc.; alternatively, the material of the cathode can be a laminated material, such as magnesium / aluminum (Mg / Al), magnesium / silver (Mg / Ag), aluminum / silver (Al / Ag), aluminum / gold (Al / Au), ytterbium / gold (Yb / Au), ytterbium / silver (Yb / Ag), calcium / magnesium (Ca / Mg), calcium / silver (Ca / Ag), barium / silver (Ba / Ag), etc.

[0144] In some examples, such as Figure 3 As shown, the light emitting device 200 includes a light emitting layer 221. In this case, the light emitting device 200 is a single-layer light emitting device (also referred to as a single light emitting device, such as a single OLED light emitting device). In other examples, such as Figure 4A As shown, the light-emitting device 200 includes a plurality of (eg, two) light-emitting layers 221 arranged along the thickness direction of the substrate 310. At this time, the light-emitting device 200 is a series light-emitting device (also known as a Tandem light-emitting device, such as a Tandem OLED light-emitting device).

[0145] In some embodiments, as Figure 4A As shown, when the light emitting device 200 includes a plurality of light emitting layers 221 , the light emitting functional layer 220 further includes a charge generating unit 222 , and the charge generating unit 222 is located between two adjacent light emitting layers 221 .

[0146] In some examples, such as Figure 4A As shown, the charge generating unit 222 includes an electron generating layer 2221 (also referred to as N-CGL) and a hole generating layer 2222 (also referred to as P-CGL) that are stacked; the electron generating layer 2221 is closer to the anode than the hole generating layer 2222.

[0147] The charge generation unit 222 allows the plurality of light-emitting layers 221 to be sequentially connected in a direction perpendicular to the light-emitting surface. Furthermore, the charge generation unit 222 in the stacked OLED light-emitting device not only connects the light-emitting layers 221 but also helps improve the efficiency of charge (holes or electrons) generation, significantly impacting the performance of the first light-emitting device 200A.

[0148] Illustratively, the material of the electron generation layer 2221 includes an electron transport material and a metal material. Illustratively, the material of the hole generation layer 2222 includes a hole transport material and a P-type dopant (PD).

[0149] In some embodiments, as Figure 3 and Figure 4A As shown, to improve the luminous efficiency of the light-emitting device 200, the light-emitting functional layer 220 further includes a hole transport functional layer 223 located on the side of the light-emitting layer 221 close to the anode, and / or an electron transport functional layer 224 located on the side of the light-emitting layer 221 close to the cathode. The hole transport functional layer 223, for example, includes at least one of a stacked hole injection layer 2231 (Hole Inject Layer, HIL), a hole transport layer 2232 (Hole Transport Layer, HTL), and an electron blocking layer 2233 (Electron Blocking Layer, EBL). The electron transport functional layer 224, for example, includes at least one of a stacked electron injection layer 2241 (Electron Inject Layer, EIL), an electron transport layer 2242 (Electron Transport Layer, ETL), and a hole blocking layer 2243 (Hole Blocking Layer, EBL).

[0150] By setting up the film layers such as the hole injection layer 2231, the hole transport layer 2232, the electron blocking layer 2233, the electron injection layer 2241, the electron transport layer 2242, and the hole blocking layer 2243, it is equivalent to setting up transition steps between the anode and the light-emitting layer 221 and between the cathode and the light-emitting layer 221, thereby reducing the potential barrier height that needs to be overcome for carrier transition and making the luminescence efficiency higher.

[0151] The hole transport functional layer 223, the electron transport functional layer 224 and the charge generating unit 222 include some highly conductive film layers (hereinafter referred to as conductive film layers K, see Figure 6 ), these conductive film layers K are, for example, electron transport layers of a single light-emitting device, or charge generation units of a tandem light-emitting device. These conductive film layers K exhibit properties similar to those of a metal conductor.

[0152] For the technology of manufacturing light-emitting devices using a photolithography process, the second electrode 230 will contact and be electrically connected to the side of the second isolation pattern 120 to achieve electrical connection between the second electrodes 230. However, the conductive film layer K in the light-emitting functional layer 220 will also overlap the side of the second isolation pattern 120 and couple with the second isolation pattern 120, causing a short circuit between the first electrode 210 and the second isolation pattern 120, making it impossible for the second electrode 230 to receive a driving signal, resulting in the light-emitting device 200 being unable to light up. For example, Figure 6 is an electron microscope image of the light emitting device 200 when the conductive film layer K overlaps the side of the second isolation pattern 120; Figure 6 As shown, the conductive film layer K may overlap the bottom corner J of the second isolation pattern 120 close to the substrate 310 , so that the conductive film layer K is coupled to the second isolation pattern 120 .

[0153] Based on this, some embodiments of the present disclosure provide a display panel 300. Figure 5 As shown, the first isolation pattern 110 includes a first portion 111 and a second portion 112 stacked in a direction away from the substrate 310. The second portion 112 includes a first edge portion 112a, which extends relative to the first portion 111 in a direction close to the center line M of the adjacent pixel opening Q. Along a first direction X, the light-emitting functional layer 220 is located between the plane where the surface of the first edge portion 112a close to the substrate 310 is located and the first electrode 210. The first direction X is the thickness direction of the substrate.

[0154] It should be understood that when the display panel 300 includes multiple light-emitting devices 200 and the isolation structure 100 defines multiple pixel openings Q, the number of first edge portions 112a can be multiple, and the first edge portions 112a can be provided in a one-to-one correspondence with the light-emitting devices 200. In some examples, the multiple pixel openings Q are provided in a one-to-one correspondence with the multiple first edge portions 112a; in other examples, some pixel openings Q are provided with the first edge portions 112a, while other pixel openings Q are not provided with the first edge portions 112a.

[0155] Here, the first edge portion 112a extends relative to the first portion 111 in a direction closer to the center line M of the adjacent pixel opening Q, which means that the first edge portion 112a is closer to the center line M of the adjacent pixel opening Q relative to the first portion 111. It should be noted that the center line M of the pixel opening Q is a virtual line located within the pixel opening Q and perpendicular to the substrate 310. The center position of the pixel opening Q can be roughly determined by the center line M. When the cross-section of the pixel opening Q parallel to the substrate 310 is a regular pattern, the center line M of the pixel opening Q passes through the geometric center of the regular pattern.

[0156] In some examples, the second portion 112 includes a plurality of first edge portions 112 a that are spaced apart, and each first edge portion 112 a surrounds a center line M of a pixel opening Q. That is, the first edge portion 112 a may be closed.

[0157] It should be understood that in the process of forming the light-emitting functional layer 220, the material of the light-emitting functional layer 220 (including the material of the conductive film layer) will be distributed on the side of the first electrode 210 away from the substrate 310, and may also be distributed on the side of the first edge portion 112a away from the substrate 310. Among them, the part distributed on the side of the first electrode 210 away from the substrate 310 can constitute the light-emitting functional layer 220.

[0158] It can be understood that the second portion 112 includes a first edge portion 112a, and the first edge portion 112a extends relative to the first portion 111 in the direction of the center line M of the adjacent pixel opening Q, so that a first recessed structure V1 (also referred to as a first undercut structure) can be formed on the first isolation pattern 110. It is difficult for the material of the light-emitting functional layer 220 to climb at the first recessed structure V1, so that the material of the light-emitting functional layer 220 cannot completely fill the first recessed structure V1. In this way, along the first direction X, the light-emitting functional layer 220 can be limited to between the plane where the surface of the first edge portion 112a is close to the substrate 310 and the first electrode 210, so that the light-emitting functional layer 220 cannot be distributed. The material of the conductive film layer on the side of the first edge portion 112a away from the substrate 310 is connected, so that current transmission cannot be formed between the light-emitting functional layer 220 and the material of the conductive film layer located on the side of the first edge portion 112a away from the substrate 310. In this way, even if the material of the conductive film layer distributed on the side of the first edge portion 112a away from the substrate 310 is overlapped with the second isolation pattern 120, it will not be conductive with the first electrode 210. In this way, a short circuit between the first electrode 210 and the second isolation pattern 120 can be prevented, and the second electrode 230 can be prevented from being unable to connect to the driving signal due to a short circuit. The reliability of the light-emitting device 200 when it is lit can be improved, so as to improve the yield of the light-emitting device 200 prepared by the photolithography process.

[0159] Based on the above structure, in some embodiments, such as Figure 5 As shown, the display panel 300 further includes a first pattern layer 340. The first pattern layer 340 is located on a side of the first edge portion 112a away from the substrate 310. The material of the light-emitting functional layer 220 is the same as that of the first pattern layer 340. The first pattern layer 340 is spaced apart from the light-emitting functional layer 220 in the first direction X.

[0160] It should be understood that the material of the light-emitting functional layer 220 distributed on the side of the first edge portion 112a away from the substrate 310 forms the first pattern layer 340. Therefore, the material of the light-emitting functional layer 220 is the same as the material of the first pattern layer 340, and the material of the first pattern layer 340 includes the material of the conductive film layer.

[0161] In some examples, when the second portion 112 includes a plurality of first edge portions 112a, the first pattern layer 340 includes a plurality of first patterns 341. The plurality of first patterns 341 are spaced apart, and each first pattern 341 surrounds a center line M of a pixel opening Q.

[0162] It can be understood that when along the first direction X, the light-emitting functional layer 220 is located between the plane where the surface of the first edge portion 112a close to the substrate 310 is located and the first electrode 210, and the first pattern layer 340 is located on the side of the first edge portion 112a away from the substrate 310, the light-emitting functional layer 220 and the first pattern layer 340 are disconnected, so that a short circuit between the first electrode 210 and the second isolation pattern 120 can be prevented.

[0163] It should be noted that the material of the first portion 111 and the material of the second portion 112 may be the same or different.

[0164] In some examples, the material of the first portion 111 is the same as the material of the second portion 112 . In this case, the first portion 111 and the second portion 112 may be two portions at different positions in the same film layer.

[0165] In some embodiments, as Figure 5 As shown, the material of the first portion 111 includes a first insulating material; the material of the second portion 112 includes a second insulating material, and the first insulating material and the second insulating material are different.

[0166] It should be understood that when the first isolation pattern 110 includes the first portion 111 and the second portion 112 , both the first portion 111 and the second portion 112 are patterned structures.

[0167] In some examples, the pattern of the first part 111 and the pattern of the second part 112 are formed using different steps. In this case, a mask template with different opening patterns can be selected, or a mask layer with different patterns can be used to form the pattern of the first part 111 and the pattern of the second part 112 respectively, so as to form multiple first edge portions 112a in the second part 112.

[0168] In some other examples, the pattern of the first part 111 and the pattern of the second part 112 are formed using the same steps. In this case, the difference in etching speed between the first insulating material and the second insulating material can be utilized, that is, the etching selectivity ratio of the two insulating materials can be utilized to form the pattern of the second part 112 in the process of forming the pattern of the first part 111, so as to form multiple first edge portions 112a in the second part 112.

[0169] Therefore, by configuring the first portion 111 and the second portion 112 to be made of different materials, the process feasibility of forming the first portion 111 and the second portion 112 can be improved.

[0170] In some embodiments, under the same etching conditions, the etching rate of the first insulating material is greater than the etching rate of the second insulating material.

[0171] For example, the same etching conditions may be the conditions of the same dry etching process; or, the same etching conditions may be the conditions of the same wet etching process; of course, the same etching conditions may also be the conditions of the same other etching processes, and there is no limitation here, as long as the requirement of making the etching rate of the first insulating material greater than the etching rate of the second insulating material is met.

[0172] It can be understood that through the above-mentioned setting, under the same etching conditions, the amount of the first insulating material etched is greater than the amount of the second insulating material etched, so as to form a first edge portion 112a in the second part 112. In this way, the pattern of the first part 111 and the pattern of the second part 112 can be formed using the same etching process. In this way, the formation process of the first isolation pattern 110 can be simplified, and the preparation process of the display panel 300 can be simplified.

[0173] It should be noted that the relative size relationship between the dimension L1 of the first portion 111 along the first direction X and the dimension L2 of the second portion 112 along the first direction X is not limited herein. In some examples, the dimension L1 of the first portion 111 along the first direction X is less than or equal to the dimension L2 of the second portion 112 along the first direction X.

[0174] In some embodiments, as Figure 5 As shown, a dimension L1 of the first portion 111 along the first direction X is greater than a dimension L2 of the second portion 112 along the first direction X.

[0175] By such a configuration, the dimension L1 of the first portion 111 along the first direction X can be made relatively large. Thus, the dimension of the first recessed structure V1 formed on the first isolation pattern 110 along the first direction X can be made relatively large, making it difficult for the material of the light-emitting functional layer 220 to climb at the first recessed structure V1, thereby improving the barrier effect of the first isolation pattern 110 on the light-emitting functional layer 220 and the first pattern layer 340.

[0176] In some embodiments, as Figure 5 As shown, the first isolation pattern 110 further includes a third portion 113. The third portion 113 is located between the first portion 111 and the substrate 310. The third portion 113 includes a second edge portion 113a. The second edge portion 113a surrounds the center line M of the adjacent pixel opening Q and extends relative to the first portion 111 in a direction closer to the center line M of the adjacent pixel opening Q. A dimension L1 of the first portion 111 along the first direction is greater than a dimension L3 of the third portion 113 along the first direction.

[0177] It can be understood that when the dimension L1 of the first portion 111 along the first direction X is greater than the dimension L3 of the third portion 113 along the first direction X, the dimension L1 of the first portion 111 along the first direction X can be made relatively large. In this way, the dimension of the first recessed structure V1 formed on the first isolation pattern 110 along the first direction X can be made relatively large. As described above, the barrier effect of the first isolation pattern 110 on the light-emitting functional layer 220 and the first pattern layer 340 can be improved.

[0178] Exemplarily, the material of the third portion 113 includes an insulating material. The type of insulating material included in the third portion 113 is not limited herein. For example, the material of the third portion 113 may include a third insulating material that is different from the first insulating material and different from the second insulating material. For another example, the material of the third portion 113 may include a first insulating material. In this case, the pattern of the third portion 113 and the pattern of the first portion 111 may be formed in different steps to form the second edge portion 113a.

[0179] In some embodiments, as Figure 5 As shown, the material of the third portion 113 is the same as that of the second portion 112 .

[0180] Exemplarily, the material of the third portion 113 and the material of the second portion 112 are both the second insulating material.

[0181] It is understood that when the material of the third portion 113 is the same as that of the second portion 112, the etching process conditions for forming the third portion 113 can be the same as the etching process conditions for forming the second portion 112. In this way, the third portion 113 can be formed during the etching process to form the second portion 112, and the second edge portion 113a of the third portion 113 can be formed during the etching process to form the first edge portion 112a of the second portion 112. In this way, the formation process of the first isolation pattern 110 can be simplified, thereby simplifying the manufacturing process of the display panel 300.

[0182] In some embodiments, as Figure 5 As shown, the edge of the second edge portion 113 a is closer to the center line M of the adjacent pixel opening Q than the edge of the first edge portion 112 a .

[0183] In some examples, in the display panel 300, the microscopic topography of the first isolation pattern 110 and the first electrode 210 is as follows: Figure 8 As shown by Figure 8 It can be seen that the material of the third portion 113 and the material of the second portion 112 can both be the second insulating material, and the second insulating material can be SiO2. The edge of the second edge portion 113a is closer to the center line M of the adjacent pixel opening Q than the edge of the first edge portion 112a (see Figure 5 ).

[0184] It should be understood that the pattern of the first portion 111, the pattern of the second portion 112, and the pattern of the third portion 113 can be formed using the same steps. In this way, when the material of the third portion 113 is the same as that of the second portion 112, the second portion 112 is closer to the outside relative to the third portion 113, so that the degree of etching of the second portion 112 is higher than the degree of etching of the third portion 113. In this way, the etching amount of the second portion 112 is greater than the etching amount of the third portion 113, so that the edge of the second edge portion 113a is closer to the center line M of the adjacent pixel opening Q relative to the edge of the first edge portion 112a.

[0185] For example, the process for forming the pattern of the first part 111, the pattern of the second part 112, and the pattern of the third part 113 can be a dry etching process, in which the contact time between the etching gas and the material of the second part 112 is relatively long, and the contact time between the etching gas and the material of the third part 113 is relatively short, so that the etching amount of the second part 112 is greater than the etching amount of the third part 113.

[0186] As mentioned above, the material of the first electrode 210 can be a composite electrode containing multiple materials, and the material in the middle can be a metal material. In this case, the material in the middle of the first electrode 210 may be a metal material that is easily oxidized. When the side of the first electrode 210 is exposed, the metal material is easily oxidized, affecting the conductive performance of the first electrode 210. For example, Figure 8 As shown, the material of the first electrode 210 is ITO / Ag / ITO. If the side surface of the first electrode 210 is exposed, silver is easily oxidized.

[0187] To this end, in some embodiments, such as Figure 7 As shown, the edge of the first portion 111 close to the pixel opening Q covers the edge of the first electrode 210 .

[0188] Here, the edge of the first portion 111 close to the pixel opening Q covers the edge of the first electrode 210 . It can be understood that the orthographic projection of the first portion 111 on the substrate 310 overlaps with the edge of the orthographic projection of the first electrode 210 on the substrate 310 .

[0189] In some embodiments, as Figure 5 As shown, the first isolation pattern 110 includes a third portion 113 , and an edge of a second edge portion 113 a of the third portion 113 close to the pixel opening Q1 covers an edge of the first electrode 210 .

[0190] Here, the edge of the second edge portion 113a close to the pixel opening Q covers the edge of the first electrode 210. It can be understood that the positive projection of the second edge portion 113a on the substrate 310 overlaps with the edge of the positive projection of the first electrode 210 on the substrate 310.

[0191] It can be understood that through the above-mentioned setting, the side of the first electrode 210 can be covered by the material of the first part 111 or the material of the second edge portion 113a. In this way, the easily oxidized metal material that may exist in the first electrode 210 can be prevented from contacting with oxygen, thereby improving the conductivity of the first electrode 210.

[0192] In some embodiments, the material of the first portion 111 includes silicon nitride.

[0193] When the material of the first part 111 includes silicon nitride, the material of the first part 111 has the advantages of being easy to etch and easy to obtain. In this way, when forming the pattern of the first part 111, the pattern of the second part 112, and the pattern of the possible third part 113, the etching amount of the first part 111 can be relatively large, which can improve the process feasibility of forming the first recessed structure V1 in the first isolation pattern 110.

[0194] In some embodiments, the material of the second portion 112 includes silicon oxide.

[0195] When the material of the second part 112 includes silicon oxide, the material of the second part 112 is easy to obtain and the etching rate is relatively low. In this way, when forming the pattern of the first part 111, the pattern of the second part 112, and the pattern of the possible third part 113, the etching amount of the second part 112 and / or the third part 113 can be made relatively small, which can improve the process feasibility of forming the first recessed structure V1 in the first isolation pattern 110.

[0196] The above is an exemplary description of the first isolation pattern 110 , and the following will be an exemplary description of the second isolation pattern 120 .

[0197] In some embodiments, as Figure 5 and Figure 7 As shown, the second isolation pattern 120 includes a fourth portion 121 and a fifth portion 122 stacked in a direction away from the substrate 310, the fifth portion 122 includes a third edge portion 122a, the third edge portion 122a surrounds the center line M of the adjacent pixel opening Q, and extends in a direction close to the center line M of the adjacent pixel opening Q relative to the fourth portion 121; the second electrode 230 is in contact with and electrically connected to the fourth portion 121.

[0198] It can be understood that in the process of forming the light-emitting functional layer 220, the material of the light-emitting functional layer 220 may also be distributed on the side of the second isolation pattern 120 away from the substrate 310. By setting the fifth part 122 including the third edge portion 122a, a second recessed structure V2 (also referred to as a second undercut structure) can be formed on the second isolation pattern 120, which can improve the barrier effect of the second isolation pattern 120 on the light-emitting functional layer 220 and the material of the light-emitting functional layer 220 distributed on the side of the second isolation pattern 120 away from the substrate 310. In this way, the material of the light-emitting functional layer 220 distributed on the side of the second isolation pattern 120 away from the substrate 310 can be prevented from having an adverse effect on the light-emitting functional layer 220. For example, water vapor and oxygen in the external environment can be prevented from entering the light-emitting functional layer 220 through this part of the material and causing damage to the material of the light-emitting functional layer 220.

[0199] As described above, the process for forming the at least one first light-emitting device 200A can be a photolithography process. In some embodiments, before etching, it is necessary to form an initial light-emitting functional layer on the first electrode 210 and the side of the isolation structure 100 away from the substrate 310, and to form a temporary encapsulation layer on the side of the initial light-emitting functional layer away from the substrate 310. The material of the light-emitting functional layer 220 is the same as that of the initial light-emitting functional layer. In this way, after the light-emitting functional layer 220 is formed by etching, the side surface of the initial light-emitting functional layer is exposed.

[0200] In some examples, during the process of etching to form the light-emitting functional layer 220, the exposed side of the initial light-emitting functional layer is connected to the light-emitting functional layer 220, or the exposed side of the initial light-emitting functional layer is the side of the light-emitting functional layer 220, so that water vapor and oxygen in the external environment can easily enter the light-emitting functional layer 220 and cause damage to the material of the light-emitting functional layer 220.

[0201] To this end, in some embodiments, the display panel 300 further includes a second pattern layer 350. The second pattern layer 350 is located on a side of the fifth portion 122 away from the substrate 310. The material of the light-emitting functional layer 220 is the same as that of the second pattern layer 350. The first pattern layer 340 and the second pattern layer 350 are spaced apart in the first direction X.

[0202] It should be understood that the portion of the initial light-emitting functional layer located on the side of the second isolation pattern 120 away from the substrate 310 that is not etched away forms the second pattern layer 350. Moreover, the material of the light-emitting functional layer 220 is the same as that of the second pattern layer 350.

[0203] In some examples, when the fifth portion 122 includes a plurality of third edge portions 122 a , the second pattern layer 350 includes a plurality of second patterns 351 . The plurality of second patterns 351 are spaced apart, and each second pattern 351 surrounds a center line M of a pixel opening Q.

[0204] It should be understood that when the first pattern layer 340 and the second pattern layer 350 are spaced apart in the first direction X, the first pattern layer 340 and the second pattern layer 350 are disconnected from each other.

[0205] It is understood that when the display panel 300 further includes a second pattern layer 350, and the second pattern layer 350 is located on a side of the fifth portion 122 away from the fourth portion 121, the opening of the mask used in forming the light-emitting device 200 through an etching process can be relatively large, thereby reducing the difficulty of forming the light-emitting device 200. Furthermore, when the first pattern layer 340 and the second pattern layer 350 are disconnected, moisture and oxygen in the external environment can be prevented from entering the light-emitting functional layer 220 through the second pattern layer 350 and damaging the material of the light-emitting functional layer 220.

[0206] In some embodiments, the material of the fourth portion 121 includes a first metal material, and the material of the fifth portion 122 includes a second metal material. The first metal material and the second metal material are different.

[0207] It should be understood that when the second isolation pattern 120 includes the fourth portion 121 and the fifth portion 122 , both the fourth portion 121 and the fifth portion 122 are patterned structures.

[0208] In some examples, the pattern of the fourth portion 121 and the pattern of the fifth portion 122 are formed using different steps. In this case, a mask template with a different opening pattern can be selected, or a mask layer with different patterns can be used to form the pattern of the fourth portion 121 and the pattern of the fifth portion 122, respectively, to form multiple third edge portions 122a in the fifth portion 122.

[0209] In some other examples, the pattern of the fourth part 121 and the pattern of the fifth part 122 are formed using the same steps. In this case, the difference in etching speed between the first metal material and the second metal material can be utilized, that is, the etching selectivity ratio of the two metal materials can be utilized to form the pattern of the fifth part 122 in the process of forming the pattern of the fourth part 121, so as to form a plurality of third edge portions 122a in the fifth part 122.

[0210] Therefore, by configuring the first metal material and the second metal material to be different, the process feasibility of forming the plurality of third edge portions 122 a can be improved.

[0211] In some embodiments, under the same etching conditions, the etching rate of the first metal material is greater than the etching rate of the second metal material.

[0212] For example, the same etching conditions may be the conditions of the same dry etching process; or, the same etching conditions may be the conditions of the same wet etching process; of course, the same etching conditions may also be the conditions of the same other etching processes, and there is no limitation here, as long as the requirement of making the etching rate of the first metal material greater than the etching rate of the second metal material is met.

[0213] It can be understood that through the above-mentioned setting, under the same etching conditions, the etching amount of the first metal material can be greater than the etching amount of the second metal material, so as to form multiple third edge portions 122a in the fifth part 122. In this way, the pattern of the fourth part 121 and the pattern of the fifth part 122 can be formed using the same etching process. In this way, the formation process of the second isolation pattern 120 can be simplified, and the preparation process of the display panel 300 can be simplified.

[0214] In some embodiments, as Figure 5 and Figure 7 As shown, a dimension L4 of the fourth portion 121 along the first direction X is greater than a dimension L5 of the fifth portion 122 along the first direction X.

[0215] By such a configuration, the dimension L4 of the fourth portion 121 along the first direction X can be made relatively large. In this way, the dimension of the second recessed structure V2 formed on the second isolation pattern 120 along the first direction X can be made relatively large, and the distance between the light-emitting functional layer 220 and the second pattern layer 350 in the first direction X can be increased, so that the barrier effect of the second isolation pattern 120 on the light-emitting functional layer 220 and the second pattern layer 350 can be improved.

[0216] In some examples, the material of the second isolation pattern 120 includes a deformable material, so that the second isolation pattern 120 is easily deformed during the manufacturing process and / or use of the display panel 300. For example, when the material of the second isolation pattern 120 includes aluminum, aluminum is a metal material that is easily deformed when heated, so the second isolation pattern 120 is easily deformed during the heating process of the display panel 300. The deformation that occurs, for example, forms a protrusion on the surface of the second isolation pattern 120.

[0217] In some embodiments, as Figure 5 and Figure 7 As shown, the second isolation pattern 120 further includes a sixth portion 123 . The sixth portion 123 is located between the fourth portion 121 and the first isolation pattern 110 .

[0218] It can be understood that when the second isolation pattern 120 also includes the sixth part 123, the fourth part 121 can be sandwiched between the fifth part 122 and the sixth part 123. In this way, the fifth part 122 and the sixth part 123 can be used to improve the deformation resistance of the material of the fourth part 121, so that the material of the fourth part 121 is not easily deformed under the influence of the external environment (for example, a thermal environment). In this way, the structural stability of the second isolation pattern 120 can be improved.

[0219] It should be understood that the material of the sixth portion 123 can be the same as that of the fifth portion 122, and both can be materials with relatively good deformation resistance. That is, the material of the sixth portion 123 can include the second metal material. This can enhance the deformation resistance of the material of the fourth portion 121. Furthermore, the pattern of the sixth portion 123 can be formed in the same step as the patterns of the fourth portion 121 and the fifth portion 122.

[0220] In this case, in some embodiments, the sixth portion 123 includes a fourth edge portion 123a, which surrounds the center line M of the adjacent pixel opening Q and extends toward the center line M of the adjacent pixel opening Q relative to the fourth portion 121; the second electrode 230 contacts and is electrically connected to the fourth edge portion 123a.

[0221] In some examples, during the process of forming the third edge portion 122 a by an etching process, the fourth edge portion 123 a is also formed.

[0222] In some embodiments, a dimension L4 of the fourth portion 121 along the first direction is greater than a dimension L6 of the sixth portion 123 along the first direction X.

[0223] It can be understood that when the dimension L4 of the fourth portion 121 along the first direction is greater than the dimension L6 of the sixth portion 123 along the first direction X, the dimension L4 of the fourth portion 121 along the first direction X can be made relatively large. In this way, the dimension of the second recessed structure V2 formed on the second isolation pattern 120 along the first direction X can be made relatively large. As mentioned above, the barrier effect of the second isolation pattern 120 on the light-emitting functional layer 220 and the second pattern layer 350 can be improved.

[0224] In some embodiments, the first metallic material includes aluminum.

[0225] When the first metal material includes aluminum, the first metal material has the advantages of being easy to etch and easy to obtain. In this way, when forming the pattern of the fourth part 121, the pattern of the fifth part 122, and the pattern of the possible sixth part 123, the etching amount of the fourth part 121 can be relatively large, which can improve the process feasibility of forming the second recessed structure V2 in the second isolation pattern 120.

[0226] In some embodiments, the second metal material includes one or both of titanium and molybdenum.

[0227] When the second metal material includes one or both of titanium and molybdenum, the second metal material is readily available and has a relatively low etching rate. Consequently, when forming the pattern of the fourth portion 121, the pattern of the fifth portion 122, and the pattern of the possible sixth portion 123, the etching amount of the fifth portion 122 and / or the sixth portion 123 can be relatively small, thereby improving the process feasibility of forming the second recessed structure V2 in the second isolation pattern 120. Furthermore, when the second metal material includes one or both of titanium and molybdenum, the second metal material is a metal material that is not easily deformed, which can enhance the anti-deformation performance of the material of the fourth portion 121.

[0228] The above is an exemplary description of the second isolation pattern 120 , and the encapsulation structure 330 will be exemplarily described below.

[0229] In some embodiments, as Figure 5 and Figure 7 As shown, the encapsulation structure 330 includes a first sublayer 331, a second sublayer 332, and a third sublayer 333 stacked in a direction away from the substrate 310. The materials of the first sublayer 331 and the third sublayer 333 are, for example, inorganic materials (e.g., TFE), and the material of the second sublayer 332 is, for example, an organic material.

[0230] For example, the process for forming the first sub-layer 331 and / or the third sub-layer 333 may be a chemical vapor deposition (CVD) process, and the process for forming the second sub-layer 332 may be an inkjet printing (IJP) process.

[0231] In some embodiments, as Figure 5 and Figure 7 As shown, the surface of the second electrode 230 away from the substrate 310 is closer to the substrate 310 in the first direction X than the surface of the isolation structure 100 away from the substrate 310. The display panel 300 also includes an encapsulation pattern 360. The encapsulation pattern 360 includes a portion covering the light-emitting device 200, the sidewalls of the pixel opening Q, the surface of the third edge portion 122a of the fifth portion 122 close to the substrate 310, the side surface of the fifth portion 122, and at least a portion of the surface of the fifth portion 122 away from the substrate 310.

[0232] In some examples, the portion of the temporary encapsulation layer described above that is disposed on a side of the initial light-emitting functional layer away from the substrate 310 after etching forms an encapsulation pattern 360 .

[0233] Therefore, by configuring the display panel 300 to include the encapsulation pattern 360 , the material of the initial light-emitting functional layer (eg, organic material) can be prevented from being damaged by moisture and oxygen in the external environment, thereby improving the life of the display panel 300 .

[0234] In some examples, encapsulation pattern 360 is reused in first sub-layer 331 of encapsulation structure 330 .

[0235] It can be understood that when the encapsulation pattern 360 covers the side wall of the pixel opening Q, the second pattern 351 and the light-emitting functional layer 220 can be isolated by the material of the encapsulation pattern 360. In this way, the corrosion resistance and density of the material of the encapsulation pattern 360 can be utilized to improve the barrier effect between the light-emitting functional layer 220 and the second pattern layer 350, and the material of the light-emitting functional layer 220 (for example, organic material) can be prevented from being damaged by water vapor and oxygen in the external environment. In this way, the life of the display panel 300 can be improved.

[0236] In some embodiments, as Figure 7 As shown, the encapsulation pattern 360 includes a first sub-pattern 3601 and a second sub-pattern 3602 stacked in a direction away from the substrate 310 , wherein the density of the first sub-pattern 3601 is greater than the density of the second sub-pattern 3602 .

[0237] For example, the material of the first sub-pattern 3601 includes one or a combination of any two or more of zirconium oxide, aluminum oxide, and tetrafluoroethylene. The first sub-pattern 3601 is formed by, for example, an atomic layer deposition (ALD) process.

[0238] For example, the second sub-pattern 3602 is made of tetrafluoroethylene. Tetrafluoroethylene has high corrosion resistance and heat resistance. This configuration can enhance the encapsulation effect of the second sub-pattern 3602 on the material of the light-emitting functional layer 220. The second sub-pattern 3602 is formed by, for example, a chemical vapor deposition (CVD) process.

[0239] Through the above-mentioned setting, the relatively high-density portion of the packaging pattern 360 (i.e., the first pattern layer 3601) can be made closer to the light-emitting device 200 relative to the relatively low-density portion of the packaging pattern 360 (i.e., the second sub-pattern 3602). In this way, the packaging effect of the packaging pattern 360 on the side wall of the pixel opening Q, the second pattern layer 350, and the light-emitting device 200 can be improved, thereby improving the packaging effect of the packaging pattern 360 on the material of the light-emitting functional layer 220.

[0240] In some embodiments, as Figure 5 and Figure 7 As shown, the light-emitting device 200 included in the display panel 300 includes a first light-emitting device 200A and a second light-emitting device 200D. The first light-emitting device 200A and the second light-emitting device 200D emit different colors. The encapsulation pattern 360 includes a first encapsulation pattern 361 covering the first light-emitting device 200A and a second encapsulation pattern 362 covering the second light-emitting device 200D.

[0241] In some examples, the light emitted by the first light-emitting device 200A is any one of red light, green light, and blue light, and the light emitted by the second light-emitting device 200D is any one of red light, green light, and blue light except the light emitted by the first light-emitting device 200A.

[0242] In some embodiments, in the method for manufacturing the display panel 300, the step of forming the first light-emitting device 200A is different from the step of forming the second light-emitting device 200D. In other words, the first light-emitting device 200A and the second light-emitting device 200D can be formed sequentially. In this case, the first encapsulation pattern 361 and the second encapsulation pattern 362 can also be formed sequentially, thus achieving pixel-level encapsulation.

[0243] Therefore, the material of the first encapsulation pattern 361 and the material of the second encapsulation pattern 362 may be the same or different. The thickness of the first encapsulation pattern 361 and the thickness of the second encapsulation pattern 362 may be the same or different.

[0244] In some embodiments, as Figure 7 As shown, a thickness H1 of the first encapsulation pattern 361 and a thickness H2 of the second encapsulation pattern 362 are the same or substantially the same.

[0245] In some embodiments, as Figure 5 As shown, the thickness H1 of the first encapsulation pattern 361 and the average thickness H2 of the second encapsulation pattern 362 are different.

[0246] Here, the thickness of the first encapsulation pattern 361 refers to a dimension perpendicular to the extending direction of the first encapsulation pattern 361. The thickness of the second encapsulation pattern 362 refers to a dimension perpendicular to the extending direction of the second encapsulation pattern 362.

[0247] It is understandable that when the first light-emitting device 200A and the second light-emitting device 200D emit different colors, the first light-emitting device 200A and the second light-emitting device 200D have different requirements for the thickness of the encapsulation pattern. Therefore, by setting different thicknesses H1 of the first encapsulation pattern 361 and H2 of the second encapsulation pattern 362, the thickness H1 of the first encapsulation pattern 361 and the thickness H2 of the second encapsulation pattern 362 can be set differently based on the differences in refractive index, extinction coefficient, etc. of the materials of the light-emitting functional layer 220 (including the first light-emitting functional layer 220A of the first light-emitting device 200A and / or the second light-emitting functional layer 220D of the second light-emitting device 200D) and / or the encapsulation pattern (including the first encapsulation pattern 361 and / or the second encapsulation pattern 362), as well as the different luminous performance requirements of the first light-emitting device 200A and the second light-emitting device 200D, thereby maximizing the luminous efficiency of both the first light-emitting device 200A and the second light-emitting device 200D.

[0248] In some embodiments, as Figure 5 、 Figure 9A and Figure 9B As shown, the first light-emitting device 200A includes a first light-emitting functional layer 220A. The second light-emitting device 200D includes a second light-emitting functional layer 220D. The display panel 300 also includes a first partition film group 370 and a second partition film group 380. The first partition film group 370 includes a first partition layer 371 and a second partition layer 372. The first partition layer 371 is made of the same material as the first light-emitting functional layer 220A, and the second partition layer 372 is made of the same material as the second electrode 230. The second partition film group 380 includes a third partition layer 381 and a fourth partition layer 382. The third partition layer 381 is made of the same material as the second light-emitting functional layer 220D, and the fourth partition layer 382 is made of the same material as the second electrode 230. The first partition film group 370 and the second partition film group 380 are both located on the side of the fifth portion 122 away from the substrate 310.

[0249] In some examples, such as Figure 5 、 Figure 9A and Figure 9B As shown, for the technology of preparing the light-emitting device using the photolithography process, the initial light-emitting functional layer corresponding to the first light-emitting functional layer 220A (for example, the first initial light-emitting functional layer 220Ai described below) is retained after etching. The portion located on the side of the fifth portion 122 away from the substrate 310 is the first isolation layer 371. Therefore, the first isolation layer 371 includes a portion covering the third edge portion 122a. In some examples, such as Figure 5 、 Figure 9A and Figure 9BAs shown, the first barrier layer 371 also includes a portion covering the other portions of the fifth portion 122 except the third edge portion 122a. Moreover, the portion of the first barrier layer 371 covering the third edge portion 122a has the same structure as the second pattern layer 350 corresponding to the first light-emitting device 200A.

[0250] It can be understood that when the display panel 300 includes the above-mentioned first partition film group 370, when the first light-emitting device 200A is formed by an etching process, the opening of the mask plate used can be relatively large. When the display panel 300 includes the above-mentioned second partition film group 380, when the second light-emitting device 200D is formed by an etching process, the opening of the mask plate used can be relatively large. In this way, the process difficulty of forming the first light-emitting device 200A and the second light-emitting device 200D can be reduced.

[0251] It should be understood that when the first light-emitting device 200A and the second light-emitting device 200D are adjacent to each other, the first partition film group 370 includes a portion located between the first light-emitting device 200A and the second light-emitting device 200D, and the second partition film group 380 includes a portion located between the first light-emitting device 200A and the second light-emitting device 200D. The relative positional relationship between this portion of the first partition film group 370 and this portion of the second partition film group 380 will be described exemplarily below.

[0252] In some embodiments, as Figure 9A As shown, the first partition film group 370 and the second partition film group 380 are spaced apart in the second direction Y; the second direction Y is parallel to a line connecting the center of the first light emitting device 200A and the center of the second light emitting device 200D.

[0253] Here, the center of the light-emitting device 200 can be understood as the light-emitting functional layer 220 and the first electrode 210 and the second electrode 230 that are opposite thereto along the first direction X, which can form a light-emitting device film group, and the center of the light-emitting device 200 is the geometric center of the light-emitting device film group. The light-emitting device 200 is the first light-emitting device 200A or the second light-emitting device 200D.

[0254] Exemplarily, the second direction Y is perpendicular to the first direction X.

[0255] It can be understood that, on the one hand, through such an arrangement, when forming the first light-emitting device 200A and the second light-emitting device 200D, the boundary requirements for the first light-emitting device 200A and the second light-emitting device 200D are relatively low, so that the difficulty of preparing the display panel 300 can be reduced to a certain extent; on the other hand, the surface of the first partition film group 370 away from the substrate 310 and the surface of the second partition film group 380 away from the substrate 310 can be made relatively flush, which is beneficial to improving the flatness of the display panel 300, preventing the appearance of corner areas in the packaging structure 330, thereby avoiding the generation of cracks and improving the packaging performance.

[0256] In some embodiments, as Figure 5 and Figure 7 As shown, a boundary 370 a of the first partition film group 370 away from the first light emitting device 200A coincides with a boundary 380 a of the second partition film group 380 away from the second light emitting device 200D.

[0257] It can be understood that through the above-mentioned arrangement, firstly, the surface of the first partition film group 370 away from the substrate 310 and the surface of the second partition film group 380 away from the substrate 310 can be made relatively flush, which is beneficial to improving the flatness of the display panel 300 and avoiding the generation of cracks, thereby improving the packaging performance; secondly, the partition film group (for example, the first partition film group 370 and / or the second partition film group 380) can better cover the fifth part 122, which can prevent the surface of the fifth part 122 away from the fourth part 121 from being etched multiple times because it is not covered by the pattern film group, thereby improving the structural integrity of the fifth part 122.

[0258] In some embodiments, as Figure 9B and Figure 9C As shown, in the second direction Y, one of the first partition film group 370 and the second partition film group 380 located between the first light-emitting device 200A and the second light-emitting device 200D adjacent to the first light-emitting device 200A is partially overlapped with the side of the other away from the substrate 310; the second direction Y is parallel to the line connecting the center of the first light-emitting device 200A and the center of the second light-emitting device 200D.

[0259] With this arrangement, on the one hand, the first and second partition film groups 370 and 380 can effectively cover the fifth portion 122, preventing the surface of the fifth portion 122 away from the fourth portion 121 from being etched multiple times due to being uncovered. This prevents damage to the material of the fifth portion 122 and helps improve the structural integrity of the fifth portion 122. Furthermore, with this arrangement, when forming the first and second light-emitting devices 200A and 200D, the requirements for the boundary between the first and second light-emitting devices 200A and 200D are relatively low, thereby reducing the difficulty of manufacturing the display panel 300 to a certain extent.

[0260] In some examples, such as Figure 9B As shown, in the second direction Y, the second barrier film group 380 is partially overlapped with a side of the first barrier film group 370 away from the substrate 310 .

[0261] In some other examples, in the second direction Y, the first barrier film group 370 is partially overlapped with a side of the second barrier film group 380 away from the substrate 310 .

[0262] In some embodiments, as Figure 9C As shown, the first partition film group 370 includes a first edge portion 370A away from the first light-emitting device 200A, and the dimension D1 of the first edge portion 370A in the first direction X gradually decreases; and / or the second partition film group 380 includes a second edge portion 380A away from the second light-emitting device 200D, and the dimension D2 of the second edge portion 380A in the first direction X gradually decreases. The first edge portion 370A and the second edge portion 380A located between the first light-emitting device 200A and the second light-emitting device 200D adjacent to the first light-emitting device 200A overlap each other.

[0263] Exemplarily, a dimension D1 of the first edge portion 370 in the first direction X gradually decreases in a direction away from the first light emitting device 200A. Exemplarily, a dimension D2 of the second edge portion 380 in the first direction X gradually decreases in a direction away from the second light emitting device 200D.

[0264] It can be understood that through the above-mentioned arrangement, the first partition film group 370 and the second partition film group 380 can be overlapped with each other through the first edge portion 370A and the second edge portion 380A on the basis of improving the structural integrity of the fifth part 122 and reducing the difficulty of preparing the display panel 300. In this way, the advantage of the gradual reduction in the size of the first edge portion 370A and / or the second edge portion 380A in the first direction X can be utilized to make the size change of the overlapping part of the first partition film group 370 and the second partition film group 380 in the first direction X relatively gentle. In this way, the packaging structure 330 can be prevented from cracking due to the appearance of the corner area, and the packaging performance can be improved.

[0265] In some embodiments, as Figure 9C As shown, the first partition film group 370 further includes a first partition portion 370B connected to the first edge portion 370A. The first partition portion 370B is closer to the first light-emitting device 200A than the first edge portion 370A. The second partition film group 380 further includes a second partition portion 380B connected to the second edge portion 380A. The second partition portion 380B is closer to the second light-emitting device 200D than the second edge portion 380A. In region SS1 between the first light-emitting device and a second light-emitting device adjacent to the first light-emitting device, the maximum value of the sum of the dimensions of the first edge portion 370A and the second edge portion 380A in the first direction X (i.e., D1 + D2) is less than the sum of the dimensions of the first partition portion 370B and the second partition portion 380B in the first direction X (D3 + D4). The dimension of the first partition portion 370B in the first direction X is D3, and the dimension of the second partition portion 380B in the first direction X is D4.

[0266] In some examples, the interface between the first edge portion 370A and the first partition portion 370B may be a critical position where the dimension of the first partition membrane assembly 370 along the first direction X changes (e.g., begins to decrease). The same applies to the interface between the second edge portion 380A and the second partition portion 380B.

[0267] It can be understood that when the maximum value of the sum of the dimensions of the first edge portion 370A and the second edge portion 380A in the first direction X (i.e., D1+D2) is less than the sum of the dimensions D3+D4 of the first partition portion 370B and the second partition portion 380B in the first direction X, the sum of the dimensions of the first edge portion 370A and the second edge portion 380A in the first direction X (i.e., D1+D2) is relatively small. In other words, the dimensions of the overlapping parts of the first partition film group 370 and the second partition film group 380 in the first direction X are relatively small. In this way, the height difference between the surface of the first partition film group 370 away from the substrate 310 and the surface of the second partition film group 380 away from the substrate 310 can be reduced, which is beneficial to improving the flatness of the display panel 300. As mentioned above, the packaging performance can be improved.

[0268] In some embodiments, as Figure 9C As shown, the light-emitting device 200 included in the display panel 300 further includes a third light-emitting device 200C, and the third light-emitting device 200C includes a third light-emitting functional layer 220C; the first light-emitting device 200A, the second light-emitting device 200D and the third light-emitting device 200C all have different luminous colors.

[0269] The display panel 300 further includes a third partition film group 390. The third partition film group 390 is located on a side of the second isolation pattern 120 away from the substrate 310. The third partition film group 390 includes a fifth partition layer 391 and a sixth partition layer 392 stacked in a direction away from the substrate 310. The fifth partition layer 391 and the third light-emitting functional layer 220C are made of the same material, and the sixth partition layer 392 and the second electrode 230 are made of the same material. The third partition film group 390 includes a third edge portion 390A away from the third light-emitting device 200C. The dimension D5 of the third edge portion 390A in the first direction X gradually decreases.

[0270] The first edge portion 370A and the third edge portion 390A located between the first light-emitting device 200A and the third light-emitting device 200C adjacent to the first light-emitting device 200A overlap with each other; and / or, the second edge portion 380A and the third edge portion 390A located between the second light-emitting device 200D and the third light-emitting device 200C adjacent to the second light-emitting device 200D overlap with each other.

[0271] In some examples, the light emitted by the first light-emitting device 200A is one of red, green, and blue, the light emitted by the second light-emitting device 200D is another of red, green, and blue, and the light emitted by the third light-emitting device 200C is another of red, green, and blue.

[0272] Here, for understanding the third isolation membrane group 390, please refer to the description of the first isolation membrane group 370 in the aforementioned section; for understanding the fifth isolation layer 391, please refer to the description of the first isolation layer 371 in the aforementioned section; for understanding the third edge portion 390A, please refer to the description of the first edge portion 370A in the aforementioned section; no further details will be given here.

[0273] It can be understood that, similar to the beneficial effects when the first edge portion 370A and the second edge portion 380A overlap each other, through the above-mentioned arrangement, the structural integrity of the fifth portion 122 can be improved, and the difficulty of preparing the display panel 300 can be reduced. The dimensional changes of the overlapping portions of the first partition film group 370 and the third partition film group 390, and / or the second partition film group 380 and the third partition film group 390 in the first direction X are relatively gentle. In this way, the packaging structure 330 can be prevented from cracking due to the presence of corner areas, and the packaging performance can be improved.

[0274] In some embodiments, as Figure 9C As shown, the third partition film group 390 further includes a third partition portion 390B connected to the third edge portion 390A. The third partition portion 390B is closer to the third light emitting device 200C than the third edge portion 390A.

[0275] In a region SS2 between the first light-emitting device 200A and the third light-emitting device 200C adjacent to the first light-emitting device 200A, a maximum value of the sum of the dimensions of the first edge portion 370A and the third edge portion 390A in the first direction X (i.e., D1+D5) is smaller than a maximum value of the sum of the dimensions of the first partition portion 370B and the third partition portion 390B in the first direction X (D2+D6); and / or

[0276] In a region SS3 between the second light-emitting device 200D and the third light-emitting device 200C adjacent to the second light-emitting device 200D, the maximum value of the sum of the dimensions of the second edge portion 380A and the third edge portion 390A in the first direction X (i.e., D3 + D5) is smaller than the sum of the dimensions D4 + D6 of the second partition portion 380B and the third partition portion 390B in the first direction X. The dimension of the third partition portion 390B in the first direction X is D6.

[0277] Here, for understanding the third partition portion 390B, please refer to the description of the first partition portion 370B in the aforementioned part; it will not be repeated here.

[0278] It can be understood that similar to the beneficial effect when the maximum value of the sum of the dimensions of the first edge portion 370A and the second edge portion 380A in the first direction X is less than the sum D3+D4 of the dimensions of the first partition portion 370B and the second partition portion 380B in the first direction X, through the above-mentioned setting, the portion where the first partition film group 370 and the third partition film group 390 overlap with each other, and / or the portion where the second partition film group 380 and the third partition film group 390 overlap with each other can be made relatively small in size in the first direction X. In this way, the height difference between the surface of the first partition film group 370 away from the substrate 310, the surface of the second partition film group 380 away from the substrate 310, and the surface of the third partition film group 390 away from the substrate 310 can be reduced, which is beneficial to improving the flatness of the display panel 300. As mentioned above, the packaging performance can be improved.

[0279] In some embodiments, as Figure 5 、 Figures 9A to 9C As shown, the display panel 300 further includes a first encapsulation pattern 361 and a second encapsulation pattern 362. The first encapsulation pattern 361 covers the first light-emitting device 200A and a portion of the surface of the second barrier layer 372 away from the substrate 310. The first barrier film set 370 further includes a portion of the first encapsulation pattern 361 covering the surface of the second barrier layer 372 away from the substrate 310. The second encapsulation pattern 362 covers the second light-emitting device 200D and a portion of the surface of the fourth barrier layer 382 away from the substrate 310. The second barrier film set 380 further includes a portion of the second encapsulation pattern 362 covering the surface of the fourth barrier layer 382 away from the substrate 310.

[0280] Here, for understanding the first packaging pattern 361 and the second packaging pattern 362 , reference may be made to the description of the first packaging pattern 361 and the second packaging pattern 362 in the aforementioned part, which will not be repeated here.

[0281] It can be understood that the first packaging pattern 361 can provide protection for the first isolation layer 371 and the second isolation layer 372 during the etching process of the first light-emitting device 200A, and the second packaging pattern 362 can provide protection for the third isolation layer 381 and the fourth isolation layer 382 during the etching process of the second light-emitting device 200D. In this way, the material of the initial light-emitting functional layer (including the initial light-emitting functional layer corresponding to the first light-emitting functional layer 220A and the second light-emitting functional layer 220D) can be prevented from being damaged by water vapor and oxygen in the external environment. In this way, the life of the display panel 300 can be improved.

[0282] The above is an exemplary description of the structure of the display panel 300. The following is an exemplary introduction to a method for manufacturing the display panel 300.

[0283] Some embodiments of the present disclosure further provide a method for preparing a display panel 300 , which includes S1 to S2 .

[0284] S1: If Figure 5 As shown, an isolation structure 100 is formed on a substrate 310. The isolation structure 100 defines a pixel opening Q. The isolation structure 100 includes a first isolation pattern 110 and a second isolation pattern 120 stacked in a direction away from the substrate 310. The first isolation pattern 110 includes a first portion 111 and a second portion 112 stacked in a direction away from the substrate 310. The second portion 112 includes a first edge portion 112a, which extends relative to the first portion 111 in a direction close to the center line M of the adjacent pixel opening Q.

[0285] S2: Forming the light-emitting device 200. The light-emitting device 200 is disposed within the pixel opening Q and includes a first electrode 210, a light-emitting functional layer 220, and a second electrode 230 stacked in a direction away from the substrate 310. The second electrode 230 is in contact with and electrically connected to the second isolation pattern 120. Along a first direction X, the light-emitting functional layer 220 is located between the first electrode 210 and a plane of the surface of the first edge portion 112a close to the substrate 310. The first direction X is the thickness direction of the substrate 310.

[0286] The beneficial effects that can be achieved by the method for preparing the display panel 300 are the same as the beneficial effects that can be achieved by the display panel 300 , and will not be described in detail here.

[0287] In some embodiments, S2 includes S2.1 to S2.2.

[0288] S2.1: Before S1, the first electrode 210 of the light emitting device 200 is formed on the substrate 310.

[0289] It should be understood that, in the case where the display panel 300 includes a plurality of light-emitting devices 200 , the first electrodes 210 of the plurality of light-emitting devices 200 are formed in S2.1 , and the plurality of first electrodes 210 are arranged at intervals.

[0290] S2.2: After S1, other film structures of the light-emitting device 200 except the first electrode 210 are formed in the pixel opening Q.

[0291] In some embodiments, forming the isolation structure 100 (ie, S1 ) includes S1.1 to S1.3.

[0292] S1.1: If Figure 12A As shown, a first preliminary isolation structure 110i is formed.

[0293] Exemplarily, the first preliminary isolation structure 110i includes a first preliminary film layer 111i and a second preliminary film layer 112i. In some examples, the first preliminary isolation structure 110i further includes a third preliminary film layer 113i.

[0294] Exemplarily, the process of forming the first initial film layer 111 i and / or the process of forming the second initial film layer 112 i may be a deposition process.

[0295] S1.2: If Figure 12A As shown, a second preliminary isolation structure 120 i is formed on a side of the first preliminary isolation structure 110 i away from the substrate 310 .

[0296] Exemplarily, the second preliminary isolation structure 120i includes a fourth preliminary film layer 121i and a fifth preliminary film layer 122i. In some examples, the second preliminary isolation structure 120i further includes a sixth preliminary film layer 123i.

[0297] Exemplarily, the process of forming the fourth initial film layer 121 i and / or the process of forming the fifth initial film layer 122 i may be a deposition process.

[0298] S1.3: If Figure 12B As shown, the second preliminary isolation structure 120i is etched to form a second isolation pattern 120; the second isolation pattern 120 includes a second sub-opening Qb.

[0299] S1.4: If Figure 12D As shown, the first preliminary isolation structure 110i is etched through the second sub-opening Qb to form a first isolation pattern 110; the first isolation pattern 110 includes a first sub-opening Qa, and the first sub-opening Qa and the second sub-opening Qb form a pixel opening Q.

[0300] Through the above-mentioned setting, the conditions of the patterning process can be set differently according to the different materials of the first isolation pattern 110 and the second isolation pattern 120, so that the formed second isolation pattern 120 includes a first edge portion 112a, and the first edge portion 112a extends relative to the first portion 111 in the direction close to the center line M of the pixel opening Q.

[0301] In some examples, after S1.3 and before S1.4, S1.3A is also included.

[0302] S1.3A: If Figure 12C As shown, a second mask layer PR2 is formed outside the second isolation pattern 120 .

[0303] Through the above configuration, it is possible to prevent the process of patterning the first preliminary isolation structure 110 i from affecting the morphology of the formed second sub-opening Qb.

[0304] In some embodiments, the material of the first initial film layer 111i includes a first insulating material. The material of the second initial film layer 112i includes a second insulating material, and the first insulating material is different from the second insulating material. At this time, etching the first initial isolation structure 110i through the second sub-opening Qb (S1.4) can specifically include: patterning the first initial film layer 111i and the second initial film layer 112i to form a first sub-opening Qa; the retained portion of the first initial film layer 111i constitutes the first portion 111, and the retained portion of the second initial film layer 112i constitutes the second portion 112. In the process of patterning the first initial film layer 111i and the second initial film layer 112i, the etching rate of the first insulating material is greater than the etching rate of the second insulating material.

[0305] It can be understood that through the above setting, the first part 111 and the second part 112 corresponding to the same pixel opening Q can be formed by a single etching process, thereby simplifying the formation process of the first isolation pattern 110 and simplifying the preparation process of the display panel 300.

[0306] In some embodiments, the plurality of pixel openings Q include at least one first pixel opening Q1 and at least one second pixel opening Q2. The display panel 300 includes at least one first light-emitting device 200A and at least one second light-emitting device 200D. The first light-emitting device 200A is disposed within the first pixel opening Q1, and the second light-emitting device 200D is disposed within the second pixel opening Q2. The color of light emitted by the first light-emitting device 200A is different from the color of light emitted by the second light-emitting device 200D.

[0307] In this case, the plurality of pixel openings Q formed in S1 include at least one first pixel opening Q1 and at least one second pixel opening Q2 .

[0308] In some examples, at least one first pixel opening Q1 and at least one second pixel opening Q2 are formed in the same step.

[0309] As a possible implementation, multiple pixel openings Q may be formed by performing steps S1.1 to S1.4 once, so that at least one first pixel opening Q1 and at least one second pixel opening Q2 are formed in the same step.

[0310] In some other examples, at least one first pixel opening Q1 and at least one second pixel opening Q2 are formed in different steps.

[0311] For example, at least one first pixel opening Q1 and at least one second pixel opening Q2 may be formed by performing steps S1.1 to S1.4 twice.

[0312] In some embodiments, as Figure 5 and Figure 7 As shown, the surface of the second electrode 230 away from the substrate 310 is closer to the substrate 310 than the surface of the isolation structure 100 away from the substrate 310 . In this case, S2 also includes S2.3 .

[0313] S2.3: Forming a packaging pattern 360 .

[0314] Illustratively, forming the encapsulation pattern 360 (ie, S2.3) includes S2.3.1 and S2.3.2.

[0315] S2.3.1: An atomic layer deposition (ALD) process is used to form a first sub-pattern 3601, which covers the light-emitting device 200, the side walls of the pixel opening Q, the third edge portion 122a of the fifth part 122 close to the surface of the substrate 310, the side of the fifth part 122, and at least part of the surface of the fifth part 122 away from the substrate 310.

[0316] Exemplarily, the first sub-pattern 3601 also covers a side of the first pattern layer 340 away from the substrate 310 .

[0317] S2.3.2: Using a chemical vapor deposition (CVD) process, a second sub-pattern layer 3602 is formed on a side of the first sub-pattern 3601 away from the substrate 310 .

[0318] It can be understood that through the above-mentioned setting, the first sub-pattern 3601 can have better covering properties, so that the covering effect of the first sub-pattern 3601 on the light-emitting device 200 and the side wall of the pixel opening Q can be improved, thereby improving the packaging effect of the packaging pattern 360 on the material of the light-emitting functional layer 220.

[0319] Some embodiments of the present disclosure also provide a method for preparing a display panel 300, such as Figure 10A and Figure 5 As shown, the preparation method includes T1 to T9.

[0320] T1: forming a plurality of first electrodes 210 on a substrate 310 .

[0321] T2: forming a first preliminary isolation structure 110 i on the substrate 310 . The material of the first preliminary isolation structure 110 i includes an insulating material.

[0322] T3: forming a second preliminary isolation structure 120 i on a side of the first preliminary isolation structure 110 i away from the substrate 310 .

[0323] T4: The second preliminary isolation structure 120 i and the first preliminary isolation structure 110 i are sequentially etched to form a first pixel opening Q1 exposing the first electrode 210 of the first light emitting device 200A.

[0324] T5: The light emitting function layer 220A and the second electrode 230 of the first light emitting device 200A are sequentially formed in the first pixel opening Q1.

[0325] T6: The second preliminary isolation structure 120 i and the first preliminary isolation structure 110 i are sequentially etched to form a second pixel opening Q2 exposing the first electrode 210 of the second light emitting device 200D.

[0326] T7: The light emitting function layer 220D and the second electrode 230 of the second light emitting device 200D are sequentially formed in the second pixel opening Q2.

[0327] T8: The second preliminary isolation structure 120 i and the first preliminary isolation structure 110 i are sequentially etched to form a third pixel opening Q3 exposing the first electrode 210 of the third light emitting device 200C.

[0328] T9: the light emitting function layer 220C and the second electrode 230 of the third light emitting device 200C are sequentially formed in the third pixel opening Q3.

[0329] The first initial isolation structure 110i and the second initial isolation structure 120i, after forming the first pixel opening Q1, the second pixel opening Q2, and the third pixel opening Q3, respectively, form a first isolation pattern 110 and a second isolation pattern 120. The first isolation pattern 110 includes a first portion 111 and a second portion 112 stacked and arranged in a direction away from the substrate 310. The second portion 112 includes a first edge portion 112a, which extends relative to the first portion 111 toward the center line M of the adjacent pixel opening Q. The second electrodes 230 of the first, second, and third light-emitting devices 200A, 200D, and 200C are all in contact with and electrically connected to the second isolation pattern 120. Along a first direction X, the light-emitting functional layers 220 of the first, second, and third light-emitting devices 200A, 200D, and 200C are located between the first electrode 210 and the plane of the first edge portion 112a near the surface of the substrate 310. The first direction X is the thickness direction of the substrate 310.

[0330] The beneficial effects that can be achieved by the method for preparing the display panel 300 are the same as the beneficial effects that can be achieved by the display panel 300 , and will not be described in detail here.

[0331] Some embodiments of the present disclosure also provide a method for preparing a display panel 300, such as Figure 10B and Figure 5As shown, the preparation method includes W1 to W7.

[0332] W1: A plurality of first electrodes 210 are formed on a substrate 310 .

[0333] W2: forming a first preliminary isolation structure 110 i on the substrate 310 . The material of the first preliminary isolation structure 110 i includes an insulating material.

[0334] W3: forming a second preliminary isolation structure 120 i on a side of the first preliminary isolation structure 110 i away from the substrate 310 .

[0335] W4: The second initial isolation structure 120i and the first initial isolation structure 110i are sequentially etched to form a first pixel opening Q1 exposing the first electrode 210 of the first light-emitting device 200A, a second pixel opening Q2 exposing the first electrode 210 of the second light-emitting device 200D, and a third pixel opening Q3 exposing the first electrode 210 of the third light-emitting device 200C.

[0336] W5: The light emitting function layer 220 and the second electrode 230 of the first light emitting device 200A are sequentially formed in the first pixel opening Q1.

[0337] W6: The light emitting function layer 220D and the second electrode 230 of the second light emitting device 200D are sequentially formed in the second pixel opening Q2.

[0338] W7: The light emitting function layer 220C and the second electrode 230 of the third light emitting device 200C are sequentially formed in the third pixel opening Q3.

[0339] The first initial isolation structure 110i and the second initial isolation structure 120i, after forming the first pixel opening Q1, the second pixel opening Q2, and the third pixel opening Q3, respectively, form a first isolation pattern 110 and a second isolation pattern 120. The first isolation pattern 110 includes a first portion 111 and a second portion 120 stacked and arranged in a direction away from the substrate 310. The second portion 112 includes a first edge portion 112a, which extends relative to the first portion 111 toward the center line M of the adjacent pixel opening Q. The second electrodes 230 of the first, second, and third light-emitting devices 200A, 200D, and 200C are all in contact with and electrically connected to the second isolation pattern 120. Along a first direction X, the light-emitting functional layers 220 of the first, second, and third light-emitting devices 200A, 200D, and 200C are located between the first electrode 210 and the plane of the first edge portion 112a located near the surface of the substrate 310. The first direction X is the thickness direction of the substrate 310.

[0340] The beneficial effects that can be achieved by the method for preparing the display panel 300 are the same as the beneficial effects that can be achieved by the display panel 300 , and will not be described in detail here.

[0341] For a clearer explanation, Preparation Example 1 is used to exemplify the case where at least one first pixel opening Q1 and at least one second pixel opening Q2 are formed in the same step, and Preparation Example 2 is used to exemplify the case where at least one first pixel opening Q1 and at least one second pixel opening Q2 are formed in different steps. In the following preparation examples, the method for removing the material of the initial light-emitting functional layer (e.g., the first initial light-emitting functional layer 220Ai, the first initial light-emitting functional layer 220Di, or the third initial light-emitting functional layer 220Ci), the second initial electrode (e.g., the second initial electrode represented by the number 230i, 230ii, or 230iii), and the initial encapsulation layer (e.g., the first initial encapsulation layer 361i, the second initial encapsulation layer 362i, or the third initial encapsulation layer 363i) is, for example, a dry etching process.

[0342] Preparation Example 1

[0343] The manufacturing method of the display panel 300 is as follows: Figures 11A to 11J As shown, it includes R1 to R16.

[0344] R1: If Figure 11A As shown, a substrate 310 is provided.

[0345] R2: If Figure 11A As shown, the first electrodes 210 of a plurality of light emitting devices 200 are formed on a substrate 310 .

[0346] R3: If Figure 11A As shown, a third initial film layer 113i, a first initial film layer 111i, a second initial film layer 112i, a sixth initial film layer 123i, a fourth initial film layer 121i, and a fifth initial film layer 122i are sequentially formed on the side of the plurality of first electrodes 210 away from the substrate 310. The first initial film layer 111i and the third initial film layer 113i are made of silicon oxide, the second initial film layer 112i is made of silicon nitride, the sixth initial film layer 123i and the fifth initial film layer 122i are made of titanium, and the fourth initial film layer 121i is made of aluminum.

[0347] R4: If Figure 11B As shown, one or more etching processes are used to pattern the third initial film layer 113i, the first initial film layer 111i, the second initial film layer 112i, the sixth initial film layer 123i, the fourth initial film layer 121i, and the fifth initial film layer 122i to form at least one first pixel opening Q1.

[0348] R5: Figure 11CAs shown, a full-surface evaporation process is used to sequentially form a first initial light-emitting functional layer 220Ai and a second initial electrode 230i in at least one first pixel opening Q1 and on a side of the fifth initial film layer 122i retained in R4 away from the substrate 310.

[0349] R6: If Figure 11D As shown, a deposition process is used to form a first preliminary encapsulation layer 361i on a side of the second preliminary electrode 230i away from the first preliminary light-emitting functional layer 220Ai.

[0350] R7: Figure 11E As shown, an etching process is used to remove the materials of the first initial light-emitting functional layer 220Ai, the second initial electrode 230i and the first initial encapsulation layer 361i away from at least one first pixel opening Q1, so that the retained first initial light-emitting functional layer 220Ai forms the first light-emitting functional layer 220A, the first pattern layer 340 and the second pattern layer 350; the retained second initial electrode 230i forms at least the second electrode 230 of at least one first light-emitting device 200A, and a part of the first partition film group 370; the retained first initial encapsulation layer 361i forms the first encapsulation pattern 361.

[0351] In some examples, the above-mentioned removal of the materials of the first initial light-emitting functional layer 220Ai, the second initial electrode 230i, and the first initial encapsulation layer 361i away from at least one first pixel opening Q1 includes the materials of the first initial light-emitting functional layer 220Ai, the second initial electrode 230i, and the first initial encapsulation layer 361i located in the light-transmitting area of ​​the display panel 300.

[0352] R8: Figure 11F As shown, one or more etching processes are used to pattern the portions of the third initial film layer 113i, the first initial film layer 111i, the second initial film layer 112i, the sixth initial film layer 123i, the fourth initial film layer 121i, and the fifth initial film layer 122i retained in R4 to form at least one second pixel opening Q2.

[0353] R9: If Figure 11G As shown, a full-surface evaporation process is used to sequentially form a second initial light-emitting functional layer and a second initial electrode in at least one second pixel opening Q2 and on a side of the fifth initial film layer 122i retained in R8 away from the substrate 310.

[0354] R10: Figure 11G As shown, a deposition process is used to form a second initial encapsulation layer on a side of the second initial electrode formed in R9 away from the second initial light-emitting functional layer.

[0355] R11: Figure 11GAs shown, an etching process is used to remove the materials of the second initial light-emitting functional layer, the second initial electrode and the second initial encapsulation layer away from at least one second pixel opening Q2, so that the retained second initial light-emitting functional layer at least forms the second light-emitting functional layer 220D and a portion of the second partition film group 380; the retained second initial electrode at least forms the second electrode 230 of at least one second light-emitting device 200D, and a portion of the second partition film group 380; the retained second initial encapsulation layer forms a second encapsulation pattern 362.

[0356] In some examples, the above-mentioned removal of the second initial light-emitting functional layer, the second initial electrode, and the second initial encapsulation layer materials away from at least one second pixel opening Q2 includes the second initial light-emitting functional layer, the second initial electrode, and the second initial encapsulation layer materials located in the light-transmitting area of ​​the display panel 300.

[0357] R12: Figure 11H As shown, one or more etching processes are used to pattern the portions of the third initial film layer 113i, the first initial film layer 111i, the second initial film layer 112i, the sixth initial film layer 123i, the fourth initial film layer 121i, and the fifth initial film layer 122i retained in R8 to form at least one third pixel opening Q3.

[0358] R13: If Figure 11I As shown, a full-surface evaporation process is used to sequentially form a third initial light-emitting functional layer and a second initial electrode in at least one third pixel opening Q3 and on a side of the fifth initial film layer 122i retained in R11 away from the substrate 310.

[0359] R14: Figure 11I As shown, a deposition process is used to form a third initial encapsulation layer on a side of the second initial electrode formed in R13 away from the third initial light-emitting functional layer.

[0360] R15: Figure 11I As shown, an etching process is used to remove the materials of the third initial light-emitting functional layer, the second initial electrode and the third initial encapsulation layer away from at least one third pixel opening Q3, so that the retained third initial light-emitting functional layer at least forms the third light-emitting functional layer 220C and a portion of the third partition film group 390; the retained second initial electrode at least forms the second electrode 230 of at least one third light-emitting device 200C, and a portion of the third partition film group 390; and the retained third initial encapsulation layer forms a third encapsulation pattern 363.

[0361] In some examples, the above-mentioned removal of the third initial light-emitting functional layer, the second initial electrode, and the third initial encapsulation layer materials away from at least one third pixel opening Q3 includes the third initial light-emitting functional layer, the second initial electrode, and the third initial encapsulation layer materials located in the light-transmitting area of ​​the display panel 300.

[0362] R16: Figure 11J As shown, a second sub-layer 332 and a third sub-layer 333 of the encapsulation structure 330 are sequentially formed on the side of the first encapsulation pattern 361 , the second encapsulation pattern 362 , and the third encapsulation pattern 363 away from the substrate 310 .

[0363] Preparation Example 2

[0364] The manufacturing method of the display panel 300 is as follows: Figures 12A to 12J As shown, it includes U1 to U15.

[0365] U1: If Figure 12A As shown, a substrate 310 is provided.

[0366] U2: If Figure 12A As shown, the first electrodes 210 of a plurality of light emitting devices 200 are formed on a substrate 310 .

[0367] U3: If Figure 12A As shown, a third initial film layer 113i, a first initial film layer 111i, a second initial film layer 112i, a sixth initial film layer 123i, a fourth initial film layer 121i, and a fifth initial film layer 122i are sequentially formed on the side of the multiple first electrodes 210 away from the substrate 310.

[0368] U4: If Figure 12A As shown, a first mask layer PR1 is formed on a side of the fifth preliminary film layer 122i away from the fourth preliminary film layer 121i.

[0369] U5: Figure 12B As shown, the fourth initial film layer 121i, the fifth initial film layer 122i, and the sixth initial film layer 123i are patterned by an etching process to form a portion of a plurality of pixel openings Q away from the substrate 310 (i.e., a second sub-opening Qb), and a second isolation pattern 120. The plurality of pixel openings Q include at least one first pixel opening Q1 (see Figure 12D ), at least one second pixel opening Q2 and at least one third pixel opening Q3.

[0370] U6: Figure 12C As shown, a second mask layer PR2 is formed outside the second isolation pattern 120 .

[0371] U7: If Figure 12D As shown, the etching process is used to pattern the third initial film layer 113i (see Figure 12C ), a first preliminary film layer 111i, and a second preliminary film layer 112i are formed to form portions of a plurality of pixel openings Q close to the substrate 310 (i.e., first sub-openings Qa), and a first isolation pattern 110. The plurality of pixel openings Q include at least one first pixel opening Q1, at least one second pixel opening Q2, and at least one third pixel opening Q3.

[0372] U8: Figure 12E As shown, a full-surface evaporation process is used to sequentially form a first initial light-emitting functional layer 220Ai and a second initial electrode 230i within a plurality of pixel openings Q and on a side of the isolation structure 100 away from the substrate 310, and a first initial encapsulation layer 361i is formed on a side of the second initial electrode 230i away from the first initial light-emitting functional layer 220Ai.

[0373] U9: Figure 12E and Figure 12F As shown, a third mask layer PR3 is formed on the side of the first initial encapsulation layer 361i away from the second initial electrode 230i; then, an etching process is used to remove the materials of the first initial light-emitting functional layer 220Ai, the second initial electrode 230i and the first initial encapsulation layer 361i away from at least one first pixel opening Q1, so that the retained first initial light-emitting functional layer 220Ai forms the first light-emitting functional layer 220A, the first pattern layer 340 and the second pattern layer 350; the retained second initial electrode 230i forms at least the second electrode 230 of at least one first light-emitting device 200A, and a part of the first partition film group 370; the retained first initial encapsulation layer 361i forms the first encapsulation pattern 361.

[0374] U10: Figure 12G As shown, a full-surface evaporation process is used to sequentially form a second initial light-emitting functional layer 220Di and a second initial electrode 230ii in other pixel openings Q except at least one first pixel opening Q1, and on the side of the first encapsulation pattern 361 and the isolation structure 100 away from the substrate 310, and a second initial encapsulation layer 362i is formed on the side of the second initial electrode 230ii away from the second initial light-emitting functional layer 220Di.

[0375] U11: such as 12G and Figure 12HAs shown, a fourth mask layer PR4 is formed on the side of the second initial encapsulation layer 362i away from the second initial electrode 230ii; then, an etching process is used to remove the materials of the second initial light-emitting functional layer 220Di, the second initial electrode 230ii and the second initial encapsulation layer 362i away from at least one second pixel opening Q2, so that the retained second initial light-emitting functional layer 220Di at least forms the second light-emitting functional layer 220D and a part of the second partition film group 380; the retained second initial electrode 230ii at least forms the second electrode 230 of at least one second light-emitting device 200D, and a part of the second partition film group 380; the retained second initial encapsulation layer 362i forms a second encapsulation pattern 362.

[0376] U12: Figure 12H As shown, a whole-surface evaporation process is adopted to sequentially form a third initial light-emitting functional layer 220Ci and a second initial electrode 230iii in other pixel openings Q except at least one first pixel opening Q1 and at least one second pixel opening Q2, as well as on the side of the first packaging pattern 361, the second packaging pattern 362 and the isolation structure 100 away from the substrate 310, and a third initial packaging layer 363i is formed on the side of the second initial electrode 230iii away from the third initial light-emitting functional layer 220Ci.

[0377] U13: Figure 12H and Figure 12I As shown, a fifth mask layer PR5 is formed on the side of the third initial encapsulation layer 363i away from the second initial electrode 230iii; then, an etching process is used to remove the materials of the third initial light-emitting functional layer 220Ci, the second initial electrode 230iii and the third initial encapsulation layer 363i away from at least one third pixel opening Q3, so that the retained third initial light-emitting functional layer 220Ci at least forms the third light-emitting functional layer 220C and a part of the third partition film group 390; the retained second initial electrode 230iii forms at least the second electrode 230 of at least one third light-emitting device 200C, and a part of the third partition film group 390; the retained third initial encapsulation layer 363i forms a third encapsulation pattern 363.

[0378] U14: Figure 12J As shown, the second sub-layer 332 and the third sub-layer 333 of the encapsulation structure 330 are sequentially formed on the first encapsulation pattern 361, the second encapsulation pattern 362, the third encapsulation pattern 363, and the side of the isolation structure 100 away from the substrate 310 that is not covered by the encapsulation pattern 360. The encapsulation pattern 360 includes the first encapsulation pattern 361, the second encapsulation pattern 362, and the third encapsulation pattern 363.

[0379] The above is an exemplary description of the display panel 300 and its preparation method when the isolation structure 100 includes a first isolation pattern 110 and a second isolation pattern 120. The structure of another display panel 300 will be described below. It should be noted that in the following embodiments, the present disclosure does not limit the structure of the isolation structure 100 included in the display panel 300.

[0380] Some embodiments of the present disclosure provide a display panel 300. Figure 9C As shown, the display panel 300 includes a substrate 310, an isolation structure 100, a first isolation film group 370, a second isolation film group 380, and a plurality of light-emitting devices 200. The isolation structure 100 is disposed on the substrate 310 and defines a first pixel opening Q1 and a second pixel opening Q2. The plurality of light-emitting devices 200 include a first light-emitting device 200A and a second light-emitting device 200D; the first light-emitting device 200A is disposed in a first pixel opening Q1, and the second light-emitting device 200D is disposed in a second pixel opening Q2, and the light-emitting colors of the first light-emitting device 200A and the second light-emitting device 200D are different; the first light-emitting device 200A and the second light-emitting device 200D both include a first electrode 210 and a second electrode 230 arranged opposite to each other along a first direction X, the first electrode 210 is closer to the substrate 310 than the second electrode 230, and the first direction X is the thickness direction of the substrate 310; the second electrode 230 is in contact with and electrically connected to the isolation structure 100; the first light-emitting device 200A also includes a first light-emitting functional layer 220A located between the first electrode 210 and the second electrode 230 of the first light-emitting device 200A; the second light-emitting device 200D also includes a second light-emitting functional layer 220D located between the first electrode 210 and the second electrode 230 of the second light-emitting device 200D.

[0381] The first partition film group 370 includes a first partition layer 371 and a second partition layer 372 stacked in a direction away from the substrate 310. The first partition layer 371 and the first light-emitting functional layer 220A are made of the same material, and the second partition layer 372 and the second electrode 230 are made of the same material. The second partition film group 380 includes a third partition layer 381 and a fourth partition layer 382 stacked in a direction away from the substrate 310. The third partition layer 381 and the second light-emitting functional layer 220D are made of the same material, and the fourth partition layer 382 and the second electrode 230 are made of the same material.

[0382] The first and second partition film groups 370 and 380 are both located on a side of the isolation structure 100 away from the substrate 310. The first partition film group 370 includes a first edge portion 370A away from the first light-emitting device 200A, with the first edge portion 370A gradually decreasing in size along the first direction X. Alternatively, the second partition film group 380 includes a second edge portion 380A away from the second light-emitting device 200D, with the second edge portion 380A gradually decreasing in size along the first direction X. The first edge portion 370A and the second edge portion 380A located between the first light-emitting device 200A and the second light-emitting device 200D adjacent to the first light-emitting device 200A overlap each other.

[0383] Here, for the understanding of the first light-emitting device 200A, the second light-emitting device 200D, the first partition film group 370, the second partition film group 380, the first edge portion 370A, and the second edge portion 380A, please refer to the description of the first light-emitting device 200A, the second light-emitting device 200D, the first partition film group 370, the second partition film group 380, the first edge portion 370A, and the second edge portion 380A in the aforementioned part, which will not be repeated here.

[0384] It can be understood that through the above-mentioned arrangement, the first partition film group 370 and the second partition film group 380 can be overlapped with each other through the first edge portion 370A and the second edge portion 380A. In this way, as described above, firstly, it is beneficial to improve the structural integrity of the fifth part 122; secondly, it can reduce the difficulty of preparing the display panel 300; thirdly, it can make the dimensional change of the overlapping part of the first partition film group 370 and the second partition film group 380 in the first direction X relatively gentle. In this way, it can prevent the packaging structure 330 from cracking due to the appearance of the corner area, and can improve the packaging performance.

[0385] In some embodiments, as Figure 9C As shown, the first partition film group 370 further includes a first partition portion 370B connected to the first edge portion 370A. The first partition portion 370B is closer to the first light emitting device 200A than the first edge portion 370A.

[0386] The second partition film assembly 380 further includes a second partition portion 380B connected to the second edge portion 380A. The second partition portion 380B is closer to the second light-emitting device 200D than the second edge portion 380A. In a region SS1 between the first light-emitting device 200A and the second light-emitting device 200D adjacent to the first light-emitting device 200A, the maximum value of the sum of the dimensions of the first edge portion 370A and the second edge portion 380A in the first direction X is smaller than the sum of the dimensions of the first partition portion 370B and the second partition portion 380B in the first direction X.

[0387] Here, for understanding the first partition portion 370B and the second partition portion 380B, please refer to the description of the first partition portion 370B and the second partition portion 380B in the aforementioned part, which will not be repeated here.

[0388] As described above, through the above setting, the height difference between the surface of the first partition film group 370 away from the substrate 310 and the surface of the second partition film group 380 away from the substrate 310 can be reduced, which is beneficial to improving the flatness of the display panel 300. As described above, the packaging performance can be improved.

[0389] In some embodiments, as Figure 9C As shown, the plurality of light-emitting devices 200 further include a third light-emitting device 200C, which includes a third light-emitting functional layer 220C. The first, second, and third light-emitting devices each emit different colors. The display panel 300 also includes a third partitioning film group 390. The third partitioning film group 390 is located on a side of the isolation structure 100 away from the substrate 310. The third partitioning film group 390 includes a fifth partitioning layer 391 and a sixth partitioning layer 392 stacked in a direction away from the substrate 310. The fifth partitioning layer 391 and the third light-emitting functional layer 220C are made of the same material, while the sixth partitioning layer 392 and the second electrode 230 are made of the same material. The third partitioning film group 390 includes a third edge portion 390A away from the third light-emitting device 200C, with the size of the third edge portion 390A gradually decreasing in the first direction X. The first edge portion 370A and the third edge portion 390A located between the first light-emitting device 200A and the third light-emitting device 200C adjacent to the first light-emitting device 200A overlap with each other; and / or, the second edge portion 380A and the third edge portion 390A located between the second light-emitting device 200D and the third light-emitting device 200C adjacent to the second light-emitting device 200D overlap with each other.

[0390] Here, for understanding the third light-emitting device 200C and the third edge portion 390A, reference may be made to the description of the third light-emitting device 200C and the third edge portion 390A in the aforementioned part, which will not be repeated here.

[0391] As described above, through the above-mentioned arrangement, the structural integrity of the fifth part 122 can be improved, and the difficulty of preparing the display panel 300 can be reduced. At the same time, the dimensional change of the overlapping parts of the first partition film group 370 and the third partition film group 390, and / or the second partition film group 380 and the third partition film group 390 in the first direction X can be relatively gentle. In this way, the packaging structure 330 can be prevented from cracking due to the presence of corner areas, and the packaging performance can be improved.

[0392] In some embodiments, as Figure 9CAs shown, the third partition film group 390 further includes a third partition portion 390B connected to the third edge portion 390A. The third partition portion 390B is closer to the third light-emitting device 200C than the third edge portion 390A. In a region SS between the first light-emitting device 200A and the third light-emitting device 200C adjacent to the first light-emitting device 200A, the maximum sum of the dimensions of the first edge portion 370A and the third edge portion 390A in the first direction X is less than the sum of the dimensions of the first partition portion 370B and the third partition portion 390B in the first direction X. And / or, in a region SS3 between the second light-emitting device 200D and the third light-emitting device 200C adjacent to the second light-emitting device 200D, the maximum sum of the dimensions of the second edge portion 380A and the third edge portion 390A in the first direction X is less than the sum of the dimensions of the second partition portion 380B and the third partition portion 390B in the first direction X.

[0393] Here, for understanding the third partition portion 390B, please refer to the description of the third partition portion 390B in the aforementioned part, which will not be repeated here.

[0394] As mentioned above, through the above-mentioned setting, the height difference between the surface of the first partition film group 370 away from the substrate 310, the surface of the second partition film group 380 away from the substrate 310, and the surface of the third partition film group 390 away from the substrate 310 can be reduced, which is beneficial to improving the flatness of the display panel 300 and can improve the packaging performance.

[0395] In some embodiments, as Figure 9C As shown, the display panel 300 further includes a first encapsulation pattern 361, a second encapsulation pattern 362, and a third encapsulation pattern 363. The first encapsulation pattern 361 covers the first light-emitting device 200A and a portion of the surface of the second barrier layer 372 away from the substrate 310. The first barrier film group 370 further includes a portion of the first encapsulation pattern 361 covering the surface of the second barrier layer 372 away from the substrate 310. The second encapsulation pattern 362 covers the second light-emitting device 200D and a portion of the surface of the fourth barrier layer 382 away from the substrate 310. The second barrier film group 380 further includes a portion of the second encapsulation pattern 362 covering the surface of the fourth barrier layer 382 away from the substrate 310. The third encapsulation pattern 363 covers the third light-emitting device 200C and a portion of the surface of the sixth barrier layer 392 away from the substrate 310. The third barrier film group 390 further includes a portion of the third encapsulation pattern 363 covering the surface of the sixth barrier layer 392 away from the substrate 310.

[0396] Here, for understanding the first encapsulation pattern 361 , the second encapsulation pattern 362 and the third encapsulation pattern 363 , reference may be made to the description of the first encapsulation pattern 361 and the second encapsulation pattern 362 in the aforementioned part, which will not be repeated here.

[0397] As mentioned above, through the above-mentioned setting, the material of the initial light-emitting functional layer (including the initial light-emitting functional layer corresponding to the first light-emitting functional layer 220A, the second light-emitting functional layer 220D and the third light-emitting functional layer 220C) can be prevented from being damaged by the influence of water vapor and oxygen in the external environment. In this way, the life of the display panel 300 can be improved.

[0398] In some embodiments, during the etching process to form the light-emitting device 200, a mask layer needs to be formed to define the boundary between the material to be removed and the material to be retained when forming the light-emitting device 200. For example, in U9 of the above-mentioned preparation example 2, the third mask layer PR3 is used to define the boundary between the material to be removed and the material to be retained when forming at least one first light-emitting device 200A; in U11 of the above-mentioned preparation example 2, the fourth mask layer PR4 is used to define the boundary between the material to be removed and the material to be retained when forming at least one second light-emitting device 200D; and in U13 of the above-mentioned preparation example 2, the fifth mask layer PR5 is used to define the boundary between the material to be removed and the material to be retained when forming at least one third light-emitting device 200C.

[0399] In practical applications, the mask plate assembly 500G is required to form the mask layer. The mask plate assembly 500G used in preparing the display panel 300 is exemplarily introduced below.

[0400] In some embodiments, the mask assembly includes a mask for forming at least one first light emitting device 200A (see Figure 5 ), a second mask for forming at least one second light emitting device 200D, and a third mask for forming at least one third light emitting device 200C. The first mask includes at least one first opening, which is used to define a boundary 370a of the first partition film group 370 away from the first pixel opening Q1 (see Figure 5 The second mask includes at least one second opening, which is used to define a boundary 380a of the second partition film group 380 away from the second pixel opening Q2. The third mask includes at least one third opening, which is used to define a boundary 390a of the third partition film group 390 away from the third pixel opening Q3.

[0401] In some examples, such as Figure 13AAs shown, the orthographic projection of the first opening on the reference plane D1-600 is D1-N1', the orthographic projection of the second opening on the reference plane D1-600 is D1-N2', and the orthographic projection of the third opening on the reference plane D1-600 is D1-N3'. In this way, the structure of the display panel 300 prepared using the mask assembly can be as follows: Figure 9A As shown, a gap is formed between the first partition film group 370 and the second partition film group 380 in the second direction Y. The second direction Y is parallel to a line connecting the center of the first light emitting device 200A and the center of the second light emitting device 200D.

[0402] In some examples, such as Figure 13B As shown, the orthographic projection of the first opening on the reference plane D2-600 is D2-N1', the orthographic projection of the second opening on the reference plane D2-600 is D2-N2', and the orthographic projection of the third opening on the reference plane D2-600 is D2-N3'. In this way, the structure of the display panel 300 prepared using the mask assembly can be as follows: Figure 9B As shown, along the second direction Y, one of the first blocking film group 370 and the second blocking film group 380 is located on a side of the other away from the substrate 310 .

[0403] It is noteworthy that the edges of the openings of the mask are relatively flat, so that the edges of the formed light-emitting device 200 are perpendicular or nearly perpendicular to the substrate 310. Another mask assembly will be described below. Using this mask assembly 500G, the light-emitting device 200 of the display panel 300 can be prepared. The partition film group (e.g., the first partition film group 370, the second partition film group 380, or the third partition film group 390) in the display panel 300 can include edge portions (e.g., the first edge portion 370A, the second edge portion 380A, or the third edge portion 390A), so that adjacent edge portions can overlap each other.

[0404] Some embodiments of the present disclosure provide a mask assembly 500G. Figure 14A 、 Figure 14B 、 Figure 15A 、 Figure 15B 、 Figure 17A 、 Figure 17B and Figure 5 As shown, the mask assembly 500G includes at least one mask 500. The mask 500 includes a sub-pixel pattern N corresponding to a sub-pixel of the display panel 300, and a boundary of the sub-pixel pattern N has a microstructure Nx.

[0405] Here, regarding the manner in which the sub-pixels of the display panel 300 correspond to the sub-pixel pattern N, for example, the boundary of the partition film group (for example, the first partition film group 370, the second partition film group 380, or the third partition film group 390) away from the pixel opening Q is defined by the sub-pixel pattern N to form the corresponding sub-pixel. When the sub-pixel pattern N corresponds to the sub-pixel of the first light-emitting device 200A, the above-mentioned manner is specifically, for example: first, a mask layer (for example, the third mask layer PR3 in U9 above) is formed on the side of the first initial encapsulation layer 361i away from the second initial electrode 230i; then, the mask layer is exposed using a mask template 500, and developed after exposure, so that the portion of the mask layer located on the first encapsulation pattern 361 is retained and the remaining portion is removed; then, an etching process (for example, a dry etching process) is used to etch the first initial light-emitting functional layer 220Ai, the second initial electrode 230i, and the first initial encapsulation layer 361i (hereinafter referred to as the first film group to be etched, see Figure 12E ), and the mask layer located at the first pixel opening Q1 is etched to remove the material of the first to-be-etched film group away from the at least one first pixel opening Q1.

[0406] In some examples, such as Figure 14A 、 Figure 14B 、 Figure 15A 、 Figure 15B and Figure 5 As shown, the mask assembly 500G includes a first mask 510 corresponding to the first light-emitting device 200A of the display panel 300, and a second mask 520 corresponding to the second light-emitting device 200D of the display panel 300. The first mask 510 includes a first sub-pixel pattern N1, the boundary of which has a first microstructure N1x; the second mask 520 includes a second sub-pixel pattern N2, the boundary of which has a second microstructure N2x.

[0407] In some examples, such as Figure 17A 、 Figure 17B and Figure 5 As shown, the mask assembly 500G further includes a third mask 530 corresponding to the third light emitting device 200C of the display panel 300. The third mask 530 includes a third sub-pixel pattern N3, and a boundary of the third sub-pixel pattern N3 has a third microstructure N3x.

[0408] It can be understood that when the boundary of the sub-pixel pattern N has a microstructure Nx, the material in the mask layer that is opposite to the boundary of the sub-pixel pattern N is in a semi-exposed state, so that after the mask layer is developed, the portion of the mask layer that is opposite to the boundary of the sub-pixel pattern N is retained, and the thickness of the retained mask layer is less than the thickness before etching, so that a film thickness gradient region can be formed. In this way, when etching the film group to be etched, the etching amount of the film group to be etched (for example, the first film group to be etched) that is opposite to the boundary of the sub-pixel pattern N is less than the etching amount of the film group to be etched that is far away from the pixel opening Q; the partition film group (for example, the first partition film group 37) in the display panel 300 can be made 0, the second partition film group 380 or the third partition film group 390) includes an edge portion (for example, the first edge portion 370A, the second edge portion 380A or the third edge portion 390A), so that adjacent edge portions can overlap each other. In this way, as described above, firstly, it is beneficial to improve the flatness of the display panel 300 and improve the packaging performance; secondly, it can enable the partition film group (for example, at least one of the first partition film group 370, the second partition film group 380 and the third partition film group 390) to better cover the fifth portion 122, which is beneficial to improve the structural integrity of the fifth portion 122; thirdly, it can reduce the difficulty of preparing the display panel 300.

[0409] In some embodiments, as Figure 14A 、 Figure 15A and Figure 16A As shown, the mask plate 500 includes a transparent substrate 503 and a shielding pattern 504 provided on the transparent substrate 503 . The shielding pattern 504 is a sub-pixel pattern N, and the microstructure Nx is formed on the shielding pattern 504 .

[0410] For example, the material of the light-transmitting substrate 503 may be glass.

[0411] Exemplarily, the material of the shielding pattern 504 may be a metal material, such as chromium.

[0412] It should be understood that when the shielding pattern 504 is a sub-pixel pattern N, the light emitting device 200 is formed by etching (see Figure 5 ) The material of the mask layer used can be positive photoresist.

[0413] Through the above arrangement, during exposure, the sub-pixel pattern N (e.g., the first sub-pixel pattern N1, the second sub-pixel pattern N2, or the third sub-pixel pattern N3) can block the mask layer located on the selected light-emitting device 200. Thus, after development, the mask layer located on the selected light-emitting device 200 (e.g., the first light-emitting device 200A, the second light-emitting device 200D, or the third light-emitting device 200C) can be retained, while the remaining portion is removed. For example, during exposure, the sub-pixel pattern N1 can block the mask layer located on at least one first light-emitting device 200A. Thus, after development, the mask layer located on at least one first light-emitting device 200A can be retained, while the remaining portion is removed.

[0414] In some embodiments, as Figure 14B 、 Figure 15B and Figure 16B As shown, the mask 500 includes a light-shielding substrate 501 . The light-shielding substrate 501 defines an opening 502 . The opening 502 is a sub-pixel pattern N. The microstructure Nx is formed on the light-shielding substrate 501 .

[0415] Exemplarily, the light shielding substrate 501 may be made of a metal material, such as chromium.

[0416] In some examples, the light-shielding substrate 501 is disposed on a transparent base plate, and the material of the transparent base plate is, for example, glass.

[0417] It should be understood that when the opening 502 is a sub-pixel pattern N, the light emitting device 200 is formed by etching (see Figure 5 ) The material of the mask layer used can be a negative photoresist.

[0418] With the above arrangement, during exposure, the sub-pixel pattern N (e.g., the first sub-pixel pattern N1, the second sub-pixel pattern N2, or the third sub-pixel pattern N3) can expose the mask layer located on the selected light-emitting device 200. Thus, after development, the mask layer located on the selected light-emitting device 200 (e.g., the first light-emitting device 200A, the second light-emitting device 200D, or the third light-emitting device 200C) can be retained, while the remaining portion can be removed. For example, during exposure, the first sub-pixel pattern N1 can expose the mask layer located on at least one first light-emitting device 200A. Thus, after development, the mask layer located on at least one first light-emitting device 200A can be retained, while the remaining portion can be removed.

[0419] It should be noted that the shapes of the first microstructure N1x, the second microstructure N2x, and the third microstructure N3x are not limited herein. In some examples, the same sub-pixel pattern (e.g., the first sub-pixel pattern N1, the second sub-pixel pattern N2, or the third sub-pixel pattern N3) can have micropatterns of various shapes.

[0420] In some embodiments, as Figure 14A 、 Figure 14B 、 Figure 15A 、 Figure 15B 、 Figure 17A 、 Figure 17B As shown, the microstructure Nx includes a plurality of sub-patterns Nxa arranged along the boundary of the sub-pixel pattern N.

[0421] It can be understood that through the above-mentioned setting, along the extension direction of the boundary of the sub-pixel graphic N, in the boundary area of ​​the mask plate 500, the sub-areas with sub-graphics Nax and the sub-areas without sub-graphics Nax are relatively dispersed. In this way, after exposure and development, along the extension direction of the boundary of the sub-pixel graphic N, the thickness of the material opposite to the boundary of the sub-pixel graphic N is relatively uniform. This is beneficial to improving the surface flatness of the edge parts (for example, the first edge part 370A, the second edge part 380A or the third edge part 390A) of the partition film group (for example, the first partition film group 370, the second partition film group 380 or the third partition film group 390) in the display panel 300 after overlapping each other, which can improve the packaging performance of the display panel 300.

[0422] In some embodiments, as Figure 14A 、 Figure 14B 、 Figure 15A 、 Figure 15B 、 Figure 17A 、 Figure 17B As shown, at least one mask plate 500 includes a first mask plate 510 and a second mask plate 520; the first mask plate 510 is used to make the first light emitting device 200A of the display panel 300 (see Figure 5 ), the second mask plate 520 is used to fabricate the second light-emitting device 200D of the display panel 300. The microstructure of the first mask plate 510 includes a plurality of first sub-patterns N1xa, and the microstructure of the second mask plate 520 includes a plurality of second sub-patterns N2xa. The first sub-patterns N1xa and the second sub-patterns N2xa have the same shape; and / or the spacing between two adjacent first sub-patterns N1xa is the same as the spacing between two adjacent second sub-patterns N2xa.

[0423] Here, the first sub-graph N1xa and the second sub-graph N2xa have the same shape, which means that the first sub-graph N1xa and the second sub-graph N2xa are similar shapes, and / or the corresponding sides of the first sub-graph N1xa and the second sub-graph N2xa have the same size.

[0424] It should be understood that in order to achieve the mutual overlap of the first edge portion 370A and the second edge portion 380A, when designing the mask template assembly 500G, it is necessary to position the first sub-pixel pattern N1 projected to the position of the first film group to be etched, and the second sub-pixel pattern N2 projected to the position of the second film group to be etched (for example, including the second initial light-emitting functional layer 220Bi, the second initial electrode 230ii and the second initial encapsulation layer 362i) so that the two can overlap in the edge area. In this way, the first edge portion 370A formed by the first sub-pixel pattern N1 and the second edge portion 380A formed by the second sub-pixel pattern N2 can overlap with each other.

[0425] When the first sub-pattern N1xa and the second sub-pattern N2xa have the same shape; and / or the spacing between two adjacent first sub-patterns N1xa is the same as the spacing between two adjacent second sub-patterns N2xa, the first sub-pattern N1xa can be embedded in the gap between two adjacent second sub-patterns N2xa, and / or the second sub-pattern N2xa can be embedded in the gap between two adjacent first sub-patterns N1xa. In this way, when positioning the first sub-pixel pattern N1 and the second sub-pixel pattern N2, the multiple first sub-pixel patterns N1 of the first mask plate 510 and the multiple second sub-pixel patterns N2 of the second mask plate 520 can be projected onto the same reference plane 600 (see Figure 16A ), the plurality of first sub-patterns N1xa of the first sub-pixel pattern N1 and the plurality of second sub-patterns N2xa of the second sub-pixel pattern N2 adjacent to the first sub-pixel pattern N1 are interlocked to achieve positioning of the first sub-pixel pattern N1 and the second sub-pixel pattern N2. Therefore, the above arrangement improves the operability of positioning the first sub-pixel pattern N1 and the second sub-pixel pattern N2, and reduces the difficulty of manufacturing the mask assembly 500G.

[0426] In some embodiments, as Figure 14A 、 Figure 14B 、 Figure 15A 、 Figure 15B 、 Figure 17A 、 Figure 17B As shown, at least one mask plate 500 further includes a third mask plate 530, which is used to fabricate the third light-emitting device 200C of the display panel 300. The microstructure N3x of the third mask plate 530 includes a plurality of third sub-patterns N3xa. The first sub-pattern N1xa, the second sub-pattern N2xa, and the third sub-pattern N3xa have the same shape; and / or the spacing between two adjacent first sub-patterns N1xa, the spacing between two adjacent second sub-patterns N2xa, and the spacing between two adjacent third sub-patterns N3xa are the same.

[0427] Here, for understanding the identical shapes of the first sub-graph N1xa, the second sub-graph N2xa, and the third sub-graph N3xa, please refer to the aforementioned description of the identical shapes of the first sub-graph N1xa and the second sub-graph N2xa, which will not be repeated here.

[0428] It can be understood that, similar to the above, the above arrangement can improve the operability of positioning the first sub-pixel pattern N1, the second sub-pixel pattern N2, and the third sub-pixel pattern N3, and reduce the manufacturing difficulty of the mask assembly 500G.

[0429] It should be noted that the shapes of the first sub-graph N1xa, the second sub-graph N2xa, and the third sub-graph N3xa are not limited herein.

[0430] In some embodiments, as Figure 14A 、 Figure 14B 、 Figure 15A 、 Figure 15B 、 Figure 17A 、 Figure 17B 、 Figure 19A and Figure 19B As shown, the shape of the sub-graphic Nax is a rectangle, a square, a triangle or a trapezoid.

[0431] For example, Figure 14A 、 Figure 14B 、 Figure 15A 、 Figure 15B 、 Figure 16A 、 Figure 16B 、 Figure 17A 、 Figure 17B 、 Figure 18A 、 Figure 18B 、 Figure 20A and Figure 20B As shown in FIG, the shape of the sub-graph Nax is a rectangle. For example, Figure 19A 、 Figure 19B Figure 21A and Figure 21B As shown, the shape of the sub-graphic Nax is a triangle.

[0432] It can be understood that when the microstructure Nx of the pixel sub-pattern N has the sub-pattern in the above-mentioned shape, on the reference plane 600 (see Figure 16A ), the adjacent sub-graphics Nxa are easily interlocked, which can improve the operability of positioning the sub-pixel graphic N.

[0433] For a clearer explanation, the following exemplifies the case where the first sub-pixel pattern N1, the second sub-pixel pattern N2, and the third sub-pixel pattern N3 are projected onto a reference plane 600. On the reference plane 600, the first sub-pixel pattern N1 has a first projection N1', the second sub-pixel pattern N2 has a first projection N2', and the third sub-pixel pattern N3 has a first projection N3'.

[0434] like Figure 16A 、 Figure 16B 、 Figure 18A 、 Figure 18B 、 Figure 19A 、 Figure 19B 、 Figure 20A 、 Figure 20B 、 Figure 21A and Figure 21B As shown, the mutually adjacent boundaries of the first projection N1 ′ and the second projection N2 ′ adjacent to each other in the third direction F1 are interlocked; the third direction F1 is the arrangement direction of the first projection N1 ′ and the second projection N2 ′.

[0435] The mutually adjacent boundaries of the third projection N3' and the first projection N1' adjacent to each other in the fourth direction F2 are interlocked; the fourth direction F2 is the arrangement direction of the third projection N3' and the first projection N1'; the mutually adjacent boundaries of the third projection N3' and the second projection N2' adjacent to each other in the fifth direction F3 are interlocked; the fifth direction F3 is the arrangement direction of the third projection N3' and the second projection N2'.

[0436] like Figure 5 、 Figure 16A and Figure 16B As shown, when the first light-emitting device 200A is adjacent to both the second light-emitting device 200D and the third light-emitting device 200C, the first projection N1' includes both a boundary interlocking with the second projection N2' and a boundary interlocking with the third projection N3'. The same applies to the second light-emitting device 200D and the third light-emitting device 200C.

[0437] In some embodiments, the display panel 300 includes a plurality of pixel units arranged in an array. Each pixel unit includes one or more first light emitting devices 200A, one or more second light emitting devices 200D, and one or more third light emitting devices 200C (see Figure 5 ).

[0438] In this case, in some embodiments, as Figure 16A 、 Figure 16B 、 Figure 18A 、 Figure 18B 、 Figure 19A 、 Figure 19B 、 Figure 20A 、 Figure 20B 、 Figure 21A and Figure 21B As shown, at least one first projection N1', at least one second projection N2', and at least one third projection N3' constitute a plurality of projection units NG. The arrangement direction of the plurality of projection units NG includes a first sub-direction Z1 and a second sub-direction Z2 that are perpendicular to each other.

[0439] It should be noted that Figure 18A 、 Figure 19A 、 Figure 20A and Figure 21A It can be understood as an arrangement diagram of the projection units NG on the reference plane 600 when the projection units NG are arranged in 3×3.

[0440] It can be understood that when at least one first projection N1', at least one second projection N2', and at least one third projection N3' constitute a plurality of projection units NG, at least one first light-emitting device 200A, at least one second light-emitting device 200D, and at least one third light-emitting device 200C prepared using the mask assembly 500G can constitute a plurality of pixel units. When the arrangement direction of the plurality of projection units NG includes a first sub-direction Z1 and a second sub-direction Z2 that are perpendicular to each other, the plurality of projection units NG on the reference plane 600 are arranged in an array. In this way, the display panel 300 (see Figure 5 ) includes multiple pixel units that can be arranged in an array.

[0441] It should be understood that in actual applications, the first light emitting device 200A (see Figure 5 ), the number of the second light-emitting devices 200D and the third light-emitting devices 200C, and the arrangement of the first light-emitting device 200A, the second light-emitting device 200D and the third light-emitting device 200C, the number of the first projection N1', the second projection N2' and the third projection N3' in the projection unit NG, and the arrangement of the first projection N1', the second projection N2' and the third projection N3' are designed, which will be exemplarily introduced below.

[0442] In some embodiments, as Figure 18A 、 Figure 18B 、 Figure 19A and Figure 19B As shown, each projection unit NG in the plurality of projection units NG includes a first projection N1', a second projection N2' and a third projection N3'. The first projection N1', the second projection N2' and the third projection N3' are arranged in sequence along the first sub-direction Z1 or the second sub-direction Z2.

[0443] For example, Figure 18A 、 Figure 18B 、 Figure 19A andFigure 19B As shown, the first projection N1 ′, the second projection N2 ′ and the third projection N3 ′ are arranged in sequence along the second sub-direction Z2 .

[0444] Through the above configuration, the projection unit NG can be displayed as follows Figure 18A and Figure 19A As shown in the arrangement, in the display panel 300 prepared using the mask assembly 500, the pixel units can be arranged in the same manner as Figure 18A and Figure 19A A similar arrangement may also be referred to as a Real arrangement, or a Strip Real arrangement (eg, a Strip RGB arrangement).

[0445] It should be noted that Figure 18A and Figure 19A Taking the direction shown in as an example, two vertically adjacent projection units NG are spaced apart. In other words, the mutually adjacent boundaries of two vertically adjacent first projections N1' are spaced apart and do not fit together. The same is true for two vertically adjacent second projections N2' and two vertically adjacent third projections N3'.

[0446] In some embodiments, as Figure 20A 、 Figure 20B 、 Figure 21A and Figure 21B As shown, each projection unit NG in the plurality of projection units NG includes a first projection N1', a second projection N2', and a third projection N3'. Of the arrangement directions of the first projection N1' and the second projection N2', the arrangement direction of the first projection N1' and the third projection N3', and the arrangement direction of the second projection N2' and the third projection N3', two are parallel to the first sub-direction Z1, and the other is parallel to the second sub-direction Z2.

[0447] For example, Figure 20A 、 Figure 20B 、 Figure 21A and Figure 21B As shown, the arrangement direction of the first projection N1' and the third projection N3', and the arrangement direction of the second projection N2' and the third projection N3' are parallel to the second sub-direction Z2, and the arrangement direction of the first projection N1' and the second projection N2' is parallel to the first sub-direction Z1.

[0448] Through the above configuration, the projection unit NG can be displayed as follows Figure 20A and Figure 21A As shown in the arrangement, in the display panel 300 prepared using the mask assembly 500, the pixel units can be arranged in the same manner as Figure 20A and Figure 21AA similar arrangement may also be referred to as a Delta arrangement, or a Delta Real arrangement (eg, a DeltaRGB arrangement).

[0449] In some embodiments, as Figure 16A and Figure 16B As shown, each of the multiple projection units NG includes two first projections N1', one second projection N2', and one third projection N3'. The two first projections N1', one second projection N2', and one third projection N3' are arranged in a quadrilateral. The second projection N2' is arranged with one first projection N1' along the first sub-direction Z1, and with another first projection N1' along the second sub-direction Z2. The third projection N3' is arranged with one first projection N1' along the first sub-direction, and with another first projection N1' along the second sub-direction Z2. The boundary between the second projection N2' and the third projection N3' is located between the two first projections N1'.

[0450] Here, the two first projections N1′, the second projection N2′, and the third projection N3′ are distributed in a quadrilateral. It can be understood that on the reference plane 600, the centers of the two first projections N1′, the center of the second projection N2′, and the center of the third projection N3′ are connected end to end to form a quadrilateral.

[0451] Through the above configuration, the projection unit NG can be displayed as follows Figure 16A As shown in the arrangement, in the display panel 300 prepared using the mask assembly 500, the pixel units can be arranged in the same manner as Figure 16A A similar arrangement can also be called an SPR arrangement.

[0452] The above description is merely a specific embodiment of the present disclosure, but the scope of protection of the present disclosure is not limited thereto. Any changes or substitutions that a person skilled in the art can conceive within the technical scope disclosed in the present disclosure should be included within the scope of protection of the present disclosure. Therefore, the scope of protection of the present disclosure should be based on the scope of protection of the claims.

Claims

1. A display panel, characterized in that: include: substrate; An isolation structure is provided on the substrate; the isolation structure defines a pixel opening; The isolation structure includes a first isolation pattern and a second isolation pattern stacked in a direction away from the substrate; The first isolation pattern comprises an insulating material, the first isolation pattern comprises a first portion and a second portion stacked in a direction away from the substrate, the second portion comprises a first edge portion, and the first edge portion extends relative to the first portion in a direction close to a center line of the adjacent pixel opening; as well as, A light-emitting device is arranged in the pixel opening, including a first electrode, a light-emitting functional layer and a second electrode stacked in a direction away from the substrate, the second electrode is in contact with and electrically connected to the second isolation pattern; along the first direction, the light-emitting functional layer is located between the plane where the surface of the first edge portion close to the substrate is located and the first electrode, and the first direction is the thickness direction of the substrate.

2. The display panel according to claim 1, wherein: Also includes: a first pattern layer, located on a side of the first edge portion away from the substrate; the material of the light-emitting functional layer is the same as that of the first pattern layer; Wherein, there is a distance between the first pattern layer and the light-emitting functional layer in the first direction.

3. The display panel according to claim 1, wherein: The material of the first portion includes a first insulating material, the material of the second portion includes a second insulating material, and the first insulating material is different from the second insulating material.

4. The display panel according to claim 3, wherein: Under the same etching conditions, the etching rate of the first insulating material is greater than the etching rate of the second insulating material.

5. The display panel according to claim 1, wherein: A dimension of the first portion along the first direction is greater than a dimension of the second portion along the first direction.

6. The display panel according to claim 1, wherein: The first isolation pattern further includes: a third portion located between the first portion and the substrate; the third portion including a second edge portion, the second edge portion surrounding a center line of the adjacent pixel opening and extending relative to the first portion toward the center line of the adjacent pixel opening; The size of the first portion along the first direction is greater than the size of the third portion along the first direction.

7. The display panel according to claim 6, wherein: The material of the third portion is the same as that of the second portion.

8. The display panel according to claim 7, wherein: The edge of the second edge portion is closer to the center line of the adjacent pixel opening than the edge of the first edge portion.

9. The display panel according to any one of claims 1 to 5, wherein: An edge of the first portion close to the pixel opening covers an edge of the first electrode.

10. The display panel according to any one of claims 6 to 8, wherein: The first isolation pattern further includes the third portion, and a second edge portion of the third portion is close to an edge of the pixel opening and covers an edge of the first electrode.

11. The display panel according to claim 1, wherein The material of the first portion includes silicon nitride; and / or the material of the second portion includes silicon oxide.

12. The display panel according to claim 2, wherein: The second isolation pattern includes a fourth portion and a fifth portion stacked in a direction away from the substrate, the fifth portion includes a third edge portion, the third edge portion surrounds the center line of the adjacent pixel opening and extends in a direction close to the center line of the adjacent pixel opening relative to the fourth portion; the second electrode is in contact with and electrically connected to the fourth portion.

13. The display panel according to claim 12, wherein: Also includes: a second pattern layer, located on a side of the third edge portion away from the substrate; the material of the light-emitting functional layer is the same as that of the second pattern layer; Wherein, the first pattern layer and the second pattern layer have a distance in the first direction.

14. The display panel according to claim 12, wherein: A size of the fourth portion along the first direction is greater than a size of the fifth portion along the first direction.

15. The display panel according to claim 12, wherein: The second isolation pattern further includes: a sixth portion located between the fourth portion and the first isolation pattern; the sixth portion including a fourth edge portion, the fourth edge portion surrounding a center line of an adjacent pixel opening and extending relative to the fourth portion toward the center line of the adjacent pixel opening; the second electrode contacting and electrically connected to the fourth edge portion; Wherein, a size of the fourth portion along the first direction is greater than a size of the sixth portion along the first direction.

16. The display panel according to claim 12, wherein: The surface of the second electrode away from the substrate is closer to the substrate in the first direction than the surface of the isolation structure away from the substrate; The display panel further includes: An encapsulation pattern covers the light-emitting device, the sidewalls of the pixel opening, the surface of the third edge portion of the fifth portion close to the substrate, the side surface of the fifth portion, and at least a portion of the surface of the fifth portion away from the substrate.

17. The display panel according to claim 16, wherein: The encapsulation pattern includes a first sub-pattern and a second sub-pattern stacked in a direction away from the substrate, and the density of the first sub-pattern is higher than the density of the second sub-pattern.

18. The display panel according to claim 16 or 17, wherein: The light emitting device included in the display panel includes a first light emitting device and a second light emitting device, and the first light emitting device and the second light emitting device emit different colors; The encapsulation pattern includes a first encapsulation pattern covering the first light emitting device and a second encapsulation pattern covering the second light emitting device, and thicknesses of the first encapsulation pattern and the second encapsulation pattern are different.

19. The display panel according to any one of claims 1 to 8 and 11 to 15, wherein: The light-emitting device included in the display panel includes a first light-emitting device and a second light-emitting device, the first light-emitting device includes a first light-emitting functional layer, and the second light-emitting device includes a second light-emitting functional layer; the first light-emitting device and the second light-emitting device have different light-emitting colors; The display panel further includes: a first partition film group, the first partition film group including a first partition layer and a second partition layer stacked in a direction away from the substrate, the first partition layer and the first light-emitting functional layer being made of the same material, and the second partition layer and the second electrode being made of the same material; and a second partition film group, the second partition film group comprising a third partition layer and a fourth partition layer stacked in a direction away from the substrate, the third partition layer and the second light-emitting functional layer being made of the same material, and the fourth partition layer and the second electrode being made of the same material; The first partition film group and the second partition film group are both located on a side of the second isolation pattern away from the substrate.

20. The display panel according to claim 19, wherein In the second direction, one of the first partition film group and the second partition film group located between the first light-emitting device and the second light-emitting device adjacent to the first light-emitting device is partially overlapped with the side of the other away from the substrate; the second direction is parallel to the line connecting the center of the first light-emitting device and the center of the second light-emitting device.

21. The display panel according to claim 20, wherein: The first partition film group includes a first edge portion away from the first light emitting device, and a size of the first edge portion gradually decreases in the first direction; and / or, The second partition film group includes a second edge portion away from the second light emitting device, and a size of the second edge portion gradually decreases in the first direction; The first edge portion and the second edge portion located between the first light emitting device and the second light emitting device adjacent to the first light emitting device overlap each other.

22. The display panel according to claim 21, wherein: The first partition film group further includes a first partition portion connected to the first edge portion, and the first partition portion is closer to the first light emitting device than the first edge portion; The second partition film group further includes a second partition portion connected to the second edge portion, and the second partition portion is closer to the second light emitting device than the second edge portion; In a region between the first light emitting device and the second light emitting device adjacent to the first light emitting device, a maximum value of a sum of dimensions of the first edge portion and the second edge portion in the first direction is smaller than a sum of dimensions of the first partition portion and the second partition portion in the first direction.

23. The display panel according to claim 22, wherein: The light-emitting device included in the display panel further includes a third light-emitting device, and the third light-emitting device includes a third light-emitting functional layer; the first light-emitting device, the second light-emitting device, and the third light-emitting device all emit different colors; The display panel further includes: a third partition film group, located on a side of the second isolation pattern away from the substrate; the third partition film group includes a fifth partition layer and a sixth partition layer stacked in a direction away from the substrate, the fifth partition layer and the third light-emitting functional layer being made of the same material, and the sixth partition layer and the second electrode being made of the same material; The third partition film group includes a third edge portion away from the third light emitting device, and a size of the third edge portion gradually decreases in the first direction; The first edge portion and the third edge portion located between the first light emitting device and the third light emitting device adjacent to the first light emitting device overlap each other; and / or, The second edge portion and the third edge portion located between the second light emitting device and the third light emitting device adjacent to the second light emitting device overlap with each other.

24. The display panel according to claim 23, wherein: The third partition film group further includes a third partition portion connected to the third edge portion, and the third partition portion is closer to the third light emitting device than the third edge portion; In a region between the first light-emitting device and the third light-emitting device adjacent to the first light-emitting device, the maximum value of the sum of the dimensions of the first edge portion and the third edge portion in the first direction is smaller than the sum of the dimensions of the first partition portion and the third partition portion in the first direction; and / or In a region between the second light-emitting device and the third light-emitting device adjacent to the second light-emitting device, a maximum value of a sum of dimensions of the second edge portion and the third edge portion in the first direction is smaller than a sum of dimensions of the second partition portion and the third partition portion in the first direction.

25. The display panel according to claim 19, wherein The first partition film group and the second partition film group have a distance in the second direction; the second direction is parallel to the line connecting the center of the first light emitting device and the center of the second light emitting device; or, A boundary of the first partition film group away from the first light emitting device coincides with a boundary of the second partition film group away from the second light emitting device.

26. The display panel according to claim 19, wherein: Also includes: a first encapsulation pattern covering the first light-emitting device and a portion of the surface of the second partition layer away from the substrate; the first partition film group further includes a portion of the first encapsulation pattern covering the surface of the second partition layer away from the substrate; The second packaging pattern covers the second light-emitting device and a portion of the surface of the fourth partition layer away from the substrate; the second partition film group also includes a portion of the second packaging pattern covering the surface of the fourth partition layer away from the substrate.

27. A display panel, characterized in that: include: substrate; An isolation structure is provided on the substrate; the isolation structure defines a first pixel opening and a second pixel opening; a plurality of light emitting devices; The plurality of light emitting devices include a first light emitting device and a second light emitting device; The first light-emitting device is disposed in the first pixel opening, and the second light-emitting device is disposed in the second pixel opening. The first light-emitting device and the second light-emitting device emit different colors. The first light-emitting device and the second light-emitting device each include a first electrode and a second electrode disposed opposite to each other along a first direction, the first electrode being closer to the substrate than the second electrode, and the first direction being a thickness direction of the substrate. The second electrode is in contact with and electrically connected to the isolation structure. The first light-emitting device further includes a first light-emitting functional layer located between the first electrode and the second electrode of the first light-emitting device. The second light-emitting device further includes a second light-emitting functional layer located between the first electrode and the second electrode of the second light-emitting device. a first partition film group, comprising a first partition layer and a second partition layer stacked in a direction away from the substrate, wherein the first partition layer and the first light-emitting functional layer are made of the same material, and the second partition layer and the second electrode are made of the same material; and a second partition film group, comprising a third partition layer and a fourth partition layer stacked in a direction away from the substrate, wherein the third partition layer and the second light-emitting functional layer are made of the same material, and the fourth partition layer and the second electrode are made of the same material; Wherein, the first partition membrane group and the second partition membrane group are both located on a side of the isolation structure away from the substrate; The first partition film group includes a first edge portion away from the first light emitting device, and a size of the first edge portion gradually decreases in the first direction; and / or, The second partition film group includes a second edge portion away from the second light emitting device, and a size of the second edge portion gradually decreases in the first direction; The first edge portion and the second edge portion located between the first light emitting device and the second light emitting device adjacent to the first light emitting device overlap each other.

28. The display panel according to claim 27, wherein: The first partition film group further includes a first partition portion connected to the first edge portion, and the first partition portion is closer to the first light emitting device than the first edge portion; The second partition film group further includes a second partition portion connected to the second edge portion, and the second partition portion is closer to the second light emitting device than the second edge portion; In a region between the first light emitting device and the second light emitting device adjacent to the first light emitting device, a maximum value of a sum of dimensions of the first edge portion and the second edge portion in the first direction is smaller than a sum of dimensions of the first partition portion and the second partition portion in the first direction.

29. The display panel according to claim 28, wherein: The plurality of light-emitting devices further includes a third light-emitting device, wherein the third light-emitting device includes a third light-emitting functional layer; the first light-emitting device, the second light-emitting device and the third light-emitting device all emit different colors; The display panel further includes: a third partition film group, located on a side of the isolation structure away from the substrate; the third partition film group includes a fifth partition layer and a sixth partition layer stacked in a direction away from the substrate, the fifth partition layer and the third light-emitting functional layer being made of the same material, and the sixth partition layer and the second electrode being made of the same material; The third partition film group includes a third edge portion away from the third light emitting device, and a size of the third edge portion gradually decreases in the first direction; The first edge portion and the third edge portion located between the first light emitting device and the third light emitting device adjacent to the first light emitting device overlap each other; and / or, The second edge portion and the third edge portion located between the second light emitting device and the third light emitting device adjacent to the second light emitting device overlap with each other.

30. The display panel according to claim 29, wherein: The third partition film group further includes a third partition portion connected to the third edge portion, and the third partition portion is closer to the third light emitting device than the third edge portion; In a region between the first light-emitting device and the third light-emitting device adjacent to the first light-emitting device, the maximum value of the sum of the dimensions of the first edge portion and the third edge portion in the first direction is smaller than the sum of the dimensions of the first partition portion and the third partition portion in the first direction; and / or In a region between the second light-emitting device and the third light-emitting device adjacent to the second light-emitting device, a maximum value of a sum of dimensions of the second edge portion and the third edge portion in the first direction is smaller than a sum of dimensions of the second partition portion and the third partition portion in the first direction.

31. The display panel according to claim 29 or 30, characterized in that Also includes: a first encapsulation pattern covering the first light-emitting device and a portion of the surface of the second partition layer away from the substrate; the first partition film group further includes a portion of the first encapsulation pattern covering the surface of the second partition layer away from the substrate; a second encapsulation pattern covering the second light-emitting device and a portion of the surface of the fourth partition layer away from the substrate; the second partition film group further includes a portion of the second encapsulation pattern covering the surface of the fourth partition layer away from the substrate; a third packaging pattern covering the third light-emitting device and a portion of the surface of the sixth partition layer away from the substrate; and the third partition film group further comprising a portion of the third packaging pattern covering a surface of the sixth partition layer away from the substrate.

32. A display device, characterized in that: include: The display panel according to any one of claims 1 to 31; as well as, A circuit board electrically connected to the display panel.

33. A mask assembly, characterized in that: include: At least one mask; the mask includes a sub-pixel pattern corresponding to a sub-pixel of a display panel, and a boundary of the sub-pixel pattern has a microstructure.

34. The mask assembly according to claim 33, wherein: The mask plate includes a light-shielding substrate, the light-shielding substrate defines an opening, the opening is the sub-pixel pattern, and the microstructure is formed on the light-shielding substrate; or The mask plate includes a light-transmitting substrate and a shielding pattern provided on the light-transmitting substrate. The shielding pattern is the sub-pixel pattern, and the microstructure is formed on the shielding pattern.

35. The mask assembly according to claim 33 or 34, characterized in that: The microstructure includes a plurality of sub-patterns arranged along a boundary of the sub-pixel pattern.

36. The mask assembly according to claim 35, wherein: The at least one mask plate includes a first mask plate and a second mask plate; the first mask plate is used to manufacture the first light-emitting device of the display panel, and the second mask plate is used to manufacture the second light-emitting device of the display panel; The microstructure of the first mask includes a plurality of first sub-patterns, and the microstructure of the second mask includes a plurality of second sub-patterns; The first sub-graph has the same shape as the second sub-graph; and / or, The distance between two adjacent first sub-patterns is the same as the distance between two adjacent second sub-patterns.

37. The mask assembly according to claim 36, wherein: The at least one mask further includes a third mask, and the third mask is used to manufacture a third light emitting device of the display panel; The microstructure of the third mask includes a plurality of third sub-patterns; The first sub-graph, the second sub-graph, and the third sub-graph have the same shape; and / or, The distance between two adjacent first sub-patterns, the distance between two adjacent second sub-patterns, and the distance between two adjacent third sub-patterns are the same.

38. The mask assembly according to claim 35, wherein: The shape of the sub-graphic is a rectangle, a square, a triangle or a trapezoid.