Bottom guard plate preparation device

Through the combination of vacuum impregnation and heating, the problem of uneven material impregnation is solved, efficient impregnation and high-quality bottom guard preparation are achieved, the cleaning process is simplified, and the production efficiency and product consistency are improved.

CN223302260UActive Publication Date: 2025-09-05BEIJING WEISHENG COMPOSITES MATERIALS CO LTD
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Patent Information

Application Number
CN202422211514.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-09-09
Publication Date
2025-09-05
Estimated Expiration
2034-09-09

AI Technical Summary

Technical Problem

In the prior art, the material wetting method is uneven, resulting in a lot of dust and large rebound, difficult product quality, difficult mechanical cleaning, and complex fault handling.

Method used

The vacuum immersion box, forming mechanism and control mechanism are adopted, combined with vacuum pump, heating parts and sensors, to achieve uniform immersion and efficient molding of materials. The process parameters are monitored through vacuum gauge and temperature sensors, reducing bubbles and pores and improving product quality.

Benefits of technology

It improves the impregnation efficiency and product quality of the material, reduces dust and rebound, simplifies mechanical cleaning, and ensures the stability and repeatability of the process.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a bottom guard plate preparation device, the bottom guard plate preparation device comprises an infiltrating box, a forming mechanism and a control mechanism, the infiltrating box is connected with a first vacuum pump and a pressure release valve, the infiltrating box is used for infiltrating materials, the first vacuum pump is used for forming a vacuum environment in the infiltrating box, and the forming mechanism is used for forming a pressure release valve in the infiltrating box. The pressure release valve is used for feeding outside air into the infiltration box, the forming mechanism comprises a mold, a transfer part, a heating part and a second vacuum pump, the transfer part is used for placing the infiltrated material into the mold, the second vacuum pump is used for vacuumizing the mold, the heating part is connected with the mold to heat the mold, and the mold is used for vacuumizing the mold. The control mechanism comprises a vacuum gauge and a temperature sensor, the vacuum gauge is connected with the vacuum piece and used for detecting the vacuum degree of the mold, and the temperature sensor is used for detecting the temperature of the mold. The bottom guard plate preparation device provided by the utility model has the advantages of high dipping efficiency and high product quality.
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Description

Technical Field

[0001] The utility model relates to the technical field of composite material manufacturing, in particular to a bottom guard plate manufacturing device. Background Art

[0002] The prior art uses a wet process for impregnation of materials, where the glue gun impregnates the raw material through spraying and showering. This process generates a large amount of dust due to uneven and unstable material feeding and sudden changes in operating air pressure. The rebound is high, typically exceeding 15%, and the single-shot spray thickness is typically less than 3mm. Water addition is controlled by a valve, making quality control difficult. This process places high demands on the wet spraying machinery, making it difficult to clean and troubleshoot any malfunctions. Utility Model Content

[0003] The present invention aims to solve at least one of the technical problems in the related art to a certain extent. To this end, an embodiment of the present invention provides a bottom guard plate preparation device, which has the advantages of high impregnation efficiency and high product quality.

[0004] According to the bottom guard plate preparation device of the embodiment of the present utility model, the bottom guard plate preparation device includes an infiltration box, a molding mechanism and a control mechanism, the infiltration box is connected to a first vacuum pump and a pressure relief valve, the infiltration box is used to infiltrate the material, the first vacuum pump is used to form a vacuum environment in the infiltration box, and the pressure relief valve is used to send outside air into the infiltration box, the molding mechanism includes a mold, a transfer part, a heating part and a second vacuum pump, the transfer part places the infiltrated material into the mold, the second vacuum pump is used to vacuum the mold, the heating part is connected to the mold to heat the mold, the control mechanism includes a vacuum gauge and a temperature sensor, the vacuum gauge is connected to the vacuum part to detect the vacuum degree of the mold, and the temperature sensor is used to detect the temperature of the mold.

[0005] The bottom guard plate preparation device according to the embodiment of the utility model has the advantages of high impregnation efficiency and high product quality.

[0006] In some embodiments, the bottom guard plate preparation device also includes a pre-processing mechanism, which includes a pre-pressing box and a pre-heating component. The pre-pressing box is used to compact the material, and the pre-heating component is used to heat the material in the pre-pressing box.

[0007] In some embodiments, the bottom guard plate preparation device further includes a conveying member, which is used to convey the material in the pre-pressing box to the infiltration box.

[0008] In some embodiments, the preheating element is an infrared heater or a microwave heater.

[0009] In some embodiments, multiple pairs of rollers are provided in the pre-pressing box, and the rollers are used to compact the material.

[0010] In some embodiments, the infiltration tank includes a working chamber and a liquid storage chamber, the liquid storage chamber is connected to the top of the working chamber through a first pipeline, the working chamber is connected to the liquid storage chamber through a second pipeline, the vacuum pump is connected to the working chamber through a pipeline for vacuuming, and the pressure relief valve is connected to the working chamber.

[0011] In some embodiments, the control mechanism further includes a control panel electrically connected to the vacuum gauge, the temperature sensor, and the vacuum pump.

[0012] In some embodiments, the bottom guard plate preparation device also includes an anti-static mechanism, which includes an electrostatic eliminator and a grounding chain. The electrostatic eliminator is located next to the infiltration box to eliminate static electricity of the material. One end of the grounding chain is connected to the outer surface of the infiltration box, and the other end of the grounding chain is connected to the ground. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a structural schematic diagram of the bottom guard plate preparation device according to an embodiment of the present utility model.

[0014] Reference numerals: 1. infiltration tank; 11. working chamber; 12. liquid storage chamber; 2. first vacuum pump; 3. control panel; 4. vacuum gauge. DETAILED DESCRIPTION

[0015] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and intended to be used to explain the present invention, but should not be understood as limiting the present invention.

[0016] In some embodiments, according to the bottom guard plate preparation device of the embodiment of the present utility model, the bottom guard plate preparation device includes an infiltration box 1, a molding mechanism and a control mechanism. The infiltration box 1 is connected to a first vacuum pump 2 and a pressure relief valve. The infiltration box 1 is used to infiltrate the material, the first vacuum pump 2 is used to form a vacuum environment in the infiltration box 1, and the pressure relief valve is used to send outside air into the infiltration box 1. The molding mechanism includes a mold, a transfer part, a heating part and a second vacuum pump. The transfer part places the infiltrated material into the mold, the second vacuum pump is used to vacuum the mold, the heating part is connected to the mold to heat the mold, and the control mechanism includes a vacuum gauge 4 and a temperature sensor. The vacuum gauge 4 is connected to the vacuum part to detect the vacuum degree of the mold, and the temperature sensor is used to detect the temperature of the mold. The infiltration box 1 improves the infiltration effect by vacuum infiltration. The resin can penetrate into the micropores of the material more quickly, thereby improving the impregnation efficiency and reducing the occurrence of defects such as bubbles and pores. The mold of the molding mechanism completes the molding of the material through vacuuming and heating. The transfer part is used to transfer the infiltrated material into the mold to improve production efficiency. The control mechanism detects the state of the mold through the vacuum gauge 4 and the temperature sensor to facilitate adjustment to meet the production needs of different materials. The vacuum gauge 4 can be a mechanical vacuum gauge 4. The vacuum environment helps the resin to penetrate the material more evenly and improve product quality. By removing air, a bubble-free environment is provided for the resin, thereby reducing pores and defects. The combination of the heating element and the vacuum pump ensures uniform heating and compaction of the material during the curing process, reducing internal defects. The heating of the mold helps to speed up the curing speed and improve production efficiency.

[0017] The bottom guard plate preparation device according to the embodiment of the utility model has the advantages of high impregnation efficiency and high product quality.

[0018] In some embodiments, the bottom guard plate preparation device also includes a pre-processing mechanism, which includes a pre-pressing box and a pre-heating component. The pre-pressing box is used to compact the material, and the pre-heating component is used to heat the material in the pre-pressing box.

[0019] Specifically, the pre-processing mechanism is used to pre-process the material to improve the material quality, reduce the gas inside the material and increase the material temperature. The compacted material produces fewer bubbles and defects during the infiltration process, and preheating can increase the subsequent processing speed.

[0020] In some embodiments, the bottom guard plate preparation device further includes a conveying member, which is used to convey the material in the pre-pressing box to the infiltration box 1.

[0021] Specifically, the conveying member can be a conveyor belt or a robotic arm. The robotic arm clamps the pre-processed materials to improve production efficiency, reduce manual participation, shorten material processing time, and reduce operational errors.

[0022] In some embodiments, the preheating element is an infrared heater or a microwave heater.

[0023] Specifically, infrared heaters heat materials through infrared radiation, quickly and evenly raising their temperature. Microwave heaters use microwave energy to directly heat the interior of the material, improving heating efficiency and uniformity. Both heaters heat without direct contact with the material, allowing for greater flexibility in their installation location.

[0024] In some embodiments, multiple pairs of rollers are provided in the pre-pressing box, and the rollers are used to compact the material.

[0025] Specifically, pressurization can reduce air voids in the material and improve the density and uniformity of the material.

[0026] In some embodiments, the infiltration box 1 includes a working chamber 11 and a liquid storage chamber 12. The liquid storage chamber 12 is connected to the top of the working chamber 11 through a first pipeline. The working chamber 11 is connected to the liquid storage chamber 12 through a second pipeline. The vacuum pump is connected to the working chamber 11 through a pipeline for vacuuming, and the pressure relief valve is connected to the working chamber 11.

[0027] Specifically, the infiltration tank 1, by providing a working chamber 11 and a liquid storage chamber 12, separates the resin storage area from the material infiltration area, reducing resin contamination and protecting resin quality. Vacuum infiltration of the material is performed within the working chamber 11. A vacuum pump creates a negative pressure environment within the working chamber 11, and a pressure relief valve regulates the pressure within the working chamber 11 to allow for the introduction of ambient air after infiltration. Two pipelines, forming a loop between the working chamber 11 and the liquid storage chamber 12, recycle the resin within the working chamber 11, reducing waste.

[0028] In some embodiments, the control mechanism further includes a control panel 3 , which is electrically connected to the vacuum gauge 4 , the temperature sensor, and the vacuum pump.

[0029] Specifically, the control panel 3 may be provided with a display screen to display parameters such as pressure and temperature for the convenience of adjustment and control by the staff. The control panel 3 helps the staff to monitor and adjust the vacuum degree and temperature in real time, thereby ensuring the stability and repeatability of the process.

[0030] In some embodiments, the bottom guard plate preparation device also includes an anti-static mechanism, which includes an electrostatic eliminator and a grounding chain. The electrostatic eliminator is located next to the infiltration box 1 to eliminate static electricity of the material. One end of the grounding chain is connected to the outer surface of the infiltration box 1, and the other end of the grounding chain is connected to the ground.

[0031] Specifically, the anti-static mechanism can prevent static electricity from damaging materials or finished products. The static eliminator blows ionized air onto the surface of the material to neutralize static electricity. The grounding chain connecting the equipment and the ground can eliminate static electricity accumulation and improve product quality.

[0032] Example of product preparation process:

[0033] Cut steel plates and balsa wood to size according to the product drawing dimensions of the target product, and cut fiber fabrics according to the drawings;

[0034] Place the glass fiber fabric, balsa wood, steel plate, and glass fiber fabric used to make the target product into the impregnation box in sequence for material impregnation;

[0035] Take out the material through the robot and put the infiltrated material into the mold;

[0036] Close the mold, the mold temperature is 70℃~180℃, and the vacuum degree is not greater than -0.085MPa;

[0037] After the glue injection is completed, the mold is heated for 3 to 5 minutes and then the mold is opened for demoulding;

[0038] Cut off the waste edges of the product, complete the production process, and obtain the target product.

[0039] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation to the present invention.

[0040] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of this utility model, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0041] In this utility model, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection, or communication; direct connection or indirect connection through an intermediate medium; internal communication between two elements or interaction between two elements, unless otherwise specified. For those skilled in the art, the specific meanings of the above terms in this utility model can be understood according to specific circumstances.

[0042] In the present invention, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediary. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0043] In the present invention, the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and the features of different embodiments or examples without contradiction.

[0044] Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are illustrative and cannot be understood as limitations on the present invention. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present invention.

Claims

1. A bottom guard plate preparation device, characterized in that: include: An infiltration box is connected to a first vacuum pump and a pressure relief valve, wherein the infiltration box is used to infiltrate the material, the first vacuum pump is used to form a vacuum environment in the infiltration box, and the pressure relief valve is used to supply external air into the infiltration box; a molding mechanism comprising a mold, a transfer member, a heating member, and a second vacuum pump; the transfer member places the infiltrated material into the mold; the second vacuum pump is used to evacuate the mold; and the heating member is connected to the mold to heat the mold; a control mechanism, the control mechanism comprising a vacuum gauge and a temperature sensor, the vacuum gauge being connected to the second vacuum pump to detect the vacuum degree of the mold, and the temperature sensor being used to detect the temperature of the mold; The infiltration box includes a working chamber and a liquid storage chamber, the liquid storage chamber is connected to the top of the working chamber through a first pipeline, the working chamber is connected to the liquid storage chamber through a second pipeline, the vacuum pump is connected to the working chamber through a pipeline for vacuuming, and the pressure relief valve is connected to the working chamber.

2. The bottom guard plate preparation device according to claim 1, characterized in that: It also includes a pre-processing mechanism, which includes a pre-pressing box and a pre-heating component. The pre-pressing box is used to compact the material, and the pre-heating component is used to heat the material in the pre-pressing box.

3. The bottom guard plate preparation device according to claim 2, characterized in that: It also includes a conveying member, which is used to convey the material in the pre-pressing box to the infiltration box.

4. The bottom guard plate preparation device according to claim 2, characterized in that: The preheating element is an infrared heater or a microwave heater.

5. The bottom guard plate preparation device according to claim 2, characterized in that: A plurality of pairs of rollers are arranged in the pre-pressing box, and the rollers are used to compact the materials.

6. The bottom guard plate preparation device according to claim 1, characterized in that: The control mechanism further includes a control panel electrically connected to the vacuum gauge, the temperature sensor, and the vacuum pump.

7. The bottom guard plate preparation device according to claim 1, characterized in that: It also includes an anti-static mechanism, which includes an electrostatic eliminator and a grounding chain. The electrostatic eliminator is located next to the infiltration box to eliminate static electricity on the material. One end of the grounding chain is connected to the outer surface of the infiltration box, and the other end of the grounding chain is connected to the ground.