Computer CPU radiator device with liquid cooling heat dissipation function

Abstract

The utility model discloses a computer CPU radiator device with a liquid cooling heat dissipation function. The computer CPU radiator device comprises an in-bin heat dissipation device and an out-bin heat dissipation device. The in-granary heat dissipation device and the out-granary heat dissipation device are connected through a first liquid flow pipe and a second liquid flow pipe; the heat dissipation device outside the warehouse comprises an aluminum alloy frame, an electric pump and a heat dissipation fan. The in-bin heat dissipation device comprises a CPU metal base, a heat dissipation bin and a heat dissipation copper pipe. The in-cabin heat dissipation device is arranged in the computer, and the out-cabin heat dissipation device is arranged outside the computer, so that the temperature and heat of a CPU (Central Processing Unit) of the computer are transmitted to the out-cabin heat dissipation device for cooling, and then cooled liquid is transmitted back to the in-cabin heat dissipation device. The liquid cooling radiator device not only improves the radiating efficiency and stability of a computer system, but also has obvious advantages in the aspects of noise control, space utilization and personalized design, and meets the requirements of modern computer users for high performance and high reliability.

Description

Technical Field

[0001] The utility model relates to the field of computer heat dissipation, in particular to a computer CPU radiator device with liquid cooling and heat dissipation. Background Art

[0002] A liquid cooler is a device used to dissipate heat from a computer's central processing unit (CPU). As modern computer hardware performance continues to improve, CPU computing power and speed are also increasing. These advances result in higher power consumption and heat generation. Traditional air-cooled radiators have limitations, including:

[0003] Air-cooled radiators rely on fans to remove heat from the heat sink, but as CPU power increases, the effect of air cooling becomes increasingly difficult to meet the cooling needs of high-performance CPUs.

[0004] In order to enhance the heat dissipation effect, the air cooling system often requires a fan running at high speed, which will generate loud noise and affect the user experience.

[0005] High-efficiency air-cooling radiators are usually large in size, which takes up space inside the chassis and affects the layout and installation of other hardware.

[0006] The advantages of liquid cooling technology include:

[0007] The liquid cooling system removes heat through liquid circulation. The heat capacity of liquid is much larger than that of air, and it can absorb and conduct heat more efficiently, making it suitable for CPUs that generate high heat.

[0008] The pumps and fans of liquid cooling systems generally run at lower speeds, which significantly reduces noise compared to high-speed fans.

[0009] The radiator of the liquid cooling system can be installed outside the chassis and connected through water pipes, which reduces the space occupied inside the chassis and makes the hardware layout more flexible.

[0010] Therefore, it is necessary to propose a computer CPU radiator device with liquid cooling heat dissipation. Utility Model Content

[0011] In response to the above technical problems, the utility model proposes a computer CPU radiator device with liquid cooling. Through an integrated liquid cooling system, the water pump, water cooling head and radiator are integrated together, which is easier to install and suitable for ordinary users. It can provide a more efficient and quieter heat dissipation effect and meet the high performance requirements of modern computer hardware.

[0012] The technical solution used in the present invention is: a computer CPU radiator device with liquid cooling and heat dissipation, including an internal heat dissipation device and an external heat dissipation device; the internal heat dissipation device and the external heat dissipation device are connected through a first liquid flow pipe and a second liquid flow pipe; the external heat dissipation device includes an aluminum alloy frame, an electric pump and a cooling fan; the internal heat dissipation device includes a CPU metal base, a heat dissipation bin and a heat dissipation copper pipe; the electric pump is detachably mounted on the back side of the aluminum alloy frame; the cooling fan is detachably mounted on the front side of the aluminum alloy frame; a plurality of tooth-shaped heat dissipation fins are provided on the front side of the aluminum alloy frame; the internal structure of the aluminum alloy frame is provided with a plurality of tooth-shaped heat dissipation fins ... The aluminum alloy frame is provided with a hollow structure; the hollow structure is filled with liquid; one end of the first liquid flow tube is detachably connected to the upper side of the aluminum alloy frame; one end of the first liquid flow tube is detachably connected to the north side of the aluminum alloy frame; the heat dissipation copper tube is non-detachably arranged on the upper side of the CPU metal base; the CPU metal base is fixedly contacted with the computer's CPU by screws; the heat dissipation chamber is detachably installed on the upper side of the CPU metal base; the heat dissipation chamber is filled with liquid; the other end of the first liquid flow tube is detachably connected to the upper side of the heat dissipation chamber; the other end of the first liquid flow tube is detachably connected to the right side of the heat dissipation chamber.

[0013] Furthermore, the heat generated by the heat dissipation device inside the warehouse is transferred to the heat dissipation device outside the warehouse by the first liquid flow pipe, and after heat dissipation treatment by the heat dissipation device outside the warehouse, is transferred back to the heat dissipation device inside the warehouse by the second liquid flow pipe.

[0014] Furthermore, it also includes a power supply unit, a main control unit, an electric pump, a temperature sensor, a fan, a display unit and a communication interface; the main control unit is the core controller of the entire liquid cooling system, which is responsible for coordinating and managing the work of all other functional units; the electric pump is used to promote the circulation of coolant in the cooling system; the temperature sensor is used to measure the temperature of key parts in the system; the fan is used to assist in heat dissipation, dissipating the heat in the radiator into the air; the display unit is used to display the operating status and temperature information of the system; the communication interface is used to realize data exchange between the cooling system and the computer motherboard or user equipment; the power supply unit is used to supply power to other functional units.

[0015] Compared to existing technologies, this new liquid-cooled radiator system offers the following advantages: by installing an internal heat sink inside the computer and an external heat sink outside the computer, heat from the computer CPU is transferred to the external heat sink for cooling, and the cooled liquid is then transferred back to the internal heat sink. This liquid-cooled radiator system not only improves the cooling efficiency and stability of the computer system, but also offers significant advantages in noise control, space utilization, and personalized design, meeting the high performance and reliability demands of modern computer users. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a structural diagram of a computer CPU cooling device with liquid cooling according to the present invention.

[0017] Figure 2 This is a diagram showing the architecture of a computer CPU cooling device with liquid cooling according to the present invention.

[0018] Figure 3 This is a functional diagram of a computer CPU cooling device with liquid cooling according to the present invention.

[0019] Figure numerals: 1-heat dissipation device inside the warehouse, 2-heat dissipation device outside the warehouse, 3-first liquid flow pipe 3, 4-second liquid flow pipe, 11-CPU metal base, 12-heat dissipation warehouse, 13-heat dissipation copper pipe, 21-aluminum alloy frame, 22-electric pump, 23-cooling fan. DETAILED DESCRIPTION

[0020] The present invention will be described in detail below with reference to the accompanying drawings. The technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the embodiments described are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of the present invention.

[0021] Those skilled in the art should understand that, in the disclosure of the present invention, the terms "longitudinal", "transverse", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like to indicate orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, the above terms cannot be understood as limiting the present invention.

[0022] like Figure 2 As shown, a computer CPU radiator device with liquid cooling includes an internal cooling device 1 and an external cooling device 2.

[0023] The heat dissipation device inside the warehouse 1 is connected to the heat dissipation device outside the warehouse 2 through a first liquid flow pipe 3 and a second liquid flow pipe 4.

[0024] It should be noted that the heat generated by the heat dissipation device 1 inside the warehouse is transferred to the heat dissipation device 2 outside the warehouse by the first liquid flow pipe 3, and after heat dissipation treatment by the heat dissipation device outside the warehouse, it is transferred back to the heat dissipation device 1 inside the warehouse by the second liquid flow pipe 4.

[0025] like Figure 1 As shown, the external heat dissipation device 2 includes an aluminum alloy frame 21, an electric pump 22 and a heat dissipation fan 23.

[0026] The electric pump 22 is detachably mounted on the back side of the aluminum alloy frame 21 .

[0027] The heat dissipation fan 23 is detachably mounted on the front side of the aluminum alloy frame 21 .

[0028] A plurality of tooth-shaped heat sinks are provided on the front side of the aluminum alloy frame 21 .

[0029] The interior of the alloy frame 21 is configured as a hollow structure; the hollow structure is filled with liquid.

[0030] One end of the first liquid flow tube 3 is detachably connected to the upper side of the aluminum alloy frame 21 .

[0031] One end of the second liquid flow pipe 4 is detachably connected to the north side of the aluminum alloy frame 21 .

[0032] It can be understood that the first liquid flow pipe draws in the heated liquid from the heat dissipation device inside the warehouse, and after physical heat dissipation by the toothed heat sink of the aluminum alloy frame 21 and heat extraction by the cooling fan, the heat dissipation device outside the warehouse sends the heat-treated liquid back to the heat dissipation device inside the warehouse, and the cycle operation is carried out.

[0033] like Figure 1 As shown, the heat dissipation device 1 in the chamber includes a CPU metal base 11, a heat dissipation chamber 12 and a heat dissipation copper pipe 13.

[0034] The heat dissipation copper tube 13 is non-detachably arranged on the upper side of the CPU metal base 11 .

[0035] The CPU metal base 11 is fixedly contacted with the CPU of the computer by screws.

[0036] The heat dissipation chamber 12 is detachably mounted on the upper side of the CPU metal base 11 ; the heat dissipation chamber 12 is filled with liquid.

[0037] The other end of the first liquid flow pipe 3 is detachably connected to the upper side of the heat dissipation chamber 12 .

[0038] The other end of the second liquid flow pipe 4 is detachably connected to the right side of the heat dissipation chamber 12 .

[0039] It is understandable that the computer CPU generates a large amount of heat, which is absorbed by the metal surface of the CPU metal base and gradually gathered at the CPU metal base and the heat dissipation copper tube. The liquid in the heat dissipation chamber absorbs the heat from the CPU metal base and the heat dissipation copper tube, flows to the heat dissipation device outside the chamber through the first liquid flow pipe, and obtains the liquid cooled by the heat dissipation device outside the chamber through the second liquid flow pipe.

[0040] as follows Figure 3 As shown, a computer CPU radiator device with liquid cooling has a specific electronic control function structure including a power supply unit, a main control unit, an electric pump, a temperature sensor, a fan, a display unit and a communication interface.

[0041] The main control unit is the core controller of the entire liquid cooling system, responsible for coordinating and managing the work of all other functional units.

[0042] It can be understood that the system monitors temperature sensor data, controls the operating speed of the electric pump, adjusts the fan speed, manages system fault detection and processing, and exchanges data and reports status with the user or host system through the communication interface.

[0043] The electric pump is used to promote the circulation of coolant in the heat dissipation system.

[0044] It is understood that ensuring the coolant flows within the system, removes the heat generated by the CPU and transfers it to the radiator (cold row) for dissipation. The operating speed of the electric pump is usually dynamically adjusted by the main control unit based on the data of the temperature sensor to optimize the cooling efficiency and system noise.

[0045] The temperature sensor is used to measure the temperature of key parts in the system.

[0046] It is understood that providing real-time temperature data to the main control unit enables it to adjust the operating status of the electric pump and fan according to temperature changes, ensuring that the system always maintains optimal heat dissipation performance under different loads. Temperatures include CPU temperature, coolant temperature, and radiator temperature.

[0047] The fan is used to assist in heat dissipation and dissipate the heat in the radiator into the air.

[0048] As you can understand, the fan speed is controlled by the main control unit and adjusted based on the temperature sensor data to balance the cooling effect and noise level. When the system temperature is high, the fan speed increases to enhance cooling; when the system temperature is low, the fan speed decreases to reduce noise.

[0049] The display unit is used to display the operating status and temperature information of the system.

[0050] Understandably, the purpose is to provide a user interface that allows users to view system parameters such as temperature, pump speed, fan speed, etc. in real time, which helps users understand the working status of the cooling system and make necessary adjustments or maintenance.

[0051] The communication interface is used to realize data exchange between the cooling system and the computer motherboard or user equipment.

[0052] As you can understand, the main control unit can be connected to the host system through interfaces such as USB, I2C, and UART, allowing it to receive control commands from the host or send status reports to the host. The communication interface can also be used for software updates and system debugging, enhancing the manageability and maintainability of the system.

[0053] The power supply unit is used to supply power to other functional units.

[0054] As you can understand, the specific workflow includes:

[0055] System startup: The main control unit initializes, starts the electric pump and fan, and begins reading data from the temperature sensor.

[0056] Temperature monitoring: The temperature sensor monitors the temperature of the CPU and other components in real time and feeds the data back to the main control unit.

[0057] Dynamic adjustment: The main control unit adjusts the flow rate of the electric pump and the speed of the fan according to temperature data to ensure that the cooling system maintains the best cooling effect under different loads.

[0058] User interaction: Through the display unit and communication interface, users can view the status of the cooling system in real time and make necessary settings and adjustments.

[0059] Fault detection and handling: The main control unit continuously monitors the operating status of each part of the system. When a fault is detected (such as pump failure, fan failure or overtemperature), it will take appropriate measures (such as alarm, speed reduction or shutdown) to protect the system.

[0060] Through the coordinated work of the above functional units, the liquid cooling system can effectively maintain the low temperature operation of the computer CPU under high load, ensuring the stability and performance of the system while providing a good user experience.

[0061] This embodiment is merely a preferred technical solution of the present invention and should not be construed as limiting the present invention. The scope of protection of the present invention shall be the technical solution described in the claims, including equivalent alternatives to the technical features of the technical solution described in the claims. Equivalent alternatives and improvements within this scope are also within the scope of protection of the present invention, and any changes that can be conceived by those skilled in the art are intended to fall within the scope of protection of this application.

Claims

1. A computer CPU radiator device with liquid cooling, characterized in that: It comprises an internal heat dissipation device (1) and an external heat dissipation device (2); The heat dissipation device (1) inside the warehouse is connected to the heat dissipation device (2) outside the warehouse via a first liquid flow pipe (3) and a second liquid flow pipe (4); The heat dissipation device (2) outside the warehouse includes an aluminum alloy frame (21), an electric pump (22) and a heat dissipation fan (23); The heat dissipation device (1) in the bin comprises a CPU metal base (11), a heat dissipation bin (12) and a heat dissipation copper pipe (13); The electric pump (22) is detachably mounted on the back side of the aluminum alloy frame (21); The heat dissipation fan (23) is detachably mounted on the front side of the aluminum alloy frame (21); The front side of the aluminum alloy frame (21) is provided with a plurality of tooth-shaped heat sinks; The interior of the aluminum alloy frame (21) is configured as a hollow structure; the hollow structure is filled with liquid; One end of the first liquid flow tube (3) is detachably connected to the upper side of the aluminum alloy frame (21); One end of the second liquid flow pipe (4) is detachably connected to the north side of the aluminum alloy frame (21); The heat dissipation copper tube (13) is non-detachably arranged on the upper side of the CPU metal base (11); The CPU metal base (11) is fixedly contacted with the CPU of the computer via screws; The heat dissipation chamber (12) is detachably mounted on the upper side of the CPU metal base (11); the heat dissipation chamber (12) is filled with liquid; The other end of the first liquid flow pipe (3) is detachably connected to the upper side of the heat dissipation chamber (12); The other end of the second liquid flow pipe (4) is detachably connected to the right side of the heat dissipation chamber (12).

2. A computer CPU radiator device with liquid cooling according to claim 1, characterized in that: The heat generated by the heat dissipation device (1) inside the warehouse is transferred to the heat dissipation device (2) outside the warehouse by the first liquid flow pipe (3), and after heat dissipation treatment by the heat dissipation device outside the warehouse, is transferred back to the heat dissipation device (1) inside the warehouse by the second liquid flow pipe (4).

3. A computer CPU radiator device with liquid cooling according to claim 2, characterized in that: It also includes a power supply unit, a main control unit, an electric pump, a temperature sensor, a fan, a display unit and a communication interface; The main control unit is the core controller of the entire liquid cooling system, responsible for coordinating and managing the work of all other functional units; The electric pump is used to promote the circulation of coolant in the heat dissipation system; The temperature sensor is used to measure the temperature of key parts in the system; The fan is used to assist in heat dissipation and dissipate the heat in the radiator into the air; The display unit is used to display the operating status and temperature information of the system; The communication interface is used to realize data exchange between the cooling system and the computer motherboard or user equipment; The power supply unit is used to supply power to other functional units.

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