Multi-axis motion controller based on ARMCortex-M4

Abstract

The utility model relates to the technical field of multi-axis motion controllers, in particular to a multi-axis motion controller based on ARMCortex-M4, which comprises a controller shell and a main circuit board embedded and assembled at the inner bottom of the controller shell, and a processor is integrally mounted on the main circuit board; a metal foam plate is fixedly mounted on the inner wall of the controller shell above the main circuit board, the metal foam plate is designed to be of a porous structure, a flow guide space is formed between the metal foam plate and the inner top of the controller shell, and the flow guide space is communicated with the external environment; a flow guide space is formed in the inner wall of the controller shell, a pumping device for transferring air out of the flow guide space is installed on the outer wall of the controller shell, an assembly frame is installed on the inner wall of the controller shell in an up-down sliding mode, and a flexible heat conduction film is fixedly installed on the inner edge of the assembly frame. And rapid cooling and heat dissipation can be realized through downward movement of the flexible heat conduction film, so that the controller is prevented from being in an overheating state for a long time.

Description

Technical Field

[0001] The utility model relates to the technical field of multi-axis motion controllers, in particular to a multi-axis motion controller based on ARM Cortex-M4. Background Art

[0002] The multi-axis motion controller based on ARMCortex-M4 is a high-performance embedded system solution that is widely used in industrial automation. The use of the ARM core can make the controller calculation more precise and can handle more tasks, thereby improving the performance of the motion controller so that it can be applied in the field of precision control.

[0003] In the existing technology, since the ARM Cortex-M4 core is integrated on the circuit board of the motion controller, it can connect to more peripherals and perform more complex and powerful calculations. However, due to the small size of the controller, the existing passive cooling mode cannot meet the high-intensity work of the controller, which may cause the performance of the controller to be reduced or the power of sensitive components to be reduced, and may even cause the ARM Cortex-M4 processor to automatically reduce the frequency or enter sleep mode. Utility Model Content

[0004] The utility model provides a multi-axis motion controller based on ARM Cortex-M4, which can not only use metal foam plates for passive heat exchange, but also use the downward movement of flexible thermal conductive film to quickly cool and dissipate heat, thereby preventing the controller from being in an overheated state for a long time.

[0005] In order to achieve the above purpose, the present invention provides the following technical solutions:

[0006] ARMCortex-M4-based multi-axis motion controller, including:

[0007] A controller housing and a main circuit board embedded in and assembled at the inner bottom thereof, wherein a processor is integrated on the main circuit board; a metal foam plate is fixedly mounted on the inner wall of the controller housing above the main circuit board, wherein the metal foam plate is designed as a porous structure, and a guide space is formed between the metal foam plate and the inner top of the controller housing, wherein the guide space is connected to the external environment; an extractor for transferring air out of the guide space is mounted on the outer wall of the controller housing.

[0008] Optionally, an assembly frame is installed on the inner wall of the controller housing for sliding up and down, and a flexible thermally conductive film is fixedly installed on the inner edge of the assembly frame. The flexible thermally conductive film has the ability to recover after deformation, and the metal foam plate is located above the flexible thermally conductive film, and the bottom of the metal foam plate is tightly fitted with the top of the flexible thermally conductive film. The assembly frame has an initial position. At the initial position, the flexible thermally conductive film is a horizontal sheet structure. The inner wall of the controller housing is designed with a driver for controlling the downward displacement of the assembly frame. The main circuit board will not interfere with the downward movement of the assembly frame. When the assembly frame moves down to the preset position, the flexible thermally conductive film can fit tightly on the main circuit board to cover the processor and components on the main circuit board.

[0009] Optionally, an assembly groove is provided on the inner wall of the controller housing, an assembly block is slidably installed on the inner wall of the assembly groove, the outer wall of the assembly block is fixedly connected to the outer wall of the assembly frame, the driver is designed at the inner bottom of the assembly groove, the output end of the driver is associated with the bottom of the assembly block, and the driver controls the up and down displacement of the assembly block.

[0010] Optionally, when the assembly frame and the flexible thermally conductive film move downward, a convection space will be formed between the metal foam plate, and the outer wall of the controller housing is provided with a second air inlet connected to the convection space. In the initial position, the outer wall of the assembly block closes the second air inlet. When the assembly frame and the flexible thermally conductive film move downward, the second air inlet will be connected to the convection space.

[0011] Optionally, a first air inlet is further provided on the outer wall of the controller housing, a guide port connected to the guide space is provided on the inner wall of the first air inlet, a piston plate is installed on the top of the assembly block, the piston plate slides through the interior of the first air inlet, and a docking port is provided on the piston plate. In the initial position, the first air inlet, the docking port and the guide port are interconnected.

[0012] Optionally, the driver includes a memory alloy strip with a heat-sensitive function, which will deform and shrink when subjected to a preset temperature. The two ends of the memory alloy strip are respectively fixedly connected to the bottom of the assembly block and the inner bottom of the assembly groove, and the memory alloy strip is a continuous broken line shape.

[0013] Optionally, the flexible thermally conductive film is composed of a thermally conductive filler, a base material and an adhesive, wherein the thermally conductive filler and the adhesive are mixed and then coated on the base material.

[0014] Optionally, a plurality of fins are installed at the bottom of the controller housing, and the fins are wavy.

[0015] Optionally, the extractor includes a PWM fan installed on the controller housing, the air outlet of the PWM fan is connected to the guide space, and the PWM fan is connected to the main circuit board through built-in hidden buried wires. The main circuit board controls the opening and closing and power supply of the PWM fan.

[0016] The present invention provides a multi-axis motion controller based on ARMCortex-M4, which has the following beneficial effects: through the cooperation between the metal foam plate, the guide space and the extractor, external air can enter the guide space, and the heat in the guide space can be transferred outward through the extractor, wherein the porous metal foam plate has a periodically arranged microscopic pore structure, and these pores can serve as a heat conduction channel, thereby improving the heat conduction efficiency of the material and performing normal heat dissipation; in an emergency or overheating state, the assembly frame will cooperate with the flexible thermal conductive film to move downward, so that the flexible thermal conductive film can fit and cover most components, so that the heat on the components can be transferred to the flexible thermal conductive film faster, so that the main circuit board and its components can be cooled more quickly; secondly, after covering the main circuit board and the components thereon, the bottom of the metal foam plate is relatively released, so that the metal foam plate can increase the heat exchange area again, and can perform heat exchange work more efficiently. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic diagram of the external three-dimensional structure of the utility model;

[0018] Figure 2 For this utility model Figure 1 Schematic top view of

[0019] Figure 3 For this utility model Figure 2 Schematic cross-sectional view at AA in the middle;

[0020] Figure 4 This is a schematic diagram of the structure inside the controller housing of the present invention;

[0021] Figure 5 For this utility model Figure 1 Schematic diagram of the top view.

[0022] In the figure: 1. Controller housing; 2. Main circuit board; 3. Processor; 4. Metal foam board; 5. Flexible thermal conductive film; 6. Assembly frame; 7. Assembly block; 8. Memory alloy strip; 9. Piston plate; 11. PWM fan; 12. Docking port; 13. Second air inlet; 14. First air inlet; 15. Fins. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0024] See also Figures 1 to 5 The utility model provides a technical solution: a multi-axis motion controller based on ARMCortex-M4, including:

[0025] The controller housing 1 has a main circuit board 2 embedded in the bottom thereof, and a processor 3 is integrated on the main circuit board 2; a metal foam plate 4 is fixedly installed on the inner wall of the controller housing 1 above the main circuit board 2, and the metal foam plate 4 is designed as a porous structure. A guide space is formed between the metal foam plate 4 and the inner top of the controller housing 1, and the guide space is connected to the external environment; an extractor for transferring air out of the guide space is installed on the outer wall of the controller housing 1.

[0026] In this case, through the cooperation between the metal foam plate 4, the guide space and the extractor, external air can enter the guide space, and the heat in the guide space can be transferred outward through the extractor. Among them, the porous metal foam plate 4 has a periodically arranged microscopic pore structure. These pores can serve as a channel for heat conduction, thereby improving the thermal conduction efficiency of the material. Secondly, the metal foam plate 4 is usually made of metal materials with high thermal conductivity, such as copper, aluminum, etc. The thermal conductivity of these metals is much greater than the thermal conductivity of the filling phase. The porosity, pore density and solid thermal conductivity of the metal foam plate 4 determine the thermal conduction efficiency of the metal foam plate 4 skeleton, which can increase the area of ​​convective heat exchange of the metal foam plate 4 and improve the heat exchange efficiency.

[0027] Among them, processor 3 adopts ARMCortex-M4 processor, which can also work with FPGA, but will not be described in detail.

[0028] Among the more preferred embodiments, an assembly frame 6 is installed on the inner wall of the controller housing 1 for sliding up and down, and a flexible thermally conductive film 5 is fixedly installed on the inner edge of the assembly frame 6. The flexible thermally conductive film 5 has the ability to recover after deformation, and the metal foam plate 4 is located above the flexible thermally conductive film 5, and the bottom of the metal foam plate 4 is tightly fitted with the top of the flexible thermally conductive film 5. The assembly frame 6 has an initial position. In the initial position, the flexible thermally conductive film 5 is a horizontal sheet structure. The inner wall of the controller housing 1 is designed with a driver for controlling the downward displacement of the assembly frame 6. The main circuit board 2 will not interfere with the downward movement of the assembly frame 6. When the assembly frame 6 moves down to the preset position, the flexible thermally conductive film 5 can be tightly fitted on the main circuit board 2 to cover the processor 3 and components on the main circuit board 2. Please refer to Figure 3 and Figure 4 In this embodiment, by designing the assembly frame 6, the flexible thermally conductive film 5 can be effectively kept flat and relaxed. When the driver controls the flexible thermally conductive film 5 to move downward, due to the different volumes, sizes and shapes of the components on the main circuit board 2, the flexible thermally conductive film 5 can be fitted and coated with most of the components as needed, so that the heat on the components can be transferred to the flexible thermally conductive film 5 more quickly, so that the main circuit board 2 and its components can be cooled more quickly. Secondly, after coating the main circuit board 2 and the components thereon, the bottom of the metal foam plate 4 is relatively released, so that the metal foam plate 4 can increase the heat exchange area again, and can perform heat exchange work more efficiently. Due to the recovery ability of the flexible thermally conductive film 5, when the main circuit board 2 is no longer abnormally high or urgently high temperature, the assembly frame 6 drives the flexible thermally conductive film 5 to move upward and reset to perform a conventional heat dissipation mode.

[0029] It should be noted that the recovery ability of the flexible thermally conductive film 5 cannot be maintained for a long time. Any material has fatigue. Therefore, the changes between the deformation and restoration of the flexible thermally conductive film 5 can not only extend the service life of the flexible thermally conductive film 5, but also enable the main circuit board 2 to face abnormally high temperatures through the coating of the flexible thermally conductive film 5 to quickly cool down and exchange heat, thereby improving the heat exchange efficiency and avoiding a decrease in the working efficiency of the main circuit board 2 or the controller.

[0030] Based on the embodiment of the flexible thermally conductive film 5, the inner wall of the controller housing 1 is provided with an assembly groove, the inner wall of which is slidably mounted with an assembly block 7, the outer wall of which is fixedly connected to the outer wall of the assembly frame 6, and the driver is designed at the inner bottom of the assembly groove, the output end of the driver is associated with the bottom of the assembly block 7, and the driver controls the up and down displacement of the assembly block 7. Figure 3 As shown in the enlarged view of its details, in this embodiment, the presence of the assembly block 7 can prevent dust from entering and has a certain degree of protection capability.

[0031] Furthermore, when the assembly frame 6 and the flexible thermally conductive film 5 are moved downward, a convection space is formed between the metal foam plate 4. The outer wall of the controller housing 1 is provided with a second air inlet 13 connected to the convection space. In the initial position, the outer wall of the assembly block 7 closes the second air inlet 13. When the assembly frame 6 and the flexible thermally conductive film 5 are moved downward, the second air inlet 13 is connected to the convection space. Figure 3 As shown in the enlarged view of its details, in this embodiment, when the flexible thermally conductive film 5 and the assembly frame 6 are moved downward, the convection space can quickly receive the heat from the flexible thermally conductive film 5. At the same time, the convection space will be connected to the outside through the second air inlet 13. At this time, the external air will enter the convection space, and then enter the guide space through the porous structure of the metal foam plate 4, and then the hot air will be extracted and transferred through the extractor to quickly exchange heat and cool down.

[0032] Furthermore, the outer wall of the controller housing 1 is further provided with a first air inlet 14, the inner wall of the first air inlet 14 is provided with a guide port connected to the guide space, a piston plate 9 is installed on the top of the assembly block 7, the piston plate 9 slides through the interior of the first air inlet 14, and a docking port 12 is provided on the piston plate 9. In the initial position, the first air inlet 14, the docking port 12 and the guide port are interconnected, please refer to Figure 3 And its detailed enlarged view, in this embodiment, when the piston plate 9 moves downward, the docking port 12 will be staggered with the guide port. At this time, the outer wall of the piston plate 9 will close the guide port, thereby avoiding affecting the operation of the convection space. Among them, under normal heat dissipation state, the first air inlet 14, the docking port 12 and the guide port are interconnected, and the normal operation of the extractor can draw external air into the guide space to complete heat exchange.

[0033] Based on the embodiment of the flexible thermally conductive film 5, the driver includes a memory alloy strip 8 with a heat-sensitive function. The memory alloy strip 8 will deform and shrink when subjected to a preset temperature. The two ends of the memory alloy strip 8 are fixedly connected to the bottom of the assembly block 7 and the inner bottom of the assembly groove respectively. The memory alloy strip 8 is a continuous broken line shape. Figure 3 As shown in the enlarged view of its details, in this embodiment, the critical point of thermal shrinkage or the transition temperature of the memory alloy strip 8 can be adjusted by changing the ratio of elements in the memory alloy strip 8, or by a specific heat treatment auxiliary process, the internal structure of the memory alloy strip 8 can be changed, thereby affecting its deformation temperature point. When the critical temperature is reached, it means that the heat generated by the main circuit board 2, the processor 3 and the components is too high. At this time, the memory alloy strip 8 will shrink, and the flexible thermal conductive film 5 is coated on their surface to accelerate their heat conduction and heat dissipation.

[0034] Based on the embodiment of the flexible thermally conductive film 5, the flexible thermally conductive film 5 is composed of a thermally conductive filler, a base material and an adhesive, wherein the thermally conductive filler and the adhesive are mixed and then coated on the base material. In this embodiment, the thermally conductive filler generally uses metal powder or graphite, which has good thermal conductivity, and the base material can be made of flexible materials such as polyimide. Depending on the needs, the thermally conductive filler and the adhesive are mixed to make a thermally conductive coating, which is evenly applied on the polyimide. After the curing process and the cutting process, a flexible thermally conductive sheet or thermally conductive film can be obtained.

[0035] Furthermore, a plurality of fins 15 are installed at the bottom of the controller housing 1. The fins 15 are wavy in shape. Figure 5 In this embodiment, plate fins are abandoned and fins are used. At the same time, multiple wavy fins 15 can provide more exchange area with air contact, improve heat dissipation efficiency, and are also easy to place. Multiple fins 15 are mainly used to guide and dissipate heat from the back of the main circuit board 2.

[0036] Furthermore, the extractor includes a PWM fan 11 installed on the controller housing 1, the air outlet of the PWM fan 11 is connected to the guide space, the PWM fan 11 is connected to the main circuit board 2 through built-in hidden buried wires, and the main circuit board 2 controls the opening and closing and power supply of the PWM fan 11. In this embodiment, through the cooperation of the PWM fan 11 and the main circuit board 2, the main circuit board 2 can achieve precise temperature control by adjusting the fan speed of the PWM fan 11. By adjusting the PWM signal, the fan speed can be adjusted according to actual needs, thereby effectively dissipating the heat of the electronic components of the multi-axis motion controller to prevent overheating.

[0037] By combining the above structures, the metal foam plate 4 can be used for passive heat exchange, and the downward movement of the flexible thermally conductive film 5 can be used for rapid cooling and heat dissipation, thereby preventing the controller from being in an overheated state for a long time.

[0038] The standard parts used in this embodiment can be purchased directly from the market, and the non-standard structural components recorded in the specification and drawings can also be directly processed according to existing technical common sense without any doubt. At the same time, the connection method of each component adopts the mature conventional means in the existing technology, and the machinery, parts and equipment all adopt conventional models in the existing technology, so no specific description is given here.

[0039] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. Multi-axis motion controller based on ARMCortex-M4, characterized by: include: A controller housing (1) and a main circuit board (2) embedded in the bottom of the controller housing, wherein a processor (3) is integrated and mounted on the main circuit board (2); A metal foam plate (4) is fixedly mounted on the inner wall of the controller housing (1) above the main circuit board (2); the metal foam plate (4) is designed as a porous structure; a flow guide space is formed between the metal foam plate (4) and the inner top of the controller housing (1); the flow guide space is communicated with the external environment; An extractor for transferring air out of the guide space is installed on the outer wall of the controller housing (1).

2. The multi-axis motion controller based on ARM Cortex-M4 according to claim 1, characterized in that: An assembly frame (6) is installed on the inner wall of the controller housing (1) so as to slide up and down. A flexible heat-conducting film (5) is fixedly installed on the inner edge of the assembly frame (6). The flexible heat-conducting film (5) has the ability to recover after deformation. The metal foam plate (4) is located above the flexible heat-conducting film (5), and the bottom of the metal foam plate (4) is tightly fitted with the top of the flexible heat-conducting film (5). The assembly frame (6) has an initial position. In the initial position, the flexible heat-conducting film (5) is a horizontal sheet structure. The inner wall of the controller housing (1) is designed with a driver for controlling the downward displacement of the assembly frame (6). The main circuit board (2) will not interfere with the downward displacement of the assembly frame (6). When the assembly frame (6) moves down to a preset position, the flexible heat-conducting film (5) can be tightly fitted on the main circuit board (2) to cover the processor (3) and components on the main circuit board (2).

3. The multi-axis motion controller based on ARM Cortex-M4 according to claim 2, characterized in that: The inner wall of the controller housing (1) is provided with an assembly groove, an assembly block (7) is slidably mounted on the inner wall of the assembly groove, the outer wall of the assembly block (7) is fixedly connected to the outer wall of the assembly frame (6), the driver is designed at the inner bottom of the assembly groove, the output end of the driver is associated with the bottom of the assembly block (7), and the driver controls the upward and downward displacement of the assembly block (7).

4. The multi-axis motion controller based on ARM Cortex-M4 according to claim 3, characterized in that: When the assembly frame (6) and the flexible heat-conducting film (5) are moved downward, a convection space is formed between the metal foam plate (4); the outer wall of the controller housing (1) is provided with a second air inlet (13) connected to the convection space; in the initial position, the outer wall of the assembly block (7) closes the second air inlet (13); when the assembly frame (6) and the flexible heat-conducting film (5) are moved downward, the second air inlet (13) is connected to the convection space.

5. The multi-axis motion controller based on ARM Cortex-M4 according to claim 4, characterized in that: The outer wall of the controller housing (1) is also provided with a first air inlet (14), and the inner wall of the first air inlet (14) is provided with a guide port connected to the guide space. A piston plate (9) is installed on the top of the assembly block (7), and the piston plate (9) slides through the interior of the first air inlet (14). A docking port (12) is provided on the piston plate (9). In the initial position, the first air inlet (14), the docking port (12) and the guide port are interconnected.

6. The multi-axis motion controller based on ARM Cortex-M4 according to claim 2, characterized in that: The driver comprises a memory alloy strip (8) with a heat-sensitive function. The memory alloy strip (8) deforms and contracts when subjected to a preset temperature. The two ends of the memory alloy strip (8) are fixedly connected to the bottom of the assembly block (7) and the inner bottom of the assembly slot, respectively. The memory alloy strip (8) is in a continuous broken line shape.

7. The multi-axis motion controller based on ARM Cortex-M4 according to claim 2, characterized in that: The flexible heat-conductive film (5) is composed of a heat-conductive filler, a base material and an adhesive, wherein the heat-conductive filler and the adhesive are mixed and then coated on the base material.

8. The ARM Cortex-M4-based multi-axis motion controller according to any one of claims 1 to 7, characterized in that: A plurality of fins (15) are installed at the bottom of the controller housing (1), and the fins (15) are wavy.

9. The multi-axis motion controller based on ARM Cortex-M4 according to claim 8, characterized in that: The extractor comprises a PWM fan (11) mounted on a controller housing (1); an air outlet of the PWM fan (11) is connected to a flow guide space; the PWM fan (11) is connected to a main circuit board (2) via a built-in hidden buried wire; and the main circuit board (2) controls the opening and closing and power supply of the PWM fan (11).

Images