Passive radiator with multiple heat pipes for heat conduction

Abstract

The utility model belongs to the technical field of radiators, and particularly relates to a multi-heat-pipe heat conduction passive radiator. A heat-conducting sheet is arranged in the bottom plate, and the heat-conducting sheet is made of a copper metal material; the main heat dissipation assembly is arranged at the top of the bottom plate, and the main heat dissipation assembly is connected with the heat conduction pieces and used for guiding the dissipation of the auxiliary heat; the auxiliary heat dissipation assembly is arranged on one side of the main heat dissipation assembly and used for assisting the main heat dissipation assembly in matched auxiliary heat dissipation. According to the radiator, the main heat dissipation assembly and the auxiliary heat dissipation assembly adopt the multi-heat-pipe design, the heat transfer capacity is remarkably improved, particularly, the heat conduction oil filled in the main heat pipes and the auxiliary heat pipes can keep good heat dissipation performance under the high-load condition, meanwhile, the main heat dissipation fins and the auxiliary heat dissipation fins are distributed at equal intervals, the heat dissipation area is increased, and the heat dissipation efficiency is improved. And the air convection heat dissipation efficiency is effectively improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of radiators, and in particular relates to a multi-heat pipe heat conduction passive radiator. Background Art

[0002] As electronic devices continue to improve in performance, especially in areas like high-performance computing, gaming, and graphics processing, heat generation is becoming increasingly prominent. Traditional cooling methods, such as fans and simple aluminum heat sinks, are no longer able to meet the efficient heat dissipation requirements of modern electronic devices.

[0003] To overcome the limitations of traditional cooling methods, heat pipe technology has been gradually adopted as a cooling solution for electronic devices. As an efficient heat transfer element, heat pipes enable rapid heat transfer, especially in high-heat flux applications. However, a single heat pipe cooling system can still encounter cooling bottlenecks under extreme loads, especially in space-constrained environments, where cooling efficiency is limited.

[0004] Therefore, it is necessary to design a new solution to solve the above problems. Utility Model Content

[0005] The purpose of the utility model is to provide a multi-heat pipe heat conduction passive radiator, aiming to solve the technical problem in the prior art of poor heat dissipation efficiency and difficulty in adapting to high-load scenarios for heat dissipation.

[0006] To achieve the above-mentioned purpose, an embodiment of the present invention provides a multi-heat pipe heat conduction passive radiator, comprising: a base plate, a heat conducting plate is provided inside the base plate, and the heat conducting plate is made of copper metal material; a main heat dissipation component, the main heat dissipation component is arranged on the top of the base plate, the main heat dissipation component is connected to the heat conducting plate, and is used to guide the dissipation of auxiliary heat; and an auxiliary heat dissipation component, the auxiliary heat dissipation component is arranged on one side of the main heat dissipation component, and is used to assist the main heat dissipation component in cooperating in auxiliary heat dissipation.

[0007] Furthermore, the main heat dissipation component includes: a main radiator, which is composed of multiple main heat dissipation fins, and the multiple main heat dissipation fins are evenly distributed, and a gap is provided between two adjacent main heat dissipation fins; a main heat pipe arranged inside the main radiator, the main heat pipe passes through the multiple main heat dissipation fins, and the bottom of the main heat pipe is connected to the thermal conductive sheet.

[0008] Furthermore, the auxiliary heat dissipation component includes: a secondary radiator, which is composed of multiple secondary heat dissipation fins, and the multiple secondary heat dissipation fins are evenly distributed, and there is a gap between two adjacent secondary heat dissipation fins; a secondary heat pipe arranged inside the secondary radiator, the secondary heat pipe passes through the multiple secondary heat dissipation fins, and the bottom of the secondary heat pipe is connected to the heat conductive sheet, and a heat conductive block is provided between the secondary radiator and the main radiator.

[0009] Furthermore, flow pipes are provided inside the main heat pipe and the secondary heat pipe, and the flow pipes are filled with heat transfer oil.

[0010] Furthermore, the edges of the primary heat dissipation fins and the secondary heat dissipation fins are both provided with arc chamfers.

[0011] Furthermore, a pad is provided on the top of the base plate, the pad is arranged in a stepped structure, and the pad is arranged on the bottom of the secondary radiator.

[0012] Furthermore, an upper cover is provided on the top of the main radiator, and a plurality of heat dissipation holes are opened on the upper cover.

[0013] Furthermore, a plurality of support rods are provided between the upper cover and the bottom plate, and the plurality of support rods are snap-fitted and connected to the bottom plate.

[0014] The above one or more technical solutions in the multi-heat pipe thermal conductive passive radiator provided by the embodiment of the present utility model have at least one of the following technical effects: by adopting a multi-heat pipe design for the main heat dissipation component and the auxiliary heat dissipation component, the heat transfer capability is significantly enhanced, especially the thermal oil filled inside the main heat pipe and the secondary heat pipe can maintain good heat dissipation performance under high load conditions. At the same time, the main heat dissipation fins and the secondary heat dissipation fins are equidistantly distributed, which increases the heat dissipation area and effectively improves the air convection heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0016] Figure 1 A schematic diagram of the overall structure of a radiator provided in an embodiment of the present utility model;

[0017] Figure 2 A schematic structural diagram of the main and auxiliary heat dissipation components of the radiator provided in an embodiment of the present utility model;

[0018] Figure 3A schematic diagram of the structure of the primary heat pipe and the secondary heat pipe of the radiator provided in an embodiment of the utility model;

[0019] Figure 4 A schematic diagram of the internal structure of a radiator provided in an embodiment of the present utility model;

[0020] Figure 5 A schematic cross-sectional view of the primary heat pipe and the secondary heat pipe of the radiator provided by an embodiment of the present utility model;

[0021] Among them, the reference numerals in the figure are: 1-base plate; 101-heat conducting plate; 102-upper cover; 103-heat dissipation hole; 2-main radiator; 201-main cooling fin; 202-main heat pipe; 203-heat conducting block; 3-secondary radiator; 301-secondary cooling fin; 302-secondary heat pipe; 303-flow pipe; 304-pad. DETAILED DESCRIPTION

[0022] The following describes in detail embodiments of the present invention, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the embodiments of the present invention, and should not be construed as limiting the present invention.

[0023] In the description of the embodiments of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0024] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present invention, "plurality" means two or more, unless otherwise specifically defined.

[0025] In the embodiments of the present invention, unless otherwise expressly specified or limited, the terms "installed," "connected," "connected," "fixed," etc. should be understood in a broad sense. For example, they may refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection; direct connection, indirect connection through an intermediate medium; internal communication between two components, or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the embodiments of the present invention based on specific circumstances.

[0026] In one embodiment of the present invention, Figure 1-Figure 5 As shown, a multi-heat pipe heat conduction passive radiator is provided, comprising: a base plate 1, a heat conducting sheet 101 is provided inside the base plate 1, and the heat conducting sheet 101 is made of copper metal material; a main heat dissipation component, the main heat dissipation component is provided on the top of the base plate 1, the main heat dissipation component is connected to the heat conducting sheet 101, and is used to guide the dissipation of auxiliary heat; and an auxiliary heat dissipation component, the auxiliary heat dissipation component is provided on one side of the main heat dissipation component, and is used to assist the main heat dissipation component in cooperating with auxiliary heat dissipation.

[0027] During use, the heat conducting sheet (101) is located inside the bottom plate (1) and directly contacts the heat source. The heat generated by the heat source is transferred to the heat conducting sheet (101) through physical contact. The main heat dissipation component and the auxiliary heat dissipation component are used to quickly conduct and complete the heat dissipation. The copper heat conducting sheet has good heat conduction performance and can quickly transfer heat from the heat source to other heat dissipation components. The bottom plate 1 design ensures good contact between the heat conducting sheet and the heat source, thereby improving the heat conduction efficiency.

[0028] Furthermore, the main heat dissipation component includes: a main radiator 2, which is composed of multiple main heat dissipation fins 201, and the multiple main heat dissipation fins 201 are evenly distributed, and there is a gap between two adjacent main heat dissipation fins 201; a main heat pipe 202 is arranged inside the main radiator 2, and the main heat pipe 202 passes through the multiple main heat dissipation fins 201, and the bottom of the main heat pipe 202 is connected to the heat conducting plate 101.

[0029] The main heat pipe (202) is used to absorb heat from the heat conducting sheet (101). At this time, the heat conducting oil flows in the main heat pipe (202), bringing the heat to the main heat dissipation fins (201), and dissipating the heat into the air through the fins. The multiple main heat dissipation fins (201) increase the surface area, which helps to improve the air convection heat dissipation efficiency.

[0030] Furthermore, a flow pipe 303 is provided inside the main heat pipe 202 and the secondary heat pipe 302, and the flow pipe 303 is filled with heat transfer oil. The heat transfer oil in the main heat pipe (202) can effectively transfer heat and maintain good heat dissipation performance even under high load conditions.

[0031] Furthermore, an upper cover 102 is provided on the top of the main radiator 2, and a plurality of heat dissipation holes 103 are opened on the upper cover 102. During use, the heat dissipation holes (103) allow hot air to be discharged, promoting air flow. The design of the heat dissipation holes optimizes air flow, which helps to improve the natural cooling efficiency. The upper cover 102 protects the internal components from dust pollution without affecting the heat dissipation effect.

[0032] Furthermore, a plurality of support rods are provided between the upper cover 102 and the bottom plate 1, and the plurality of support rods are snap-fitted to the bottom plate 1. The support rods fix the distance between the upper cover (102) and the bottom plate (1), ensuring sufficient space for air circulation, thereby providing stable structural support, preventing damage caused by external pressure, and ensuring sufficient space for air circulation, thereby improving heat dissipation efficiency.

[0033] In another embodiment of the present invention, Figure 1-Figure 5 As shown, further, the auxiliary heat dissipation component includes: a secondary radiator 3, the secondary radiator 3 is composed of a plurality of secondary heat dissipation fins 301, and the plurality of secondary heat dissipation fins 301 are evenly distributed, and a gap is provided between two adjacent secondary heat dissipation fins 301; a secondary heat pipe 302 is provided inside the secondary radiator 3, the secondary heat pipe 302 passes through the plurality of secondary heat dissipation fins 301, and the bottom of the secondary heat pipe 302 is connected to the heat conductive sheet 101, and a heat conductive block 203 is provided between the secondary radiator 3 and the main radiator 2.

[0034] During use, the secondary heat pipe (302) also transfers heat to the secondary heat sink fin (301) through the thermal oil, and the heat conduction block (203) is used to help evenly distribute the heat between the main radiator (2) and the secondary radiator (3). By adding an additional heat dissipation path, the efficiency of the overall heat dissipation system is improved. Under high load, the secondary radiator (3) can serve as an auxiliary heat dissipation unit to ensure the stability of the system temperature.

[0035] Furthermore, the edges of the main heat sink fins 201 and the secondary heat sink fins 301 are provided with arc chamfers. The arc chamfers can reduce turbulence and improve the smoothness of air flowing through the heat sink fins, thereby improving heat dissipation efficiency and reducing energy loss. At the same time, it can also prevent the fins from scratching the user's hands.

[0036] Furthermore, a pad 304 is provided on the top of the base plate 1. The pad 304 is arranged in a stepped structure. The pad 304 is placed on the bottom of the secondary radiator 3. The pad (304) is used to support the secondary radiator (3) to ensure that there is enough space between it and the base plate (1), thereby ensuring that the heat flow between the secondary radiator (3) and the main radiator (2) is unobstructed. The stepped design is conducive to air circulation, further improving the heat dissipation effect.

[0037] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A multi-heat pipe heat conduction passive radiator, characterized in that: include; A bottom plate (1), wherein a heat conducting plate (101) is provided inside the bottom plate (1), and the heat conducting plate (101) is made of copper metal material; A main heat dissipation component, the main heat dissipation component being arranged on the top of the base plate (1), the main heat dissipation component being connected to the heat conducting sheet (101) and being used for guiding the dissipation of auxiliary heat; and Auxiliary heat dissipation component, the auxiliary heat dissipation component is arranged on one side of the main heat dissipation component, and is used to assist the main heat dissipation component in performing auxiliary heat dissipation.

2. The multi-heat pipe heat conduction passive radiator according to claim 1, characterized in that: The main heat dissipation component includes: A main radiator (2), the main radiator (2) being composed of a plurality of main radiating fins (201), the plurality of main radiating fins (201) being equidistantly distributed, and a gap being provided between two adjacent main radiating fins (201); A main heat pipe (202) is provided inside the main radiator (2), the main heat pipe (202) passes through the plurality of main heat dissipation fins (201), and the bottom of the main heat pipe (202) is connected to the heat conducting sheet (101).

3. The multi-heat pipe heat conduction passive radiator according to claim 2, characterized in that: The auxiliary heat dissipation component includes: A secondary radiator (3), the secondary radiator (3) being composed of a plurality of secondary radiating fins (301), wherein the plurality of secondary radiating fins (301) are equidistantly distributed and a gap is provided between two adjacent secondary radiating fins (301); A secondary heat pipe (302) is provided inside the secondary radiator (3), the secondary heat pipe (302) passes through the plurality of secondary heat dissipation fins (301), and the bottom of the secondary heat pipe (302) is connected to the heat conducting plate (101), and a heat conducting block (203) is provided between the secondary radiator (3) and the main radiator (2).

4. The multi-heat pipe heat conduction passive radiator according to claim 3, characterized in that: A flow pipe (303) is provided inside the main heat pipe (202) and the secondary heat pipe (302), and the flow pipe (303) is filled with heat-conducting oil.

5. The multi-heat pipe heat conduction passive radiator according to claim 3, characterized in that: The edges of the primary heat dissipation fins (201) and the secondary heat dissipation fins (301) are both provided with arc chamfers.

6. The multi-heat pipe heat conduction passive radiator according to claim 3, characterized in that: A pad (304) is provided on the top of the base plate (1); the pad (304) is arranged in a stepped structure; the pad (304) is padded on the bottom of the secondary radiator (3).

7. The multi-heat pipe heat conduction passive radiator according to claim 2, characterized in that: An upper cover (102) is provided on the top of the main radiator (2), and a plurality of heat dissipation holes (103) are provided on the upper cover (102).

8. The multi-heat pipe heat conduction passive radiator according to claim 7, characterized in that: A plurality of support rods are provided between the upper cover (102) and the bottom plate (1), and the plurality of support rods are snap-fitted and connected to the bottom plate (1).

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