Pressure monitoring device for steel wire machining stamping

Abstract

The utility model relates to a pressure monitoring device for steel wire machining stamping. The pressure monitoring device sequentially comprises an upper die unit and a lower die unit from top to bottom. A lower die fixing base is arranged on the outer side of the lower die base, the lower die base can move in a lower die movable cavity in the inner side of the lower die fixing base in the vertical direction, and the bottom of the lower die base is connected with the lower die movable cavity below through a plurality of lower die damping mechanisms. Positioning columns are arranged on the left side and the right side of the bottom of the upper die stamping head, and positioning contact mechanisms matched with the positioning columns are arranged on the lower die base under the positioning columns. Primary pressure monitoring is achieved through the positioning column and the positioning contact mechanism below the positioning column, secondary pressure monitoring is further achieved through the lower die base and the lower die damping mechanism below the lower die base, and influences on formed products are avoided.

Description

Technical Field

[0001] The utility model relates to the technical field related to steel wire processing, and in particular to a pressure monitoring device for steel wire processing and stamping. Background Art

[0002] During the production and processing of steel and aluminum plate structural parts, they need to be stamped and formed. During the stamping process, the pressure during stamping is also very important, so the pressure during stamping needs to be monitored in real time.

[0003] After massive searches, it was found that the prior art publication number is CN210995882U, which discloses an intelligent mold pressure monitoring device, which belongs to the field of cold stamping mold forming pressure monitoring. The current lack of an intelligent mold pressure monitoring device for cold stamping parts forming is a technical problem that needs to be solved urgently. The intelligent mold pressure monitoring device in the utility model mainly includes the following components: a lower mold balance block, a lower mold mounting screw, a force sensor, an upper mold mounting screw and an upper mold balance block; the force sensor is fixed to the lower mold through the lower mold balance block and the lower mold mounting screw, and the upper mold balance block is fixed to the upper mold through the upper mold mounting screw, and the lower end face of the upper mold balance block corresponds to the upper end face of the lower mold balance block. When the upper mold and the lower mold are closed, the pressure between the two is transmitted to the force sensor through the upper mold balance block and the lower mold balance block.

[0004] In summary, the problems existing in the prior art are:

[0005] The existing pressure monitoring device is a punch head that punches and contacts the pressure sensor installed in the lower die cavity, thereby monitoring the punching pressure in real time. However, the location of the pressure sensor in the lower die cavity will have a certain impact on the molded product, so it is necessary to spend more cost on the design of the lower die cavity.

[0006] In view of the above-mentioned defects, the designer has actively carried out research and innovation in order to create a pressure monitoring device for steel wire processing and stamping, so that it has more industrial utilization value. Utility Model Content

[0007] In order to solve any of the above technical problems, the purpose of the present utility model is to provide a pressure monitoring device for steel wire processing and stamping.

[0008] In order to achieve the above purpose, the present invention adopts the following technical solutions:

[0009] A pressure monitoring device for steel wire processing and stamping, comprising, from top to bottom, an upper die unit and a lower die unit;

[0010] The upper die unit includes an upper die movable frame, the bottom of the upper die driving cylinder is connected to the upper die movable frame below, and the upper die punch head is installed on the bottom of the upper die movable frame through the upper die punch mounting seat;

[0011] The lower die unit includes a lower die base, and a lower die cavity adapted to the upper die punch is provided on the lower die base directly below the upper die punch;

[0012] A lower die fixing seat is provided on the outer side of the lower die seat. The lower die seat can move in the vertical direction within the lower die movable cavity inside the lower die fixing seat. The bottom of the lower die seat is connected to the lower die movable cavity below through a plurality of lower die damping mechanisms.

[0013] Positioning columns are provided on both the left and right sides of the bottom of the upper die punch head, and a positioning contact mechanism matched with the positioning columns is provided on the lower die base just below the positioning columns.

[0014] As a further improvement of the present invention, a pressure block is installed at the bottom of the positioning column, and the positioning contact mechanism includes a positioning hole, a contact block, a first elastic structure and a first pressure sensor. A positioning hole is opened on the lower mold base directly below the positioning column, and a contact block, a first elastic structure and a first pressure sensor are arranged in the positioning hole from top to bottom. The first pressure sensor is located at the bottom of the positioning hole, and a first elastic structure that can realize elastic displacement in the vertical direction is installed above the first pressure sensor. A contact block adapted to the upper pressure block is installed above the first elastic structure.

[0015] As a further improvement of the present invention, the first elastic structure is a hydraulic rod or an elastic telescopic rod.

[0016] As a further improvement of the present invention, guide rails distributed along the vertical direction are installed on both the left and right sides of the lower mold movable cavity, and the left and right sides of the lower mold base are connected to the outer guide rails through sliders respectively.

[0017] As a further improvement of the present invention, the lower mold damping mechanism includes a second elastic structure, a fixed sleeve and a second pressure sensor. The top of the second elastic structure is installed on the bottom of the lower mold base through an upper mounting block. The second elastic structure can realize elastic displacement in the vertical direction. A fixed sleeve is provided on the lower mold fixed base directly below the second elastic structure. The bottom of the second elastic structure is clamped in the fixed sleeve through a lower limit block, and the second pressure sensor is located at the inner bottom of the fixed sleeve.

[0018] As a further improvement of the present invention, the second elastic structure is a spring.

[0019] By means of the above solution, the present invention has at least the following advantages:

[0020] The utility model realizes primary pressure monitoring through the positioning column and the positioning contact mechanism below, and secondary pressure monitoring through the lower die base and the lower die damping mechanism below, thereby avoiding the influence on the molded product;

[0021] The utility model combines the pressure monitoring structure setting of the positioning contact mechanism and the lower die damping mechanism, so that the pressure detection during stamping is more stable and uniform, the pressure deviation is reduced, and the accuracy of pressure detection is improved.

[0022] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention and to implement it according to the contents of the specification, the following is a detailed description of the preferred embodiments of the present invention in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.

[0024] Figure 1 This is a schematic structural diagram of a pressure monitoring device for steel wire processing and stamping according to the present invention;

[0025] Figure 2 yes Figure 1 Schematic diagram of the structure of the middle and upper mold units;

[0026] Figure 3 yes Figure 1 Schematic diagram of the structure of the middle and lower mold units;

[0027] Figure 4 yes Figure 3 Structural diagram of the positioning contact mechanism;

[0028] Figure 5 yes Figure 3 Schematic diagram of the structure of the middle and lower mold damping mechanism;

[0029] Figure 6 yes Figure 5 Schematic diagram of the structure in another usage state.

[0030] The meanings of the reference numerals in the figures are as follows.

[0031] Upper mold unit 1, lower mold unit 2;

[0032] Upper die movable frame 11, upper die driving cylinder 12, upper die stamping mounting seat 13, upper die stamping head 14, positioning column 15, pressing block 16;

[0033] Lower die fixed base 21, lower die movable cavity 22, lower die base 23, lower die cavity 24, positioning contact mechanism 25, guide rail 26, slider 27, lower die damping mechanism 28;

[0034] Positioning hole 251, contact block 252, first elastic structure 253, first pressure sensor 254;

[0035] Upper mounting block 281 , second elastic structure 282 , fixing sleeve 283 , lower limit block 284 , second pressure sensor 285 . DETAILED DESCRIPTION

[0036] The following embodiments are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0037] In order to enable those skilled in the art to better understand the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. The components of the embodiments of the present invention generally described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of the utility model for which protection is sought, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making creative work are within the scope of protection of the present invention.

[0038] Example

[0039] like Figures 1 to 6 As shown,

[0040] A pressure monitoring device for steel wire processing and stamping comprises an upper die unit 1 and a lower die unit 2 from top to bottom.

[0041] 1. The upper die unit 1 includes an upper die movable frame 11 . The bottom of the upper die driving cylinder 12 is connected to the upper die movable frame 11 below. An upper die punch head 14 is installed at the bottom of the upper die movable frame 11 through an upper die punch mounting seat 13 .

[0042] 2. The lower die unit 2 includes a lower die base 23 . A lower die cavity 24 adapted to the upper die punch 14 is provided on the lower die base 23 directly below the upper die punch 14 .

[0043] 3. Positioning posts 15 are provided on both the left and right sides of the bottom of the upper die punch 14 , and a positioning contact mechanism 25 adapted to the positioning posts 15 is provided on the lower die base 23 just below the positioning posts 15 .

[0044] A pressure block 16 is installed at the bottom of the positioning column 15, and the positioning contact mechanism 25 includes a positioning hole 251, a contact block 252, a first elastic structure 253 and a first pressure sensor 254. A positioning hole 251 is opened on the lower mold base 23 directly below the positioning column 15, and the contact block 252, the first elastic structure 253 and the first pressure sensor 254 are arranged in sequence from top to bottom in the positioning hole 251. The first pressure sensor 254 is located at the bottom of the positioning hole 251, and the first elastic structure 253 that can realize elastic displacement in the vertical direction is installed above the first pressure sensor 254. Above the first elastic structure 253, a contact block 252 that is compatible with the upper pressure block 16 is installed.

[0045] The first elastic structure 253 is a hydraulic rod or an elastic telescopic rod.

[0046] When the upper die punch head 14 is pressed down, the pressure block 16 at the bottom of the positioning column 15 contacts the contact block 252 located at the top of the positioning hole 251, and then the contact block 252 drives the first elastic structure 253 to press down, and the first pressure sensor 254 can detect the stamping pressure of the upper die punch head 14.

[0047] In addition, the above process also plays a buffering role, avoiding the hard collision of upper and lower punching, which can effectively reduce the damage of mold rigidity caused by excessive impact force during the punching process and increase its service life.

[0048] 4. A lower die fixing base 21 is provided on the outer side of the lower die base 23. The lower die base 23 can move vertically in the lower die movable cavity 22 inside the lower die fixing base 21. The bottom of the lower die base 23 is connected to the lower die movable cavity 22 below through several lower die damping mechanisms 28.

[0049] 1. Guide rails 26 distributed along the vertical direction are installed on both the left and right sides of the lower mold movable cavity 22. The left and right sides of the lower mold base 23 are connected to the outer guide rails 26 through sliders 27 respectively.

[0050] 2. The lower mold damping mechanism 28 includes a second elastic structure 282, a fixed sleeve 283 and a second pressure sensor 285. The top of the second elastic structure 282 is installed on the bottom of the lower mold base 23 through the upper mounting block 281. The second elastic structure 282 can realize elastic displacement in the vertical direction. A fixed sleeve 283 is provided on the lower mold fixed base 21 directly below the second elastic structure 282. The bottom of the second elastic structure 282 is clamped in the fixed sleeve 283 through the lower limit block 284. The second pressure sensor 285 is located at the inner bottom of the fixed sleeve 283.

[0051] The second elastic structure 282 is a spring.

[0052] When the upper die punch 14 drives the lower die base 23 to press downward, the lower die base 23 can slide on the guide rail 26 via the slider 27, thereby improving the smoothness of the movement of the lower die base 23 and improving the stability of the stamping. When the lower die base 23 contacts the lower die damping mechanism 28 below, the pressure drives the second elastic structure 282 at the lower end to press downward, and then the second pressure sensor 285 at the bottom can detect the pressure of the upper die punch 14, which can detect the overall pressure during stamping.

[0053] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implying the number of technical features indicated. Therefore, features defined as "first", "second", etc. may explicitly or implicitly include one or more of such features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0054] In the description of this utility model, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integral connections; mechanical connections, electrical connections, direct connections, indirect connections through an intermediate medium, and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on specific circumstances.

[0055] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. It should be pointed out that ordinary technicians in this technical field can make several improvements and modifications without departing from the technical principles of the present invention. These improvements and modifications should also be regarded as within the scope of protection of the present invention.

Claims

1. A pressure monitoring device for steel wire processing and stamping, comprising, from top to bottom, an upper die unit (1) and a lower die unit (2); The upper die unit (1) includes an upper die movable frame (11), the bottom of an upper die driving cylinder (12) is connected to the upper die movable frame (11) below, and an upper die punch head (14) is installed at the bottom of the upper die movable frame (11) via an upper die punch mounting seat (13); The lower die unit (2) includes a lower die base (23), and a lower die cavity (24) adapted to the upper die punch (14) is provided on the lower die base (23) directly below the upper die punch (14); Its characteristics are: A lower die fixing seat (21) is provided on the outer side of the lower die seat (23); the lower die seat (23) can move vertically in a lower die movable cavity (22) inside the lower die fixing seat (21); and the bottom of the lower die seat (23) is connected to the lower die movable cavity (22) below via a plurality of lower die damping mechanisms (28); Positioning columns (15) are provided on both the left and right sides of the bottom of the upper die punch (14), and a positioning contact mechanism (25) adapted to the positioning columns (15) is provided on the lower die base (23) directly below the positioning columns (15).

2. A pressure monitoring device for steel wire processing and stamping according to claim 1, characterized in that: A pressure block (16) is installed at the bottom of the positioning column (15), and the positioning contact mechanism (25) includes a positioning hole (251), a contact block (252), a first elastic structure (253) and a first pressure sensor (254). A positioning hole (251) is opened on the lower mold base (23) directly below the positioning column (15), and a contact block (252), a first elastic structure (253) and a first pressure sensor (254) are arranged in sequence from top to bottom in the positioning hole (251). The first pressure sensor (254) is located at the bottom of the positioning hole (251), and a first elastic structure (253) that can realize elastic displacement in the vertical direction is installed above the first pressure sensor (254). A contact block (252) adapted to the upper pressure block (16) is installed above the first elastic structure (253).

3. A pressure monitoring device for steel wire processing and stamping according to claim 2, characterized in that: The first elastic structure (253) is a hydraulic rod or an elastic telescopic rod.

4. A pressure monitoring device for steel wire processing and stamping according to claim 1, characterized in that: Guide rails (26) distributed along the vertical direction are installed on both the left and right sides of the lower mold movable cavity (22), and the left and right sides of the lower mold base (23) are connected to the outer guide rails (26) through sliders (27) respectively.

5. A pressure monitoring device for steel wire processing and stamping according to claim 1, characterized in that: The lower die damping mechanism (28) comprises a second elastic structure (282), a fixed sleeve (283) and a second pressure sensor (285). The top of the second elastic structure (282) is mounted on the bottom of the lower die seat (23) via an upper mounting block (281). The second elastic structure (282) can realize elastic displacement in the vertical direction. A fixed sleeve (283) is provided on the lower die fixed seat (21) directly below the second elastic structure (282). The bottom of the second elastic structure (282) is clamped in the fixed sleeve (283) via a lower limit block (284). The second pressure sensor (285) is located at the inner bottom of the fixed sleeve (283).

6. A pressure monitoring device for steel wire processing and stamping according to claim 5, characterized in that: The second elastic structure (282) is a spring.

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