Signal processing device and electronic equipment comprising same

Abstract

The utility model relates to a signal processing device and electronic equipment comprising the same. A signal processing apparatus may include: a signal input port for receiving a multiplexed signal, the multiplexed signal including an audio signal and a haptic signal; a demultiplexing unit connected to the signal input port and used for separating the audio signal and the tactile signal from the multiplexed signal; the first power amplifier is connected to the demultiplexing unit and is used for amplifying the audio signal; the second power amplifier is connected to the demultiplexing unit and is used for amplifying the tactile signal; the first signal output port is connected to the first power amplifier and is used for outputting the amplified audio signal; and the second signal output port is connected to the second power amplifier and is used for outputting the amplified tactile signal.

Description

Technical Field

[0001] The present application relates to the field of electronic technology, and more particularly, to a signal processing device for processing audio signals and tactile signals, and an electronic device including the signal processing device. Background Art

[0002] As portable electronic devices such as smartphones, tablets, and wearable devices become increasingly versatile, the number of electronic components required to be integrated into these devices continues to increase. For example, portable electronic devices typically incorporate speakers for audio playback and vibration motors for tactile (e.g., vibration) output.

[0003] Existing audio and tactile output solutions generally use two independent driver chips to drive the speaker and vibration motor respectively. Figure 1 An example of this is shown in FIG. Figure 1 As shown, the audio driver chip 10 includes a power amplifier 11 and a boost circuit 12, wherein the boost circuit 12 receives a power supply voltage VDD and boosts the power supply voltage to a high voltage, providing the high voltage to power the power amplifier 11. The power amplifier 11 receives an audio signal S1, amplifies the audio signal S1, and provides the amplified audio signal S1 to drive the speaker 20, thereby playing the audio signal. In addition, the independent tactile driver chip 30 includes a power amplifier 31 and a boost circuit 32, wherein the boost circuit 32 receives a power supply voltage VDD and boosts the power supply voltage to a high voltage, providing the high voltage to power the power amplifier 31. The power amplifier 31 receives a tactile signal S2 provided externally or stored internally in the chip, amplifies the tactile signal S2, and provides the amplified tactile signal S2 to drive the motor 40, thereby generating tactile feedback.

[0004] However, this independent driver solution has numerous drawbacks. For example, the manufacturing and installation of two independent driver chips incurs higher costs, and more complex peripheral circuitry (such as power supply circuits and drive signal supply circuits) is required to coordinate with these two chips. Furthermore, the two chips occupy a large area on the circuit board, hindering the miniaturization of electronic devices. Utility Model Content

[0005] In order to solve the above problems, the present application is proposed. The present application provides a two-in-one driving solution, which can use a single driving circuit (eg, a driving chip) to drive both a speaker and a motor.

[0006] According to one embodiment, a signal processing device may include: a signal input port for receiving a multiplexed signal, the multiplexed signal including an audio signal and a tactile signal; a demultiplexing unit connected to the signal input port, for separating the audio signal and the tactile signal from the multiplexed signal; a first power amplifier connected to the demultiplexing unit, for amplifying the audio signal; a second power amplifier connected to the demultiplexing unit, for amplifying the tactile signal; a first signal output port connected to the first power amplifier, for outputting the amplified audio signal; and a second signal output port connected to the second power amplifier, for outputting the amplified tactile signal.

[0007] In some examples, the multiplexed signal may include a time-division multiplexed or frequency-division multiplexed audio signal and a haptic signal.

[0008] In some examples, when the multiplexed signal includes a time-division multiplexed audio signal and a haptic signal, the demultiplexing unit may include: a first switch having one end connected to the signal input port to receive the multiplexed signal and the other end connected to the first power amplifier; and a second switch having one end connected to the signal input port to receive the multiplexed signal and the other end connected to the second power amplifier. During a first time period, the first switch is turned on and the second switch is turned off, so that the audio signal in the multiplexed signal is provided to the first power amplifier via the first switch; during a second time period different from the first time period, the first switch is turned off and the second switch is turned on, so that the haptic signal in the multiplexed signal is provided to the second power amplifier via the second switch.

[0009] In some examples, when the multiplexed signal includes the audio signal and the tactile signal that are frequency-division multiplexed, the demultiplexing unit may include: a first filter, whose input is connected to the signal input port to receive the multiplexed signal, and whose output is connected to the first power amplifier, and the first filter is configured to allow the frequency component of the audio signal in the multiplexed signal to pass through the first filter to be provided to the first power amplifier; and a second filter, whose input is connected to the signal input port to receive the multiplexed signal, and whose output is connected to the second power amplifier, and the second filter is configured to allow the frequency component of the tactile signal in the multiplexed signal to pass through the second filter to be provided to the second power amplifier.

[0010] In some examples, the first power amplifier and the second power amplifier can be powered by a boost unit, which may include: a first voltage detection circuit for detecting the voltage of the audio signal; a second voltage detection circuit for detecting the voltage of the tactile signal; a control unit connected to the first voltage detection circuit and the second voltage detection circuit, configured to determine a target boost voltage based on the voltage of the audio signal and the voltage of the tactile signal; a boost circuit connected to the control unit, configured to boost the power supply voltage to the target boost voltage under the control of the control unit; and a voltage divider circuit connected to the boost circuit to receive the target boost voltage and to the control unit to provide a first boost voltage at a first output port and a second boost voltage at a second output port under the control of the control unit, the first output port being connected to the first power amplifier to power the first power amplifier using the first boost voltage, and the second output port being connected to the second power amplifier to power the second power amplifier using the second boost voltage.

[0011] In some examples, the signal processing device may be implemented as a chip. When the multiplexed signal is a single-ended signal, the signal input port may be implemented as a single input pin of the chip to receive the single-ended signal; when the multiplexed signal is a differential signal, the signal input port may be implemented as a pair of input pins of the chip to receive the differential signal. The first signal output port may be implemented as a first pair of output pins of the chip for connecting to a speaker, and the first pair of output pins may use the amplified audio signal to drive the speaker. The second signal output port may be implemented as a second pair of output pins of the chip for connecting to a motor, and the second pair of output pins may use the amplified tactile signal to drive the motor.

[0012] According to another embodiment, a signal processing device may include: a signal input port for receiving a multiplexed signal, the multiplexed signal including an audio signal and a tactile signal; a power amplifier connected to the signal input port for amplifying the multiplexed signal; a demultiplexing unit connected to the power amplifier for separating the audio signal and the tactile signal from the multiplexed signal after amplification; a first signal output port connected to the demultiplexing unit for outputting the audio signal; and a second signal output port connected to the demultiplexing unit for outputting the tactile signal.

[0013] In some examples, the multiplexed signal may include an audio signal and a tactile signal that are time-division multiplexed or frequency-division multiplexed. When the multiplexed signal includes an audio signal and a tactile signal that are time-division multiplexed, the demultiplexing unit may include: a first switch, one end of which is connected to the power amplifier to receive the amplified multiplexed signal, and the other end is connected to the first signal output port; and a second switch, one end of which is connected to the power amplifier to receive the amplified multiplexed signal, and the other end is connected to the second signal output port. In a first time period, the first switch is turned on and the second switch is turned off, so that the audio signal in the multiplexed signal is provided to the first signal output port via the first switch; in a second time period different from the first time period, the first switch is turned off and the second switch is turned on, so that the tactile signal in the multiplexed signal is provided to the second signal output port via the second switch. When the multiplexed signal includes a frequency-division multiplexed audio signal and a tactile signal, the demultiplexing unit may include: a first filter, whose input end is connected to the power amplifier to receive the multiplexed signal after amplification, and whose output end is connected to the first signal output port, and the first filter is configured to allow the frequency component of the audio signal in the multiplexed signal to pass through the first filter to be provided to the first signal output port; and a second filter, whose input end is connected to the power amplifier to receive the multiplexed signal after amplification, and whose output end is connected to the second signal output port, and the second filter is configured to allow the frequency component of the tactile signal in the multiplexed signal to pass through the second filter to be provided to the second signal output port.

[0014] In some examples, the signal processing device may be implemented as a chip. When the multiplexed signal is a single-ended signal, the signal input port may be implemented as a single input pin of the chip to receive the single-ended signal; when the multiplexed signal is a differential signal, the signal input port may be implemented as a pair of input pins of the chip to receive the differential signal. The first signal output port may be implemented as a first pair of output pins of the chip for connecting to a speaker, the first pair of output pins using the amplified audio signal to drive the speaker. The second signal output port may be implemented as a second pair of output pins of the chip for connecting to a motor, the second pair of output pins using the amplified tactile signal to drive the motor.

[0015] According to another embodiment, an electronic device may include the above-mentioned signal processing device. The electronic device may be any terminal device with voice playback function and tactile (e.g., vibration) output function, such as but not limited to a smartphone, tablet computer, wearable device, etc.

[0016] Compared with the prior art, the signal processing device of the present application can process both audio signals and tactile signals, and use the corresponding signals to drive the speaker and the vibration motor, thereby reducing the number of electronic components integrated in the electronic device, saving the occupied area on the circuit board, and facilitating the further miniaturization of the electronic device. Moreover, the signal processing device of the present application can receive both audio signals and tactile signals on the same port, reducing the number of ports, improving the integration of the device, and thus simplifying the complexity of the related peripheral circuits. Compared with the traditional solution of using two independent chips to drive the speaker and the vibration motor respectively, the signal processing device of the present application can be implemented as a single chip, and some components can be reused for processing both audio signals and tactile signals, such as multiplexing the boost circuit, etc., thereby saving costs in chip design, manufacturing, installation, etc.

[0017] The above and other features and advantages of the present application will become more apparent from the following description of exemplary embodiments with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] By describing the embodiments of the present invention in more detail in conjunction with the accompanying drawings, the above-mentioned and other purposes, features and advantages of the present invention will become more apparent. The accompanying drawings are used to provide a further understanding of the embodiments of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings, the same reference numerals generally represent the same parts. It should be understood that the sizes and dimensions of the parts shown in the figures are not necessarily drawn to scale and may be different from those shown here for implementation. In addition, some embodiments may combine any suitable combination of features from two or more drawings.

[0019] Figure 1 A schematic block diagram of a speaker driver chip and a motor driver chip in the prior art.

[0020] Figure 2 is a schematic block diagram of a signal processing device according to an embodiment of the present application.

[0021] Figure 3 is a schematic circuit diagram of a demultiplexing unit according to an embodiment of the present application.

[0022] Figure 4 is a schematic circuit diagram of a demultiplexing unit according to another embodiment of the present application.

[0023] Figure 5 is a schematic block diagram of a boost unit according to an embodiment of the present application.

[0024] Figure 6is a schematic block diagram of a signal processing device according to another embodiment of the present application.

[0025] Figure 7 is a schematic block diagram of an electronic device according to an embodiment of the present application. DETAILED DESCRIPTION

[0026] Below, example embodiments according to the present application will be described in detail with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, rather than all embodiments of the present application. At the same time, it is not necessary to achieve all of the above advantages at the same time when implementing any example of the embodiments of the present application. It should be understood that the present application should not be limited to the specific details of these example embodiments. Instead, the embodiments of the present application can be implemented without these specific details or using other alternatives without departing from the ideas and principles of the present application defined in the claims.

[0027] Figure 2 FIG. 1 shows a schematic block diagram of a signal processing device 100 according to an embodiment of the present application. Figure 2 As shown, the signal processing device 100 may include a demultiplexing unit 110 , a first power amplifier 120 , a second power amplifier 130 and a boosting unit 140 .

[0028] The demultiplexing unit 110 can be connected to the input port IN of the signal processing device 100 to receive a multiplexed signal S, which may include a multiplexed audio signal S1 and a tactile signal S2, wherein the audio signal S1 and the tactile signal S2 may be time-division multiplexed or frequency-division multiplexed. In a time-division multiplexing scheme, the multiplexed signal S may include the audio signal S1 in a first time period and the tactile signal S2 in a second time period, with the first time period and the second time period appearing alternately with each other. When a time-division multiplexing scheme is adopted, in one embodiment, the input port IN may be implemented as, for example, an I2S port, where one channel of the I2S signal received thereon may be used to transmit the audio signal S1, and another channel of the I2S signal may be used to transmit the tactile signal S2. The I2S protocol is well known in the art and will not be described in detail here. In a frequency-division multiplexing scheme, the multiplexed signal S may include the audio signal S1 in a first frequency range and the tactile signal S2 in a second frequency range, wherein the first frequency range and the second frequency range may be different from each other, partially overlap, or the second frequency range may be a portion of the first frequency range. For example, the first frequency range of the audio signal S1 can cover the hearing frequency range of the human ear, which is approximately 20Hz-20KHz, generally 150-350Hz, and typically above 200Hz; the second frequency range of the tactile signal S2 can be below 200Hz. However, it should be understood that the first frequency range of the audio signal S1 and the second frequency range of the tactile signal S2 in the multiplexed signal S received at the input port IN are not limited to the examples given here, but any other appropriate frequency range can be used, because the signal processing device 100 can also include one or more frequency conversion units (not shown) to convert the audio signal S1 and the tactile signal S2 to the desired frequency range, thereby ultimately driving the speaker 20 and the motor 40 at the desired frequency.

[0029] It is understood that the audio signal S1 and the haptic signal S2 can be different signals, or the haptic signal S2 can be a portion of the audio signal S1. For example, the audio signal S1 can be a multi-channel audio signal such as "2.1," "5.1," or "7.1," and a certain channel, such as a low-frequency effects audio channel, also generally referred to as a subwoofer channel, can be extracted and processed, such as by frequency shifting, to convert it into the haptic signal S2. In this example, it can be said that a portion of the audio signal S1 (e.g., the low-frequency effects channel portion) is the haptic signal S2.

[0030] Continue to refer to Figure 2, the demultiplexing unit 110 can separate the audio signal S1 and the tactile signal S2 from the multiplexed signal S, and provide the audio signal S1 and the tactile signal S2 to the first power amplifier 120 and the second power amplifier 130 for amplification processing. The first power amplifier 120 and the second power amplifier 130 can be power amplifiers of the same type or different types, including but not limited to class A amplifiers, class B amplifiers, class AB amplifiers, class D amplifiers, etc. Figure 2 In the illustrated embodiment, the first power amplifier 120 and the second power amplifier 130 can be powered by a boost unit 140. The boost unit 140 can convert the power supply voltage VDD into high voltages, such as a first high voltage PVDD1 and a second high voltage PVDD2. The first high voltage PVDD1 is used to power the first power amplifier 120, and the second high voltage PVDD2 is used to power the second power amplifier 130. The power supply voltage VDD can be, for example, a battery voltage provided by a lithium battery, which is generally around 4V. The boost unit 140 can boost the battery voltage to a sufficient level based on, for example, the voltages of the audio signal S1 and the haptic signal S2, and then use a voltage divider circuit to provide appropriate first and second high voltages PVDD1 and PVDD2 to the first power amplifier 120 and the second power amplifier 130. The first and second high voltages PVDD1 and PVDD2 can be equal or different. In other embodiments, the first power amplifier 120 and the second power amplifier 130 can be powered by separate boost units, or one or both of the first and second power amplifiers 120 and 130 can be powered by circuitry external to the signal processing device 100.

[0031] The first power amplifier 120 can provide the amplified audio signal S1 to the first signal output port OUT1, and the second power amplifier 130 can provide the amplified tactile signal S2 to the second signal output port OUT2. The speaker 20 can be connected to the first signal output port OUT1 of the signal processing device 100, so that the audio signal S1 can be used to drive the speaker 20 to achieve audio playback. The motor 40 can be connected to the second signal output port OUT2 of the signal processing device 100, so that the tactile signal S2 can be used to drive the motor 40 to provide tactile feedback to the user. It can be understood that the motor 40 can be any actuator capable of providing tactile feedback, including but not limited to a linear resonant actuator LRA (or linear motor), a center of mass rotating mass ERM, etc.

[0032] Although Figure 2Although not shown, it is understood that the signal processing device 100 may also include other devices, such as a digital-to-analog converter (DAC). In some embodiments, a digital-to-analog converter may be provided upstream of the demultiplexing unit 110 to convert the multiplexed signal S from a digital signal to an analog signal; in other embodiments, two digital-to-analog converters may be provided downstream of the demultiplexing unit 110 to convert the audio signal S1 and the tactile signal S2 from digital signals to analog signals, respectively, so that the first power amplifier 120 and the second power amplifier 130 can amplify the analog signals. In some embodiments, the signal processing device 100 may also include an audio processor, such as an audio codec (codec) or a digital signal processor (DSP), and the digital signal processor (DSP) may also include a filter to implement a filtering function. In some embodiments, the signal processing device 100 may also include, for example, a control unit, which may control the operations of other components in the signal processing device 100, including but not limited to startup and shutdown operations.

[0033] Figure 3 FIG. 1 shows a schematic circuit diagram of a demultiplexing unit 110 according to an embodiment of the present application. The demultiplexing unit 110 can be used to perform a demultiplexing operation on a time division multiplexed signal S. Figure 3 As shown, the demultiplexing unit 110 may include a first switch 111 and a second switch 112, one end of each of which may be connected to, for example, a signal input port IN to receive a time-division multiplexed signal S, the other end of the first switch 111 may be connected to a first power amplifier 120, and the other end of the second switch 112 may be connected to a second power amplifier 130. In one embodiment, the first switch 111 and the second switch 112 may be formed by switch transistors, for example, both may be formed by NMOS transistors or PMOS transistors, or one may be formed by an NMOS transistor and the other by a PMOS transistor.

[0034] The control signal Ctrl can be used to control the on and off of the first switch 111 and the second switch 112. For example, when the first switch 111 and the second switch 112 are both formed by NMOS transistors or PMOS transistors, the control signal Ctrl can be connected to the control gate of the first switch 111 and then connected to the control gate of the second switch 112 after passing through an inverter, thereby ensuring that when one of the first switch 111 and the second switch 112 is turned on, the other is turned off. In another embodiment, when the first switch 111 and the second switch 112 are formed by NMOS transistors and PMOS transistors, respectively, the control signal Ctrl can be connected to the control gates of both switches, thereby ensuring that when one of the NMOS transistor and the PMOS transistor is turned on, the other is turned off. For example, in the first time period, the control signal Ctrl can turn on the first switch 111 and turn off the second switch 112, so that the audio signal S1 in the time division multiplexing signal S can be provided to the first power amplifier 120 via the first switch 111; in the second time period, the control signal Ctrl can turn off the first switch 111 and turn on the second switch 112, so that the tactile signal S2 in the time division multiplexing signal S can be provided to the second power amplifier 130 via the second switch 112.

[0035] In one embodiment, the control signal Ctrl may be generated by, for example, a control unit based on time-division multiplexing information of the time-division multiplexing signal S. For example, when the time-division multiplexing signal S is an I2S data signal received on a data signal line (SD) of the I2S protocol, a left and right channel indication signal (also called a frame synchronization signal) received on a left and right channel clock line (LRCK) of the I2S protocol indicates the time-division multiplexing information in the I2S data signal. The control unit may generate the control signal Ctrl based on the left and right channel indication signal, or directly use the left and right channel indication signal as the control signal Ctrl to control the on and off of the first switch 111 and the second switch 112, thereby outputting the signals of each channel in the time-division multiplexing signal S through the corresponding switch.

[0036] Figure 4 FIG. 1 shows a schematic circuit diagram of a demultiplexing unit 110 according to another embodiment of the present application. The demultiplexing unit 110 can be used to demultiplex a frequency division multiplexed signal S. Figure 4 As shown, the demultiplexing unit 110 may include a first filter 113 and a second filter 114, one end of each of which can be connected to, for example, a signal input port IN to receive a frequency division multiplexing signal S, the other end of the first filter 113 can be connected to the first power amplifier 120, and the other end of the second filter 114 can be connected to the second power amplifier 130.

[0037] Each of the first filter 113 and the second filter 114 can be a high-pass filter, a low-pass filter, or a band-pass filter, which allows the signal of the corresponding frequency component to pass through the filter while filtering out the remaining frequency components. In one embodiment, the first filter 113 can be a high-pass filter, which allows the frequency component of the audio signal S1 to pass through the filter while filtering out other frequency components, thereby providing the audio signal S1 in the frequency-division multiplexed signal S to the first power amplifier 120. The second filter 114 can be a low-pass filter, which allows the frequency component of the tactile signal S2 to pass through the filter while filtering out other frequency components, thereby providing the tactile signal S2 in the frequency-division multiplexed signal S to the second power amplifier 130.

[0038] Figure 5 A schematic block diagram of a boost unit 140 according to an embodiment of the present application is shown. As shown in the figure, the boost unit 140 may include a first voltage detection circuit 141, a second voltage detection circuit 142, a control unit 143, a boost circuit 144, and a voltage divider circuit 145.

[0039] The first voltage detection circuit 141 may include, for example, a voltage sampling circuit configured to detect the voltage V1 of the audio signal S1 . Similarly, the second voltage detection circuit 142 may also include, for example, a voltage sampling circuit configured to detect the voltage V2 of the tactile signal S2 .

[0040] The control unit 143 can be connected to the first voltage detection circuit 141 and the second voltage detection circuit 142, and is configured to determine a target boost voltage based on the voltage V1 of the audio signal S1 detected by the first voltage detection circuit 141 and the voltage V2 of the tactile signal S2 detected by the second voltage detection circuit 142. For example, the control unit 143 can determine a first supply voltage required for amplifying the audio signal S1 based on the voltage V1 of the audio signal S1 and its amplification gain, and determine a second supply voltage required for amplifying the tactile signal S2 based on the voltage V2 of the tactile signal S2 and its amplification gain. Because the boost unit 140 is configured to power both the first power amplifier 120 and the second power amplifier 130, the control unit 143 can determine the target boost voltage based on the larger of the first supply voltage and the second supply voltage.

[0041] The boost circuit 144 can be connected to the control unit 143 and, under the control of the control unit 143, boost the power supply voltage VDD (e.g., the battery voltage) to a determined target boost voltage PVDD. The boost circuit 144 can include a switching-type boost circuit, such as a DC-DC boost voltage or a charge pump, which controls the output voltage of the boost circuit by comparing the output voltage with a reference voltage and, based on the comparison result, controlling the ratio between the charging cycle and the discharging cycle, i.e., the switching time ratio. The control unit 143 can control the output voltage of the boost circuit 144 by controlling the value of the reference voltage or directly controlling the switching time ratio between the charging cycle and the discharging cycle, so that it dynamically stabilizes at the target boost voltage PVDD. It is understood that the control unit 143 can be part of the control unit of the signal processing device 100, or can be a dedicated control unit included in the boost unit 140. In addition, the boost circuit 144 can also include other types of boost circuits with adjustable / controllable outputs, and this application is not particularly limited in this regard.

[0042] The voltage divider circuit 145 may include, for example, a resistor network, one end of which may be connected to the output terminal of the voltage boost circuit 144 to receive the boosted voltage PVDD, and the other end of which may be grounded. The voltage divider circuit 145 may also include two output terminals, which may be connected to appropriate positions of the resistor network via switches under the control of the control unit 143 to provide a first high voltage PVDD1 and a second high voltage PVDD2 to power the first power amplifier 120 and the second power amplifier 130, respectively. The first high voltage PVDD1 and the second high voltage PVDD2 may be equal to or different from each other, and both are lower than or equal to the output voltage PVDD of the voltage boost circuit 144.

[0043] exist Figure 5 In the illustrated embodiment, the boost unit 140 can provide an appropriate voltage to power the first power amplifier 120 and the second power amplifier 130 based on the voltages of the audio signal S1 and the tactile signal S2. This means that the boost unit 140 can provide an adjustable boost voltage to power the first power amplifier 120 and the second power amplifier 130, thereby improving energy efficiency and reducing system power consumption. In other embodiments, the boost unit 140 can also provide a constant voltage to power the first power amplifier 120 and the second power amplifier 130, regardless of the voltage levels of the audio signal S1 and the tactile signal S2. In this case, the first voltage detection circuit 141 and the second voltage detection circuit 142 can be omitted from the boost unit 140, and even the control unit 143 can be omitted. The boost circuit 144 boosts the power supply voltage VDD to a predetermined voltage PVDD and provides a first high voltage PVDD1 and a second high voltage PVDD2 via the voltage divider circuit 145 to power the first power amplifier 120 and the second power amplifier 130.

[0044] Refer to above Figure 2-5 In the described embodiment, the signal processing device 100 amplifies the audio signal S1 and the tactile signal S2 separately, and therefore includes two power amplifiers. By having the two power amplifiers share a common boost unit, the number of components can be reduced, the circuit structure can be simplified, and costs can be lowered. In other embodiments, the same power amplifier can be used to amplify both the audio signal S1 and the tactile signal S2, further reducing the number of components and costs. Figure 6 FIG. 2 shows a signal processing apparatus 200 according to such an embodiment. Figure 6 As shown, the signal processing device 200 may include a power amplifier 210 , a boost unit 220 and a demultiplexing unit 230 .

[0045] The power amplifier 210 can be connected to the signal input port IN of the signal processing device 200 to receive the multiplexed signal S and amplify the multiplexed signal S. As mentioned above, the multiplexed signal S may include a time-division multiplexed or frequency-division multiplexed audio signal S1 and a tactile signal S2. In some embodiments, the signal processing device 200 may further include a digital-to-analog converter (DAC) provided between the signal input port IN and the power amplifier 210 to convert the received digital multiplexed signal S into an analog signal, so that the power amplifier 210 can amplify the analog signal. The power amplifier 210 can be a class A amplifier, a class B amplifier, a class AB amplifier, a class D amplifier, etc., and this application does not impose any special restrictions on this.

[0046] The boost unit 220 can convert the power supply voltage VDD into a high voltage PVDD and provide the high voltage PVDD to power the power amplifier 210. Figure 5 The circuit principle is similar to that shown in FIG. 2 , and the boost unit 220 can control the magnitude of the boost voltage PVDD based on the voltage of the multiplex signal S; however, Figure 5 The circuit shown is different in that the boost unit 220 may include only one voltage detection circuit to detect the voltage of the multiplexed signal S. In addition, the voltage divider circuit may be omitted, and the high voltage PVDD output by the boost circuit may be directly provided to the power amplifier 210 .

[0047] The demultiplexing unit 230 can be connected to the output end of the power amplifier 210 to demultiplex the amplified multiplexed signal S and separate the audio signal S1 and the tactile signal S2. When the multiplexed signal S includes the time-division multiplexed audio signal S1 and the tactile signal S2, the demultiplexing unit 230 may include Figure 3 When the multiplexed signal S includes a frequency-division multiplexed audio signal S1 and a tactile signal S2, the demultiplexing unit 230 may include Figure 4The circuit structure shown in FIG. 2 is not described again here. One output terminal of the demultiplexing unit 230 can be connected to the first signal output interface OUT1 to provide an audio signal S1, which can be further connected to the speaker 20, and the other output terminal can be connected to the second signal output interface OUT2 to provide a tactile signal S2, which can be further connected to the motor 40. Figure 6 and Figure 2 Although not shown, a filter circuit may be further provided between the first signal output interface OUT1 and the speaker 20 and between the second signal output interface OUT2 and the motor 40 .

[0048] In some embodiments of the present application, each of the signal processing devices 100 and 200 described above can be implemented as a single chip, which can be mounted on a printed circuit board (PCB) in an electronic device, for example. The chip receives a multiplexed signal S from other circuits on the PCB and outputs an audio signal S1 and a haptic signal S2 for driving the speaker 20 and motor 40, respectively. When the multiplexed signal S is a single-ended signal, the signal input port IN of the signal processing devices 100 and 200 can be implemented as a single input pin of the chip to receive the single-ended signal; when the multiplexed signal S is a differential signal, the signal input port IN can be implemented as a pair of input pins of the chip to receive the differential signal. The first signal output port OUT1 can be implemented as a pair of output pins of the chip for connecting to the speaker 20 and providing the amplified audio signal S1 to drive the speaker 20. The second signal output port OUT2 can be implemented as another pair of output pins of the chip for connecting to the motor 40 and providing the amplified haptic signal S2 to drive the motor 40. Since only a single chip can be used to drive both the speaker 20 and the motor 40, the present application reduces the number of components integrated on the circuit board, saves circuit board area, is conducive to the miniaturization of electronic equipment and reduces costs.

[0049] Figure 7 This is a schematic block diagram of an electronic device 300 according to an embodiment of the present application. The electronic device 300 may be any terminal device with a voice playback function and a tactile (such as vibration) output function, such as but not limited to a smart phone, a tablet computer, a wearable device, etc. Figure 7As shown, the electronic device 300 may include a processor 310 and a memory 320. The memory 320 may store computer-readable instructions. The processor 310 may read and execute the computer-readable instructions from the memory 320 to perform various functions, such as but not limited to playing audio and video, displaying a graphical user interface, communicating with other devices via a network, etc. The electronic device 300 also includes a driver chip 330, which may be connected to the processor 310, the speaker 340, and the motor 350. The driver chip 330 may be configured to drive the speaker 340 to play audio and drive the motor 350 to provide tactile feedback under the control of the processor 310. The driver chip 330 may include the above-referenced Figure 2-6 The signal processing device 100 or 200 according to any embodiment described above can receive the multiplexed signal S from the processor 310 or other devices under the control of the processor 310 (such as but not limited to the memory 320), and provide the audio signal S1 and the tactile signal S2 to drive the speaker 340 and the motor 350 respectively. The signal processing devices 100 and 200 and their operations have been described in detail above and will not be repeated here. It should be understood that the electronic device 300 may also include many other Figure 7 Components not shown, such as but not limited to a display screen, a battery, a microphone, input buttons, a wireless communication module, etc., are used to implement various corresponding functions.

[0050] Unless the context clearly requires otherwise, throughout the specification and claims, the words "comprise", "comprising", "including", "comprising" and the like are to be interpreted in an inclusive sense, rather than an exclusive or exhaustive sense. That is, the meaning is "including but not limited to". As generally used herein, the word "connected" refers to two or more elements that can be directly connected or connected through one or more intermediate elements. As generally used herein, the word "connected" refers to two or more elements that can be directly connected or connected through one or more intermediate elements. In addition, when used in this application, the words "herein", "above", "below" and words of similar meaning shall refer to the entirety of this application and not to any particular part of this application. Where the context permits, the word "or" refers to a list of two or more items, which word covers all of the following interpretations of the word: any item in the list, all items in the list, and any combination of items in the list.

[0051] Furthermore, unless specifically stated otherwise or understood otherwise in the context of use, conditional language used herein, such as "can," "may," "might," "could," "for example," "for example," "such as," and the like, is generally intended to convey that some embodiments include, while other embodiments do not, certain features, elements, and / or states. Thus, such conditional language is generally not intended to imply that one or more embodiments in any way require features, elements, and / or states, or that one or more embodiments must include logic for determining, with or without author input or prompting, that such features, elements, and / or states are included or to be performed in any particular embodiment.

[0052] Although certain embodiments have been described, these embodiments are presented by way of example only and are not intended to limit the scope of the present disclosure. In fact, the novel facilities, methods, and systems described herein can be embodied in a variety of other forms; in addition, various omissions, substitutions, and changes in the form of the methods and systems described herein may be made without departing from the spirit of the present disclosure. For example, although blocks are presented in a given arrangement, alternative embodiments may perform similar functions with different components and / or circuit topologies, and some blocks may be deleted, moved, added, subdivided, combined, and / or modified. Each of these blocks can be implemented in a variety of different ways. Any suitable combination of the elements and actions of the various embodiments described above may be combined to provide further embodiments. The accompanying claims and their equivalents are intended to cover these forms or modifications that fall within the scope and spirit of the present disclosure.

[0053] The above description has been provided for the purpose of illustration and description. Furthermore, this description is not intended to limit the embodiments of the present application to the forms disclosed herein. Although a number of example aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, alterations, additions, and sub-combinations thereof.

Claims

1. A signal processing device, characterized in that: include: a signal input port, configured to receive a multiplexed signal, the multiplexed signal including an audio signal and a tactile signal; a demultiplexing unit, connected to the signal input port, for separating the audio signal and the tactile signal from the multiplexed signal; a first power amplifier, connected to the demultiplexing unit, for amplifying the audio signal; a second power amplifier, connected to the demultiplexing unit, for amplifying the tactile signal; a first signal output port, connected to the first power amplifier, for outputting the amplified audio signal; as well as The second signal output port is connected to the second power amplifier and is used to output the amplified tactile signal.

2. The signal processing device according to claim 1, wherein In the multiplexed signal, the audio signal and the haptic signal are time-division multiplexed or frequency-division multiplexed.

3. The signal processing device according to claim 2, wherein When the multiplexed signal includes the audio signal and the tactile signal that are time-division multiplexed, the demultiplexing unit includes: a first switch, one end of which is connected to the signal input port to receive the multiplexed signal, and the other end of which is connected to the first power amplifier; and a second switch, one end of which is connected to the signal input port to receive the multiplexed signal, and the other end of which is connected to the second power amplifier; In the first time period, the first switch is turned on and the second switch is turned off, so that the audio signal in the multiplexed signal is provided to the first power amplifier via the first switch. In a second time period different from the first time period, the first switch is turned off and the second switch is turned on, so that the haptic signal in the multiplexed signal is provided to the second power amplifier via the second switch.

4. The signal processing device according to claim 2, wherein When the multiplexed signal includes the audio signal and the tactile signal that are frequency-division multiplexed, the demultiplexing unit includes: a first filter, an input end of which is connected to the signal input port to receive the multiplexed signal, and an output end of which is connected to the first power amplifier, the first filter being configured to allow the frequency component of the audio signal in the multiplexed signal to pass through the first filter to be provided to the first power amplifier; and A second filter has an input end connected to the signal input port to receive the multiplexed signal, and an output end connected to the second power amplifier. The second filter is configured to allow the frequency component of the tactile signal in the multiplexed signal to pass through the second filter to be provided to the second power amplifier.

5. The signal processing device according to claim 1, wherein The first power amplifier and the second power amplifier are powered by a boost unit, and the boost unit includes: a first voltage detection circuit, configured to detect the voltage of the audio signal; a second voltage detection circuit, configured to detect the voltage of the tactile signal; a control unit connected to the first voltage detection circuit and the second voltage detection circuit, configured to determine a target boost voltage based on a voltage of the audio signal and a voltage of the haptic signal; a boost circuit connected to the control unit and configured to boost the power supply voltage to the target boost voltage under the control of the control unit; and A voltage divider circuit is connected to the boost circuit to receive the target boost voltage, and is connected to the control unit to provide a first boost voltage at a first output port and a second boost voltage at a second output port under the control of the control unit, the first output port is connected to the first power amplifier to power the first power amplifier using the first boost voltage, and the second output port is connected to the second power amplifier to power the second power amplifier using the second boost voltage.

6. The signal processing device according to claim 1, wherein The signal processing device is implemented as a chip, When the multiplexed signal is a single-ended signal, the signal input port is implemented as a single input pin of the chip to receive the single-ended signal; when the multiplexed signal is a differential signal, the signal input port is implemented as a pair of input pins of the chip to receive the differential signal. The first signal output port is implemented as a first pair of output pins of the chip for connecting to a speaker, and the first pair of output pins drives the speaker using the amplified audio signal. The second signal output port is implemented as a second pair of output pins of the chip for connecting to a motor, and the second pair of output pins drives the motor using the amplified haptic signal.

7. A signal processing device, characterized in that: include: a signal input port, configured to receive a multiplexed signal, the multiplexed signal including an audio signal and a tactile signal; a power amplifier connected to the signal input port, for amplifying the multiplexed signal; a demultiplexing unit, connected to the power amplifier, and configured to separate the audio signal and the tactile signal from the amplified multiplexed signal; a first signal output port, connected to the demultiplexing unit, for outputting the audio signal; as well as The second signal output port is connected to the demultiplexing unit and is used to output the tactile signal.

8. The signal processing device according to claim 7, wherein In the multiplexed signal, the audio signal and the tactile signal are time-division multiplexed or frequency-division multiplexed, When the multiplexed signal includes the audio signal and the tactile signal that are time-division multiplexed, the demultiplexing unit includes: a first switch, one end of which is connected to the power amplifier to receive the amplified multiplexed signal, and the other end of which is connected to the first signal output port; and A second switch, one end of which is connected to the power amplifier to receive the amplified multiplexed signal, and the other end of which is connected to the second signal output port. In a first time period, the first switch is turned on and the second switch is turned off, so that the audio signal in the multiplexed signal is provided to the first signal output port via the first switch; in a second time period different from the first time period, the first switch is turned off and the second switch is turned on, so that the tactile signal in the multiplexed signal is provided to the second signal output port via the second switch. When the multiplexed signal includes the audio signal and the tactile signal that are frequency-division multiplexed, the demultiplexing unit includes: a first filter, an input end of which is connected to the power amplifier to receive the amplified multiplexed signal, and an output end of which is connected to the first signal output port, the first filter being configured to allow the frequency component of the audio signal in the multiplexed signal to pass through the first filter and be provided to the first signal output port; and A second filter, whose input end is connected to the power amplifier to receive the multiplexed signal after amplification, and whose output end is connected to the second signal output port, is configured to allow the frequency component of the tactile signal in the multiplexed signal to pass through the second filter to be provided to the second signal output port.

9. The signal processing device according to claim 7, wherein: The signal processing device is implemented as a chip, When the multiplexed signal is a single-ended signal, the signal input port is implemented as a single input pin of the chip to receive the single-ended signal; when the multiplexed signal is a differential signal, the signal input port is implemented as a pair of input pins of the chip to receive the differential signal. The first signal output port is implemented as a first pair of output pins of the chip for connecting to a speaker, and the first pair of output pins drives the speaker using the amplified audio signal. The second signal output port is implemented as a second pair of output pins of the chip for connecting to a motor, and the second pair of output pins drives the motor using the amplified haptic signal.

10. An electronic device, characterized in that: The electronic device includes the signal processing device according to any one of claims 1 to 9.

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