Automatic packaging device for semiconductor carrier tape reel

Abstract

According to the automatic packaging device for the semiconductor carrier tape disc, the material tape conveying assembly conveys packaging materials to the side face of the carrier tape disc, the tape head clamping jaw clamps the packaging materials, the rotating disc assembly drives the tape head clamping jaw to rotate around the carrier tape disc in the circumferential direction, and the tape head pressing wheel assembly presses a tape head to make the tape head tightly attached to the carrier tape disc; the packaging material is pulled back by a certain distance through reverse transmission of the material belt conveying assembly, the belt tail pressing wheel assembly stretches out, the packaging material is tightly attached to the circumference of the carrier tape disc, the material belt conveying assembly cuts off the packaging material, the pressing plate assembly is pressed downwards and tightly attached to the packaging material belt head portion of the carrier tape disc, and at the moment, the belt head pressing wheel assembly is reset. The upper rotating disc assembly and the lower rotating disc assembly synchronously rotate to collect the tail of the remaining packaging material into the tape carrying disc, the pressing plate assembly is reset, the lower rotating disc assembly is kept immovable, the upper rotating disc assembly rotates to the pressing plate assembly to be located above the tail of the packaging material, the pressing plate assembly extends out to press the tail of the packaging material, and the tape tail pressing wheel assembly is reset; therefore, automation of wrapping the carrier tape disc with the packaging material can be effectively achieved.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor carrier tape packaging, and in particular relates to an automatic packaging device for semiconductor carrier tapes. Background Art

[0002] Semiconductor tape and reel packaging is an important method for semiconductor component packaging. It primarily consists of a carrier tape and a reel. The carrier tape is primarily used to package electronic components such as semiconductor chips, providing protection and ease of handling during transportation, storage, and production. It can also organize individual electronic components in an orderly manner, facilitating subsequent automated placement and other processes. The reel is a disc-shaped container for winding the carrier tape, facilitating storage, transportation, and subsequent production and processing. Furthermore, adhesive tape can be used to secure or seal items within the reel.

[0003] When packaging semiconductor carrier reels, one or more wraps of foam or tape are wrapped around their outer edges to protect the products inside from bumps and contamination during transport. The tail of the foam or tape is secured to the reel using tape. However, conventional semiconductor carrier reels are typically packaged manually, which is inefficient, labor-intensive, and results in significant variations in packaging quality. Furthermore, due to the self-adhesive nature of the tape, manual operation is not convenient when wearing gloves, and sweat and dirt significantly impact the reliability of the tape application, making manual packaging unsuitable for subsequent processes.

[0004] Therefore, for semiconductor carrier tray packaging operations, automating this process is of great significance to achieving carrier tray packaging automation. Utility Model Content

[0005] The purpose of the utility model is to provide an automatic packaging device for semiconductor carrier trays, which can effectively realize the automation of packaging materials covering the carrier trays.

[0006] In order to solve the above technical problems, the present invention provides an automated packaging device for semiconductor carrier reels, which is used to pack packaging materials on the side of the carrier reels, comprising:

[0007] The lower turntable assembly is used to drive the carrier reel to rotate;

[0008] A material conveying assembly for conveying packaging materials and capable of cutting them at preset lengths;

[0009] An upper turntable assembly and a tape head clamp, wherein the movable end of the upper turntable assembly is connected to the tape head clamp and is used to drive the tape head clamp to rotate circumferentially along the side wall of the tape carrier disk, and the tape head clamp is used to clamp the packaging material from the material belt conveyor assembly;

[0010] The head pressing wheel assembly is used to press the packaging material wrapped on the carrier reel.

[0011] Optionally, the above-mentioned automated packaging device for semiconductor carrier tapes further includes a tape head sensor for detecting whether the packaging material from the tape conveying assembly is in place.

[0012] Optionally, in the above-mentioned automated packaging device for semiconductor carrier trays, the lower turntable assembly is further used to drive the carrier tray to rise and fall.

[0013] Optionally, in the above-mentioned automated packaging device for the semiconductor carrier tray, the lower turntable assembly includes a lower turntable lifting module, a first mounting platform, a second mounting platform and a lower turntable rotation module. The fixed end of the lower turntable lifting module is fixed by the first mounting platform, the movable end of the lower turntable lifting module is connected to the second mounting platform, the fixed end of the lower turntable rotation module is connected to the second mounting platform, and the movable end of the lower turntable rotation module can be engaged with the center hole of the carrier tray.

[0014] Optionally, in the above-mentioned automated packaging device for semiconductor carrier tapes, the material tape conveying assembly includes a third mounting platform and a plurality of guide wheel groups, a transmission mechanism and a cutting mechanism arranged on the third mounting platform. The movable end of the transmission mechanism is used to drive a pair of guide wheels of the guide wheel group to rotate toward each other so that the packaging material can pass smoothly between the guide wheel groups, and the cutting mechanism is used to cut off the packaging material.

[0015] Optionally, in the above-mentioned automated packaging device for the semiconductor carrier tape, the upper turntable assembly includes a fourth mounting platform, an upper turntable rotation module and a clamp lifting module, the fixed end of the upper turntable rotation module is fixedly connected through the fourth mounting platform, the fixed end of the clamp lifting module is connected to the movable end of the upper turntable rotation module, and the movable end of the clamp lifting module is connected to the head clamp.

[0016] Optionally, in the above-mentioned automated packaging device for the semiconductor carrier tray, the head pressure wheel assembly includes a first linear module and a roller, the movable end of the first linear module is rotatably connected to the roller, and the roller is used to press the packaging material against the side wall of the carrier tray.

[0017] Optionally, the above-mentioned automated packaging device for semiconductor carrier tapes further includes a tail pressure wheel assembly for compacting the tape attached to the tail of the packaging material of the carrier tape, the tail pressure wheel assembly includes a movable plate assembly, a movable plate linear module, a tape roller fixing plate, a tape roller, an auxiliary wheel arm linear module, an auxiliary wheel arm seat plate, an auxiliary wheel arm and a tape auxiliary wheel, the movable end of the movable plate linear module is connected to the movable plate assembly, one end of the tape roller fixing plate is rotatably connected to the tape roller, and the other end is connected to the movable plate assembly, the movable plate linear module The group is used to drive the movable plate assembly and, together with the tape roller fixing plate and the tape roller, move closer to or away from the tape carrier disk. The fixed end of the auxiliary wheel arm linear module is connected to the movable plate assembly, and the movable end is connected to the auxiliary wheel arm seat plate. One end of the auxiliary wheel arm is hinged to the auxiliary wheel arm seat plate, and the other end is rotatably connected to the tape auxiliary wheel. The driving direction of the auxiliary wheel arm linear module is consistent with that of the movable plate linear module. The auxiliary wheel arm is located on one side of the tape roller fixing plate and is connected to the auxiliary wheel arm seat plate through an elastic reset mechanism.

[0018] Optionally, in the above-mentioned automated packaging device for the semiconductor carrier disk, the movable plate assembly includes a first movable plate, a second movable plate and a movable plate compression spring, the movable end of the movable plate linear module is connected to the first movable plate, the first movable plate and the second movable plate are connected through the movable plate compression spring, and the fixed end of the auxiliary wheel arm linear module is arranged on the second movable plate.

[0019] Optionally, in the above-mentioned automated packaging device for semiconductor carrier tapes, a pressing plate assembly is further included for pressing the tape head of the packaging material onto the carrier tape;

[0020] And / or, it also includes a workbench, the upper turntable assembly and the head pressure wheel assembly are installed above the workbench, and the lower turntable assembly is installed below the workbench.

[0021] The utility model provides an automatic packaging device for semiconductor carrier tapes, which has the following beneficial effects:

[0022] The tape conveyor assembly is used to convey the packaging material to the side of the carrier disk. After the head clamp grips the packaging material from the tape conveyor assembly, the turntable assembly drives the head clamp to rotate circumferentially around the side wall of the carrier disk. The head pressure wheel assembly presses the head of the packaging material to make it close to the carrier disk. At this time, the tape conveyor assembly can be used to reverse the transmission to pull back the packaging material a certain distance, so that the packaging material is tightened on the side wall of the carrier disk, thereby effectively realizing the automation of packaging material covering the carrier disk. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are merely embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying any creative work.

[0024] Figure 1 A schematic structural diagram of an automated packaging device for semiconductor carrier tapes and reels provided in an embodiment of the present invention;

[0025] Figure 2 A schematic structural diagram of the lower turntable assembly provided in an embodiment of the present utility model;

[0026] Figure 3 A schematic structural diagram of a material belt conveyor assembly provided in an embodiment of the present utility model;

[0027] Figure 4 A schematic diagram of the structure of the upper turntable assembly provided in an embodiment of the utility model

[0028] Figure 5 This is a structural schematic diagram of the tail pressure wheel assembly provided in an embodiment of the utility model.

[0029] In the above picture:

[0030] A-carrier reel; B-packaging material;

[0031] 100 - lower turntable assembly; 110 - lower turntable lifting module; 120 - first mounting platform; 130 - second mounting platform; 140 - lower turntable rotation module;

[0032] 200- material belt conveying assembly; 210- third installation platform; 220- guide wheel assembly; 230- transmission mechanism; 240- cutting mechanism;

[0033] 300-upper turntable assembly; 310-head clamping claw; 320-fourth mounting platform; 330-upper turntable rotation module; 340-clamping claw lifting module;

[0034] 400-with head sensor;

[0035] 500-head pressure wheel assembly;

[0036] 600-tail pressure wheel assembly; 610-second movable plate; 620-auxiliary wheel arm linear module; 630-auxiliary wheel arm seat plate; 640-auxiliary wheel arm; 650-adhesive tape auxiliary wheel; 660-adhesive tape roller fixing plate; 670-adhesive tape roller; 680-elastic reset mechanism; 690-movable plate linear module; 6100-movable plate compression spring; 6110-first movable plate;

[0037] 700-pressure plate assembly;

[0038] 800-Workbench. DETAILED DESCRIPTION

[0039] The following describes embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present invention and are not to be construed as limiting the present invention.

[0040] The core of the utility model is to provide an automatic packaging device for semiconductor carrier tapes, which can effectively realize the automation of packaging materials covering the carrier tapes.

[0041] In order to enable those skilled in the art to better understand the technical solution provided by the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0042] Specifically, please refer to Figure 1-Figure 5 The utility model provides an automated packaging device for a semiconductor carrier tape, which is used to package packaging materials B, including but not limited to edge tape or foam, on the side of the carrier tape A. The automated packaging device mainly includes a lower turntable assembly 100, a material tape conveying assembly 200, an upper turntable assembly 300, a head clamp 310 and a head pressure wheel assembly 500.

[0043] The lower turntable assembly 100 is used to drive the carrier plate A to rotate. Specifically, the movable end of the lower turntable assembly 100 can be detachably connected to the center of the carrier plate A.

[0044] The material belt conveying assembly 200 is used to convey the packaging material B and can cut it at a preset length.

[0045] The movable end of the upper turntable assembly 300 is connected to the tape head clamp 310 and is used to drive the tape head clamp 310 to rotate circumferentially along the side wall of the tape carrier disk A. The tape head clamp 310 is used to clamp the packaging material B from the tape conveying assembly 200.

[0046] The tape head of the packaging material B wound on the carrier reel A can be pressed against the side wall of the carrier reel A by the tape head pressing wheel assembly 500 .

[0047] The automated packaging device for semiconductor carrier tapes provided by this solution utilizes the tape conveyor assembly 200 to convey the packaging material B to the side of the carrier tape A. After the tape head clamp 310 clamps the packaging material B from the tape conveyor assembly 200, the turntable assembly 300 drives the tape head clamp 310 to rotate circumferentially around the side wall of the carrier tape A. The tape head pressure wheel assembly 500 presses the tape head of the packaging material B to make it close to the carrier tape A. At this time, the tape conveyor assembly 200 can be used to reverse the transmission to pull back the packaging material B a certain distance, so that the packaging material B is tightened on the side wall of the carrier tape A, thereby effectively realizing the automation of the packaging material covering the carrier tape.

[0048] This solution also includes a tape head sensor 400 for detecting the presence of packaging material B from the tape conveyor assembly 200. The tape head sensor 400 is connected to the automated packaging system's master controller, which controls the movement of the upper turntable assembly 300, the tape head sensor 400, and other components. When the tape head sensor 400 detects that packaging material B has been delivered to its proper position, specifically below the tape head clamp 310, the tape head clamp 310 grips the packaging material B, and the upper turntable assembly 300 rotates the tape head clamp 310 and the packaging material B around the sidewall of the carrier reel A one revolution or a desired number of revolutions.

[0049] like Figure 1 The lower turntable assembly 100 is also used to drive the carrier plate A to rise and fall. Specifically, the lower turntable assembly 100 includes a lower turntable lifting module 110, a first mounting platform 120, a second mounting platform 130, and a lower turntable rotating module 140. The fixed end of the lower turntable lifting module 110 is fixed by the first mounting platform 120, the movable end of the lower turntable lifting module 110 is connected to the second mounting platform 130, and the fixed end of the lower turntable rotating module 140 is connected to the second mounting platform 130. The movable end of the lower turntable rotating module 140 can be engaged with the center hole of the carrier plate A. Furthermore, a movable pin can be provided on the movable end of the lower turntable rotating module 140. When the carrier plate A needs to be driven to rotate, the lower turntable lifting module 110 drives the rotating module upward, so that the movable pin of the lower turntable rotating module 140 can be engaged with the positioning groove on the central hole wall of the carrier plate A. When the carrier plate A does not need to be driven, the lower turntable lifting module 110 drives the lower turntable rotating module 140 downward, so that the movable pin of the lower turntable rotating module 140 can be disengaged from the positioning groove on the central hole wall of the carrier plate A. Of course, the movable end of the lower turntable rotating module 140 and the central hole of the carrier plate A can also be designed to have matching special-shaped structures, so that the circumferential movement of the two can be restricted, while allowing relative axial movement.

[0050] In a specific embodiment, the material belt conveyor assembly 200 includes a third mounting platform 210 and a plurality of guide wheel groups 220, a transmission mechanism 230 and a cutting mechanism 240 arranged on the third mounting platform 210. The plurality of guide wheel groups 220 can be rotatably mounted on the third mounting platform 210. The fixed end of the transmission mechanism 230 is mounted on the third mounting platform 210. The movable end of the transmission mechanism 230 is used to drive a pair of guide wheels of the guide wheel group 220 to rotate toward each other so that the packaging material B can pass smoothly between the guide wheel groups 220. The cutting mechanism 240 is used to cut off the packaging material B.

[0051] In a specific embodiment, the upper turntable assembly 300 includes a fourth mounting platform 320, an upper turntable rotating module 330 and a clamping claw lifting module 340. The fixed end of the upper turntable rotating module 330 is fixedly connected through the fourth mounting platform 320, and the movable end of the upper turntable rotating module 330 can press the side of the carrier disk and drive the clamping claw lifting module 340 to rotate. The fixed end of the clamping claw lifting module 340 is connected to the movable end of the upper turntable rotating module 330, and the movable end of the clamping claw 310 is connected to the head clamp 310.

[0052] The raising and lowering of the lead jaw 310 is achieved through the jaw lifting module 340. When the lead jaw 310 needs to clamp the packaging material B, the main controller controls the jaw lifting module 340 to drive the lead jaw 310 to descend, and the lead jaw 310 closes to clamp the packaging material B; when the packaging material B is completed wrapped, the lead jaw 310 opens to release the packaging material B, and the main controller controls the jaw lifting module 340 to drive the lead jaw 310 to rise.

[0053] In a specific embodiment, the head pressure roller assembly 500 includes a first linear module and a roller. The movable end of the first linear module is rotatably connected to the roller. The roller is used to press the packaging material B against the side wall of the carrier disk A.

[0054] In a specific embodiment, the present solution also includes a tail pressure roller assembly 600 for compacting the tape attached to the tail of the packaging material B on the tape carrier reel A. The tail pressure roller assembly 600 includes a movable plate assembly, a movable plate linear module 690, a tape roller fixing plate 660, a tape roller 670, an auxiliary wheel arm linear module 620, an auxiliary wheel arm seat plate 630, an auxiliary wheel arm 640 and a tape auxiliary wheel 650. The movable end of the movable plate linear module 690 is connected to the movable plate assembly, one end of the tape roller fixing plate 660 is rotatably connected to the tape roller 670, and the other end is connected to the movable plate assembly. The movable plate linear module 6 90 is used to drive the movable plate assembly and together with the tape roller fixing plate 660 and the tape roller 670, move closer to or away from the carrier disk A. The fixed end of the auxiliary wheel arm linear module 620 is connected to the movable plate assembly, and the movable end is connected to the auxiliary wheel arm seat plate 630. One end of the auxiliary wheel arm 640 is hinged to the auxiliary wheel arm seat plate 630, and the other end is rotatably connected to the tape auxiliary wheel 650. The driving direction of the auxiliary wheel arm linear module 620 is consistent with that of the movable plate linear module 690. The auxiliary wheel arm 640 is located on one side of the tape roller fixing plate 660 and is connected to the auxiliary wheel arm seat plate 630 through an elastic reset mechanism 680.

[0055] The moving plate linear module 690 drives the moving plate assembly, driving the tape roller fixing plate 660 and tape roller 670 toward the side wall of carrier reel A, causing the tape roller 670 to apply the tape to the side tape or foam on the side wall of carrier reel A. Simultaneously, the auxiliary wheel arm linear module 620 drives the auxiliary wheel arm base plate 630, driving the auxiliary wheel arm 640 and the tape auxiliary wheel 650 toward carrier reel A. The elastic return mechanism 680 causes the tape auxiliary wheel 650 to press the end of the tape against the side wall of carrier reel A, thereby automatically applying the tape to the semiconductor carrier reel. This effectively avoids manual errors, standardizes the packaging process, and saves production costs without damaging carrier reel A.

[0056] The above arrangement allows the tape roller 670 and the tape auxiliary wheel 650 to be extended from the tail pressure wheel assembly 600 so that the packaging material B is closely attached to the circumference of the tape carrier reel A. Of course, the packaging material B can also be cut off by the tape conveying assembly 200.

[0057] Furthermore, the movable plate assembly includes a first movable plate 6110, a second movable plate 610, and a movable plate compression spring 6100. The movable end of the movable plate linear module is connected to the first movable plate 6110, and the first movable plate 6110 and the second movable plate 610 are connected via the movable plate compression spring 6100. The fixed end of the auxiliary wheel arm linear module 620 is disposed on the second movable plate 610. The movable plate compression spring 6100 provides elastic movement space for the entire movable plate assembly, preventing hard contact between the tape roller 670 and the carrier reel A.

[0058] This solution also includes a pressure plate assembly 700 for pressing the leading edge of packaging material B against carrier reel A. This assembly includes a pressure plate and a pressure plate lifting mechanism, with the movable end of the pressure plate lifting mechanism connected to the pressure plate. The pressure plate of pressure plate assembly 700 presses down against the leading edge of packaging material B on the circumference of carrier reel A, allowing packaging material B to be wound around carrier reel A.

[0059] In addition, this solution also includes a workbench 800 , the upper turntable assembly 300 and the head pressure wheel assembly 500 are installed above the workbench 800 , and the lower turntable assembly 100 is installed below the workbench 800 .

[0060] In order to avoid manual errors and standardize the packaging process, this solution saves the company's production costs without damaging the carrier tray A. Automating the packaging of the carrier tray with packaging materials is the first step in automating the carrier tray packaging process.

[0061] The operation of the automated packaging device for semiconductor carrier tapes is as follows:

[0062] After the tape carrier A arrives at the station, the material belt conveyor assembly 200 conveys the packaging material B to the bottom of the tape head clamp 310, the tape head sensor 400 detects the tape head of the packaging material B, the tape head clamp 310 clamps the tape head of the packaging material B and rotates one circle or the required number of circles under the drive of the upper turntable assembly 300, the tape head pressure wheel assembly 500 presses the tape head tightly against the tape carrier A, the tape head clamp 310 releases the tape head and resets the tape head, the material belt conveyor assembly 200 pulls back the packaging material B for a certain distance, and then the tail pressure wheel assembly 600 extends to make the packaging material B tightly against the circumference of the tape carrier A, the material belt conveyor assembly 200 cuts off the packaging material B, and the pressure plate assembly 70 0 rotates to the top of the head of the packaging material B, and the pressure plate assembly 700 presses down the head of the packaging material tightly against the circumference of the carrier disk A. At this time, the head pressure wheel assembly 500 is reset, and then the upper turntable assembly 300 and the lower turntable assembly 100 rotate synchronously to put the remaining tail of the packaging material B into the carrier disk A. Then the pressure plate assembly 700 is reset, and the lower turntable assembly 100 is kept stationary. The upper turntable assembly 300 rotates until the pressure plate assembly 700 is located above the tail of the packaging material B, and the pressure plate assembly 700 extends out to press the tail of the packaging material B. The tail pressure wheel assembly 600 is reset, and the packaging material B is wrapped on the circumference of the carrier disk A.

[0063] In the description of this application, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on this application.

[0064] In the description of this application, the meaning of "plurality" is more than two. If there is a description of "first" or "second", it is only for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0065] As used in this application and the claims, unless the context clearly indicates an exception, the terms "a," "an," "an," and / or "the" are not intended to refer to the singular and may include the plural, unless the context clearly indicates otherwise. Generally speaking, the terms "comprises" and "include" only indicate the inclusion of the steps and elements specifically identified, and these steps and elements do not constitute an exclusive list. A method or apparatus may also include other steps or elements. The phrase "comprises a..." does not preclude the presence of additional identical elements in the process, method, product, or apparatus that includes the elements.

[0066] In the description of the embodiments of this application, unless otherwise specified, " / " represents or. For example, A / B can represent A or B. "And / or" in this article is simply a description of the association relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, in the description of the embodiments of this application, "plurality" means two or more than two.

[0067] In the description of this application, unless otherwise clearly defined, terms such as setting, installing, and connecting should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in this application based on the specific content of the technical solution.

[0068] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0069] This document uses specific examples to illustrate the principles and implementation methods of the present invention. The above examples are only intended to help understand the method and core concept of the present invention. It should be noted that those skilled in the art can make various improvements and modifications to the present invention without departing from the principles of the present invention, and such improvements and modifications also fall within the scope of protection of the claims of the present invention.

Claims

1. An automated packaging device for semiconductor carrier tapes, characterized in that: Used to pack packaging material (B) on the side of the carrier reel (A), including: A lower turntable assembly (100) for driving the tape carrier disk (A) to rotate; A material belt conveying assembly (200) for conveying packaging material (B) and capable of cutting it at a preset length; An upper turntable assembly (300) and a head clamp (310), wherein a movable end of the upper turntable assembly (300) is connected to the head clamp (310) and is used to drive the head clamp (310) to rotate circumferentially along the side wall of the tape carrier disk (A), and the head clamp (310) is used to clamp the packaging material (B) from the tape conveying assembly (200); The head pressing wheel assembly (500) is used to press the packaging material (B) wound on the tape carrier reel (A).

2. The automated packaging device for semiconductor carrier tapes according to claim 1, wherein: It also includes a belt head sensor (400) for detecting whether the packaging material (B) from the material belt conveying component (200) is in place.

3. The automated packaging device for semiconductor carrier tapes according to claim 1, wherein: The lower turntable assembly (100) is also used to drive the tape carrier disk (A) to rise and fall.

4. The automated packaging device for semiconductor carrier tapes according to claim 3, wherein: The lower turntable assembly (100) includes a lower turntable lifting module (110), a first mounting platform (120), a second mounting platform (130) and a lower turntable rotating module (140), wherein the fixed end of the lower turntable lifting module (110) is fixed by the first mounting platform (120), the movable end of the lower turntable lifting module (110) is connected to the second mounting platform (130), the fixed end of the lower turntable rotating module (140) is connected to the second mounting platform (130), and the movable end of the lower turntable rotating module (140) can be engaged with the center hole of the carrier disk (A).

5. The automated packaging device for semiconductor carrier tapes according to claim 1, wherein: The material belt conveyor assembly (200) includes a third mounting platform (210) and a plurality of guide wheel groups (220), a transmission mechanism (230) and a cutting mechanism (240) arranged on the third mounting platform (210). The movable end of the transmission mechanism (230) is used to drive a pair of guide wheels of the guide wheel group (220) to rotate toward each other so that the packaging material (B) can pass smoothly between the guide wheel groups (220). The cutting mechanism (240) is used to cut off the packaging material (B).

6. The automated packaging device for semiconductor carrier tapes according to claim 1, wherein: The upper turntable assembly (300) includes a fourth mounting platform (320), an upper turntable rotating module (330) and a clamping claw lifting module (340), wherein the fixed end of the upper turntable rotating module (330) is fixedly connected via the fourth mounting platform (320), the fixed end of the clamping claw lifting module (340) is connected to the movable end of the upper turntable rotating module (330), and the movable end of the clamping claw lifting module (340) is connected to the head clamping claw (310).

7. The automated packaging device for semiconductor carrier tapes according to claim 1, wherein: The head pressing wheel assembly (500) comprises a first linear module and a roller, wherein the movable end of the first linear module is rotatably connected to the roller, and the roller is used to press the packaging material (B) against the side wall of the tape carrier (A).

8. The automated packaging device for semiconductor carrier tapes according to claim 1, wherein: The invention also includes a tail pressure wheel assembly (600) for compacting the tape attached to the tail of the packaging material (B) on the tape carrier (A), wherein the tail pressure wheel assembly (600) includes a movable plate assembly, a movable plate linear module (690), a tape roller fixing plate (660), a tape roller (670), an auxiliary wheel arm linear module (620), an auxiliary wheel arm seat plate (630), an auxiliary wheel arm (640), and a tape auxiliary wheel (650), wherein the movable end of the movable plate linear module (690) is connected to the movable plate assembly, one end of the tape roller fixing plate (660) is rotatably connected to the tape roller (670), and the other end is connected to the movable plate assembly, and the movable plate linear module (690) is used to drive the movable plate. The auxiliary wheel arm linear module (620) and the movable plate assembly (660) move closer to or farther from the tape carrier (A), the fixed end of the auxiliary wheel arm linear module (620) is connected to the movable plate assembly, and the movable end is connected to the auxiliary wheel arm seat (630), one end of the auxiliary wheel arm (640) is hinged to the auxiliary wheel arm seat (630), and the other end is rotatably connected to the tape auxiliary wheel (650), the driving direction of the auxiliary wheel arm linear module (620) and the movable plate linear module (690) are consistent, and the auxiliary wheel arm (640) is located on one side of the tape roller fixed plate (660) and is connected to the auxiliary wheel arm seat (630) through an elastic reset mechanism (680).

9. The automated packaging device for semiconductor carrier tapes according to claim 8, wherein: The movable plate assembly comprises a first movable plate (6110), a second movable plate (610) and a movable plate compression spring (6100); the movable end of the movable plate linear module is connected to the first movable plate (6110); the first movable plate (6110) and the second movable plate (610) are connected via the movable plate compression spring (6100); and the fixed end of the auxiliary wheel arm linear module (620) is arranged on the second movable plate (610).

10. The automated packaging device for semiconductor carrier tapes according to claim 1, wherein: Also included is a pressing plate assembly (700) for pressing the tape head of the packaging material (B) onto the tape carrier disk (A); And / or, it further comprises a workbench (800), the upper turntable assembly (300) and the head pressure wheel assembly (500) are installed above the workbench (800), and the lower turntable assembly (100) is installed below the workbench (800).

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