Copper bar connecting structure of electrogalvanized steel wire plating solution pool

Abstract

The utility model belongs to the technical field of electrogalvanizing, and provides an electrogalvanized steel wire plating solution pool copper bar connecting structure which comprises a connecting frame, connecting structures arranged at the top end of the connecting frame, copper bars arranged between the connecting structures, a mounting structure arranged at the bottom end of the connecting frame, and electrical connecting structures arranged at the two ends of the copper bars. The connecting structure comprises a bearing plate placed at the bottom of one end of the connecting frame, locking bolts are installed at the two ends of the top of the bearing plate, the tops of the two locking bolts extend and penetrate through the connecting frame, a first insulation pad is arranged at the bottom of one end of the connecting frame, a second insulation pad is arranged at the top of the bearing plate, and a copper bar is placed in the second insulation pad. The mounting structure comprises a first supporting plate fixed to one end of the bottom of the connecting frame, and a second supporting plate is fixedly arranged at the other end of the bottom of the connecting frame. The problems that an electro-galvanized anode lead frame of existing equipment can make contact with the edge of an electro-galvanized steel wire plating solution pool, so that part of current flows into the electro-galvanized steel wire plating solution pool, and power loss and electric shock accidents are caused are solved.

Description

Technical Field

[0001] The utility model relates to the field of electrogalvanizing, in particular to a copper busbar connection structure for an electrogalvanizing steel wire plating bath. Background Art

[0002] Electrogalvanizing, also known as cold galvanizing, is the process of forming a uniform, dense, and well-bonded metal or alloy deposit on the surface of the plated component using electrolysis. In order to maintain the power supply for a long time and form the electrolysis behavior, a copper busbar is required as a current conductor.

[0003] After searching, the patent with publication number CN204325526U discloses a copper bar connection structure for an electro-galvanized steel wire plating bath, including a main copper bar and an electro-galvanized anode lead frame. The main copper bar is electrically connected to the upper outer end of the electro-galvanized anode lead frame, and the bottom surface of the main copper bar is connected to the bracket through a bakelite board. The main copper bar is insulated from the bracket.

[0004] The electrogalvanizing anode lead frame of the existing equipment will be set up to contact the edge of the electrogalvanizing steel wire plating bath, which will cause part of the current to flow into the edge of the electrogalvanizing steel wire plating bath, causing power loss and electric shock accidents.

[0005] Therefore, it is necessary to provide a copper busbar connection structure for an electrogalvanized steel wire plating bath to solve the above technical problems. Utility Model Content

[0006] In order to solve the above technical problems, the utility model provides a copper busbar connection structure for an electro-galvanized steel wire plating bath.

[0007] The utility model provides a copper bar connection structure for an electrogalvanized steel wire plating bath, comprising a connecting frame, a connecting structure provided at the top of the connecting frame, a copper bar provided between the connecting structures, a mounting structure provided at the bottom of the connecting frame, and electrical connection structures provided at both ends of the copper bar;

[0008] The connecting structure includes a supporting plate placed at the bottom of one end of the connecting frame, locking bolts are installed at both ends of the top of the supporting plate, the tops of the two locking bolts extend through the connecting frame, an insulating pad 1 is provided at the bottom of one end of the connecting frame, an insulating pad 2 is provided on the top of the supporting plate, and the copper busbar is placed inside the insulating pad 2.

[0009] In order to achieve the effect of clamping and fixing the edge of the electro-galvanized steel wire plating pool, the utility model provides a copper busbar connection structure for the electro-galvanized steel wire plating pool. Preferably, the installation structure includes a support plate 1 fixed to one end of the bottom of the connecting frame, and a support plate 2 is fixed to the other end of the bottom of the connecting frame. A plurality of mounting bolts 1 are equidistantly provided through one end of the support plate 1, and a plurality of mounting bolts 2 are equidistantly provided through one end of the support plate 2.

[0010] In order to achieve the effect of increasing the contact area of ​​clamping, the utility model provides a copper busbar connection structure for an electro-galvanized steel wire plating bath. Preferably, the other ends of several of the mounting bolts one are rotatably provided with the same mounting clamp plate one, and the other ends of several of the mounting bolts two are rotatably provided with the same mounting clamp plate two.

[0011] In order to achieve the effect of insulation capacity, the utility model provides a copper busbar connection structure for an electro-galvanized steel wire plating bath. Preferably, the connecting frame is a plate with a Z-shaped cross-section, the insulating pad 2 is a U-shaped piece, and the insulating pad 1 and the insulating pad 2 are both made of ceramic materials.

[0012] In order to achieve the effect of convenient connection to the power supply, the utility model provides a copper busbar connection structure for the electro-galvanized steel wire plating bath. Preferably, the electrical connection structure includes an electrical connection column 1 fixedly arranged at one end of the top of the copper busbar, and an electrical connection column 2 fixedly arranged at the other end of the bottom of the copper busbar.

[0013] In order to achieve the effect of stable and fixed connection to the power supply, the utility model provides a copper busbar connection structure for the electro-galvanized steel wire plating liquid pool. Preferably, the interior of the electrical connection column one is provided with an electrical connection hole one, the top of the electrical connection column one is provided with an electrical fastening bolt one, and it extends through the electrical connection hole one, the interior of the electrical connection column two is provided with an electrical connection hole two, the bottom of the electrical connection column two is provided with an electrical fastening bolt two, and it extends through the electrical connection hole two.

[0014] Compared with the prior art, the beneficial effects of the present invention are:

[0015] The copper bar connection structure of the electro-galvanized steel wire plating bath clamps the copper bar between the connecting frame and the supporting plate, so that the copper bar is away from the electro-galvanized steel wire plating bath, thereby solving the problem that the electro-galvanized anode lead frame of the existing equipment may be set up to contact the edge of the electro-galvanized steel wire plating bath, and part of the current may flow into the electro-galvanized steel wire plating bath, causing power loss and electric shock accidents.

[0016] The copper busbar connection structure for the electrogalvanized steel wire plating bath sets the power wires in the electrical connection holes inside the electrical connection columns at both ends of the copper busbar, and relies on electrical tightening bolts to lock the wires. This solves the problem of existing equipment connecting wires by soldering, which makes it inconvenient to replace aging parts and reduces the efficiency of maintenance and repair. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 A structural diagram of a preferred embodiment of the copper busbar connection structure for the electrogalvanized steel wire plating bath provided by the present invention;

[0018] Figure 2 for Figure 1 A structural diagram of the installation structure shown;

[0019] Figure 3 for Figure 1 A structural diagram of the connection structure shown;

[0020] Figure 4 for Figure 1 A structural diagram of the electrical connection structure shown.

[0021] Numbers in the figure: 1. Connecting frame; 2. Connecting structure; 201. Locking bolt; 202. Support plate; 203. Insulating pad 1; 204. Insulating pad 2; 3. Copper busbar; 4. Mounting structure; 401. Support plate 1; 402. Support plate 2; 403. Mounting bolt 1; 404. Mounting bolt 2; 405. Mounting splint 1; 406. Mounting splint 2; 5. Electrical connection structure; 501. Electrical connection column 1; 502. Electrical connection hole 1; 503. Electrical tightening bolt 1; 504. Electrical connection column 2; 505. Electrical connection hole 2; 506. Electrical tightening bolt 2. DETAILED DESCRIPTION

[0022] The present invention will be further described below with reference to the accompanying drawings and implementation examples.

[0023] Please refer to Figure 1 、 Figure 2 、 Figure 3 and Figure 4 ,in, Figure 1 A structural diagram of a preferred embodiment of the copper busbar connection structure for the electrogalvanized steel wire plating bath provided by the present invention; Figure 2 for Figure 1 A structural diagram of the installation structure shown; Figure 3 for Figure 1 A structural diagram of the connection structure shown; Figure 4 for Figure 1 The schematic diagram of the electrical connection structure shown includes a connecting frame 1, a connecting structure 2 is provided at the top of the connecting frame 1, a copper busbar 3 is provided between the connecting structures 2, a mounting structure 4 is provided at the bottom of the connecting frame 1, and electrical connection structures 5 are provided at both ends of the copper busbar 3;

[0024] The connecting structure 2 includes a supporting plate 202 placed at the bottom of one end of the connecting frame 1, and locking bolts 201 are installed at both ends of the top of the supporting plate 202. The tops of the two locking bolts 201 extend through the connecting frame 1. An insulating pad 1 203 is provided at the bottom of one end of the connecting frame 1, and an insulating pad 2 204 is provided on the top of the supporting plate 202. A copper busbar 3 is placed inside the insulating pad 204.

[0025] It should be noted that: the copper busbar 3 is placed on top of the insulating pad 204 of the supporting plate 202, and the two locking bolts 201 are rotated to control the upward displacement of the supporting plate 202 until the insulating pad 1 203 is against the copper busbar 3 at the top, so as to clamp and fix the copper busbar 3, and the copper busbar 3 will not conduct current to the connecting frame 1, avoiding the problem of leakage.

[0026] In the specific implementation process, refer to Figure 1 and Figure 2 As shown, the mounting structure 4 includes a support plate 1 401 fixed to one end of the bottom of the connecting frame 1, a support plate 2 402 is fixedly provided at the other end of the bottom of the connecting frame 1, a plurality of mounting bolts 1 403 are equidistantly provided through one end of the support plate 1 401, a plurality of mounting bolts 2 404 are equidistantly provided through one end of the support plate 2 402, the other ends of the plurality of mounting bolts 1 403 are all rotatably provided with the same mounting splint 1 405, and the other ends of the plurality of mounting bolts 2 404 are all rotatably provided with the same mounting splint 2 406.

[0027] It should be noted that: the support plate 1 401 and the support plate 2 402 at the bottom of the connecting frame 1 are clamped in the electro-galvanized steel wire plating bath, and several mounting bolts 1 403 and several mounting bolts 2 404 are rotated to approach each other, and the corresponding mounting clamp 1 405 and mounting clamp 2 406 are squeezed and clamped together on the edge of the electro-galvanized steel wire plating bath to achieve the purpose of fixing the connecting frame 1. In addition, the ends of the mounting clamp 1 405 and the mounting clamp 2 406 that are close to each other are fixed with anti-slip grooves at equal distances.

[0028] In the specific implementation process, refer to Figure 1 and Figure 3 As shown, the connecting frame 1 is a plate with a Z-shaped cross section, the second insulating pad 204 is a U-shaped piece, and both the first insulating pad 203 and the second insulating pad 204 are made of ceramic materials.

[0029] It should be noted that: the connecting frame 1 adopts a Z-shaped cross-section plate design, which can provide support in two directions, preventing the two ends of the copper busbar 3 from bending downward and contacting the electro-galvanized steel wire plating solution pool, causing a short circuit; the insulating pad 2 204 adopts a U-shaped piece to clamp the copper busbar 3 on three sides to avoid the problem of short circuit; the insulating pad 1 203 and the insulating pad 2 204 are both made of ceramic material, and the insulating ability of the ceramic material is used to isolate the copper busbar 3 from current leakage.

[0030] In the specific implementation process, refer to Figure 1 and Figure 4As shown, the electrical connection structure 5 includes an electrical connection column 1 501 fixedly arranged at one end of the top of the copper busbar 3, and an electrical connection column 2 504 fixedly arranged at the other end of the bottom of the copper busbar 3. An electrical connection hole 1 502 is penetrated through the interior of the electrical connection column 1 501, and an electrical fastening bolt 1 503 is provided on the top of the electrical connection column 1 501 and extends through the electrical connection hole 1 502. An electrical connection hole 2 505 is penetrated through the interior of the electrical connection column 2 504, and an electrical fastening bolt 2 506 is provided on the bottom of the electrical connection column 2 504 and extends through the electrical connection hole 2 505.

[0031] It should be noted that: the positive pole of the power supply is connected to the electrical connection hole 1 502 inside the electrical connection column 1 501, and the electrical tightening bolt 1 503 is used to lock the wire to prevent the connection from falling off. The current flows through the copper bus 3 and is transported to the electrical connection column 2 504. The wire set in the electrical connection hole 2 505 transports the current to the zinc plate, promoting the zinc atoms inside the zinc plate to lose electrons, become ionic state, and dissolve in the electrolyte.

[0032] The working principle of the copper bar connection structure of the electrogalvanized steel wire plating bath provided by the utility model is as follows:

[0033] When in use, place the support plate 1 401 and the support plate 2 402 on one side of the electro-galvanized steel wire plating bath, rotate several mounting bolts 1 403 and several mounting bolts 2 404 to control the corresponding mounting clamp 1 405 and mounting clamp 2 406 to clamp one side of the electro-galvanized steel wire plating bath, place the copper bus 3 on top of the insulating pad 2 204 on the top of the support plate 202, rotate the two locking bolts 201 to control the support plate 202 to approach the connecting frame 1, until the insulating pad 1 203 and the insulating pad 204 clamp the copper bus 3 to provide stable support. , connect the positive pole of the power supply to the electrical connection hole 1 502 inside the electrical connection column 1 501, and rely on the electrical tightening bolt 1 503 to lock the wire to prevent the connection from falling off. The current flows through the copper bus 3 and is transported to the electrical connection column 2 504. The wire set in the electrical connection hole 2 505 transports the current to the zinc plate, promoting the zinc atoms inside the zinc plate to lose electrons, become ionic state, and dissolve in the electrolyte. The negative pole of the power supply is connected to the electrogalvanized steel wire through the wire, and the electrogalvanized steel wire evenly absorbs the ionic zinc.

[0034] The above description is merely an embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the description and drawings of the present invention, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A copper busbar connection structure for an electrogalvanized steel wire plating bath, comprising a connecting frame (1), characterized in that: The top of the connecting frame (1) is provided with a connecting structure (2), a copper busbar (3) is provided between the connecting structures (2), the bottom of the connecting frame (1) is provided with a mounting structure (4), and both ends of the copper busbar (3) are provided with electrical connection structures (5); The connection structure (2) includes a supporting plate (202) placed at the bottom of one end of the connecting frame (1), locking bolts (201) are installed at both ends of the top of the supporting plate (202), and the tops of the two locking bolts (201) extend through the connecting frame (1), an insulating pad (203) is provided at the bottom of one end of the connecting frame (1), and an insulating pad (204) is provided at the top of the supporting plate (202), and the copper busbar (3) is placed inside the insulating pad (204).

2. The copper busbar connection structure for the electrogalvanized steel wire plating bath according to claim 1, characterized in that: The mounting structure (4) comprises a support plate 1 (401) fixed to one end of the bottom of the connecting frame (1), a support plate 2 (402) fixed to the other end of the bottom of the connecting frame (1), a plurality of mounting bolts 1 (403) equidistantly passing through one end of the support plate 1 (401), and a plurality of mounting bolts 2 (404) equidistantly passing through one end of the support plate 2 (402).

3. The copper busbar connection structure for the electrogalvanized steel wire plating bath according to claim 2, characterized in that: The other ends of several of the mounting bolts (403) are all rotatably provided with the same mounting clamping plate (405), and the other ends of several of the mounting bolts (404) are all rotatably provided with the same mounting clamping plate (406).

4. The copper busbar connection structure for the electrogalvanized steel wire plating bath according to claim 1, characterized in that: The connecting frame (1) is a plate with a Z-shaped cross section, the second insulating pad (204) is a U-shaped piece, and both the first insulating pad (203) and the second insulating pad (204) are made of ceramic material.

5. The copper busbar connection structure for the electrogalvanized steel wire plating bath according to claim 1, characterized in that: The electrical connection structure (5) comprises an electrical connection column 1 (501) fixedly arranged at one end of the top of the copper busbar (3), and an electrical connection column 2 (504) fixedly arranged at the other end of the bottom of the copper busbar (3).

6. The copper busbar connection structure for the electrogalvanized steel wire plating bath according to claim 5, characterized in that: An electrical connection hole (502) is provided through the interior of the electrical connection column (501), an electrical fastening bolt (503) is provided on the top of the electrical connection column (501), and extends through the electrical connection hole (502), an electrical connection hole (505) is provided through the interior of the electrical connection column (504), an electrical fastening bolt (506) is provided on the bottom of the electrical connection column (504), and extends through the electrical connection hole (505).

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