Microwave interconnection system and quantum computer

Abstract

The utility model discloses a microwave interconnection system and a quantum computer. The microwave interconnection system comprises at least one first flexible strip line integrated with a plurality of first signal lines; the first interconnection structure is used for detachably and electrically connecting one end of each first signal line with a signal port of measurement and control equipment outside the dilution refrigerator in a one-to-one correspondence manner; the sealing flange is arranged on the first flexible strip line in a sealing and sleeving mode and used for being detachably connected to a room temperature disc of the dilution refrigerator in a sealing mode; the plurality of clamping seats are clamped on the first flexible strip line and are detachably connected to cold discs of the dilution refrigerator in a one-to-one correspondence manner; and the second interconnection structures are detachably connected to the other ends of the first signal lines and are used for being electrically connected with signal ports of quantum chips in a one-to-one correspondence manner. The microwave interconnection system is high in integration level, convenient to mount and dismount, few in connection points and capable of improving the reliability of signal transmission.

Description

Technical Field

[0001] The utility model relates to the technical field of quantum computers, in particular to a microwave interconnection system and a quantum computer. Background Art

[0002] In superconducting quantum computers, quantum chips must operate in extremely low temperatures, such as around 10mK. This low temperature is typically provided by a dilution refrigerator, which is installed at the lowest temperature level within the refrigerator. To control and measure the quantum chip at this lowest level, a microwave interconnect system is required to electrically connect the measurement and control equipment outside the dilution refrigerator to the quantum chip inside. Currently, coaxial cables are commonly used for signal transmission in microwave interconnect systems. These cables have the following drawbacks: their size will be difficult to miniaturize on a large scale for a long time to come, resulting in low integration. Furthermore, when microwave interconnect systems are installed across temperature zones, i.e., across the room temperature plate and each cold plate, each coaxial cable must be connected via multiple signal connectors, resulting in numerous connection points, low reliability, and cumbersome installation and removal.

[0003] It should be noted that the information disclosed in the background technology section of this application is only intended to deepen the understanding of the general background technology of this application, and should not be regarded as an admission or any form of implication that the information constitutes prior art already known to those skilled in the art. Utility Model Content

[0004] The purpose of the utility model is to provide a microwave interconnection system and a quantum computer, which not only have high integration and are easy to install and disassemble, but also have fewer connection points, thereby improving the reliability of signal transmission.

[0005] In order to achieve the above purpose, the present invention provides the following technical solutions:

[0006] A first aspect of the present invention provides a microwave interconnection system, comprising:

[0007] at least one first flexible strip line integrated with a plurality of first signal lines;

[0008] a first interconnection structure for detachably electrically connecting one end of each of the first signal lines to a signal port of a measurement and control device outside the dilution refrigerator in a one-to-one correspondence;

[0009] A sealing flange, a sealing sleeve provided on the first flexible strip line and used for sealing and detachably connecting to the room temperature plate of the dilution refrigerator;

[0010] A plurality of clamping seats, clamped on the first flexible strip line, and used for being detachably connected to the cold plate of the dilution refrigerator in a one-to-one correspondence;

[0011] The second interconnection structure is detachably connected to the other end of each of the first signal lines, and is used for electrically connecting to the signal ports of the quantum chip in a one-to-one correspondence.

[0012] The microwave interconnection system as described above, further, the second interconnection structure includes:

[0013] A second stripline having a plurality of second signal lines integrated therein, wherein one end of each of the second signal lines is configured to be electrically connected to a signal port of the quantum chip in a one-to-one correspondence;

[0014] a plurality of first elastic conductors disposed perpendicularly on the second stripline, wherein one end of each of the first elastic conductors is electrically connected to each of the second signal lines in a one-to-one correspondence; and the other end of each of the first elastic conductors is in contact with each of the first signal lines in a one-to-one correspondence;

[0015] The crimping assembly is used to detachably crimp one end of the first flexible strip line to the second strip line so that the first elastic conductor is in close contact with the first signal line.

[0016] The microwave interconnection system as described above, further, the crimping assembly includes:

[0017] first pressing plate;

[0018] a second pressing plate, wherein a placement hole for sandwiching the first flexible strip line and the second strip line is formed between the first pressing plate and the second pressing plate;

[0019] The first fixing member is used to detachably connect the first pressing plate and the second pressing plate so that one end of the first flexible strip line and the second strip line are detachably crimped.

[0020] The microwave interconnection system as described above, further, the first pressing plate includes:

[0021] a first plate;

[0022] At least two second plates perpendicular to the first plate and spaced apart, wherein the opposite sides of any two adjacent second plates are provided with first limiting grooves;

[0023] Both ends of the second pressing plate are respectively arranged in the first limiting groove, and the placement hole is formed between the second pressing plate, the first plate body and any two second plate bodies.

[0024] The microwave interconnection system as described above, further, each of the first flexible strip lines includes:

[0025] A flexible strip sub-line segment 1 integrating a plurality of third signal lines, wherein one end of each of the third signal lines is detachably electrically connected to a signal port of a measurement and control device outside the dilution refrigerator in a one-to-one correspondence;

[0026] a flexible strip sub-line segment 2 integrating a plurality of fourth signal lines; one end of each of the fourth signal lines being electrically connected to the other end of each of the third signal lines in a one-to-one correspondence, and the other end of each of the fourth signal lines being detachably electrically connected to the second interconnection structure;

[0027] a third interconnection structure for electrically connecting one end of each of the fourth signal lines to the other end of each of the third signal lines in a one-to-one correspondence;

[0028] The third interconnection structure is located in the 4K temperature zone of the dilution refrigerator; the third signal line is a copper-containing cable; and the fourth signal line is a superconducting cable.

[0029] The microwave interconnection system as described above, further, the third interconnection structure includes:

[0030] a third stripline comprising a first dielectric layer and a plurality of conductive traces disposed within the first dielectric layer;

[0031] a plurality of second elastic conductors, one end of each of the second elastic conductors being fixed to one end of each of the conductive traces in a one-to-one correspondence, and the other end of each of the second elastic conductors being configured to contact each of the third signal lines in a one-to-one correspondence;

[0032] a plurality of third elastic conductors, one end of each of the third elastic conductors being fixed to the other end of each of the conductive traces in a one-to-one correspondence, and the other end of each of the third elastic conductors being configured to contact each of the fourth signal lines in a one-to-one correspondence;

[0033] a second fixing member, for detachably connecting one end of the third strip line to the flexible strip sub-line segment;

[0034] The third fixing member is used to detachably connect the other end of the third strip line to the second flexible strip sub-line segment.

[0035] In the microwave interconnection system as described above, further, the second elastic conductor and the third elastic conductor both include spring pins.

[0036] In the microwave interconnection system as described above, further, the first interconnection structure is a first high-density connector.

[0037] The microwave interconnection system as described above, further, the first signal line in the first flexible stripline is integrated with a microwave component.

[0038] A second aspect of the present invention provides a quantum computer, comprising a quantum chip, a measurement and control device, and at least one of the above-mentioned microwave interconnection systems electrically connected between the quantum chip and the measurement and control device.

[0039] The beneficial effects of the present invention are:

[0040] The microwave interconnection system of the present application adopts a first flexible stripline to replace a coaxial cable. Since the flexible stripline has the characteristics of small size and high integration, the integration of the entire microwave interconnection system is improved.

[0041] The first interconnect structure facilitates installation and removal of the microwave interconnect system and external measurement and control equipment. The second interconnect structure facilitates installation and removal of the microwave interconnect system and the quantum chip. Specifically, the second interconnect structure can be electrically connected to the signal ports of the quantum chip in a one-to-one correspondence, and then the second interconnect structure can be detachably connected to the first flexible strip line. The sealing flange and clamping seat facilitate installation and removal of the microwave interconnect system and the room temperature plate and cold plate inside the dilution refrigerator.

[0042] Compared with the coaxial cable, the first flexible strip line is not only easier to arrange on the sealing flange and the clamping seat, but also the sealing flange sealing sleeve is arranged on the first flexible strip line, and the clamping seat is clamped on the first flexible strip line. Therefore, when the first flexible strip line passes through the room temperature plate and the cold plate, it does not need to be transferred through a signal connector, which reduces the connection points and improves the reliability of signal transmission.

[0043] Therefore, the microwave interconnection system of this embodiment not only has a high degree of integration and is easy to install and disassemble, but also has fewer connection points, thereby improving the reliability of signal transmission.

[0044] The quantum computer provided by the present invention includes the above-mentioned microwave interconnection system, and therefore has the same beneficial effects, which will not be described in detail here. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] Figure 1 A schematic structural diagram of a microwave interconnection system provided in an embodiment of the present utility model;

[0046] Figure 2 A schematic diagram of the structure of the second interconnection structure in use provided by an embodiment of the present utility model;

[0047] Figure 3 A schematic diagram of the structure of the connection between the second strip line and the first elastic conductor provided by an embodiment of the present utility model;

[0048] Figure 4 A schematic structural diagram of a crimping assembly provided in an embodiment of the present utility model;

[0049] Figure 5 A schematic diagram of the third interconnection structure provided in an embodiment of the present utility model Figure 1 ;

[0050] Figure 6Schematic diagram of the structure of the first flexible strip line provided in the embodiment of the utility model Figure 1 ;

[0051] Figure 7 A schematic diagram of the third interconnection structure provided in an embodiment of the present utility model Figure 2 ;

[0052] Figure 8 Schematic diagram of the structure of the first flexible strip line provided in the embodiment of the utility model Figure 2 ;

[0053] Figure 9 Schematic diagram of the structure of the first flexible strip line provided in the embodiment of the utility model Figure 3 ;

[0054] Figure 10 for Figure 9 A magnified view of middle A;

[0055] In the accompanying drawings: 10, first flexible stripline; 11, flexible stripline sub-segment 1; 111, third signal line; 12, flexible stripline sub-segment 2; 121, fourth signal line; 13, third interconnect structure; 131, third stripline; 1311, conductive trace; 1312, first dielectric layer; 1313, metal shielding layer; 132, second elastic conductor; 133, third elastic conductor; 134, second fixing member; 135, third fixing member; 136, first metal via;

[0056] 20. First interconnect structure; 30. Sealing flange; 40. Clamping seat; 50. Second interconnect structure; 51. Second strip line; 511. Second signal line; 512. Second dielectric layer; 52. Pressing assembly; 521. First pressure plate; 5211. First plate body; 5212. Second plate body; 5212a. First limiting groove; 522. Second pressure plate; 523. First fixing member; 53. First elastic conductor; 60. Quantum chip; 70. Measurement and control equipment. DETAILED DESCRIPTION

[0057] In order to enable those skilled in the art to better understand the technical solutions in this application, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the drawings in the embodiments of this application. Obviously, the described embodiments are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative work should fall within the scope of protection of this application. The embodiments described below with reference to the drawings are exemplary and are only used to explain this application, and cannot be interpreted as limiting this application.

[0058] In the description of the present invention, it should be understood that the terms "center", "up", "down", "left", "right", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present invention.

[0059] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include one or more of such features. In the description of this utility model, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0060] Figure 1 A schematic diagram of the structure of a microwave interconnection system provided in an embodiment of the present invention; Figure 1 As shown: The embodiment of the present application discloses a microwave interconnection system, comprising:

[0061] At least one first flexible strip line 10 is integrated with a plurality of first signal lines.

[0062] The first interconnection structure 20 is used to detachably electrically connect one end of each of the first signal lines to a signal port of the measurement and control device 70 outside the dilution refrigerator in a one-to-one correspondence.

[0063] The sealing flange 30 is provided on the first flexible strip line 10 and is used for sealing and detachably connecting to the room temperature plate of the dilution refrigerator.

[0064] A plurality of clamping seats 40 are clamped on the first flexible strip line 10 and are used for being detachably connected to the cold plate of the dilution refrigerator in a one-to-one correspondence.

[0065] The second interconnection structure 50 is detachably connected to the other end of each of the first signal lines, and is used for electrically connecting to the signal ports of the quantum chip 60 in a one-to-one correspondence.

[0066] The microwave interconnection system of this embodiment uses the first flexible stripline 10 to replace the coaxial cable. Since the flexible stripline has the characteristics of small size and high integration, the integration of the entire microwave interconnection system is improved.

[0067] The first interconnect structure 20 facilitates installation and removal of the microwave interconnect system and the external measurement and control equipment 70. The second interconnect structure 50 facilitates installation and removal of the microwave interconnect system and the quantum chip 60. Specifically, the second interconnect structure 50 can be electrically connected to the signal ports of the quantum chip 60 in a one-to-one correspondence, and then the second interconnect structure 50 can be detachably connected to the first flexible stripline 10. The sealing flange 30 and the clamping seat 40 facilitate installation and removal of the microwave interconnect system and the room temperature plate and several cold plates inside the dilution refrigerator.

[0068] Compared with a coaxial cable, the first flexible strip line 10 is not only easier to arrange on the sealing flange 30 and the clamping seat 40, but also the sealing flange 30 is sealingly sleeved on the first flexible strip line 10, and the clamping seat 40 is clamped on the first flexible strip line 10. Therefore, when the first flexible strip line 10 passes through a room temperature disk and several cold disks, it does not need to be transferred through a signal connector, which reduces the number of connection points, improves the reliability of signal transmission, reduces the complexity of installation, and improves the installation efficiency.

[0069] Therefore, the microwave interconnection system of this embodiment not only has a high degree of integration and is easy to install and disassemble, but also has fewer connection points, thereby improving the reliability of signal transmission.

[0070] In this embodiment, the sealing flange 30 is sealed on the structure of the first flexible strip line without any specific limitation. For example, the sealing flange 30 is provided with a through hole for the first flexible strip line 10 to pass through, and the gap between the first flexible strip line 10 and the through hole is filled with a sealant layer to ensure the airtightness of the installation, thereby ensuring the reliability of signal transmission.

[0071] In this embodiment, the sealing flange 30 can be detachably connected to the room temperature disk of the dilution refrigerator by screws, and a sealing ring is provided at the contact surface between the sealing flange 40 and the room temperature disk to achieve a sealed and detachable connection.

[0072] In this embodiment, the structure of the clamping base 40 clamped to the first flexible stripline 10 is not specifically limited. For example, the clamping base 40 includes a first clamping base and a second clamping base detachably connected by screws. When the first and second clamping bases are clamped together, a through hole for clamping the first flexible stripline 10 is formed. By adjusting the screws, the clamping base 40 is firmly clamped to the first flexible stripline 10. This facilitates heat transfer from the first flexible stripline 10 to the cold plate, improving signal transmission reliability. To further enhance heat transfer, the clamping base 40 is made of oxygen-free copper.

[0073] In this embodiment, the clamping seat 40 can be detachably connected to the cold plate of the dilution refrigerator by screws.

[0074] In this embodiment, the second interconnection structure 50 is not specifically limited. In order to improve the reliability of the electrical connection between the first flexible stripline 10 and the quantum chip 60 and to improve the reliability of signal transmission of the microwave interconnection system, Figure 2 A schematic structural diagram of the second interconnection structure 50 in use according to an embodiment of the present invention; Figure 3 Schematic diagram of the structure of the second strip line 51 and the first elastic conductor 53 provided in an embodiment of the present invention; Figure 2 and Figure 3 As shown: This embodiment of the present application discloses a second interconnect structure 50, including:

[0075] The second strip line 51 is integrated with a plurality of second signal lines 511 , and one end of each second signal line 511 is used for one-to-one electrical connection with a signal port of the quantum chip 60 .

[0076] A plurality of first elastic conductors 53 are vertically arranged on the second strip line 51 , and one end of each first elastic conductor 53 is electrically connected to each second signal line 511 in a one-to-one correspondence; the other end of each first elastic conductor 53 is in contact with each first signal line in a one-to-one correspondence.

[0077] The crimping assembly 52 is used to detachably crimp one end of the first flexible strip line 10 to the second strip line 51 so that the first elastic conductor 53 is in close contact with the first signal line.

[0078] The second interconnect structure 50 of the present application includes a second stripline 51 integrated with multiple second signal lines 511 and multiple first elastic conductors 53. One end of each second signal line 511 is used to electrically connect to the signal port of the quantum chip 60 in a one-to-one correspondence, and one end of each first elastic conductor 53 is electrically connected to each second signal line 511 in a one-to-one correspondence; the other end of each first elastic conductor 53 is in contact with each first signal line in a one-to-one correspondence, so that the first flexible stripline 10 is electrically connected to the first elastic conductor 53 through the second stripline 51. By providing a crimping assembly 52, one end of the first flexible stripline 10 is detachably crimped to the second stripline 51 so that the first elastic conductor 53 is in close contact with the first signal line, thereby ensuring the reliability of the electrical connection between the first elastic conductor 53 and the first signal line and the reliability of the electrical connection between the first flexible stripline 10 and the quantum chip 60.

[0079] In this embodiment, the structure of the quantum chip 60 is not specifically limited. In order to facilitate the electrical connection between the second signal line 511 and the signal port of the quantum chip 60, multiple signal ports of the quantum chip 60 electrically connected to multiple second signal lines 511 in the same second strip line 51 are arranged in an array along the same direction.

[0080] In this embodiment, the second stripline 51 may be flexible or not. For example, the second stripline 51 is a rigid stripline, which makes it easier to electrically connect the second signal line 511 in the second stripline 51 with the signal port of the quantum chip 60.

[0081] To improve the reliability of the electrical connection between the first flexible stripline 10 and the quantum chip 60, three aspects can be taken into consideration: first, improving the anti-interference capability of the second stripline 51 in the second interconnect structure 50; second, improving the reliability of the electrical connection between the quantum chip 60 and the second stripline 51 in the second interconnect structure 50; and third, improving the reliability of the electrical connection between the first signal line in the first flexible stripline 10 and the first elastic conductor 53 in the second interconnect structure 50.

[0082] Regarding the first point: Continue as Figure 3 As shown: In this embodiment, the second stripline 51 further includes a second dielectric layer 512, and the plurality of second signal lines 511 are arranged at intervals in the second dielectric layer 512, thereby avoiding mutual interference between the plurality of second signal lines 511; further, the outer wall of the second dielectric layer 512 is provided with a metal shielding layer 1313. By providing the metal shielding layer 1313, the effect of reducing external signal interference is played, and the signal quality transmitted by the second signal line 511 in the second stripline 51 is guaranteed, so as to improve the reliability of the electrical connection.

[0083] Regarding the second point: In this embodiment, there is no specific limitation on the electrical connection method between the second signal line 511 in the second stripline 51 and the signal port in the quantum chip 60. In order to improve the reliability of the electrical connection between the quantum chip 60 and the second interconnection structure 50, one end of the second signal line 511 in the second interconnection structure 50 can be electrically connected to the signal port of the quantum chip 60 by welding. In order to further improve the reliability of the electrical connection, one end of the second signal line 511 can be electrically connected to the signal port of the quantum chip 60 by an indium column.

[0084] Regarding the third point, which is improving the reliability of the electrical connection between the first signal line in the first flexible stripline 10 and the first elastic conductor 53 in the second interconnect structure 50 , a detailed description is given below.

[0085] In order to improve the reliability of the electrical connection between the first signal line in the first flexible stripline 10 and the first elastic conductor 53 in the second interconnect structure 50, Figure 4 A schematic structural diagram of the crimping assembly 52 provided in an embodiment of the present invention; Figure 4As shown: In some implementations of this embodiment, the crimping assembly 52 includes: a first pressing plate 521; a second pressing plate 522, wherein a placement hole for clamping the first flexible strip line 10 and the second strip line 51 is formed between the first pressing plate 521 and the second pressing plate 522; a first fixing member 523, which is used to detachably connect the first pressing plate 521 and the second pressing plate 522 so that one end of the first flexible strip line 10 and the second strip line 51 can be detachably crimped.

[0086] The first flexible strip line 10 and the second strip line 51 are clamped together by the first pressing plate 521 and the second pressing plate 522. The first fixing member 523 realizes a detachable connection between the first pressing plate 521 and the second pressing plate 522 so that one end of the first flexible strip line 10 and the second strip line 51 can be detachably crimped together, thereby making the first elastic conductor 53 and the first signal line in close contact, thereby achieving a reliable electrical connection between the first flexible strip line 10 and the second interconnect structure 50.

[0087] In this embodiment, the structure of the first pressing plate 521 is not specifically limited and may be a square pressing plate or other shapes.

[0088] In order to improve the reliability of the electrical connection between the first signal line in the first flexible stripline 10 and the first elastic conductor 53 in the second interconnection structure 50, Figure 4 As shown in some implementations of this embodiment, the first pressing plate 521 includes: a first plate 5211; at least two second plates 5212 perpendicular to the first plate 5211 and spaced apart; first limiting grooves 5212a are provided on opposing sides of any two adjacent second plates 5212; and both ends of the second pressing plate 522 are disposed within the first limiting grooves 5212a. The placement holes are formed between the second pressing plate 522, the first plate 5211, and any two second plates 5212. The aforementioned configuration of the first pressing plate 521 facilitates defining the positions of the first flexible stripline 10 and the second stripline 51, thereby facilitating reliable crimping of the first signal line in the first flexible stripline 10 and the first elastic conductor 53 on the second stripline 51, thereby improving electrical connection reliability.

[0089] In this embodiment, the number of second plates 5212 in the first pressure plate 521 is not specifically limited. For example, there can be two, three, or more second plates 5212. When two second plates 5212 are provided, one first flexible stripline 10 can be electrically connected to the quantum chip 60. When three second plates 5212 are provided, two first flexible striplines 10 can be electrically connected to the quantum chip 60.

[0090] In order to improve the reliability of the electrical connection between the first signal line in the first flexible stripline 10 and the first elastic conductor 53 in the second interconnect structure 50, in some implementations of this embodiment, the dimension of the first limiting groove 5212a perpendicular to the second pressing plate 522 is greater than the thickness of the second pressing plate 522. In this way, the size of the placement hole can be adjusted to ensure that the first signal line and the first elastic conductor 53 are tightly crimped, thereby improving the reliability of the electrical connection between the first flexible stripline 10 and the second interconnect structure 50. At the same time, the crimping assembly 52 can also be applied to first flexible striplines 10 and second striplines 51 of different thicknesses.

[0091] In order to improve the reliability of the electrical connection between the first signal line in the first flexible stripline 10 and the first elastic conductor 53 in the second interconnect structure 50, in some implementations of this embodiment, a second limiting groove is provided on the side of the first plate 5211 opposite to the second pressure plate 522, and the second limiting groove matches the width of the first flexible stripline 10; and a third limiting groove is provided on the side of the second pressure plate 522 opposite to the second plate 5212, and the third limiting groove matches the width of the second stripline 51.

[0092] The second limiting groove is provided to limit the position of the first flexible stripline 10, and the third limiting groove is provided to limit the position of the second stripline 51. The first limiting groove 5212a defines the relative positions of the first pressing plate 521 and the second pressing plate 522. This facilitates one-to-one alignment and contact between the first signal lines on the first flexible stripline 10 and the first elastic conductors 53 on the second stripline 51, thereby improving the reliability of the electrical connection between the first flexible stripline 10 and the second interconnect structure 50.

[0093] In this embodiment, the first fixing member 523 is not specifically limited. To improve the reliability of the electrical connection between the first signal line in the first flexible stripline 10 and the first elastic conductor 53 in the second interconnect structure 50, in some implementations of this embodiment, the first fixing member 523 includes a screw and a spring sleeved on the screw, with one end of the spring contacting the first plate 5211 and the other end of the spring contacting the second pressure plate 522. The first fixing member 523 in this embodiment, by providing the spring, can achieve elastic compression of the first flexible stripline 10 and the second stripline 51, thereby improving the reliability of the electrical connection.

[0094] In this embodiment, the type of first elastic conductor 53 is not specifically limited. In some implementations of this embodiment, the first elastic conductor 53 comprises a pogo pin. The use of the pogo pin ensures a reliable electrical connection between the first flexible stripline 10 and the second interconnect structure 50. Furthermore, the pogo pin has an arc-shaped end surface where it contacts the second signal line 511. This arc-shaped end surface reduces physical damage to the second signal line 511 and increases the contact area, thereby improving the signal line's connection stability and conduction efficiency.

[0095] Typically, the quantum chip 60 needs to operate in an extremely low temperature environment to maintain the stability of its quantum state. In order to prevent the heat generated by the second strip line 51 during signal transmission from interfering with the extremely low temperature environment of the quantum chip 60 and thereby improve the reliability of signal transmission, in some implementations of this embodiment, the material of the second signal line 511 in the second strip line 51 includes a superconducting material, such as niobium titanium. By using a superconducting material, the second signal line 511 does not generate resistance when transmitting signals, and therefore does not generate heat, thereby avoiding interference with the extremely low temperature environment and improving the reliability of signal transmission.

[0096] In order to prevent the heat generated by the first flexible strip line 10 during signal transmission from interfering with the extremely low temperature environment of the quantum chip 60 and to improve the reliability of signal transmission, in some implementations of this embodiment, Figure 5 A schematic diagram of the structure of the third interconnection structure 13 provided in an embodiment of the present utility model Figure 1 ; Figure 6 The structure of the first flexible strip line 10 provided in the embodiment of the present invention is schematically shown. Figure 1 ;like Figure 5 and Figure 6 As shown: This embodiment of the present application discloses a first flexible strip line 10, comprising:

[0097] A flexible strip sub-line segment 11 is integrated with a plurality of third signal lines 111 , and one end of each third signal line 111 is detachably electrically connected to a signal port of a measurement and control device 70 outside the dilution refrigerator in a one-to-one correspondence.

[0098] The flexible strip sub-line segment 12 integrates multiple fourth signal lines 121; one end of each fourth signal line 121 is electrically connected to the other end of each third signal line 111 in a one-to-one correspondence, and the other end of each fourth signal line 121 is detachably electrically connected to the second interconnection structure 50.

[0099] The third interconnect structure 13 is used to electrically connect one end of each of the fourth signal lines 121 to the other end of each of the third signal lines 111 in a one-to-one correspondence.

[0100] The third interconnect structure 13 is located in the 4K temperature zone of the dilution refrigerator; the third signal line 111 is a copper-containing cable; and the fourth signal line 121 is a superconducting cable.

[0101] In this embodiment, the first flexible strip line 10 is formed by splicing a flexible strip sub-segment 1 11 and a flexible strip sub-segment 2 12 through a third interconnection structure 13, and the third interconnection structure 13 is located in the 4K temperature zone of the dilution refrigerator; the third signal line 111 is a copper cable; the fourth signal line 121 is a superconducting cable; by selecting the fourth signal line 121 of the flexible strip sub-segment 2 12 in the temperature zone of 4K and below as a superconducting cable, such as a niobium-titanium cable, no resistance is generated when transmitting signals, and therefore no heat is generated, thereby avoiding interference with the extremely low temperature environment and improving the reliability of signal transmission. Since the temperature requirement in the temperature zone above 4K is relatively lower than that in the temperature zone below 4K, a copper cable with low thermal conductivity, such as phosphor bronze or beryllium copper, can be used in the temperature zone above 4K.

[0102] In this embodiment, the third interconnection structure 13 is not specifically limited. In order to ensure the reliability of the electrical connection between the flexible strip sub-segment 1 11 and the flexible strip sub-segment 2 12, in some implementations of this embodiment, Figure 5 and Figure 6 As shown: the third interconnection structure 13 includes:

[0103] The third stripline 131 includes a first dielectric layer 1312 and a plurality of conductive traces 1311 disposed within the first dielectric layer 1312; a plurality of second elastic conductors 132, each of which has one end fixed to one end of the conductive trace 1311, and the other end of each second elastic conductor 132 is configured to contact one of the third signal lines 111; a plurality of third elastic conductors 133, each of which has one end fixed to the other end of the conductive trace 1311, and the other end of each third elastic conductor 133 is configured to contact one of the fourth signal lines 121; a second fixing member 134 is configured to detachably connect one end of the third stripline 131 to the flexible stripline sub-segment 11; and a third fixing member 135 is configured to detachably connect the other end of the third stripline 131 to the flexible stripline sub-segment 2 12.

[0104] The third interconnect structure 13 in this embodiment includes a third stripline 131 having a plurality of conductive traces 1311. A plurality of second elastic conductors 132 and a second fixing member 134 are provided to electrically connect the plurality of conductive traces 1311 to the plurality of third signal lines 111 in the flexible stripline sub-segment 11 in a one-to-one correspondence. A third elastic conductor 133 and a third fixing member 135 are provided to electrically connect the plurality of conductive traces 1311 to the plurality of fourth signal lines 121 in the flexible stripline sub-segment 2 in a one-to-one correspondence. Electrical connection is achieved through the third interconnection structure 13, thereby realizing electrical connection between the flexible strip sub-segment 1 11 and the flexible strip sub-segment 2 12. Due to the provision of the second elastic conductor 132 and the third elastic conductor 133, the third interconnection structure 13 is in elastic electrical contact with both the flexible strip sub-segment 1 11 and the flexible strip sub-segment 2 12, which not only ensures the reliability of the electrical contact but also reduces physical wear, thereby ensuring the reliability of the electrical connection between the flexible strip sub-segment 1 11 and the flexible strip sub-segment 2 12.

[0105] In this embodiment, the type of second elastic conductor 132 is not specifically limited. In some implementations of this embodiment, the second elastic conductor 132 comprises pogo pins. The use of pogo pins ensures reliable electrical connection between the third interconnect structure 13 and the flexible strip sub-segment 11. Furthermore, the end faces of the pogo pins that contact the third signal line 111 in the flexible strip sub-segment 11 are curved. This curved end face reduces physical damage to the third signal line 111 and increases the contact area, thereby improving signal line connection stability and conduction efficiency.

[0106] In this embodiment, the type of third elastic conductor 133 is not specifically limited. In some implementations of this embodiment, the third elastic conductor 133 comprises a pogo pin. The use of the pogo pin ensures reliable electrical connection between the third interconnect structure 13 and the second flexible strip sub-segment 12. Furthermore, the end faces of the pogo pins that contact the fourth signal line 121 in the second flexible strip sub-segment 12 are curved. This curved end face reduces physical damage to the fourth signal line 121 and increases the contact area, thereby improving signal line connection stability and conduction efficiency.

[0107] In this embodiment, the shape of the conductive trace 1311 is not particularly limited, so as to facilitate electrical connection. Figure 7 A schematic diagram of the structure of the third interconnection structure 13 provided in an embodiment of the present utility model Figure 2 ;like Figure 5 and Figure 7 As shown: In order to facilitate electrical connection, in some implementations of this embodiment, the conductive trace 1311 is Z-shaped or long strip-shaped.

[0108] Continue as Figure 5 and Figure 7As shown: In some implementations of this embodiment, the third stripline 131 further includes a metal shielding layer 1313 covering at least one surface of the first dielectric layer 1312. The provision of the metal shielding layer 1313 reduces external signal interference, ensures the signal quality transmitted by the conductive traces 1311 in the third interconnect structure 13, and improves the reliability of the electrical connection. Furthermore, the metal shielding layer 1313 is provided on all surfaces of the first dielectric layer 1312 in the third stripline 131 that are not contacted by the flexible stripline sub-segment 1 11 and the flexible stripline sub-segment 2 12.

[0109] In this embodiment, the second fixing member 134 and the third fixing member 135 are not specifically limited. In some implementations of this embodiment, the second fixing member 134 and the third fixing member 135 are both screws; the screws can be used to quickly and easily achieve a detachable connection; in other implementations of this embodiment, the second fixing member 134 and the third fixing member 135 are both clamps.

[0110] In this embodiment, the electrical connection between the first and second flexible strip sub-segments 11 and 12 and the third interconnect structure 13 is not specifically limited. To facilitate electrical connection, in some implementations of this embodiment, a first notch is provided at one end of the first flexible strip sub-segment 11, exposing the third signal line 111. A second notch is provided at the end of the second flexible strip sub-segment 12 opposite the first flexible strip sub-segment 11, exposing the fourth signal line 121. The second elastic conductor 132 contacts the exposed third signal line 111, and the third elastic conductor 133 contacts the exposed fourth signal line 121, thereby electrically connecting the first and second flexible strip sub-segments 11 and 12 to the third interconnect structure 13. Two specific examples of the third interconnect structure 13 and the first flexible strip line 10 are provided below, based on this structure of the first and second flexible strip sub-segments 11 and 12.

[0111] Example 1: Figure 5 and Figure 6 As shown, the third interconnect structure 13 is Z-shaped, and the conductive trace 1311 therein is also Z-shaped. Specifically, a third notch is provided above one end of the third stripline 131, and a fourth notch is provided below the other end of the third stripline 131, forming a Z-shaped third interconnect structure 13. The conductive trace 1311 includes a third wire and a fourth wire arranged horizontally and a fifth wire perpendicular to the third wire and the fourth wire. The two ends of the fifth wire are respectively electrically connected to one end of the third wire and one end of the fourth wire, forming a Z-shaped conductive trace 1311.

[0112] One end of the second elastic conductor 132 is fixed to the third wire, and the other end of the second elastic conductor 132 passes through the third notch and contacts the third signal line 111 exposed at the first notch. One end of the third elastic conductor 133 is fixed to the fourth wire, and the other end of the third elastic conductor 133 passes through the fourth notch and contacts the fourth signal line 121 exposed at the second notch, forming a circuit as shown in FIG. Figure 6 The first flexible strip line 10 is shown as a long strip.

[0113] It should be noted that in this example, the Z-shaped conductive trace 1311 can be realized by a multi-layer PCB board.

[0114] Example 2: Figure 8 The structure of the first flexible strip line 10 provided in the embodiment of the present invention is schematically shown. Figure 2 ,like Figure 7 and Figure 8 As shown, the third interconnect structure 13 is in the shape of an elongated strip, and the conductive trace 1311 therein is also in the shape of an elongated strip. Specifically, the third stripline 131 is in the shape of an elongated strip. One end of the second elastic conductor 132 fixed to the conductive trace 1311 has the other end extending from the first dielectric layer 1312 of the third stripline 131 and in contact with the third signal line 111 exposed at the first notch. The other end of the third elastic conductor 133 fixed to the conductive trace 1311 extends from the first dielectric layer 1312 of the third stripline 131 and in contact with the fourth signal line 121 exposed at the second notch, forming a structure as shown in FIG. Figure 8 The first flexible strip line 10 is shown as a long strip.

[0115] Figure 9 The structure of the first flexible strip line 10 provided in the embodiment of the present invention is schematically shown. Figure 3 ; Figure 10 for Figure 9 A magnified view of the middle; Figure 9 and Figure 10 As shown: To facilitate electrical connection, in some other implementations of this embodiment, the flexible strip sub-segment 1 1 is provided with a first metal via 136 electrically connected vertically to the third signal line 111, and the flexible strip sub-segment 2 12 is provided with a second metal via electrically connected vertically to the fourth signal line 121; the second elastic conductor 132 is electrically connected to the third signal line 111 through the first metal via 136; and the third elastic conductor 133 is electrically connected to the fourth signal line 121 through the second metal via.

[0116] In this embodiment, the first interconnection structure 20 is not specifically limited. In some implementations of this embodiment, the first interconnection structure 20 is a first high-density connector; specifically, the signal ports on the measurement and control device 70 are connected to coaxial cables in a one-to-one correspondence, and the ends of the multiple coaxial cables away from the measurement and control device 70 are integrated on the second high-density connector. The first high-density connector and the second high-density connector are plugged together to achieve a one-to-one electrical connection between each first signal line in the first flexible strip line 10 and each coaxial cable, thereby achieving an electrical connection between the first flexible strip line 10 and the measurement and control device 70.

[0117] To improve the signal transmission quality of a microwave interconnect system, microwave components are typically arranged in the system. In some implementations of this embodiment, microwave components are integrated on the first flexible stripline 10. By directly arranging microwave components on the first flexible stripline 10, the integration level of the microwave interconnect system is further improved. For example, the microwave components include attenuators, filters, and the like.

[0118] Based on the same application concept, an embodiment of the present application further proposes a quantum computer, comprising a quantum chip 60, a measurement and control device 70, and at least one microwave interconnection system as described above electrically connected between the quantum chip 60 and the measurement and control device 70.

[0119] The quantum computer of the present application includes a microwave interconnection system, and therefore has the same beneficial effects as the above-mentioned microwave interconnection system, which will not be described in detail here.

[0120] Throughout this specification, references to terms such as "some embodiments" or "examples" indicate that the specific features, structures, materials, or characteristics described in conjunction with such embodiments or examples are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments. Furthermore, those skilled in the art may combine and reconcile the different embodiments or examples described in this specification.

[0121] The above description is merely a preferred embodiment of the present invention and does not limit the present invention in any way. Any person skilled in the art who, without departing from the scope of the present invention, makes any equivalent substitution, modification, or other variation to the technical solution and technical content disclosed herein shall be deemed to fall within the scope of the present invention and remain within the scope of protection of the present invention.

Claims

1. A microwave interconnection system, characterized in that: include: at least one first flexible strip line integrated with a plurality of first signal lines; a first interconnection structure for detachably electrically connecting one end of each of the first signal lines to a signal port of a measurement and control device outside the dilution refrigerator in a one-to-one correspondence; A sealing flange, a sealing sleeve provided on the first flexible strip line and used for sealing and detachably connecting to the room temperature plate of the dilution refrigerator; A plurality of clamping seats, clamped on the first flexible strip line, and used for being detachably connected to the cold plate of the dilution refrigerator in a one-to-one correspondence; The second interconnection structure is detachably connected to the other end of each of the first signal lines, and is used for electrically connecting to the signal ports of the quantum chip in a one-to-one correspondence.

2. The microwave interconnection system according to claim 1, wherein: The second interconnect structure comprises: A second stripline having a plurality of second signal lines integrated therein, wherein one end of each of the second signal lines is configured to be electrically connected to a signal port of the quantum chip in a one-to-one correspondence; a plurality of first elastic conductors disposed perpendicularly on the second stripline, wherein one end of each of the first elastic conductors is electrically connected to each of the second signal lines in a one-to-one correspondence; and the other end of each of the first elastic conductors is in contact with each of the first signal lines in a one-to-one correspondence; The crimping assembly is used to detachably crimp one end of the first flexible strip line to the second strip line so that the first elastic conductor is in close contact with the first signal line.

3. The microwave interconnection system according to claim 2, wherein: The crimping assembly comprises: first pressing plate; a second pressing plate, wherein a placement hole for sandwiching the first flexible strip line and the second strip line is formed between the first pressing plate and the second pressing plate; The first fixing member is used to detachably connect the first pressing plate and the second pressing plate so that one end of the first flexible strip line and the second strip line are detachably crimped.

4. The microwave interconnection system according to claim 3, wherein: The first pressing plate comprises: a first plate; At least two second plates perpendicular to the first plate and spaced apart, wherein the opposite sides of any two adjacent second plates are provided with first limiting grooves; Both ends of the second pressing plate are respectively arranged in the first limiting groove, and the placement hole is formed between the second pressing plate, the first plate body and any two second plate bodies.

5. The microwave interconnection system according to claim 1, wherein: Each of the first flexible strip lines comprises: A flexible strip sub-line segment 1 integrating a plurality of third signal lines, wherein one end of each of the third signal lines is detachably electrically connected to a signal port of a measurement and control device outside the dilution refrigerator in a one-to-one correspondence; a flexible strip sub-line segment 2 integrating a plurality of fourth signal lines; one end of each of the fourth signal lines being electrically connected to the other end of each of the third signal lines in a one-to-one correspondence, and the other end of each of the fourth signal lines being detachably electrically connected to the second interconnection structure; a third interconnection structure for electrically connecting one end of each of the fourth signal lines to the other end of each of the third signal lines in a one-to-one correspondence; The third interconnection structure is located in the 4K temperature zone of the dilution refrigerator; the third signal line is a copper-containing cable; and the fourth signal line is a superconducting cable.

6. The microwave interconnection system according to claim 5, characterized in that: The third interconnect structure comprises: a third stripline comprising a first dielectric layer and a plurality of conductive traces disposed within the first dielectric layer; a plurality of second elastic conductors, one end of each of the second elastic conductors being fixed to one end of each of the conductive traces in a one-to-one correspondence, and the other end of each of the second elastic conductors being configured to contact each of the third signal lines in a one-to-one correspondence; a plurality of third elastic conductors, one end of each of the third elastic conductors being fixed to the other end of each of the conductive traces in a one-to-one correspondence, and the other end of each of the third elastic conductors being configured to contact each of the fourth signal lines in a one-to-one correspondence; a second fixing member, for detachably connecting one end of the third strip line to the flexible strip sub-line segment; The third fixing member is used to detachably connect the other end of the third strip line to the second flexible strip sub-line segment.

7. The microwave interconnection system according to claim 6, characterized in that: The second elastic conductor and the third elastic conductor each include a spring pin.

8. The microwave interconnection system according to claim 1, wherein: The first interconnect structure is a first high-density connector.

9. The microwave interconnection system according to claim 6, wherein: A microwave component is integrated on the first signal line in the first flexible stripline.

10. A quantum computer, characterized in that: The invention comprises a quantum chip, a measurement and control device, and at least one microwave interconnection system according to any one of claims 1 to 9 electrically connected between the quantum chip and the measurement and control device.

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