Interconnection structure, quantum measurement and control circuit and quantum computer

Abstract

The utility model discloses an interconnection structure, a quantum measurement and control circuit and a quantum computer, which are used for electrically connecting a quantum chip with a first flexible strip line integrated with a plurality of first signal lines, and the interconnection structure comprises a second strip line integrated with a plurality of second signal lines, one end of each second signal line is used for being electrically connected with a signal port of a quantum chip in a one-to-one correspondence manner; the plurality of elastic conductors are vertically arranged on the second strip line, and one end of each elastic conductor is electrically connected with each second signal line in a one-to-one correspondence manner; the other ends of the elastic conductors are in contact with the first signal lines in a one-to-one correspondence manner; and the crimping assembly is used for detachably crimping one end of the first flexible strip line and the second strip line so as to enable the elastic conductor to be in close contact with the first signal line. The interconnection structure can realize reliable electric connection between the elastic conductor and the first signal line so as to ensure the reliability of electric connection between the first flexible strip line and the quantum chip.

Description

Technical Field

[0001] The utility model relates to the technical field of quantum computers, in particular to an interconnection structure, a quantum measurement and control circuit and a quantum computer. Background Art

[0002] In superconducting quantum computers, quantum chips must operate at extremely low temperatures, such as around 10 millikelvin (mK). This low temperature is typically maintained by a dilution refrigerator, where the quantum chip is mounted at the lowest temperature. To control and measure the quantum chip at this bottom layer, a circuit carrying quantum measurement and control signals must enter the dilution refrigerator, passing through the refrigerator's various cold plates and connecting to the quantum chip at the lowest temperature.

[0003] With the rapid growth in the number of qubits, the required measurement and control signal transmission lines (also known as quantum measurement and control circuits) have also increased, but the space inside the dilution refrigerator is generally limited. Currently, the signal transmission lines in the measurement and control signal transmission lines are generally coaxial cables. However, coaxial cables have the following disadvantages: their size will be difficult to achieve a larger scale and smaller design in the long term. With the development of flexible stripline, due to its small size and high integration, the use of flexible stripline to replace coaxial cables is becoming more and more popular. When using flexible stripline, it is very important to ensure the reliability of the electrical connection between the flexible stripline and the quantum chip.

[0004] It should be noted that the information disclosed in the background technology section of this application is only intended to deepen the understanding of the general background technology of this application, and should not be regarded as an admission or any form of implication that the information constitutes prior art already known to those skilled in the art. Utility Model Content

[0005] The purpose of the utility model is to provide an interconnection structure, a quantum measurement and control circuit and a quantum computer to ensure the reliability of the electrical connection between the flexible strip line and the quantum chip.

[0006] In order to achieve the above purpose, the present invention provides the following technical solutions:

[0007] A first aspect of the present invention provides an interconnection structure for electrically connecting a quantum chip to a first flexible stripline integrated with a plurality of first signal lines, the interconnection structure comprising:

[0008] A second stripline having a plurality of second signal lines integrated therein, wherein one end of each of the second signal lines is configured to be electrically connected to a signal port of the quantum chip in a one-to-one correspondence;

[0009] a plurality of elastic conductors disposed perpendicularly on the second stripline, wherein one end of each elastic conductor is electrically connected to each second signal line in a one-to-one correspondence; and the other end of each elastic conductor is in contact with each first signal line in a one-to-one correspondence;

[0010] The crimping assembly is used to detachably crimp one end of the first flexible strip line to the second strip line so that the elastic conductor is in close contact with the first signal line.

[0011] The interconnection structure as described above, further, the crimping assembly includes:

[0012] first pressing plate;

[0013] a second pressing plate, wherein a placement hole for sandwiching the first flexible strip line and the second strip line is formed between the first pressing plate and the second pressing plate;

[0014] The fixing member is used to detachably connect the first pressing plate and the second pressing plate so that one end of the first flexible strip line and the second strip line can be detachably crimped.

[0015] The interconnection structure as described above, further, the first pressing plate includes:

[0016] a first plate;

[0017] At least two second plates perpendicular to the first plate and spaced apart, wherein the opposite sides of any two adjacent second plates are provided with first limiting grooves;

[0018] Both ends of the second pressing plate are respectively arranged in the first limiting groove, and the placement hole is formed between the second pressing plate, the first plate body and any two second plate bodies.

[0019] As for the interconnection structure as described above, further, the dimension of the first limiting groove perpendicular to the direction of the second pressing plate is greater than the thickness of the second pressing plate.

[0020] The interconnection structure as described above, further, a second limiting groove is provided on a side of the first plate body opposite to the second pressing plate, and the second limiting groove matches the width of the first flexible strip line;

[0021] A third limiting groove is provided on a side of the second pressing plate opposite to the second plate body, and the third limiting groove matches the width of the second strip line.

[0022] As for the interconnection structure described above, further, the fixing member includes a screw and a spring sleeved on the screw, and one end of the spring contacts the first plate, and the other end of the spring contacts the second pressure plate.

[0023] In the interconnection structure as described above, further, the elastic conductor includes a spring pin.

[0024] In the interconnection structure as described above, further, the material of the second signal line includes superconducting material.

[0025] A second aspect of the present invention provides a quantum measurement and control circuit, comprising a first flexible stripline, a second stripline, and the above-mentioned interconnection structure, wherein the other end of the first flexible stripline is electrically connected to a signal source or a measuring device.

[0026] A third aspect of the present invention provides a quantum computer, comprising the above-mentioned quantum measurement and control circuit and quantum chip.

[0027] The beneficial effects of the present invention are:

[0028] The interconnection structure of the present application includes a second stripline integrated with multiple second signal lines and multiple elastic conductors. One end of each second signal line is used to electrically connect to the signal port of the quantum chip in a one-to-one correspondence, and one end of each elastic conductor is electrically connected to each second signal line in a one-to-one correspondence; the other end of each elastic conductor is in contact with each first signal line in a one-to-one correspondence. In this way, the quantum chip and the first flexible stripline in the measurement and control circuit are electrically connected through the second stripline and the elastic conductor. By providing a crimping assembly, one end of the first flexible stripline is detachably crimped to the second stripline so that the elastic conductor is in close contact with the first signal line, thereby ensuring the reliability of the electrical connection between the elastic conductor and the first signal line and the reliability of the electrical connection between the first flexible stripline and the quantum chip.

[0029] The quantum measurement and control circuit and quantum computer provided by the present invention include the above-mentioned interconnection structure, and therefore have the same beneficial effects, which will not be described in detail here. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 A schematic diagram of the structure of the interconnection structure provided in the embodiment of the present utility model in use;

[0031] Figure 2 A schematic diagram of the structure of the connection between the second strip line and the elastic conductor provided by an embodiment of the present utility model;

[0032] Figure 3 A schematic structural diagram of a crimping assembly provided in an embodiment of the present utility model;

[0033] Figure 4 A schematic diagram of the structure of a quantum measurement and control circuit provided in an embodiment of the present utility model;

[0034] In the accompanying drawings, 10, first flexible strip line; 20, second strip line; 21, second signal line; 22, dielectric layer; 30, crimping assembly; 31, first pressure plate; 311, first plate body; 312, second plate body; 312a, first limiting groove; 32, second pressure plate; 33, fixing part; 40, quantum chip; 50, signal source; 60, elastic conductor. DETAILED DESCRIPTION

[0035] In order to enable those skilled in the art to better understand the technical solutions in this application, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the drawings in the embodiments of this application. Obviously, the described embodiments are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative work should fall within the scope of protection of this application. The embodiments described below with reference to the drawings are exemplary and are only used to explain this application, and cannot be interpreted as limiting this application.

[0036] In the description of the present invention, it should be understood that the terms "center", "up", "down", "left", "right", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present invention.

[0037] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include one or more of such features. In the description of this utility model, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0038] Figure 1 A schematic diagram of the structure of the interconnection structure provided in the embodiment of the present utility model in use; Figure 2 Schematic diagram of the structure of the second strip line 20 connected to the elastic conductor 60 provided in an embodiment of the present invention; Figure 1 and Figure 2 As shown: The embodiment of the present application discloses an interconnection structure for electrically connecting a quantum chip 40 with a first flexible strip line 10 integrated with multiple first signal lines, the interconnection structure comprising:

[0039] The second strip line 20 is integrated with a plurality of second signal lines 21 , and one end of each second signal line 21 is used for electrically connecting to a signal port of the quantum chip 40 in a one-to-one correspondence.

[0040] A plurality of elastic conductors 60 are vertically disposed on the second strip line 20 , one end of each elastic conductor 60 is electrically connected to each second signal line 21 in a one-to-one correspondence; the other end of each elastic conductor 60 is in contact with each first signal line in a one-to-one correspondence.

[0041] The crimping assembly 30 is used to detachably crimp one end of the first flexible strip line 10 to the second strip line 20 so that the elastic conductor 60 is in close contact with the first signal line.

[0042] The interconnect structure of the present application includes a second stripline 20 integrated with multiple second signal lines 21 and multiple elastic conductors 60. One end of each second signal line 21 is used to electrically connect to the signal port of the quantum chip 40 in a one-to-one correspondence, and one end of each elastic conductor 60 is electrically connected to each second signal line 21 in a one-to-one correspondence; the other end of each elastic conductor 60 is in contact with each first signal line in a one-to-one correspondence, so that the quantum chip 40 and the first flexible stripline 10 in the measurement and control circuit are electrically connected through the second stripline 20 and the elastic conductor 60. By providing a crimping assembly 30, one end of the first flexible stripline 10 is detachably crimped to the second stripline 20 so that the elastic conductor 60 is in close contact with the first signal line, ensuring the reliability of the electrical connection between the elastic conductor 60 and the first signal line and the reliability of the electrical connection between the first flexible stripline 10 and the quantum chip 40.

[0043] In this embodiment, the structure of the quantum chip 40 is not specifically limited. In order to facilitate the electrical connection between the second signal line 21 and the signal port of the quantum chip 40, multiple signal ports of the quantum chip 40 electrically connected to multiple second signal lines 21 in the same second strip line 20 are arranged in an array along the same direction.

[0044] In this embodiment, the second strip line 20 may be flexible or not.

[0045] To improve the reliability of the electrical connection between the first flexible stripline 10 and the quantum chip 40, three aspects can be considered: first, improving the anti-interference capability of the second stripline 20 in the interconnection structure; second, improving the reliability of the electrical connection between the quantum chip 40 and the second stripline 20 in the interconnection structure; and third, improving the reliability of the electrical connection between the first signal line in the first flexible stripline 10 and the elastic conductor 60 in the interconnection structure.

[0046] Regarding the first point: Continue as Figure 2As shown: In this embodiment, the second stripline 20 further includes a dielectric layer 22, and the plurality of second signal lines 21 are arranged at intervals within the dielectric layer 22, thereby avoiding mutual interference between the plurality of second signal lines 21; further, a metal shielding layer is provided on the outer wall of the dielectric layer 22. By providing the metal shielding layer, external signal interference is reduced, and the signal quality transmitted by the second signal line 21 in the second stripline 20 is ensured, thereby improving the stability and reliability of the electrical connection.

[0047] Regarding the second point: In this embodiment, there is no specific limitation on the electrical connection method between the second signal line 21 in the second strip line 20 and the signal port in the quantum chip 40. In order to improve the reliability of the electrical connection between the quantum chip 40 and the interconnection structure, one end of the second signal line 21 in the interconnection structure can be welded to the signal port of the quantum chip 40. In order to further improve the reliability of the electrical connection, one end of the second signal line 21 can be welded to the signal port of the quantum chip 40 through an indium column.

[0048] Regarding the third point—improving the reliability of the electrical connection between the first signal line in the first flexible stripline 10 and the elastic conductor 60 in the interconnection structure—the following is a detailed description.

[0049] In order to improve the reliability of the electrical connection between the first signal line in the first flexible stripline 10 and the elastic conductor 60 in the interconnection structure, Figure 3 A schematic structural diagram of a crimping assembly 30 provided in an embodiment of the present invention; Figure 3 As shown: In some implementations of this embodiment, the crimping assembly 30 includes: a first pressing plate 31; a second pressing plate 32, wherein a placement hole for clamping the first flexible strip line 10 and the second strip line 20 is formed between the first pressing plate 31 and the second pressing plate 32; a fixing member 33, which is used to detachably connect the first pressing plate 31 and the second pressing plate 32 so that one end of the first flexible strip line 10 and the second strip line 20 can be detachably crimped.

[0050] The first flexible strip line 10 and the second strip line 20 are clamped together by the first pressing plate 31 and the second pressing plate 32, and the first pressing plate 31 and the second pressing plate 32 are detachably connected by the fixing member 33 so that one end of the first flexible strip line 10 and the second strip line 20 can be detachably crimped together, thereby making the elastic conductor 60 and the first signal line in close contact, thereby achieving a reliable electrical connection between the first flexible strip line 10 and the interconnection structure.

[0051] In this embodiment, the structure of the first pressing plate 31 is not particularly limited and may be a square pressing plate or other shapes.

[0052] In order to improve the reliability of the electrical connection between the first signal line in the first flexible stripline 10 and the elastic conductor 60 in the interconnection structure, Figure 3 As shown in some implementations of this embodiment, the first pressing plate 31 includes: a first plate 311; at least two second plates 312 arranged perpendicular to the first plate 311 and spaced apart; first limiting grooves 312a are defined on the opposing sides of any two adjacent second plates 312; and both ends of the second pressing plate 32 are disposed within the first limiting grooves 312a. The placement holes are formed between the second pressing plate 32, the first plate 311, and any two second plates 312. This configuration of the first pressing plate 31 facilitates defining the positions of the first flexible stripline 10 and the second stripline 20, thereby facilitating reliable crimping of the first signal line in the first flexible stripline 10 and the elastic conductor 60 on the second stripline 20, thereby improving electrical connection reliability.

[0053] In this embodiment, the number of second plates 312 in the first pressure plate 31 is not specifically limited. For example, it can be two, three, or more. When two second plates 312 are provided, one first flexible stripline 10 can be electrically connected to the quantum chip 40. When three second plates 312 are provided, two first flexible striplines 10 can be electrically connected to the quantum chip 40.

[0054] In order to improve the reliability of the electrical connection between the first signal line in the first flexible stripline 10 and the elastic conductor 60 in the interconnection structure, in some implementations of this embodiment, the dimension of the first limiting groove 312a perpendicular to the second pressing plate 32 is greater than the thickness of the second pressing plate 32. In this way, the size of the placement hole can be adjusted to ensure that the first signal line and the elastic conductor 60 are tightly crimped, thereby improving the reliability of the electrical connection between the first flexible stripline 10 and the interconnection structure. At the same time, the crimping assembly 30 can also be applied to first flexible striplines 10 and second striplines 20 of different thicknesses.

[0055] In order to improve the reliability of the electrical connection between the first signal line in the first flexible stripline 10 and the elastic conductor 60 in the interconnection structure, in some implementations of this embodiment, a second limiting groove is provided on the side of the first plate 311 opposite to the second pressure plate 32, and the second limiting groove matches the width of the first flexible stripline 10; a third limiting groove is provided on the side of the second pressure plate 32 opposite to the second plate 312, and the third limiting groove matches the width of the second stripline 20.

[0056] The second limiting groove is provided to limit the position of the first flexible stripline 10, and the third limiting groove is provided to limit the position of the second stripline 20. The first limiting groove 312a defines the relative positions of the first pressing plate 31 and the second pressing plate 32. This facilitates one-to-one alignment and contact between the first signal lines on the first flexible stripline 10 and the elastic conductors 60 on the second stripline 20, thereby improving the reliability of the electrical connection between the first flexible stripline 10 and the interconnection structure.

[0057] In this embodiment, the fixing member 33 is not specifically limited. To improve the reliability of the electrical connection between the first signal line in the first flexible stripline 10 and the elastic conductor 60 in the interconnect structure, in some implementations of this embodiment, the fixing member 33 includes a screw and a spring sleeved on the screw, with one end of the spring contacting the first plate 311 and the other end of the spring contacting the second pressure plate 32. The fixing member 33 in this embodiment, by providing the spring, can achieve elastic compression of the first flexible stripline 10 and the second stripline 20, thereby improving the reliability of the electrical connection.

[0058] In this embodiment, the type of elastic conductor 60 is not specifically limited. In some implementations of this embodiment, the elastic conductor 60 comprises pogo pins. The use of pogo pins ensures the stability and reliability of the electrical connection between the first flexible stripline 10 and the interconnect structure. Furthermore, the end faces of the pogo pins that contact the second signal line 21 are curved. This curved end face reduces physical damage to the second signal line 21 and increases the contact area, thereby improving the signal line's connection stability and conduction efficiency.

[0059] Typically, the quantum chip 40 needs to operate in an extremely low temperature environment to maintain the stability of its quantum state. In order to prevent the heat generated by the second strip when transmitting signals from interfering with the extremely low temperature environment of the quantum chip 40, in some implementations of this embodiment, the material of the second signal line 21 includes a superconducting material, such as niobium titanium. By using superconducting materials, the second signal line 21 does not generate resistance when transmitting signals, and therefore does not generate heat, thereby avoiding interference with the extremely low temperature environment.

[0060] Figure 4 A schematic diagram of the structure of a quantum measurement and control circuit provided in an embodiment of the present utility model; Figure 4 As shown: Based on the same application concept, the embodiment of the present application also proposes a quantum measurement and control circuit, including a first flexible strip line 10, a second strip line 20 and the above-mentioned interconnection structure, and the other end of the first flexible strip line 10 is electrically connected to a signal source 50 or a measuring device.

[0061] The quantum measurement and control circuit of the present application includes an interconnection structure, and therefore has the same beneficial effects as the above-mentioned interconnection structure, which will not be repeated here.

[0062] In this embodiment, the other end of the first flexible stripline 10 may be electrically connected to the signal source 50 or the measuring device via a coaxial cable. Specifically, the first flexible stripline 10 and the coaxial cable are connected via a signal connector.

[0063] Based on the same application concept, an embodiment of the present application also proposes a quantum computer, including at least one of the above-mentioned quantum measurement and control circuits and a quantum chip 40.

[0064] The quantum computer of the present application includes a quantum measurement and control circuit, and therefore has the same beneficial effects as the above-mentioned quantum measurement and control circuit, which will not be repeated here.

[0065] Throughout this specification, references to terms such as "some embodiments" or "examples" indicate that the specific features, structures, materials, or characteristics described in conjunction with such embodiments or examples are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments. Furthermore, those skilled in the art may combine and reconcile the different embodiments or examples described in this specification.

[0066] The above description is merely a preferred embodiment of the present invention and does not limit the present invention in any way. Any person skilled in the art who, without departing from the scope of the present invention, makes any equivalent substitution, modification, or other variation to the technical solution and technical content disclosed herein shall be deemed to fall within the scope of the present invention and remain within the scope of protection of the present invention.

Claims

1. An interconnection structure for electrically connecting a quantum chip to a first flexible strip line integrated with a plurality of first signal lines, characterized in that: The interconnect structure comprises: A second stripline having a plurality of second signal lines integrated therein, wherein one end of each of the second signal lines is configured to be electrically connected to a signal port of the quantum chip in a one-to-one correspondence; a plurality of elastic conductors disposed perpendicularly on the second stripline, wherein one end of each elastic conductor is electrically connected to each second signal line in a one-to-one correspondence; and the other end of each elastic conductor is in contact with each first signal line in a one-to-one correspondence; The crimping assembly is used to detachably crimp one end of the first flexible strip line to the second strip line so that the elastic conductor is in close contact with the first signal line.

2. The interconnection structure according to claim 1, wherein: The crimping assembly comprises: first pressing plate; a second pressing plate, wherein a placement hole for sandwiching the first flexible strip line and the second strip line is formed between the first pressing plate and the second pressing plate; The fixing member is used to detachably connect the first pressing plate and the second pressing plate so that one end of the first flexible strip line and the second strip line can be detachably crimped.

3. The interconnection structure according to claim 2, wherein: The first pressing plate comprises: a first plate; At least two second plates perpendicular to the first plate and spaced apart, wherein the opposite sides of any two adjacent second plates are provided with first limiting grooves; Both ends of the second pressing plate are respectively arranged in the first limiting groove, and the placement hole is formed between the second pressing plate, the first plate body and any two second plate bodies.

4. The interconnection structure according to claim 3, wherein: A dimension of the first limiting groove perpendicular to a direction of the second pressing plate is greater than a thickness of the second pressing plate.

5. The interconnection structure according to claim 3, wherein: A second limiting groove is provided on the side of the first plate body opposite to the second pressing plate, and the second limiting groove matches the width of the first flexible strip line; A third limiting groove is provided on a side of the second pressing plate opposite to the second plate body, and the third limiting groove matches the width of the second strip line.

6. The interconnection structure according to any one of claims 3 to 5, characterized in that: The fixing member includes a screw and a spring sleeved on the screw, one end of the spring contacts the first plate, and the other end of the spring contacts the second pressing plate.

7. The interconnection structure according to claim 1, wherein: The elastic conductor includes a pogo pin.

8. The interconnection structure according to claim 1, wherein: The second signal line is made of a superconducting material.

9. A quantum measurement and control circuit, characterized in that: The device comprises a first flexible stripline, a second stripline, and the interconnection structure according to any one of claims 1 to 8, wherein the other end of the first flexible stripline is electrically connected to a signal source or a measuring device.

10. A quantum computer, characterized in that: It comprises at least one quantum measurement and control circuit and quantum chip as claimed in claim 9.

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