Copper bar assembly and overcurrent protection circuit

Abstract

The utility model discloses a copper bar assembly and an overcurrent protection circuit. The copper bar assembly comprises a first copper bar, a second copper bar and at least one switch chip integrated between the first copper bar and the second copper bar. The switch chip comprises a driving signal end, a driving signal reference end and an input reference end; the driving signal end leads out the copper bar assembly through a driving signal leading-out wire, the driving signal reference end leads out the copper bar assembly through a driving signal reference leading-out wire, and the input reference end leads out the copper bar assembly through an input reference leading-out wire. A switch chip is integrated between the first copper bar and the second copper bar to replace a mechanical relay, so that the arrangement size of the internal structure of the whole machine can be reduced.

Description

Technical Field

[0001] The utility model relates to the field of circuit devices, in particular to a copper busbar assembly and an overcurrent protection circuit. Background Art

[0002] The existing technology mostly uses copper bars to connect relays, and realizes the disconnection and conduction of the high-voltage circuit by controlling the relays.

[0003] The existing method of connecting relays with copper bars is to directly crimp the copper bars onto the mechanical relays with bolts. This method is complex to install, requires a large layout space, and requires numerous wiring harnesses, which is not conducive to miniaturization and wirelessization of the controller. Utility Model Content

[0004] The utility model provides a copper busbar assembly and an overcurrent protection circuit. Switch chips are integrated between the copper busbars to replace mechanical relays, thereby reducing the layout size of the internal structure of the entire machine.

[0005] In a first aspect, an embodiment of the present invention provides a copper busbar assembly, comprising: a first copper busbar, a second copper busbar, and at least one switch chip integrated between the first copper busbar and the second copper busbar;

[0006] The switch chip includes a drive signal terminal, a drive signal reference terminal and an input reference terminal;

[0007] The driving signal end is led out of the copper busbar assembly through a driving signal lead-out line, the driving signal reference end is led out of the copper busbar assembly through a driving signal reference lead-out line, and the input reference end is led out of the copper busbar assembly through an input reference lead-out line.

[0008] Optionally, there is an overlapping area between the first copper bar and the second copper bar in a first direction, and the first direction is perpendicular to the plane where the first copper bar and the second copper bar are located;

[0009] The switch chip is integrated in the overlapping area, and the copper busbar assembly further includes an insulating material filled between the first copper busbar, the second copper busbar and the switch chip.

[0010] Optionally, the arrangement area of ​​the insulating material is larger than the area of ​​the overlapping region.

[0011] Optionally, the driving signal reference terminal is electrically connected to the first copper busbar, and the input reference terminal is electrically connected to the second copper busbar.

[0012] Optionally, the drive signal lead wire is electrically connected to the drive signal terminal, the drive signal reference lead wire is electrically connected to the drive signal reference terminal, and the input reference lead wire is electrically connected to the input reference terminal.

[0013] Optionally, the drive signal lead is electrically connected to the drive signal terminal, the drive signal reference lead is electrically connected to the drive signal reference terminal through the first copper bus, and the input reference lead is electrically connected to the input reference terminal through the second copper bus.

[0014] Optionally, the switch chip includes an insulated gate bipolar transistor;

[0015] The driving signal terminal includes a gate of the insulated gate bipolar transistor, the driving signal reference terminal includes an emitter of the insulated gate bipolar transistor, and the input reference terminal includes a collector of the insulated gate bipolar transistor.

[0016] Optionally, the switch chip includes a metal-oxide-semiconductor field-effect transistor;

[0017] The driving signal terminal includes the gate of the metal-oxide-semiconductor field effect transistor, the input reference terminal includes the source of the metal-oxide-semiconductor field effect transistor, and the input reference terminal includes the drain of the metal-oxide-semiconductor field effect transistor.

[0018] Optionally, the switch chip is integrated between the first copper busbar and the second copper busbar by using a welding process or a wire bonding process.

[0019] In a second aspect, an embodiment of the present invention further provides an overcurrent protection circuit, comprising a copper busbar assembly as described in any embodiment of the first aspect.

[0020] The embodiment of the present utility model discloses a copper busbar assembly and an overcurrent protection circuit, wherein a switch chip is integrated between a first copper busbar and a second copper busbar to replace a mechanical relay, thereby reducing the layout size of the internal structure of the entire machine. Since the drive signal end leads out of the copper busbar assembly through a drive signal lead-out line, the drive signal reference end leads out of the copper busbar assembly through a drive signal reference lead-out line, and the input reference end leads out of the copper busbar assembly through an input reference lead-out line, the switch state and the switch process of the switch chip can be controlled by applying a drive voltage and a drive current to the drive signal lead-out line and the drive signal reference lead-out line. The relationship between the voltage drop and the current of the switch chip in the on state can also be utilized, and the current can be obtained by detecting the voltage of the drive signal reference lead-out line and the input reference lead-out line, and overcurrent protection can be performed in an emergency.

[0021] It should be understood that the content described in this section is not intended to identify the key or important features of the embodiments of the present invention, nor is it intended to limit the scope of the present invention. Other features of the present invention will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0023] Figure 1 The present invention provides a schematic cross-sectional structure diagram of a copper busbar assembly according to an embodiment of the present invention. DETAILED DESCRIPTION

[0024] In order to help those skilled in the art better understand the present invention, the following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of the present invention.

[0025] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0026] Figure 1 A schematic cross-sectional view of a copper busbar assembly provided by the present invention is provided. Figure 1 The copper busbar assembly includes: a first copper busbar 1, a second copper busbar 2, and at least one switch chip 3 integrated between the first copper busbar 1 and the second copper busbar 2. In the embodiment of the present invention, the switch chip 3 includes a drive signal terminal, a drive signal reference terminal, and an input reference terminal (the drive signal terminal, the drive signal reference terminal, and the input reference terminal are not shown in FIG. Figure 1 The driving signal end is led out of the copper busbar assembly through the driving signal lead wire 4, the driving signal reference end is led out of the copper busbar assembly through the driving signal reference lead wire 5, and the input reference end is led out of the copper busbar assembly through the input reference lead wire 6.

[0027] The switch chip 3 may include a power switch chip. Current conduction between the first copper busbar 1 and the second copper busbar 2 requires the switch chip 3 to be turned on. The number of switch chips 3 can be determined based on the rated parameters of the output current capability of the switch chip 3 itself and the current carrying capacity of the copper busbar assembly. Therefore, one switch chip 3 or multiple switch chips 3 can be selected and connected in parallel between the first copper busbar 1 and the second copper busbar 2. Figure 1 FIG. 3 shows a situation where two switch chips 3 are connected in parallel between the first copper bus 1 and the second copper bus 2 .

[0028] The embodiment of the present invention integrates a switch chip between the first copper bar 1 and the second copper bar 2 to replace a mechanical relay, thereby reducing the layout size of the internal structure of the entire machine. Since the drive signal end leads out the copper bar assembly through the drive signal lead wire 4, the drive signal reference end leads out the copper bar assembly through the drive signal reference lead wire 5, and the input reference end leads out the copper bar assembly through the input reference lead wire 6, by applying a drive voltage and a drive current to the two lead wires of the drive signal lead wire 4 and the drive signal reference lead wire 5, it is possible to control the switching state and the switching process of the switch chip 3. It is also possible to utilize the relationship between the voltage drop and the current of the switch chip 3 in the on state, by detecting the voltage of the two lead wires of the drive signal reference lead wire 5 and the input reference lead wire 6, thereby knowing the current, and performing overcurrent protection in an emergency.

[0029] Optionally, based on the above embodiment, continue to refer to Figure 1 In the embodiment of the present invention, an overlapping region exists between the first copper busbar 1 and the second copper busbar 2 in a first direction x, which is perpendicular to the plane in which the first copper busbar 1 and the second copper busbar 2 lie. The switch chip 3 is integrated within the overlapping region, and the copper busbar assembly further includes an insulating material 7 filled between the first copper busbar 1, the second copper busbar 2, and the switch chip 3.

[0030] In the embodiment of the present invention, the insulating material 7 is filled between the first copper bus 1 , the second copper bus 2 and the switch chip 3 to ensure electrical safety between the copper buses.

[0031] Optionally, based on the above embodiment, the arrangement area of ​​the insulating material 7 in the embodiment of the present utility model is larger than the area of ​​the overlapping area.

[0032] In the embodiment of the present invention, the overlapping area of ​​the first copper busbar 1 and the second copper busbar 2, except for the part integrating the switch chip 3, is isolated by the insulating material 7. The layout area of ​​the insulating material 7 is larger than the area of ​​the overlapping area, which can further ensure the electrical safety between the copper buses.

[0033] Optionally, based on the above embodiment, the driving signal reference terminal in the embodiment of the present utility model is electrically connected to the first copper bus 1 , and the input reference terminal is electrically connected to the second copper bus 2 .

[0034] In the embodiment of the present invention, since the drive signal reference end is electrically connected to the first copper bus 1 and the input reference end is electrically connected to the second copper bus 2, the heat consumption generated by the switch chip 3 during operation can be dissipated through the first copper bus 1 and the second copper bus 2, the junction temperature is controllable and the service life is long.

[0035] Optionally, based on the above embodiment, the drive signal lead line 4 in the embodiment of the utility model is electrically connected to the drive signal end, the drive signal reference lead line 5 is electrically connected to the drive signal reference end, and the input reference lead line 6 is electrically connected to the input reference end.

[0036] Optionally, based on the above embodiment, the drive signal lead line 4 in the embodiment of the utility model is electrically connected to the drive signal end, the drive signal reference lead line 5 is electrically connected to the drive signal reference end through the first copper bus 1, and the input reference lead line 6 is electrically connected to the input reference end through the second copper bus 2.

[0037] The embodiment of the present invention can monitor the conduction state of the switch chip 3 by identifying the voltage between the first copper busbar 1 and the second copper busbar 2. It can also detect the current of the copper busbar assembly without using a current sensor, and can be combined with a hardware circuit to achieve overcurrent protection.

[0038] Optionally, based on the above embodiment, the switch chip 3 in the embodiment of the present invention includes an insulated gate bipolar transistor. The drive signal terminal includes the gate of the insulated gate bipolar transistor, the drive signal reference terminal includes the emitter of the insulated gate bipolar transistor, and the input reference terminal includes the collector of the insulated gate bipolar transistor.

[0039] Optionally, based on the above embodiment, the switch chip 3 in the embodiment of the present invention includes a metal-oxide-semiconductor field-effect transistor. The drive signal terminal includes the gate of the metal-oxide-semiconductor field-effect transistor, the input reference terminal includes the source of the metal-oxide-semiconductor field-effect transistor, and the input reference terminal includes the drain of the metal-oxide-semiconductor field-effect transistor.

[0040] Optionally, based on the above embodiment, the switch chip 3 in the embodiment of the present invention is integrated between the first copper bus 1 and the second copper bus 2 by using a welding process or a wire bonding process.

[0041] Among them, the welding process includes tin welding and laser welding.

[0042] It can be understood that when the switch chip 3 is integrated between the first copper bus 1 and the second copper bus 2 using the bonding wire process, the first copper bus 1 and the second copper bus 2 are located in the same plane, and the drive signal reference end of the switch chip 3 is connected to the first copper bus 1 through a conductive bonding wire, and the input reference end of the switch chip 3 is connected to the second copper bus 2 through a conductive bonding wire.

[0043] The utility model embodiment integrates a switch chip between the first copper bar 1 and the second copper bar 2 to replace a mechanical relay, which can reduce the layout size of the entire internal structure. Since the drive signal end leads the copper bar assembly through the drive signal lead wire 4, the drive signal reference end leads the copper bar assembly through the drive signal reference lead wire 5, and the input reference end leads the copper bar assembly through the input reference lead wire 6, so by applying a driving voltage and a driving current to the two lead wires of the drive signal lead wire 4 and the drive signal reference lead wire 5, it is possible to control the switch state and the switching process of the switch chip 3. The relationship between the voltage drop and the current of the switch chip 3 in the on-state can also be utilized, by detecting the voltage of the two lead wires of the drive signal reference lead wire 5 and the input reference lead wire 6, thereby knowing the current, and overcurrent protection can be performed in an emergency. The overlapping area of ​​the first copper bar 1 and the second copper bar 2, except the part of the integrated switch chip 3, is all isolated using an insulating material 7. The layout area of ​​the insulating material 7 is greater than the area of ​​the overlapping area, which can further ensure the electrical safety between the copper bars. Since the drive signal reference terminal is electrically connected to the first copper busbar 1 and the input reference terminal is electrically connected to the second copper busbar 2, the heat generated by the switch chip 3 during operation can be dissipated through the first copper busbar 1 and the second copper busbar 2, which makes the junction temperature controllable and prolongs the service life. By identifying the voltage between the first copper busbar 1 and the second copper busbar 2, the conduction state of the switch chip 3 can be monitored. The current of the copper busbar assembly can also be detected without using a current sensor, and overcurrent protection can be implemented with hardware circuits.

[0044] An embodiment of the present utility model further provides an overcurrent protection circuit, comprising the copper busbar assembly of any of the above embodiments.

[0045] Since the overcurrent protection circuit provided by the embodiment of the present invention includes the copper busbar assembly of any of the above embodiments, it has the same beneficial effects. For the contents not described in detail in this embodiment, reference can be made to the copper busbar assembly provided by the above embodiments.

[0046] The above specific embodiments do not limit the scope of protection of this utility model. Those skilled in the art will appreciate that various modifications, combinations, sub-combinations, and substitutions may be made based on design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model shall be included within the scope of protection of this utility model.

Claims

1. A copper busbar assembly, characterized in that: include: A first copper bar, a second copper bar, and at least one switch chip integrated between the first copper bar and the second copper bar; The switch chip includes a drive signal terminal, a drive signal reference terminal and an input reference terminal; The driving signal end is led out of the copper busbar assembly through a driving signal lead-out line, the driving signal reference end is led out of the copper busbar assembly through a driving signal reference lead-out line, and the input reference end is led out of the copper busbar assembly through an input reference lead-out line.

2. The copper busbar assembly according to claim 1, characterized in that: There is an overlapping area between the first copper bar and the second copper bar in a first direction, and the first direction is perpendicular to the plane where the first copper bar and the second copper bar are located; The switch chip is integrated in the overlapping area, and the copper busbar assembly further includes an insulating material filled between the first copper busbar, the second copper busbar and the switch chip.

3. The copper busbar assembly according to claim 2, characterized in that: The arrangement area of ​​the insulating material is larger than the area of ​​the overlapping region.

4. The copper busbar assembly according to claim 1, characterized in that: The driving signal reference terminal is electrically connected to the first copper busbar, and the input reference terminal is electrically connected to the second copper busbar.

5. The copper busbar assembly according to claim 4, characterized in that: The driving signal lead-out line is electrically connected to the driving signal terminal, the driving signal reference lead-out line is electrically connected to the driving signal reference terminal, and the input reference lead-out line is electrically connected to the input reference terminal.

6. The copper busbar assembly according to claim 4, characterized in that: The drive signal lead is electrically connected to the drive signal terminal, the drive signal reference lead is electrically connected to the drive signal reference terminal through the first copper bus, and the input reference lead is electrically connected to the input reference terminal through the second copper bus.

7. The copper busbar assembly according to claim 1, characterized in that: The switch chip includes an insulated gate bipolar transistor; The driving signal terminal includes a gate of the insulated gate bipolar transistor, the driving signal reference terminal includes an emitter of the insulated gate bipolar transistor, and the input reference terminal includes a collector of the insulated gate bipolar transistor.

8. The copper busbar assembly according to claim 1, characterized in that: The switch chip includes a metal-oxide-semiconductor field-effect transistor; The driving signal terminal includes the gate of the metal-oxide-semiconductor field effect transistor, the input reference terminal includes the source of the metal-oxide-semiconductor field effect transistor, and the input reference terminal includes the drain of the metal-oxide-semiconductor field effect transistor.

9. The copper busbar assembly according to claim 1, characterized in that: The switch chip is integrated between the first copper busbar and the second copper busbar by using a welding process or a wire bonding process.

10. An overcurrent protection circuit, characterized in that: The copper busbar assembly comprises the copper busbar assembly according to any one of claims 1 to 9.

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