Reflow soldering clamp for epoxy resin injection molding module radiator

Abstract

The utility model relates to the technical field of reflow soldering process, in particular to a reflow soldering clamp for an epoxy resin injection molding module radiator, which comprises a plurality of radiator mounting positions distributed on a reflow carrier and corresponding to the shape of an inverted radiator; the heightening clamp is positioned above the backflow clamp; the heightening clamp is provided with a welding through hole above the radiator mounting position; the depth of the welding through hole corresponds to the welding height of the epoxy resin injection molding module and the radiator. In order to solve the problems that in the prior art, in the welding process of a radiator, inclination and inconsistent height possibly occur, and then follow-up device installation and heat dissipation are affected, in the scheme, a specific heightening clamp is designed in a reflow soldering clamp, and the two faces of the heightening clamp abut against the radiator and an epoxy resin injection molding module respectively; the parallel welding process is achieved by raising the plane of the clamp, meanwhile, the welding height is fixed by controlling the depth of the welding through hole, and the good welding yield is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of reflow soldering technology, in particular to a reflow soldering fixture for an epoxy resin injection molding module radiator. Background Art

[0002] Reflow soldering is a soldering process that remelts the solder paste pre-dispensed onto the printed circuit board pads to achieve mechanical and electrical connections between the terminals or leads of surface mount components and the printed circuit board pads. Typically, to achieve higher soldering efficiency, high-temperature gas is reflowed in the soldering chamber to maintain a high soldering ambient temperature, thereby melting the solder.

[0003] Epoxy resin injection molded modules are structures formed through the injection molding process using epoxy resin molding compound as raw material. Due to its excellent dielectric properties, it is widely used in the semiconductor field in packaging processes, especially as a packaging structure for discrete power devices.

[0004] In the prior art, after a power device, such as an IGBT, is prepared through processes such as photolithography and evaporation, it is usually placed in a packaging structure. For example, the device is soldered to a substrate, and then the electrodes of the device are led out through solder joints or gold wires and connected to the pins of the packaging structure. Then, epoxy resin is injected into the substrate through an injection molding process and cured to wrap the substrate and the power device to form an epoxy resin injection molding module.

[0005] Epoxy resin injection molded modules typically have good physical properties. However, as the voltage rating and power of power devices continue to rise, significant heat buildup occurs in the devices and packages. To prevent device burnout due to excessive temperatures, a heat dissipation structure, such as heat sink fins produced through aluminum extrusion, is often required on the epoxy resin injection molded module. Brazing is often used as the connection method between epoxy resin injection molded modules and heat sinks due to its excellent thermal conductivity and low production cost.

[0006] However, during the actual implementation process, the inventors found that in the reflow soldering of the heat sink of the traditional power module package, the welding module size is smaller than the welding surface size, but the epoxy resin injection molded module cannot be reflow soldered due to the epoxy resin part, and the welding stress of the solder is very large under the high-temperature operating environment. The flat heat sink cannot guarantee the welding quality and height of the module, thereby affecting the yield. Utility Model Content

[0007] In view of the above problems existing in the prior art, a reflow soldering fixture for an epoxy resin injection molded module heat sink is provided.

[0008] The specific technical solutions are as follows:

[0009] A reflow soldering fixture for an epoxy resin injection molded module heat sink, comprising a reflow carrier and a padding fixture;

[0010] The reflow carrier is provided with a plurality of radiator mounting positions corresponding to the shape of an inverted radiator;

[0011] The padding fixture is located above the reflux fixture;

[0012] The raising fixture is provided with a welding through hole above the radiator installation position;

[0013] The depth of the welding through hole corresponds to the welding height between the epoxy resin injection molding module and the heat sink.

[0014] On the other hand, it also includes:

[0015] Limit frame;

[0016] The limiting frame is provided with a plurality of limiting holes corresponding to the resin injection molding module;

[0017] The reflow carrier, the raising fixture and the limiting frame are vertically assembled;

[0018] The radiator mounting position, the welding through hole and the limiting hole are aligned.

[0019] On the other hand, the reflux carrier is in the shape of an elongated strip;

[0020] The upper surface of the reflow carrier is provided with a plurality of radiator mounting positions along the long axis direction;

[0021] A spacing block is provided between each of the radiator installation positions;

[0022] The spacer block is in a convex shape;

[0023] The spacer blocks are distributed along the short axis direction of the reflux carrier.

[0024] On the other hand, the spacing block includes a positioning block;

[0025] The positioning block is provided with a first positioning hole;

[0026] The position of the raising fixture corresponding to the first positioning hole is provided with a second positioning hole;

[0027] A third positioning hole is provided on the limiting frame at a position corresponding to the second positioning hole;

[0028] The first positioning hole, the second positioning hole and the third positioning hole are connected by positioning posts.

[0029] On the other hand, the positioning blocks are arranged at intervals.

[0030] On the other hand, the reflux carrier includes a first plane and a second plane arranged parallel to the long axis direction;

[0031] The second plane is higher than the first plane;

[0032] The radiator mounting positions are distributed on the second plane;

[0033] The raising fixture includes a first cushion block and a second cushion block;

[0034] The first cushion block is arranged above the first plane;

[0035] The second pad is arranged to fit the side of the second plane.

[0036] On the other hand, the raising fixture has a grid-like structure;

[0037] The grid-like structure matches the reflux carrier in a top-view direction;

[0038] The welding through holes are distributed at positions of the grid structure corresponding to the radiator mounting holes;

[0039] The first cushion block and the second cushion block are arranged parallel to the long axis direction of the raising fixture;

[0040] The first pad and the second pad are respectively located on both sides of the welding through hole;

[0041] The side surface of the raising fixture is L-shaped.

[0042] On the other hand, a reinforcing rib is provided in the middle of the raising clamp.

[0043] On the other hand, the limiting hole is provided with clearance holes on both sides of the short axis direction of the limiting frame.

[0044] The above technical solution has the following advantages or beneficial effects:

[0045] In view of the problem that tilting and height inconsistency may occur during the radiator welding process in the existing technology, which in turn affects the subsequent device installation and heat dissipation, in this solution, a specific raising fixture is designed in the reflow soldering fixture. The two sides of the raising fixture are respectively offset against the radiator and the epoxy resin injection molding module. The parallel welding process is achieved by raising the plane of the fixture. At the same time, the welding height is fixed by controlling the depth of the welding through hole to achieve a better welding yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] The embodiments of the present invention will be described more fully with reference to the accompanying drawings, which are for illustration and description only and are not intended to limit the scope of the present invention.

[0047] Figure 1 A schematic diagram of a reflow carrier according to an embodiment of the present invention;

[0048] Figure 2 This is a schematic diagram of a heightening fixture according to an embodiment of the present invention;

[0049] Figure 3 A schematic diagram of a limit frame according to an embodiment of the present utility model;

[0050] Figure 4 A side view of the raising fixture according to an embodiment of the present invention DETAILED DESCRIPTION

[0051] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0052] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features therein can be combined with each other.

[0053] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, but they are not intended to limit the present invention.

[0054] The utility model includes:

[0055] A reflow soldering fixture for epoxy resin injection molded module heat sink, such as Figures 1 to 4 As shown, it includes a reflow carrier 1 and a padding fixture 2;

[0056] A plurality of heat sink mounting positions 11 corresponding to the shape of an inverted heat sink are distributed on the reflow carrier 1;

[0057] It should be noted that Figure 1 The radiator mounting position 11 in the figure has been installed upside down, and when the radiator is not installed, there is an empty mounting hole position;

[0058] The padding fixture 2 is located above the reflow fixture 1;

[0059] The raising fixture 2 is provided with a welding through hole 21 above the radiator mounting position 1;

[0060] The depth of the welding through hole 21 corresponds to the welding height between the epoxy resin injection molding module and the heat sink.

[0061] Specifically, in order to address the problem that tilting and height inconsistency may occur during the radiator welding process in the prior art, thereby affecting the subsequent device installation and heat dissipation, in this solution, a specific raising fixture 2 is designed in the reflow soldering fixture. The two sides of the raising fixture 2 are respectively offset against the radiator and the epoxy resin injection molding module. The parallel welding process is achieved by raising the plane of the raising fixture 2. At the same time, the welding height is fixed by controlling the depth of the welding through hole 21 to achieve a better welding yield.

[0062] Specifically, during the reflow soldering process, solder paste needs to be applied between the heat sink and the epoxy resin injection molding module, and then the two are pasted together and sent into the soldering box for heating and soldering, and then cooled and fixed.

[0063] Using the aforementioned fixture, initially, heat sinks are sequentially installed in an inverted orientation into the multiple heat sink mounting locations 11 on the reflow carrier 1, with the fins facing downward and the soldering surface facing upward. Subsequently, a standoff fixture 2 is placed above the reflow carrier 1 and the heat sink, with its soldering holes 21 aligned with the soldering surface of the heat sink below.

[0064] Then, a corresponding mask is used to cover the bottom of the padding fixture 2, and solder paste is applied to the welding through hole 21. Then, an epoxy resin injection molding module is flipped over the welding through hole 21, and the padding fixture 2 is used to control the welding height and plane.

[0065] In one embodiment, it further includes:

[0066] Limit frame 3;

[0067] The limiting frame 3 is provided with a plurality of limiting holes 31 corresponding to the epoxy resin injection molding modules;

[0068] The reflow carrier 1, the heightening fixture 2 and the limit frame 3 are vertically assembled;

[0069] The radiator mounting position 11 , the welding through hole 21 and the limiting hole 31 are aligned.

[0070] Specifically, in order to achieve better welding accuracy, in this embodiment, a limit frame 3 is further provided. The limit frame 3 is provided with a plurality of limit holes 31 corresponding to the resin injection molding module for horizontally limiting the epoxy resin injection molding module.

[0071] In the process of applying soldering paste in the welding through hole 21 and inverting the epoxy resin injection molding module, the limit frame 3 can be assembled above the raising fixture 2 first, and then the epoxy resin injection molding module can be placed in the limiting hole 31 to achieve alignment, and finally sent into the welding box for heating and welding. After cooling and fixing, the limit frame 3 and the raising fixture 2 are taken out in turn, and the welded product is taken out.

[0072] In one embodiment, the reflow carrier 1 is in the shape of a long strip;

[0073] The upper surface of the reflow carrier 1 is provided with a plurality of heat sink mounting positions 11 along the longitudinal direction;

[0074] A spacing block 12 is provided between each radiator mounting position 11;

[0075] The spacer block 12 is in a convex shape;

[0076] The spacer blocks 12 are distributed along the short axis direction of the reflow carrier 1 .

[0077] Specifically, to achieve a better welding effect, in this embodiment, a spacer block 12 is provided between each radiator mounting position 11. The spacer block 12 is in a convex shape, including a higher surface at the top and lower surfaces on both sides, and then transitions to the radiator mounting position 11. This structure can support the upper raising fixture 2 through the convex top surface, and contain overflowing solder paste through the lower surfaces on both sides.

[0078] In one embodiment, the spacing block 12 includes a positioning block 13;

[0079] The positioning block 13 is provided with a first positioning hole 14;

[0080] A second positioning hole 22 is provided on the portion of the raising fixture 12 corresponding to the first positioning hole 14;

[0081] A third positioning hole 32 is provided on the limiting frame 3 at a position corresponding to the second positioning hole 22;

[0082] The first positioning hole 14 , the second positioning hole 22 and the third positioning hole 32 are connected by the positioning column 4 .

[0083] Specifically, to achieve a better assembly effect, in this embodiment, first to third positioning holes are respectively provided in the reflow carrier 1, the elevation fixture 2, and the limit frame 3. After the reflow carrier 1, the elevation fixture 2, and the limit frame 3 are roughly aligned, the first to third positioning holes can usually also be roughly aligned, and then the positioning post 4 can be inserted to assist in positioning, thereby achieving a more accurate positioning process.

[0084] In one embodiment, the positioning blocks 13 are arranged at intervals.

[0085] Specifically, to achieve better assembly efficiency and more stable positioning, in this embodiment, positioning blocks 13 are interspersed between the spacing blocks 12. Specifically, for the multiple radiator mounting positions 11, positioning blocks 13 are respectively provided on the outside of the radiator mounting positions 11 at the leading and trailing ends. Conventional spacing blocks 12 and positioning blocks 13 are interspersed between the multiple radiator mounting positions 11 in the middle.

[0086] In one embodiment, the reflow carrier 1 includes a first plane and a second plane arranged parallel to the long axis direction;

[0087] The second plane is higher than the first plane;

[0088] The radiator mounting positions 11 are distributed on the second plane;

[0089] The raising fixture 2 includes a first spacer 23 and a second spacer 24;

[0090] The first cushion block 23 is arranged above the first plane;

[0091] The second pad 24 is disposed in contact with the side of the second plane.

[0092] In one embodiment, the raising fixture 2 has a grid structure;

[0093] The grid-like structure matches the reflux carrier 1 in the top view direction;

[0094] The grid-like structure is provided with welding through holes 21 at positions corresponding to the radiator mounting holes 11;

[0095] The first cushion block 23 and the second cushion block 24 are arranged parallel to the long axis direction of the cushioning fixture;

[0096] The first pad 23 and the second pad 24 are respectively located on both sides of the welding through hole 21;

[0097] The side surface of the raising fixture 2 is L-shaped.

[0098] Specifically, in order to achieve better installation and alignment effects, in this embodiment, the reflow carrier 1 and the raising fixture 2 are made into a non-planar structure.

[0099] The first pad 23 is a lying rectangular structure viewed from the side, with its bottom set on the first plane of the reflow carrier 1 and its inner side near the radiator mounting position 11 abutting against the side wall between the first and second planes of the reflow carrier 1 .

[0100] Correspondingly, the second cushion block 24 is a rectangular structure with a height direction longer than a bottom direction, and the side wall of the second plane of the reflow carrier 1 abuts against the inner side surface of the second cushion block 24 .

[0101] At this time, the first pad 23 , the grid structure, and the second pad 24 can form a structure similar to an X-shape, which is placed on the top of the reflow carrier 1 to achieve fixation.

[0102] At the same time, the grid structure realizes automatic alignment of the radiator mounting position 11 below through the above-mentioned socketing method.

[0103] In one embodiment, a reinforcing rib is provided in the middle of the raising fixture 2 .

[0104] In one embodiment, the limiting hole 31 is provided with clearance holes on both sides of the limiting frame 3 in the short axis direction.

[0105] Specifically, considering that the epoxy resin injection molding module has a pin structure after packaging, corresponding clearance holes are opened on both sides of the short axis direction of the limiting hole 31 to allow the pins to pass through.

[0106] The above are only preferred embodiments of the present invention and do not limit the implementation methods and protection scope of the present invention. Those skilled in the art should be aware that all solutions obtained by equivalent substitutions and obvious changes made using the description and illustrations of the present invention should be included in the protection scope of the present invention.

Claims

1. A reflow soldering fixture for epoxy resin injection molded module heat sink, characterized in that: Including reflow carrier and pad fixture; The reflow carrier is provided with a plurality of radiator mounting positions corresponding to the shape of an inverted radiator; The raising fixture is located above the reflow carrier; The raising fixture is provided with a welding through hole above the radiator installation position; The depth of the welding through hole corresponds to the welding height between the epoxy resin injection molding module and the heat sink.

2. The reflow soldering fixture according to claim 1, wherein: Also includes: Limit frame; The limiting frame is provided with a plurality of limiting holes corresponding to the epoxy resin injection molding module; The reflow carrier, the raising fixture and the limiting frame are vertically assembled; The radiator mounting position, the welding through hole and the limiting hole are aligned.

3. The reflow soldering fixture according to claim 2, wherein: The reflux carrier is in the shape of a long strip; The upper surface of the reflow carrier is provided with a plurality of radiator mounting positions along the long axis direction; A spacing block is provided between each of the radiator installation positions; The spacer block is in a convex shape; The spacer blocks are distributed along the short axis direction of the reflux carrier.

4. The reflow soldering fixture according to claim 3, wherein: The spacing block includes a positioning block; The positioning block is provided with a first positioning hole; The position of the raising fixture corresponding to the first positioning hole is provided with a second positioning hole; A third positioning hole is provided on the limiting frame at a position corresponding to the second positioning hole; The first positioning hole, the second positioning hole and the third positioning hole are connected by positioning posts.

5. The reflow soldering fixture according to claim 4, wherein: The positioning blocks are arranged at intervals.

6. The reflow soldering fixture according to claim 3, wherein: The reflux carrier includes a first plane and a second plane arranged parallel to the long axis direction; The second plane is higher than the first plane; The radiator mounting positions are distributed on the second plane; The raising fixture includes a first cushion block and a second cushion block; The first cushion block is arranged above the first plane; The second pad is arranged to fit the side of the second plane.

7. The reflow soldering fixture according to claim 6, wherein: The raising fixture has a grid structure; The grid-like structure matches the reflux carrier in a top-view direction; The welding through holes are distributed at positions of the grid structure corresponding to the radiator installation positions; The first cushion block and the second cushion block are arranged parallel to the long axis direction of the raising fixture; The first pad and the second pad are respectively located on both sides of the welding through hole; The side surface of the raising fixture is L-shaped.

8. The reflow soldering fixture according to claim 7, wherein: A reinforcing rib is provided in the middle of the raising clamp.

9. The reflow soldering fixture according to claim 2, wherein: The limiting hole is provided with clearance holes on both sides of the short axis direction of the limiting frame.

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