Wavelength conversion assembly and lighting equipment

Abstract

The utility model discloses a wavelength conversion assembly and lighting equipment. The wavelength conversion assembly comprises a heat dissipation piece, a wavelength conversion piece and a metal heat conduction piece. Wherein the wavelength conversion piece comprises a light transmitting layer and a wavelength conversion layer, the light transmitting layer is arranged on one side of the heat dissipation piece, and the wavelength conversion layer is arranged on the side, away from the heat dissipation piece, of the light transmitting layer; the metal heat conduction piece is arranged between the light-transmitting layer and the heat dissipation piece so that the light-transmitting layer and the heat dissipation piece can be fixedly connected. As the metal heat conduction piece is arranged between the light-transmitting layer and the heat dissipation piece, the heat dissipation performance of the wavelength conversion layer arranged on one side of the light-transmitting layer can be improved, the problems of ablation, blackening and the like possibly occurring on the wavelength conversion layer under long-time irradiation of high-power laser are avoided, and then the fluorescence conversion efficiency of the wavelength conversion layer is guaranteed.

Description

Technical Field

[0001] The present application relates to the field of laser lighting technology, and more specifically, to a wavelength conversion component and a lighting device. Background Art

[0002] In the existing field of laser lighting technology, a lighting method of laser excitation of fluorescence is generally adopted. For example, blue laser is used to excite yellow fluorescence, which can be mixed to form white light.

[0003] However, since laser light generates a lot of heat when irradiating wavelength conversion devices (e.g., fluorescent films), the heat tends to accumulate in a fixed area of ​​the fluorescent film, causing the fluorescent film to suffer from problems such as ablation and blackening under long-term irradiation with high-power laser light, thereby reducing the fluorescent conversion efficiency of the fluorescent film. Utility Model Content

[0004] Embodiments of the present application provide a wavelength conversion component and a lighting device.

[0005] According to a first aspect of the present application, embodiments of the present application provide a wavelength conversion assembly comprising a heat sink, a wavelength conversion element, and a metal thermal conductor. The wavelength conversion element comprises a light-transmitting layer and a wavelength conversion layer, the light-transmitting layer being disposed on one side of the heat sink, and the wavelength conversion layer being disposed on a side of the light-transmitting layer facing away from the heat sink. The metal thermal conductor is disposed between the light-transmitting layer and the heat sink to securely connect the light-transmitting layer and the heat sink.

[0006] Among them, in some possible embodiments, the wavelength conversion component is suitable for being arranged in the optical path where the excitation light is located; the heat sink is provided with a through hole, which passes through the opposite sides of the heat sink; the light-transmitting layer covers the through hole; the excitation light passes through the through hole and the light-transmitting layer and then enters the wavelength conversion layer.

[0007] In some possible embodiments, the heat sink is further provided with a receiving hole, the receiving hole is communicated with the through hole, and the wavelength conversion element and the metal heat conductor are arranged in the receiving hole.

[0008] In some possible embodiments, the aperture of the accommodating hole is larger than the aperture of the through hole, so that a step surface is formed at the connection between the accommodating hole and the through hole; and the metal heat conductor is connected between the step surface and the light-transmitting layer.

[0009] Among them, in some possible embodiments, the light-transmitting layer includes a light-entering surface, the light-entering surface is provided with a light-transmitting area and a connecting area, the light-transmitting area is used to transmit light; the connecting area surrounds the periphery of the light-transmitting area or is connected to one side of the light-transmitting area; the metal heat conductor is arranged between the connecting area and the heat sink.

[0010] In some possible embodiments, the metal heat conductor includes a metal solder layer and a metal film layer, the metal film layer is arranged on the side of the light-transmitting layer away from the wavelength conversion layer; the metal solder layer is fixedly connected between the heat sink and the metal film layer.

[0011] In some possible embodiments, the metal solder layer is a sintered silver layer, and the metal film layer is a nano silver film layer; or the metal solder layer is a tin-based solder sheet layer, and the metal film layer is a nickel film layer.

[0012] In some possible embodiments, the wavelength conversion layer is a fluorescent glass film, and the fluorescent glass film is doped with fluorescent particles, and the fluorescent particles include at least two of red fluorescent particles, yellow fluorescent particles, and green fluorescent particles.

[0013] Among them, in some possible embodiments, the wavelength conversion component is suitable for being arranged in the optical path where the excitation light is located, and the wavelength conversion layer is used to convert the excitation light into the converted light; the wavelength conversion component also includes a dichroic film, which is arranged between the light-transmitting layer and the wavelength conversion layer; the dichroic film is used to transmit the excitation light and reflect the converted light.

[0014] According to a second aspect of the present application, an embodiment of the present application further provides an illumination device, comprising a light source and the aforementioned wavelength conversion component, wherein the light source is used to generate excitation light, and the wavelength conversion component is disposed on an optical path of the excitation light.

[0015] The present invention provides a wavelength conversion assembly and lighting device. The wavelength conversion assembly includes a heat sink, a wavelength conversion element, and a metal heat conductor. The wavelength conversion element includes a light-transmitting layer and a wavelength conversion layer. The metal heat conductor is disposed between the light-transmitting layer and the heat sink to securely connect them. The wavelength conversion layer is disposed on the side of the light-transmitting layer facing away from the heat sink.

[0016] On the one hand, the wavelength conversion part in the present application includes a light-transmitting layer, indicating that the wavelength conversion component is a transmissive wavelength conversion component, which has the advantages of simple structure and small size, and is conducive to the miniaturization design of the lighting equipment equipped with the wavelength conversion component.

[0017] Furthermore, by disposing a metal heat conductor between the light-transmitting layer and the heat sink, the present invention improves the heat dissipation performance of the wavelength conversion layer located on one side of the light-transmitting layer. This prevents the wavelength conversion layer from eroding or blackening under prolonged exposure to high-power lasers, thereby ensuring the wavelength conversion layer's fluorescence conversion efficiency. Furthermore, the metal heat conductor securely connects the heat sink and wavelength conversion element, achieving a tightly integrated interconnection between the two elements, further enhancing the overall heat dissipation efficiency of the wavelength conversion assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0019] Figure 1 It is a structural diagram of the lighting device provided in an embodiment of the present application.

[0020] Figure 2 yes Figure 1 A schematic diagram of the structure of a wavelength conversion component in a lighting device is shown.

[0021] Figure 3 yes Figure 1 Another structural schematic diagram of a wavelength conversion component in a lighting device is shown.

[0022] Figure 4 yes Figure 1 Another structural schematic diagram of a wavelength conversion component in a lighting device is shown.

[0023] Figure 5 yes Figure 2 The schematic diagram of the structure of the heat sink in the wavelength conversion component is shown.

[0024] Figure 6 yes Figure 2 The schematic diagram of the structure of the wavelength conversion component in the wavelength conversion assembly is shown.

[0025] Figure 7 yes Figure 1 Another structural schematic diagram of a wavelength conversion component in a lighting device is shown. DETAILED DESCRIPTION

[0026] In order to enable those skilled in the art to better understand the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0027] See also Figure 1 The present invention provides a wavelength conversion component 100 and an illumination device 200 equipped with the wavelength conversion component 100. The illumination device 200 is a device for generating illumination light. For example, the illumination device 200 may be a laser light, a stage light, a car light, a searchlight, or the like.

[0028] In this embodiment, the lighting device 200 may include a light source 210 and a wavelength conversion component 100, wherein the light source 210 is used to generate excitation light L. The excitation light L serves as the excitation light of the wavelength conversion component 100. For example, the excitation light L may be a blue laser, and the central wavelength of the blue laser may be 450nm. Of course, in some other possible embodiments, the excitation light L may also be a violet laser, a deep blue laser, etc. Specifically, the light source 210 may be a laser generator, such as a gas laser generator, a solid-state laser generator, a semiconductor laser generator, etc. The number of laser generators may be multiple to achieve high-power lighting of the lighting device 200.

[0029] In some other possible embodiments, the light source 210 may also be an LED light, for example, a blue LED light. In this case, the excitation light L may be a blue LED light.

[0030] The wavelength conversion component 100 is adapted to be disposed in the optical path of the excitation light L and is configured to convert the excitation light L into the converted light F. It is readily understood that a portion of the excitation light L is not converted into the converted light F (i.e., fluorescence). This unconverted light is combined with the converted light F to form illumination light emitted to the outside world.

[0031] See also Figure 2 The wavelength conversion component 100 may include a heat sink 10, a wavelength conversion element 30, and a metal heat conductor 50. The wavelength conversion element 30 may include a light-transmitting layer 320 and a wavelength conversion layer 340. The light-transmitting layer 320 is disposed on one side of the heat sink 10, and the wavelength conversion layer 340 is disposed on a side of the light-transmitting layer 320 facing away from the heat sink 10. The metal heat conductor 50 is disposed between the light-transmitting layer 320 and the heat sink 10 to securely connect the light-transmitting layer 320 and the heat sink 10.

[0032] On the one hand, the wavelength conversion element 30 in this embodiment includes a light-transmitting layer 320, indicating that the wavelength conversion component 100 is a transmissive wavelength conversion component, which has advantages such as simple structure and small size, and is conducive to realizing the miniaturization design of the lighting device 200 equipped with the wavelength conversion component 100.

[0033] On the other hand, this embodiment can improve the heat dissipation performance of the wavelength conversion layer 340 arranged on one side of the light-transmitting layer 320 by setting a metal heat conductor 50 between the light-transmitting layer 320 and the heat dissipation member 10, thereby avoiding the occurrence of problems such as ablation and blackening of the wavelength conversion layer 340 under long-term irradiation of high-power laser, thereby ensuring the fluorescence conversion efficiency of the wavelength conversion layer 340.

[0034] It should be noted that in the related art, a heat conduction effect is usually achieved by applying a thermal paste between the heat sink 10 and the light-transmitting layer 320, but the fixing connection performance of the thermal paste is poor. Alternatively, a fixing method is adopted between the heat sink 10 and the light-transmitting layer 320 through organic silicone, but the thermal conductivity of organic silicone is poor. In order to solve the above problem, the inventors of the present application use a metal heat conductor 50 to fix the heat sink 10 and the wavelength conversion component 30, which can achieve an integrated and tight interconnection between the heat sink 10 and the wavelength conversion component 30. In addition, since the metal itself has good thermal conductivity, it can quickly conduct away the heat generated by the excitation light L on the wavelength conversion component 100, which is beneficial to improving the overall heat dissipation effect of the wavelength conversion component 100.

[0035] The specific implementation of the wavelength conversion component 100 is introduced below.

[0036] In this embodiment, the heat sink 10 is generally block-shaped and serves to securely support the wavelength conversion element 30 and the metal heat conductor 50. Specifically, the heat sink 10 can be made of materials such as ceramic, graphene, or metal (e.g., aluminum alloy, copper, or copper alloy) to improve the heat dissipation performance of the wavelength conversion assembly 100.

[0037] In some possible embodiments, such as Figure 2 As shown, the wavelength conversion element 30 is arranged on one side of the heat dissipation element 10, and at least part of the wavelength conversion element 30 protrudes relative to the heat dissipation element 10, so that the excitation light L can smoothly enter the light-transmitting layer 320, and then enter the wavelength conversion layer 340 after passing through the light-transmitting layer 320.

[0038] In some possible embodiments, see Figure 3 The heat sink 10 may be provided with a through hole 120 extending through opposite sides of the heat sink 10. The light-transmitting layer 320 covers the through hole 120, allowing the excitation light L to pass through the through hole 120 and the light-transmitting layer 320 before being incident on the wavelength conversion layer 340. Specifically, the aperture of the through hole 120 may be greater than or equal to the size of the spot formed by the excitation light L on the light-transmitting layer 320, so that the excitation light L can fully pass through the through hole 120, avoiding loss of the incident light L and ensuring the excitation efficiency of the stimulated light F.

[0039] Specifically, the through hole 120 can be located at the center of the heat sink 10 so that when the excitation light L passes through the through hole 120 , the heat sink 10 can evenly surround the periphery of the excitation light L to improve the heat dissipation effect of the wavelength conversion component 100 .

[0040] In addition, it is not difficult to find here that the wavelength conversion component 100 in this embodiment adopts an optical path structure in which the excitation light L passes through the through hole 120 and transmits through the light-transmitting layer 320 and then is incident on the wavelength conversion layer 340, indicating that the wavelength conversion component 100 is a transmissive wavelength conversion component, which is conducive to achieving a miniaturized design of the lighting device 200 equipped with the wavelength conversion component 100, and can also make the structure of the lighting device 200 more compact and reasonable.

[0041] In some possible embodiments, see Figure 4 The heat sink 10 may further include a receiving hole 140, which communicates with the through hole 120. The wavelength conversion element 30 and the metal heat conductor 50 are disposed within the receiving hole 140. Therefore, the heat sink 10 in this embodiment is generally concave in shape and surrounds the outer periphery of the wavelength conversion element 30, further enhancing the heat dissipation effect of the wavelength conversion element 30 and ensuring the fluorescence conversion efficiency of the wavelength conversion layer 340.

[0042] Specifically, see Figure 5 The receiving hole 140 may be a circular hole. In other possible embodiments, the receiving hole 140 may also be a square hole. Researchers can flexibly adjust the shape of the receiving hole 140 according to the shapes of the wavelength conversion layer 340 and the light-transmitting layer 320. This embodiment does not specifically limit this.

[0043] Please refer to Figure 4 and Figure 5 The diameter of the receiving hole 140 is larger than that of the through hole 120, so that a step surface 160 is formed at the junction of the receiving hole 140 and the through hole 120. The metal heat conductor 50 is connected between the step surface 160 and the light-transmitting layer 320. The step surface 160 here can fix and limit the wavelength converter 30, so that the wavelength converter 30 is firmly and reliably set in the receiving hole 140 through the metal heat conductor 50.

[0044] In some possible embodiments, the aperture of the accommodating hole 140 may be slightly larger than or equal to the size of the light-transmitting layer 320 , so that the light-transmitting layer 320 may be embedded in the accommodating hole 140 to improve the connection reliability of the overall structure of the wavelength conversion component 100 .

[0045] In this embodiment, the dimensions of the wavelength converter 30 and the metal thermal conductor 50 in the optical axis direction of the excitation light L are defined as thickness, and the dimension of the accommodating hole 140 in the optical axis direction of the excitation light L is defined as depth, wherein the sum of the thicknesses of the wavelength converter 30 and the metal thermal conductor 50 can be equal to the depth of the accommodating hole 140, so that the wavelength converter 30 and the metal thermal conductor 50 are just embedded in the accommodating hole 140, which can fully ensure the heat dissipation effect of the heat sink 10 on the wavelength converter 30.

[0046] Of course, in other embodiments of the present application, the sum of the thicknesses of the wavelength conversion component 30 and the metal thermal conductor 50 may also be greater than the depth of the accommodating hole 140; in another embodiment of the present application, the sum of the thicknesses of the wavelength conversion component 30 and the metal thermal conductor 50 may also be less than the depth of the accommodating hole 140.

[0047] In this embodiment, the wavelength converter 30 may include a light-transmitting layer 320 and a wavelength conversion layer 340. The light-transmitting layer 320 is used to securely support the wavelength conversion layer 340. The light-transmitting layer 320 is disposed in the optical path of the excitation light L and is used to transmit the excitation light L. Specifically, the light-transmitting layer 320 may be made of a transparent material (e.g., glass or sapphire). In some possible embodiments, the excitation light L may be a blue laser, and the light-transmitting layer 320 may be a transparent sapphire layer.

[0048] See also Figure 6 and Figure 7 , the light-transmitting layer 320 may be a circular sheet-shaped structure. The light-transmitting layer 320 may include a light incident surface 3210, and the light incident surface 3210 is arranged on the light path where the excitation light L is located. Among them, the light incident surface 3210 is provided with a light-transmitting area 3212 and a connection area 3214, and the light-transmitting area 3212 is used to transmit light (that is, the excitation light L). The connection area 3214 surrounds the outer periphery of the light-transmitting area 3212. The metal heat conductor 50 is arranged between the connection area 3214 and the heat sink 10. In some other possible embodiments, the light-transmitting layer 320 may also be a square sheet-shaped structure, which is not specifically limited in this embodiment.

[0049] Specifically, the connection region 3214 can be roughly annular, with the width of the annular ring being roughly equal to the width of the step surface 160 of the heat sink 10. The "width of the step surface 160" refers to the dimension of the step surface 160 in the direction of the aperture of the through hole 120. Therefore, the connection region 3214 can be tightly fitted with the step surface 160, thereby improving the connection reliability between the light-transmitting layer 320 and the heat sink 10.

[0050] Of course, in Figure 2 In the illustrated embodiment, the connection region 3214 may also be connected to one side of the light-transmitting region 3212 .

[0051] Therefore, the metal heat conductor 50 in this embodiment is only connected to a portion of the light incident surface 3210 (i.e., the connection area 3214), which can prevent the metal heat conductor 50 from blocking the excitation light L, thereby ensuring that the excitation light L can smoothly enter the light-transmitting layer 320. It should be noted that the light-transmitting area 3212 and the connection area 3214 are named only to facilitate the description of the connection position between the light-transmitting layer 320 and the metal heat conductor 50, and there is no clear dividing line between the two.

[0052] The wavelength conversion layer 340 is disposed on the side of the light-transmitting layer 320 facing away from the metal thermal conductor 50 and is used to convert the excitation light L into the converted light F. The converted light F can be a single-color fluorescent light or a mixed fluorescent light of multiple colors. Specifically, the excitation light L can be a blue laser. The wavelength conversion layer 340 is doped with fluorescent particles 3410, which can include at least two of red, yellow, and green fluorescent particles.

[0053] In some possible embodiments, the fluorescent particles 3410 may include red, yellow, and green fluorescent particles. In this case, the stimulated light F may be a mixture of red, yellow, and green fluorescent light. Therefore, when the wavelength conversion component 100 is configured in the lighting device 200, the generated illumination light may simultaneously mix blue laser light, red, yellow, and green fluorescent light to achieve a higher color rendering index. In some possible embodiments, when the fluorescent particles 3410 include red, yellow, and green fluorescent particles, the color rendering index of the lighting device 200 may be greater than or equal to 92 and less than or equal to 95. The color temperature of the lighting device 200 may be greater than or equal to 5000K and less than or equal to 8000K.

[0054] Specifically, the red fluorescent particles may be nitride particles, the yellow fluorescent particles may be cerium-doped yttrium aluminum garnet (Ce:YAG) fluorescent crystal particles, and the green fluorescent particles may be aluminate (LuAG) particles.

[0055] In other possible embodiments, the fluorescent particles 3410 may include any two of red, yellow, and green fluorescent particles. Researchers can adjust this based on the actual application scenario of the lighting device 200, and this embodiment is not specifically limited thereto. For example, the fluorescent particles 3410 may include red and yellow fluorescent particles. In another example, the fluorescent particles 3410 may include red and green fluorescent particles. It should be noted that when the fluorescent particles 3410 include red fluorescent particles, the color rendering index of the illumination light can be significantly improved.

[0056] Specifically, the wavelength conversion layer 340 may be a fluorescent glass film, which covers the side of the light-transmitting layer 320 facing away from the metal thermal conductor 50. The fluorescent glass film refers to a fluorescent film in which fluorescent particles are doped into a glass matrix. In other words, the fluorescent glass film uses glass as its matrix material, and the fluorescent particles 3410 are doped into the glass matrix. Therefore, the wavelength conversion layer 340 in this embodiment uses a glass matrix inorganic encapsulation method. Compared to organic encapsulation methods such as silicone or resin, this can further improve the thermal conductivity of the wavelength conversion layer 340, thereby preventing problems such as ablation and blackening of the wavelength conversion layer 340 that may occur under long-term irradiation with a high-power laser.

[0057] In some possible embodiments, the wavelength converter 30 may further include a dichroic film 360 disposed between the light-transmitting layer 320 and the wavelength conversion layer 340. The dichroic film 360 is configured to transmit the excitation light L and reflect the converted light F. On one hand, the dichroic film 360 transmits the excitation light L to ensure that the excitation light L can smoothly pass through the dichroic film 360 and enter the wavelength conversion layer 340. On the other hand, since the converted light F (i.e., fluorescence) is Lambertian light, a portion of the converted light F will be emitted toward one side of the light-transmitting layer 320. Therefore, the dichroic film 360 in this embodiment also reflects this portion of the converted light F to improve the energy utilization efficiency of the converted light F.

[0058] Specifically, the dichroic film 360 can be a blue-transmitting, yellow-reflecting film. The blue-transmitting, yellow-reflecting film is used to transmit light with a wavelength between 440 nm and 460 nm, and the transmittance can be greater than or equal to 90%. For example, the transmittance can be 90%, 92%, 95%, 98%, etc. The blue-transmitting, yellow-reflecting film is also used to reflect light with a wavelength between 480 nm and 780 nm, and the reflectivity can be greater than or equal to 90%. For example, the reflectivity can be 90%, 92%, 95%, 98%, etc.

[0059] In this embodiment, the metal heat conductor 50 is disposed between the connection area 3214 and the heat sink 10 to securely connect the wavelength converter 30 and the heat sink 10. Figure 7 In the illustrated embodiment, the metal heat conductor 50 may include a metal solder layer 520 and a metal film layer 540. The metal film layer 540 is disposed on a side of the light-transmitting layer 320 facing away from the wavelength conversion layer 340. The metal solder layer 520 is fixedly connected between the heat sink 10 and the metal film layer 540. In this embodiment, by providing the metal film layer 540 on the side of the light-transmitting layer 320 facing away from the wavelength conversion layer 340 for transition, the connection reliability between the light-transmitting layer 320 and the metal solder layer 520 can be improved.

[0060] In some possible embodiments, the metal solder layer 520 may be a sintered silver layer, and the metal film layer 540 may be a nanosilver film layer, which is plated on the side of the light-transmitting layer 320 facing away from the wavelength conversion layer 340. In other possible embodiments, the metal solder layer 520 may be a tin-based solder sheet layer, and the metal film layer 540 may be a nickel film layer, which is plated on the side of the light-transmitting layer 320 facing away from the wavelength conversion layer 340.

[0061] The present invention provides a wavelength conversion component 100 and a lighting device 200 equipped with the wavelength conversion component 100. The wavelength conversion component 100 may include a heat sink 10, a wavelength conversion component 30, and a metal heat conductor 50. The wavelength conversion component 30 may include a light-transmitting layer 320 and a wavelength conversion layer 340. The light-transmitting layer 320 is disposed on one side of the heat sink 10, and the wavelength conversion layer 340 is disposed on the side of the light-transmitting layer 320 facing away from the heat sink 10. The metal heat conductor 50 is disposed between the light-transmitting layer 320 and the heat sink 10 to securely connect the light-transmitting layer 320 and the heat sink 10.

[0062] On the one hand, the wavelength conversion element 30 in this embodiment includes a light-transmitting layer 320, indicating that the wavelength conversion component 100 is a transmissive wavelength conversion component, which has advantages such as simple structure and small size, and is conducive to realizing the miniaturization design of the lighting device 200 equipped with the wavelength conversion component 100.

[0063] On the other hand, this embodiment can improve the heat dissipation performance of the wavelength conversion layer 340 arranged on one side of the light-transmitting layer 320 by setting a metal heat conductor 50 between the light-transmitting layer 320 and the heat dissipation member 10, thereby avoiding the occurrence of problems such as ablation and blackening of the wavelength conversion layer 340 under long-term irradiation of high-power laser, thereby ensuring the fluorescence conversion efficiency of the wavelength conversion layer 340.

[0064] In the specification of this application, certain words are used to refer to specific components in the specification and claims. Those skilled in the art should understand that hardware manufacturers may use different terms to refer to the same component. The specification and claims do not use the difference in name as a way to distinguish components, but use the difference in function of the components as the criterion for distinction. For example, "including" mentioned throughout the specification and claims is an open term and should be interpreted as "including but not limited to"; "substantially" means that those skilled in the art can solve the technical problem within a certain error range and basically achieve the technical effect.

[0065] In the description of this application, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "inside", etc. indicating directions or positional relationships are based on the directions or positional relationships shown in the accompanying drawings. They are only used to simplify the description for the convenience of describing this application, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they should not be understood as limitations on this application.

[0066] In this application, unless otherwise expressly specified or limited, terms such as "mounted," "connected," "connect," and "fixed" should be interpreted broadly. For example, these terms may refer to fixed, removable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediary; internal communication between two components; or mere surface contact. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0067] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and features of different embodiments or examples without contradiction.

[0068] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of such features. Throughout the description of this application, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0069] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A wavelength conversion component, characterized in that: The wavelength conversion component includes a heat sink, a wavelength conversion component and a metal heat conductor; The wavelength conversion element includes a light-transmitting layer and a wavelength conversion layer, wherein the light-transmitting layer is arranged on one side of the heat dissipating element, and the wavelength conversion layer is arranged on a side of the light-transmitting layer away from the heat dissipating element; The metal heat conductive member is arranged between the light-transmitting layer and the heat dissipating member so as to fix the light-transmitting layer and the heat dissipating member in connection.

2. The wavelength conversion component according to claim 1, wherein: The wavelength conversion component is suitable for being arranged on the optical path of the excitation light; the heat sink is provided with a through hole, which passes through two opposite sides of the heat sink; and the light-transmitting layer covers the through hole; The excitation light passes through the through hole and the light-transmitting layer and then enters the wavelength conversion layer.

3. The wavelength conversion component according to claim 2, wherein: The heat sink is further provided with a receiving hole, which is communicated with the through hole, and the wavelength conversion component and the metal heat conductor are arranged in the receiving hole.

4. The wavelength conversion component according to claim 3, characterized in that The diameter of the receiving hole is larger than the diameter of the through hole, so that a step surface is formed at the connection between the receiving hole and the through hole; The metal heat conductor is connected between the step surface and the light-transmitting layer.

5. The wavelength conversion component according to claim 1, wherein: The light-transmitting layer includes a light-incident surface, wherein the light-incident surface is provided with a light-transmitting area and a connecting area, wherein the light-transmitting area is used to transmit light; and the connecting area surrounds the periphery of the light-transmitting area or is connected to one side of the light-transmitting area; The metal heat conductor is arranged between the connection area and the heat sink.

6. The wavelength conversion component according to any one of claims 1 to 5, characterized in that: The metal heat conductor comprises a metal solder layer and a metal film layer, wherein the metal film layer is arranged on a side of the light-transmitting layer away from the wavelength conversion layer; The metal solder layer is fixedly connected between the heat sink and the metal film layer.

7. The wavelength conversion component according to claim 6, wherein: The metal solder layer is a sintered silver layer, and the metal film layer is a nano silver film layer; or The metal solder layer is a tin-based solder sheet layer, and the metal film layer is a nickel film layer.

8. The wavelength conversion component according to any one of claims 1 to 5, characterized in that: The wavelength conversion layer is a fluorescent glass film, and the fluorescent glass film is doped with fluorescent particles. The fluorescent particles include at least two of red fluorescent particles, yellow fluorescent particles, and green fluorescent particles.

9. The wavelength conversion component according to any one of claims 1 to 5, characterized in that: The wavelength conversion component is suitable for being arranged on the optical path of the excitation light, and the wavelength conversion layer is used to convert the excitation light into the converted light; The wavelength conversion element further includes a dichroic film, which is arranged between the light-transmitting layer and the wavelength conversion layer; the dichroic film is used to transmit the excitation light and reflect the converted light.

10. A lighting device, characterized in that: include: a light source for generating excitation light; as well as The wavelength conversion component according to any one of claims 1 to 9, wherein the wavelength conversion component is arranged on the optical path where the excitation light is located.

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