MOS tube pin bending device

Abstract

According to the MOS tube pin bending device, a fixing base is arranged at the upper end of a machining table, a plurality of containing grooves are formed in the fixing base, MOS tube workpieces are placed in the containing grooves, a first top plate is fixedly arranged above the fixing base, and a first lifting assembly is arranged in the middle of the first top plate; a first lifting rod is arranged at the output end of the first lifting assembly, a pressing plate used for limiting MOS tube workpieces is arranged at the bottom end of the first lifting rod, the MOS tube workpieces needing to be bent are placed in the containing grooves, pins on the MOS tube workpieces are sequentially arranged on the cushion block, then the second lifting assembly is started, the pressing block can descend, and the MOS tube workpieces can be bent. In the descending process of the pressing block, the pin on the MOS tube workpiece can be bent, the precision of the bending size and the bending angle is higher, and the machining efficiency is high.

Description

Technical Field

[0001] The utility model relates to the technical field of MOS tube processing equipment, in particular to a MOS tube pin bending device. Background Art

[0002] MOS tubes are commonly used electrical components in circuit design. Conventional MOS tubes are factory-installed with their pins and substrate in a horizontal state. During the PCBA soldering process, the MOS tube pins usually need to be bent into a certain angle according to the actual application situation and then soldered to the PCB board. When the MOS tube pin bending work is done entirely by hand, the bending size and bending angle are difficult to guarantee, resulting in large errors. In addition, bending a large number of MOS tubes requires a lot of man-hours. Utility Model Content

[0003] (1) Technical problems solved

[0004] In view of the deficiencies in the prior art, the utility model provides a MOS tube pin bending device.

[0005] (2) Technical solution

[0006] To achieve the above-mentioned object, the present invention provides the following technical solution: a MOS tube pin bending device, comprising a processing table, a fixing seat provided at the upper end of the processing table, a plurality of placement grooves provided on the fixing seat, and a MOS tube workpiece placed inside the placement grooves;

[0007] A first top plate is fixedly arranged above the fixing seat, a first lifting assembly is provided in the middle portion of the first top plate, a first lifting rod is provided at the output end of the first lifting assembly, and a pressing plate for limiting the position of the MOS tube workpiece is provided at the bottom end of the first lifting rod;

[0008] One side of the fixed seat is provided with a pad located at the upper end of the processing table, two positioning plates are symmetrically arranged on both sides of the pad, a second column is fixedly arranged on the upper end of the positioning plate, a second top plate is fixedly arranged on the upper end of the second column, a second lifting assembly is fixedly arranged in the middle part of the second top plate, an output end of the second lifting assembly is provided with a lifting rod passing through the second top plate, and a pressure block is provided at the bottom end of the lifting rod.

[0009] In order to improve the stability of the pressing block during lifting, the present invention has an improvement in that both ends of the pressing block are penetrated by a second column.

[0010] In order to improve the stability of the pressure plate during lifting, the present invention has the following improvements: two first columns are symmetrically arranged on both sides of the fixed seat, the first top plate is fixed to the top of the first column, and both ends of the pressure plate are penetrated by the first column.

[0011] In order to facilitate the removal of the MOS tube workpiece from the placement groove, the improvement of the utility model is that a base plate is provided under the processing table, and a plurality of support rods are provided on the base plate that can pass through the processing table and be inserted into the placement groove. The two ends of the base plate are connected to the two ends of the pressure plate through side plates.

[0012] In order to facilitate the adjustment of the position of the pad, the improvements of the present invention are as follows: a slide groove is provided at the upper end of the processing table, a slider cooperating with the slide groove is provided at the lower end of the pad, a positioning tube is provided at the middle part of the pad, a motor and a cavity are provided at the middle part of the fixed seat, and a screw rod passing through the cavity and inserted into the interior of the positioning tube is provided at the output end of the motor, and the screw rod is threadedly connected to the positioning tube.

[0013] Furthermore, the present invention is improved in that the motor is a servo motor.

[0014] (3) Beneficial effects

[0015] Compared with the prior art, the present invention provides a MOS tube pin bending device with the following beneficial effects:

[0016] Place the MOS tube workpiece that needs to be bent into multiple placement slots so that the pins on the MOS tube workpiece are arranged on the pad in sequence. Then start the second lifting component to lower the pressing block. During the lowering process, the pressing block can bend the pins on the MOS tube workpiece. The bending size and bending angle are more accurate and the processing efficiency is high.

[0017] Start the first lifting assembly to raise the pressure plate. During this process, the side plate will drive the bottom plate to rise, so that the support rod can penetrate the placement groove, and the support rod can push the MOS tube workpiece out of the placement groove, making it easier to take out the MOS tube workpiece from the placement groove. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the three-dimensional structure of the utility model;

[0019] Figure 2 For this utility model Figure 1 Side view of;

[0020] Figure 3 For this utility model Figure 1 The main view;

[0021] Figure 4 This is a schematic diagram of the structure of the screw in the utility model;

[0022] In the figure: 1. Processing table; 2. Fixing seat; 3. Placement slot; 4. MOS tube workpiece; 5. Pressing plate; 6. Bottom plate; 7. Support rod; 8. First column; 9. Side plate; 10. First lifting assembly; 11. First top plate; 12. Pad; 13. Positioning plate; 14. Pressing block; 15. Second top plate; 16. Second lifting assembly; 17. Motor; 18. Positioning tube; 19. Screw; 20. Second column. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0024] See also Figure 1-4 The utility model provides a MOS tube pin bending device, comprising a processing table 1, wherein the upper end of the processing table 1 is provided with a fixing seat 2, the fixing seat 2 is provided with a plurality of placement grooves 3, and the MOS tube workpiece 4 is placed inside the placement grooves 3;

[0025] A first top plate 11 is fixedly provided above the fixing seat 2. A first lifting assembly 10 is provided in the middle portion of the first top plate 11. A first lifting rod is provided at the output end of the first lifting assembly 10. A pressing plate 5 for limiting the position of the MOS tube workpiece 4 is provided at the bottom end of the first lifting rod.

[0026] A pad 12 is provided on one side of the fixed seat 2 and is located at the upper end of the processing table 1. Two positioning plates 13 are symmetrically provided on both sides of the pad 12. A second column 20 is fixedly provided on the upper end of the positioning plate 13. A second top plate 15 is fixedly provided on the upper end of the second column 20. A second lifting assembly 16 is fixedly provided in the middle part of the second top plate 15. A lifting rod is provided at the output end of the second lifting assembly 16 and passes through the second top plate 15. A pressure block 14 is provided at the bottom end of the lifting rod.

[0027] When the present structure is in use, the MOS tube workpiece 4 to be bent is placed in the plurality of placement slots 3, and then the first lifting assembly 10 is activated to lower the pressing plate 5. The pressing plate 5 can limit the MOS tube workpiece 4, so that the MOS tube workpiece 4 can be placed more stably in the placement slot 3, and the pins on the MOS tube workpiece 4 are arranged in sequence on the pad 12. Then, the second lifting assembly 16 is activated to lower the pressing block 14. During the lowering process, the pressing block 14 can bend the pins on the MOS tube workpiece 4, so that the accuracy of the bending size and the bending angle is higher, and the processing efficiency is high.

[0028] In this embodiment, both ends of the pressing block 14 are penetrated by the second column 20. When the pressing block 14 is lifted or lowered, the two ends of the pressing block 14 can slide along the second column 20. Two first columns 8 are symmetrically arranged on both sides of the fixed seat 2. The first top plate 11 is fixed to the top of the first column 8, and both ends of the pressing plate 5 are penetrated by the first column 8. When the pressing plate 5 is lifted or lowered, the two ends of the pressing plate 5 will slide along the first column 8, thereby improving the stability of the pressing block 14 and the pressing plate 5 during lifting or lowering.

[0029] In this embodiment, a base plate 6 is provided under the processing table 1, and a plurality of support rods 7 are provided on the base plate 6, which can penetrate the processing table 1 and be inserted into the placement groove 3. The two ends of the base plate 6 are connected to the two ends of the pressure plate 5 through the side plates 9. When the pins on the MOS tube workpiece 4 are bent, the first lifting assembly 10 is started to raise the pressure plate 5. During this process, the side plates 9 will drive the base plate 6 to rise, so that the support rods 7 can penetrate the placement groove 3, and the support rods 7 can push the MOS tube workpiece 4 out of the placement groove 3, so that the MOS tube workpiece 4 can be easily taken out of the placement groove 3.

[0030] In this embodiment, the upper end of the processing table 1 is provided with a slide groove, the lower end of the pad 12 is provided with a slider cooperating with the slide groove, the middle part of the pad 12 is provided with a positioning tube 18, the middle part of the fixed seat 2 is provided with a motor 17 and a cavity, the output end of the motor 17 is provided with a screw 19 that passes through the cavity and is inserted into the interior of the positioning tube 18, the screw 19 is threadedly connected to the positioning tube 18, and the motor 17 adopts a servo motor. Starting the motor 17 can rotate the screw 19, and through the action of the threaded structure, the positioning tube 18 can drive the pad 12 to slide on the processing table 1. At this time, the slider will slide in the slide groove, which can facilitate temporary adjustment of the position of the pad 12 and facilitate bending different positions on the MOS tube pin.

[0031] In the description herein, it should be noted that relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Furthermore, the terms "include," "comprise," or any other variations thereof are intended to encompass non-exclusive inclusion, such that a process, method, article, or apparatus that includes a list of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus.

[0032] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention.

Claims

1. A MOS tube pin bending device, comprising a processing table (1), characterized in that: A fixing seat (2) is provided at the upper end of the processing table (1), a plurality of placement grooves (3) are provided on the fixing seat (2), and MOS tube workpieces (4) are placed inside the placement grooves (3); A first top plate (11) is fixedly arranged above the fixing seat (2); a first lifting assembly (10) is provided in the middle portion of the first top plate (11); a first lifting rod is provided at the output end of the first lifting assembly (10); and a pressing plate (5) for limiting the position of the MOS tube workpiece (4) is provided at the bottom end of the first lifting rod; A pad (12) located at the upper end of the processing table (1) is provided on one side of the fixing seat (2), two positioning plates (13) are symmetrically provided on both sides of the pad (12), a second column (20) is fixedly provided on the upper end of the positioning plate (13), a second top plate (15) is fixedly provided on the upper end of the second column (20), a second lifting assembly (16) is fixedly provided in the middle part of the second top plate (15), a lifting rod penetrating the second top plate (15) is provided at the output end of the second lifting assembly (16), and a pressure block (14) is provided at the bottom end of the lifting rod.

2. The MOS tube pin bending device according to claim 1, characterized in that: Both ends of the pressing block (14) are penetrated by second upright columns (20).

3. The MOS tube pin bending device according to claim 2, characterized in that: Two first columns (8) are symmetrically arranged on both sides of the fixing seat (2), the first top plate (11) is fixed on the top of the first column (8), and both ends of the pressing plate (5) are penetrated by the first column (8).

4. The MOS tube pin bending device according to claim 3, characterized in that: A bottom plate (6) is provided below the processing table (1), and a plurality of supporting rods (7) are provided on the bottom plate (6) that can penetrate the processing table (1) and be inserted into the placement groove (3). The two ends of the bottom plate (6) are connected to the two ends of the pressing plate (5) through side plates (9).

5. The MOS tube pin bending device according to claim 4, characterized in that: The upper end of the processing table (1) is provided with a slide groove, the lower end of the cushion block (12) is provided with a slider matched with the slide groove, the middle part of the cushion block (12) is provided with a positioning tube (18), the middle part of the fixing seat (2) is provided with a motor (17) and a cavity, the output end of the motor (17) is provided with a screw (19) that passes through the cavity and is inserted into the interior of the positioning tube (18), and the screw (19) is threadedly connected to the positioning tube (18).

6. The MOS tube pin bending device according to claim 5, characterized in that: The motor (17) is a servo motor.

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