Semiconductor refrigeration cooling mechanism

Abstract

The utility model relates to the technical field of semiconductor refrigeration, and discloses a semiconductor refrigeration cooling mechanism which comprises a refrigeration pad, a refrigeration paste system and an air supply system. The refrigeration pad comprises a contact layer, an air supporting layer and a heat insulation layer which are arranged in sequence; the refrigeration patch system comprises a cold compress patch module and a refrigeration host, the refrigeration host is embedded in the air supporting layer, the cold compress patch module is located on the outer side of the contact layer, the contact face of the cold compress patch module avoids the air outlet hole, and the cold transfer end of the cold compress patch module penetrates through the contact layer and then is attached to the cold end face of a semiconductor refrigeration piece of the refrigeration host; the air supply system penetrates through the contact layer and then is embedded into the air supporting layer, and the air supply system is used for supplying air to the air supporting layer. According to the semiconductor refrigeration cooling mechanism provided by the scheme, the cooling effect of the seat cushion is enhanced, the comfort and driving feeling of a driver and passengers are effectively improved, and the technical problem that the cooling effect of an existing automobile seat cushion is limited is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor refrigeration, in particular to a semiconductor refrigeration temperature reduction mechanism. Background Art

[0002] With the rapid development of the automotive industry, more and more cars have entered ordinary households, bringing numerous conveniences to people's lives. When using a car, the driver needs to sit in the car seat, which is usually made of leather or fabric. If the car is parked in a hot environment or exposed to the sun, the temperature inside the car is often very high, which in turn causes the car seat to heat up. Furthermore, the temperature of the car seat is not only easily affected by environmental factors, but also changes during use. For example, in the hot summer, even if the car is air-conditioned, the skin of the driver and the back, which is in close contact with the seat, will heat up during use. Even with air conditioning, the skin of the driver and the seat will still sweat.

[0003] To solve this problem, drivers and passengers generally use water bags, bamboo mats and other cushions with a certain cooling feeling to cool down their buttocks or backs. However, since the temperature of water bags, bamboo mats and other cushions themselves is at room temperature and the temperature is also prone to change during use, the cooling effect is very limited. Utility Model Content

[0004] The purpose of the utility model is to propose a semiconductor refrigeration cooling mechanism, which is conducive to enhancing the cooling effect of the seat cushion, effectively improving the comfort and driving experience of the driver and passengers, and solving the technical problem of limited cooling effect of existing automobile seat cushions.

[0005] To achieve this purpose, the present invention adopts the following technical solutions:

[0006] A semiconductor refrigeration and cooling mechanism comprises a refrigeration pad, a refrigeration patch system, and an air supply system; the refrigeration pad comprises a contact layer, an air support layer, and a heat insulation layer arranged in sequence, and the contact layer is provided with a plurality of air outlets; the refrigeration pad is also provided with a heat dissipation vent, and the air outlet and the heat dissipation vent are both interconnected with the air support layer;

[0007] The refrigeration patch system includes a cold compress patch module and a refrigeration main unit. The refrigeration main unit is embedded in the air support layer, the cold compress patch module is located outside the contact layer, and the contact surface of the cold compress patch module avoids the air outlet. The cold transfer end of the cold compress patch module passes through the contact layer and contacts the cold end surface of the semiconductor refrigeration plate of the refrigeration main unit. The cold compress patch module contains a cold storage material, and the refrigeration main unit is used to transfer cold energy to the cold storage material. The refrigeration shell of the refrigeration main unit is provided with a heat dissipation inlet and a heat dissipation outlet, and the heat dissipation inlet and the heat dissipation outlet are both connected to the air support layer.

[0008] The air supply system passes through the contact layer and is embedded in the interior of the air supporting layer. The air supply system is provided with an air inlet and an air outlet, wherein the air inlet is located outside the contact layer, and the air outlet is located inside the air supporting layer and is interconnected with the air supporting layer. The air supply system is used to supply air to the air supporting layer.

[0009] Preferably, the cooling pad includes an integrally formed back pad and an extension arm, the extension arm is protrudingly connected to both sides of the back pad, the cooling patch system is arranged on the back pad, and the air supply system is arranged at the end of the extension arm.

[0010] Preferably, the cooling pad further includes a seat cushion, and the seat cushion is integrally connected to the bottom of the back cushion.

[0011] Preferably, the cooling pad includes an integrally formed back pad and seat cushion, the seat cushion is connected to the bottom of the back pad, the cooling patch system is arranged on the back pad, and the air supply system is arranged at the lower part of the seat cushion.

[0012] Preferably, at least two groups of the cooling patch systems are provided, and the two groups of the cooling patch systems are arranged in the middle of the back pad at intervals above and below.

[0013] Preferably, the air supply system comprises a ventilation fan, an air supply housing and an air inlet mask which are installed in sequence, and the ventilation fan is located inside the air supporting layer, and the air supply housing and the air inlet mask are both located outside the contact layer;

[0014] The inlet of the air inlet mask is the air inlet, the outlet of the ventilation fan is the air outlet, the air inlet mask, the air supply housing and the ventilation fan are interconnected to form an air supply duct, and the contact layer is further provided with an avoidance hole for avoiding the air supply duct;

[0015] The air inlet direction of the air supply system and the air outlet direction of the air supply system are perpendicular to each other.

[0016] Preferably, the ventilation fan is a centrifugal fan.

[0017] Preferably, the refrigeration host comprises the semiconductor refrigeration plate, the refrigeration shell and the heat sink, the semiconductor refrigeration plate and the heat sink are both installed inside the refrigeration shell, and the hot end surface of the semiconductor refrigeration plate is in contact with the heat sink;

[0018] The refrigeration shell is further provided with an escape opening, which is arranged close to the cold end surface of the semiconductor refrigeration plate, and the escape opening is used for the cold transfer end of the cold compress module to pass through.

[0019] Preferably, a plurality of heat dissipation channels are provided inside the heat dissipation element, and the heat dissipation inlet and the heat dissipation outlet are respectively located at two ends of the heat dissipation channels.

[0020] Preferably, the heat dissipation inlet and the heat dissipation outlet are arranged opposite to each other.

[0021] The technical solution provided by the utility model may have the following beneficial effects:

[0022] When the semiconductor refrigeration and cooling mechanism of this scheme is working, the wind generated by the air supply system acts on the cooling pad, and the cold fluid formed by the cold storage material and the air flow formed by the wind generated by the air supply system jointly take away the heat from the human body, forming a double combination of cold fluid and cold air flow field for the human body, so that the driver and passengers can feel the flow of wind while directly contacting the cold compress module that stores the cold storage material, and achieve the purpose of perspiration to a certain extent, which is conducive to further enhancing the coolness of the driver and passengers in terms of physical sensation, making the driver and passengers feel the cooling more strongly. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 The utility model is a schematic diagram of the hierarchical structure of a refrigeration pad in a semiconductor refrigeration and temperature reduction mechanism.

[0024] Figure 2 It is a cross-sectional view of a refrigeration patch system in a semiconductor refrigeration and temperature reduction mechanism of the utility model.

[0025] Figure 3 This is a structural exploded diagram of a refrigeration patch system in a semiconductor refrigeration and temperature reduction mechanism of the utility model.

[0026] Figure 4 The utility model is a structural diagram of an air supply system in a semiconductor refrigeration and temperature reduction mechanism.

[0027] Figure 5 This is a structural exploded diagram of an air supply system in a semiconductor refrigeration and temperature reduction mechanism of the utility model.

[0028] Figure 6 It is a structural schematic diagram of a first embodiment of a semiconductor refrigeration and temperature reduction mechanism of the present utility model.

[0029] Figure 7 It is a structural schematic diagram of a second embodiment of a semiconductor refrigeration and temperature reduction mechanism of the present utility model.

[0030] Figure 8 This is a schematic diagram of the use state of the first embodiment of a semiconductor refrigeration and cooling mechanism of the present utility model.

[0031] Figure 9 This is a schematic diagram of the usage state of the third embodiment of the semiconductor refrigeration and temperature reduction mechanism of the present utility model.

[0032] Figure 10 The utility model is a structural schematic diagram of a cold compress module in a semiconductor refrigeration and temperature reduction mechanism.

[0033] Wherein: cooling pad 1, back pad 101, extension arm 102, seat cushion 103, contact layer 11, air outlet 111, air support layer 12, thermal insulation layer 13;

[0034] Refrigeration patch system 2, cold compress patch module 21, cold compress bag 211, cold conduction block 212, refrigeration host 22, semiconductor refrigeration sheet 221, refrigeration housing 222, heat dissipation inlet 2221, heat dissipation outlet 2222, heat dissipation element 223;

[0035] Air supply system 3, air inlet 301, air outlet 302, ventilation fan 31, air supply housing 32, air inlet mask 33. DETAILED DESCRIPTION

[0036] The following describes embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present invention and are not to be construed as limiting the present invention.

[0037] This technical solution provides a semiconductor refrigeration and cooling mechanism, including a refrigeration pad 1, a refrigeration patch system 2 and an air supply system 3;

[0038] The cooling pad 1 includes a contact layer 11, an air support layer 12, and a heat insulating layer 13 arranged in sequence, and the contact layer 11 is provided with a plurality of air outlets 111; the cooling pad 1 is also provided with heat dissipation vents, and the air outlets 111 and the heat dissipation vents are both connected to the air support layer 12;

[0039] The refrigeration patch system 2 includes a cold compress patch module 21 and a refrigeration main unit 22. The refrigeration main unit 22 is embedded in the air support layer 12. The cold compress patch module 21 is located on the outside of the contact layer 11, and the contact surface of the cold compress patch module 21 avoids the air outlet 111. The cold transfer end of the cold compress patch module 21 passes through the contact layer 11 and is in contact with the cold end surface of the semiconductor refrigeration plate 221 of the refrigeration main unit 22. The cold compress patch module 21 contains a cold storage material, and the refrigeration main unit 22 is used to transfer cold to the cold storage material. The refrigeration shell 222 of the refrigeration main unit 22 is provided with a heat dissipation inlet 2221 and a heat dissipation outlet 2222, and the heat dissipation inlet 2221 and the heat dissipation outlet 2222 are both connected to the air support layer 12.

[0040] The air supply system 3 passes through the contact layer 11 and is embedded in the air supporting layer 12. The air supply system 3 is provided with an air inlet 301 and an air outlet 302. The air inlet 301 is located outside the contact layer 11, and the air outlet 302 is located inside the air supporting layer 12 and communicates with the air supporting layer 12. The air supply system 3 is used to supply air to the air supporting layer 12.

[0041] In order to solve the technical problem of limited cooling effect of existing car seat cushions and improve the comfort and driving experience of drivers and passengers, this technical solution proposes a semiconductor refrigeration cooling mechanism, such as Figure 1-7 As shown, the device comprises a cooling pad 1 mounted on a car seat, a cooling patch system 2 (including a cooling patch module 21 for storing cold storage material and a cooling main unit 22 for transferring cold energy to the cold storage material), and an air supply system 3 for supplying air to the cooling pad 1. When the semiconductor refrigeration and cooling mechanism of this solution is in operation, the air generated by the air supply system 3 acts on the cooling pad 1. The cold fluid formed by the cold storage material (such as water, gel, or other materials that can store and release cold energy) and the airflow generated by the air supply system 3 jointly remove heat from the human body, forming a dual combination of cold fluid and cold airflow fields. This allows the driver and passenger to feel the flow of air while directly contacting the cooling patch module 21 storing the cold storage material, achieving the purpose of perspiration to a certain extent, thereby further enhancing the driver and passenger's sense of coolness and making the cooling experience more intense.

[0042] In addition, in the cold compress patch module 21 of the present technical solution, the semiconductor refrigeration plate 221 of the refrigeration host 22 transfers cold energy to the cold storage material through direct contact using the cold transfer end of the cold compress patch module 21, thereby reducing the heat loss of the cold storage material in the process of entering and exiting the cold compress patch module 21 through pipes, etc., and more effectively transferring the cold energy generated by the semiconductor refrigeration plate 221 in the refrigeration host 22 directly to the cold storage material, thereby improving the conversion rate of the refrigeration host 22.

[0043] In a specific embodiment, Figure 10 As shown, the cold compress module 21 of this embodiment includes a cold compress bag 211 and a cold conduction block 212. The cold conduction block 212 includes a cold conduction portion and a cold transfer portion. The cold conduction portion is arranged on the outside of the cold compress bag 211, and the cold transfer portion is arranged on the inside of the cold compress bag 211. The cold compress bag 211 contains a cold storage material. The cold end surface of the semiconductor refrigeration plate 221 of the refrigeration main unit 22 is in contact with the cold conduction portion. The refrigeration main unit 22 transfers cold energy to the cold storage material through the cold conduction block. In this embodiment, the cold transfer end of the cold compress module 21 is the cold conduction portion, and the cold conduction block 212 can be an aluminum block.

[0044] Furthermore, the refrigeration main unit 22 of the present solution is arranged inside the refrigeration pad 1, and the refrigeration main unit 22 is located inside the air support layer 12. Therefore, the present solution can utilize part of the wind entering the air support layer 12 to dissipate the heat of the hot end surface of the semiconductor refrigeration plate 221, so that the cooling fan can be omitted in the structure of the refrigeration main unit 22, making the structure of the refrigeration main unit 22 more compact and lower in cost.

[0045] It should be noted that the heat dissipation process of the cooling main unit 22 of this solution is specifically as follows: the air generated by the air supply system 3 enters the air support layer 12 through the air outlet 302, a portion of which passes through the air outlet 111 to form an outlet airflow on the outside of the contact layer 11, while the remaining air enters the interior of the cooling main unit 22 through the heat dissipation inlet 2221, carrying the heat generated by the hot end surface of the semiconductor cooling plate 221 to the heat dissipation outlet and then out of the cooling pad 1. It should be noted that the location of the heat dissipation outlet can be arranged according to the installation position of the cooling main unit 22 and the location of the heat dissipation outlet 2222, and this solution does not limit this.

[0046] Furthermore, in order to allow the driver and passengers to feel the cooling effect brought by the air supply system 3 more directly, the present solution also optimizes the structure of the cooling pad 1 so that it can fully play the dual role of ventilation and support. Among them, the provision of the air support layer 12 is conducive to better storage of the large amount of wind generated by the air supply system 3 in the cooling pad 1, thereby increasing the air flow of the air outlet 111 and making the cooling effect more obvious. The provision of the thermal insulation layer 13 is mainly used to prevent the wind from escaping from the outside of the cooling pad 1, thereby being more conducive to increasing the cooling effect of the cooling pad 1. In a specific embodiment, the thermal insulation layer 13 is made of polyester fiber, and the air support layer 12 is a 3D support structure, the interior of which is supported by a plurality of mutually interlaced support ribs to form the three-dimensional space of the air support layer 12, which is conducive to the large amount of wind storage, while not affecting the flow of air inside the air support layer 12, thereby avoiding the increase of wind resistance.

[0047] Further explained, the cooling pad 1 includes an integrally formed back pad 101 and an extension arm 102, the extension arm 102 being protrudingly connected to both sides of the back pad 101, and the cooling patch system 2 being arranged on the back pad 101, and the air supply system 3 being arranged at the end of the extension arm 102.

[0048] In one embodiment of the present technical solution, in order to make full use of the air inside the vehicle, the present solution designs the cooling pad 1 as a dual-region structure of an integrally formed back pad 101 and an extension arm 102, such as Figure 6 As shown, when the cooling pad 1 is installed on the car seat, the air inlet 301 of the air supply system 3 is located behind the seat, which is conducive to fully mobilizing the air in the car to assist in cooling the car, and on the other hand, it is also conducive to the fixation and installation of the cooling pad 1; in a specific embodiment, the present solution can add a fixing strap at the end of the extension arm 102 to achieve its snap-on installation on the back of the seat, and by adjusting the length of the snap position of the fixing strap, it can adapt to the universal installation requirements of different seat thicknesses and widths, such as Figure 8 shown.

[0049] To further explain, the cooling pad 1 further includes a seat cushion 103 , and the seat cushion 103 is integrally connected to the bottom of the back cushion 101 .

[0050] As a better embodiment of the above, the present invention further adds a seat cushion 103 to the cooling pad 1, and designs the cooling pad 1 as an integrated three-region structure, such as Figure 7 As shown, the air supply system 3 delivers external air to the back or arms of the driver and passenger, further enhancing the cooling feeling.

[0051] To further explain, the cooling pad 1 includes an integrally formed back pad 101 and a seat cushion 103 , the seat cushion 103 is connected to the bottom of the back pad 101 , and the cooling patch system 2 is arranged on the back pad 101 , and the air supply system 3 is arranged at the lower part of the seat cushion 103 .

[0052] In another embodiment of the present technical solution, the air supply system 3 can also be installed in a sunken manner, such as Figure 9 As shown, this can fully mobilize the air under the car seat to assist in cooling the car.

[0053] Furthermore, at least two groups of cooling patch systems 2 are provided, and the two groups of cooling patch systems 2 are spaced apart and arranged in the middle of the back pad 101. In this way, the driver and passengers can feel the coolness more intensely.

[0054] Further, the air supply system 3 includes a ventilation fan 31, an air supply housing 32, and an air inlet mask 33 installed in sequence, and the ventilation fan 31 is located inside the air supporting layer 12, and the air supply housing 32 and the air inlet mask 33 are both located outside the contact layer 11;

[0055] The inlet of the air inlet mask 33 is the air inlet 301, and the outlet of the ventilation fan 31 is the air outlet 302. The air inlet mask 33, the air supply housing 32 and the ventilation fan 31 are interconnected to form an air supply duct. The contact layer 11 is further provided with an avoidance hole for avoiding the air supply duct.

[0056] The air inlet direction of the air supply system 3 and the air outlet direction of the air supply system 3 are perpendicular to each other.

[0057] Compared with the parallel air supply in which the airflow quickly "passes through the hall", in this solution, when the air supply system 3 realizes vertical air supply, the airflow can repeatedly pass through the air support layer 12 during the turning and diffusion process, which can absorb heat more efficiently, thereby accelerating cooling (especially in areas prone to sweating such as the buttocks and back) and reducing the damp and sticky feeling.

[0058] To further explain, the ventilation fan 31 is a centrifugal fan.

[0059] In order to more effectively deliver the external airflow to the remote position of the cooling pad 1, this solution optimizes the ventilation fan 31 to be a centrifugal fan, thereby increasing the airflow pressure to offset the high resistance inside the cooling pad 1, so as to ensure that the airflow is also blown out from the remote position inside the cooling pad 1.

[0060] Further, the refrigeration host 22 includes the semiconductor refrigeration plate 221, the refrigeration shell 222 and the heat sink 223. The semiconductor refrigeration plate 221 and the heat sink 223 are both installed inside the refrigeration shell 222, and the hot end surface of the semiconductor refrigeration plate 221 is in contact with the heat sink 223.

[0061] The refrigeration shell 222 is further provided with an escape opening, which is arranged close to the cold end surface of the semiconductor refrigeration plate 221, and is used for the cold transfer end of the cold compress module 21 to pass through.

[0062] Since the semiconductor refrigeration plate 221 of this solution is made using the Peltier effect, the Peltier effect refers to the phenomenon that when a direct current passes through a galvanic couple composed of two semiconductor materials, one end of the galvanic couple absorbs heat and the other end releases heat; in other words, the semiconductor refrigeration plate 221 is made of two semiconductor materials, forming a hot end and a cold end, the cold end continuously absorbs heat to achieve cooling; the hot end continuously releases heat.

[0063] To help the hot end surface of the semiconductor cooling plate 221 dissipate heat quickly, this solution also adds a heat sink 223 to the cooling main unit 22. The mutual contact between the hot end surface and the heat sink 223 facilitates direct and effective heat conduction, thereby improving the cooling effect of the cooling main unit 22. In addition, a clearance is provided in the cooling housing 222 to facilitate the contact and installation of the cold end of the cold compress module 21 with the cold end surface of the semiconductor cooling plate 221.

[0064] Furthermore, the heat sink 223 has multiple heat dissipation channels formed therein, and the heat dissipation inlet 2221 and the heat dissipation outlet 2222 are located at the two ends of the heat dissipation channels, thereby increasing the contact area between the airflow and the heat sink 223 and further accelerating heat removal.

[0065] To further illustrate, the heat dissipation inlet 2221 and the heat dissipation outlet 2222 are arranged relative to each other, so as to quickly remove the heat generated in the refrigeration main unit 22.

[0066] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, they indicate the presence of features, steps, operations, devices, components and / or combinations thereof.

[0067] Unless otherwise specifically stated, the relative arrangement of the parts and steps, the numerical expressions and the numerical values ​​set forth in these embodiments do not limit the scope of the present invention. At the same time, it should be understood that, for ease of description, the sizes of the various parts shown in the drawings are not drawn according to the actual proportional relationship. The techniques, methods and equipment known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, the techniques, methods and equipment should be considered as part of the authorization specification. In all examples shown and discussed here, any specific values ​​should be interpreted as being merely exemplary and not as limitations. Therefore, other examples of the exemplary embodiments may have different values. It should be noted that similar numbers and letters represent similar items in the following figures, and therefore, once an item is defined in one figure, it does not need to be further discussed in subsequent figures.

[0068] In the description of the present invention, it needs to be understood that the directions or positional relationships indicated by directional words such as "front, back, up, down, left, right", "horizontal, vertical, vertical, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the drawings. They are only for the convenience of describing the present invention and simplifying the description. Unless otherwise specified, these directional words do not indicate or imply that the device or element referred to must have a specific direction or be constructed and operated in a specific direction. Therefore, they cannot be understood as limiting the scope of protection of the present invention; the directional words "inside and outside" refer to the inside and outside relative to the outline of each component itself.

[0069] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used herein to describe the spatial positional relationship of a device or feature to other devices or features as shown in the figures. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figures. For example, if the device in the drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0070] In addition, it should be noted that the use of words such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. Unless otherwise stated, the above words have no special meaning and therefore cannot be understood as limiting the scope of protection of this utility model.

[0071] It should be noted that the terms "first," "second," and the like in the specification and claims of this application and the accompanying drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate, such that the embodiments of the present application described herein can be implemented in an order other than that illustrated or described herein.

[0072] The technical principles of the present invention have been described above with reference to specific embodiments. These descriptions are intended solely to illustrate the principles of the present invention and should not be construed in any way as limiting the scope of protection of the present invention. Based on the explanations herein, those skilled in the art will be able to devise other specific implementations of the present invention without inventive effort, and such implementations will fall within the scope of protection of the present invention.

Claims

1. A semiconductor refrigeration and cooling mechanism, characterized in that: The cooling pad comprises a cooling pad, a cooling patch system and an air supply system; the cooling pad comprises a contact layer, an air support layer and a heat insulation layer arranged in sequence, and the contact layer is provided with a plurality of air outlets; the cooling pad is also provided with a heat dissipation vent, and the air outlet vent and the heat dissipation vent are both connected to the air support layer; The refrigeration patch system includes a cold compress patch module and a refrigeration main unit. The refrigeration main unit is embedded in the air support layer, the cold compress patch module is located outside the contact layer, and the contact surface of the cold compress patch module avoids the air outlet. The cold transfer end of the cold compress patch module passes through the contact layer and contacts the cold end surface of the semiconductor refrigeration plate of the refrigeration main unit. The cold compress patch module contains a cold storage material, and the refrigeration main unit is used to transfer cold energy to the cold storage material. The refrigeration shell of the refrigeration main unit is provided with a heat dissipation inlet and a heat dissipation outlet, and the heat dissipation inlet and the heat dissipation outlet are both connected to the air support layer. The air supply system passes through the contact layer and is embedded in the interior of the air supporting layer. The air supply system is provided with an air inlet and an air outlet, wherein the air inlet is located outside the contact layer, and the air outlet is located inside the air supporting layer and is interconnected with the air supporting layer. The air supply system is used to supply air to the air supporting layer.

2. The semiconductor refrigeration and cooling mechanism according to claim 1, characterized in that: The cooling pad includes an integrally formed back pad and an extension arm, wherein the extension arm is protrudingly connected to both sides of the back pad, and the cooling patch system is arranged on the back pad, and the air supply system is arranged at the end of the extension arm.

3. The semiconductor refrigeration and cooling mechanism according to claim 2, characterized in that: The cooling pad also includes a seat cushion, which is integrally connected to the bottom of the back cushion.

4. The semiconductor refrigeration and cooling mechanism according to claim 1, characterized in that: The cooling pad includes an integrally formed back pad and seat pad, the seat pad is connected to the bottom of the back pad, the cooling patch system is arranged on the back pad, and the air supply system is arranged on the lower part of the seat pad.

5. A semiconductor refrigeration and cooling mechanism according to claim 2 or 4, characterized in that: At least two groups of the cooling patch system are provided, and the two groups of the cooling patch system are arranged in the middle of the back pad at intervals.

6. The semiconductor refrigeration and cooling mechanism according to claim 1, characterized in that: The air supply system includes a ventilation fan, an air supply housing, and an air inlet mask installed in sequence, wherein the ventilation fan is located inside the air support layer, and the air supply housing and the air inlet mask are both located outside the contact layer; The inlet of the air inlet mask is the air inlet, the outlet of the ventilation fan is the air outlet, the air inlet mask, the air supply housing and the ventilation fan are interconnected to form an air supply duct, and the contact layer is further provided with an avoidance hole for avoiding the air supply duct; The air inlet direction of the air supply system and the air outlet direction of the air supply system are perpendicular to each other.

7. The semiconductor refrigeration and cooling mechanism according to claim 6, characterized in that: The ventilation fan is a centrifugal fan.

8. The semiconductor refrigeration and cooling mechanism according to claim 1, characterized in that: The refrigeration host comprises the semiconductor refrigeration plate, the refrigeration shell and the heat sink, the semiconductor refrigeration plate and the heat sink are both installed inside the refrigeration shell, and the hot end surface of the semiconductor refrigeration plate is in contact with the heat sink; The refrigeration shell is further provided with an escape opening, which is arranged close to the cold end surface of the semiconductor refrigeration plate, and the escape opening is used for the cold transfer end of the cold compress module to pass through.

9. The semiconductor refrigeration and cooling mechanism according to claim 8, characterized in that: A plurality of heat dissipation channels are provided inside the heat dissipation element, and the heat dissipation inlet and the heat dissipation outlet are respectively located at two ends of the heat dissipation channels.

10. The semiconductor refrigeration and cooling mechanism according to claim 1, characterized in that: The heat dissipation inlet and the heat dissipation outlet are arranged opposite to each other.

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