Ultralow temperature solenoid valve
By installing a semiconductor heating ring and plate on the solenoid valve, the problem of waxing of silicone oil in the solenoid valve under ultra-low temperature is solved, ensuring that the solenoid valve can work stably under ultra-low temperature conditions.
Patent Information
- Application Number
- CN202422898722.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-27
- Publication Date
- 2025-09-26
- Estimated Expiration
- 2034-11-27
AI Technical Summary
Under ultra-low temperature conditions, the silicone oil in the solenoid valve easily waxes, making it difficult to open and unable to close completely.
A semiconductor heating ring is installed on the connecting joint of the solenoid valve, and the semiconductor heating plate is fixed to the solenoid valve body through a fixing component and an installation component. The heating ring and plate are turned on in advance using a time controller to prevent the silicone oil from waxing.
Ensure that the solenoid valve opens and closes stably under ultra-low temperature conditions, avoids the waxing of silicone oil, and achieves smooth operation.
Smart Images

Figure CN223388114U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of solenoid valves, in particular to a solenoid valve for ultra-low temperatures. Background Art
[0002] In the field of vacuum coating and composite current collectors, the temperature of the ultra-low temperature fluid refrigerant is minus 120 degrees Celsius. It flows to the place where cooling is required through the main valve (proportional valve). Each control area (that is, the tributary) will use a solenoid valve to control the switch.
[0003] However, ultra-low temperatures will also affect the use of solenoid valves, because silicone oil will wax inside the local pipeline under ultra-low temperature conditions, causing difficulty in opening the solenoid valve and failure to achieve complete closure when closing.
[0004] For this reason, a solenoid valve for ultra-low temperature is proposed. Utility Model Content
[0005] The purpose of the present invention is to solve the problems raised in the above background technology, and to provide a solenoid valve for ultra-low temperature use.
[0006] In order to achieve the above-mentioned purpose, the present invention specifically adopts the following technical solutions:
[0007] An ultra-low temperature solenoid valve comprises a solenoid valve body, wherein semiconductor heating rings are sleeved on the connecting joints at both ends of the solenoid valve body, and a fixing assembly is threadedly sleeved on the connecting joint for fixing the semiconductor heating ring on the connecting joint. An installation assembly is provided on the solenoid valve body, and a semiconductor heating plate is provided in the installation assembly, and the installation assembly is used to fit the semiconductor heating plate with the bottom surface of the solenoid valve body.
[0008] Furthermore, the fixing assembly includes a threaded sleeve, a protective shell is fixedly installed on the end of the threaded sleeve, and an elastic pressure ring is provided in the protective shell. The threaded sleeve is threadedly sleeved on the connecting joint to fix the protective shell.
[0009] Furthermore, the mounting assembly includes a rectangular mounting plate fixedly mounted on the surface of the solenoid valve body, a mounting box is attached to the bottom surface of the rectangular mounting plate, bolts are inserted between the rectangular mounting plate and the mounting box for fixing the mounting box, several groups of springs are fixedly mounted on the inner bottom of the mounting box, and a push plate is fixedly mounted on the end of the spring.
[0010] Furthermore, when the semiconductor heating ring is installed, the elastic pressure ring is in a compressed state, and the end of the protective shell is tightly fitted with the end face of the solenoid valve body.
[0011] Furthermore, the push plate is located inside the installation box, and the push plate is arranged to slide vertically inside the installation box.
[0012] Furthermore, when the semiconductor heating plate is installed, the spring is in a compressed state, so that the semiconductor heating plate is in close contact with the bottom surface of the solenoid valve body.
[0013] The beneficial effects of the utility model are as follows:
[0014] By respectively sleeved two sets of semiconductor heating rings on the connecting joints, the end faces of the semiconductor heating rings are fitted with the surface of the solenoid valve body, and the semiconductor heating rings are fixedly installed through the fixing components, so that the semiconductor heating rings and the end faces of the solenoid valve body are tightly fitted, and the semiconductor heating plate is fixedly installed on the bottom surface of the solenoid valve body through the installation components. Before the solenoid valve body is controlled to open by the main controller, the semiconductor heating rings and the semiconductor heating plate are controlled to open in advance by the time controller, thereby heating the solenoid valve body to avoid waxing of the silicone oil transported in the solenoid valve body due to low temperature, so that the solenoid valve body is stable and smooth when opening and closing. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 This is a schematic diagram of the three-dimensional structure of the utility model;
[0016] Figure 2 It is a front view of the utility model;
[0017] Figure 3 It is an exploded view of the utility model;
[0018] Figure 4 It is a partial cross-sectional view of the utility model;
[0019] Figure 5 This is a control flow chart of the utility model;
[0020] Figure numerals: 1, solenoid valve body; 11, connecting joint; 2, semiconductor heating ring; 3, fixing assembly; 301, threaded sleeve; 302, protective shell; 303, elastic pressure ring; 4, mounting assembly; 401, rectangular mounting plate; 402, mounting box; 403, bolt; 404, spring; 405, push plate; 5, semiconductor heating plate. DETAILED DESCRIPTION
[0021] To make the purpose, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings herein can be arranged and designed in various different configurations.
[0022] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but rather merely represents selected embodiments of the present invention. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without creative effort are also within the scope of protection of the present invention.
[0023] It should be noted that similar reference numerals and letters represent similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings. In addition, the terms "first," "second," etc. are used only to distinguish the descriptions and are not to be understood as indicating or implying relative importance.
[0024] In the description of the embodiments of the present invention, it should be noted that the terms "inside", "outside", "upper", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the product of the present invention is usually placed when in use. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as a limitation on the present invention.
[0025] like Figures 1 to 5 As shown, a solenoid valve for ultra-low temperature use includes a solenoid valve body 1, semiconductor heating rings 2 are sleeved on the connecting joints 11 at both ends of the solenoid valve body 1, and a fixing component 3 is threadedly sleeved on the connecting joint 11 for fixing the semiconductor heating ring 2 on the connecting joint 11, a mounting component 4 is provided on the solenoid valve body 1, and a semiconductor heating plate 5 is provided in the mounting component 4, and the mounting component 4 is used for the semiconductor heating plate 5 to fit with the bottom surface of the solenoid valve body 1. More specifically, by respectively sleeved two groups of semiconductor heating rings 2 on the connecting joints 11, the end faces of the semiconductor heating rings 2 are fitted with the surface of the solenoid valve body 1, and the semiconductor heating rings 2 are fixedly installed through the fixing components 3, so that the semiconductor heating rings 2 and the end faces of the solenoid valve body 1 are tightly fitted, and the semiconductor heating plate 5 is fixedly installed on the bottom surface of the solenoid valve body 1 through the installation components 4. Before the solenoid valve body 1 is controlled to open by the main controller, the semiconductor heating rings 2 and the semiconductor heating plate 5 are controlled by the time controller to open in advance, thereby heating the solenoid valve body 1 to avoid the waxing of the silicone oil transported in the solenoid valve body 1 due to low temperature, so that the solenoid valve body 1 is stable and smooth when opening and closing.
[0026] The fixing assembly 3 includes a threaded sleeve 301, a protective shell 302 is fixedly installed at the end of the threaded sleeve 301, and an elastic pressure ring 303 is provided in the protective shell 302. The threaded sleeve 301 is threadedly sleeved on the connecting joint 11 to fix the protective shell 302. More specifically, by sleeve-mounting the semiconductor heating ring 2 on the connecting joint 11, the end face of the semiconductor heating ring 2 is fitted with the end face of the solenoid valve body 1. By sleeve-mounting the threaded sleeve 301 on the connecting joint 11, the protective shell 302 is sleeved on the surface of the semiconductor heating ring 2, and is fitted with the other end of the semiconductor heating ring 2 through the elastic pressure ring 303. Under the elastic force of the elastic pressure ring 303, the semiconductor heating ring 2 is tightly fitted and installed with the solenoid valve body 1.
[0027] The mounting assembly 4 includes a rectangular mounting plate 401 fixedly mounted on the surface of the solenoid valve body 1. The bottom surface of the rectangular mounting plate 401 is fitted with a mounting box 402. Bolts 403 are inserted between the rectangular mounting plate 401 and the mounting box 402 to fix the mounting box 402. Several groups of springs 404 are fixedly mounted on the inner bottom of the mounting box 402, and a push plate 405 is fixedly mounted on the end of the spring 404. More specifically, the semiconductor heating plate 5 is placed on the push plate 405, the mounting box 402 is fitted with the rectangular mounting plate 401, and the mounting box 402 is fixedly mounted on the solenoid valve body 1 via the bolts 403. As the mounting box 402 is fixedly installed, the springs 404 are compressed. Under the elastic force of the springs 404, the semiconductor heating plate 5 is fitted with the bottom surface of the solenoid valve body 1.
[0028] When the semiconductor heating ring 2 is installed, the elastic pressure ring 303 is compressed, and the end of the protective shell 302 is in close contact with the end surface of the solenoid valve body 1. More specifically, the elastic force of the elastic pressure ring 303 causes the semiconductor heating ring 2 to be in close contact with the surface of the solenoid valve body 1.
[0029] The push plate 405 is located inside the installation box 402, and the push plate 405 is vertically slidably arranged inside the installation box 402. More specifically, the push plate 405 is vertically guided and limited by the installation box 402.
[0030] When the semiconductor heating plate 5 is installed, the spring 404 is compressed to ensure that the semiconductor heating plate 5 is in close contact with the bottom surface of the solenoid valve body 1. More specifically, the spring 404 is compressed after the semiconductor heating plate 5 is installed, thereby ensuring that the semiconductor heating plate 5 is in close contact with the bottom end of the solenoid valve body 1.
[0031] In summary: by respectively sleeved the two groups of semiconductor heating rings 2 on the connecting joint 11, the end faces of the semiconductor heating rings 2 are fitted with the surface of the solenoid valve body 1, and the semiconductor heating rings 2 are fixedly installed through the fixing component 3, so that the semiconductor heating rings 2 and the end faces of the solenoid valve body 1 are tightly fitted, and the semiconductor heating plate 5 is fixedly installed on the bottom surface of the solenoid valve body 1 through the installation component 4. Before the solenoid valve body 1 is controlled to open by the main controller, the semiconductor heating rings 2 and the semiconductor heating plate 5 are controlled by the time controller to open in advance, thereby heating the solenoid valve body 1 to avoid the waxing of the silicone oil transported in the solenoid valve body 1 due to low temperature, so that the solenoid valve body 1 is stable and smooth when opening and closing.
[0032] The above shows and describes the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions merely illustrate the principles of the present invention. Various changes and improvements are possible without departing from the spirit and scope of the present invention. Such changes and improvements are intended to fall within the scope of the present invention. The scope of protection claimed for the present invention is defined by the appended claims and their equivalents.
Claims
1. Ultra-low temperature solenoid valve, characterized in that: The invention comprises a solenoid valve body (1), wherein semiconductor heating rings (2) are sleeved on connecting joints (11) at both ends of the solenoid valve body (1), and a fixing assembly (3) is threadedly sleeved on the connecting joint (11) for fixing the semiconductor heating ring (2) on the connecting joint (11), and a mounting assembly (4) is provided on the solenoid valve body (1), and a semiconductor heating plate (5) is provided in the mounting assembly (4), and the mounting assembly (4) is used for the semiconductor heating plate (5) to fit the bottom surface of the solenoid valve body (1).
2. The ultra-low temperature solenoid valve according to claim 1, characterized in that: The fixing assembly (3) comprises a threaded sleeve (301), a protective shell (302) is fixedly mounted on the end of the threaded sleeve (301), and an elastic pressure ring (303) is provided in the protective shell (302), and the threaded sleeve (301) and the connecting joint (11) are threadedly sleeved to fix the protective shell (302).
3. The ultra-low temperature solenoid valve according to claim 1, characterized in that: The mounting assembly (4) comprises a rectangular mounting plate (401) fixedly mounted on the surface of the solenoid valve body (1); a mounting box (402) is attached to the bottom surface of the rectangular mounting plate (401); bolts (403) are inserted between the rectangular mounting plate (401) and the mounting box (402) for fixing the mounting box (402); a plurality of groups of springs (404) are fixedly mounted on the inner bottom of the mounting box (402), and a push plate (405) is fixedly mounted on the end of the spring (404).
4. The ultra-low temperature solenoid valve according to claim 2, characterized in that: When the semiconductor heating ring (2) is installed, the elastic pressure ring (303) is in a compressed state, and the end of the protective shell (302) is tightly fitted with the end surface of the electromagnetic valve body (1).
5. The ultra-low temperature solenoid valve according to claim 3, characterized in that: The push plate (405) is located inside the installation box (402), and the push plate (405) is arranged to slide vertically inside the installation box (402).
6. The ultra-low temperature solenoid valve according to claim 3, characterized in that: When the semiconductor heating plate (5) is installed, the spring (404) is in a compressed state, so that the semiconductor heating plate (5) and the bottom surface of the solenoid valve body (1) are tightly fitted.