Lightweight vehicle-mounted computer with high computing power density

Abstract

The utility model relates to a light-weight vehicle-mounted computer with high computing power density, belongs to the technical field of vehicle-mounted computers, and solves the problem that the existing light-weight vehicle-mounted computer with high computing power density is insufficient in adaptability to severe environments. The vehicle-mounted computer comprises a case and a circuit board, wherein the circuit board is arranged in the case; the case comprises a case body and two side plates, the left side and the right side of the case body are provided with openings, the two side plates are detachably arranged at the openings in the left side and the right side of the case body respectively, and the edges of the side plates and the corresponding edges of the openings of the case body are connected in a sealed mode through shielding rubber strips. And a plurality of radiating fins are arranged on the outer surfaces of the two side plates. According to the vehicle-mounted computer, the structure of the case of the vehicle-mounted computer is improved, so that the vehicle-mounted computer can meet the requirements of high computing power density, high reliability and good severe environment resistance.

Description

Technical Field

[0001] The utility model relates to the technical field of vehicle-mounted computers, and in particular to a lightweight vehicle-mounted computer with high computing power density. Background Art

[0002] Robots have broad application prospects in unmanned equipment and related fields. The intelligent on-board computer (main control computer) is the core information processing device of the unmanned equipment robot. It connects the robot's humanoid arm, payload controller, video sensor, radar sensor, navigation equipment, etc. through network, bus and other interfaces to realize robot control, management, monitoring, verification, patrol and other functions, and has NPU intelligent computing power to provide a computing power platform for voice recognition, gesture recognition and unmanned driving.

[0003] The performance requirements of the main control computer are mainly reflected in the following aspects:

[0004] (1) High computing density and high performance

[0005] With the rapid growth of demand for data resources in the information field, high-speed bus network systems based on high-performance processors, large-capacity storage devices, and diversified transmission capabilities have become an urgent need and mainstream development trend.

[0006] (2) Lightweight and miniaturization

[0007] Electronic devices will inevitably become lighter and smaller, making them easier to deploy. Therefore, the space available for the main control computer will be very limited, and it is necessary to reduce its size and weight. Key technologies such as high assembly density and low-power hardware and software design will be used to achieve miniaturization and lightweight design.

[0008] (3) High reliability

[0009] When the main control computer collects, stores and manages data, each operation of the system must be highly reliable to ensure that the system can run stably for a long time.

[0010] (4) Good resistance to harsh environments

[0011] The main control computer should have good resistance to harsh environments and be able to work stably and with high performance under harsh conditions such as high altitude, high and low temperatures, high vibration, and rain.

[0012] Therefore, there is an urgent need for a lightweight, high-computing-density, and environmentally adaptable vehicle-mounted computer to meet the high-performance usage requirements in complex environments such as high temperature, high humidity, vibration and shock, and electromagnetic compatibility. Utility Model Content

[0013] In view of the above analysis, the present invention aims to provide a lightweight, high-computing-power-density vehicle-mounted computer to solve the problem that existing lightweight, high-computing-power-density vehicle-mounted computers are insufficiently adaptable to harsh environments.

[0014] The utility model provides a lightweight and high-computing-density vehicle-mounted computer, the vehicle-mounted computer comprising: a chassis and a circuit board, the circuit board being arranged inside the chassis;

[0015] The chassis includes a box body and two side panels. The box body is provided with openings on the left and right sides. The two side panels are detachably provided at the openings on the left and right sides of the box body respectively. The edges of the side panels are sealed to the edges of the corresponding box body openings by shielding rubber strips. Multiple heat dissipation fins are provided on the outer surfaces of the two side panels.

[0016] Based on the further improvement of the above-mentioned on-board computer, on each of the side panels, the heat dissipation fins extend along the height direction of the side panel, and a plurality of heat dissipation fins are arranged in sequence at equal intervals along the width direction of the side panel.

[0017] Based on a further improvement of the above-mentioned on-board computer, a fan is provided below the heat dissipation fins on each of the side panels, and an air outlet of the fan faces the corresponding heat dissipation fins.

[0018] Based on the further improvement of the above-mentioned on-board computer, the thickness of the heat dissipation fin is 1mm to 3mm, the gap between two adjacent heat dissipation fins is 3mm to 5mm, and the number of the heat dissipation fins on each side panel is 30 to 50.

[0019] Based on the further improvement of the above-mentioned on-board computer, each of the side panels is provided with a protective plate, the protective plate is provided on the outside of the fan, and the protective plate is provided with a plurality of evenly distributed ventilation holes.

[0020] Based on the further improvement of the above-mentioned on-board computer, a heat dissipation bonding surface is provided on the outer surface of the high-power chip on the circuit board. The heat dissipation bonding surface is made of insulating thermal conductive material and is bonded to the inner surface of the side panel.

[0021] Based on the further improvement of the above-mentioned on-board computer, the box body and the two side panels are made of hard aluminum alloy material.

[0022] Based on the further improvement of the above-mentioned on-board computer, a heat protection coating is provided on the outer surfaces of the box body and the side panels.

[0023] Based on the further improvement of the above-mentioned on-board computer, the cross section of the shielding rubber strip is O-shaped.

[0024] Based on the further improvement of the above-mentioned on-board computer, the front panel of the box is provided with multiple mounting holes, each of the mounting holes is provided with an aviation socket, and the gap between the outer wall of the aviation socket and the mounting hole is sealed by a conductive shielding rubber gasket.

[0025] Compared with the prior art, the present invention can achieve at least one of the following beneficial effects:

[0026] 1. In the present invention, by improving the structure of the chassis of the vehicle-mounted computer, the vehicle-mounted computer can meet the requirements of high computing power density, high reliability and good resistance to harsh environments. The chassis and the side panels are sealed by shielding rubber strips, forming a sealed space inside the chassis, which can effectively provide waterproof and electromagnetic shielding, thereby improving the computer's ability to resist harsh environments. At the same time, heat dissipation fins are provided on the side panels to enable the chassis to effectively dissipate heat, avoiding excessive internal temperature of the chassis affecting the stable operation of the computer, and meeting the computer's requirements of high computing power density and high reliability.

[0027] 2. In the present invention, a fan is provided below the heat dissipation fins for use therewith, thereby further improving the heat dissipation capacity inside the chassis.

[0028] 3. In the present invention, a heat dissipation bonding surface is provided on the outer surface of the high-power chip on the circuit board, and the heat dissipation bonding surface is bonded to the inner surface of the side panel, so that a good thermal path is formed between the high-power chip and the chassis shell, so that the chip has good heat dissipation capability and can work stably at higher power and frequency, thereby ensuring that the computer can have a higher computing power density.

[0029] In the present invention, the above-mentioned technical solutions can be combined with each other to achieve more preferred combinations. Other features and advantages of the present invention will be described in the following content, and some advantages will become apparent from the description or be understood through practice of the present invention. The objectives and other advantages of the present invention can be realized and obtained through the contents particularly pointed out in the text and drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] The accompanying drawings are only used for the purpose of illustrating specific embodiments and are not to be considered as limiting the present invention. Throughout the accompanying drawings, the same reference symbols denote the same components.

[0031] Figure 1 A perspective view of an on-vehicle computer according to an embodiment of the present invention;

[0032] Figure 2 A front view of a vehicle-mounted computer according to an embodiment of the present invention;

[0033] Figure 3 This is a right side view of an on-vehicle computer according to an embodiment of the present invention;

[0034] Figure 4 A top view of a vehicle-mounted computer according to an embodiment of the present invention;

[0035] Figure 5 A schematic diagram of the internal structure of an on-board computer according to an embodiment of the present invention;

[0036] Figure 6 The figure is a cross-sectional schematic diagram of the internal structure of a vehicle-mounted computer according to an embodiment of the present invention.

[0037] Reference numerals:

[0038] 1- box body; 2- side panel; 3- heat sink fin; 4- shielding rubber strip;

[0039] 5-Fan; 6-Protection plate; 7-Aviation socket; 8-Conductive shielding rubber pad;

[0040] 9-Heat dissipation bonding surface. DETAILED DESCRIPTION

[0041] The preferred embodiments of the present invention are described in detail below in conjunction with the accompanying drawings, wherein the accompanying drawings constitute a part of this application and are used together with the embodiments of the present invention to illustrate the principles of the present invention, and are not used to limit the scope of the present invention.

[0042] One embodiment of the present invention discloses a lightweight and high-computing-density vehicle-mounted computer. Figure 1-6 As shown in . The vehicle-mounted computer includes: a chassis and a circuit board, the circuit board being disposed within the chassis. The chassis includes a housing 1 and two side panels 2. The housing 1 is provided with openings on its left and right sides. The two side panels 2 are detachably disposed at the openings on the left and right sides of the housing 1. The edges of the side panels 2 are sealed to the edges of the corresponding openings of the housing 1 via shielding rubber strips 4. Multiple heat dissipation fins 3 are disposed on the outer surfaces of both side panels 2.

[0043] Compared with the prior art, the present invention improves the structure of the chassis of the on-board computer so that the on-board computer can meet the requirements of high computing power density, high reliability and good resistance to harsh environments. The chassis 1 and the side panel 2 are sealed and connected by a shielding rubber strip 4, and a sealed space is formed inside the chassis, which can effectively prevent water and electromagnetic shielding, thereby improving the computer's ability to resist harsh environments. At the same time, heat dissipation fins 3 are provided on the side panel 2, so that the chassis can effectively dissipate heat, avoiding excessively high internal temperature of the chassis affecting the stable operation of the computer, and meeting the computer's requirements of high computing power density and high reliability.

[0044] Specifically, the two side panels 2 are removably attached to the left and right openings of the case 1 using fasteners, such as screws. Furthermore, the case 1 and the two side panels 2 are connected by a stopper structure, comprising a first stopper portion and a second stopper portion that cooperate with each other. The first stopper portion is provided at the left and right openings of the case 1, and the edges of the side panels 2 are provided with the second stopper portion. Finally, after the chassis is assembled, a flexible adhesive sealant is applied to the exposed edges of the assembly to seal the assembly, thereby achieving the IP68 protection standard.

[0045] Furthermore, to protect the entire system from prolonged exposure to rain, rain, and immersion in extremely harsh environments, chemical protective measures are also implemented for the modules within the chassis to ensure they are resistant to moisture, salt spray, sand, dust, and mildew. These measures are implemented using coatings or potting materials with appropriate electrical conductivity, insulation, thermal conductivity, and heat resistance, tailored to the specific purpose of each component within the chassis. For example, the surface of a circuit board is coated with a protective agent that provides resistance to moisture, salt spray, and mildew.

[0046] Specifically, such as Figure 3 As shown in , on each of the side panels 2 , the heat dissipation fins 3 extend along the height direction of the side panel 2 , and a plurality of heat dissipation fins 3 are arranged in sequence at equal intervals along the width direction of the side panel 2 .

[0047] Preferably, a fan 5 is provided below the heat dissipation fins 3 on each side panel 2 , and an air outlet of the fan 5 faces the corresponding heat dissipation fin 3 .

[0048] In the present invention, a fan 5 is provided below the heat dissipation fins 3 for use therewith, thereby further improving the heat dissipation capacity inside the chassis.

[0049] Specifically, a plurality of fans 5 are provided below the heat dissipation fins 3 on each side panel 2 , and the plurality of fans 5 are arranged in sequence at equal intervals along the width direction of the side panel 2 .

[0050] During implementation, the required air volume of the system is calculated according to the above formula based on the heat dissipation requirements. After the required air volume is determined, the fan 5 is selected in combination with the requirements of installation size, noise, reliability, etc. According to the heat dissipation requirements and structural characteristics of the intelligent vehicle-mounted computer device of the present invention, an axial flow fan 5 with high air pressure, compact structure and small size is selected for heat dissipation, such as Figure 3 shown.

[0051] Specifically, the thickness of the heat dissipation fin 3 is 1 mm to 3 mm, preferably 2 mm; the gap between two adjacent heat dissipation fins 3 is 3 mm to 5 mm, preferably 4 mm; the number of the heat dissipation fins 3 on each side panel 2 is 30 to 50, preferably 40.

[0052] During implementation, the dimensional parameters of the radiator, such as the number of fins, thickness, and gap, are designed and determined according to the wind resistance formula. Although increasing the number of heat dissipation fins 3 can increase the heat exchange area and enhance the heat exchange capacity, the wind resistance of the system will also increase with the increase of fins. After testing, the wind resistance should be controlled at 70-100 Pa, so the number of fins of the radiator should be within 40. After testing, preferably, the thickness of the heat dissipation fin 3 is 2 mm; the gap between two adjacent heat dissipation fins 3 is 4 mm; the number of heat dissipation fins 3 on each side panel 2 is 40.

[0053] Preferably, each of the side panels 2 is provided with a protective plate 6 , the protective plate 6 is provided on the outside of the fan 5 , and the protective plate 6 is provided with a plurality of evenly distributed ventilation holes.

[0054] In one embodiment, Figure 5 As shown in , a heat dissipation bonding surface 9 is provided on the outer surface of the high-power chip on the circuit board. The heat dissipation bonding surface 9 is made of insulating thermal conductive material, and the heat dissipation bonding surface 9 is bonded to the inner surface of the side plate 2.

[0055] During implementation, a chip whose power exceeds a preset power value is a high-power chip.

[0056] In the present invention, a heat dissipation bonding surface 9 is provided on the outer surface of the high-power chip on the circuit board, and the heat dissipation bonding surface 9 is bonded to the inner surface of the side panel 2, so that a good thermal path is formed between the high-power chip and the chassis shell, so that the chip has good heat dissipation capability and can work stably at higher power and frequency, thereby ensuring that the computer can have a higher computing power density.

[0057] During implementation, the components on the circuit board are reasonably laid out so that the high-power chip is adjacent to the side plate 2 , making it easier for its heat dissipation bonding surface 9 to bond with the inner surface of the side plate 2 .

[0058] In one embodiment, the box body 1 and the two side panels 2 are made of hard aluminum alloy material.

[0059] In response to the strong vibration and shock experienced in vehicle-mounted environments, a comprehensive comparison of commonly used steel, aluminum alloy, and magnesium alloy materials was conducted. While meeting the overall quality and dimensional requirements, duralumin alloy was selected as the base material for the structural components. Duralumin alloy offers high strength, excellent corrosion resistance, and high heat resistance, reducing overall weight while maximizing overall strength. It also offers excellent resistance to vibration and shock.

[0060] During implementation, the housing 1 and the two side panels 2 can be made of 2A12 aluminum. 2A12 aluminum is primarily used for structural components, compressor casings, container casings, and ship parts, meeting various environmental requirements. This material also possesses excellent electrical conductivity, and through circuit integration with electromagnetic shielding design, it offers resistance to electromagnetic interference.

[0061] In addition to selecting the chassis material, the mounting structure of the electrical modules within the chassis also needs to be optimized to improve structural strength and rigidity. For example, large and heavy electronic components are soldered to the circuit board, and the edges of the components are glued to the circuit board.

[0062] Specifically, modules such as circuit boards and filters are fixed in the chassis by fasteners such as screws, and are supplemented by measures such as thread glue and one-component silicone rubber.

[0063] Specifically, a heat protection coating is provided on the outer surfaces of the housing 1 and the side panels 2. Thus, by adding the heat protection coating, external high temperature burning can be prevented in a short time, which is beneficial to improving the computer's ability to adapt to harsh environments.

[0064] Furthermore, electron beams, laser beams, low-temperature plasma, and other equipment are used to apply high-thermal-resistance, wear-resistant, and corrosion-resistant coatings (i.e., thermal protective coatings), such as thermal barrier coatings, to the exterior surfaces of the housing 1 and side panels 2, thereby improving the material's heat resistance, corrosion resistance, and oxidation resistance. A typical thermal barrier coating is a two-layer structure, with a thermally insulating ceramic surface layer and an anti-oxidation adhesive layer within. These coatings are typically applied to the exterior surfaces of the structural components using plasma spraying or electron beam physical vapor deposition techniques.

[0065] Specifically, the cross section of the shielding rubber strip 4 is O-shaped. When the O-shaped shielding rubber strip 4 is squeezed by an external force, it generally undergoes a compression deformation of 15% to 30%, thereby achieving sealing.

[0066] More specifically, a sealing groove for accommodating the shielding rubber strip 4 is provided on the edge of the side panel 2 .

[0067] Specifically, the front panel of the box body 1 is provided with a plurality of mounting holes, each of the mounting holes is provided with an aviation socket, and the gap between the outer wall of the aviation socket and the mounting hole is sealed by a conductive shielding rubber pad 8.

[0068] During implementation, the aviation socket uses a sealed connector, and the interior is potted with silicone rubber to protect the solder joints and prevent the wires from breaking.

[0069] The above is only a preferred specific implementation method of the present invention, but the protection scope of the present invention is not limited to this. Any changes or replacements that can be easily thought of by any technician familiar with this technical field within the technical scope disclosed in the present invention should be covered by the protection scope of the present invention.

Claims

1. A lightweight, high-computing-density vehicle-mounted computer, characterized in that: The vehicle-mounted computer comprises: a chassis and a circuit board, wherein the circuit board is arranged inside the chassis; The chassis includes a box body and two side panels. The box body is provided with openings on the left and right sides. The two side panels are detachably provided at the openings on the left and right sides of the box body respectively. The edges of the side panels are sealed to the edges of the corresponding box body openings by shielding rubber strips. Multiple heat dissipation fins are provided on the outer surfaces of the two side panels.

2. The vehicle-mounted computer according to claim 1, wherein: On each of the side plates, the heat dissipation fins extend along the height direction of the side plate, and a plurality of heat dissipation fins are arranged in sequence at equal intervals along the width direction of the side plate.

3. The vehicle-mounted computer according to claim 2, wherein: The thickness of the heat dissipation fins is 1 mm to 3 mm, the gap between two adjacent heat dissipation fins is 3 mm to 5 mm, and the number of the heat dissipation fins on each side plate is 30 to 50.

4. The vehicle-mounted computer according to any one of claims 1 to 3, characterized in that: A fan is provided below the heat dissipation fins on each side panel, and an air outlet of the fan faces the corresponding heat dissipation fins.

5. The vehicle-mounted computer according to claim 4, characterized in that: Each of the side panels is provided with a protection plate, which is arranged on the outside of the fan and has a plurality of ventilation holes evenly distributed.

6. The vehicle-mounted computer according to any one of claims 1 to 3, characterized in that: A heat dissipation bonding surface is provided on the outer surface of the high-power chip on the circuit board. The heat dissipation bonding surface is made of insulating heat-conductive material and is bonded to the inner surface of the side plate.

7. The vehicle-mounted computer according to any one of claims 1 to 3, characterized in that: The box body and the two side panels are made of hard aluminum alloy material.

8. The vehicle-mounted computer according to any one of claims 1 to 3, characterized in that: Thermal protection coatings are provided on the outer surfaces of the box body and the side panels.

9. The vehicle-mounted computer according to any one of claims 1 to 3, characterized in that: The cross section of the shielding rubber strip is O-shaped.

10. The vehicle-mounted computer according to any one of claims 1 to 3, characterized in that: The front panel of the box is provided with a plurality of mounting holes, each of the mounting holes is provided with an aviation socket, and the gap between the outer wall of the aviation socket and the mounting hole is sealed by a conductive shielding rubber pad.

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