Side light-emitting type four-color colorful LED

Abstract

The utility model relates to the technical field of LEDs, in particular to a side light-emitting type four-color colorful LED. According to the CSP-LED white light chip, when white light needs to be emitted, the red light chip, the green light chip and the blue light chip do not need to be made to emit light at the same time so that the white light can be generated in a mixed mode, and therefore the heat productivity and the power of an LED can be greatly reduced, and the service life of the LED can be prolonged; light rays emitted by the CSP-LED white light wafer, the red light wafer, the green light wafer and the blue light wafer directly enter the light guide module of the display screen, so that the brightness of the light rays entering the display screen can be greatly improved, LED installation and wiring modes can be facilitated through the side-mounted bonding pads and the front-mounted bonding pads, connection between the LED and an external circuit is facilitated, and the service life of the display screen is prolonged. The applicability can be improved; the problems that an existing LED is difficult to emit light laterally, light spots of white light are not uniform, and the heating power of the LED is large when the white light is emitted are solved.

Description

Technical Field

[0001] The utility model relates to the technical field of LEDs, in particular to a side-emitting four-color dazzling LED. Background Art

[0002] Currently, there are two main structures for colorful LEDs on the market. One is the RGB three-crystal structure, which uses a formal chip, is connected by bonding wires, and realizes colorfulness through IC. However, because there is no white light chip, the color of the white light mixed by RGB is limited by the influence of the three primary colors of RGB, resulting in uneven light spots. In addition, the three chips work simultaneously, which generates high heat and high power. For gaming laptops, long-term use will accelerate light decay and shorten the life of the LED. The ambient lights in automotive products are more susceptible to decay and shortened life in high temperature environments. The second is the RGBW four-crystal structure, which uses a formal chip and is connected by bonding wires. One of the blue light chips needs to use a dispensing machine to apply phosphor powder to achieve RGBW four colors. However, the second method requires an additional process, and the white light and RGB need to be in separate spaces to achieve it. The process is cumbersome and increases cost. In addition, when emitting light, the two can only project residual light into the light guide module, resulting in weak brightness and uniformity. More LEDs are often required to increase brightness, resulting in increased cost. Utility Model Content

[0003] In view of the shortcomings of the existing technology, the present invention provides a side-emitting four-color colorful LED, which solves the problems that the existing LED is difficult to emit light from the side, has uneven white light spots and high heat power of the LED when it is white light.

[0004] To achieve the above objectives, the present invention provides the following technical solutions:

[0005] A side-emitting four-color LED includes a red chip, a green chip, and a blue chip for emitting red, green, and blue light, respectively, and a side-emitting mechanism for emitting light from the side.

[0006] The side-light-emitting mechanism includes a support plate serving as a mounting carrier, on which a mounting plate is provided that forms a certain angle with its mounting surface. The red light chip, the green light chip, and the blue light chip are all arranged on the mounting surface of the mounting plate. The mounting plate is also provided with a CSP-LED white light chip for emitting white light. The mounting plate is also provided with a solder pad assembly for supplying power to the red light chip, the green light chip, the blue light chip, and the CSP-LED white light chip.

[0007] Preferably, the mounting board is further provided with an IC for controlling the current in the red light chip, the green light chip, the blue light chip and the CSP-LED white light chip.

[0008] Preferably, the IC is a four-channel overflow-increasing IC.

[0009] Preferably, the pad assembly includes a side-mounted pad arranged on a side of the mounting plate away from the CSP-LED white light chip, and also includes a front-mounted pad arranged on a side of the support plate away from the mounting plate.

[0010] Preferably, the red light chip, the green light chip and the blue light chip are sequentially arranged at one end of the mounting plate.

[0011] Preferably, the red light chip, the green light chip and the blue light chip are all flip chips.

[0012] Compared with the existing technology, the present invention provides a side-emitting four-color LED with the following advantages:

[0013] 1. By setting up the CSP-LED white light chip, when white light is needed, there is no need to make the red light chip, green light chip and blue light chip emit light at the same time to mix and produce white light, which can greatly reduce the heat and power of the LED and help to increase the service life of the LED.

[0014] 2. Through the support plate and mounting plate, the light emitted by the CSP-LED white light chip, red light chip, green light chip and blue light chip is directly directed into the light guide module of the display screen, thereby greatly improving the brightness of the light entering the display screen.

[0015] 3. The side-mounted solder pads and the front-mounted solder pads can facilitate the installation and wiring of the LED and facilitate its connection with the external circuit, thereby improving its applicability. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0017] Figure 1 A schematic diagram of components on a mounting plate of the present invention;

[0018] Figure 2 This is a schematic diagram of the positions of the support plate, mounting plate and side pads of the utility model;

[0019] Figure 3 This is a schematic diagram of the front-mounted solder pad of the present invention.

[0020] In the figure: 1. Red light chip; 2. Green light chip; 3. Blue light chip; 4. Side light emitting mechanism; 41. Support plate; 42. Mounting plate; 43. CSP-LED white light chip; 44. Pad assembly; 441. Side-mounted pad; 442. Front-mounted pad; 45. IC. DETAILED DESCRIPTION

[0021] The embodiments of the present application will be described in detail below in conjunction with the accompanying drawings and embodiments, so as to fully understand the implementation process of how the present application uses technical means to solve technical problems and achieve technical effects and implement accordingly.

[0022] To solve the problems that existing LEDs are difficult to emit light from the side, the white light spot is uneven, and the heat generation power of the LED is large when emitting white light, the present invention provides a side-emitting type four-color colorful LED, which includes a red light chip 1, a green light chip 2, and a blue light chip 3 for respectively emitting red light, green light, and blue light. Under normal design, the red light chip 1, the green light chip 2, and the blue light chip 3 can separately emit three-color light, and the three chips light up simultaneously to mix and emit white light. It also includes a side-emitting mechanism 4 for side emission. At this time, the white light emitted by the side-emitting mechanism 4 is used to replace the white light generated by mixing the three-color light emitted by the red light chip 1, the green light chip 2, and the blue light chip 3, thereby reducing the high power when the red light chip 1, the green light chip 2, and the blue light chip 3 light up simultaneously, which is beneficial to reducing the overall power and heat of the LED, reducing the speed of LED light decay, and improving the lifespan of the LED.

[0023] The side-emitting mechanism 4 includes a support plate 41 as an installation carrier. An installation plate 42 is arranged on the support plate 41 at a certain angle with its installation surface. For convenience, generally during production, the support plate 41 and the installation plate 42 are presented as a "丄" shape. The red light chip 1, the green light chip 2, and the blue light chip 3 are all arranged on the installation surface of the installation plate 42. An CSP-LED white light chip 43 for emitting white light is also arranged on the installation plate 42. When white light needs to be emitted, only the CSP-LED white light chip 43 emits white light, thereby reducing the power and heat of the LED. A pad assembly 44 for supplying power to the red light chip 1, the green light chip 2, the blue light chip 3, and the CSP-LED white light chip 43 is also arranged on the installation plate 42. Of course, on the installation plate 42, there are also conventionally copper foil pads or bonding wires for conductive connection between the red light chip 1, the green light chip 2, the blue light chip 3, and the CSP-LED white light chip 43, which will not be elaborated here. During use, the support plate 41 is placed parallel to the display screen. Under the support of the support plate 41, the light emitted by the red light chip 1, the green light chip 2, the blue light chip 3, and the CSP-LED white light chip 43 on the installation plate 42 directly enters the light guide module of the display screen, thereby ensuring the intensity of the light of the display screen.

[0024] To control the current intensity in the red light chip 1, the green light chip 2, the blue light chip 3, and the CSP-LED white light chip 43 and make the corresponding chips emit light according to the light emission requirements, an IC 45 for controlling the current in the red light chip 1, the green light chip 2, the blue light chip 3, and the CSP-LED white light chip 43 is also arranged on the installation plate 42.

[0025] In order to further ensure the separate control of the current intensity in the red light chip 1, green light chip 2, blue light chip 3 and CSP-LED white light chip 43, IC45 is made into a four-channel overflow-type IC, so that each chip can be controlled independently, and the current of each channel of the chip controlling each luminous color can be adjusted from 0-39mA through the signal, meeting the needs of applications in more different brightness scenes.

[0026] In order to further enrich the wiring methods between the pad assembly 44 and the external circuit and expand its application range, the pad assembly 44 includes a side-mounted pad 441 arranged on the side of the mounting plate 42 away from the CSP-LED white light chip 43, and also includes a front-mounted pad 442 arranged on the side of the support plate 41 away from the mounting plate 42, so that the external circuit can be selectively connected to the side-mounted pad 441 and the front-mounted pad 442, which has a wider applicability.

[0027] In order to ensure the consistency of the angles of red, green and blue light when emitted and reduce the brightness unevenness when the color is switched, the red light chip 1, the green light chip 2 and the blue light chip 3 are arranged in sequence at one end of the mounting plate 42 so that their positions are as close as possible, thereby improving the consistency of the light-emitting point position and improving the light uniformity when the color is switched.

[0028] When the red light chip 1, the green light chip 2 and the blue light chip 3 are connected to each other by bonding wires, the position of the bonding wires may change due to long-term use, resulting in light spots on the display screen. At the same time, when connecting the bonding wires, it was found that there is a possibility of bonding wire connection errors during the processing, resulting in a defective rate. Therefore, the red light chip 1, the green light chip 2 and the blue light chip 3 are all flip-chips, so there is no need to weld bonding wires, so as to improve the stability of product quality.

[0029] It should be noted that, in this article, the terms "comprises", "includes" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or apparatus that includes a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements that are inherent to such process, method, article or apparatus.

[0030] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A side-emitting four-color LED, comprising a red light chip (1), a green light chip (2) and a blue light chip (3) for emitting red light, green light and blue light respectively, characterized in that: Also included is a side lighting mechanism (4) for side lighting; The side-light emitting mechanism (4) comprises a support plate (41) serving as a mounting carrier, a mounting plate (42) is provided on the support plate (41) and is formed at a certain angle with its mounting surface, a red light chip (1), a green light chip (2) and a blue light chip (3) are all provided on the mounting surface of the mounting plate (42), a CSP-LED white light chip (43) for emitting white light is also provided on the mounting plate (42), and a pad assembly (44) for supplying power to the red light chip (1), the green light chip (2), the blue light chip (3) and the CSP-LED white light chip (43) is also provided on the mounting plate (42).

2. The four-color LED according to claim 1, characterized in that: An IC (45) for controlling the current in the red light chip (1), the green light chip (2), the blue light chip (3) and the CSP-LED white light chip (43) is also provided on the mounting plate (42).

3. The four-color LED according to claim 2, characterized in that: The IC (45) is a four-channel overflow-increasing IC.

4. The four-color LED according to claim 1, characterized in that: The pad assembly (44) includes a side-mounted pad (441) disposed on a side of the mounting plate (42) away from the CSP-LED white light chip (43), and also includes a front-mounted pad (442) disposed on a side of the support plate (41) away from the mounting plate (42).

5. The four-color LED according to claim 1, characterized in that: The red light chip (1), the green light chip (2), and the blue light chip (3) are sequentially arranged at one end of the mounting plate (42).

6. The four-color LED according to claim 2, characterized in that: The red light chip (1), the green light chip (2) and the blue light chip (3) are all flip chips.

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