Indenting die cutting assembly
By combining independent gravure plates and die-cut plates, the problem of high plate-making costs is solved, costs are reduced, and the scope of application is expanded to meet the processing requirements of materials of different thicknesses.
Patent Information
- Application Number
- CN202422763871.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-13
- Publication Date
- 2025-09-30
- Estimated Expiration
- 2034-11-13
AI Technical Summary
In the prior art, the embossing die-cutting plate is an integral structure, resulting in high plate-making costs and limited material selection, and is unable to meet the processing requirements of packaging materials of different thicknesses.
A relatively independent combination of embossing plate and die-cutting plate is used, each made of different materials. The die-cutting plate is replaceable, and a cushion layer is set to adapt to materials of different thicknesses, and is fixed with bolts.
Reduce plate making costs, expand the scope of application, adapt to the processing needs of materials of different thicknesses, and the die-cutting plate can be replaced to reduce the cost of use.
Smart Images

Figure CN223395813U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of packaging material processing, in particular to a concave die-cutting component. Background Art
[0002] On the outer packaging of high-end products such as cosmetics and health products, you often see Figure 1 The processing requirement of the hollow die-cutting pattern shown is that the hollow die-cutting pattern is set on the inner side of the debossed pattern. The existing technology usually uses a complete debossing die-cutting plate to realize the debossing die-cutting operation in one time. This technical solution has the following problems: since the debossing die-cutting plate is a whole, only a single material can be used to make the plate. In order to increase the service life of the debossing die-cutting plate, a higher strength steel plate is usually used to prepare the debossing die-cutting plate, resulting in higher plate making costs.
[0003] Therefore, it is necessary to provide a concave die cutting assembly to solve the above problems. Utility Model Content
[0004] The utility model provides a concave die-cutting assembly, comprising a relatively independent concave plate and a die-cutting plate, the concave plate comprising a first plate base and a concave line fixedly connected, a hollow portion being provided on the inner side of the concave line on the first plate base, the die-cutting plate comprising a second plate base and a die-cutting line fixedly connected, the first plate base being stacked above the second plate base, and the die-cutting line extending through the hollow portion in a direction away from the first plate base.
[0005] In one embodiment, the hollow portion and part of the concave lines have the same visual center.
[0006] In one embodiment, the outer shape of the die cutting line matches the hollow portion.
[0007] In one embodiment, the material used to prepare the intaglio plate is metal.
[0008] In one embodiment, the metal is copper.
[0009] In one embodiment, the material used to prepare the die-cutting plate is metal.
[0010] In one embodiment, the metal is steel.
[0011] In one embodiment, a cushion layer is provided between the first substrate and the second substrate.
[0012] In one embodiment, a bottom plate is provided between the first substrate and the second substrate.
[0013] In one embodiment, the first base and the second base are fixedly connected by bolts.
[0014] The above-mentioned embossing and die-cutting assembly is composed of a relatively independent embossing plate and a die-cutting plate, and its beneficial effects include: (1) different materials can be used to prepare the embossing plate and the die-cutting plate, which can reduce the plate making cost; (2) a cushion layer can be set between the first plate base and the second plate base to meet the processing requirements of packaging materials of different thicknesses, and has a wide range of applications; (3) the die-cutting plate has a relatively short lifespan and can be replaced as a consumable part, further reducing the cost of use. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 A schematic diagram showing that a die-cut pattern and a portion of a debossed pattern in the prior art have the same visual center;
[0016] Figure 2 This is a schematic diagram of the three-dimensional structure of an intaglio plate according to one embodiment;
[0017] Figure 3 This is a schematic diagram of the three-dimensional structure of a die-cutting plate according to one embodiment;
[0018] Figure 4 For example Figure 2 The embossed plate shown is Figure 3 Schematic diagram of the three-dimensional structure of the embossing and die-cutting assembly after the die-cutting plates are assembled;
[0019] Figure 5 Schematic diagram of the three-dimensional structure of the embossing and die-cutting assembly in another embodiment;
[0020] Figure 6 It is a schematic diagram of the three-dimensional structure of the embossing and die-cutting component in another embodiment. DETAILED DESCRIPTION
[0021] To make the above-mentioned objects, features, and advantages of the present invention more clearly understood, the following detailed description of specific embodiments of the present invention is provided in conjunction with the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways than those described herein, and those skilled in the art may make similar improvements without violating the scope of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.
[0022] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be an intermediate element. When an element is considered to be "connected" or "communicating" with another element, it may be directly connected to the other element or there may be an intermediate element. The terms "upper," "lower," "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only implementation methods.
[0023] The following is a further detailed description of the embossing and die-cutting assembly mainly in conjunction with the accompanying drawings and specific embodiments.
[0024] See also Figures 2 to 4 , an embodiment of the embossing and die-cutting assembly includes a relatively independent embossing plate 10 and a die-cutting plate 20.
[0025] The intaglio plate 10 includes a first base 11 and an intaglio line 12 that are fixedly connected. The first base 11 is used to support the intaglio line 12 . A hollow portion 13 is provided on the first base 11 on the inner side of the intaglio line 12 .
[0026] Specifically, the embossing line 12 is arranged perpendicular to the first base 11, and the hollow portion 13 is arranged on the inner side of the embossing line 12. In this embodiment, the hollow portion 13 and part of the embossing line 12 have the same visual center, so that the edge of the hollow portion 13 is at the same distance from the edge of the embossing line 12 in the area.
[0027] In this embodiment, the intaglio plate 10 is made of a metal material.
[0028] Optionally, the metal material used to prepare the intaglio plate 10 includes but is not limited to a steel plate, a copper plate and an aluminum plate.
[0029] Preferably, the metal material used to prepare the intaglio plate 10 is copper plate. On the one hand, the copper plate has moderate hardness and is suitable for engraving complex intaglio line 12 patterns. On the other hand, the cost of copper plate is relatively cheap, which is conducive to reducing the preparation cost of the intaglio plate 10.
[0030] The die-cutting plate 20 includes a second plate base 21 and a die-cutting line 22 that are fixedly connected. The second plate base 21 is used to carry the die-cutting line 22.
[0031] Specifically, the die cutting line 22 is perpendicular to the second base 21 , and the shape of the die cutting line 22 matches the hollow portion 13 , so that the die cutting line 22 can pass through the hollow portion 13 and be located inside the concave line 12 .
[0032] In this embodiment, the die-cutting plate 20 is carved from a metal material.
[0033] Optionally, the metal material used to prepare the die-cutting plate 20 includes but is not limited to a steel plate, a copper plate and an aluminum plate.
[0034] Preferably, the metal material used to prepare the die-cutting plate 20 is a steel plate. During operation, since the die-cutting line 22 needs to withstand great pressure to continuously cut the packaging material, choosing a high-strength steel plate to prepare the die-cutting plate 20 is beneficial to improving the service life of the die-cutting plate 20.
[0035] When the die-cutting plate 20 and the embossing plate 10 are combined into a embossing die-cutting assembly, the first base 11 is stacked on the second base 21, and the two are fixedly connected by bolts. At this time, the die-cutting line 22 passes through the hollow portion 13 and is arranged on the inner side of the embossing line 12, and the die-cutting line 22 is slightly higher than the embossing line 12, so that the die-cutting line 22 can cut the packaging material, while the embossing line 12 only plays a embossing role. When the embossing die-cutting assembly is used to die-cut the packaging material, the following can be obtained: Figure 1 The die-cut pattern shown is located inside a portion of the embossed pattern.
[0036] In another embodiment, see Figure 5 A cushion layer 30 is further provided between the first substrate 11 and the second substrate 21. By providing the cushion layer 30, the height difference between the die-cutting line 22 and the embossing line 12 can be controlled, so that the embossing die-cutting assembly can be suitable for processing paper materials of different thicknesses.
[0037] In another embodiment, see Figure 6 A base plate 40 is further provided between the first base plate 11 and the second base plate 21 of the multiple sets of embossing and die-cutting components, and the multiple sets of embossing and die-cutting components are fixed on the same base plate 40. This arrangement is conducive to improving the operating efficiency of the embossing and die-cutting components.
[0038] The above-mentioned embossing and die-cutting assembly is composed of a relatively independent embossing plate 10 and a die-cutting plate 20, and its beneficial effects include: (1) different materials can be used to prepare the embossing plate 10 and the die-cutting plate 20, which can reduce the plate making cost; (2) a cushion layer 30 can be set between the first plate base 11 and the second plate base 21 to meet the processing requirements of packaging materials of different thicknesses, and has a wide range of applications; (3) the die-cutting plate 20 has a relatively short lifespan and can be replaced as a consumable part, further reducing the cost of use.
[0039] The following are specific examples.
[0040] Example 1
[0041] See also Figures 2 to 4 This embodiment provides a debossing and die-cutting assembly, including a relatively independent debossing plate 10 and a die-cutting plate 20. The debossing plate 10 includes a first base 11 and a debossing line 12 that are fixedly connected. A hollow portion 13 is provided on the first base 11 on the inner side of the debossing line 12. The die-cutting plate 20 includes a second base 21 and a die-cutting line 22 that are fixedly connected. The first base 11 is stacked on top of the second base 21. The die-cutting line 22 extends through the hollow portion 13 in a direction away from the first base 11, and the die-cutting line 22 and part of the debossing line 12 have the same visual center.
[0042] In this embodiment, the intaglio plate 10 is made of copper engraving, and the die-cutting plate 20 is made of steel engraving.
[0043] The above-mentioned embossing and die-cutting assembly is composed of a relatively independent embossing plate 10 and a die-cutting plate 20, and its beneficial effects include: (1) different materials can be used to prepare the embossing plate 10 and the die-cutting plate 20, which can reduce the plate making cost; (2) a cushion layer 30 can be set between the first plate base 11 and the second plate base 21 to meet the processing requirements of packaging materials of different thicknesses, and has a wide range of applications; (3) the die-cutting plate 20 has a relatively short lifespan and can be replaced as a consumable part, further reducing the cost of use.
[0044] Example 2
[0045] See also Figure 5 The embossing die-cutting assembly provided in this embodiment is similar to the embossing die-cutting assembly provided in Example 1, except that a cushion layer 30 is provided between the first substrate 11 and the second substrate 21.
[0046] The above-mentioned embossing die-cutting assembly can control the height difference between the die-cutting line 22 and the embossing line 12 by providing the cushion layer 30, so that the embossing die-cutting assembly can be applied to paper materials of different thicknesses.
[0047] Example 3
[0048] See also Figure 6 The embossing die-cutting assembly provided in this embodiment is similar to the embossing die-cutting assembly provided in Example 1, except that a base plate 40 is further provided between the first base plate 11 and the second base plate 21 of the multiple groups of embossing die-cutting assemblies, so that the multiple groups of embossing die-cutting assemblies are fixed on the same base plate 40.
[0049] The above-mentioned embossing and die-cutting assembly is beneficial to improving the operating efficiency of the embossing and die-cutting assembly.
[0050] The above-described embodiments merely represent several implementations of the present invention. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that a person skilled in the art would be able to make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements fall within the scope of protection of the present invention. Therefore, the scope of protection of the present utility model patent shall be determined by the appended claims.
Claims
1. A denting die cutting assembly, characterized in that: It includes relatively independent intaglio plate and die-cutting plate, the intaglio plate includes a fixedly connected first plate base and an intaglio line, the first plate base is provided with a hollow portion on the inner side of the intaglio line, the die-cutting plate includes a fixedly connected second plate base and a die-cutting line, the first plate base is stacked on top of the second plate base, and the die-cutting line extends through the hollow portion in a direction away from the first plate base.
2. The embossing die cutting assembly according to claim 1, wherein: The hollow portion and part of the concave lines have the same visual center.
3. The embossing die cutting assembly according to claim 2, characterized in that: The shape of the die-cutting line matches the hollow portion.
4. The embossing die cutting assembly according to claim 3, characterized in that: The material used to prepare the intaglio plate is metal.
5. The embossing die cutting assembly according to claim 4, characterized in that: The metal is copper.
6. The embossing die cutting assembly according to claim 1, characterized in that: The material used to prepare the die-cutting plate is metal.
7. The embossing die cutting assembly according to claim 6, wherein: The metal is steel.
8. The embossing die cutting assembly according to any one of claims 1 to 7, characterized in that: A cushion layer is provided between the first substrate and the second substrate.
9. The embossing die cutting assembly according to claim 8, characterized in that: A bottom plate is arranged between the first base and the second base.
10. The embossing die cutting assembly according to claim 9, wherein: The first base and the second base are fixedly connected by bolts.