Electroplating bath device with self-cleaning function

Abstract

The utility model relates to the technical field of electroplating equipment, in particular to an electroplating bath device with a self-cleaning function. And after electroplating of the electroplated part is completed, the electroplated part is taken out of the electroplating bath body, the driving assembly drives the filtering plate to move towards the communicating opening, and then the electroplating liquid in the treatment layer is filtered through the filtering plate. And in the moving process of the filter plate, the filter plate intercepts impurities in the electroplating liquid, and the electroplating liquid reaches the side, away from the communicating opening, of the filter plate after being filtered. When the filter plate reaches the communicating port, the electroplating liquid on the side, close to the communicating port, of the filter plate is enriched with impurities, the liquid pump assembly is started, then the electroplating liquid enriched with the impurities enters the buffering bin and reaches the liquid collecting bin after being filtered by the filter assembly, and the impurities are collected in the dirt collecting bin after being filtered by the filter assembly. And the quantity of impurities in the electroplating liquid reaching the liquid collecting bin and the treatment layer meets the expected requirement. In this way, the electroplating liquid is treated in the electroplating process, and the self-cleaning function of the electroplating liquid is achieved.

Description

Technical Field

[0001] The present invention relates to the field of electroplating equipment, in particular to an electroplating tank device with a self-cleaning function. Background Art

[0002] Electroplating is a process that uses electrolysis to deposit a metallic film on the surface of metal or other materials. Electroplating involves electrolysis in a salt solution containing the metal being plated, with the base metal serving as the cathode. The electrolysis causes the cations of the metal being plated to deposit on the surface of the base metal, forming a coating. This process can significantly improve a material's wear resistance, conductivity, reflectivity, corrosion resistance, and aesthetics, leading to its increasing industrial application.

[0003] During the electroplating process, impurities in the plating solution gradually accumulate, depositing impurities on the surface of the plated parts and causing poor plating results. Therefore, the plating solution must be replaced regularly to ensure its cleanliness. However, frequent replacement of the plating solution can reduce production efficiency, waste resources, and increase production costs.

[0004] It can be seen that how to treat the electroplating solution during the electroplating process is a technical problem that needs to be solved urgently. Utility Model Content

[0005] The present application provides an electroplating tank device with a self-cleaning function, which aims to solve the technical problem of how to treat the electroplating solution during the electroplating process in the prior art.

[0006] The present application provides an electroplating tank device with a self-cleaning function, comprising:

[0007] An electroplating tank body, wherein the electroplating tank body is used to load the electroplating solution;

[0008] a partition member, the partition member separating the electroplating tank body into a purification layer and a treatment layer, the treatment layer being above the purification layer, the treatment layer being used for electroplating the electroplated parts, and the treatment layer being used for purifying the electroplating solution, the treatment layer and the purification layer being in fluid communication via a communication port;

[0009] A filter plate is slidably mounted in the electroplating tank body, and the filter plate separates the treatment layer into two independent areas;

[0010] A driving assembly, the driving assembly being used to drive the filter plate to move relative to the electroplating tank body in a direction approaching or away from the communication port;

[0011] The treatment layer is provided with a dirt collection bin, a buffer bin and a liquid collection bin, the dirt collection bin is connected to the treatment layer through the communication port, the buffer bin is adjacent to the dirt collection bin, and the liquid collection bin is adjacent to the buffer bin;

[0012] A filter assembly, the filter assembly being arranged between the buffer bin and the dirt collecting bin;

[0013] a liquid pump assembly, the liquid pump assembly being used to pump the electroplating liquid in the buffer bin to the liquid collecting bin;

[0014] Wherein, after the filter plate reaches the communication port, the liquid pump assembly starts to operate.

[0015] Optionally, the communication port is provided with a seal. When the filter plate reaches the communication port, the seal abuts against the filter plate to form a seal with the filter plate, thereby preventing the treatment layer and the dirt collecting bin from exchanging electroplating liquid across the filter plate.

[0016] Optionally, the electroplating tank body is provided with a nozzle member, the spraying direction of the nozzle member is toward the filter plate, and the nozzle member is used to clean the filter plate.

[0017] Optionally, the liquid collecting tank is connected to the treatment layer via a filter element liquid path.

[0018] Optionally, the sewage collecting bin is provided with a sewage outlet and a flushing outlet, the sewage outlet is used to discharge sewage from the sewage collecting bin, and the flushing outlet is used to flush the sewage collecting bin.

[0019] Optionally, the communication port is provided with an opening and closing component, and the opening and closing component is used to open and close the sewage collection bin and the treatment layer.

[0020] Optionally, the driving component includes:

[0021] A screw rod, the screw rod being rotatably mounted on the outer side of the electroplating tank body;

[0022] A driving motor, the driving motor is used to drive the screw member to rotate;

[0023] A connecting piece is fixedly connected to the filter plate, and the connecting piece is adapted to the screw rod. When the screw rod rotates, the connecting piece is driven to move.

[0024] Optionally, the driving component further includes:

[0025] A guide member, wherein the guide member is arranged parallel to the screw member;

[0026] Wherein, the connecting member is connected to the top of the filter plate, and the guiding member guides the bottom of the filter plate.

[0027] Optionally, the buffer bin is provided with a liquid level sensor, and the liquid level sensor is used to detect the liquid level in the buffer bin.

[0028] Optionally, the number of the sewage collecting bin, the buffer bin, the filter assembly, the liquid pump assembly and the connecting port is two, and the sewage collecting bin, the buffer bin, the filter assembly, the liquid pump assembly and the connecting port are all symmetrically arranged with respect to the middle section of the electroplating tank body.

[0029] The beneficial effects achieved by the present application are as follows: during the electroplating process of the electroplated part in the treatment layer within the electroplating tank body, the filter plate is located on a side away from the connection port. After the electroplating of the electroplated part is completed, the electroplated part is removed from the electroplating tank body, and the drive assembly drives the filter plate to move toward the connection port, thereby filtering the electroplating liquid in the treatment layer through the filter plate. During the movement of the filter plate, the filter plate intercepts impurities in the electroplating liquid and allows the electroplating liquid to reach the side of the filter plate away from the connection port after filtration. When the filter plate reaches the connection port, the electroplating liquid on the side of the filter plate near the connection port is enriched with impurities, and the liquid pump assembly is started, allowing the electroplating liquid enriched with impurities to enter the buffer bin and reach the liquid collection bin after being filtered by the filter assembly, and the impurities are collected in the sewage collection bin after being filtered by the filter assembly, thereby ensuring that the impurity content in the electroplating liquid reaching the liquid collection bin and the treatment layer meets the expected requirements. In this way, the electroplating liquid is treated during the electroplating process to achieve a self-cleaning function for the electroplating liquid. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 This is a schematic diagram of the three-dimensional structure of an electroplating tank device with a self-cleaning function in an embodiment of the present utility model;

[0031] Figure 2 This is a schematic diagram of the three-dimensional structure of the electroplating tank body after being cut open in the electroplating tank device with a self-cleaning function in an embodiment of the present utility model;

[0032] Figure 3 It is a cross-sectional view of an electroplating tank device with a self-cleaning function in an embodiment of the present invention.

[0033] Description of main unit symbols:

[0034] 10. Electroplating tank device; 20. Electroplating tank body; 21. Purification layer; 211. Waste collection bin; 212. Buffer bin; 213. Liquid collection bin; 22. Treatment layer; 23. Filter element; 24. Drain port; 25. Flushing port; 26. Partition element; 27. Connecting port; 28. Sealing element; 29. ​​Liquid level sensor; 30. Filter plate; 40. Drive assembly; 41. Screw element; 42. Drive motor; 43. Connecting element; 44. Guide element; 50. Filter assembly; 60. Liquid pump assembly; 70. Nozzle element; 80. Opening and closing assembly; 81. Sealing plate; 82. Spring; 83. Electromagnet assembly. DETAILED DESCRIPTION

[0035] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. Examples of the embodiments are shown in the accompanying drawings, in which the same or similar reference numerals throughout represent the same or similar units or units with the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and are not to be construed as limiting the present invention. In addition, it should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0036] In the description of the present invention, it should be understood that the terms "length", "width", "up", "down", "left", "right", "horizontal", "top", "bottom", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or unit referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0037] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the described features. In the description of this utility model, "plurality" means two or more, unless otherwise specifically defined.

[0038] In the description of this utility model, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections, electrical connections, or mutual communication; they can refer to direct connections or indirect connections through an intermediate medium; they can refer to internal communication between two units or interaction between two units. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on specific circumstances.

[0039] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0040] The disclosure below provides many different embodiments or examples for realizing different structures of the present invention. In order to simplify the disclosure of the present invention, the components and settings of specific examples are described below. Of course, they are merely examples and are not intended to limit the present invention. In addition, the present invention may repeat reference numbers and / or reference letters in different examples. Such repetition is for the purpose of simplicity and clarity and does not in itself indicate the relationship between the various embodiments and / or settings discussed. In addition, the present invention provides examples of various specific processes and materials, but a person of ordinary skill in the art will appreciate the application of other processes and / or the use of other materials.

[0041] See also Figures 1 to 3In some embodiments of the present application, the present application provides an electroplating tank device 10 with a self-cleaning function, comprising: an electroplating tank body 20, a partition member 26, a filter plate 30, a drive assembly 40, a filter assembly 50, and a liquid pump assembly 60. The electroplating tank body 20 is used to load the electroplating liquid. The partition member 26 separates the electroplating tank body 20 into a purification layer 21 and a treatment layer 22. The treatment layer 22 is above the purification layer 21. The treatment layer 22 is used to electroplate the electroplating parts. The treatment layer 22 is used to purify the electroplating liquid. The treatment layer 22 is connected to the purification layer 21 through a liquid path through a connecting port 27. The filter plate 30 is slidably installed in the electroplating tank body 20. The filter plate 30 divides the treatment layer 22 into two independent areas. The drive assembly 40 is used to drive the filter plate 30 to move relative to the electroplating tank body 20 in a direction close to or away from the connecting port 27. The processing layer 22 is equipped with a waste collection bin 211, a buffer bin 212, and a liquid collection bin 213. The waste collection bin 211 is connected to the processing layer 22 via a connecting port 27. The buffer bin 212 is adjacent to the waste collection bin 211, and the liquid collection bin 213 is adjacent to the buffer bin 212. The filter assembly 50 is positioned between the buffer bin 212 and the waste collection bin 211. The liquid pump assembly 60 is used to pump the electroplating solution from the buffer bin 212 to the liquid collection bin 213. The liquid pump assembly 60 starts operating after the filter plate 30 reaches the connecting port 27.

[0042] During electroplating of the treated layer 22 within the plating tank body 20, the filter plate 30 is positioned on a side away from the communication port 27. After plating is complete, the plated component is removed from the plating tank body 20, and the drive assembly 40 drives the filter plate 30 toward the communication port 27, thereby filtering the plating solution in the treated layer 22. During its movement, the filter plate 30 intercepts impurities in the plating solution and allows the filtered plating solution to reach the side of the filter plate 30 away from the communication port 27. When the filter plate 30 reaches the communication port 27, the electroplating liquid on the side of the filter plate 30 near the communication port 27 is enriched with impurities. The liquid pump assembly 60 is activated, and the impurity-enriched electroplating liquid is filtered by the filter assembly 50, enters the buffer chamber 212, and reaches the liquid collection chamber 213. After being filtered by the filter assembly 50, the impurities are collected in the sewage collection chamber 211. As a result, the impurity content of the electroplating liquid reaching the liquid collection chamber 213 and the treatment layer 22 meets the expected requirements. In this way, the electroplating liquid is treated during the electroplating process, achieving a self-cleaning function for the electroplating liquid.

[0043] See also Figures 2 to 3 In some embodiments of the present application, a seal 28 is provided at the connecting port 27. When the filter plate 30 reaches the connecting port 27, the seal 28 abuts against the filter plate 30 to form a seal with the filter plate 30, thereby preventing the treatment layer 22 and the dirt collecting bin 211 from exchanging electroplating liquid across the filter plate 30.

[0044] The filter plate 30 separates the treatment layer 22 into two independent areas, allowing the electroplating liquid in the treatment layer 22 to be exchanged only through the filter plate 30, thereby enabling the filter plate 30 to effectively filter the electroplating liquid in the treatment layer 22. After the electroplating of the electroplated parts is completed, the electroplated parts are removed from the electroplating tank body 20. During the process of replenishing the electroplated parts, the drive assembly 40 drives the filter plate 30 toward the communication port 27 to filter the electroplating liquid in the treatment layer 22 through the filter plate 30. When the filter plate 30 abuts the sealing member 28, the electroplating liquid enriched with impurities is isolated from the filtered electroplating liquid, preventing impurities from entering the filtered electroplating liquid, thereby ensuring the cleanliness of the filtered electroplating liquid.

[0045] After the filter plate 30 abuts the seal 28, impurities concentrate near the communication port 27. At this point, the liquid pump assembly 60 is activated, accelerating the flow of the impurity-enriched plating solution into the sump 211. Because the flow rate of the plating solution pumped by the liquid pump assembly 60 is greater than the flow rate of the plating solution entering the sump 211 through the filter plate 30, the level of the plating solution on the side of the filter plate 30 near the communication port 27 decreases relative to the level of the plating solution on the side of the filter plate 30 away from the communication port 27. In other words, the level of the impurity-enriched plating solution decreases relative to the level of the filtered plating solution. As the liquid pump assembly 60 pumps the plating solution, the impurity-enriched plating solution enters the sump 211, is filtered by the filter assembly 50, and then enters the sump 213 through the buffer chamber 212. The plating solution in the sump 213 is the filtered plating solution. The liquid collecting chamber 213 can be connected to the processing layer 22, so that the filtered electroplating liquid can return to the processing layer 22 to play the role of the electroplating liquid.

[0046] After the impurity-rich plating solution is filtered through the filter assembly 50, the impurities are collected in the dirt collection bin 211. After the plating solution is filtered and the impurities are collected, the drive assembly 40 drives the filter plate 30 to move away from the communication port 27, so that the electroplated parts are electroplated in the area of ​​the filter plate 30 on the side near the communication port 27. As a result, impurities generated during the electroplating process are located in the area of ​​the filter plate 30 on the side near the communication port 27, allowing the filter plate 30 to filter the plating solution containing impurities and allow the impurities to enter the dirt collection bin 211 through the communication port 27.

[0047] In some embodiments of the present application, the electroplating tank body 20 is provided with a nozzle member 70 , the spraying direction of the nozzle member 70 is toward the filter plate 30 , and the nozzle member 70 is used to clean the filter plate 30 .

[0048] When the filter plate 30 reaches the connection port 27, impurities adhere to the filter plate 30 due to filtering the impurity-laden plating solution. As the liquid pump assembly 60 operates to lower the level of the impurity-laden plating solution, the liquid pump pumps the plating solution from the liquid collection chamber 213 or the treatment layer 22 to the nozzle member 70. The nozzle member 70 then sprays the plating solution toward the filter plate 30, thereby cleaning the filter plate 30 and collecting all impurities in the dirt collection chamber 211, preventing further contamination of the plating solution. By cleaning the filter plate 30, the filter plate 30 maintains good filtration performance, ensuring that the filter plate 30 can continuously filter the plating solution, thereby improving production efficiency.

[0049] See also Figures 2 to 3 In some embodiments of the present application, the liquid collection tank 213 is connected to the processing layer 22 through a filter element 23.

[0050] By connecting the liquid collecting tank 213 with the treatment layer 22 via the filter element 23, the electroplating liquid in the liquid collecting tank 213 is filtered through the filter element 23 before entering the treatment layer 22, so that the electroplating liquid treated by the purification layer 21 can enter the treatment layer 22 again to replenish the electroplating liquid in the treatment layer 22, thereby ensuring the stability of the electroplating liquid level in the treatment layer 22 and allowing the electroplating process to proceed continuously and orderly.

[0051] A filter element 23 is provided between the liquid collecting chamber 213 and the treatment layer 22 to prevent impurities generated during the electroplating process from entering the liquid collecting chamber 213 and to prevent impurities in the liquid collecting chamber 213 from entering the treatment layer 22 and affecting the electroplating effect.

[0052] In some embodiments of the present application, the sewage collecting bin 211 is provided with a sewage outlet 24 and a flushing outlet 25 . The sewage outlet 24 is used to discharge sewage from the sewage collecting bin 211 , and the flushing outlet 25 is used to flush the sewage collecting bin 211 .

[0053] When the dirt collection bin 211 is filled with impurities, the impurities are discharged through the drain port 24, and the dirt collection bin 211 and the filter assembly 50 are rinsed through the rinse port 25, thereby preventing the excessive impurities collected in the dirt collection bin 211 from flowing back into the processing layer 22. Furthermore, by reconditioning the filter assembly 50, the good filtering performance of the filter assembly 50 is maintained, ensuring that the filter assembly 50 can continuously filter the electroplating solution, thereby improving production efficiency.

[0054] See also Figure 3 In some embodiments of the present application, the communication port 27 is provided with an opening and closing component 80 , and the opening and closing component 80 is used to open and close the dirt collecting bin 211 and the processing layer 22 .

[0055] During the cleaning process of the dirt collecting chamber 211 , the communication port 27 is closed by the opening and closing assembly 80 to prevent the electroplating solution of the treatment layer 22 from entering the dirt collecting chamber 211 , thereby preventing the loss of the electroplating solution.

[0056] When the driving assembly 40 drives the filter plate 30 to move away from the connecting port 27 , the opening and closing assembly 80 closes the connecting port 27 , thereby preventing impurities in the dirt collecting chamber 211 from flowing back to the processing layer 22 and affecting the electroplating effect.

[0057] In some embodiments of the present application, the opening and closing assembly 80 includes a sealing plate 81, a spring 82, and an electromagnet assembly 83. The sealing plate 81 is slidably mounted on the partition member 26. One end of the spring 82 is connected to the partition member 26, and the other end of the spring 82 is connected to the sealing plate 81.

[0058] When the electromagnet assembly 83 is energized, it magnetically attracts the sealing plate 81, causing the sealing plate 81 to overcome the elastic force of the spring 82 and close the communication port 27, thereby preventing impurities in the dirt collection chamber 211 from flowing back into the treatment layer 22. When the electromagnet assembly 83 is de-energized, the elastic force of the spring 82 causes the sealing plate 81 to open the communication port 27, allowing the electroplating solution enriched with impurities to smoothly enter the dirt collection chamber 211.

[0059] In some embodiments of the present application, the drive assembly 40 includes a screw member 41, a drive motor 42, and a connector 43. The screw member 41 is rotatably mounted on the outside of the electroplating tank body 20. The drive motor 42 is used to drive the screw member 41 to rotate. The connector 43 is fixedly connected to the filter plate 30 and is adapted to fit the screw member 41. When the screw member 41 rotates, the connector 43 is driven to move.

[0060] During the operation of the driving motor 42 , the lead screw 41 is driven to rotate, thereby driving the connecting member 43 to move, thereby driving the filter plate 30 to move through the connecting member 43 to achieve filtering of the electroplating solution.

[0061] In some embodiments of the present application, the drive assembly 40 further includes a guide member 44 . The guide member 44 is arranged parallel to the screw member 41 . The connecting member 43 is connected to the top of the filter plate 30 , and the guide member 44 guides the bottom of the filter plate 30 .

[0062] The filter plate 30 is guided by the guide member 44 , thereby ensuring that the force on the filter plate 30 is more balanced and making the movement process of the filter plate 30 smoother.

[0063] See also Figures 1 to 2 In some embodiments of the present application, the buffer bin 212 is provided with a liquid level sensor 29 , which is used to detect the liquid level in the buffer bin 212 .

[0064] During operation of the liquid pump assembly 60, the electroplating liquid passes through the buffer chamber 212 and is then pumped to the liquid collection chamber 213. If the filter assembly 50 becomes clogged, the liquid level in the buffer chamber 212 will drop. This abnormal drop in the liquid level in the buffer chamber 212 can be detected by the liquid level sensor 29, which can then determine whether the collection chamber 211 and the filter assembly 50 need to be cleaned.

[0065] In some embodiments of the present application, the number of the sewage collecting bin 211, the buffer bin 212, the filter assembly, the liquid pump assembly 60 and the connecting port 27 is two, and the sewage collecting bin 211, the buffer bin 212, the filter assembly, the liquid pump assembly 60 and the connecting port 27 are all symmetrically arranged in the middle section of the electroplating tank body 20.

[0066] By arranging the waste collecting bin 211, the buffer bin 212, the filter assembly, the liquid pump assembly 60 and the connecting port 27 symmetrically with respect to the middle section of the electroplating tank body 20, the filter plate 30 can move in both directions to filter the electroplating liquid of the treatment layer 22, thereby improving production efficiency.

[0067] Throughout this specification, references to terms such as "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" indicate that a specific feature, structure, material, or characteristic described in conjunction with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, illustrative uses of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0068] Furthermore, the above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention shall be subject to the scope of protection of the claims.

Claims

1. A plating tank device with a self-cleaning function, characterized in that: include: An electroplating tank body, wherein the electroplating tank body is used to load the electroplating solution; a partition member, the partition member separating the electroplating tank body into a purification layer and a treatment layer, the treatment layer being above the purification layer, the treatment layer being used for electroplating the electroplated parts, and the treatment layer being used for purifying the electroplating solution, the treatment layer and the purification layer being in fluid communication via a communication port; A filter plate is slidably mounted in the electroplating tank body, and the filter plate separates the treatment layer into two independent areas; A driving assembly, the driving assembly being used to drive the filter plate to move relative to the electroplating tank body in a direction approaching or away from the communication port; The treatment layer is provided with a dirt collection bin, a buffer bin and a liquid collection bin, the dirt collection bin is connected to the treatment layer through the communication port, the buffer bin is adjacent to the dirt collection bin, and the liquid collection bin is adjacent to the buffer bin; A filter assembly, the filter assembly being arranged between the buffer bin and the dirt collecting bin; a liquid pump assembly, the liquid pump assembly being used to pump the electroplating liquid in the buffer bin to the liquid collecting bin; Wherein, after the filter plate reaches the communication port, the liquid pump assembly starts to operate.

2. The electroplating tank device with self-cleaning function according to claim 1, characterized in that: The communication port is provided with a sealing member, and when the filter plate reaches the communication port, the sealing member abuts against the filter plate.

3. The electroplating tank device with self-cleaning function according to claim 1, characterized in that: The electroplating tank body is provided with a nozzle member, the spraying direction of the nozzle member is toward the filter plate, and the nozzle member is used to clean the filter plate.

4. The electroplating tank device with self-cleaning function according to claim 1, characterized in that: The liquid collecting tank is connected to the treatment layer via a filter element liquid path.

5. The electroplating tank device with self-cleaning function according to claim 1, characterized in that: The sewage collecting bin is provided with a sewage discharge port and a flushing port. The sewage discharge port is used to discharge sewage from the sewage collecting bin, and the flushing port is used to flush the sewage collecting bin.

6. The electroplating tank device with self-cleaning function according to claim 1, characterized in that: The communication port is provided with an opening and closing component, and the opening and closing component is used to open and close the dirt collecting bin and the processing layer.

7. The electroplating tank device with self-cleaning function according to claim 1, characterized in that: The drive assembly includes: A screw rod, the screw rod being rotatably mounted on the outer side of the electroplating tank body; A driving motor, the driving motor is used to drive the screw member to rotate; A connecting piece is fixedly connected to the filter plate, and the connecting piece is adapted to the screw rod. When the screw rod rotates, the connecting piece is driven to move.

8. The electroplating tank device with self-cleaning function according to claim 7, characterized in that: The drive assembly further includes: A guide member, wherein the guide member is arranged parallel to the screw member; Wherein, the connecting member is connected to the top of the filter plate, and the guiding member guides the bottom of the filter plate.

9. The electroplating tank device with self-cleaning function according to claim 8, characterized in that: The buffer bin is provided with a liquid level sensor, and the liquid level sensor is used to detect the liquid level in the buffer bin.

10. The electroplating tank device with self-cleaning function according to claim 1, characterized in that: The number of the sewage collecting bin, the buffer bin, the filter assembly, the liquid pump assembly and the connecting port is two, and the sewage collecting bin, the buffer bin, the filter assembly, the liquid pump assembly and the connecting port are all symmetrically arranged with respect to the middle section of the electroplating tank body.

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