Clamping identification mechanism of electroplating hanger

Abstract

The utility model relates to a clamping identification mechanism of an electroplating hanger, which comprises a frame body used for being connected with an external manipulator so as to move along with the external manipulator; the clamping assembly is connected with the frame body; the hanging tool assembly comprises a hanging plate, the hanging plate can bear a wafer, and the hanging plate is configured to be capable of being clamped by the clamping assembly so as to move along with the frame body; the recognition assembly is arranged on the clamping assembly and used for recognizing various types of hanging plates; wherein the top end of each hanging plate is provided with an identification part, the identification assembly comprises a scanning piece connected with the controller, the scanning piece is configured to be capable of scanning the identification part, and due to the fact that the scanning piece is arranged on the clamping assembly, when the hanging plate is selected, the scanning piece can firstly identify the identification part at the top end of the hanging plate; then the hanging plate is directly clamped through the clamping assembly, so that the wafer electroplating step is reduced, the time is saved, and the working efficiency is improved; and moreover, an independent hanger identification assembly does not need to be arranged, and the space of the whole electroplating hanger is saved due to the integrated arrangement.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a clamping and identifying mechanism of an electroplating rack. Background Art

[0002] As semiconductor manufacturing technology continues to advance, wafers require electroplating during production and processing to improve performance. During electroplating, wafers are supported on a rack and immersed in the plating solution. Currently, there are many types of racks on the market, each suitable for different wafer sizes and plating process requirements. Therefore, different types of racks must be selected for electroplating based on actual conditions. To avoid errors in manual rack identification, the industry typically labels different types of racks, which are then identified through scanning.

[0003] In the prior art, it is often necessary to set up a separate hanger identification position, which makes the wafer electroplating steps complicated, and the separately set identification device occupies a large space.

[0004] Therefore, it is necessary to improve the prior art to overcome the above defects. Utility Model Content

[0005] In view of this, the present invention provides a clamping and identifying mechanism for an electroplating rack to solve at least one problem in the background art, including:

[0006] A frame, used for connecting to an external manipulator to follow the movement of the external manipulator;

[0007] A clamping assembly connected to the frame;

[0008] A hanger assembly, comprising a hanging plate, the hanging plate being capable of carrying wafers, the hanging plate being configured to be clamped by the clamping assembly so as to follow the movement of the frame;

[0009] an identification component, provided on the clamping component, for identifying various types of hanging boards;

[0010] Wherein, an identification portion is provided at the top of each hanging plate, and the identification component includes a scanning component connected to the controller, and the scanning component is configured to be able to scan the identification portion.

[0011] Optionally, the clamping identification mechanism of the above-mentioned electroplating hanger, the clamping assembly includes a first connecting plate connected to the frame, two cylinders arranged on the first connecting plate and two clamps connected to the two cylinders, and the cylinders can drive the clamps to move to clamp or release the hanging plate.

[0012] Optionally, in the clamping and identifying mechanism of the electroplating rack, the width of the clamping claw is consistent with the width of the hanging plate.

[0013] Optionally, in the clamping and identification mechanism of the above-mentioned electroplating rack, the identification component includes a second connecting plate connected to the frame, the scanning component is installed on the second connecting plate, and the scanning component is located between the two cylinders.

[0014] Optionally, in the clamping and identifying mechanism of the electroplating rack, the scanning component further includes a data port, and the data port is used to be electrically connected to the controller.

[0015] Optionally, in the clamping and identifying mechanism of the electroplating rack, the scanning component has a scanning port, and the light of the scanning component passes through the scanning port to scan the identifying portion;

[0016] The electroplating rack clamping and identifying mechanism further includes an airflow component mounted on the frame, and the airflow component has an air outlet arranged toward the scanning port.

[0017] Optionally, in the clamping identification mechanism of the electroplating rack described above, the airflow component further includes an air inlet connected to the air outlet, and the air inlet is suitable for connecting to an external air source.

[0018] Optionally, in the clamping identification mechanism of the electroplating rack described above, the airflow component further includes a guide nozzle, the guide nozzle is connected to the air inlet, and the air outlet is located on the guide nozzle.

[0019] Optionally, in the clamping and identifying mechanism of the electroplating rack, the airflow component is installed between the frame and the identifying component;

[0020] The second connecting plate is provided with a avoidance opening, and the air inlet is communicated with an external air source through the avoidance opening.

[0021] Compared with the prior art, the present application has the following beneficial effects: by providing a frame, a clamping assembly, a hanger assembly and an identification assembly, and an identification part is provided at the top of the hanging board, and the identification assembly includes a scanning part connected to the controller, so that the scanning part can scan and identify the identification part on the hanging board. Since the scanning part is provided on the clamping assembly, when selecting a hanging board, the scanning part can first identify the identification part on the top of the hanging board, and then directly clamp the hanging board through the clamping assembly, reducing the steps of wafer electroplating, saving time and improving work efficiency; and, there is no need to set up a separate hanger identification assembly, and the integrated setting saves space for the entire electroplating hanger. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 is a schematic diagram of a partial structure of the electroplating rack shown in this embodiment;

[0023] Figure 2Schematic diagram of the clamping and identifying mechanism of the electroplating rack shown in this embodiment;

[0024] Figure 3 yes Figure 2 Schematic cross-section diagram.

[0025] Reference numerals:

[0026] 2-clamping assembly, 21-first connecting plate, 22-cylinder body, 23-clamping claw;

[0027] 3-hanging assembly, 31-hanging plate, 311-identification part;

[0028] 4-identification component, 41-scanning piece, 411-data port, 412-scanning port, 42-second connecting plate, 421-avoidance port;

[0029] 5-airflow component, 51-air inlet, 52-air outlet, 53-guide nozzle. DETAILED DESCRIPTION

[0030] The exemplary embodiments disclosed in the present application will be described in more detail below. In the description below, a large number of specific details are given in order to provide a more thorough understanding of the present application. However, it is obvious to those skilled in the art that the present application can be implemented without one or more of these details. In other examples, in order to avoid confusion with the present application, some technical features well known in the art are not described; that is, all features of the actual embodiments are not described here, and well-known functions and structures are not described in detail.

[0031] It should be understood that when an element or layer is referred to as being "on," "adjacent to," "connected to," or "coupled to" another element or layer, it may be directly on, adjacent to, connected to, or coupled to the other element or layer, or there may be intervening elements or layers. Conversely, when an element is referred to as being "directly on," "directly adjacent to," "directly connected to," or "directly coupled to" another element or layer, there may be no intervening elements or layers. It should be understood that although the terms first, second, third, etc. may be used to describe various elements, components, regions, layers, and / or parts, these elements, components, regions, layers, and / or parts should not be limited by these terms. These terms are merely used to distinguish one element, component, region, layer, or part from another element, component, region, layer, or part. Therefore, without departing from the teachings of the present application, the first element, component, region, layer, or part discussed below may be represented as a second element, component, region, layer, or part. And when the second element, component, region, layer, or part is discussed, it does not necessarily mean that the first element, component, region, layer, or part is present in the present application.

[0032] Spatially relative terms such as "below," "beneath," "beneath," "beneath," "above," "upper," etc., may be used herein for convenience to describe the relationship of one element or feature to other elements or features shown in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use and operation in addition to the orientations depicted in the figures.

[0033] The purpose of the terms used herein is only to describe specific embodiments and is not intended to limit the present application. When used herein, the singular forms "a", "an", and " / the" are intended to include the plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "comprising" and / or "including", when used in this specification, identify the presence of features, integers, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, parts and / or groups. When used herein, the term "and / or" includes any and all combinations of the relevant listed items.

[0034] In order to fully understand the present application, detailed steps and detailed structures will be presented in the following description to illustrate the technical solution of the present application. The preferred embodiments of the present application are described in detail below. However, in addition to these detailed descriptions, the present application may also have other implementation methods.

[0035] Please refer to Figure 1-Figure 3 As shown, a preferred embodiment of the present application shows a clamping and identification mechanism for an electroplating rack, comprising a frame, a clamping assembly 2 connected to the frame, a rack assembly 3, and an identification assembly 4. The clamping assembly 2 is used to clamp the rack assembly 3, and the rack assembly 3 is used to carry wafers. The frame is used to connect to an external robot to follow the movement of the external robot, thereby driving the clamping assembly 2 and then the rack assembly 3 to achieve the electroplating process of the wafer.

[0036] Specifically, the hanger assembly 3 includes a hanging plate 31 , which can carry wafers and is configured to be clamped by the clamping assembly 2 and move with the frame.

[0037] The clamping assembly 2 includes a first connecting plate 21 connected to the frame, two cylinders 22 mounted on the first connecting plate 21, and two clamping jaws 23 connected to the cylinders 22. The cylinders 22 drive the clamping jaws 23 to clamp or release the hanging plate 31. In this embodiment, the width of the clamping jaws 23 is consistent with the width of the hanging plate 31, thereby better clamping the hanging plate 31 and improving the stability and reliability of the clamping.

[0038] As described above, the identification component 4 is arranged on the clamping component 2, and is used to identify various types of hanging boards 31. Specifically, an identification part 311 is provided at the top of each hanging board 31, and the identification component 4 includes a scanning part 41 connected to the controller. The scanning part 41 is configured to be able to scan the identification part 311 to select the required hanging board 31 according to different needs, thereby improving the versatility of production.

[0039] The identification component 4 also includes a second connecting plate 42 connected to the frame, and the scanning component 41 is installed on the second connecting plate 42, and the scanning component 41 is located between the two cylinders 22, which increases the compactness of the entire electroplating rack, has a reasonable layout, and does not affect the normal operation of the clamping component 2.

[0040] In this embodiment, the scanner 41 further includes a data port 411, which is used to electrically connect to the controller to enable data transmission and processing, thereby improving recognition accuracy and efficiency. In other embodiments, the scanner 41 and the controller may also be connected for communication, also enabling data transmission and processing. The connection method between the two is not specifically limited here and will be determined based on actual circumstances.

[0041] In actual use, since the electroplating rack will move in different units in the electroplating equipment, and the electroplating process involves a variety of different liquids, including cleaning liquid, electroplating liquid or other chemical liquids, even parts that have no contact with the electroplating liquid, such as the scanning part 41, will accumulate water droplets, resulting in failure in identifying the type of rack.

[0042] In order to solve the above problems, in this embodiment, the scanning piece 41 has a scanning port 412, and the light of the scanning piece 41 scans the identification part 311 through the scanning port 412; the electroplating hanger clamping and identification mechanism also includes an airflow component 5 installed on the frame, and the airflow component 5 has an air outlet 52 set toward the scanning port 412, so that the airflow blown out through the air outlet 52 can blow off water droplets or other dust particles gathered at the scanning port 412, thereby ensuring the stability of the scanning piece 41 in identifying the hanging plate 31 and improving work efficiency.

[0043] Furthermore, the airflow component 5 also includes an air inlet 51 connected to the air outlet 52. The air inlet 51 is suitable for connecting to an external air source to introduce clean airflow, ensure the stability of the airflow at the air outlet 52, and further improve the protection effect of the scanning port 412.

[0044] The airflow assembly 5 also includes a guide nozzle 53, which is connected to the air inlet 51. The air outlet 52 is located above the guide nozzle 53 to guide the airflow, so that the airflow is more concentratedly blown toward the scanning port 412, thereby improving the protection effect. It should be noted that in this embodiment, the range of the air outlet 52 can not only act on the air outlet, but also on the identification portion 311 on the scanned hanging plate 31, so as to clean dust on the identification portion 311 and improve recognition accuracy. In this embodiment, the specific spray range of the air outlet, that is, the guide nozzle 53, is not specifically limited and can be determined according to actual conditions.

[0045] The airflow component 5 is installed between the frame and the identification component 4; a avoidance port 421 is provided on the second connecting plate 42, and the air inlet 51 is connected to the external air source through the avoidance port 421, further making the electroplating rack structure compact and achieving a reasonable layout.

[0046] The above is only a specific implementation of the present application. Any other improvements made based on the concept of the present application are considered to be within the scope of protection of the present application.

Claims

1. A clamping and identifying mechanism for an electroplating rack, characterized in that: include: A frame, used for connecting to an external manipulator to follow the movement of the external manipulator; A clamping assembly connected to the frame; A hanger assembly, comprising a hanging plate, the hanging plate being capable of carrying wafers, the hanging plate being configured to be clamped by the clamping assembly so as to follow the movement of the frame; an identification component, provided on the clamping component, for identifying various types of hanging boards; Wherein, an identification portion is provided at the top of each hanging plate, and the identification component includes a scanning component connected to the controller, and the scanning component is configured to be able to scan the identification portion.

2. The clamping identification mechanism of the electroplating rack according to claim 1, characterized in that: The clamping assembly includes a first connecting plate connected to the frame, two cylinders arranged on the first connecting plate, and two clamping claws connected to the two cylinders. The cylinders can drive the clamping claws to move to clamp or release the hanging plate.

3. The clamping and identifying mechanism for the electroplating rack according to claim 2, characterized in that: The width of the clamping jaws is consistent with the width of the hanging plate.

4. The clamping and identifying mechanism for the electroplating rack according to claim 2, characterized in that: The identification component includes a second connecting plate connected to the frame, the scanning component is installed on the second connecting plate, and the scanning component is located between the two cylinders.

5. The clamping and identifying mechanism for the electroplating rack according to claim 1, characterized in that: The scanning component further includes a data port, and the data port is used for being electrically connected to the controller.

6. The clamping and identifying mechanism for the electroplating rack according to claim 4, characterized in that: The scanning piece has a scanning port, and the light of the scanning piece passes through the scanning port to scan the identification part; The electroplating rack clamping and identifying mechanism further includes an airflow component mounted on the frame, and the airflow component has an air outlet arranged toward the scanning port.

7. The clamping and identifying mechanism for the electroplating rack according to claim 6, characterized in that: The airflow component further includes an air inlet communicated with the air outlet, and the air inlet is suitable for communicating with an external air source.

8. The clamping and identifying mechanism for the electroplating rack according to claim 7, characterized in that: The airflow component further includes a guide nozzle, which is communicated with the air inlet, and the air outlet is located on the guide nozzle.

9. The clamping and identifying mechanism for the electroplating rack according to claim 8, characterized in that: The airflow component is installed between the frame and the identification component; The second connecting plate is provided with a avoidance opening, and the air inlet is communicated with an external air source through the avoidance opening.

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