Transmission type semiconductor substrate transfer printing clamp

Abstract

The utility model discloses a transmission type semiconductor substrate transfer printing clamp, which relates to the technical field of transfer printing equipment and comprises a transmission table, a transmission adjusting cabin is arranged in the top end of one side of the transmission table, and a transmission screw rod is rotatably connected in the transmission adjusting cabin. A transmission driving motor is fixedly mounted on the outer wall of the top end of the side, close to the transmission screw, of the transmission table. A transmission driving motor is arranged to control the rotation operation of a transmission screw rod in a transmission adjusting cabin, so that the sliding adjusting position of a sliding adjusting block in the transmission adjusting cabin is realized, the overall position of a sliding limiting top disc is further controlled, and the transmission operation is realized; and a connecting adjusting shaft is arranged between the rotating fixing table and the sliding limiting top disc, angle adjustment of the rotating fixing table can be assisted through an auxiliary rotating handle, semiconductor substrate machining operation at different angles can be carried out, and the use flexibility of machining operation is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of pad printing equipment, in particular to a transmission-type pad printing fixture for semiconductor substrates. Background Art

[0002] With the continuous development of electronic information technology, semiconductor manufacturing technology has also rapidly developed and become widespread. In the semiconductor device manufacturing process, pad printing technology can transfer circuits drawn with organic and inorganic materials on the chip to the semiconductor substrate, thereby manufacturing high-precision micro-devices and integrated circuits. Traditional pad printing operations are usually performed manually, which is inefficient and prone to errors, affecting chip quality and manufacturing efficiency.

[0003] A search revealed Chinese publication number CN219917124U, which discloses a transmission-type semiconductor substrate pad printing fixture. The fixture comprises a base and a mounting plate slidably mounted on top of the base, with multiple limit bars positioned on top of the mounting plate. The base houses multiple motor rotors distributed on either side of the mounting plate, along with a power distribution module that supplies power to the motor rotors. The motor rotors are electrically connected to the power distribution module. A transmission shaft is attached to the output shaft of the motor rotor, with a gear mounted on the end extending outside the base. The mounting plate has teeth that mesh with the gears. This utility model can replace manual pad printing operations, improving efficiency and reducing pad printing errors.

[0004] However, in actual use, the above device can only perform circuit welding in a fixed direction and cannot adjust the angle appropriately according to actual needs, resulting in positional angle deviation when the circuit is transferred to the semiconductor substrate, which directly affects product quality. Therefore, we redesigned a transmission-type semiconductor substrate pad printing fixture. Utility Model Content

[0005] The purpose of the utility model is to provide a transmission-type semiconductor substrate pad printing fixture.

[0006] In order to solve the above technical problems, the present invention provides the following technical solutions: a transmission-type semiconductor substrate pad printing fixture, comprising a transmission platform, a transmission adjustment cabin is opened inside the top of one side of the transmission platform, a transmission screw is rotatably connected to the inside of the transmission adjustment cabin, a transmission drive motor is fixedly installed on the outer wall of the top side of the transmission platform close to the transmission screw, a sliding adjustment block is movably installed inside the transmission adjustment cabin, a sliding limit top plate is fixedly connected to the top of one side of the sliding limit top plate, a connecting adjustment shaft is rotatably connected to the top of one side of the connecting adjustment shaft, a rotating fixed platform is fixedly connected to the top of one side of the rotating fixed platform, and an auxiliary rotating handle is fixedly connected to the edge surface of the top side of the rotating fixed platform.

[0007] Preferably, a connecting disk is fixedly connected to the top of one side of the rotating fixed platform, a sliding adjustment disk is fixedly connected to the top of one side of the connecting disk, a sliding limit groove is provided inside the sliding adjustment disk, a sliding block is detachably installed on one side of the sliding adjustment disk, and sliding auxiliary side plates are fixedly connected to the tops of both sides of the sliding block.

[0008] Preferably, an adjusting screw is movably installed inside the top end of one side of the sliding block, an adjusting dial is fixedly connected to the top end of one side of the adjusting screw, an auxiliary friction groove is provided on the edge of one side surface of the adjusting dial, and a fixed disk is fixedly connected to the bottom end of one side of the adjusting screw.

[0009] Preferably, a fixed connecting plate is fixedly connected to the bottom end surface of one side of the transmission platform, and a fixing groove is provided on one side surface of the fixed connecting plate.

[0010] Preferably, the connection between the transmission drive motor and the transmission screw is a drive connection, the transmission screw passes through the interior of the sliding adjustment block, the connection between the transmission screw and the sliding adjustment block is a threaded connection, the sliding adjustment block is located inside the transmission adjustment cabin, the connection between the sliding adjustment block and the transmission adjustment cabin is a sliding connection, the sliding limit top plate is located on the top surface of the transmission platform, the connection between the sliding limit top plate and the transmission platform is a sliding connection, the number of the auxiliary rotating handles is several, and the several auxiliary rotating handles are circumferentially distributed on the top edge surface of the rotating fixed platform.

[0011] Preferably, the sliding block is located inside the sliding limit groove, the connection relationship between the sliding adjustment disk and the sliding block is a sliding connection, the connection relationship between the sliding auxiliary side plate and the sliding adjustment disk is a sliding connection, the adjusting screw passes through the interior of the sliding block, the connection relationship between the sliding block and the adjusting screw is a threaded connection, the number of the auxiliary friction grooves is several, and the several auxiliary friction grooves are circumferentially distributed on one side edge surface of the adjustment dial.

[0012] Compared with related technologies, the transmission-type semiconductor substrate pad printing clamp provided by the present invention has the following beneficial effects:

[0013] The utility model provides a transmission-type semiconductor substrate pad printing fixture, which realizes the sliding adjustment position of the sliding adjustment block inside the transmission adjustment cabin by arranging a transmission drive motor to control the rotation operation of the transmission screw inside the transmission adjustment cabin, thereby controlling the overall position of the sliding limit top plate to realize the transmission operation, and directly fixes the substrate on the top surface of the rotating fixed table, and arranges a connecting adjustment shaft between the rotating fixed table and the sliding limit top plate. The angle of the rotating fixed table can be assisted by an auxiliary rotating handle, so that semiconductor substrates with different angles can be processed, thereby improving the flexibility of the processing operation.

[0014] The utility model provides a transmission-type semiconductor substrate pad printing fixture, which adjusts the overall position of the sliding block by setting the sliding block to slide between the sliding adjustment disks and the sliding auxiliary side plates to slide in the sliding limit grooves. The position of the adjusting screw inside the sliding block is adjusted by rotating the adjustment dial to adjust the overall height of the fixed disk. The semiconductor substrate is operated by using the fixed disks on both sides. The fixed disks can be appropriately adjusted in position according to the actual size of the semiconductor substrate, thereby increasing the flexibility of the fixed position. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the three-dimensional structure of the utility model;

[0016] Figure 2 This is a schematic diagram of the overall side bottom view of the device of the present invention;

[0017] Figure 3 This is a schematic diagram of the structure of the fixed device of the utility model in a disassembled bottom view;

[0018] Figure 4 This is a structural schematic diagram of the rotating fixed platform of the present utility model.

[0019] Numbers in the figure: 1. Transmission platform; 2. Transmission adjustment cabin; 3. Transmission screw; 4. Transmission drive motor; 5. Sliding adjustment block; 6. Sliding limit top plate; 7. Connecting adjustment shaft; 8. Rotating fixed platform; 9. Auxiliary rotating handle; 10. Connecting plate; 11. Sliding adjustment plate; 12. Sliding limit groove; 13. Sliding block; 14. Sliding auxiliary side plate; 15. Adjusting screw; 16. Adjusting turntable; 17. Auxiliary friction groove; 18. Fixed plate; 19. Fixed connecting plate; 20. Fixed groove. DETAILED DESCRIPTION Example

[0020] See also Figure 1-4The utility model provides a technical solution: a transmission type semiconductor substrate pad printing fixture, comprising a transmission platform 1, a transmission adjustment cabin 2 is opened inside the top of one side of the transmission platform 1, a transmission screw 3 is rotatably connected to the inside of the transmission adjustment cabin 2, a transmission drive motor 4 is fixedly installed on the outer wall of the top of one side of the transmission platform 1 close to the transmission screw 3, a sliding adjustment block 5 is movably installed inside the transmission adjustment cabin 2, a sliding limit top plate 6 is fixedly connected to the top of one side of the sliding limit top plate 6, a connecting adjustment shaft 7 is rotatably connected to the top of one side of the connecting adjustment shaft 7, a rotating fixed platform 8 is fixedly connected to the top of one side of the rotating fixed platform 8 An auxiliary rotating handle 9 is fixedly connected to the end edge surface, the connection relationship between the transmission drive motor 4 and the transmission screw 3 is a driving connection, the transmission screw 3 passes through the interior of the sliding adjustment block 5, the connection relationship between the transmission screw 3 and the sliding adjustment block 5 is a threaded connection, the sliding adjustment block 5 is located inside the transmission adjustment cabin 2, the connection relationship between the sliding adjustment block 5 and the transmission adjustment cabin 2 is a sliding connection, the sliding limit top plate 6 is located on the top surface of the transmission platform 1, and the connection relationship between the sliding limit top plate 6 and the transmission platform 1 is a sliding connection. There are several auxiliary rotating handles 9, and several auxiliary rotating handles 9 are distributed circumferentially on the top edge surface of the rotating fixed platform 8.

[0021] In the implementation scheme, a transmission drive motor 4 is provided to control the rotation operation of the transmission screw 3 inside the transmission adjustment cabin 2, thereby realizing the sliding adjustment position of the sliding adjustment block 5 inside the transmission adjustment cabin 2, and then controlling the overall position of the sliding limit top plate 6 to realize the transmission operation. By directly fixing the substrate on the top surface of the rotating fixed table 8, a connecting adjustment shaft 7 is provided between the rotating fixed table 8 and the sliding limit top plate 6. The auxiliary rotating handle 9 can assist in adjusting the angle of the rotating fixed table 8, and can be used for processing semiconductor substrates at different angles, thereby improving the flexibility of the processing operation. Example

[0022] See also Figure 1-4The utility model provides a technical solution: a transmission type semiconductor substrate pad printing fixture, comprising a rotating fixed table 8, a connecting plate 10 is fixedly connected to the top of one side of the connecting plate 10, a sliding adjustment plate 11 is fixedly connected to the top of one side of the connecting plate 10, a sliding limit groove 12 is provided inside the sliding adjustment plate 11, a sliding block 13 is detachably installed on one side of the sliding adjustment plate 11, and the tops of both sides of the sliding block 13 are fixedly connected to sliding auxiliary side plates 14, an adjusting screw 15 is movably installed inside the top of one side of the sliding block 13, and the top of one side of the adjusting screw 15 is fixedly connected to an adjusting dial 16, and an auxiliary friction groove 17 is provided on the edge of one side surface of the adjusting dial 16. A fixed disk 18 is fixedly connected to the bottom end of one side of the rod 15, and a fixed connecting plate 19 is fixedly connected to the bottom end surface of one side of the transmission platform 1. A fixed groove 20 is provided on one side surface of the fixed connecting plate 19. The sliding block 13 is located inside the sliding limit groove 12. The connection relationship between the sliding adjustment disk 11 and the sliding block 13 is a sliding connection. The connection relationship between the sliding auxiliary side plate 14 and the sliding adjustment disk 11 is a sliding connection. The adjusting screw 15 passes through the interior of the sliding block 13. The connection relationship between the sliding block 13 and the adjusting screw 15 is a threaded connection. There are several auxiliary friction grooves 17, and several auxiliary friction grooves 17 are circumferentially distributed on the edge surface of one side of the adjusting dial 16.

[0023] In the implementation scheme, the sliding block 13 is set to slide between the sliding adjustment disks 11, and the sliding auxiliary side plate 14 is simultaneously slid inside the sliding limit groove 12 to adjust the overall position of the sliding block 13. The position of the adjusting screw 15 inside the sliding block 13 is adjusted by rotating the adjusting dial 16 to adjust the overall height of the fixed disk 18. The fixed disks 18 on both sides are used to perform operations on the semiconductor substrate. The fixed disks 18 can be appropriately adjusted to the position according to the actual size of the semiconductor substrate, thereby increasing the flexibility of the fixed position.

[0024] Working principle:

[0025] By setting a transmission drive motor 4 to control the rotation operation of the transmission screw 3 inside the transmission adjustment cabin 2, the sliding adjustment position of the sliding adjustment block 5 inside the transmission adjustment cabin 2 is achieved, thereby controlling the overall position of the sliding limit top plate 6 to achieve transmission operation. By directly fixing the substrate on the top surface of the rotating fixed table 8, a connecting adjustment shaft 7 is set between the rotating fixed table 8 and the sliding limit top plate 6. The auxiliary rotating handle 9 can assist in adjusting the angle of the rotating fixed table 8, which can be used for processing semiconductor substrates at different angles, thereby improving the flexibility of the processing operation.

[0026] By setting the sliding block 13 to slide between the sliding adjustment plates 11 and the sliding auxiliary side plates 14 to slide inside the sliding limit grooves 12, the overall position of the sliding block 13 is adjusted. By rotating the adjustment dial 16 to adjust the position of the adjustment screw 15 inside the sliding block 13, the overall height of the fixed plate 18 is adjusted. The fixed plates 18 on both sides are used to operate the semiconductor substrate. The fixed plates 18 can be appropriately adjusted according to the actual size of the semiconductor substrate, thereby increasing the flexibility of the fixed position.

[0027] The fixed connecting plate 19 facilitates the operation of fixing the position of the transmission platform 1, and is convenient for disassembly and replacement.

Claims

1. A transmission type semiconductor substrate pad printing fixture, comprising a transmission platform (1), wherein a transmission adjustment cabin (2) is provided inside the top end of one side of the transmission platform (1), and characterized in that: The transmission adjustment cabin (2) is rotatably connected to a transmission screw (3), a transmission drive motor (4) is fixedly installed on the outer wall of the top end of the transmission platform (1) close to the transmission screw (3), a sliding adjustment block (5) is movably installed inside the transmission adjustment cabin (2), a sliding limit top plate (6) is fixedly connected to the top end of one side of the sliding limit top plate (6), a connecting adjustment shaft (7) is rotatably connected to the top end of one side of the connecting adjustment shaft (7), a rotating fixed platform (8) is fixedly connected to the edge surface of the top end of one side of the rotating fixed platform (8), and an auxiliary rotating handle (9) is fixedly connected to the edge surface of the top end of one side of the rotating fixed platform (8).

2. The transmission-type semiconductor substrate pad printing fixture according to claim 1, characterized in that: A connecting disk (10) is fixedly connected to the top of one side of the rotating fixed platform (8), a sliding adjustment disk (11) is fixedly connected to the top of one side of the connecting disk (10), a sliding limit groove (12) is provided inside the sliding adjustment disk (11), a sliding block (13) is detachably mounted on one side of the sliding adjustment disk (11), and sliding auxiliary side plates (14) are fixedly connected to the tops of both sides of the sliding block (13).

3. The transmission-type semiconductor substrate pad printing fixture according to claim 2, characterized in that: An adjusting screw (15) is movably installed inside the top end of one side of the sliding block (13), an adjusting dial (16) is fixedly connected to the top end of one side of the adjusting screw (15), an auxiliary friction groove (17) is provided on the edge of one side surface of the adjusting dial (16), and a fixed disk (18) is fixedly connected to the bottom end of one side of the adjusting screw (15).

4. The transmission-type semiconductor substrate pad printing fixture according to claim 1, characterized in that: A fixed connecting plate (19) is fixedly connected to a bottom end surface of one side of the transmission platform (1), and a fixing groove (20) is provided on a surface of one side of the fixed connecting plate (19).

5. The transmission-type semiconductor substrate pad printing fixture according to claim 1, characterized in that: The connection relationship between the transmission drive motor (4) and the transmission screw (3) is a drive connection, the transmission screw (3) passes through the interior of the sliding adjustment block (5), the connection relationship between the transmission screw (3) and the sliding adjustment block (5) is a threaded connection, the sliding adjustment block (5) is located inside the transmission adjustment cabin (2), the connection relationship between the sliding adjustment block (5) and the transmission adjustment cabin (2) is a sliding connection, the sliding limit top plate (6) is located on the top surface of the transmission platform (1), the connection relationship between the sliding limit top plate (6) and the transmission platform (1) is a sliding connection, the number of the auxiliary rotating handles (9) is several, and the several auxiliary rotating handles (9) are circumferentially distributed on the top edge surface of the rotating fixed platform (8).

6. The transmission-type semiconductor substrate pad printing fixture according to claim 3, characterized in that: The sliding block (13) is located inside the sliding limit groove (12); the connection relationship between the sliding adjustment disk (11) and the sliding block (13) is a sliding connection; the connection relationship between the sliding auxiliary side plate (14) and the sliding adjustment disk (11) is a sliding connection; the adjusting screw (15) passes through the interior of the sliding block (13); the connection relationship between the sliding block (13) and the adjusting screw (15) is a threaded connection; the number of the auxiliary friction grooves (17) is several, and the several auxiliary friction grooves (17) are circumferentially distributed on the edge surface of one side of the adjustment dial (16).

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