High-speed signal acquisition device
By configuring high-speed and high-precision sampling chips and FPGA chips for signal processing and combining them with optical fiber communication interfaces, the error problem of high-speed signal acquisition devices in multi-channel synchronous acquisition and data transmission is solved, and high-precision and real-time signal acquisition and transmission are achieved.
Patent Information
- Application Number
- CN202422387527.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-29
- Publication Date
- 2025-10-03
- Estimated Expiration
- 2034-09-29
AI Technical Summary
Existing high-speed signal acquisition devices have phase errors and gain errors during multi-channel synchronous acquisition, which limits data transmission and leads to inaccurate signal analysis and poor real-time performance.
High-speed and high-precision sampling chips and FPGA chips are used for data processing. The parallel computing capability of FPGA is used to reduce synchronization errors. The clock error in the data transmission process is compensated by the clock module. The optical fiber communication interface is combined to reduce communication delay.
It achieves high-precision signal acquisition and data transmission, reduces synchronization errors and delays, and improves the accuracy and real-time performance of signal analysis.
Smart Images

Figure CN223413632U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the field of signal acquisition equipment, and in particular relates to a high-speed signal acquisition device. Background Art
[0002] With the continuous development of electronic technology and the growing demand for its applications, high-speed signal acquisition devices are moving towards higher sampling rates, higher resolutions, more channels, and stronger data processing capabilities. Furthermore, with the rise of technologies such as the Internet of Things, big data, and artificial intelligence, the role of high-speed signal acquisition devices in data acquisition, processing, and analysis applications will become even more prominent.
[0003] When performing multi-channel synchronous acquisition, existing high-speed signal acquisition devices may experience phase or gain errors in the collected signals due to slight time differences or inconsistent gains between channels, affecting the accuracy of signal analysis. Furthermore, when using multiple ADCs for cross-sampling, inconsistent DC bias points, gains, and phases among the ADCs may introduce bias, gain, and phase errors, requiring calibration and correction through signal processing techniques. In terms of data transmission, although high-speed signal acquisition devices have high sampling rates, they may be limited by factors such as interface speed and transmission protocol. This can lead to delays or packet loss in real-time data transmission, impacting the real-time nature and integrity of the data. Summary of the Invention
[0004] The technical problem to be solved by the present invention is to provide a high-speed signal acquisition device, which realizes high-precision sampling by configuring a high-speed and high-precision sampling chip, and adopts an FPGA chip for data processing. The powerful parallel computing capability of FPGA is used to reduce the synchronization error of the sampled data. In terms of data transmission, the clock error generated in the data transmission process is compensated by the clock module, thereby reducing the synchronization error caused by transmission delay.
[0005] In order to solve the above technical problems, the technical solution adopted by the present invention is:
[0006] A high-speed signal acquisition device includes a main control module, which is electrically connected to an acquisition module, an analog signal output module, a timing module, a storage module, a switch signal output module and a communication module; wherein the acquisition module includes an analog signal acquisition module and a switch signal acquisition module.
[0007] Preferably, the main control module includes a microcontroller and a field programmable logic gate array; wherein the microcontroller is electrically connected to the communication module, the analog signal acquisition module, the analog signal output module, the timing module and the storage module respectively;
[0008] The field programmable logic gate array is electrically connected to the communication module, the switching signal acquisition module and the switching signal output module respectively.
[0009] Preferably, the communication module includes an Ethernet / serial communication module and a fiber optic communication module; the Ethernet / serial communication module is electrically connected to the microcontroller; and the fiber optic communication module is electrically connected to the field programmable logic gate array.
[0010] Preferably, the main control module is used to complete signal processing, communication management, clock synchronization processing and internal resource management of the device.
[0011] Preferably, the storage module includes an internal memory and an external expansion memory. The internal memory is used to temporarily store data and program instructions when the main control module is running, and the external expansion memory is used to store data and programs for a long time, so that key information can be retained after the system power is off.
[0012] Preferably, it further comprises a power supply module, which is connected to the main control module, the storage module, the acquisition module, the time synchronization module and the communication module.
[0013] Preferably, the acquisition module is used to acquire external analog and switch signals, and convert the analog and switch signals into digital signals for processing by the main control module.
[0014] Preferably, the timing module is used to precisely calibrate the internal clock by receiving an external precise clock source signal to achieve signal synchronization.
[0015] Preferably, the main control module forwards the collected data to the outside through the communication module and can receive external data at the same time.
[0016] The utility model can achieve the following beneficial effects:
[0017] This device uses an acquisition module to collect analog and switching data, converting it into digital signals for processing by the main control module. The clock module calibrates the internal clock by receiving signals from an external clock source. The communication module transmits and receives collected data, and the main control module performs clock compensation on the data collected by the device based on the collected data, communication data, and clock information. High-precision sampling is achieved through the use of a high-speed, high-precision sampling chip. FPGA chips are used for data processing, leveraging the FPGA's powerful parallel computing capabilities to reduce synchronization errors in the sampled data. Regarding data transmission, the clock module compensates for clock errors generated during the data transmission process, reducing synchronization errors caused by transmission delays. The communication module utilizes a fiber-optic communication interface to reduce delays in communication lines and improve communication anti-interference performance. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] The present invention will be further described below with reference to the accompanying drawings and embodiments:
[0019] Figure 1 This is a schematic diagram of the system structure of the utility model;
[0020] Figure 2 This is a schematic diagram of the structure of the main controller module of the utility model;
[0021] Figure 3 This is the principle diagram of the Ethernet communication module of this utility model. DETAILED DESCRIPTION
[0022] The preferred solution is Figures 1 to 3 As shown, a high-speed signal acquisition device includes:
[0023] Main control module: The main control module includes at least one of a microcontroller (MCU), a digital signal processor, a field programmable gate array (FPGA), and a system on a chip. It is used to perform functions such as signal processing, communication management, clock synchronization processing, and internal resource management of the device.
[0024] Storage module: connected to the main control module, including internal memory and external expansion memory. The internal memory is used to temporarily store data and program instructions when the main control module is running, and the external expansion memory is used to store data and programs for a long time, so that key information can be retained after the system power is off.
[0025] The selection of storage modules includes read-only memory (NOR Flash), random access memory (SDRAM), Flash memory, SD card, etc.; among them, NOR Flash uses linear storage, with fast reading speed but relatively small storage capacity, and is used to store system software programs of programming devices; SDRAM can be read and written, and can be erased and written multiple times, and is used to store program code and data; SDRAM is a dynamic memory, which provides dynamic space when the system is running, and is used to store variables and data during program operation; NAND Flash uses block data reading method, with large storage capacity, and is suitable for storing user code data of programming devices; SD card can be read and written, and is easy to move and expand, supporting SD mode and SPI mode to adapt to different data transmission requirements.
[0026] Power supply module: connected to the main control module, storage module, acquisition module, clock synchronization module, communication module, etc., connects to the external power supply and performs conversion to provide stable and reliable power supply for the entire device. It includes power management integrated circuits, voltage regulators and other parts, monitors and controls the power status of the device, and provides multiple power outputs, including voltage stabilization, voltage reduction, voltage boost and other functions.
[0027] The selection of power modules includes power conversion module, voltage regulator, filter circuit, power management chip and auxiliary circuit, etc.; the power conversion module converts the input power into the power form required by the internal components of the device, and the voltage regulator is used to provide a stable output voltage; the filter circuit is composed of capacitors, inductors and other components, which are used to filter out noise and fluctuations on the power line and improve the stability of the power supply; the power management chip is used to further manage and protect the power supply, such as voltage stabilization and overcurrent protection.
[0028] Acquisition module: connected to the main control module and external signal terminals, used to collect external analog and switch signals, and convert them into digital signals for processing by the main control module. The accuracy and real-time nature of the collected data are guaranteed through high-precision sampling chips.
[0029] The selection of acquisition modules includes signal conditioning circuit, analog-to-digital converter, level conversion circuit, anti-shake circuit, etc. The signal conditioning circuit amplifies, filters, linearizes and processes the input signal to improve the quality and accuracy of the signal; the analog-to-digital converter converts the conditioned analog signal into a digital signal, and the level conversion circuit converts the level of the input signal according to the needs of the system; the anti-shake circuit is mainly used for processing switching signals. Switching signals jitter due to the influence of mechanical vibration, electromagnetic interference and other factors during the change process. An anti-shake circuit is set after the signal is input to ensure that the acquired signal is stable and reliable.
[0030] Clock synchronization module (i.e. timing module): connected to the main control module, it receives external precise clock source signals, accurately calibrates the internal clock, and achieves signal synchronization.
[0031] The selection of clock synchronization module includes interface module, high-precision crystal oscillator, etc. The interface module is used to connect with the external clock source signal and transmit it to the main control module through signal conditioning and conversion. The high-precision crystal oscillator is used to maintain high time accuracy when using external clock source in the city.
[0032] Communication module: Connected to the main control module, the main control module converts the collected data into data in a format that meets the requirements of the relevant protocol and forwards it to the outside through the communication module. It can also receive external data.
[0033] The selection of communication modules includes communication interfaces, auxiliary circuits, etc. Communication interfaces usually include serial communication interfaces, parallel communication interfaces, Ethernet interfaces, wireless communication interfaces, etc. Auxiliary circuits are used to provide stable power supply, clock signals, and reset signals for the communication modules. The communication module needs to deploy the corresponding communication protocol stack in the main control module according to the on-site communication protocol. The communication protocol stack usually includes the physical layer, data link layer, network layer, transport layer, and application layer. The physical layer is responsible for the physical transmission of data, including signal modulation, demodulation, encoding, decoding, etc. The data link layer is responsible for data framing, error control, flow control, etc. The network layer is responsible for data routing and forwarding to ensure that data can reach the correct destination. The transport layer provides end-to-end communication services, such as TCP and UDP protocols. The application layer defines the format and rules for data exchange, such as HTTP, FTP, SMTP and other protocols.
[0034] The above embodiments are merely preferred technical solutions of the present invention and should not be construed as limiting the present invention. The scope of protection of the present invention shall be the technical solutions set forth in the claims, including equivalent alternatives to the technical features of the technical solutions set forth in the claims. Equivalent alternatives and improvements within this scope are also within the scope of protection of the present invention.
Claims
1. A high-speed signal acquisition device, characterized in that: The main control module is electrically connected to the acquisition module, the analog signal output module, the timing module, the storage module, the switch signal output module and the communication module respectively; wherein the acquisition module includes an analog signal acquisition module and a switch signal acquisition module; The main control module includes a microcontroller and a field programmable logic gate array; wherein the microcontroller is electrically connected to the communication module, the analog signal acquisition module, the analog signal output module, the timing module and the storage module respectively; The field programmable logic gate array is electrically connected to the communication module, the switching signal acquisition module and the switching signal output module respectively.
2. A high-speed signal acquisition device according to claim 1, characterized in that: The communication module includes an Ethernet / serial communication module and an optical fiber communication module; the Ethernet / serial communication module is electrically connected to the microcontroller; and the optical fiber communication module is electrically connected to the field programmable logic gate array.
3. The high-speed signal acquisition device according to claim 1, wherein: The main control module is used to complete signal processing, communication management, clock synchronization processing and internal resource management of the device.
4. The high-speed signal acquisition device according to claim 1, wherein: The storage module includes internal memory and external expansion memory. The internal memory is used to temporarily store data and program instructions when the main control module is running, and the external expansion memory is used to store data and programs for a long time, so that key information can be retained after the system power is off.
5. The high-speed signal acquisition device according to claim 1, characterized in that: It also includes a power module, which is connected to the main control module, storage module, acquisition module, time synchronization module and communication module.
6. The high-speed signal acquisition device according to claim 1, characterized in that: The acquisition module is used to collect external analog and switch signals, and convert the analog and switch signals into digital signals for processing by the main control module.
7. The high-speed signal acquisition device according to claim 1, characterized in that: The timing module is used to precisely calibrate the internal clock by receiving an external precise clock source signal to achieve signal synchronization.
8. The high-speed signal acquisition device according to claim 1, characterized in that: The main control module forwards the collected data to the outside through the communication module and can also receive external data.