Die for producing bar frame carrying disc shaped like Chinese character'tian '

Abstract

The utility model discloses a mold for producing a bar frame carrying disc shaped like a Chinese character'tian ', which comprises a mold base, a lower mold plate, a lower mold block, an upper mold block, an upper mold plate, an injection molding plate, an ejector pin assembly which is arranged below the lower mold plate and is matched with the lower mold plate in a penetrating manner, and a plurality of groups of heat preservation feeding assemblies which are arranged in the surface of an upper cavity of the upper mold plate, the lower end face of the upper die block is provided with an upper cavity surface of a to-be-formed carrier plate product, and a heat preservation feeding assembly is arranged at each T-shaped connecting part right facing the to-be-formed carrier plate product in an attached mode and comprises a flow dividing block embedded into the upper die block, a heating pipe, an electrified wire and a heat preservation feeding pipe. According to the mold for producing the strip frame carrying disc shaped like the Chinese character'tian ', by means of the mode that plastic cement is evenly injected in a dispersed mode, carrying disc products to be formed are synchronously and evenly poured into all corners of a mold cavity from all pouring gates in a T-shaped runner scheme, the technological process is simplified, the production efficiency is improved, and the production cost is reduced. And the yield and the productivity are improved, and the yield is high.

Description

Technical Field

[0001] The utility model relates to the technical field of mold equipment, in particular to a mold for producing a field-shaped strip frame carrier. Background Art

[0002] There is a field-shaped carrier that needs to be assembled with a corrosion-resistant tray and assembled in the form of a button slot and used to support the PCB substrate. Figure 8 Because it is a split installation structure, button-sized countersunk slots are set on the horizontal and vertical frames and the middle cross frame of the field-shaped carrier, and the countersunk slots are connected with the clips set around the tray. The traditional solution is the blister production solution. After heating the plastic plate, it is transferred to the blister mold, and the high negative pressure environment is used to firmly adsorb the plastic plate on the inner wall of the mold cavity, so that both production and efficiency are guaranteed. However, the button-sized countersunk slots of this product are difficult to form in a negative pressure environment, and the porous structure is difficult to complete by blistering. After forming and finalizing, the interior needs to be matrix cut, and the process flow is too complicated. For this reason, it is necessary for us to design a mold equipment that can form this carrier product in one go, simplify the process flow, and increase production and production capacity. Utility Model Content

[0003] The purpose of this utility model is to address the problem that products similar to the "田"-shaped carrier tray with button-sized countersunk slots are difficult to form in the blister process and require excessive matrix cutting and other overly complicated processes in the subsequent process. On the basis of ensuring reliable product quality and sufficient production capacity, we need to simplify the production process. Therefore, we design a mold for producing "田"-shaped strip frame carrier trays. The mold uniformly pours plastic in a dispersed manner, and the carrier tray product to be formed is synchronously and evenly poured into every corner of the cavity from each gate using a "T"-shaped runner solution, thereby simplifying the process, improving output and production capacity, and achieving a high yield rate.

[0004] The technical solutions adopted to solve the above problems are:

[0005] A mold for producing a field-shaped strip frame carrier includes a mold base, a lower mold plate, a lower die block, an upper die block, an upper mold plate, and an injection molding plate, as well as an ejector pin assembly placed under the lower mold plate and perforated to fit the mold, and also includes several groups of heat-insulating feed assemblies built into the upper cavity surface of the upper mold plate.

[0006] The mold base, lower template, lower module, upper module, upper template and injection plate are stacked in sequence and fitted with guide pin and guide sleeve assemblies at the four corners. The lower module fits above the lower template, and the upper module fits below the upper template. Several cooling pipes are provided in the lower and upper modules at a certain distance from the cavity surface of the molded product.

[0007] The lower end face of the upper module is provided with the upper cavity surface of the carrier product to be formed, and a heat-insulating feed assembly is fitted on each T-shaped connection part of the carrier product to be formed, and the heat-insulating feed assembly includes a shunt block embedded in the upper module, a heating pipe, an energized wire and a heat-insulating feed pipe. A runner connected to the cavity is provided at the center of the shunt block, and the runner is connected to the heat-insulating feed pipe. The heating pipe is annularly fitted on the upper end face of the shunt block, and is energized by the energized wire to obtain a heating and heat-insulating effect. The shunt block is screwed to the lower end face of the upper module by screws, and the lower end face of the shunt block and the upper cavity surface are spliced ​​and combined to form a complete upper cavity surface of the carrier product to be formed.

[0008] The insulation feed pipes of each group of insulation feed components converge at one place and are connected to the injection port.

[0009] Furthermore, the upper end surface of the lower module is provided with the lower cavity surface of the carrier product to be formed, and an overflow groove for the slag bag is provided along the periphery of the cavity parting surface to ensure that the plastic fully flows in the cavity and fills every corner after pressurization.

[0010] Furthermore, the ejector assembly includes several ejectors and bases facing the molded carrier product. The base is pushed by an external force-applying device, and the ejectors push the molded carrier product away from the lower cavity surface of the lower module to achieve demolding.

[0011] Furthermore, after obtaining the plastic, the diverter block injects the raw material into the cavity in three directions in a T-shaped structure, and multiple diverter blocks simultaneously pour the plastic raw material, so that the cavity is evenly stressed, evenly diverted, and formed synchronously.

[0012] The beneficial effects of the utility model are:

[0013] The mold for producing the "田"-shaped strip frame carrier plate disperses and evenly injects the plastic, and the carrier plate product to be formed is simultaneously and evenly poured into every corner of the cavity through each gate using a "T"-shaped runner solution, simplifying the process flow, and improving output and production capacity with a high yield rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 1 is a side plan view of a mold for producing a chevron-shaped strip frame carrier according to an embodiment;

[0015] Figure 2 This is a side plan view of a mold for producing a chevron-shaped frame carrier with the upper template, upper module, and lower module removed;

[0016] Figure 3 for Figure 2 A partial enlarged view of point A in the middle;

[0017] Figure 4 This is a schematic structural diagram of the cooling pipeline described in the embodiment;

[0018] Figure 5 A side elevation view of the upper cavity surface according to the embodiment;

[0019] Figure 6 for Figure 5 A partial enlarged view of point B in the middle;

[0020] Figure 7 This is a bottom view of the diverter block described in the embodiment;

[0021] Figure 8 Schematic diagram of the structure of the carrier product according to the embodiment;

[0022] Among them, 1-mold base, 2-lower template, 3-lower module, 4-upper module, 5-upper template, 6-injection port, 7-cooling pipeline, 8-carrier product, 9-diverter block, 10-insulation feed pipe, 11-heating pipe, 12-power wire, 13-overflow groove, 14-guide column and guide sleeve assembly, 15-cooling pipeline, 16-ejector pin, 17-upper cavity surface, 18-diverter block mounting groove, 19-sprue, 20-sinking card slot cavity, 21-horizontal frame, 22-longitudinal frame, 23-sinking card slot, 24-cross bar frame, 25-frame reinforcement rib. DETAILED DESCRIPTION

[0023] The technical solution of the present invention will be described clearly and completely in the following by way of embodiments in conjunction with the accompanying drawings.

[0024] See also Figure 1 and Figure 3 This embodiment proposes a mold for producing a field-shaped strip frame carrier, including a mold base 1, a lower template 2, a lower module 3, an upper module 4, an upper template 5 and an injection molding plate, as well as a ejector pin assembly placed under the lower template 2 and perforated for cooperation, and also includes four groups of heat-insulating feeding assemblies built into the upper cavity surface 17 of the upper template 5. The mold base 1, lower template 2, lower module 3, upper module 4, upper template 5 and injection molding plate are stacked in sequence and are fitted with guide column and guide sleeve assemblies 14 at the four corners. The lower module 3 is fitted above the lower template 2, and the upper module 4 is fitted below the upper template 5. A number of cooling pipes are opened in the lower module 3 and the upper module 4 at a certain distance from the cavity surface of the molded product.

[0025] See Figures 2 to 6The lower end face of the upper module 4 is provided with an upper cavity surface 17 of the carrier product 8 to be formed, and a thermal insulation feed component is fitted on each T-shaped connection portion of the carrier product 8 to be formed, and the thermal insulation feed component includes a diverter block 9 embedded in the upper module 4, a heating tube 11, an energized wire 12 and an insulation feed pipe 10. A runner 19 connected to the cavity is provided at the center of the diverter block 9, and the runner 19 is connected to the insulation feed pipe 10. The heating tube 11 is annularly fitted on the upper end face of the diverter block 9, and is energized by the energized wire 12 to obtain a heating and insulation effect. The diverter block 9 is screwed to the lower end face of the upper module 4 by screws, and the lower end face of the diverter block 9 and the upper cavity surface 17 are spliced ​​and combined to form a complete upper cavity surface 17 of the carrier product 8 to be formed.

[0026] In particular, see Figure 2 The insulation feed pipes 10 of each group of insulation feed components converge at one place and are connected to the injection port 6.

[0027] See Figure 3 The upper end surface of the lower module 3 is provided with the lower cavity surface of the carrier product 8 to be formed, and an overflow groove 13 of the slag bag is provided along the periphery of the cavity parting surface to ensure that the plastic fully flows in the cavity and fills every corner after pressurization.

[0028] See Figure 4 The ejector assembly includes several ejectors 16 and a bottom support facing the molded carrier product 8. The bottom support is pushed by an external force-applying device, and the ejector 16 pushes the molded carrier product 8 away from the lower cavity surface of the lower module 3 to achieve demolding.

[0029] See Figure 2 and Figure 5 After obtaining the plastic, the diverter block 9 injects the raw material into the cavity in three directions in a T-shaped structure, and multiple diverter blocks 9 simultaneously pour the plastic raw material, so that the cavity is evenly stressed, evenly diverted, and synchronously molded.

[0030] By implementing this mold, we have effectively solved the problem that the field-shaped carrier product with a button-sized countersunk slot is difficult to form in the blister process, and that it requires excessive matrix cutting and other overly complicated processes in the subsequent process. On the basis of ensuring reliable product quality and sufficient production capacity, we have fully simplified the production process, increased output and production capacity, and achieved a high yield rate.

[0031] The above describes the embodiments of the present invention in detail in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by ordinary technicians in this field, various changes, modifications, substitutions and variations can be made without departing from the purpose of the present invention. The scope of the present invention is defined by the attached claims and their equivalents.

Claims

1. A mold for producing a field-shaped strip frame carrier, comprising a mold base (1), a lower template (2), a lower module (3), an upper module (4), an upper template (5) and an injection molding plate, and a pin assembly placed below the lower template (2) and perforated to fit. The mold base (1), the lower template (2), the lower module (3), the upper module (4), the upper template (5) and the injection molding plate are stacked in sequence and fitted with guide pillar and guide sleeve assemblies (14) at four corners. The lower module (3) fits above the lower template (2), and the upper module (4) fits below the upper template (5). A plurality of cooling pipes are provided in the lower module (3) and the upper module (4) at a certain distance from the cavity surface of the molded product. The invention is characterized in that: It also includes several groups of heat-insulating feeding components built into the upper cavity surface (17) of the upper template (5), The lower end face of the upper module (4) is provided with an upper cavity surface (17) of the carrier product (8) to be formed, and a heat-insulating feed assembly is provided in contact with each T-shaped connection portion of the carrier product (8) to be formed, and the heat-insulating feed assembly includes a diverter block (9) embedded in the upper module (4), a heating pipe (11), an energized wire (12) and a heat-insulating feed pipe (10), a center of the diverter block (9) is provided with a runner (19) connected to the cavity, the runner (19) is connected to the heat-insulating feed pipe (10), the heating pipe (11) is annularly attached to the upper end face of the diverter block (9), and the heating and heat-insulating effect is obtained by energizing the energized wire (12), the diverter block (9) is screwed to the lower end face of the upper module (4) by screws, and the lower end face of the diverter block (9) and the upper cavity surface (17) are spliced ​​and combined to form a complete upper cavity surface (17) of the carrier product (8) to be formed. The heat-insulating feed pipes (10) of each group of heat-insulating feed components converge at one point and are communicated with the injection port (6).

2. The mold for producing a chevron-shaped frame carrier according to claim 1, characterized in that: The upper end surface of the lower module (3) is provided with a lower cavity surface for the tray-carrying product (8) to be formed, and an overflow trough (13) for a slag bag is provided along the outer periphery of the cavity parting surface.

3. The mold for producing a chevron-shaped frame carrier according to claim 1, characterized in that: The ejector assembly includes a plurality of ejectors (16) facing the formed carrier product (8) and a base, and the base is pushed by an external force-applying device, and the ejector (16) pushes the formed carrier product (8) away from the lower cavity surface of the lower module (3).

4. The mold for producing a chevron-shaped strip frame carrier according to claim 1, characterized in that: After the diverter block (9) obtains the plastic, it injects the raw material into the mold cavity along three directions in a T-shaped structure, and multiple diverter blocks (9) simultaneously inject the plastic raw material, so that the mold cavity is uniformly stressed, uniformly diverted, and synchronously molded.

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