Cooling fin structure

Abstract

The utility model discloses a radiating fin structure, which comprises a bottom plate, a first side wall, a second side wall, a first top cover, a second top cover, a first extension part and a second extension part, and is characterized in that the bottom plate, the first side wall, the second side wall, the first top cover and the second top cover form a cavity; the first extension part and the second extension part are arranged in the cavity, the first extension part is connected with one end, far away from the first side wall, of the first top cover, the second extension part is connected with one end, far away from the second side wall, of the second top cover, and the first extension part and the second extension part are symmetrically arranged. The utility model solves the problems that the conventional standard radiating fin is lower in radiating energy efficiency and higher in finished product price.

Description

Technical Field

[0001] The utility model belongs to the technical field of heat dissipation structures, in particular to a heat dissipation fin structure. Background Art

[0002] Electronic devices, especially semiconductor devices and high-power components, typically generate significant amounts of heat during operation. If this heat cannot be dissipated promptly and effectively, it can cause component overheating, leading to device failure or performance degradation. The existing Sonos heat sink, an international standard component, has only seven heat dissipation surfaces. Field testing shows that the actual heat dissipation efficiency of printed circuit boards (PCBs) is only 70%, a moderate figure. Furthermore, the finished standard component costs as much as $1.56 per PCS. Utility Model Content

[0003] The technical problem solved by the utility model is to provide a heat sink structure, which solves the problem that the heat dissipation efficiency of the current standard heat sink is relatively low and the price of the finished product is relatively high.

[0004] The technical solution of the present invention is: the present invention provides a heat sink structure, including: a base plate, a first side wall and a second side wall, a first top cover and a second top cover, a first extension portion and a second extension portion, the base plate, the first side wall, the second side wall, the first top cover and the second top cover form a cavity, the first extension portion and the second extension portion are arranged in the cavity, the first extension portion is connected to an end of the first top cover away from the first side wall, the second extension portion is connected to an end of the second top cover away from the second side wall, and the first extension portion and the second extension portion are symmetrically arranged.

[0005] Furthermore, the first side wall and the second side wall are symmetrically arranged, the first side wall and the second side wall are both vertically connected to the bottom plate, the first top cover is parallel to the second top cover, the first top cover is vertically connected to the end of the first side wall away from the bottom plate, and the second top cover is vertically connected to the end of the second side wall away from the bottom plate.

[0006] Furthermore, the first extension portion includes a first partition and a first connecting portion, the second extension portion includes a second partition and a second connecting portion, the first connecting portion is parallel to the second connecting portion, the first partition is vertically connected to the first connecting portion, the second partition is vertically connected to the second connecting portion, and the first partition and the second partition are both parallel to the bottom plate.

[0007] Furthermore, a first plug is provided on the first side wall, and the first plug is provided on the central axis of the first side wall. A second plug is provided on the second side wall, and the second plug is provided on the central axis of the second side wall. The first plug is riveted to the first side wall, and the second plug is riveted to the second side wall. The first plug is symmetrical to the second plug.

[0008] Furthermore, a card slot is provided on the bottom plate, and the card slot is provided on the same side as the first plug. The card slot includes a first side surface and a second side surface, the first side surface is parallel to the first side wall and the height of the first side surface is less than the height of the first side wall, and the second side surface is parallel to the second side wall and the height of the second side surface is less than the height of the second side wall.

[0009] Furthermore, the bottom plate is provided with a circular hole and a buckle, the circular hole and the buckle are both provided on the central axis of the bottom plate, and the circular hole is provided on the side facing the card slot.

[0010] Furthermore, a first pressure plate is provided on the side of the first partition facing the first plug, and a second pressure plate is provided on the side of the second partition facing the second plug, the first pressure plate is parallel to the second pressure plate, the height of the first pressure plate away from one end of the first partition is less than the height of the first partition, and the height of the second pressure plate away from one end of the second partition is less than the height of the second partition.

[0011] Furthermore, one end of the first top cover facing the first plug, one end of the second top cover facing the second plug, and one end of the card slot away from the bottom plate are aligned in the vertical direction.

[0012] Furthermore, the lengths of the first pressing plate and the second pressing plate in the horizontal direction are the same as the width of the card slot.

[0013] Furthermore, a first groove is provided at one end of the first top cover facing the first pressure plate, and a bottom edge of the first groove is aligned with a side of the first pressure plate facing the second pressure plate; a second groove is provided at one end of the second top cover facing the second pressure plate, and a bottom edge of the second groove is aligned with a side of the second pressure plate facing the first pressure plate.

[0014] The beneficial effects of the present invention are as follows: the present invention provides a heat sink structure, which places the components that need to dissipate heat in a cavity surrounded by a base plate, a first side wall, a second side wall, a first top cover and a second top cover, and a symmetrical first extension part and a second extension part are also provided in the cavity, the first extension part is connected to the first top cover, and the second extension part is connected to the second top cover, the first extension part and the second extension part increase the heat dissipation area and improve the heat dissipation efficiency of the heat sink. Compared with a standard heat sink, the finished product has a lower price. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0016] Figure 1 A first structural schematic diagram of a heat sink structure provided in an embodiment of the present application;

[0017] Figure 2 This is a schematic diagram of the second structure of a heat sink structure provided in an embodiment of the present application.

[0018] Description of reference numerals:

[0019] 1-bottom plate, 2-first side wall, 3-second side wall, 4-first top cover, 5-second top cover, 6-first extension part, 7-second extension part;

[0020] 11-card slot, 12-first side, 13-second side, 14-round hole, 15-clip, 21-first plug, 31-second plug, 41-first groove, 51-second groove, 61-first partition, 62-first connecting part, 63-first pressure plate, 71-second partition, 72-second connecting part, 73-second pressure plate. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0022] In this utility model, the terms "first," "second," etc. are primarily used to distinguish different devices, elements, or components (which may or may not be the same in type and configuration) and are not intended to indicate or imply the relative importance or quantity of the devices, elements, or components indicated. Unless otherwise specified, "plurality" means two or more.

[0023] The following is a detailed description of the implementation of the present invention with reference to the accompanying drawings:

[0024] Figure 1 A first structural diagram of a heat sink structure provided in an embodiment of the present application is shown in FIG. Figure 1As shown, the present application provides a heat sink structure comprising a base plate 1, a first side wall 2, a second side wall 3, a first top cover 4, a second top cover 5, a first extension 6, and a second extension 7. The base plate 1, first side wall 2, second side wall 3, first top cover 4, and second top cover 5 define a cavity, within which the first extension 6 and second extension 7 are disposed. The cavity is symmetrical with the first extension 6 and second extension 7, and is used to house a circuit board. The provision of the first and second extensions 6 and 7 increases the heat dissipation area of ​​the heat sink structure, thereby improving heat dissipation efficiency. Measurements show that the circumference of the heat sink structure in this embodiment is 78.45 mm, which is larger than the 73.56 mm circumference of the standard Sonos heat sink. This domestic alternative heat sink structure achieves 100% heat dissipation efficiency, offering superior performance. Furthermore, the unit price is $0.3-0.4 USD lower per unit than the original international standard, effectively reducing unit costs.

[0025] The first side wall 2 is arranged parallel to the second side wall 3, the first side wall 2 is vertically fixedly connected to the bottom plate 1, the second side wall 3 is vertically fixedly connected to the bottom plate 1, the first top cover 4 is vertically connected to the end of the first side wall 2 away from the bottom plate 1, the second top cover 5 is vertically connected to the end of the second side wall 3 away from the bottom plate 1, the first top cover 4 and the second top cover 5 are arranged parallel to each other and are not connected, the bottom plate 1, the first side wall 2, the second side wall 3, the first top cover 4 and the second top cover 5 form a rectangular box structure that is through-connected from front to back, which is convenient for air cooling and heat dissipation of the circuit board.

[0026] The first extension portion 6 includes a first partition 61 and a first connecting portion 62, and the second extension portion 7 includes a second partition 71 and a second connecting portion 72. The first partition 61 is vertically connected to the first connecting portion 62, and the first connecting portion 62 is vertically connected to the first top cover 4. The first partition 61 is parallel to the first top cover 4. The end of the first partition 61 away from the first connecting portion 62 does not contact the first side wall 2. The second partition 71 is vertically connected to the second connecting portion 72, and the second connecting portion 72 is vertically connected to the second top cover 5. The second top cover 5 is arranged parallel to the second partition 71. The width of the second partition 71 is smaller than the width of the second top cover 5. The end of the second partition 71 away from the second connecting portion 72 does not contact the second side wall 3.

[0027] Figure 2 This is a second structural diagram of a heat sink structure provided by this application, combined with Figure 1 and Figure 2 A first plug 21 is provided on the first side wall 2, and the first plug 21 is provided on the central axis of the first side wall 2, and the first plug 21 is riveted to the first side wall 2. A second plug 31 is provided on the second side wall 3, and the second plug 31 is provided on the central axis of the second side wall 2, and the second plug 31 is riveted to the second side wall 3. The first plug 21 and the second plug 31 are both arranged towards the front end opening, and the first plug 21 and the second plug 31 are parallel.

[0028] The base plate 1 is also provided with a slot 11, which extends toward the first plug 21 and the second plug 31. The slot 11 includes a first side 12 and a second side 13. The height of the first side 12 is less than the height of the first side wall 2, and the height of the second side 13 is less than the height of the second side wall 3. The base plate 1 is also provided with a circular hole 14 and a buckle 15. Both the circular hole 14 and the buckle 15 are located on the central axis of the base plate 1. The circular hole 14 is located between the buckle 15 and the slot 11, and is used for engaging with other components of the circuit board.

[0029] The first partition 62 is also provided with a first pressure plate 63, which is positioned on the side facing the first plug 21. The free end of the first pressure plate 63 is lower than the height of the first partition 62 from the base plate 1. The second partition 72 is provided with a second pressure plate 73, which is positioned on the side facing the second plug 31. The free end of the second pressure plate 73 is lower than the height of the second partition 72 from the base plate 1. The first and second pressure plates 63 and 73 are parallel, and the first and second pressure plates 63 and 73 have the same width as the slot 11. The first and second pressure plates 63 and 73 cooperate with the slot 11 to secure the other components of the circuit board to the heat sink structure, integrating the circuit board and the heat dissipation structure into a single piece and preventing them from falling off during operation and affecting heat dissipation efficiency.

[0030] A first groove 41 is provided at one end of the first top cover 4 facing the first pressure plate 63, and the bottom edge of the first groove 41 is aligned with the side of the first pressure plate 63 facing the second pressure plate 73. A second groove 51 is provided at one end of the second top cover 5 facing the second pressure plate 73, and the bottom edge of the second groove 51 is aligned with the side of the second pressure plate 73 facing the first pressure plate 63.

[0031] Obviously, the above are only preferred embodiments of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and that various obvious changes, readjustments, and substitutions are possible for those skilled in the art without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments and may include many other equivalent embodiments without departing from the scope of the present invention. The scope of the present invention is determined by the scope of the appended claims.

[0032] Note that throughout this specification, references to terms such as "some embodiments" and "other embodiments" indicate that the specific features, structures, materials, or characteristics described in conjunction with that embodiment or example are included in at least one embodiment or example of the present invention. Throughout this specification, schematic representations of these terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Claims

1. A heat sink structure, characterized in that: include: A bottom plate, a first side wall and a second side wall, a first top cover and a second top cover, a first extension portion and a second extension portion, the bottom plate, the first side wall, the second side wall, the first top cover and the second top cover form a cavity, the first extension portion and the second extension portion are arranged in the cavity, the first extension portion is connected to an end of the first top cover away from the first side wall, the second extension portion is connected to an end of the second top cover away from the second side wall, and the first extension portion and the second extension portion are symmetrically arranged.

2. A heat sink structure according to claim 1, characterized in that: The first side wall and the second side wall are symmetrically arranged, and the first side wall and the second side wall are both vertically connected to the bottom plate. The first top cover is parallel to the second top cover, the first top cover is vertically connected to the end of the first side wall away from the bottom plate, and the second top cover is vertically connected to the end of the second side wall away from the bottom plate.

3. A heat sink structure according to claim 2, characterized in that: The first extension portion includes a first partition and a first connecting portion, the second extension portion includes a second partition and a second connecting portion, the first connecting portion is parallel to the second connecting portion, the first partition is vertically connected to the first connecting portion, the second partition is vertically connected to the second connecting portion, and the first partition and the second partition are both parallel to the bottom plate.

4. A heat sink structure according to claim 3, characterized in that: A first plug is provided on the first side wall, and the first plug is arranged on the central axis of the first side wall. A second plug is provided on the second side wall, and the second plug is arranged on the central axis of the second side wall. The first plug is riveted to the first side wall, and the second plug is riveted to the second side wall. The first plug is symmetrical to the second plug.

5. A heat sink structure according to claim 4, characterized in that: A card slot is provided on the bottom plate, and the card slot is provided on the same side as the first plug. The card slot includes a first side surface and a second side surface, the first side surface is parallel to the first side wall and the height of the first side surface is less than the height of the first side wall, and the second side surface is parallel to the second side wall and the height of the second side surface is less than the height of the second side wall.

6. A heat sink structure according to claim 5, characterized in that: The bottom plate is further provided with a circular hole and a buckle. The circular hole and the buckle are both arranged on the central axis of the bottom plate. The circular hole is arranged on the side facing the card slot.

7. The heat sink structure according to claim 5, wherein: A first pressure plate is provided on the side of the first partition facing the first plug, and a second pressure plate is provided on the side of the second partition facing the second plug. The first pressure plate is parallel to the second pressure plate. The height of the first pressure plate away from one end of the first partition is less than the height of the first partition, and the height of the second pressure plate away from one end of the second partition is less than the height of the second partition.

8. The heat sink structure according to claim 7, wherein: An end of the first top cover facing the first plug, an end of the second top cover facing the second plug, and an end of the card slot away from the bottom plate are aligned in a vertical direction.

9. The heat sink structure according to claim 7, wherein: The lengths of the first pressing plate and the second pressing plate in the horizontal direction are the same as the width of the card slot.

10. The heat sink structure according to claim 7, wherein: A first groove is provided at one end of the first top cover facing the first pressure plate, and a bottom edge of the first groove is aligned with a side of the first pressure plate facing the second pressure plate; a second groove is provided at one end of the second top cover facing the second pressure plate, and a bottom edge of the second groove is aligned with a side of the second pressure plate facing the first pressure plate.

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