Heating device and atomizer

Abstract

The utility model relates to a heating device and an atomizer, and the device comprises a heating part which is provided with a containing cavity, the containing cavity is used for containing a to-be-atomized object, and the heating part is used for heating the to-be-atomized object in the containing cavity; the first heating piece is attached to the outer side wall of the heating piece, and the first heating piece is used for heating the heating piece; and the winding layer is arranged on the periphery of the first heating element, and the winding layer can generate an alternating magnetic field to heat at least part of the heating element. According to the technical scheme, the heating efficiency of the heating device is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of heating devices, in particular to a heating device and an atomizer. BACKGROUND

[0002] At present, in the atomizer market, the mainstream heating method is mainly resistance heating type or electromagnetic heating type. The heating body base material used by resistance heating includes ceramic and FPC, etc. The overall heating rate of the whole heating element is slow, and it takes a long time to heat the atomized material. The user needs to wait for a long preheating time during use, which affects the experience. The winding layer used by electromagnetic heating generally includes ordinary cylindrical wire units. The cylindrical wire units are directly wound outside the heating cavity to form an electromagnetic heating winding layer. During use of this electromagnetic heating winding layer, due to the large number of winding turns of the winding layer, a high voltage and a high working frequency are often required, which also leads to a long heating time. Therefore, the above-mentioned methods cannot meet the demand for fast heating of the atomized material. CONTENT OF THE INVENTION

[0003] The present application provides a heating device and an atomizer, which improves the heating efficiency of the heating device to at least partially solve the above technical problems.

[0004] In order to achieve the above-mentioned purpose, according to the first aspect of the present application, a heating device is provided, comprising: a heating piece having a containing cavity, the containing cavity being used for containing an atomized material, the heating piece being used for heating the atomized material in the containing cavity; a first heating piece attached to the outer side wall of the heating piece, the first heating piece being used for heating the heating piece; and a winding layer arranged at the outer periphery of the first heating piece, the winding layer being capable of generating an alternating magnetic field to heat at least part of the heating piece.

[0005] Optionally, the first heating piece comprises a first insulating layer, a resistance layer and a second insulating layer which are sequentially stacked, the second insulating layer is connected with the outer side wall of the heating piece in a fit manner, and the winding layer is arranged at the outer periphery of the first insulating layer.

[0006] Optionally, the thickness of the first insulating layer is L1, and 0.01mm≤L1≤0.1mm.

[0007] Optionally, the thickness of the second insulating layer is L2, and 0.01mm≤L2≤0.1mm.

[0008] Optionally, the thickness of the resistance layer is L3, and 0.01mm≤L3≤0.1mm.

[0009] Optionally, the inner diameter of the heating piece is D1, and 6.9mm≤D1≤7.3mm.

[0010] Optionally, the outer diameter of the heating piece is D2, and 0.05mm≤D2-D1≤0.08mm.

[0011] Optionally, the wire winding layer extends along an axial length of the heating element, and the axial length is L4, 4mm≤L4≤10mm.

[0012] Optionally, the first heating element extends along an axial length of the heating element, and the axial length is L5, L4:L5≤1:3.

[0013] Optionally, the first heating element has a first heating structure and a second heating structure symmetrically arranged along an axis of the heating element, and each of the first heating structure and the second heating structure includes a plurality of resistance segments sequentially connected and arranged in a bent manner.

[0014] Optionally, the first heating element further has a first wire segment connected to one end of the resistance segments of the first heating structure, a second wire segment connected to one end of the resistance segments of the second heating structure, and a common segment connected to the other end of the resistance segments of the first heating structure and the other end of the resistance segments of the second heating structure, the first wire segment, the first heating structure, and the common segment forming a first loop, and the second wire segment, the second heating structure, and the common segment forming a second loop.

[0015] Optionally, the first insulating layer, the resistance layer, and the second insulating layer have the same thickness.

[0016] Optionally, the heating element has an opening at one end, the opening is in communication with the accommodating cavity, and the opening is used for inserting the to-be-atomized object into the accommodating cavity.

[0017] Optionally, the wire winding layer is arranged close to the opening.

[0018] Optionally, the first heating element is wrapped on the outer sidewall of the heating element along a circumferential direction of the heating element.

[0019] Optionally, the first heating element is annularly arranged on the outer sidewall of the heating element.

[0020] Optionally, the heating device further includes a temperature sensor, and the wire winding layer and the first heating element are respectively provided with the temperature sensor.

[0021] Optionally, the wire winding layer includes a coil.

[0022] Optionally, the temperature sensor on the first heating element is located at a middle portion of the first heating element.

[0023] According to a second aspect of the present application, a kind of atomizers is provided, including the above-mentioned heating device.

[0024] The heating device of the embodiment of the present application includes: a heating element having a accommodating cavity, the accommodating cavity is used to accommodate the material to be atomized, and the heating element is used to heat the material to be atomized in the accommodating cavity; a first heating element, attached to the outer wall of the heating element, the first heating element is used to heat the heating element; a winding layer, arranged on the periphery of the first heating element, the winding layer is used to supply current to generate an induced magnetic field, and to heat at least part of the heating element through the eddy current effect of the induced magnetic field. Through the above technical solution, mixed heating of different heating methods can be achieved on the same heating element. The first heating element attached to the outer wall of the heating element is used to heat the heating element, and the winding layer located on the periphery of the first heating element realizes electromagnetic heating of the heating element by generating an induced magnetic field, which can realize simultaneous heating or separate heating of the two methods, thereby achieving the effect of mixed heating and flexible switching, so as to improve the heating efficiency of the heating device for the atomized material.

[0025] Other features and advantages of the present application will be described in detail in the subsequent detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] To more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present application. Those skilled in the art can also derive other drawings based on these drawings without inventive effort.

[0027] In order to more completely understand the present application and its beneficial effects, the following description will be given in conjunction with the accompanying drawings, wherein the same drawing numbers represent the same parts in the following description.

[0028] Figure 1 is a schematic diagram of the overall structure of a heating device provided in an exemplary embodiment of the present disclosure;

[0029] Figure 2 is an internal cross-sectional view of a heating device provided in an exemplary embodiment of the present disclosure;

[0030] Figure 3 is a schematic structural diagram of a heating element provided in an exemplary embodiment of the present disclosure;

[0031] Figure 4 is a schematic structural diagram of a first insulating layer, a resistive layer, and a second insulating layer provided in an exemplary embodiment of the present disclosure;

[0032] Figure 5 is a schematic diagram of the expanded structure of the first heating element provided in an exemplary embodiment of the present disclosure;

[0033] Figure 6is a schematic view of an unfolded structure of the first heating element provided in the exemplary embodiment of the present disclosure.

[0034] Legend of reference signs:

[0035] 1. heating device;

[0036] 10. heating element; 11. accommodating cavity; 12. opening;

[0037] 20. first heating element; 21. first insulating layer; 22. resistance layer; 23. second insulating layer; 24. first heating structure; 25. second heating structure; 26. resistance section; 27. first outgoing section; 28. second outgoing section; 29. common section;

[0038] 30. wire winding layer;

[0039] 40. temperature sensor;

[0040] 50. to-be-atomized substance. DETAILED DESCRIPTION

[0041] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative effort belong to the protection scope of the present application.

[0042] As shown in Figures 1 to 6 According to the first aspect of the present application, a heating device 1 is provided, comprising: a heating element 10 having an accommodating cavity 11 for accommodating a to-be-atomized substance 50, the heating element 10 being configured to heat the to-be-atomized substance 50 in the accommodating cavity 11; a first heating element 20 attached to an outer sidewall of the heating element 10, the first heating element 20 being configured to heat the heating element 10; and a wire winding layer 30 arranged at an outer periphery of the first heating element 20, the wire winding layer being configured to generate an alternating magnetic field to heat at least part of the heating element 10.

[0043] The heating device 1 of the embodiment of the present application comprises: a heating piece 10, having a containing cavity 11 for containing a to-be-atomized object 50, the heating piece 10 being used for heating the to-be-atomized object 50 in the containing cavity 11; a first heating piece 20, attached to the outer side wall of the heating piece 10, the first heating piece 20 being used for heating the heating piece 10; and a winding layer 30, arranged at the outer periphery of the first heating piece 20, the winding layer 30 being used for supplying current to generate an induced magnetic field and heating at least part of the heating piece 10 through the eddy current effect of the induced magnetic field. Through the above technical solution, mixed heating of different heating modes can be realized on the same heating piece 10. The first heating piece 20 attached to the outer side wall of the heating piece 10 is used for heating the heating piece 10, and the winding layer 30 at the periphery of the first heating piece 20 realizes electromagnetic heating of the heating piece 10 through the generated induced magnetic field, so that the two modes can be heated simultaneously or separately, thereby achieving the effects of mixed heating and flexible switching, so as to improve the heating efficiency of the heating device 1 on the to-be-atomized object 50.

[0044] In the present application, the number of turns, the size and shape of the wire diameter of the winding layer 30 are not specifically limited. The support is used to fix the winding layer 30, and is usually made of high-temperature-resistant plastic material, and the material selection is also not specifically limited. The heating piece 10 is selected to be made of 430 stainless steel as the main material, but other metal materials are also supported.

[0045] Under general environmental conditions, such as dry and non-acidic environment, 430 stainless steel shows excellent corrosion resistance. It can effectively resist the corrosion of most organic acids, organic compounds and moisture, ensuring the long-term stability and service life of the heating piece 10. At the same time, compared with other stainless steels, 430 stainless steel has higher hardness and strength, which makes it not easy to deform.

[0046] Further, 430 stainless steel is a magnetic material, which has unique advantages in occasions requiring magnetic response. For example, in the manufacture of components requiring magnetic attraction or magnetic induction, 430 stainless steel is an ideal choice. Moreover, the manufacturing cost of 430 stainless steel is relatively low, which makes it competitive in application fields with high cost control requirements, so as to facilitate the mass production of the heating piece 10. At the same time, 430 stainless steel has good processing and forming performance, which can be processed and formed through stamping, bending, cutting and other processes, which helps to reduce the processing difficulty and cost in the production process and improve the production efficiency.

[0047] Optionally, the first heating element 20 comprises a first insulating layer 21, a resistance layer 22 and a second insulating layer 23 which are sequentially stacked, the second insulating layer 23 is connected with the outer side wall of the heating element 10, and the wire layer 30 is arranged at the outer periphery of the first insulating layer 21. In this way, the insulation between the resistance layer 22 and the heating element 10 and the wire layer 30 can be ensured, and the safety of the first heating element 20 in use can be ensured.

[0048] In the present application, the first insulating layer 21 is made of a high-temperature material such as resin, and the second insulating layer 23 is made of aerogel material. Because resin can provide very high insulation resistance, effectively prevent current leakage, ensure the safe operation of the circuit or equipment, and at the same time, some resin insulating materials such as epoxy resin have a withstand voltage of more than 5000V, meeting the needs of high-voltage equipment, so the insulation effect of the first insulating layer 21 can be improved. At the same time, the insulating materials such as epoxy resin have excellent dielectric properties, such as dielectric strength, dielectric constant and dielectric loss tangent, etc. The parameters are excellent, and the resin has high tensile strength and impact resistance, can withstand certain mechanical stress, and protect the internal circuit from damage.

[0049] Further, the resin material such as epoxy resin also has good wear resistance and corrosion resistance, can be used in harsh environments for a long time, and has a low water absorption rate, is not easy to be damp, helps to maintain the stability of the insulation performance, and can resist the corrosion of various chemicals, ensuring the safe use of the circuit or equipment in complex environments.

[0050] Because the thermal conductivity of aerogel is very low, which can be as low as 0.012 W / (m·K), it makes it an excellent thermal insulation material, which can significantly reduce the transfer of heat, and the porosity of aerogel is as high as 99.9%, these tiny pores are filled with air, and the thermal conductivity of air is very poor, so the thermal insulation performance of aerogel is further enhanced.

[0051] Further, the dielectric constant of aerogel is less than 1.003, which is a good insulating medium, can reduce the leakage current of integrated circuits, reduce the capacitance effect between wires, and reduce the heat of integrated circuits. At the same time, the design of aerogel material can withstand a temperature of up to 650 degrees Celsius, suitable for insulation requirements in high-temperature environments. In addition, aerogel is very flexible, has various forms such as aerogel concrete, aerogel sheet and aerogel felt, etc., which can be easily cut into the required shape and size, so the applicability and application range of aerogel can be improved.

[0052] In the present application, the resistance layer 22 comprises a thin-film resistance or a thick-film resistance, the difference between which mainly lies in the selection of the resistance conductive material, which is not specifically limited in the present design. Since the manufacturing process of the thin-film resistance has high precision, the thickness and resistance value of the thin-film layer can be precisely controlled. This makes the precision of the thin-film resistance generally reach 0.1% to 1%, which can meet the needs of high-precision measurement and control. In applications requiring precise resistance values, thin-film resistances perform well. At the same time, the resistance value of the thin-film resistance is less affected by environmental factors such as temperature, humidity, and pressure, and has very high stability. In particular, thin-film resistances using oxide, nitride and other materials have very small temperature coefficients, and can maintain stable resistance values within a wide temperature range. This stability is crucial to ensure the normal operation and performance of electronic equipment.

[0053] Further, the size of the thin-film resistance is small, and a high-area-density layout can be achieved, thereby realizing a smaller circuit form. This is an important advantage for modern electronic equipment that pursues miniaturization and integration. At the same time, the thin-film resistance has a high response frequency, which is suitable for high-frequency circuit applications. In high-frequency signal transmission and processing, the thin-film resistance can maintain low impedance and loss, ensuring the quality and stability of the signal. Furthermore, the manufacturing process of the thin-film resistance is mature, and the material has good chemical stability and mechanical strength. Under normal use conditions, the service life of the thin-film resistance can reach tens of thousands of hours or even longer, showing very high reliability.

[0054] The thick-film resistance mainly refers to the resistance printed by the thick-film process. This process coats a layer of resistance material with a relatively large thickness on the substrate, and then fixes the resistance material on the substrate through sintering or drying process, forming a resistance body with a certain shape and size. The resistance material generally uses metal alloy or conductive ceramic material, such as metal ruthenium-based resistance paste, which contains ruthenium oxide, organic solvent and glass beads, etc. By controlling the composition and thickness of the resistance material, the resistance value of the resistance can be adjusted.

[0055] Optionally, the thickness of the first insulating layer 21 is L1, 0.01mm≤L1≤0.1mm. In this way, the thickness of the first insulating layer 21 will not be too small or too large, thereby ensuring the stability of the first heating element 20 during operation. In the present application, the thickness of the first insulating layer 21 can be set to 0.01mm, 0.05mm or 0.1mm, etc. The specific setting should be selected according to the use environment of the device.

[0056] Optionally, the thickness of the second insulation layer 23 is L2, 0.01mm≤L2≤0.1mm. In this way, the thickness of the second insulation layer 23 is not too small or too large, thereby ensuring the stability of the first heating element 20 during operation. In the present application, the thickness of the second insulation layer 23 can be set to 0.01mm, 0.05mm or 0.1mm, etc. The specific setting should be selected according to the use environment of the device.

[0057] Optionally, the thickness of the second insulation layer 23 is L3, 0.01mm≤L3≤0.1mm. In this way, the thickness of the second insulation layer 23 is not too small or too large, thereby ensuring the stability of the first heating element 20 during operation. In the present application, the thickness of the second insulation layer 23 can be set to 0.01mm, 0.05mm or 0.1mm, etc. The specific setting should be selected according to the use environment of the device.

[0058] Optionally, the inner diameter of the heating element 10 is D1, 6.9mm≤D1≤7.3mm. In this way, the inner diameter of the heating element 10 is not too small or too large, thereby ensuring the stability of the heating element 10 when inserted with the to-be-atomized object 50. In the present application, the thickness of the heating element 10 can be set to 6.9mm, 7mm or 6.9mm, etc. The specific setting should be selected according to the use environment of the device.

[0059] Optionally, the outer diameter of the heating element 10 is D2, 0.05mm≤D2-D1≤0.08mm. In this way, the thickness of the heating element 10 is not too small or too large, thereby ensuring the structural strength of the heating element 10. In the present application, the thickness of the heating element 10 can be set to 0.05mm, 0.06mm or 0.08mm, etc. The specific setting should be selected according to the use environment of the device.

[0060] Optionally, the axial extension length of the wire-wound layer 30 along the heating element 10 is L4, 4mm≤L4≤10mm. In this way, the axial extension length of the wire-wound layer 30 along the heating element 10 is not too small or too large, not only meeting the atomization requirements of the device, but also reducing the production cost of the wire-wound layer. In the present application, the axial extension length of the wire-wound layer 30 along the heating element 10 can be set to 4mm, 7mm or 10mm, etc. The specific setting should be selected according to the use environment of the device.

[0061] Optionally, the axial extension length of the first heating element 20 along the heating element 10 is L5, L4:L5≤1:3. In this way, the overlapping area of the wire-wound layer 30 and the first heating element 20 is not too large, thereby facilitating the stability of the device during heating.

[0062] Optionally, the first heating element 20 includes a first heating structure 24 and a second heating structure 25 symmetrically arranged along the axis of the heating element 10. The first heating structure 24 and the second heating structure 25 each include a plurality of resistor segments 26 connected in series and arranged in a curved manner. This arrangement enables time-sharing and zone-based heating, allowing heating of different areas according to actual usage needs, which not only meets the heating needs of the device but also reduces energy consumption during use of the device.

[0063] Optionally, the first heating element 20 further comprises: a first outgoing wire segment 27 connected to one end of the resistor segment 26 of the first heating structure 24; a second outgoing wire segment 28 connected to one end of the resistor segment 26 of the second heating structure 25; and a common segment 29 connected to both the other end of the resistor segment 26 of the first heating structure 24 and the other end of the resistor segment 26 of the second heating structure 25. The first outgoing wire segment 27, the first heating structure 24, and the common segment 29 form a first loop, and the second outgoing wire segment 28, the second heating structure 25, and the common segment 29 form a second loop. This arrangement rationally utilizes the space of the first heating element 20, and the first and second loops share a common segment, which can also save the production cost of the first heating element 20 to a certain extent.

[0064] Optionally, the thicknesses of the first insulating layer 21, the resistance layer 22 and the second insulating layer 23 are all the same. This arrangement not only facilitates the processing of the structure, but also makes the performance of the first heating element 20 better to meet the use requirements of the device.

[0065] Optionally, an opening 12 is provided at one end of the heating element 10, the opening 12 being connected to the accommodating cavity 11, and the opening 12 is used for inserting the atomized object 50 into the accommodating cavity 11. The above arrangement facilitates the insertion of the atomized object 50, thereby meeting the heating requirement of the atomized object 50.

[0066] Optionally, the winding layer 30 is arranged near the opening 12. In this arrangement, when the atomized object 50 is inserted into the accommodating cavity 11, the winding layer 30 is heated, and the heating area of ​​the winding portion of the winding layer 30 is quickly heated by dense winding, thereby significantly shortening the heating time and improving the heating efficiency.

[0067] Optionally, the first heating element 20 is wrapped around the outer wall of the heating element 10 along the circumference of the heating element 10. In the present application, the first heating element 20 is divided into two independent left and right areas, and the heating of the first heating element 20 is precisely controlled to achieve all-round heating of the heating element 10.

[0068] Optionally, the first heating element 20 is annularly arranged on the outer wall of the heating element 10. This achieves all-round coverage to improve heating efficiency.

[0069] Optionally, the heating device 1 further comprises temperature sensors 40, and the temperature sensors 40 are arranged on the wire winding layer 30 and the first heating element 20 respectively. Through the temperature sensors 40, the temperature of the first heating element and the wire winding layer 30 can be monitored in real time, so as to ensure the stable operation of the device.

[0070] Optionally, the temperature sensor 40 on the first heating element 20 is located at the middle part of the first heating element 20. Through the above structure, the accuracy and stability of temperature control can be ensured.

[0071] Optionally, the wire winding layer 30 comprises a coil.

[0072] According to a second aspect of the present application, a nebulizer is provided, comprising the above heating device 1.

[0073] In the heating device 1 of the embodiment of the present application, the heating device 1 comprises: a heating element 10, having a containing cavity 11 for containing a to-be-nebulized substance 50, and the heating element 10 is used for heating the to-be-nebulized substance 50 in the containing cavity 11; a first heating element 20, arranged on the outer side wall of the heating element 10, and the first heating element 20 is used for heating the heating element 10; and a wire winding layer 30, arranged on the outer periphery of the first heating element 20, and the wire winding layer 30 is used for supplying current to generate an induced magnetic field, and the wire winding layer 30 is used for heating at least part of the heating element 10 through the eddy current effect of the induced magnetic field. Through the above technical solution, mixed heating of different heating modes can be realized on the same heating element 10. The first heating element 20 arranged on the outer side wall of the heating element 10 is used for heating the heating element 10, and the wire winding layer 30 arranged on the periphery of the first heating element 20 is used for realizing electromagnetic heating of the heating element 10 through the generated induced magnetic field, and the two modes can be simultaneously heated or separately heated, so as to achieve the effects of mixed heating and flexible switching, so as to improve the heating efficiency of the heating device 1 on the to-be-nebulized substance 50.

[0074] It should be noted that the terms used herein are only intended to describe specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, the singular form is intended to include the plural form, unless the context clearly indicates otherwise, and it should be further understood that the terms "comprise" and / or "include" as used in the specification, indicate the presence of features, steps, operations, devices, components and / or combinations thereof.

Claims

1. A heating device, characterized in that: include: A heating element having a receiving cavity for receiving a substance to be atomized, and the heating element is used to heat the substance to be atomized in the receiving cavity; a first heating element, attached to an outer wall of the heating element, and used to heat the heating element; The winding layer is arranged on the outer periphery of the first heating element, and the winding layer can generate an alternating magnetic field to increase the temperature of at least a portion of the heating element.

2. The heating device according to claim 1, characterized in that The first heating element includes a first insulating layer, a resistance layer, and a second insulating layer stacked in sequence. The second insulating layer is bonded to the outer wall of the heating element. The winding layer is arranged on the periphery of the first insulating layer.

3. The heating device according to claim 2, characterized in that The thickness of the first insulating layer is L1, 0.01 mm≤L1≤0.1 mm.

4. The heating device according to claim 2, characterized in that The thickness of the second insulating layer is L2, 0.01 mm≤L2≤0.1 mm.

5. The heating device according to claim 2, characterized in that The thickness of the resistance layer is L3, 0.01 mm≤L3≤0.1 mm.

6. The heating device according to claim 1, characterized in that The inner diameter of the heating element is D1, 6.9 mm ≤ D1 ≤ 7.3 mm.

7. The heating device according to claim 6, characterized in that The outer diameter of the heating element is D2, 0.05mm≤D2-D1≤0.08mm.

8. The heating device according to claim 1, characterized in that The winding layer extends along the axial direction of the heating element by a length L4, 4mm≤L4≤10mm.

9. The heating device according to claim 8, characterized in that The first heating element extends along the axial direction of the heating element by a length L5, and L4:L5≤1:

3.

10. The heating device according to claim 1, characterized in that The first heating element comprises a first heating structure and a second heating structure symmetrically arranged along the axis of the heating element. The first heating structure and the second heating structure each comprise a plurality of resistance segments connected in sequence and arranged in a bent manner.

11. The heating device according to claim 10, characterized in that The first heating element further comprises: a first outgoing wire segment connected to one end of the resistance segment of the first heating structure; a second outgoing wire segment connected to one end of the resistance segment of the second heating structure; The common section is connected to the other end of the resistance section of the first heating structure and the other end of the resistance section of the second heating structure at the same time. The first outgoing line section, the first heating structure, and the common section form a first loop. The second outgoing line section, the second heating structure, and the common section form a second loop.

12. The heating device according to claim 2, characterized in that The first insulating layer, the resistance layer and the second insulating layer have the same thickness.

13. The heating device according to claim 1, characterized in that An opening is provided at one end of the heating element, the opening being communicated with the accommodating cavity, and the opening being used for allowing the atomized material to be inserted into the accommodating cavity.

14. The heating device according to claim 13, characterized in that The winding layer is arranged close to the opening.

15. The heating device according to claim 1, characterized in that The first heating element is covered on the outer side wall of the heating element along the circumference of the heating element.

16. The heating device according to claim 15, characterized in that The first heating element is arranged in an annular shape on the outer side wall of the heating element.

17. The heating device according to claim 1, characterized in that The heating device further includes a temperature sensor, and the temperature sensors are respectively provided on the winding layer and the first heating element.

18. The heating device according to claim 17, characterized in that The temperature sensor on the first heating element is located in the middle of the first heating element.

19. The heating device according to claim 1, characterized in that The winding layer includes a coil.

20. An atomizer, characterized in that: The heating device comprises the heating device according to any one of claims 1 to 19.

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