Speech enhancement module

Abstract

The utility model provides a speech enhancement module, belongs to the technical field of communication, and enables the speech enhancement module to adapt to more equipment interfaces by separating a core circuit from an interface circuit, thereby improving the application range of the speech enhancement module. The core board adopts an embedded system technology based on an SOC architecture, and the PS unit and the PL unit cooperatively work. And the PS unit realizes noise reduction processing on the input audio through a noise reduction algorithm. The PL unit is matched with the audio coding and decoding chip to realize digital-to-analog conversion of audio signals. And the interface board is used for conditioning input and output audio signals and providing communication and control interfaces for the outside. The voice enhancement module can be independently connected between the arranged audio equipment and the electroacoustic conversion equipment, and a set of low-cost and convenient noise reduction scheme is provided for the arranged audio equipment.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of communication, in particular to a voice enhancement module. BACKGROUND

[0002] Voice communication is an important communication means of wireless communication equipment, and the voice effect directly affects the user experience and the capture of key information. With the development of signal processing technology, audio noise reduction technology has also made breakthrough development. At present, there are a large number of installed communication equipment without noise reduction function. In order to make the advanced audio noise reduction technology applied to this kind of installed equipment, the voice enhancement module is developed to provide the audio noise reduction function without changing the technical state of the original equipment.

[0003] The voice of wireless communication equipment generally has problems such as nonlinear noise interference and howling, which is difficult to be processed by hardware means. With the development of signal processing technology, the algorithm for audio noise reduction has become an advanced and powerful noise reduction means.

[0004] At present, in order to increase the audio noise reduction function of the installed communication equipment, it is more quick and economical to upgrade the original equipment than to replace a large number of equipment. The current mainstream upgrade scheme includes two types of algorithm noise reduction and chip noise reduction.(1) Adopting noise reduction algorithm: common noise reduction algorithms include Minimum Mean Square Error (MMSE), Minimum Mean Square Error Logarithmic (MMSE-LOG), Web Real-Time Communication (Webrtc), Speex Digital Signal Processing (Speexdsp), etc.(2) Adopting noise reduction chip: chip manufacturers embed noise reduction algorithms into chips, and users use the chips on the product circuit and set related parameters according to the requirements to obtain the noise reduction effect.

[0005] The noise reduction algorithm scheme has certain computing power requirements for the hardware platform running the algorithm. If the hardware platform of the original equipment does not meet the algorithm requirements, the platform scheme needs to be changed, which is a major change, takes a long time, and will affect the performance and functions of the original product. Even if the original platform meets the algorithm requirements, software development work is still needed, which also has the risk of technical state change. The upgrade cost on site is also a considerable expense. The noise reduction chip scheme must change the software and hardware at the same time, which will also cause the problems of technical state affected, long time-consuming, high upgrade cost, etc.

[0006] As can be seen from the above, the existing noise reduction cost for installed equipment is high. CONTENT OF THE INVENTION

[0007] The application provides a voice enhancement module to solve the defects of high noise reduction cost and large workload for the installed equipment in the prior art, and realizes the low cost and convenience of the noise reduction function of the installed equipment.

[0008] The application provides a voice enhancement module, which comprises a core board, an audio codec and an interface board, the interface board comprises a plurality of audio interfaces, the audio interfaces are connected with the audio codec and external equipment, the core board comprises a processing system (PS) unit and a programmable logic (PL) unit, the PL unit is connected with the audio codec, and the external equipment comprises audio equipment and electroacoustic conversion equipment.

[0009] According to the voice enhancement module provided by the application, the PS unit further comprises a debugging serial port, a communication serial port, a network port, a double data rate (DDR) interface and a quad serial peripheral interface (QSPI) interface, the debugging serial port and the communication serial port are connected with a level conversion chip of the interface board, the network port is connected with an Ethernet physical layer (PHY) chip of the interface board, the DDR interface is connected with a memory unit, and the QSPI interface is connected with a flash memory unit.

[0010] According to the voice enhancement module provided by the application, the PL unit further comprises at least two general input / output (GPIO) interfaces, and the GPIO interfaces are connected with the interface board.

[0011] According to the voice enhancement module provided by the application, the PL unit further comprises a digital audio interface, and the digital audio interface is connected with the interface board.

[0012] According to the voice enhancement module provided by the application, the interface board further comprises a power supply interface, the power supply interface is connected with a power supply unit on the interface board, and the power supply unit is connected with an external power supply, a core board and power consumption circuits of the interface board.

[0013] According to the voice enhancement module provided by the application, the core board further comprises a joint test action group (JTAG) interface, and the JTAG interface of the core board is connected with the interface board.

[0014] According to the voice enhancement module provided by the application, the interface board further comprises a JTAG interface, and the JTAG interface of the interface board is used for connecting a simulator.

[0015] According to the voice enhancement module provided by the application, the interface board further comprises a noise reduction switch button, and the noise reduction switch button is connected with the GPIO interface.

[0016] According to the voice enhancement module provided by the application, a plug-in part is further included, the plug-in part integrates the audio interfaces, the power supply interface, a communication serial port on the interface board and a debugging serial port on the interface board, and the plug-in part is connected with external equipment.

[0017] The voice enhancement module provided in the application further comprises a cavity and a cover plate.

[0018] The voice enhancement module provided in the application separates the core circuit and the interface circuit, so that the audio noise reduction device can adapt to more device interfaces, and the application range of the voice enhancement module is improved. The core board adopts an embedded system technology based on an SOC architecture, and the PS unit and the PL unit work cooperatively. The PS unit realizes noise reduction processing of the input audio through a noise reduction algorithm. The PL unit realizes digital-analog-digital conversion of the audio signal in cooperation with an audio codec chip. The interface board realizes conditioning of the input and output audio signals, and provides a communication and control interface externally. The voice enhancement module can be independently connected between an installed audio device and an electro-acoustic conversion device, and provides a low-cost and convenient noise reduction solution for the installed audio device. BRIEF DESCRIPTION OF DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description are some embodiments of the application, and other drawings can be obtained by those skilled in the art without creative labor.

[0020] Figure 1 Fig. 1 is a structural schematic diagram of the voice enhancement module provided in the application.

[0021] Figure 2 Fig. 2 is a structural schematic diagram of the core board and the interface board provided in the application.

[0022] Figure 3 Fig. 3 is another structural schematic diagram of the core board and the interface board provided in the application.

[0023] Reference signs:

[0024] 100: connector; 200: noise reduction switch button; 300: indicator light; 400: cavity; 500: interface board; 600: core board; 700: cover plate; 800: audio interface; 900: volume GPIO interface; 110: noise reduction level GPIO interface; 120: digital audio interface; 130: communication serial port; 140: debugging serial port; 150: network port; 160: DDR interface; 170: QSPI interface; 180: JTAG interface. DETAILED DESCRIPTION

[0025] In order to make the purposes, technical solutions and advantages of the present application clearer, the technical solutions in the present application will be described clearly and completely below with reference to the drawings in the present application. Obviously, the described embodiments are some of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0026] Figure 1 Figure 1 is a structural schematic diagram of a voice enhancement module provided by the present application. Referring to Figure 1, Figure 1 the embodiment of the present application provides a voice enhancement module, which comprises a core board 600, an audio codec and an interface board 500. The interface board 500 comprises a plurality of audio interfaces 800, the audio interfaces 800 are connected to the audio codec and external devices, the core board comprises a processing system PS unit and a programmable logic PL unit, the PL unit is connected to the audio codec, and the external devices comprise audio devices and electro-acoustic conversion devices.

[0027] The voice enhancement module (voice enhancement device) of the present application is suitable for various audio devices which have a demand for audio noise reduction, for example, a radio. The voice enhancement module is arranged between an audio device and an electro-acoustic conversion device (for example, a loudspeaker or a microphone) when applied, without changing the architecture of the original audio device.

[0028] The voice enhancement module is connected to an audio device (for example, a radio) and an electro-acoustic conversion device. Upstream audio is output from the electro-acoustic conversion device to the voice enhancement module, and is output to the radio after being processed by the voice enhancement module. Downstream audio is output from the radio to the voice enhancement module, and is output to the electro-acoustic conversion device for playing after being processed by the voice enhancement module.

[0029] The number of the audio interfaces 800 can be 2 pairs (1 pair of single-ended input and output interfaces, and 1 pair of differential input and output interfaces). One pair of the audio interfaces is connected to the audio device and the electro-acoustic conversion device. For example, the voice enhancement module has 2 pairs of the audio interfaces 800, one pair of the audio interfaces 800 is connected to the radio and a single-ended electro-acoustic conversion device, and the other pair of the audio interfaces 800 is connected to the radio and a differential electro-acoustic conversion device. As shown in Figure 2, Figure 3 there are 2 pairs of the audio interfaces (each pair comprises 1 input and 1 output), which are respectively used for the single-ended electro-acoustic conversion device and the differential electro-acoustic conversion device.

[0030] In order to adapt to more device interfaces, the voice enhancement module of the present application adopts a structure in which the core board 600 and the interface board 500 are separated.

[0031] The core board is used for noise reduction processing of input audio signals (uplink audio or downlink audio), and the core board includes a core board processor, for example, the core board processor is selected as a Zynq-7000 series processor of Xilinx Company, model XC7Z010. As shown in Figure 2 The XC7Z010 processor internally contains a processing system (PS) unit and a programmable logic (PL) unit. The frequency of an advanced reduced instruction set computer machine (ARM) processor is up to 667 MHz. The number of logic units of the PL unit can be up to 28K. The core board of the present application further includes a power supply system. The core board of the present application is compact and small, for example, the area of the core board of the present application is 42mm*42mm. The core board of the present application completes the design of the ZYNQ7000 series processor minimum system + power supply system + audio coder-decoder (CODEC) circuit, and can be directly embedded in the circuit as a functional complete on-board unit. The voice enhancement module of the present application can run mainstream embedded operating systems, and the computing power meets mainstream noise reduction algorithms.

[0032] The PL unit is responsible for interfacing with the audio codec, for example, the PL unit communicates with the audio codec through an inter-IC sound (I2S) and an inter-integrated circuit (I2C) two-wire serial bus. The model of the audio codec includes TLV320AIC23B. The audio codec includes an analog-to-digital (AD) converter and a digital-to-analog (DA) converter, wherein the signal-to-noise ratio of the AD converter is up to 90dB, and the signal-to-noise ratio of the DA converter is up to 100dB. The audio codec is used to convert the input audio (analog signal) from the outside world into a digital signal (digital audio), or restore the digital signal output by the core board into an analog signal and output.

[0033] The voice enhancement module provided by the embodiment of the application separates the core board 600 and the interface board 500, so that the audio noise reduction device can adapt to more device interfaces, and the application range of the voice enhancement module is improved. The core board adopts an embedded system technology based on a SOC architecture, and the PS unit and the PL unit work cooperatively. The PS unit realizes noise reduction processing of the input audio through a noise reduction algorithm. The PL unit realizes digital-analog-digital conversion of the audio signal in cooperation with an audio codec chip. The interface board realizes conditioning of the input and output audio signals, and provides a communication and control interface externally. The voice enhancement module of the application can be independently connected between the installed audio device and the electro-acoustic conversion device, and provides a low-cost and convenient noise reduction solution for the installed audio device.

[0034] It can be understood that the PL unit further includes a digital audio interface 120, and the digital audio interface 120 is connected with the interface board 500.

[0035] The PL unit externally reserves the digital audio interface 120, and can skip the encoding and decoding process of the input audio by the audio decoder. For example, when the input audio is digital audio, the digital audio can be directly input into the PS unit of the core board through the digital audio interface 120, and the digital audio is subjected to noise reduction processing by the PS unit.

[0036] The application directly realizes noise reduction processing of the input digital signal by separately reserving the digital audio interface 120, avoids the conversion process of the digital signal, reduces signal distortion, and is beneficial to improving the efficiency of noise reduction of the digital signal.

[0037] It can be understood that the PS unit further includes a debugging serial port 140, a communication serial port 130, a network port 150, a double data rate (DDR) interface 160, and a quad serial peripheral interface (QSPI) interface 170, the debugging serial port 140 and the communication serial port 130 are connected with a level conversion chip of the interface board 500, the network port 150 is connected with an Ethernet physical layer (PHY) chip of the interface board 500, the DDR interface 160 is connected with a memory unit, and the QSPI interface 170 is connected with a flash memory unit.

[0038] The main function of the interface board 500 is to connect and convert various signals between the core board and the external interface, adapt the characteristics of the externally input audio, so that the output audio signal (the audio signal after noise reduction) meets the level requirement of the output.

[0039] The level conversion chip is used for converting the signal level, and the level conversion chip is connected through the debugging serial port 140 and the communication serial port 130, so as to realize conversion between a transistor-transistor logic (TTL) level and a recommended standard 232 (RS232) level of the serial port signal. For example,Figure 3 As shown, the level conversion chip includes a TRS3122E interface chip (TRS3122ERGE). The Ethernet physical layer (PHY) chip includes an 88E1512 chip (88E1512-AO-NNP2I000), which is used to provide Ethernet physical layer and partial data link layer processing. The network port 150 includes a Fast Ethernet general interface (Reduced Gigabit Media Independent Interface, RGMII) and a management data input / output interface (MDIO). The Ethernet PHY chip can be connected to a universal registered jack 45 (RJ45) through a switching process (for example, a switching cable).

[0040] Furthermore, the debugging serial port 140 and the communication serial port 130 are multi-function input and output (MIO) interfaces.

[0041] Furthermore, audio from the network can be input through the network port 150 and subjected to noise reduction processing.

[0042] The core board processor's power supply (PS) unit also includes a double data rate (DDR) interface 160 for connecting to the memory unit. The memory unit includes low-voltage double data rate 3-generation synchronous dynamic random access memory (DDR 3L). The PS unit also includes a quad serial peripheral (QSPI) interface 170 for connecting to the flash memory unit. QSPI interface 170 is an MIO interface.

[0043] This application realizes signal docking between the core board 600 and the interface board 500 through the debugging serial port 140, the communication serial port 130, the network port 150, the audio interface 800, the volume GPIO interface, and the noise reduction level GPIO interface, and completes signal conditioning on the interface board so that the output audio signal meets the output level requirements, thereby improving the accuracy of audio processing.

[0044] It is understandable that the PL unit further includes at least two general purpose input and output (GPIO) interfaces, and the GPIO interfaces are connected to the interface board 500 .

[0045] It can be understood that the GPIO interface is used for control signals.

[0046] It can be understood that the interface board 500 further comprises a noise reduction switch button 200, and the noise reduction switch button 200 is connected with the GPIO interface.

[0047] The PL unit is connected with the interface board 500 through the GPIO interface, and the GPIO interface is used for controlling the noise reduction standard of the audio, for example, noise reduction level control and volume control. For example, the GPIO interface comprises a noise reduction level GPIO interface 110, and a user can set the noise reduction level through the noise reduction level GPIO interface 110. The GPIO interface further comprises a volume GPIO interface 900, and a user can adjust the volume control through the volume GPIO interface 900.

[0048] The interface board 500 further comprises a noise reduction switch button 200, and the noise reduction switch button 200 is connected with the GPIO interface. For example, the noise reduction switch button 200 is connected with the noise reduction level GPIO interface 110, and a user adjusts the noise reduction level through the noise reduction switch button 200. The voice enhancement module further comprises an indicator light 300, and the indicator light 300 comprises a noise reduction indicator light and a power supply indicator light. When the noise reduction indicator light is off, it represents that the noise reduction processing is not enabled at this time, and the input audio signal is only transmitted in the voice enhancement module. At this time, the noise reduction switch button 200 is pressed once, and the noise reduction indicator light is turned from off to long light, which represents that the noise reduction processing is started to be enabled. The noise reduction switch button 200 is continuously pressed, and the noise reduction level can be adjusted. The noise reduction level has three levels of low, medium and high, and the higher the noise reduction level is, the greater the noise reduction degree is. A user can select a suitable noise reduction level according to the quality of the original signal (input audio). When the noise reduction processing is started to be enabled (the noise reduction switch button 200 is pressed once), the noise reduction level is low, the noise reduction switch button 200 is pressed once, the noise reduction level is converted from low to medium. The noise reduction switch button 200 is pressed again, and the noise reduction level is converted from medium to high. The noise reduction switch button 200 is pressed again, and the noise reduction processing is closed, and the noise reduction indicator light is off.

[0049] Further, the interface board 600 further comprises a volume adjustment button, and the volume adjustment button is connected with the GPIO interface. For example, the volume adjustment button is connected with the audio GPIO interface 900, and a user can control the volume through the volume adjustment button.

[0050] The application realizes the control of different noise reduction processing levels and the volume control of the input audio signal through the GPIO interface. The user sets the noise reduction level through the noise reduction switch button

[0051] It can be understood that the interface board 500 further comprises a power supply interface, and the power supply interface is connected with a power supply unit on the interface board. The power supply unit is connected with an external power supply, a core board and a power consumption circuit of the interface board.

[0052] The core board includes a power supply system, an input port of the power supply system is connected with a power supply unit of the interface board, and the power supply unit is used for supplying power to the core board. The power supply unit of the interface board is also connected with power consumption circuits of the interface board, and is used for supplying power to the interface board 500. The power supply interface is connected with the power supply unit, and the power supply unit converts the input external power supply into power supplies suitable for the core board 600 and the interface board 500. For example, the external input power supply is a power supply of 10.8-32.4 V. The power supply interface converts part of the external input power supply into a 5 V power supply, which is used for supplying power to the core board. The power supply interface also converts part of the external input power supply into power supplies of 10 V, 3.3 V and 1.8 V, which are used for supplying power to the interface board 500.

[0053] The voice enhancement module is not provided with a switch, and the voice enhancement module is turned off by disconnecting the external power supply. The voice enhancement module is turned on by connecting the external power supply.

[0054] Further, the voice enhancement module further includes a power indicator light, the power indicator light is on when the voice enhancement module is turned on, and the power indicator light is off when the voice enhancement module is turned off.

[0055] The power supply interface and the power supply unit are used for realizing power supply of each path of the interface board 500 and the core board 600, and improving power supply efficiency of the interface board 500 and the core board 600 with different power supply requirements.

[0056] It can be understood that the core board further includes a Joint Test Action Group (JTAG) interface 180, and the JTAG interface 180 of the core board is connected with the interface board.

[0057] It can be understood that the interface board further includes a JTAG interface, and the JTAG interface of the interface board is used for connecting a simulator.

[0058] The core board is connected with an external simulator through a Joint Test Action Group (JTAG) interface 180, and simulation debugging or simulation testing of the core board can be realized. The simulator is connected with the JTAG interface of the interface board through a 6-pin flat pin on the interface board 500.

[0059] The JTAG interface 180 is used for connecting the simulator, and simulation debugging or simulation testing of the core board is realized, which is beneficial to updating and iteration of noise reduction processing capability of the core board.

[0060] It can be understood that the voice enhancement module further includes a plug-in 100, the plug-in 100 integrates an audio interface 800, a power supply interface, a communication serial port on the interface board and a debugging serial port on the interface board, and the plug-in 100 is connected with an external device.

[0061] Part of the interface on the interface board 500 is integrated through the plug-in 100. The interface board 500 is connected to external devices such as audio devices, electro-acoustic conversion devices, power supplies, etc. through the plug-in 100.

[0062] The application unifies the connection of external devices through the plug-in 100, simplifies the connection of the voice enhancement module and external devices, and further simplifies the installation mode of the voice enhancement module.

[0063] It can be understood that the voice enhancement module also includes the cavity 400 and the cover plate 700.

[0064] The cavity 400 and the cover plate 700 are used to accommodate and fix the parts of the voice enhancement module, so that the structure of the voice enhancement module is more compact.

[0065] The application provides a voice enhancement module based on algorithm to realize noise reduction. The system on chip (SOC) platform computing power adopted can support mainstream noise reduction algorithms, ensuring the advancement of noise reduction technology. The application mode of the voice enhancement module is external series connection, without changing the original device technical state, convenient for upgrading, low in time consumption and cost. It is simple to operate, one-key control, and easy to use. For noise reduction of installed devices, the voice enhancement module of the application has lower cost and better noise reduction efficiency.

[0066] The device embodiments described above are only schematic, wherein the units shown as separate components can or can not be physically separate, and the components shown as units can or can not be physical units, i.e., can be located in one place or distributed on multiple network units. Some or all of the modules can be selected according to actual needs to achieve the purpose of the embodiment. Those skilled in the art can understand and implement without creative labor.

[0067] From the above description of the embodiments, those skilled in the art can clearly understand that the embodiments can be realized by means of software plus necessary universal hardware platforms, and of course can also be realized by hardware. Based on such understanding, the above technical solutions can be embodied in the form of software products, which can be stored in a computer readable storage medium, such as ROM / RAM, magnetic disk, optical disk, etc., and include a number of instructions to make a computer device (which can be a personal computer, a server, or a network device, etc.) execute the methods described in each embodiment or some parts of the embodiments.

[0068] Finally, it should be noted that the above examples are only used to illustrate the technical solutions of the present application, and are not intended to limit the same; although the present application has been described in detail with reference to the foregoing examples, those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing examples, or make equivalent replacements for some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A speech enhancement module, characterized in that: include: A core board, an audio codec and an interface board, wherein the interface board includes multiple audio interfaces, which connect the audio codec and external devices. The core board contains a processing system PS unit and a programmable logic PL unit, which connects the audio codec. The external devices include audio devices and electroacoustic conversion devices.

2. The speech enhancement module according to claim 1, characterized in that The PS unit also includes a debugging serial port, a communication serial port, a network port, a double data rate DDR interface and a four-wire serial peripheral QSPI interface. The debugging serial port and the communication serial port are connected to the level conversion chip of the interface board, the network port is connected to the Ethernet physical layer PHY chip of the interface board, the DDR interface is connected to the memory unit, and the QSPI interface is connected to the flash memory unit.

3. The voice enhancement module according to claim 1, characterized in that The PL unit further includes at least two general purpose input and output (GPIO) interfaces, and the GPIO interfaces are connected to the interface board.

4. The voice enhancement module according to claim 1, characterized in that The PL unit further includes a digital audio interface connected to the interface board.

5. The voice enhancement module according to claim 1, characterized in that: The interface board also includes a power supply interface, which is connected to a power supply unit on the interface board, and the power supply unit is connected to an external power supply, a core board, and an electrical circuit of the interface board.

6. The speech enhancement module according to claim 1, characterized in that: The core board also includes a Joint Test Action Group (JTAG) interface, and the JTAG interface of the core board is connected to the interface board.

7. The speech enhancement module according to claim 1, characterized in that: The interface board also includes a JTAG interface, and the JTAG interface of the interface board is used to connect to the emulator.

8. The voice enhancement module according to claim 3, characterized in that: The interface board further includes a noise reduction switch button, and the noise reduction switch button is connected to the GPIO interface.

9. The speech enhancement module according to claim 1, characterized in that: It also includes a connector, which integrates the audio interface, the power interface, the communication serial port on the interface board and the debugging serial port on the interface board, and is connected to external devices.

10. The speech enhancement module according to claim 1, characterized in that: Also included is a cavity and a cover.

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