Loudspeaker module and electronic equipment

Abstract

The embodiment of the utility model discloses a loudspeaker module and electronic equipment, the loudspeaker module comprises a shell, a sound production unit, a sound absorption assembly, a conductive assembly and a heat dissipation assembly, a sound cavity is formed in the shell, the sound production unit, the sound absorption assembly and the heat dissipation assembly are respectively arranged in the sound cavity, and the conductive assembly is arranged in the sound cavity. The conductive assembly is arranged on the outer side of the shell to provide electromagnetic shielding and electrostatic protection, the heat dissipation assembly is connected with the sound production unit to conduct heat and prolong the service life of the sound production unit, the sound absorption assembly is arranged on one side of the sound production unit to absorb sound waves and improve the sound quality, and the sound absorption assembly, the conductive assembly and the heat dissipation assembly are all made of nano-silver sound absorption cotton. Not only is the manufacturing cost reduced, but also the sound absorption effect, the heat dissipation performance and the electromagnetic shielding capability of the loudspeaker are remarkably improved, so that the sound quality performance and the reliability of the loudspeaker are guaranteed.

Description

Technical Field

[0001] The utility model relates to the field of electronic devices, in particular to a loudspeaker module and an electronic device. Background Art

[0002] To improve sound quality and performance, speakers on the market typically employ a variety of materials and technologies to address different issues. For example, sound-absorbing foam is used to enhance sound clarity and purity; conductive foam is attached to the exterior of the speaker housing to provide electromagnetic shielding and electrostatic protection; and thermally conductive adhesive or heat sinks are often used to reduce the speaker's temperature during high-power operation. Each of these three functions is achieved through different materials. Due to the differences in each material and its assembly location, different materials and processes are required. This multi-material and multi-process requirement significantly increases material and processing costs. Utility Model Content

[0003] In view of this, an object of the present invention is to provide a speaker module and an electronic device that can ensure sound quality performance and effectively control costs.

[0004] First, the speaker module includes:

[0005] a shell having a sound cavity formed therein;

[0006] A sound-generating unit is arranged in the sound cavity;

[0007] A sound absorbing component is arranged in the sound cavity and is located on one side of the sound generating unit;

[0008] A conductive component is arranged outside the shell;

[0009] a heat dissipation component, disposed in the sound cavity and connected to the sound generating unit;

[0010] Among them, the sound-absorbing components, conductive components and heat-dissipating components are all nano-silver sound-absorbing cotton composites.

[0011] Furthermore, the sound-emitting unit includes a diaphragm and a voice coil fixed to the lower surface of the diaphragm, and the voice coil is arranged in a magnetic gap formed by the magnetic circuit system.

[0012] Furthermore, a support seat is provided on the inner top surface of the shell, and the support seat surrounds and supports the outer side of the magnetic circuit system.

[0013] Furthermore, the diaphragm is overlapped on the support seat, and the diaphragm divides the sound cavity into a front cavity and a rear cavity.

[0014] Furthermore, the sound-generating unit and the sound-absorbing component are arranged in the rear cavity.

[0015] Furthermore, a sound outlet hole is provided on one side of the shell at a position corresponding to the diaphragm, and the sound outlet hole is communicated with the front cavity.

[0016] Further, the shell bottom is provided with a first through hole corresponding to the position of the sound production unit, and a magnetic yoke plate is embedded in the first through hole.

[0017] Further, a heat dissipation assembly is arranged between the magnetic yoke plate and the magnetic circuit system.

[0018] Further, a mounting groove is concavely arranged on the outer side of the shell, and the conductive assembly is arranged in the mounting groove.

[0019] In the second aspect, the utility model embodiment further provides an electronic equipment, and the electronic equipment comprises the loudspeaker module as described in the first aspect.

[0020] The utility model embodiment provides a loudspeaker module and electronic equipment, wherein the loudspeaker module comprises a shell, a sound production unit, a sound absorption assembly, a conductive assembly and a heat dissipation assembly, a sound cavity is formed in the shell, the sound production unit, the sound absorption assembly and the heat dissipation assembly are arranged in the sound cavity respectively, the conductive assembly is arranged on the outer side of the shell to provide electromagnetic shielding and static electricity protection, the heat dissipation assembly is connected with the sound production unit to conduct heat, prolongs the service life of the sound production unit, the sound absorption assembly is arranged on one side of the sound production unit to absorb sound waves, improves the tone, wherein the sound absorption assembly, the conductive assembly and the heat dissipation assembly are all nanometer silver sound absorption cotton, not only reduce the manufacturing cost, but also significantly improve the sound absorption effect, the heat dissipation performance and the electromagnetic shielding capacity of the loudspeaker, thereby guaranteeing the tone performance and reliability of the loudspeaker. BRIEF DESCRIPTION OF DRAWINGS

[0021] The above and other objects, features and advantages of the utility model will become more apparent from the following description of the utility model embodiments with reference to the accompanying drawings, in which:

[0022] Figure 1 It is the whole structure schematic diagram of the loudspeaker module of the utility model embodiment;

[0023] Figure 2 It is the loudspeaker module sectional view of the utility model embodiment;

[0024] Figure 3 The sectional view of the shell of the utility model embodiment;

[0025] Figure 4 It is the structure schematic diagram of the shell support seat of the utility model embodiment;

[0026] Figure 5 It is the first space sectional view of the utility model embodiment.

[0027] MARK NUMBER EXPLANATION:

[0028] 10 - shell; 11 - body; 111 - support seat; 1111 - square ring frame; 1112 - clamping groove; 112 - sound hole; 113 - mounting groove; 114 - partition plate; 115 - hollow part; 116 - stop block; 12 - first cover body; 13 - second cover body; 131 - first through hole; 14 - sound cavity; 141 - front cavity; 142 - rear cavity; 143 - first space; 144 - second space; 15 - magnetic yoke plate; 20 - sound unit; 21 - diaphragm; 22 - voice coil; 23 - magnetic circuit system; 231 - magnetic gap; 232 - magnetic bowl; 233 - magnet; 234 - magnetic yoke; 235 - magnetic conducting sheet; 24 - dust screen; 30 - sound absorption assembly; 40 - conductive assembly; 50 - heat dissipation assembly. DETAILED DESCRIPTION

[0029] The present application is described in detail below based on examples, but the present application is not limited to only these examples. In the following detailed description of the present application, some specific details are described in detail. The present application can also be fully understood without the description of these details by those skilled in the art. In order to avoid confusion of the essence of the present application, well-known methods, processes, procedures, elements and circuits are not described in detail.

[0030] In addition, those of ordinary skill in the art will understand that the drawings provided herein are for illustrative purposes only and are not necessarily drawn to scale.

[0031] Unless otherwise clearly specified and limited, the terms "mounting", "connecting", "connecting", "fixing" and the like should be understood in a broad sense, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise clearly limited. The specific meaning of the above terms in the present application can be understood according to the specific circumstances by those skilled in the art.

[0032] Unless the context clearly requires otherwise, the terms "including", "containing", and the like in the entire application should be interpreted as inclusive rather than exclusive or exhaustive; that is, as "including but not limited to".

[0033] In the description of the present application, it should be understood that the terms "first", "second" and the like are only for the purpose of description and should not be understood as indicating or implying relative importance. In addition, in the description of the present application, unless otherwise stated, the meaning of "multiple" is two or more.

[0034] The embodiment of the application provides a loudspeaker module, which comprises a shell 10, a sound generating unit 20, a sound absorbing assembly 30, a conductive assembly 40 and a heat dissipation assembly 50. Referring to Figure 1 , the shell 10 is in the shape of a cuboid as a whole, and the bottom is provided with an arc-shaped structure to match other structures in an electronic device for installation. Referring to Figure 2 , the sound generating unit 20 and the sound absorbing assembly 30 are both arranged in a sound cavity 14, and the sound absorbing assembly 30 is located on one side of the sound generating unit 20, used for absorbing sound waves to improve sound quality. The heat dissipation assembly 50 is arranged in the sound cavity 14 and connected with the sound generating unit 20, which can reduce the temperature of the sound generating unit 20 when working, and guarantee stable operation for a long time. The conductive assembly 40 is arranged outside the shell 10 to provide electromagnetic shielding and electrostatic protection, and protect the internal circuit from interference. Among them, the sound absorbing assembly 30, the heat dissipation assembly 50 and the conductive assembly 40 are all nano-silver sound absorbing cotton. The three assemblies are made of the same material, which can effectively reduce the manufacturing cost of the loudspeaker module and simplify the manufacturing process of the loudspeaker module.

[0035] Referring to Figure 2 , the sound generating unit 20 comprises a diaphragm 21, a voice coil 22 and a magnetic circuit system 23. The voice coil 22 is arranged in a magnetic gap 231 of the magnetic circuit system 23 and fixed to the lower surface of the diaphragm 21. The diaphragm 21 is in the shape of a ring, and a dust screen 24 is arranged at the upper middle part of the diaphragm 21, which can prevent dust and sundries from entering the area of the voice coil 22 and provide certain mechanical support to make the diaphragm 21 keep symmetry and stability.

[0036] Further, referring to Figure 2 and Figure 5 , the magnetic circuit system 23 comprises a magnetic bowl 232, a magnet 233 and two magnetic yoke pieces 234. The magnetic bowl 232 is in the shape of U, located at the bottom of the whole magnetic circuit system 23 and fixed through a support seat 111. The magnet 233 is located in the hollow part of the magnetic bowl 232, and the two magnetic yoke pieces 234 are fixed at the front and rear ends of the U-shaped magnetic bowl 232 through the support seat 111 to form a closed magnetic circuit and reduce magnetic leakage. Referring to Figure 5 , the upper surfaces of the two magnetic yoke pieces 234 and the magnet 233 are further provided with magnetic conductive sheets 235 respectively, which concentrate the magnetic field and transmit it to the voice coil 22 through the air gap, and optimize the magnetic field distribution. Referring to Figure 2 and Figure 5There is a certain gap between the magnetic bowl 232 and the magnet 233, and between the magnetic yoke 234 and the magnet 233. This gap is the magnetic gap 231. The voice coil 22 is accommodated in the magnetic gap 231, and the magnetic lines of force formed by the magnetic circuit system 23 pass through the voice coil 22. When the voice coil 22 is connected to the electrical signal, it is subjected to the Ampere force in the magnetic field formed by the magnetic circuit system 23. The magnitude and direction of the Ampere force on the voice coil 22 correspond to the signal changes. When the signal changes, the voice coil 22 is affected by the Ampere force and vibrates up and down in the magnetic gap 231. Because the voice coil 22 and the diaphragm 21 are fixedly combined as one, the vibration of the voice coil 22 can drive the diaphragm 21 to vibrate, thereby producing sound.

[0037] Reference Figure 3 A support base 111 is provided in the housing 10 to fix the sound unit 20. Figure 4 The support base 111 is connected to the top of the inner portion of the housing 10 and is supported around the outer side of the magnetic circuit system 23. The diaphragm 21 is overlapped on the support base 111 and separates the acoustic cavity 14 into a front cavity 141 and a rear cavity 142. Figure 3 A partition plate 114 is provided in the acoustic cavity 14. The partition plate 114 is connected to the top of the inner portion of the shell 10 and is kept at a certain distance from the bottom of the shell 10, thereby dividing the acoustic cavity 14 into a first space 143 and a second space 144 that are interconnected. The sound unit 20 is fixed in the first space 143 by a support base 111, and the support base 111 is configured to have a shape and structure that cooperates with the magnetic circuit system 23. In addition, the support base 111 is kept at a certain distance from the bottom of the shell 10 to ensure connectivity within the acoustic cavity 14.

[0038] Reference Figure 3 The support base 111 includes a square ring frame 1111 and four slots 1112. The square ring frame 1111 is arranged to fit the three side walls and the partition plate 114 in the first space 143, and the four slots 1112 are connected and fixed to the inner side of the square ring frame 1111. Figure 4 , the top surface of the square ring frame 1111 is higher than the top surfaces of the four card slots 1112. Figure 2 The diaphragm 21 is overlapped on the top surface of the square ring frame 1111, and the shape of the square ring frame 1111 matches the shape of the diaphragm 21, thereby dividing the space above the diaphragm 21 in the first space 143 into the front cavity 141, and the space below the diaphragm 21 in the first space 143 and the second space 144 into the rear cavity 142. Dividing the acoustic cavity 14 into the front cavity 141 and the rear cavity 142 can isolate the forward and backward sound waves, reduce unnecessary resonance and distortion, and thus improve the sound quality. Figure 3The four clamping grooves 1112 are all U-shaped grooves, and the four clamping grooves 1112 are respectively arranged on the inner side of the square ring frame 1111 close to the center, and the slot opening faces the middle part of the square ring frame 1111, so as to facilitate the clamping and fixing of the magnetic bowl 232 and the magnetic yoke 234 in the magnetic circuit system 23.

[0039] With reference to Figure 1 , the shell 10 is provided with a sound outlet hole 112, and the sound outlet hole 112 is in communication with the front cavity 141 to ensure effective propagation of sound. Figure 2 and Figure 4 , the shell 10 comprises a body 11, a first cover 12 and a second cover 13. Figure 3 , the top end of the body 11 is provided with a hollow part 115 corresponding to the position of the sound generating unit 20. Figure 4 , the first cover 12 is detachably connected with the body 11 through the hollow part 115, so as to facilitate the installation of the sound generating unit 20. Figure 3 , the hollow part 115 is a through structure from top to bottom, and the sound outlet hole 112 is arranged on one side of the body 11 and is in lateral communication with the hollow part 115. Figure 3 , the sound outlet hole 112 is provided with a slope which is connected with the top surface of the square ring frame 1111 to ensure that the sound outlet hole 112 is only in communication with the front cavity 141, thereby ensuring the final audio effect. Figure 1 , the square ring frame 1111 is provided with a stop block 116 above, when the first cover 12 is buckled with the body 11, the first cover 12 is in contact with the stop block 116 to keep a certain distance with the square ring frame 1111, thereby ensuring that the sound outlet hole 112 will not be blocked by the first cover 12.

[0040] With reference to Figure 2 and Figure 4 , the second cover 13 is detachably connected at the bottom of the body 11, and the detachable buckling structure is conducive to the installation of the sound generating unit 20, the sound absorbing assembly 30 and the heat dissipation assembly 50 in the shell 10.

[0041] With reference to Figure 2 and Figure 5 , a magnetic yoke plate 15 is further arranged below the sound generating unit 20. The bottom of the shell 10, i.e. the second cover 13, is provided with a first through hole 131 corresponding to the position of the sound generating unit 20, and the magnetic yoke plate 15 is embedded in the first through hole 131. The embedding of the magnetic yoke plate 15 on the shell 10 can play a certain electromagnetic shielding effect, reducing the influence of external electromagnetic interference on the internal circuit of the loudspeaker. Figure 2 , the magnetic yoke plate 15 is located directly below the magnetic circuit system 23, which is helpful to concentrate and guide the magnetic field and improve the electro-acoustic conversion efficiency.

[0042] Further, with reference to Figure 2 and Figure 5The heat dissipation assembly 50 is arranged between the yoke plate 15 and the magnetic circuit system 23, and is arranged in close contact with the bottom of the magnetic bowl 232 of the magnetic circuit system 23 to improve the heat dissipation efficiency. Meanwhile, the yoke plate 15 has good heat conduction performance, and can serve as a heat conduction path to improve the heat dissipation effect.

[0043] With reference to Figure 2 The sound emitting unit 20 is arranged in the rear cavity 142 and located in the first space 143, and the sound absorbing assembly 30 is arranged in the rear cavity 142 and located in the second space 144. The sound absorbing assembly 30 is arranged in the rear cavity 142 to absorb the excess backward sound waves, ensure the sound to be clearer and more natural, reduce unnecessary resonance and distortion, and further improve the overall efficiency and sound quality.

[0044] With reference to Figures 1 to 4 The shell 10 is concave on the outer side and has a mounting groove 113, and the conductive assembly 40 is embedded in the mounting groove 113, and the conductive assembly 40 is flat with the outer side of the shell 10. The conductive assembly 40 is arranged on the outer side of the shell 10 to effectively block external electromagnetic interference, prevent electromagnetic radiation generated by the shell 10 from leaking out, and also disperse static electricity to avoid damage to electronic components such as the power generating unit caused by static electricity accumulation.

[0045] The sound absorbing assembly 30, the heat dissipation unit and the conductive assembly 40 of the embodiment are all made of nano-silver sound absorbing cotton. The nano-silver sound absorbing cotton is a composite of nano-silver and sound absorbing cotton. When the composite is combined, the sound absorbing cotton is first immersed in a solution containing nano-silver particles, so that the nano-silver particles are evenly attached to the surface of the fibers of the sound absorbing cotton. Finally, after drying treatment, the nano-silver can be firmly combined with the sound absorbing cotton.

[0046] The distribution of the nano-silver particles in the sound absorbing cotton can form more micro-pores and irregular surfaces, thereby increasing the surface area of the sound waves in contact with the material and effectively improving the sound absorbing effect, so that it can be installed as an excellent sound absorbing assembly 30 in a loudspeaker. At the same time, the composite of nano-silver and sound absorbing cotton combines the high thermal conductivity of silver and the compressibility of sound absorbing cotton, thereby having excellent heat dissipation performance. Due to its compressibility, the nano-silver sound absorbing cotton can perfectly fill between two elements without increasing the assembly size, ensuring close contact and efficient heat transfer. When the composite is installed as a heat dissipation assembly 50 in a loudspeaker, it not only improves the heat dissipation effect, but also ensures good assembly flexibility. In addition, silver has the lowest resistivity among conventional metals, so that the nano-silver sound absorbing cotton also has excellent conductive performance, which can fully play the role of the conductive assembly 40. Therefore, when the sound absorbing assembly 30, the conductive assembly 40 and the heat dissipation assembly 50 in the loudspeaker are all made of the composite material of nano-silver and sound absorbing cotton, not only the production cost is reduced, but also the sound absorbing effect, heat dissipation performance and electromagnetic shielding ability of the loudspeaker are significantly improved, thereby ensuring the sound quality performance and reliability of the loudspeaker.

[0047] Optionally, the sound absorption assembly 30, the conductive assembly 40 and the heat dissipation assembly 50 can be connected and fixed by bonding, compression fixing or mechanical fixing.

[0048] The loudspeaker module of the embodiment is provided with a sound absorption assembly in the shell to absorb sound waves and improve sound quality. The loudspeaker module is also provided with a heat dissipation assembly attached to the sound production unit, which can keep the temperature of the sound production unit stable during work, prolong the service life, and the shell outside is also provided with a conductive assembly to shield external electromagnetic and provide electrostatic protection, ensure the stability of the audio signal, and the sound absorption assembly, the conductive assembly and the heat dissipation assembly are all made of nano sound absorption cotton, which effectively simplifies the process, reduces the production cost, and can significantly improve the overall performance of the loudspeaker module.

[0049] The embodiment of the application also provides an electronic device comprising the loudspeaker module in the above embodiment, which can make the electronic device have good audio effect, higher reliability and longer service life.

[0050] The above only describes the preferred embodiments of the application and is not used to limit the application. For those skilled in the art, the application can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. within the spirit and principles of the application shall be included in the protection scope of the application.

Claims

1. A speaker module, characterized in that: The speaker module includes: A housing (10) having a sound cavity (14) formed therein; A sound-generating unit (20) is disposed in the sound cavity (14); A sound absorbing component (30) is disposed in the sound cavity (14) and is located on one side of the sound generating unit (20); A conductive component (40) is arranged outside the housing (10); a heat dissipation assembly (50) disposed in the acoustic cavity (14) and connected to the sound generating unit (20); Wherein, the sound-absorbing component (30), the conductive component (40) and the heat-dissipating component (50) are all nano-silver sound-absorbing cotton composites.

2. The speaker module according to claim 1, wherein: The sound-generating unit (20) comprises a diaphragm (21), a voice coil (22) and a magnetic circuit system (23); the voice coil (22) is arranged in a magnetic gap (231) formed by the magnetic circuit system (23) and is fixed on the lower surface of the diaphragm (21).

3. The speaker module according to claim 2, wherein: A support seat (111) is provided at the top end of the interior of the housing (10), and the support seat (111) surrounds and supports the outside of the magnetic circuit system (23).

4. The speaker module according to claim 3, wherein: The diaphragm (21) is overlapped on the support seat (111), and the diaphragm (21) divides the sound cavity (14) into a front cavity (141) and a rear cavity (142).

5. The speaker module according to claim 4, characterized in that: The sound-generating unit (20) and the sound-absorbing component (30) are arranged in the rear cavity (142).

6. The speaker module according to claim 4, wherein: A sound outlet hole (112) is provided on one side of the housing (10) at a position corresponding to the diaphragm (21), and the sound outlet hole (112) is communicated with the front cavity (141).

7. The speaker module according to claim 2, wherein: A first through hole (131) is provided at a position of the bottom of the housing (10) corresponding to the position of the sound-generating unit (20), and a magnetic yoke plate (15) is embedded in the first through hole (131).

8. The speaker module according to claim 7, wherein: The heat dissipation assembly (50) is arranged between the yoke plate (15) and the magnetic circuit system (23).

9. The speaker module according to claim 1, wherein: A mounting groove (113) is recessed on the outer side of the housing (10), and the conductive component (40) is arranged in the mounting groove (113).

10. An electronic device, characterized in that: The electronic device comprises the speaker module according to any one of claims 1 to 9.

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