Cold and hot compress therapy equipment based on semiconductor refrigeration

Abstract

The embodiment of the utility model relates to the technical field of application therapy equipment, in particular to cold and hot application therapy equipment based on semiconductor refrigeration. The device comprises a shell, and a semiconductor refrigeration component, an application therapy component, a heat exchanger and a water pump which are arranged in the shell, the application therapy component comprises an application therapy bag, the heat exchanger is provided with an internal pipeline, and the internal pipeline of the heat exchanger, the water pump and the application therapy bag are communicated through a connecting pipeline and form a circulating pipeline. According to the equipment, the liquid use amount is reduced, the energy utilization efficiency and the use experience are improved, a user does not need to consider the problems of water adding and water discharging during use, the space occupation of parts in the equipment can be greatly reduced, meanwhile, part connecting nodes on a circulating pipeline are reduced, structural points needing sealing treatment are effectively reduced, and the cost is reduced. And the use stability of the product is improved.

Description

TECHNICAL FIELD

[0001] The embodiment of the present application relates to the technical field of therapy equipment, and particularly relates to a cold and hot therapy equipment based on semiconductor refrigeration. BACKGROUND

[0002] For fever, sprain, heat stroke and other diseases, people often use ice packs, cold wet towels, cold compresses and other cold compresses to reduce discomfort. However, the cold compresses such as ice packs, cold wet towels and cold compresses need to be replaced frequently and have poor persistence.

[0003] To solve the problem of poor persistence and frequent replacement of the existing disposable cold compresses, the Chinese utility model patent with the application number CN202221094455.0 discloses a liquid-cooled cold compress instrument based on semiconductor refrigeration, which comprises a liquid-cooled pad assembly, a first connecting pipe, a second connecting pipe and a semiconductor refrigeration device. The semiconductor refrigeration device is used to cool the liquid to form cooling liquid and pass the cooling liquid into the liquid-cooled pad assembly. The liquid-cooled pad assembly is used to be detachably sleeved on the cold compress position of the user and cold compress the cold compress position through the cooling liquid contained in the liquid-cooled pad assembly. The liquid in the liquid-cooled cold compress instrument can be recycled and continuously cooled, which can effectively solve the technical problems of poor persistence and frequent replacement of the existing disposable cold compresses.

[0004] However, the liquid storage tank is arranged in the equipment to store the circulating water, which not only occupies a large internal space of the equipment, but also is not conducive to the miniaturization design of the equipment, and is inconvenient to carry and place. In addition, the liquid storage tank is provided with a vent and a liquid injection port on the cover, which is not conducive to the sealing of the circulating pipeline. UTILITY MODEL CONTENT

[0005] The embodiment of the present application provides a cold and hot therapy equipment based on semiconductor refrigeration which can omit the related structure of the liquid storage tank, greatly reduce the component space occupation of the equipment and be conducive to the miniaturization structure layout.

[0006] The equipment comprises a shell, a semiconductor refrigeration component, a therapy component, a heat exchanger and a water pump arranged in the shell. The therapy component comprises a therapy bag. The heat exchanger has an internal pipeline. The internal pipeline of the heat exchanger, the water pump and the therapy bag are connected through a connecting pipeline and form a circulating pipeline. One outer side surface of the heat exchanger at least partially contacts one end surface of the semiconductor refrigeration component and cools or heats the liquid in the circulating pipeline under the action of the semiconductor refrigeration component to form a therapy liquid. The therapy component performs therapy through the therapy liquid circulating in the therapy bag.

[0007] The cold compress therapy device based on semiconductor refrigeration of the embodiment of the present application stores the required circulating liquid through the circulating pipeline itself, does not need a special liquid storage tank or other mechanism to circulate the liquid, reduces the liquid usage, reduces the time and energy value required for the temperature rise and fall of the therapy component, improves the energy utilization efficiency and use experience, and the user does not need to consider the water adding and draining problems during use, and can greatly reduce the space occupation of the internal components of the device, and also reduces the component connection nodes on the circulating pipeline, effectively reduces the structure points that need to be sealed, and improves the stability of the product use.

[0008] In a possible implementation, the air pump, the air bag, and the air valve are connected through pipelines, and the air bag is inflated or deflated by the air pump and the air valve.

[0009] In a possible implementation, the air bag is arranged on a side surface of the therapy component away from the therapy site, or the air bag is arranged around the therapy component.

[0010] In a possible implementation, a bandage is arranged on a side of the therapy component away from the therapy site, and the bandage is connected to the therapy component by a magnetic buckle or a magic tape.

[0011] In a possible implementation, a heat sink is arranged on the back of the heat exchanger, and the heat sink includes a heat-conducting sheet and a heat-dissipating sheet, the heat-conducting sheet and the heat-dissipating sheet are connected through a heat exchange pipe, and a heat-dissipating fan is arranged on the heat-dissipating sheet.

[0012] In a possible implementation, the heat-dissipating sheet includes a plurality of heat-dissipating fins, the heat-dissipating fins are parallel to each other to form a heat-dissipating channel, and the heat-dissipating fan is opposite to the heat-dissipating channel.

[0013] In a possible implementation, the connecting pipeline includes a first pipeline, a second pipeline, and a third pipeline, the outlet of the water pump is connected to the heat exchange pipe of the heat exchanger through the first pipeline, the heat exchange pipe of the heat exchanger is connected to the therapy bag through the second pipeline, and the therapy bag is connected to the water pump through the third pipeline.

[0014] In a possible implementation, a handle is movably connected to the shell.

[0015] In a possible implementation, a battery assembly is further included, the battery assembly includes a rear shell, a front cover, and a battery, the front cover is mounted on a side of the shell away from the therapy component, the rear shell is fixedly mounted on the front cover, and the front cover and the rear shell together enclose a cavity for mounting the battery.

[0016] In a possible implementation, the battery assembly is detachably mounted outside the shell. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 is an exploded view of an embodiment of the present application;

[0018] Figure 2 is a partial structure schematic of an embodiment of the present application Figure 1 ;

[0019] Figure 3 is a partial structure schematic of an embodiment of the present application Figure 2 ;

[0020] Figure 4 is a whole structure schematic of an embodiment of the present application.

[0021] Wherein: 1, semiconductor refrigeration component; 2, fumigation component; 3, heat exchanger; 4, water pump; 5, air pump; 6, air bag; 7, air valve; 8, heat dissipation block; 9, heat dissipation fan; 10, shell; 11, handle; 12, battery assembly; 13, three-way pipeline; 14, air pump button; 15, mode button; 16, adjustment knob; 100, upper cover; 101, base; 102, outer grid; 120, rear shell; 121, front cover; 122, battery; 123, circuit board. DETAILED DESCRIPTION

[0022] In order to make the purpose, technical scheme and advantages of the present application clearer, the following will describe the technical scheme of the present application in detail with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are some of the embodiments of the present application, not all the embodiments, and the embodiments in the present application and the features in the embodiments can be combined with each other without conflict. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.

[0023] It should be noted that: in the drawings, the same or similar notations represent the same or similar elements or elements with the same or similar functions throughout; in the description of the present application, the terms "center", "longitudinal", "transverse", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, therefore it cannot be understood as a limitation on the scope of protection of the present application; in the description of the present application, "first", "second" and the like are only used to distinguish each other, and do not indicate their importance and order, etc.

[0024] The working principle of the semiconductor cooling sheet is based on the Peltier effect. When a direct current passes through an electric couple composed of two different semiconductor materials in series, the two ends of the electric couple can respectively absorb heat and emit heat. By controlling the direction of the current, it can be determined which end is heated and which end is cooled. Specifically, when the current flows from the P-type region of one semiconductor to the N-type region of another semiconductor, one end will absorb heat, and the other end will emit heat. This effect enables the semiconductor cooling sheet to achieve the functions of cooling or heating. Therefore, by controlling the direction of the current flowing into the semiconductor cooling sheet, the heat absorbing and heat emitting surfaces of the semiconductor cooling sheet can be changed, and it can be determined whether one end of the semiconductor cooling sheet is a cold end or a hot end.

[0025] In the prior art, some semiconductor cooling sheet-based fomentation devices generally use the cold end of the semiconductor cooling sheet to cool liquid to form cooling liquid. The cooling liquid is used to cool the cold compress part of the user, and the water pump is used to pump the cooling liquid back after absorbing heat to form a reciprocating water circuit, so that the cold compress part can be continuously cooled.

[0026] In many daily life scenarios, such as heatstroke, sprain, fever, etc., cold compress treatment is needed for the fomentation part, and hot compress treatment is needed for the fomentation part, such as dispelling wind and cold, promoting blood circulation, etc. The existing semiconductor cooling-based fomentation device can only cool the cold compress position, and the functionality is relatively single, which cannot meet the diversified needs of people's daily life, and the structure needs to be improved.

[0027] Therefore, the present application provides a semiconductor cooling-based cold and hot fomentation device capable of cold or hot compress treatment of body parts as needed.

[0028] As shown in Figures 1-4 The semiconductor cooling-based cold and hot fomentation device of the first embodiment of the present application includes a shell 10, a semiconductor cooling component 1, a fomentation component 2, a heat exchanger 3, and a water pump 4 arranged in the shell 10. The fomentation component 2 includes a fomentation bag, the heat exchanger 3 has an internal pipeline, the internal pipeline of the heat exchanger 3, the water pump 4, and the fomentation bag are connected by a connecting pipeline and form a circulating pipeline, one outer side of the heat exchanger 3 at least partially contacts one end of the semiconductor cooling component 2 and cools or warms the liquid in the circulating pipeline under the action of the semiconductor cooling component 2 to form fomentation liquid, and the fomentation component 2 is fomented by the fomentation liquid circulating in the fomentation bag.

[0029] The semiconductor refrigeration component 1 comprises at least one semiconductor refrigeration sheet. In order to improve the cooling effect of the cold end of the semiconductor refrigeration component 1 and the heating effect of the hot end, a plurality of semiconductor refrigeration sheets can be connected in series. The application part 2 is used to contact or fix the part of the human body needing application and treatment, and the circulating liquid in the application bag inside the application part 2 can realize cold or hot compress on the application part.

[0030] In terms of the connection of the circulating pipeline, the circulating pipeline is a closed internal circulating pipeline, and the liquid is stored and circulated in the closed internal circulating pipeline. The connecting pipeline comprises three sections of a first pipeline, a second pipeline and a third pipeline. The liquid outlet of the water pump 4 is connected to the internal pipeline of the heat exchanger 3 through the first pipeline, the internal pipeline of the heat exchanger 3 is connected to the application bag through the second pipeline, and the application bag is connected to the water pump 4 through the third pipeline.

[0031] Based on the above connection mode of the circulating pipeline, taking cold compress as an example, when working, the water pump 4 generates power to make the liquid in the circulating pipeline flow from the liquid outlet of the water pump 4 to the internal pipeline of the heat exchanger through the first pipeline. The liquid flows out of the internal pipeline of the heat exchanger after being cooled by the semiconductor refrigeration component, flows to the application bag in the application part 2 through the second pipeline, and performs cold compress on the part of the user's body through the low-temperature liquid. In this process, the heat of the human body interacts with the low-temperature liquid in the application bag, the low-temperature liquid in the application bag is warmed up and flows to the water pump 4 through the third pipeline, and the cycle is repeated to achieve a continuous cold compress working state. The pipeline arrangement and liquid flow direction control can ensure that the heat exchanger has the maximum positive pressure and can effectively generate turbulent flow to improve the heat exchange efficiency.

[0032] According to the principle of the semiconductor refrigeration component, the semiconductor refrigeration component 1 comprises a cold end and a hot end. Assuming that when a positive current flows through the semiconductor refrigeration component 1, one end face of the semiconductor refrigeration component 1 is the cold end, and the other end face of the semiconductor refrigeration component 1 is the hot end. Correspondingly, when a negative current flows through the semiconductor refrigeration component 1, one end face of the semiconductor refrigeration component 1 is the hot end, and the other end face of the semiconductor refrigeration component 1 is the cold end.

[0033] Since the direction of the current of the semiconductor refrigeration component 1 determines whether one end face of the semiconductor refrigeration component 1 cools or heats, one end face of the semiconductor refrigeration component 1 can be used to cool or heat the internal pipeline of the heat exchanger 3 according to actual needs, and then the liquid flowing through the internal pipeline of the heat exchanger 3 is cooled or heated to form an application liquid. The application part can be continuously cooled or heated according to the actual needs of the user, which improves the application effect and expands the application range, and has good practicability.

[0034] In the prior art semiconductor refrigeration-based liquid-cooled cold compress device described above, the semiconductor refrigeration device includes a liquid storage tank, a cold conduction box, a liquid pump, and a semiconductor refrigeration module. The semiconductor refrigeration-based cold and hot compress therapy device described in the present application comprises a semiconductor refrigeration component 1, a compress therapy component 2, a heat exchanger 3, and a water pump 4 to form a circulating pipeline, and does not need to install a liquid storage tank. Therefore, compared with the prior art semiconductor refrigeration-based liquid-cooled cold compress device, the embodiment of the present application simplifies the structure, facilitates miniaturization, improves portability, is more suitable for personal use, reduces the number of component connection nodes in the circulating pipeline, effectively reduces the structure points that need to be sealed, and improves the stability of product use.

[0035] In order to enable the compress therapy component 2 to be more closely attached to the compress therapy site on the human body when acting on the human body, the second embodiment is further proposed on the basis of the first embodiment. The semiconductor refrigeration-based cold and hot compress therapy device in the second embodiment further comprises an air pump 5, an air bag 6, and an air valve 7, and the air pump 5, the air valve 7, and the air bag 6 are connected through pipelines.

[0036] There are various setting forms for the specific structure of the air bag 6. For example, a bandage with an air bag can be separately pulled out through a pipeline, and is used by being bound to the outside of the compress therapy component, so that the compress therapy component on the inside is tightly attached to the human body through the expansion and extrusion of the air bag.

[0037] In order to avoid the situation that the compress therapy bag is bent when being worn, or the inner wall of the compress therapy bag is tightly attached and blocks the liquid flow path when being extruded by the air bag, a support strip, also known as an anti-blocking strip, is arranged in the compress therapy bag in the embodiment, and is used to separate the inner wall of the compress therapy bag for attachment, so as to keep the liquid flow path unblocked.

[0038] In order to simplify the number of components and the structural relationship, the air flow pipeline of the air bag and the liquid flow in and out pipeline of the compress therapy bag are made into a three-in-one pipeline 13 in the embodiment, that is, the two liquid flow in and out pipelines and the single air flow pipeline are made into a parallel pipeline, and the air bag is arranged in the compress therapy component 2 and located on the side surface away from the compress therapy site, or the air bag 6 is arranged in the compress therapy component and located around the compress therapy component. This structure can arrange the air bag and the compress therapy bag in the compress therapy component, and when one compress therapy component is bound to the human body, the compress therapy can be performed in combination with the air bag. The difference lies in that when the air bag 6 is arranged in the compress therapy component and located on the side surface away from the compress therapy site, the air bag is extruded to make the compress therapy bag tightly attached to the human body when being expanded; and when the air bag is arranged in the compress therapy component and located around the compress therapy component, the air bag is extruded to make the human body skin and muscles deform to be close to the compress therapy bag when being expanded. Both ways can achieve the effect of tightly attaching the compress therapy bag to the human body.

[0039] In addition, the air bag 6 is used for inflation and deflation operation by the air pump 5 and the air valve 7 to massage the massage part of the user. The air bag 6 can be inflated and deflated by the air pump 5 and the air valve 7, so that the air bag 6 can be switched between the inflated and deflated states, thereby massaging the massage part of the user. In this way, the functions of the hot and cold compress therapy equipment are enriched, and the application range of the hot and cold compress therapy equipment is further expanded.

[0040] Because the therapy part and the therapy bag, the air bag and other parts in the various embodiments of the present application are made of flexible materials, the shape during work can be changed, and it is not convenient to represent the internal structure by mechanical drawing, therefore, the related structure shape is further described here.

[0041] In the above embodiment, the air bag 6 is detachably mounted on the surface of the therapy part 2 away from the therapy part. The therapy part 2 and the therapy bag and air bag 6 therein are made of flexible materials such as TPU, PVC and the like, so that they can be deformed to fit the human therapy part, and also facilitate product storage and handling.

[0042] Figure 1 、 2 The approximate position of the air bag 6 in the therapy part 2 in the above embodiment is indicated, which is not the specific shape. The air bag 6 is composed of two elliptical air bags arranged side by side, and has a dumbbell shape connected by an intermediate air path.

[0043] The triple pipeline 13 is made of flexible materials such as TPU, PVC and the like. The broken position in the figure does not limit the length in the meaning of mechanical drawing, and is not structurally disconnected. By reasonably configuring the length, the therapy part 2 can be conveniently moved to massage and therapy different therapy parts.

[0044] Because the therapy of each part of the human body is different, the deformation of the therapy part often cannot meet the fixing needs of each part of the human body. In order to improve the adaptability of the product and increase the stability of each part of the human body, a strap is further provided on the side of the therapy part away from the therapy part in the various embodiments of the present application, and the strap is connected with the therapy part by magnetic buckle or magic tape.

[0045] In terms of the specific structure of other components, in the above embodiment, the heat exchanger 3 is fixedly installed on the cold end of the semiconductor refrigeration part 1, and the installation surface of the heat exchanger 3 is attached to the cold end surface of the semiconductor refrigeration part 1, so as to improve the refrigeration effect of the semiconductor refrigeration part 1 on the liquid in the internal pipeline of the heat exchanger 3.

[0046] The semiconductor refrigeration component is located at the back of the heat exchanger and is provided with a radiator, the radiator comprises a heat conduction sheet and a heat dissipation sheet, the heat conduction sheet and the heat dissipation sheet are connected through a heat exchange pipe, and the heat dissipation sheet is provided with a heat dissipation fan. In order to improve the heat conduction performance, a heat conduction gap filling material such as silicone grease is used to fill the gap between the mating surfaces of the heat conduction sheet and the semiconductor refrigeration component, so as to achieve the purpose of sufficient heat conduction.

[0047] In a possible implementation, the heat dissipation sheet comprises a plurality of heat dissipation fins, the plurality of heat dissipation fins are parallel to each other to form a heat dissipation channel, and the heat dissipation fan is opposite to the heat dissipation channel.

[0048] In operation, as shown in Figure 1 and Figure 2 , the semiconductor refrigeration component is located at one side of the heat exchanger for refrigeration, and is located at one side of the radiator for heating at the same time. The heat generated by the heating side of the semiconductor refrigeration component is conducted to the heat conduction sheet, the heat conduction sheet further transmits the heat to the heat dissipation sheet through the heat exchange pipe, and the heat dissipation fan blows the heat on the heat dissipation sheet out of the shell. Thus, the radiator can continuously discharge the heat generated by the heating side of the semiconductor refrigeration component, so as to ensure stable operation of the product.

[0049] Optionally, in order to facilitate the movement and carrying of the product, as shown in Figure 4 , the shell 10 of the cold and hot compress therapy equipment based on the semiconductor refrigeration in the above embodiment further comprises a handle 11, the handle 11 is rotatably installed on the shell 10, the handle 11 enables a user to carry and move, and when the handle is put down, the handle is attached to the outer surface of the shell 10, so as to reduce the occupied space during storage and maintain the integration of the external structure.

[0050] Specifically, the shell 10 comprises an upper cover 100, a base 101 and an outer grid 102, the upper cover 100 and the base 101 enclose a cavity for installing the semiconductor refrigeration component 1, the heat exchanger 3 and the water pump 4. Both sides of the upper cover 100 are provided with openings, the outer grid 102 is installed in the openings, the heat dissipation fan 9 is fixedly installed on the base 101, and the heat dissipation fan 9 and the heat dissipation block 8 are located between the outer grids 102 installed on both sides of the upper cover 100.

[0051] The specific positions of the water pump 4, the semiconductor refrigeration component 1 and the heat exchanger 3 in the shell 10 can be adjusted according to actual conditions, and thus will not be described here.

[0052] Optionally, as shown in Figure 1 , Figure 2As shown, the hot and cold compress therapy device based on semiconductor refrigeration also includes a battery assembly 12, which includes a rear shell 120, a front cover 121 and a battery 122. The front cover 121 is installed on the side of the outer shell 10 away from the compress component 2, and the rear shell 120 is fixedly installed on the front cover 121. The front cover 121 and the rear shell 120 together enclose a chamber for installing the battery 122, and the battery 122 is electrically connected to the semiconductor refrigeration component 1 and the water pump 4.

[0053] In various embodiments of the present application, the battery assembly 12 is detachably mounted on the outside of the housing 10, which facilitates separate charging and replacement of the battery and improves the portability of the therapeutic application device.

[0054] like Figure 3 、 Figure 4 As shown, an air pump button 14, a mode button 15, and an adjustment knob 16 may be further provided on the top or side of the upper cover 100. The air pump button 14, the mode button 15, and the adjustment knob 16 are all electrically connected to the circuit board. The air pump button 14 is used to control the start and stop and working mode of the air pump 5 and the air valve. The mode button 15 is used to control the start and stop of the water pump 4. The mode button 15 is used to change the cold, hot, and cold and hot alternating modes. The adjustment knob 16 is used to adjust the strength of the set temperature closed-loop set value.

[0055] In order to facilitate the indication of strength, a circle of light ring is designed on the circuit board below the adjustment knob 16. The degree of brightness of the light ring indicates the high or low of the set value. By rotating the knob, the brightness of the light ring is changed, and the user can know the strength of the adjustment mode, thereby completing the control of the current and voltage values ​​of the water pump, refrigeration plate and fan.

[0056] The above description is only a preferred embodiment of the embodiment of the present application, and does not limit the patent scope of the embodiment of the present application. Any equivalent structure or equivalent process transformation made using the description and drawings of the embodiment of the present application, or directly or indirectly applied in other related technical fields, is also included in the patent protection scope of the embodiment of the present application.

Claims

1. A cold compress therapy device based on semiconductor refrigeration, characterized by, The application relates to a semiconductor refrigeration device, which comprises a shell, a semiconductor refrigeration component arranged in the shell, a treatment component, a heat exchanger and a water pump, wherein the treatment component comprises a treatment bag, the heat exchanger has an internal pipeline, the internal pipeline of the heat exchanger, the water pump and the treatment bag are communicated through connecting pipelines to form a circulating pipeline, one outer side surface of the heat exchanger is at least partially in contact with one end surface of the semiconductor refrigeration component, and the semiconductor refrigeration component is used for cooling or heating liquid in the circulating pipeline to form treatment liquid under the action of the semiconductor refrigeration component, and the treatment component is used for treating the treatment liquid in the treatment bag through circulation.

2. The semiconductor refrigeration-based cold compress therapy device according to claim 1, wherein The application further comprises an air pump, an air bag and an air valve, the internal cavities of the air pump, the air valve and the air bag are communicated through pipelines, and the air bag is inflated or shrunk by controlling the air pump and the air valve.

3. The semiconductor refrigeration-based cold compress therapy device according to claim 2, wherein The air bag is arranged in the treatment component and located on a side surface away from a treatment position, or the air bag is arranged in the treatment component and located around the treatment bag.

4. The semiconductor refrigeration-based cold compress therapy device according to any one of claims 1 to 3, wherein A bandage is arranged on a side of the treatment component away from the treatment position, and the bandage is connected with the treatment component through magnetic buckles or magic tapes.

5. The semiconductor refrigeration-based cold compress therapy device according to any one of claims 1 to 3, wherein A radiator is arranged on a back surface of the semiconductor refrigeration component, the radiator comprises heat-conducting sheets and radiating sheets, the heat-conducting sheets and the radiating sheets are connected through heat exchange pipes, and a radiating fan is arranged on the radiating sheets.

6. The semiconductor refrigeration-based cold compress therapy device according to claim 5, wherein The radiating sheets comprise a plurality of radiating fins, the radiating fins are parallel to each other to form radiating channels, and the radiating fan faces the radiating channels.

7. The semiconductor refrigeration-based cold compress therapy device according to any one of claims 1 to 3, wherein The connecting pipelines comprise first pipelines, second pipelines and third pipelines, the liquid outlet of the water pump and the heat exchange pipes of the heat exchanger are communicated through the first pipelines, the heat exchange pipes of the heat exchanger and the treatment bag are communicated through the second pipelines, and the treatment bag and the water pump are communicated through the third pipelines.

8. The semiconductor refrigeration-based cold compress therapy device according to any one of claims 1 to 3, wherein A handle is movably connected to the shell.

9. The semiconductor refrigeration-based cold compress therapy apparatus according to any one of claims 1 to 3, wherein The application further comprises a battery assembly, the battery assembly comprises a rear shell, a front cover and a battery, the front cover is arranged on a side of the shell away from the treatment component, the rear shell is fixedly arranged on the front cover, and the front cover and the rear shell jointly enclose a cavity for arranging the battery.

10. The semiconductor refrigeration-based cold compress therapy device according to claim 9, wherein The battery assembly is detachably arranged outside the shell.

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