Small cooling device for PCB crest welder

Abstract

The utility model relates to the technical field of electronic manufacturing equipment, and discloses a small cooling device for a PCB crest welder, the small cooling device comprises a mounting frame, a motor is arranged at the top of the mounting frame through a fixing block, and two connecting frames are arranged at the two ends of the top of the mounting frame; and transmission shafts are rotationally arranged on the inner walls of the corresponding ends between every two connecting frames, the outer walls of the two transmission shafts are sleeved with a conveying belt, and the outer wall of a driving wheel arranged on the outer surface of an output shaft of the motor is sleeved with a belt. According to the small cooling device for the PCB crest welder, the cooling path of a PCB in the cooling box can be prolonged through the arrangement of the multiple partition plates in the cooling box, the PCB can be cooled more efficiently through low temperature emitted by a condensation pipe in the cooling box, the PCB can be rapidly cooled, the PCB can be cooled to the proper temperature in a short time, the cooling efficiency is improved, and the service life of the PCB is prolonged. And the production efficiency is improved.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of electronic manufacturing equipment, in particular to a small cooling device for a PCB wave soldering machine. BACKGROUND

[0002] In the electronic manufacturing industry, a wave soldering machine is a commonly used welding equipment and is widely applied to the welding of various circuit boards. However, the PCB after welding usually has a high temperature, and in order to ensure safety and improve production efficiency, effective cooling treatment must be carried out.

[0003] The existing cooling methods generally have the problems of slow cooling speed and unsatisfactory effect, especially on high-yield production lines, long-time natural cooling will cause the production rhythm to slow down, affecting the overall production efficiency. In addition, some efficient cooling methods such as cooling water tank and cold air injection can effectively reduce the temperature, but the equipment is complex, occupies a large area, has high energy consumption, and the maintenance cost is relatively high, which is not conducive to large-scale promotion and application. CONTENT OF THE UTILITY MODEL

[0004] In view of the defects of the prior art, the application provides a small cooling device for a PCB wave soldering machine, which can quickly cool the PCB, so that it can be cooled to an appropriate temperature in a short time, and the production efficiency is improved. The device has a compact structure and occupies a small space, and can be integrated into the existing wave soldering machine production line without affecting the layout of the original equipment. The application solves the problems of the existing cooling methods, such as slow cooling speed and unsatisfactory effect, especially on high-yield production lines, long-time natural cooling will cause the production rhythm to slow down, affecting the overall production efficiency. In addition, some efficient cooling methods such as cooling water tank and cold air injection can effectively reduce the temperature, but the equipment is complex, occupies a large area, has high energy consumption, and the maintenance cost is relatively high, which is not conducive to large-scale promotion and application.

[0005] In order to achieve the above-mentioned purpose of quickly cooling the PCB board so that it can be reduced to an appropriate temperature in a short time, thereby improving production efficiency, the device has a compact structure, occupies a small space, is easy to integrate into the existing wave soldering machine production line, and will not affect the layout of the original equipment, the application provides the following technical solutions: a small cooling device for a PCB wave soldering machine, comprising a mounting frame, a motor is provided on the top of the mounting frame through a fixed block, two connecting frames are provided at both ends of the top of the mounting frame, and the inner walls of the corresponding ends of the four connecting frames are rotatably provided with a transmission shaft, the outer walls of the two transmission shafts are provided with a conveyor belt, the outer wall of the driving wheel provided on the outer surface of the motor output shaft is provided with a belt, and the belt is away from the driving wheel. One end of the wheel is sleeved on the outer wall of the driven wheel provided on the outer surface of one end of the corresponding transmission shaft. The conveyor belt is inclined. A cooling box is provided on the top of the mounting frame through a fixed block. The middle of the conveyor belt is located inside the cooling box. A plurality of partitions are arranged in an array on both sides of the inner wall of the cooling box. The bottom of the partition is slidably connected to the outer surface of the top of the conveyor belt. The partitions on both sides of the inner wall of the cooling box are staggered. A refrigeration mechanism is provided on the top of the cooling box. Condensing pipes are connected to both ends of the refrigeration mechanism. The middle of the condensing pipe is located inside the cooling box. The part of the condensing pipe located inside the cooling box is serpentine. A plurality of temperature sensors are provided on both sides of the inner wall of the cooling box. A control mechanism is provided on one side of the top of the mounting frame.

[0006] Through the above solution, the setting of multiple partitions in the cooling box can extend the cooling path of the PCB board in the cooling box, so that the low temperature emitted by the condenser tube in the cooling box can cool the PCB board more efficiently, thereby achieving the effect of quickly cooling the PCB board, so that it can be reduced to an appropriate temperature in a short time, thereby improving production efficiency.

[0007] Furthermore, a heat exchange plate is provided on the top of the inner wall of the cooling box through a fixing block, and the heat exchange plate is coated on the outer surface of the middle part of the condenser tube.

[0008] Through the above solution, the low temperature emitted by the condenser can be transferred through the heat exchange plate, which facilitates the transfer of the low temperature to various components in the cooling box for heat exchange.

[0009] Furthermore, a heat exchange frame is provided on the partition, and the top of the heat exchange frame is provided on the bottom of the heat exchange plate through a heat exchange block.

[0010] With the above solution, the low temperature of the heat exchange plate can be transferred to the partition through the heat exchange rack, and the partition is heat-exchanged, so that when the PCB board contacts the partition in the cooling box, the PCB board is further heat-exchanged and cooled through the partition.

[0011] Furthermore, a plurality of cooling fans are provided at the bottom of the heat exchange plate through a fixing block.

[0012] Through the above scheme, the low temperature emitted by the heat exchange plate can be blown to the PCB board below through the setting of the cooling fan to cool the PCB board.

[0013] Further, the partition plates are inclined, and the inclined directions of the partition plates on the two sides of the inner wall of the cooling box are opposite.

[0014] Through the above scheme, the PCB board can smoothly continue to move along the conveying belt by contacting the partition plate, and the PCB board is prevented from being blocked by the partition plate.

[0015] Further, the mounting frame is provided with a hydraulic rod at the bottom, and the bottom of the hydraulic rod is arranged on the top of the support frame.

[0016] Through the above scheme, the mounting frame can be pushed by the setting of the hydraulic rod, the height of the mounting frame is adjusted, the height of the mounting frame can adapt to the wave soldering machine production line of different heights, and the adaptability of the device is improved.

[0017] Further, the support frame is provided with four telescopic rods at the top of four corners, and the top of the four telescopic rods is arranged at the bottom of the four corners of the mounting frame.

[0018] Through the above scheme, the angle of the mounting frame can be fixed by the setting of the four telescopic rods, the movement track of the mounting frame can be fixed, and the stability of the mounting frame moving driven by the hydraulic rod is improved.

[0019] Further, the bottom of the supporting leg of the support frame is provided with an anti-skid pad.

[0020] Through the above scheme, the stability of the device during work can be increased by the setting of the anti-skid pad, the device is prevented from being displaced by some external factors, the device is prevented from deviating from the wave soldering machine production line, and the output PCB board cannot be conveyed to the device for cooling.

[0021] Compared with the prior art, the technical scheme of the present application has the following beneficial effects:

[0022] The small cooling device for the PCB board wave soldering machine can prolong the cooling path of the PCB board in the cooling box by the setting of the multiple partition plates in the cooling box, the low temperature emitted by the condenser pipe in the cooling box can more efficiently cool the PCB board, the PCB board can be quickly cooled to an appropriate temperature in a short time, and the production efficiency is improved. BRIEF DESCRIPTION OF DRAWINGS

[0023] Figure 1 It is a three-dimensional structure schematic diagram of the present application;

[0024] Figure 2 It is a left side structure schematic diagram of the present application;

[0025] Figure 3 It is a schematic diagram of the front view structure of the application;

[0026] Figure 4 It is a schematic diagram of the connection structure of the condenser pipe and the heat exchange plate of the application;

[0027] Figure 5 It is a schematic diagram of the top view structure of the application.

[0028] In the figure:

[0029] 1, mounting frame; 2, motor; 3, belt; 4, conveyor belt; 5, cooling box; 6, partition; 7, refrigeration mechanism; 8, condenser pipe; 9, heat exchange plate; 10, cooling fan; 11, heat exchange frame; 12, temperature sensor; 13, control mechanism; 14, hydraulic rod; 15, support frame; 16, telescopic rod; 17, non-slip pad; 18, connecting frame; 19, transmission shaft. DETAILED DESCRIPTION

[0030] The technical solutions in the embodiments of the application will be clearly and completely described below with reference to the drawings in the embodiments of the application. Obviously, the described embodiments are only part of the embodiments of the application, not all the embodiments. Based on the embodiments in the application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the application.

[0031] Please refer to Figure 3 , Figure 4 and Figure 5 A small cooling device for a PCB wave soldering machine is provided in the embodiment, which comprises a mounting frame 1, a motor 2 is arranged on the top of the mounting frame 1 through a fixing block, two connecting frames 18 are arranged at both ends of the top of the mounting frame 1, a transmission shaft 19 is rotationally arranged in the inner wall of one end of the connecting frame 18 corresponding to each other, a conveyor belt 4 is sleeved on the outer wall of the transmission shaft 19, a driving pulley is arranged on the outer surface of the output shaft of the motor 2, a belt 3 is sleeved on the outer wall of the driving pulley, one end of the belt 3 away from the driving pulley is sleeved on the outer wall of a driven pulley arranged on the outer surface of one end of the transmission shaft 19 corresponding to each other, the conveyor belt 4 is arranged obliquely, a cooling box 5 is arranged on the top of the mounting frame 1 through a fixing block, the middle part of the conveyor belt 4 is located inside the cooling box 5, a plurality of partition plates 6 are arranged in an array on the both sides of the inner wall of the cooling box 5, the partition plates 6 are slidably connected to the outer surface of the top of the conveyor belt 4, the partition plates 6 on the both sides of the inner wall of the cooling box 5 are arranged staggeredly, a refrigeration mechanism 7 is arranged on the top of the cooling box 5, a condenser pipe 8 is connected to both ends of the refrigeration mechanism 7, the middle part of the condenser pipe 8 is located inside the cooling box 5, the part of the condenser pipe 8 located inside the cooling box 5 is arranged in a serpentine shape, a plurality of temperature sensors 12 are arranged on the both sides of the inner wall of the cooling box 5, and a control mechanism 13 is arranged on one side of the top of the mounting frame 1.

[0032] Please see Figure 3 and Figure 4 , the top of the inner wall of the cooling box 5 is provided with a heat exchange plate 9 through a fixing block, the heat exchange plate 9 is wrapped on the outer surface of the middle part of the condensing pipe 8, and the low temperature emitted by the condensing pipe 8 can be transmitted through the heat exchange plate 9, so that the low temperature is conveniently transmitted to each component in the cooling box 5 for heat exchange.

[0033] Please see Figure 3 , Figure 4 and Figure 5 , the heat exchange frame 11 is arranged on the partition plate 6, the top of the heat exchange frame 11 is arranged on the bottom of the heat exchange plate 9 through a heat exchange block, the low temperature of the heat exchange plate 9 can be transmitted to the partition plate 6 through the heat exchange frame 11, the partition plate 6 is heat-exchanged, and the PCB board is further heat-exchanged and cooled when the PCB board contacts the partition plate 6 in the cooling box 5.

[0034] Please see Figure 2 , Figure 3 and Figure 5 , the bottom of the heat exchange plate 9 is provided with a plurality of cooling fans 10 through a fixing block, the low temperature emitted by the heat exchange plate 9 can be blown to the PCB board below through the setting of the cooling fan 10, so that the PCB board is cooled.

[0035] Please see Figure 5 , the partition plate 6 is arranged obliquely, the oblique directions of the partition plates 6 on the two sides of the inner wall of the cooling box 5 are opposite, and the oblique arrangement of the partition plate 6 cooperates with the oblique arrangement of the conveying belt 4, so that the PCB board can smoothly continue to move along with the conveying belt 4 when contacting the partition plate 6, avoiding that the PCB board is blocked by the partition plate 6.

[0036] Please see Figure 1 , Figure 2 and Figure 3 , the bottom of the mounting frame 1 is provided with a hydraulic rod 14, the bottom of the hydraulic rod 14 is arranged on the top of the supporting frame 15, the mounting frame 1 can be pushed through the setting of the hydraulic rod 14, the height of the mounting frame 1 is adjusted, the height of the mounting frame 1 can adapt to the wave soldering machine production line of different heights, and the adaptability of the device is improved.

[0037] Please see Figure 1 , Figure 2 and Figure 3 , the top of the supporting frame 15 is provided with four telescopic rods 16 at four corners, the top of the four telescopic rods 16 is arranged on the four corners of the bottom of the mounting frame 1, the angle of the mounting frame 1 can be fixed through the setting of the four telescopic rods 16, the movement track of the mounting frame 1 can be fixed, and the stability of the movement of the mounting frame 1 driven by the hydraulic rod 14 is improved.

[0038] Please see Figure 1 , Figure 2 andFigure 3 The bottom of the bottom supporting feet of the supporting frame 15 is provided with an anti-skid pad 17, which can increase the stability of the device during operation, avoid displacement of the device due to some external factors, and cause the device to deviate from the wave soldering machine production line, so that the output PCB board cannot be conveyed to the device for cooling.

[0039] The small cooling device for the wave soldering machine of the PCB board in the embodiment can prolong the cooling path of the PCB board in the cooling box 5, so that the low temperature emitted by the condenser pipe 8 can more efficiently cool the PCB board, quickly cool the PCB board to a suitable temperature in a short time, and improve the production efficiency.

[0040] It should be noted that the refrigeration mechanism 7 includes a compressor, a condenser, an expansion valve, and an evaporator, which can generate refrigerant for the condenser pipe 8, and the control mechanism 13 includes a PLC controller and a display screen, which adjusts the working state of the refrigeration unit according to the feedback of the temperature sensor 12 to ensure that the PCB board reaches the required temperature.

[0041] The working principle of the above embodiment is as follows: the device is moved to the discharge of the wave soldering machine production line, the hydraulic rod 14 works, the mounting frame 1 is pushed to move, the height of the mounting frame 1 is adjusted, the height of the conveying belt 4 is adapted to the wave soldering machine production line, the PCB board output by the wave soldering machine production line is conveyed to the left side of the top of the conveying belt 4, the motor 2 works, the two transmission shafts 19 rotate through the corresponding transmission shafts 19 of the belt 3, the two transmission shafts 19 cooperate to drive the conveying belt 4 to work, so that the conveying belt 4 conveys the PCB board on the top to the inside of the cooling box 5, the refrigeration mechanism 7 works, generates refrigerant for the condenser pipe 8, and makes the condenser pipe 8 emit low temperature to reduce the temperature in the cooling box 5. When the conveying belt 4 drives the PCB board to move, it will contact the partition plate 6, the path of the PCB board moving in the cooling box 5 is changed through the inclined partition plate 6, and the path of the PCB board moving is prolonged through the cooperation of the plurality of partition plates 6. The low temperature of the condenser pipe 8 is transferred to the heat exchange plate 9, the low temperature of the heat exchange plate 9 is transferred to the partition plate 6 through the heat exchange frame 11, the temperature of the partition plate 6 is reduced, the PCB board contacts the partition plate 6, and the PCB board is cooled through the partition plate 6. At the same time, the cooling fan 10 works, blows the low temperature emitted by the heat exchange plate 9 and the condenser pipe 8 to the PCB board below, and cools the PCB board. The temperature sensor 12 monitors the temperature at each position in the cooling box 5 in real time, and transmits the data to the control mechanism 13. The control mechanism 13 adjusts the refrigeration mechanism 7, and then adjusts the temperature in the cooling box 5.

[0042] It is to be understood that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting; it is not intended to exclude myriad other embodiments of the present application that other inventors can develop based on the same general inventive concepts embodied by the enclosed claims. That is, although the present application is described in terms of particular embodiments and illustrative figures, it should be apparent that the application can be varied in a multitude of ways. Such alterations, many of which will be apparent to those skilled in the art, can be based on current technology, and as such, this application should not be limited to the particular embodiments described herein, but should be understood to include all embodiments that are within the scope of the appended claims and their equivalents.

[0043] While the embodiments of the application have been shown and described herein, it will be understood by those skilled in the art that many changes, modifications, substitutions and alterations to these embodiments can be made without departing from the principles and spirits of the application, which can be limited only by the scope of the appended claims and their equivalents.

Claims

1. A small cooling device for PCB wave soldering machine, comprising a mounting frame (1), characterized in that: The mounting frame (1) top is provided with a motor (2) through a fixed block, both ends of the mounting frame (1) top are provided with two connecting frames (18), the inner wall of the corresponding end between every two of the four connecting frames (18) is rotatably provided with a transmission shaft (19), the outer wall of the two transmission shafts (19) is sleeved with a conveyor belt (4), the outer wall of the driving wheel provided on the outer surface of the output shaft of the motor (2) is sleeved with a belt (3), one end of the belt (3) away from the driving wheel is sleeved on the outer wall of the driven wheel provided on the outer surface of one end of the corresponding transmission shaft (19), the conveyor belt (4) is inclined, the mounting frame (1) top is provided with a cooling box (5) through a fixed block, the middle part of the conveyor belt (4) is located in the inside of the cooling box (5), a plurality of baffle plates (6) are arranged on the both sides of the inner wall of the cooling box (5), the bottom of the baffle plate (6) is slidably connected with the top outer surface of the conveyor belt (4), the baffle plates (6) on the both sides of the inner wall of the cooling box (5) are staggered, the top of the cooling box (5) is provided with a refrigeration mechanism (7), the both ends of the refrigeration mechanism (7) are connected with a condenser pipe (8), the middle part of the condenser pipe (8) is located in the inside of the cooling box (5), the part of the condenser pipe (8) located in the inside of the cooling box (5) is serpentine, a plurality of temperature sensors (12) are arranged on the both sides of the inner wall of the cooling box (5), one side of the top of the mounting frame (1) is provided with a control mechanism (13).

2. The compact cooling device for a PCB wave soldering machine according to claim 1, characterized in that: The top of the inner wall of the cooling box (5) is provided with a heat exchange plate (9) through a fixed block, the heat exchange plate (9) is covered on the outer surface of the middle part of the condenser pipe (8).

3. The compact cooling device for a PCB wave soldering machine according to claim 1, characterized in that: The baffle plate (6) is provided with a heat exchange frame (11), the top of the heat exchange frame (11) is arranged on the bottom of the heat exchange plate (9) through a heat exchange block.

4. The compact cooling device for a PCB wave soldering machine according to claim 2, characterized in that: The bottom of the heat exchange plate (9) is provided with a plurality of cooling fans (10) through a fixed block.

5. The compact cooling device for a PCB wave soldering machine according to claim 1, characterized in that: The baffle plate (6) is inclined, the inclination directions of the baffle plates (6) on the both sides of the inner wall of the cooling box (5) are opposite.

6. The compact cooling device for a PCB wave soldering machine according to claim 1, characterized in that: The bottom of the mounting frame (1) is provided with a hydraulic rod (14), the bottom of the hydraulic rod (14) is arranged on the top of a supporting frame (15).

7. The compact cooling device for a PCB wave soldering machine according to claim 6, characterized in that: The top of the supporting frame (15) is provided with four telescopic rods (16) at four corners, the top of the four telescopic rods (16) is arranged on the four corners of the bottom of the mounting frame (1).

8. The compact cooling device for a PCB wave soldering machine according to claim 6, characterized in that: The bottom of the supporting leg of the supporting frame (15) is provided with an antiskid pad (17).

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