Mini LED backlight module, display device and mobile terminal
By creating through slots on the PCB board and thermally conductive silicone pads, and setting heat dissipation fins at the bottom of the aluminum lower frame, the problems of material waste and poor heat dissipation in Mini LED backlight modules are solved, achieving cost reduction and improved heat dissipation efficiency.
Patent Information
- Application Number
- CN202422798978.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-18
- Publication Date
- 2025-10-21
- Estimated Expiration
- 2034-11-18
AI Technical Summary
In existing Mini LED backlight modules, excessive use of PCB boards and thermal conductive silicone pads increases equipment costs, while the flat structure of the aluminum lower frame results in poor heat dissipation.
A first through-slot is opened on the PCB board, and a corresponding second through-slot is opened on the thermal conductive silicone sheet, eliminating the portion of the thermal conductive silicone sheet where the lamp beads are not installed. Heat dissipation fins are set at the bottom of the aluminum lower frame to increase the air contact area, and the heat dissipation fins are used to improve the heat transfer efficiency.
It reduces equipment costs, improves heat dissipation effects, and achieves more efficient heat dissipation.
Smart Images

Figure CN223461767U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to LED backlight module technical field, concretely is a kind of Mini LED backlight module, display device and mobile terminal. BACKGROUND
[0002] Mini LED backlight module is a new type of backlight technology, mainly used in liquid crystal display, by the traditional unified brightness backlight is changed into the dot matrix backlight of the brightness of the partition adjustment, to significantly improve display effect. And in Mini LED backlight module, the heat dissipation of lamp bead is particularly important.
[0003] Through the retrieval, China patent discloses a kind of Mini LED backlight module (grant announcement number CN221375608U), including multiple Mini LED lamp beads, PCB board and lower frame, Mini LED lamp bead array is welded on PCB board, the array windowing same with Mini LED lamp bead arrangement mode is opened in the PCB board, and each windowing covers 1 / 2-3 / 5 of Mini LED lamp bead area;The PCB board and lower frame are equipped with heat-conducting silica gel sheet;The lower frame is aluminum material lower frame.
[0004] And the following defects exist in this patent:
[0005] 1, since its Mini LED lamp bead equidistant installation is on PCB board, so the actual area of PCB board will be much larger than the total area of Mini LED lamp bead, simultaneously lead to the heat-conducting silica gel sheet installed below PCB board also need to be set with the same size of PCB board, can better realize the heat conduction of PCB, but this size setting not only increases the material of PCB board, also increases the material of heat-conducting silica gel sheet, causes equipment cost increase, not conducive to actual application;
[0006] 2, since the bottom of aluminum material lower frame is set as flat plane structure, its contact area with air is the bottom area of aluminum material lower frame, lead to when carrying out heat transfer, the heat dissipation effect is not good, cannot fully and quickly dissipate heat.
[0007] Therefore, the person skilled in the art provides a kind of Mini LED backlight module, display device and mobile terminal, to solve the problems raised in the above background art. UTILITY MODEL CONTENT
[0008] In view of the deficiencies of the prior art, the utility model provides a kind of Mini LED backlight module, display device and mobile terminal, solve the problems of equipment cost increase and poor heat dissipation effect mentioned in the above background art.
[0009] To achieve the above object, the utility model discloses a Mini LED backlight module, including PCB board, heat conducting silica gel piece and aluminium material lower frame, the heat conducting silica gel piece is installed between PCB board and aluminium material lower frame, the side of PCB board away from heat conducting silica gel piece is equidistantly welded with Mini LED lamp pearl, the first through slot of seven staggered arrangements is equidistantly seted up on PCB board, the second through slot of seven is equidistantly seted up on heat conducting silica gel piece, the bottom of aluminium material lower frame is equidistantly installed with the fin of heat dissipation.
[0010] Through the above technical scheme, the first through slot is seted up on the PCB board, and the corresponding second through slot is seted up on the heat conducting silica gel piece, so that the part without installing the lamp pearl is removed, and the corresponding heat conducting silica gel piece is also saved, thereby reducing the investment material of the equipment, and the purpose of reducing the cost of the equipment is achieved, and the fin of heat dissipation is arranged on the bottom of the aluminium material lower frame, the contact area of the aluminium material lower frame and air is increased by using the fin of heat dissipation, so that the efficiency of heat transfer between the equipment and air is improved, the purpose of increasing the heat dissipation effect is achieved, and the practical application is facilitated.
[0011] Preferably, the positions of the first through slot and the second through slot correspond.
[0012] Through the above technical scheme, the second through slot is seted up below the first through slot, so that the positions of the first through slot and the second through slot correspond, a hollow structure is formed, material is saved on the one hand, lightweight is ensured, and on the other hand, the aluminium material lower frame located at the bottom can better contact with air.
[0013] Preferably, the inside of the five first through slots located in the middle is equipped with a connecting block.
[0014] Through the above technical scheme, the connecting block can compensate for the problem of unstable structure and easy deformation of the PCB board caused by setting the first through slot.
[0015] Preferably, the bottom of the aluminium material lower frame is equipped with five screw columns, and the bottom of the screw column is equipped with a threaded hole.
[0016] Through the above technical scheme, the screw column can not only detach the aluminium material lower frame from the terminal whole machine shell, but also increase the heat dissipation channel of the aluminium material lower frame, so that air can enter the bottom of the aluminium material lower frame, and the threaded hole is convenient for connecting with the screw.
[0017] Preferably, the outside of the fin of heat dissipation is equidistantly equipped with a ventilation hole.
[0018] Through the above technical scheme, the ventilation hole on the fin of heat dissipation makes air pass through the bottom of the aluminium material lower frame better, so as to further increase the heat dissipation effect of the equipment.
[0019] The utility model discloses a display device, it includes the Mini LED backlight module as described above, thereby reduced the equipment's investment material, reach the purpose of reducing equipment cost, and improved the equipment and air heat transfer's efficiency, be favorable to practical application.
[0020] The utility model discloses a mobile terminal, it includes the Mini LED backlight module as described above, thereby reduced the equipment's investment material, reach the purpose of reducing equipment cost, and improved the equipment and air heat transfer's efficiency, be favorable to practical application.
[0021] The utility model provides a Mini LED backlight module, display device and mobile terminal have beneficial effect as follows:
[0022] 1, the utility model discloses a first through slot is set up on the PCB board, and the second through slot is set up with it corresponding on the heat conduction silica gel piece, makes the part of not installing lamp pearl be removed, and corresponding heat conduction silica gel piece is also saved, thereby reduced the equipment's investment material, reach the purpose of reducing equipment cost, be favorable to practical application;
[0023] 2, the utility model discloses setting up the heat dissipation fin in the bottom of aluminum material lower frame, utilizes heat dissipation fin to increase the contact area of aluminum material lower frame and air, thereby improves the equipment and air heat transfer's efficiency, reaches the purpose of increasing heat dissipation effect. DRAWINGS
[0024] Figure 1 It is the first visual angle split structure schematic diagram of the utility model;
[0025] Figure 2 It is the second visual angle split structure schematic diagram of the utility model;
[0026] Figure 3 It is the whole structure schematic diagram of the utility model;
[0027] Figure 4 It is the PCB board and Mini LED lamp pearl structure schematic diagram of the utility model.
[0028] In the drawing: 1, PCB board;2, heat conduction silica gel piece;3, aluminum material lower frame;4, Mini LED lamp pearl;5, first through slot;6, second through slot;7, heat dissipation fin;8, connecting block;9, screw column. DETAILED DESCRIPTION
[0029] The utility model will be further elaborated in the following with the aid of drawing and embodiment.
[0030] Refer toFigure 1 、 Figure 2 、 Figure 3 and Figure 4 The utility model discloses a kind of Mini LED backlight module, display device and mobile terminal, including PCB board 1, heat-conducting silica gel piece 2 and aluminum material lower frame 3, heat-conducting silica gel piece 2 is installed between PCB board 1 and aluminum material lower frame 3, heat on PCB board 1 is introduced to aluminum material lower frame 3 using heat-conducting silica gel piece 2 and is cooled.
[0031] Mini LED lamp pearl 4 is equidistantly welded on the side of PCB board 1 away from heat-conducting silica gel piece 2 by SMT, and Mini LED lamp pearl 4 is equidistantly arranged on PCB board 1, to better form Mini LED backlight module. Figure 4 As shown in the figure, seven first through slots 5 are equidistantly arranged on PCB board 1, and five first through slots 5 are arranged in the middle of PCB board 1, and a connecting block 8 is arranged in each of the five first through slots 5, so that the problem of unstable structure and easy deformation of PCB board 1 caused by the first through slots 5 can be solved by the connecting block 8.
[0032] Referring to Figure 2 In one aspect of the embodiment, five screw columns 9 are arranged on the bottom of the aluminum material lower frame 3, so that the aluminum material lower frame 3 can be connected to the terminal whole machine shell by the screw columns 9, and the heat dissipation channel of the aluminum material lower frame 3 is increased, so that air can enter the bottom of the aluminum material lower frame 3.
[0033] The utility model also provides a display device, the display device includes the Mini LED backlight module provided by the utility model as described above, it is known that the display device provided by the embodiment adopts the Mini LED backlight module provided above, so as to reduce the investment material of equipment, achieve the purpose of reducing equipment cost, and improve the efficiency of heat transfer between equipment and air, which is beneficial to practical application.
[0034] The utility model further provides a kind of mobile terminal, the mobile terminal includes as provided in the utility model above MiniLED backlight module, it is known that, the mobile terminal provided in the embodiment adopts the MiniLED backlight module provided above, to reduce the investment material of equipment, reach the purpose of reducing equipment cost, and improve the efficiency of equipment and air heat transfer, it is favorable to practical application.
[0035] Working principle:
[0036] Firstly, the equipment is assembled, and the Mini LED lamp bead 4 is welded on the PCB board 1 by SMT equidistance, then the heat-conducting silica gel sheet 2 is attached to the lower surface of the PCB board 1 by pressure bonding, and the first through slot 5 on the PCB board 1 is corresponded with the second through slot 6 on the heat-conducting silica gel sheet 2;
[0037] Then, the PCB board 1 with the heat-conducting silica gel sheet 2 is attached to the aluminum material lower frame 3, in use, the gap between the first through slot 5 and the second through slot 6 makes the PCB board 1 and the aluminum material lower frame 3 better contact with air, preliminarily increases the heat dissipation effect, and reduces the investment material of equipment, reaches the purpose of reducing equipment cost.
[0038] At the same time, the heat generated by the Mini LED lamp bead 4 is transmitted to the aluminum material lower frame 3 through the heat-conducting silica gel sheet 2 at the bottom of the PCB board 1, and the heat is transmitted by the heat dissipation fins 7 at the bottom of the aluminum material lower frame 3, when air passes through the bottom of the aluminum material lower frame 3, the ventilation hole inside the heat dissipation fins 7 ensures the circulation of air, and the circulation of air can take away the heat on the heat dissipation fins 7, thereby achieving the purpose of rapid heat dissipation, which is beneficial to practical application.
[0039] Although the embodiments of the utility model have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and variations can be made to these embodiments without departing from the principles and spirits of the utility model, and the scope of the utility model is defined by the appended claims and their equivalents.
Claims
1. A Mini LED backlight module, comprising a PCB board (1), a heat-conducting silica gel sheet (2) and an aluminum lower frame (3), the heat-conducting silica gel sheet (2) being installed between the PCB board (1) and the aluminum lower frame (3), characterized in that, The PCB board (1) is welded with Mini LED lamp beads (4) equidistantly away from one side of the heat-conducting silica gel sheet (2), seven first through grooves (5) are arranged staggeredly and equidistantly on the PCB board (1), seven second through grooves (6) are equidistantly arranged on the heat-conducting silica gel sheet (2), and the bottom of the aluminum material lower frame (3) is equipped with heat dissipation fins (7) equidistantly.
2. The Mini LED backlight module according to claim 1, characterized in that: The first through grooves (5) correspond to the positions of the second through grooves (6).
3. The Mini LED backlight module according to claim 1, characterized in that: Five first through grooves (5) in the middle are all equipped with connecting blocks (8).
4. The Mini LED backlight module according to claim 1, characterized in that: The bottom of the aluminum material lower frame (3) is equipped with five screw columns (9), and the bottom of the screw column (9) is all equipped with a threaded hole.
5. The Mini LED backlight module according to claim 1, characterized in that: The outer side of the heat dissipation fin (7) is all equipped with a ventilation hole equidistantly.
6. A display device, characterized by comprising: The Mini LED backlight module comprises the Mini LED backlight module according to any one of claims 1-5.
7. A mobile terminal, characterized by: The Mini LED backlight module comprises the Mini LED backlight module according to any one of claims 1-5.
Citation Information
Patent Citations
Mini LED backlight module
CN221375608U