Capacitive screen thinning structure

Abstract

The utility model discloses a capacitive screen thinning structure which comprises a glass cover plate, an OCA optical adhesive layer and a lower electrode layer which are sequentially arranged from top to bottom. An upper layer circuit is arranged on the inner side face of the glass cover plate and located between the glass cover plate and the OCA optical cement layer. According to the utility model, the upper layer circuit is directly manufactured on the glass cover plate, the thickness of a layer of electrode and the optical cement is reduced, the purpose of thinning is achieved, the glass cover plate with the upper layer circuit and the lower electrode layer are bonded through the OCA optical cement layer, and a bonding process is reduced technologically, so that the processing process is simpler, the cost is lower, and the production efficiency is improved. And the product yield is improved. The glass cover plate integrates an upper layer circuit, so that the total thickness of the capacitive screen is well controlled, the use amount of optical cement is saved, the processing is convenient, and the production cost can be effectively reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to a capacitive screen technical field more specifically, especially relates to a capacitive screen thinning structure. BACKGROUND

[0002] At present, the mainstream touch capacitive screen mostly adopts GFF structure, that is, is composed of two layers of electrodes, is pasted by OCA optical cement between two layers of electrodes, and is pasted with cover plate glass through OCA optical cement. The capacitive screen of this structure is also the common structure on the market, satisfies the production demand of vast majority. But the defect of this technology is that the total thickness of capacitive screen is larger, and the material cost is high, and the cover plate glass, upper electrode, lower electrode all need to be pasted through OCA optical cement and other adhesives, and the processing cost is relatively high. SUMMARY

[0003] The utility model provides a capacitive screen thinning structure to solve the problem in above -mentioned background art. To realize above -mentioned purpose, the utility model provides the following technical scheme: a capacitive screen thinning structure, including glass cover plate, OCA optical cement layer and lower electrode layer arranged from top to bottom successively, the inner side of glass cover plate is equipped with upper layer circuit, and the upper layer circuit is located between glass cover plate and OCA optical cement layer.

[0004] Preferably, a layer of blackened copper plating layer is attached to the inner side of the glass cover plate by evaporation or sputtering, and a layer of metal copper plating layer is attached to the surface of the blackened copper plating layer by evaporation or sputtering; the blackened copper plating layer and the metal copper plating layer form the upper layer circuit with a pattern through a yellow light process.

[0005] Preferably, the blackened copper plating layer forms a blackened copper layer through a yellow light process, the metal copper plating layer forms a copper plating layer through a yellow light process, the blackened copper layer is connected to the inner side of the glass cover plate, the copper plating layer is connected to the blackened copper layer, and the OCA optical cement layer is connected to the copper plating layer.

[0006] Preferably, the thickness of the blackened copper layer is 10-20 nm.

[0007] Preferably, the lower electrode layer includes a lower layer circuit and a transparent substrate, and the lower layer circuit is arranged on the transparent substrate through a yellow light process; the lower layer circuit is connected to the OCA optical cement layer.

[0008] Preferably, the material of the transparent substrate is PET plastic.

[0009] Preferably, the thickness of the lower layer circuit is the same as the thickness of the upper layer circuit.

[0010] Preferably, the thickness of the upper layer circuit is 2-5 microns.

[0011] Preferably, the thickness of the OCA optical adhesive layer is 60-100 microns, and the light transmittance is not less than 95%.

[0012] Compared with the prior art, the utility model has the advantages of reasonable design and simple structure, the upper layer circuit is directly made on the glass cover plate, the thickness of one layer of electrode and optical adhesive is reduced to achieve the purpose of thinning, the glass cover plate with the upper layer circuit and the lower electrode layer are bonded through the OCA optical adhesive layer, one process of bonding is reduced, the processing process is simpler, the cost is lower, and the yield of the product is improved. BRIEF DESCRIPTION OF DRAWINGS

[0013] Figure 1 It is a structural diagram of the capacitive screen thinning structure of the utility model embodiment;

[0014] Figure 2 It is a GFF structure schematic diagram of the traditional capacitive screen;

[0015] In Figure 1 Corresponding relationship between the names of various components and the figure numbers is:

[0016] 1 - glass cover plate, 2 - OCA optical adhesive layer, 3 - lower electrode layer, 31 - lower layer circuit, 32 - transparent base material, 4 - upper layer circuit. DETAILED DESCRIPTION

[0017] The embodiments of the utility model will be further described in detail below in combination with the drawings and examples, and the attached drawings are only for reference and are not used to limit the disclosed embodiments. The following examples are used to illustrate the utility model, but cannot be used to limit the scope of the utility model.

[0018] In the description of the utility model, unless otherwise specified, the meaning of "a plurality of" is two or more than two; the directions or position relations indicated by the terms "upper", "lower", "left", "right", "inner", "outer", "front end", "rear end", "head", "tail" and the like are based on the directions or position relations shown in the drawings, and are only for the convenience of describing the utility model and simplifying the description, and cannot be understood as indicating or implying that the indicated devices or elements must have a particular direction, be constructed and operated in a particular direction, and therefore cannot be understood as limiting the utility model. In addition, the terms "first", "second", "third" and the like are only for the purpose of description, and cannot be understood as indicating or implying relative importance.

[0019] In the description of the utility model, it is necessary to explain that, unless there is definite stipulation and limitation, the term "connection" should be understood broadly, for example, it can be fixed connection, also can be detachable connection, or integrally connected, it can be mechanical connection, also can be electrical connection, it can be direct connection, also can be indirectly connected through intermediate medium.

[0020] Please refer to Figure 1 The utility model provides a kind of capacitive screen thinning structure, including glass cover plate 1, OCA optical adhesive layer 2 and lower electrode layer 3 sequentially from top to bottom;The inner side of glass cover plate 1 is equipped with upper layer circuit 4, and the upper layer circuit 4 is located between the glass cover plate 1 and the OCA optical adhesive layer 2.

[0021] Please refer to Figure 2 , Figure 2 It is GFF structure schematic diagram for capacitive screen, in the upper electrode (Rx) production process of traditional capacitive screen, generally single-layer electrode is arranged on transparent base material, then is adhered with cover plate by optical adhesive.For capacitive screen of pursuing thin structure, the thickness of cover plate can be reduced, the thickness of upper electrode (Rx) or lower electrode (Tx) is reduced, but the degree of thinning is limited, and is greatly influenced by the precision of processing equipment.The thinning structure provided in the embodiment is improved on the structure of capacitive screen, and the structure mode of G+F is adopted, i.e., the upper layer circuit 4 is made on glass cover plate 1, the thickness of one layer electrode and OCA is reduced to achieve the purpose of thinning.

[0022] Specifically, the upper layer circuit 4 can be produced by adopting yellow light etching process, now film is plated on glass cover plate 1, after film plating is completed, yellow light process such as exposure and development is carried out, then etching is carried out to obtain glass cover plate 1 with upper layer circuit 4.The glass cover plate 1 with upper layer circuit 4 is directed to lower electrode, and OCA optical adhesive layer 2 is used to adhere between glass cover plate 1 and lower electrode, to obtain the required capacitive screen.

[0023] Through the above structural design, after reducing the thickness of one layer electrode and OCA, the thickness of the entire capacitive screen can be reduced by 250 μm.

[0024] Preferably, a blackened copper plating layer is attached to the inner side of the glass cover plate 1 by evaporation or sputtering, and a metal copper plating layer is attached to the surface of the blackened copper plating layer by evaporation or sputtering; the blackened copper plating layer and the metal copper plating layer are formed into the upper layer circuit 4 with patterns by a yellow light process. In this embodiment, a metal copper plating layer is formed by evaporation or sputtering on the glass cover plate 1, and then a yellow light etching process or other fine work can be performed. In order to increase visibility, a blackened copper plating layer can be evaporated before copper plating, and then a metal copper plating layer is formed after the blackened copper plating layer is formed.

[0025] Preferably, the blackened copper plating layer is formed into a blackened copper layer by a yellow light process, the metal copper plating layer is formed into a copper plating layer by a yellow light process, the blackened copper layer is connected to the inner side of the glass cover plate 1, the copper plating layer is connected to the blackened copper layer, and the OCA optical adhesive layer 2 is connected to the copper plating layer. In this embodiment, the original blackened copper plating layer and the metal copper plating layer are formed into a blackened copper layer and a copper plating layer with patterns by a yellow light etching process, the blackened copper layer can reduce the metal reflectivity, reduce the light rays diffraction generated by the halo or interference, and improve the display effect.

[0026] Preferably, the thickness of the blackened copper layer is 10-20 nm.

[0027] Preferably, the lower electrode layer 3 includes a lower layer circuit 31 and a transparent substrate 32, the lower layer circuit 31 is arranged on the transparent substrate 32 by a yellow light process; and the lower layer circuit 31 is connected to the OCA optical adhesive layer 2. In this embodiment, the lower layer circuit 31 is made by copper plating on the transparent substrate 32, and the same preparation process as the upper layer circuit 4 can be used to reduce equipment investment and production cost.

[0028] Preferably, the material of the transparent substrate 32 is PET plastic.

[0029] Preferably, the thickness of the lower layer circuit 31 is the same as the thickness of the upper layer circuit 4. In this embodiment, the thickness of the lower layer circuit 31 is the same as the thickness of the copper layer of the upper layer circuit 4 on the glass cover plate 1, so that the corresponding circuit can be made without changing the water line parameters on the production line.

[0030] Preferably, the thickness of the upper layer circuit 4 is 2-5 μm. In this embodiment, the thickness of the copper layer of the upper layer circuit 4 is controllable, and is usually 2-5 μm, so as to ensure good touch effect and take into account the thickness of the capacitive screen.

[0031] Preferably, the thickness of the OCA optical adhesive layer 2 is 60-100 μm, and the light transmittance is not less than 95%.

[0032] Compared with the prior art, the utility model have the advantages that: the utility model discloses reasonable design, simple structure, through directly making upper layer circuit to glass cover plate, reduce a layer electrode and the thickness of optical adhesive, reach the purpose of thinning, glass cover plate with upper layer circuit and lower electrode layer through OCA optical adhesive layer adhesion, reduced a process of sticking on craft, make the processing process simpler, cost lower, the yield of product is promoted.

[0033] Embodiments of the present application are presented for the purpose of example and description, and are not exhaustive or limiting of the present application to the disclosed form. Many modifications and variations will be apparent to those of ordinary skill in the art. Embodiments are chosen and described in order to best explain the principles of the present application and its practical application, and to enable others skilled in the art to understand the present application for various embodiments with various modifications as are suited to the particular use contemplated.

Claims

1. A capacitive screen thinning structure, characterized in that, The glass cover plate (1), OCA optical glue layer (2) and lower electrode layer (3) are sequentially arranged from top to bottom; the inner side of the glass cover plate is provided with an upper layer circuit (4) between the glass cover plate and the OCA optical glue layer.

2. The capacitive screen thinning structure of claim 1, wherein, A blackened copper plating layer is attached to the inner side of the glass cover plate by evaporation or sputtering, and a metal copper plating layer is attached to the surface of the blackened copper plating layer by evaporation or sputtering; the blackened copper plating layer and the metal copper plating layer form the upper layer circuit with patterns through the yellow light process.

3. The capacitive screen thinning structure of claim 2, wherein, The blackened copper plating layer forms a blackened copper layer through the yellow light process, the metal copper plating layer forms a copper plating layer through the yellow light process, the blackened copper layer is connected with the inner side of the glass cover plate, the copper plating layer is connected with the blackened copper layer, and the OCA optical glue layer is connected with the copper plating layer.

4. The capacitive screen thinning structure of claim 3, wherein, The thickness of the blackened copper layer is 10-20 nm.

5. The capacitive screen thinning structure of claim 1, wherein, The lower electrode layer includes a lower layer circuit (31) and a transparent substrate (32), and the lower layer circuit is arranged on the transparent substrate through the yellow light process; the lower layer circuit is connected with the OCA optical glue layer.

6. The capacitive screen thinning structure of claim 5, wherein, The material of the transparent substrate is PET plastic.

7. The capacitive screen thinning structure of claim 6, wherein, The thickness of the lower layer circuit is the same as that of the upper layer circuit.

8. The capacitive screen thinning structure of claim 7, wherein, The thickness of the upper layer circuit is 2-5 μm.

9. The capacitive screen thinning structure of claim 1, wherein, The thickness of the OCA optical glue layer is 60-100 μm, and the light transmittance is not less than 95%.

Images