High-performance Mini LED display device

Abstract

The utility model discloses a high-performance Mini LED display device, and belongs to the field of semiconductor display. The problems that a Mini LED display is uneven in brightness and color, high in power consumption and low in IC drive response speed are solved. According to the technical scheme, the flip-chip light-emitting device comprises a carrier plate, the carrier plate comprises a first end face and a second end face, the first end face is provided with a first upper chip area and a first driving circuit, a flip-chip light-emitting chip is welded to the first upper chip area and electrically connected with the first driving circuit, a concave cavity is formed in the second end face, and a second upper chip area is arranged in the concave cavity and electrically connected with the second driving circuit. A flip driving IC chip is welded on the second upper chip area, the flip driving IC chip is electrically connected with the flip light-emitting chip through a first via hole, the edge of the second end face is provided with an SMT bonding pad, the SMT bonding pad is electrically connected with the flip driving IC chip through a second driving circuit, the SMT bonding pad is electrically connected with the first driving circuit through a second via hole, and the SMT bonding pad is welded on the circuit board; the utility model is applied to the LED display.

Description

TECHNICAL FIELD

[0001] The utility model provides a kind of high-performance Mini LED display device belongs to semiconductor display technical field. BACKGROUND

[0002] The existing Mini LED display device will cause the brightness to reduce, color distortion in some strong light environment, thereby causing the definition of the image displayed to be affected. In addition, the conventional flip light emitting chip and flip drive IC chip are integrated on different modules respectively, the circuit is complex, and when applied to small-pitch LED display, poor heat dissipation will cause slow driving response speed and high power consumption, thereby limiting the display effect, and in the manufacturing process, the carrier plate of flip light emitting chip and the carrier plate of IC chip will also have the problem of warping. For the Mini LED display applied in large screen, there will also be overall display brightness and color non-uniformity, affecting the overall display effect.

[0003] Therefore, it is very necessary to develop a high-performance Mini LED display device. UTILITY MODEL CONTENTS

[0004] The utility model discloses a kind of high-performance Mini LED display devices to solve the technical problems such as Mini LED display brightness, color non-uniformity, high power consumption, IC driving response speed slow, propose to improve the hardware structure and circuit structure of Mini LED display to enhance the display effect of Mini LED display device, improve the use performance of Mini LED display device.

[0005] To solve the above technical problems, the technical scheme adopted by the utility model is as follows: a kind of high-performance Mini LED display device, including carrier plate, the carrier plate includes first end face and second end face, first upper chip area and first drive circuit are provided on the first end face, flip light emitting chip is welded on the first upper chip area, and the flip light emitting chip is electrically connected with the first drive circuit;

[0006] Recessed cavity is opened on the second end face, second upper chip area is arranged in the recessed cavity, flip drive IC chip is reflow soldered on the second upper chip area, the flip drive IC chip includes a plurality of first IC chips and a plurality of second IC chips, the first IC chip corresponds to flip light emitting chip one by one, and the first IC chip is electrically connected with flip light emitting chip by first through-hole;

[0007] SMT pad is provided on the edge of the second end face, the SMT pad is electrically connected with the second IC chip by second drive circuit, and the SMT pad is electrically connected with the first drive circuit by second through-hole;

[0008] The SMT pad is welded on the circuit board;

[0009] The flip light emitting chip is packaged on the first end face through a first plastic encapsulant, and the flip driving IC chip is packaged in the concave cavity through a second plastic encapsulant.

[0010] Further, the flip light emitting chip is welded on the first upper die area through first tin paste, the first tin paste is low-temperature tin paste; the flip driving IC chip is welded on the second upper die area through second tin paste, and the second tin paste is high-temperature tin paste.

[0011] Further, the first through hole and the second through hole are both plated with a metal layer.

[0012] Further, the first plastic encapsulant is light-transmitting epoxy resin, and the second plastic encapsulant is non-light-transmitting epoxy resin.

[0013] Further, the first driving line and the second driving line both contain Cu, Ni, Ag and Au metals.

[0014] Further, the first end face and the second end face are both coated with solder resist ink.

[0015] Further, the upper surface of the second plastic encapsulant is in the same plane with the second end face.

[0016] Further, the flip light emitting chip comprises a red light chip, a green light chip and a blue light chip.

[0017] Further, the material of the carrier plate is ceramic or glass or BT substrate.

[0018] Further, the flip light emitting chip is common cathode packaging or common anode packaging.

[0019] The utility model discloses a flip light emitting chip and flip driving IC chip are connected through the first through hole, and SMT pad and first driving line are connected through the second through hole, compared with prior art, further simplify the setting of electronic circuit, improve the response speed of control system, reduce the point spacing of light emitting point, can effectively enhance the resolution of LED display screen.

[0020] 1. The utility model discloses a flip driving IC chip and flip light emitting chip are connected through the first through hole, and SMT pad and first driving line are connected through the second through hole, compared with prior art, further simplify the setting of electronic circuit, improve the response speed of control system, reduce the point spacing of light emitting point, can effectively enhance the resolution of LED display screen.

[0021] 2. The flip drive IC chip and the flip light emitting chip are packaged on the same carrier plate, the flip drive IC chip can control the flip light emitting chip one by one, the brightness, color and other parameters of the LED display device can be adjusted, clearer, brighter and more realistic images can be displayed in the LED display screen, when the brightness of the LED display device is not required, the brightness and current of the flip light emitting chip can be adjusted, the energy consumption can be reduced, the service life of the display device is prolonged and the power consumption is reduced;

[0022] 3. The flip drive IC chip and the flip light emitting chip are distributed on the first end face and the second end face of the carrier plate, so that the stress borne by the front and back surfaces of the carrier plate is balanced, and the warping problem of the carrier plate in the manufacturing process is avoided.

[0023] 4. The flip drive IC chip and the flip light emitting chip are welded on the carrier plate by high-temperature reflow soldering, the signal transmission path is reduced, and the driving response speed is greatly improved. BRIEF DESCRIPTION OF DRAWINGS

[0024] The utility model will be further described in connection with the drawings:

[0025] Figure 1 It is the structure schematic view of the first end face of the utility model not fixed flip light emitting chip;

[0026] Figure 2 It is the structure schematic view of the first end face of the utility model fixed flip light emitting chip after;

[0027] Figure 3 It is the structure schematic view of the second end face of the utility model not fixed flip drive IC chip;

[0028] Figure 4 It is the structure schematic view of the utility model three-dimensional structure;

[0029] Figure 5 It is the section view of the utility model after packaging;

[0030] In the drawing: 1 is carrier plate, 2 is first end face, 3 is first upper core area, 4 is first through hole, 5 is first tin paste, 6 is flip light emitting chip, 7 is first plastic package, 8 is second end face, 9 is second upper core area, 10 is second tin paste, 11 is flip drive IC chip, 12 is second plastic package, 13 is SMT pad, 14 is first drive circuit, 15 is second drive circuit, 16 is second through hole, 17 is concave cavity. DETAILED DESCRIPTION

[0031] In the utility model, in the case that no opposite statement is made, the orientation words such as '' upper, lower, top, bottom '' used are usually for the direction shown in the drawing or for the vertical, perpendicular or gravity direction of the component itself; similarly, for the convenience of understanding and description, '' inner, outer '' refers to the inner and outer of the contour of each component itself, but the above orientation words are not used to limit the utility model.

[0032] In the description of the utility model, it needs to be explained that, unless there is definite stipulation and limitation, the terms '' installation '' '' connection '' should be understood in a broad sense, for example, can be fixed connection, can be detachable connection or integrally connected, can be mechanical connection or electrical connection, can be directly connected or indirectly connected through intermediate medium, can be the communication inside two elements. For ordinary skilled person in the art, the specific meaning of the above terms in the application can be understood according to specific circumstances.

[0033] As Figures 1 to 5 The utility model provides a kind of high-performance Mini LED display device, including carrier plate 1, the material of carrier plate 1 is ceramic or glass or BT substrate, carrier plate 1 includes first end surface 2 and second end surface 8, first end surface 2 and second end surface 8 are opposite faces, first end surface 2 is distributed with first upper core area 3 and first drive circuit 14, first upper core area 3 is welded with flip light emitting chip 6, flip light emitting chip 6 is welded on first upper core area 3 by reflow soldering, flip light emitting chip 6 is electrically connected with first drive circuit 14. Flip light emitting chip 6 is welded on first upper core area 3 by first tin paste 5, and first tin paste 5 is low-temperature tin paste. Flip light emitting chip 6 includes red light chip, green light chip and blue light chip, is common cathode package or common anode package, can be adapted to the functional requirement of user as required, and need not therefore increase cost.

[0034] Second end surface 8 is provided with square recessed cavity 17, and second upper core area 9 is arranged in recessed cavity 17, reflow soldering is welded with flip drive IC chip 11 on second upper core area 9, flip drive IC chip 11 includes a plurality of first IC chips and a plurality of second IC chips, first IC chip and flip light emitting chip 6 one-to-one correspondence, first IC chip and flip light emitting chip 6 are electrically connected by first via hole 4, and metal layer is electroplated in first via hole 4. Three first IC chips and four second IC chips are arranged in the embodiment, three first IC chips are electrically connected with red light chip, green light chip and blue light chip respectively, flip drive IC chip 11 is welded on second upper core area 9 by second tin paste 10, and second tin paste 10 is high-temperature tin paste.

[0035] The edge of the second end surface 8 is further provided with an SMT pad 13, the SMT pad 13 is electrically connected with the second IC chip through a second driving circuit 15, the SMT pad 13 is electrically connected with the first driving circuit 14 through a second through hole 16, and the SMT pad 13 is welded on the circuit board. The SMT pad 13 can realize electrical functional interconnection between the flip-chip driving IC chip 11 and an external circuit and electrical functional interconnection between the flip-chip light emitting chip 6 and the external circuit. The second through hole 16 is internally electroplated with a metal layer.

[0036] In the embodiment, five SMT pads 13 are arranged, four of which are connected with one second IC chip through the second driving circuit 15 respectively, and one SMT pad 13 is connected with the first driving circuit 14 on the first end surface 2 through the second through hole 16, so that electrical connection between the flip-chip light emitting chip 6 and an external circuit can be realized.

[0037] The flip-chip light emitting chip 6 is packaged on the first end surface 2 through the first plastic package 7, and the flip-chip driving IC chip 11 is packaged in the concave cavity 17 through the second plastic package 12, and the upper surface of the second plastic package 12 is in the same plane as the second end surface 8. The first plastic package 7 is a light-transmitting epoxy resin, and the second plastic package 12 is a non-light-transmitting epoxy resin.

[0038] The first driving circuit 14 and the second driving circuit 15 each contain Cu, Ni, Ag and Au metals, which are fixed on the carrier plate 1 through electroplating and electrochemical deposition.

[0039] The first end surface 2 and the second end surface 8 are each coated with a solder resist ink.

[0040] The flip-chip driving IC chip 11 and the flip-chip light emitting chip 6 of the LED display device are integrally packaged on the same carrier plate 1, the flip-chip driving IC chip 11 controls the flip-chip light emitting chip 6 independently, the Mini LED display device is applied to a large-screen display screen, and the resolution of the large-screen display screen can be effectively improved. The flip-chip driving IC chip 11 is packaged in the concave cavity 17 through the second plastic package 12, the upper surface of the second plastic package 12 is in the same plane as the second end surface 8, and the thickness of the LED device as a whole is effectively reduced. The flip-chip driving IC chip 11 and the flip-chip light emitting chip 6 are electrically connected through the first through hole 4, and the SMT pad 13 and the first driving circuit 14 are electrically connected through the second through hole 16, so that the signal communication path is shortened, the response speed is improved, and the heat dissipation effect is improved.

[0041] It should be noted that the connection relationship between the components and modules of the utility model is determined and can be realized, and the specific connection relationship can bring about corresponding technical effects, and based on the premise of not relying on the corresponding software program execution, the technical problems proposed by the utility model are solved, the model, the connection mode between the components, the modules and the specific components, the conventional use method brought about by the above technical features, the predictable technical effects, and the like are all the disclosed contents in the patent, the journal paper, the technical manual, the technical dictionary, the textbook, or the like which can be obtained by the technical personnel in the field before the application date, or the existing technology such as the conventional technology and the common knowledge, and thus no further description is needed, so that the technical scheme provided by the case is clear, complete and realizable, and the corresponding entity product can be reproduced or obtained according to the technical means.

[0042] Finally, it should be noted that: the above embodiments are only used to illustrate the technical scheme of the utility model, rather than limit it; although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: it can still modify the technical scheme recorded in the foregoing embodiments, or make equivalent replacement for part or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical scheme deviate from the scope of the technical scheme of the embodiments of the utility model.

Claims

1. A high-performance Mini LED display device, characterized in that: The application relates to a flip chip LED packaging substrate, which comprises a carrier plate (1) provided with a first end face (2) and a second end face (8), a first upper chip area (3) and a first driving circuit (14) arranged on the first end face (2), a flip light-emitting chip (6) welded on the first upper chip area (3), and the flip light-emitting chip (6) is electrically connected with the first driving circuit (14). A recessed cavity (17) is arranged on the second end face (8), a second upper chip area (9) is arranged in the recessed cavity (17), a flip driving IC chip (11) is welded on the second upper chip area (9), the flip driving IC chip (11) comprises a plurality of first IC chips and a plurality of second IC chips, the first IC chips correspond to the flip light-emitting chips (6) one by one, and the first IC chips are electrically connected with the flip light-emitting chips (6) through first through holes (4). An SMT pad (13) is arranged at the edge of the second end face (8), the SMT pad (13) is electrically connected with the second IC chips through a second driving circuit (15), and the SMT pad (13) is electrically connected with the first driving circuit (14) through second through holes (16). The SMT pad (13) is welded on a circuit board. The flip light-emitting chip (6) is packaged on the first end face (2) through a first plastic sealing body (7), and the flip driving IC chip (11) is packaged in the recessed cavity (17) through a second plastic sealing body (12).

2. The high-performance Mini LED display device of claim 1, wherein: The flip light-emitting chip (6) is welded on the first upper chip area (3) through first tin paste (5), the first tin paste (5) is low-temperature tin paste, the flip driving IC chip (11) is welded on the second upper chip area (9) through second tin paste (10), and the second tin paste (10) is high-temperature tin paste.

3. The high-performance Mini LED display device of claim 1, wherein: Metal layers are electroplated in the first through holes (4) and the second through holes (16).

4. The high-performance Mini LED display device of claim 1, wherein: The first plastic sealing body (7) is light-transmitting epoxy resin, and the second plastic sealing body (12) is non-light-transmitting epoxy resin.

5. The high-performance Mini LED display device of claim 1, wherein: The first driving circuit (14) and the second driving circuit (15) both contain Cu, Ni, Ag and Au metals.

6. The high-performance Mini LED display device of claim 1, wherein: The first end face (2) and the second end face (8) are both coated with solder resist ink.

7. The high-performance Mini LED display device of claim 1, wherein: The upper surface of the second plastic sealing body (12) is in the same plane as the second end face (8).

8. The high-performance Mini LED display device of claim 1, wherein: The flip light-emitting chip (6) comprises red light chips, green light chips and blue light chips.

9. The high-performance Mini LED display device of claim 1, wherein: The material of the carrier plate (1) is ceramic, glass or a BT substrate.

10. The high-performance Mini LED display device of claim 1, wherein: The flip light-emitting chip (6) is a common cathode packaging or a common anode packaging.

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