Integrated PIN for long-service-life easy-to-package power module

Abstract

The utility model discloses an integrated PIN for a long-life easy-to-package power module, which belongs to the technical field of PINs, the integrated PIN for the long-life easy-to-package power module comprises a circuit board for installation, and further comprises an integrated PIN, the integrated PIN comprises a needle tip, the end part of the needle tip is inserted into the circuit board, the tail part of the needle tip is connected with a positioning shoulder, and the end part of the needle tip is inserted into the circuit board. A stress buffering bent plate is fixedly connected to the face, away from the needle tip, of the positioning shoulder, the stress buffering bent plate is arranged in a bent mode, the tail of the stress buffering bent plate is connected with a base, the stress buffering bent plate deforms firstly when subjected to external force, cracking of a connecting welding layer is effectively avoided, and the integrated PIN needle is simple in structure, easy to machine and manufacture and capable of being directly connected to a substrate through the welding layer. The reliability can be improved; the service life is prolonged; cracking caused by the fact that force is directly transmitted to the connecting welding layer is avoided, reliability can be improved, and the service life can be prolonged.

Description

Technical Field

[0001] The utility model relates to the field of PIN pins, and in particular to an integrated PIN pin for a long-life, easy-to-package power module. Background Art

[0002] A power module is a module made by electrically interconnecting power electronic components to form an integrated circuit with certain functions and then encapsulating it.

[0003] like Figure 3 As shown, a conventional split-type PIN pin includes a pin socket 105 and a PIN pin 106. Its packaging process and usage are as follows: first, the pin socket 105 is connected to the substrate 101 using the solder layer 104. Then, the PIN pin 106 is inserted into the pin socket 105. Then, the PIN pin 106 is passed through the corresponding hole in the power module housing 102. Finally, the other end of the PIN pin 106 is inserted into the circuit board 103 to complete the electrical connection. However, the conventional split-type PIN pin has the following disadvantages:

[0004] 1. Both the needle holder 105 and the PIN pin 106 are rigid structures. During module testing and service, the external force applied to the PIN pin 106 is easily transmitted to the solder layer 104 connecting the needle holder 105 and the substrate 101, causing cracks and affecting service reliability.

[0005] Second, the needle holder 105 and the PIN needle 106 are connected by an interference fit. The external force applied to the PIN needle 106 may cause the connection between the PIN needle 106 and the inner hole of the needle holder 105 to become loose, affecting the reliability of the electrical connection.

[0006] Third, the packaging of split PIN pins requires two steps: soldering the pin holder 105 and inserting the PIN pin 106. The low efficiency of the pin insertion process has become a bottleneck limiting production capacity. Furthermore, it is easy to cause modules to be scrapped due to pin insertion, increasing costs. Inventing a long-life, easy-to-package power module with integrated PIN pins to address these issues has become a pressing issue for those skilled in the art. Utility Model Content

[0007] In order to make up for the above shortcomings, the utility model provides an integrated PIN needle for a long-life, easy-to-package power module, aiming to improve the problem that the force applied to the PIN needle easily causes the connection solder layer to crack and the needle seat connection to loosen.

[0008] The utility model is realized as follows: an integrated PIN needle for a long-life and easy-to-package power module is used for installing a circuit board, and further includes

[0009] The utility model provides an integral PIN needle, the needle tip of the integral PIN needle includes the end inserted in the circuit board, the tail of the needle tip is connected with the locating shoulder, the one side of the locating shoulder away from the needle tip is fixedly connected with the stress buffer bent plate, the stress buffer bent plate is bently arranged, the tail of the stress buffer bent plate is connected with the base.

[0010] In a preferred technical scheme of the utility model, one side of the circuit board is provided with a substrate, and the back of the base is connected with the substrate.

[0011] In a preferred technical scheme of the utility model, a power module shell is arranged between the circuit board and the substrate, and the side of the locating shoulder close to the needle tip is in abutment with the power module shell.

[0012] In a preferred technical scheme of the utility model, the locating shoulder is disc-shaped, the one side of the locating shoulder connected with the needle tip is a horizontal plane, and the horizontal plane of the locating shoulder is in abutment with the power module shell.

[0013] In a preferred technical scheme of the utility model, the other side of the locating shoulder is conical, the conical surface of the locating shoulder is fixedly connected with one end of the stress buffer bent plate, and the conical surface is gradually reduced from the horizontal plane to the end of the stress buffer bent plate.

[0014] In a preferred technical scheme of the utility model, the stress buffer bent plate is three-segmented, both ends of the stress buffer bent plate are rectangular columns, and the middle part of the stress buffer bent plate is an arc-shaped plate.

[0015] In a preferred technical scheme of the utility model, the thickness of the middle arc-shaped plate of the stress buffer bent plate is gradually reduced from the end close to the base to the end close to the locating shoulder.

[0016] In a preferred technical scheme of the utility model, the base is two-segmented, the upper part of the base is a rectangular column, the bottom of the base is a circular disc, and the rectangular column of the base is fixedly connected with one end of the stress buffer bent plate.

[0017] In a preferred technical scheme of the utility model, the bottom of the circular disc of the base is a horizontal plane, the upper surface of the circular disc is conical, and the conical surface of the circular disc is gradually reduced from the horizontal plane to the rectangular column.

[0018] In a preferred technical scheme of the utility model, a welding layer is arranged between the horizontal plane of the base disc and the substrate, and the base is connected with the substrate through the welding layer.

[0019] The utility model discloses a beneficial effect is: the utility model discloses a long -life easy packaging power module with integral PIN needle is obtained through above -mentioned design, when using, the positioning shoulder is in the inside of power module shell after packing and is pressed, prevents the power module from pulling out from the circuit board and causes its cracking when the force transmission of integral PIN needle and the connecting solder layer of base, can promote reliability and prolong the service life.

[0020] The stress buffer bending plate is arranged between the positioning shoulder and the base, wherein the arc-shaped part of the stress buffer bending plate has small rigidity and can be deformed first when the integral PIN needle bears the force along or perpendicular to the needle tip, thereby avoiding the force from being directly transmitted to the connecting solder layer to cause cracking of the connecting solder layer, and the reliability can be improved and the service life can be prolonged.

[0021] The base is arranged at the lowermost part of the integral PIN needle, and the cross section of the base is larger than the cross section of the needle tip to provide a larger area of the connecting solder layer during welding; the integral PIN needle has simple structure and is easy to process and manufacture, and the connecting solder layer can be directly connected to the base, the reliability can be improved, and the service life can be prolonged.

[0022] The integral PIN needle is projected on the base surface along the length direction of the integral PIN needle, so as to facilitate electrical connection. BRIEF DESCRIPTION OF DRAWINGS

[0023] In order to more clearly illustrate the technical scheme of the embodiments of the utility model, the following will be briefly introduced the drawings needed to be used in the embodiments, it should be understood, the following drawings only shows some embodiments of the utility model, therefore should not be regarded as the limitation to the scope, for ordinary skilled person in the art, under the premise of not paying the creative labor, still can obtain other related drawings according to these drawings.

[0024] Figure 1 It is the integral PIN needle packaging structure schematic view provided by the utility model embodiment;

[0025] Figure 2 It is the integral PIN needle structure schematic view provided by the utility model embodiment;

[0026] Figure 3 It is the traditional PIN needle packaging structure schematic view provided by the utility model embodiment.

[0027] In the drawing: 101, base plate;102, power module shell;103, circuit board;104, solder layer;105, needle seat;106, PIN needle;205, integral PIN needle;2051, needle tip;2052, stress buffer bending plate;2053, base;2054, positioning shoulder. DETAILED DESCRIPTION

[0028] In order to make the purpose, technical scheme and advantages of the utility model embodiment clearer, the technical scheme in the utility model embodiment will be clearly and completely described below in combination with the drawings in the utility model embodiment. Obviously, the described embodiment is part of the utility model, rather than all the embodiments. Based on the embodiment in the utility model, all other embodiments obtained by the person skilled in the art without creative labor belong to the protection scope of the utility model.

[0029] Please refer to Figure 1 The utility model provides a technical scheme: a long life easy package power module is with integral PIN, for installing circuit board 103, still includes

[0030] Integral PIN 205, integral PIN 205 includes needle tip 2051, the end of needle tip 2051 is inserted in circuit board 103, the tail of needle tip 2051 is connected with the positioning shoulder 2054, the one side of positioning shoulder 2054 away from needle tip 2051 is fixedly connected with stress buffer bent plate 2052, stress buffer bent plate 2052 is bently arranged, the tail of stress buffer bent plate 2052 is connected with base 2053, stress buffer bent plate 2052 will first deform when being subjected to external force, effectively avoid the cracking of connecting solder layer 104.

[0031] Please refer to Figure 1 And Figure 2 One side of circuit board 103 is provided with base plate 101, the back of base 2053 is connected with base plate 101. Power module shell 102 is arranged between circuit board 103 and base plate 101, and the side of positioning shoulder 2054 close to needle tip 2051 abuts against power module shell 102. Positioning shoulder 2054 is disc-shaped, and the side of positioning shoulder 2054 connected with needle tip 2051 is a horizontal plane, and the horizontal plane of positioning shoulder 2054 abuts against power module shell 102.

[0032] The other side of positioning shoulder 2054 is conically arranged, and the conical surface of positioning shoulder 2054 is fixedly connected with one end of stress buffer bent plate 2052, and the conical surface is gradually reduced from the horizontal plane to the end of stress buffer bent plate 2052.

[0033] Stress buffer bent plate 2052 is three-sectionally arranged, both ends of stress buffer bent plate 2052 are rectangular columns, and the middle part of stress buffer bent plate 2052 is an arc-shaped plate. The thickness of the middle part of stress buffer bent plate 2052 gradually decreases from the end close to base 2053 to the end close to positioning shoulder 2054, so as to reduce the rigidity of stress buffer bent plate 2052 and bend when subjected to external force.

[0034] The base 2053 is provided in two sections, the upper part of the base 2053 is a rectangular column, the bottom of the base 2053 is a circular disc, the rectangular column of the base 2053 is fixedly connected with one end of the stress buffer bending plate 2052, and the circular disc is used for increasing a welding area during welding.

[0035] The bottom of the circular disc of the base 2053 is provided in a plane, the upper surface of the circular disc is provided in a conical shape, and the conical surface of the circular disc is gradually reduced from the horizontal plane to the rectangular column. The plane of the circular disc of the base 2053 is provided with a welding layer 104 between the base plate 101, the base 2053 is connected with the base plate 101 through the welding layer 104, the integral PIN needle 205 is projected in the plane of the base 2053 along the length direction, so as to facilitate electrical connection, and the integral PIN needle 205 can be directly connected to the base plate 101 through nano-silver soldering paste low-temperature sintering, and the connection reliability is improved.

[0036] Working principle: the positioning shoulder 2054 abuts against the inner side of the power module shell 102 after packaging, so that force is prevented from being transmitted to the connection welding layer 104 of the integral PIN needle 205 and the base plate 101 to cause cracking of the connection welding layer 104 when the power module is pulled out of the circuit board 103; the stress buffer bending plate 2052 is arranged between the positioning shoulder 2054 and the base 2053, wherein the arc-shaped part of the stress buffer bending plate 2052 has small rigidity and can be deformed first when the integral PIN needle 205 bears force along or perpendicular to the needle tip 2051, so that the force is prevented from being directly transmitted to the connection welding layer 104 to cause cracking of the connection welding layer 104; the base 2053 is arranged at the lowermost position of the integral PIN needle 205, the cross section of the base 2053 is greater than that of the needle tip 2051 to provide a larger area of the connection welding layer 104 during welding; the integral PIN needle 205 has simple structure and is easy to process and manufacture, and can be directly connected to the base plate 101 by using the welding layer 104.

[0037] The preferred embodiments of the utility model are described above only, and are not used for limiting the utility model, for the person skilled in the art, the utility model can have various changes and changes. Any modification, equivalent replacement, improvement etc. that is made within the spirit and principle of the utility model should be included in the protection scope of the utility model.

Claims

1. An integrated PIN for a long-life, easy-to-package power module for a circuit board to be mounted, characterized by, Also include The integrated PIN needle includes a needle tip, the end of the needle tip is inserted into the circuit board, the tail of the needle tip is connected with a positioning shoulder, the far side of the positioning shoulder is fixedly connected with a stress buffer bending plate, the stress buffer bending plate is bent, the tail of the stress buffer bending plate is connected with a base.

2. The integrated PIN for long-life, easy-to-package power modules of claim 1, wherein: One side of the circuit board is provided with a substrate, the back of the base is connected with the substrate.

3. The integral PIN for long-life easy-to-package power modules of claim 2, wherein: The power module shell is arranged between the circuit board and the substrate, and the side of the positioning shoulder close to the needle tip abuts against the power module shell.

4. The integrated PIN for long-life easy-to-package power modules of claim 3, wherein: The positioning shoulder is disc-shaped, one side of the positioning shoulder connected with the needle tip is a horizontal plane, and the horizontal plane of the positioning shoulder abuts against the power module shell.

5. The integral PIN for long-life easy-to-package power modules of claim 4, wherein: The other side of the positioning shoulder is conical, one end of the stress buffer bending plate is fixedly connected with the conical surface of the positioning shoulder, and the conical surface is gradually reduced from the horizontal plane to the end of the stress buffer bending plate.

6. The integral PIN for long-life easy-to-package power modules of claim 4, wherein: The stress buffer bending plate is three-sectioned, both ends of the stress buffer bending plate are rectangular columns, and the middle part of the stress buffer bending plate is an arc-shaped plate.

7. The integral PIN for long-life easy-to-package power modules of claim 6, wherein: The thickness of the middle arc-shaped plate of the stress buffer bending plate is gradually reduced from the end close to the base to the end close to the positioning shoulder.

8. The integral PIN for long-life easy-to-package power modules of claim 6, wherein: The base is two-sectioned, the upper part of the base is a rectangular column, the bottom of the base is a circular disc, and the rectangular column of the base is fixedly connected with one end of the stress buffer bending plate.

9. The integral PIN for long-life easy-to-package power modules of claim 8, wherein: The bottom of the circular disc of the base is flat, and the upper surface of the circular disc is conical.

10. The integral pin for long-life easy-to-package power modules of claim 8, wherein: A welding layer is arranged between the flat surface of the circular disc of the base and the substrate, and the base is connected with the substrate through the welding layer.

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