Image acquisition device and intelligent glasses

Abstract

The embodiment of the utility model provides an image acquisition device and intelligent glasses. The image acquisition device comprises a first connector, a camera module and a detection circuit. The first connector is in pluggable connection with a second connector of an external image processing device; the camera module is connected to the first connector through the first interface; one end of the detection circuit is connected to the first connector, and the other end of the detection circuit is used for receiving a constant level signal. According to the embodiment of the invention, the pluggable connection between the camera module and the external image processing device is realized through the switching function of the first connector.

Description

TECHNICAL FIELD

[0001] Embodiments of the present disclosure relate to the technical field of intelligent equipment, and in particular, to an image acquisition device and smart glasses. BACKGROUND

[0002] In the related art, a MIPI interface (Mobile Industry Processor Interface) is usually arranged in an image sensor to realize image data interaction between the image sensor and other devices (such as an image processor).

[0003] The specification protocol of the MIPI interface does not have a hot plug related design. That is, for the image sensor and other devices (such as an image processor) connected through the MIPI interface, once the connection is disconnected, the image sensor needs to restart the device power supply, so that it can be recognized by the image processor.

[0004] However, in some use scenarios, people usually want to conveniently and quickly connect or disconnect the interface of the image sensor hardware device without restarting the device power supply. CONTENT OF THE INVENTION

[0005] Therefore, embodiments of the present disclosure provide an image acquisition device and smart glasses to at least partially solve the above problems.

[0006] According to a first aspect of embodiments of the present disclosure, an image acquisition device is provided, comprising: a first connector, the first connector having a first side and a second side, the first side being opposite to the second side; a first interface and a first test pin are arranged on the first side; the second side is used to plugably connect the first connector with a second connector of an external image processing device; a camera module, the camera module being connected to the first connector through the first interface; and a detection circuit, one end of the detection circuit being connected to the first connector through the first test pin, and the other end of the detection circuit being used to receive a constant level signal; in a state where the first connector is connected with the second connector, the external image processing device controls the connection between the external image processing device and the image acquisition device by detecting a level change of a second test pin; and the constant level signal is different from an initial level signal of the second test pin.

[0007] According to a second aspect of the embodiments of the present disclosure, a main body is provided, which is provided with an external image processing device; and an image acquisition device, the image acquisition device comprising: a first connector, the first connector having a first side and a second side, the first side being opposite to the second side; a first interface and a first test pin being arranged on the first side; the second side being used for pluggable connection of the first connector with a second connector of the external image processing device; a camera module, the camera module being connected to the first connector through the first interface; and a detection circuit, one end of the detection circuit being connected to the first connector through the first test pin, the other end of the detection circuit being used for receiving a constant level signal; in a state that the first connector is connected with the second connector, the external image processing device controls the connection between the external image processing device and the image acquisition device by detecting a level change of the second test pin; wherein the constant level signal is different from an initial level signal of the second test pin. BRIEF DESCRIPTION OF DRAWINGS

[0008] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description are only some embodiments of the present disclosure, and other drawings can also be obtained by those skilled in the art based on these drawings.

[0009] Figure 1 Structure diagram of the image acquisition device according to the embodiments of the present disclosure Figure 1

[0010] Figure 2 Structure diagram of the image acquisition device according to the embodiments of the present disclosure Figure 2

[0011] Figure 3 Structure diagram of the image acquisition device according to the embodiments of the present disclosure

[0012] Figure 4 Structure diagram of the image acquisition device according to the embodiments of the present disclosure Figure 3

[0013] Figure 5 Connection diagram of the image acquisition device and the image processing device in the related art

[0014] Figure 6 Connection diagram of the image acquisition device and the external image processing device according to the embodiments of the present disclosure

[0015] Figure 7 Connection diagram of the smart glasses according to the embodiments of the present disclosure

[0016] Explanation of the reference signs: ​​​

[0017] 100 - image acquisition device; 110 - first connector; 111 - first side; 1111 - first interface; 1112 - first test pin; 1113 - power enable pin; 1114 - clock crystal enable pin; 1115 - second interface; 112 - second side; 120 - camera module; 121 - image sensor; 130 - detection circuit; 140 - power supply circuit; 150 - clock supply circuit; 200 - external image processing device; 210 - second connector; 211 - second test pin; 212 - third interface; 220 - image processing module. DETAILED DESCRIPTION

[0018] In order to better understand the technical solutions in the embodiments of the present disclosure, the technical solutions in the embodiments of the present disclosure will be clearly and completely described below in combination with the drawings in the embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, not all embodiments. Based on the embodiments in the embodiments of the present disclosure, all other embodiments obtained by those of ordinary skill in the art should belong to the scope of protection of the present disclosure.

[0019] The following description of the embodiments is made with reference to the accompanying drawings, which illustrate specific embodiments in which the present disclosure can be implemented. The serial numbers of components in this document, such as "first", "second", etc., are only used to distinguish the described objects, and do not have any sequence or technical meaning. The "connection" and "coupling" in the present disclosure include direct and indirect connections (couplings) unless otherwise specified. The direction terms mentioned in the present disclosure, such as "up", "down", "front", "back", "left", "right", "inside", "outside", "side", etc., are only the direction of the attached drawings. Therefore, the direction terms used are to better and more clearly illustrate and understand the present disclosure, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present disclosure.

[0020] The specific implementation of the embodiments of the present disclosure will be further described below in combination with the drawings of the embodiments of the present disclosure.

[0021] Reference is made to Figure 1 , Figure 1 The structure of the image acquisition device according to the embodiments of the present disclosure is shown in Figure 1 . As Figure 1 shown, in some embodiments, the image acquisition device 100 includes a first connector 110, a camera module 120, and a detection circuit 130.

[0022] The first connector 110 can have a first side 111 and a second side 112. The first side 111 is opposite to the second side 112, and the first side 111 is provided with a first interface 1111 and a first test pin 1112. The second side 112 is used to plugably connect the first connector 110 with a second connector 210 of an external image processing device 200. The camera module 120 can be connected to the first connector 110 through the first interface 1111. One end of a detection circuit 130 is connected to the first connector 110 through the first test pin 1112, and the other end of the detection circuit 130 is used to receive a constant level signal.

[0023] As shown in FIG. 1, the first connector 110 can be provided with a first test pin 111 and a second interface 112. Figure 1 As shown in FIG. 1, the second connector 210 can be provided with a second test pin 211 and a third interface 212.

[0024] In a state that the first connector 110 is connected with the second connector 210, the external image processing device 200 controls the connection between the external image processing device 200 and the image acquisition device 100 by detecting the level change of the second test pin 211. The constant level signal is different from the initial level signal of the second test pin 211.

[0025] The image acquisition device 100 in the embodiment of the present disclosure can be used to acquire image and video data. The external image processing device 200 can be used to receive the image and video data acquired by the image acquisition device 100, and further process the image and video data. For example, the external image processing device 200 can process or display the image and video data, or reconstruct a virtual scene based on the received image and video data, or perform visual positioning based on the received image and video data.

[0026] In the embodiment of the present disclosure, the image acquisition device 100 and the external image processing device 200 can be plugably connected through the plugable connection between the second side 112 of the first connector 110 and the second connector 210. When the connection between the image acquisition device 100 and the external image processing device 200 is established, the image data can be transmitted from the image acquisition device 100 to the external image processing device 200.

[0027] In a case that the camera module 120 in the image acquisition device 100 is connected to the first connector 110 through the first interface 1111, and the image processing module 210 in the external image processing device 200 is connected to the second connector 210 through the third interface 212, the plugable connection between the camera module 120 in the image acquisition device 100 and the image processing module 210 in the external image processing device 200 can be established through the plugable connection between the first connector 110 and the second connector 210.

[0028] According toFigure 1 It can be known that when the first connector 110 is connected with the second connector 210, the second test pin 211 in the second connector 210 will be in communication with the first test pin 1112 in the first connector 110. Further, due to the detection circuit 130 in the image acquisition device 100, one end of which is connected to the first connector 110 through the first test pin 1112, and the other end of which receives a constant level signal, when the first connector 110 is connected with the second connector 210, the level signal of the second test pin 211 will be changed from the initial level signal to the constant level signal. Similarly, when the first connector 110 is disconnected with the second connector 210, the level signal of the second test pin 211 will be changed from the constant level signal to the initial level signal.

[0029] Based on the above analysis, the external image processing device 200 can determine the connection state between the external image processing device 200 and the image acquisition device 100 by detecting the level change of the second test pin 211. Specifically, when it is detected that the level of the second test pin 211 is the initial level signal, it is determined that the external image processing device 200 and the image acquisition device 100 are in a disconnected state; when it is detected that the level of the second test pin 211 is the constant level signal, it is determined that the external image processing device 200 and the image acquisition device 100 are in a connected state.

[0030] In the embodiments of the present disclosure, the constant level signal and the initial level signal can be any two different level signals, and the specific values of the constant level signal and the initial level signal are not limited, and can be defined according to actual conditions.

[0031] The image acquisition device 100 provided by the embodiments of the present disclosure realizes the pluggable connection between the camera module 120 and the external image processing device 200 through the conversion of the first connector 110; through the detection circuit 130, when the connection state between the image acquisition device 100 and the external image processing device 200 changes, the level of the second test pin 211 of the second connector 210 in the external image processing device 200 also changes, so that the external image processing device 200 can perceive the plugging state of the image acquisition device 100 by detecting the level change of the second test pin 211. Through simple hardware improvement, the embodiments of the present disclosure realize the hot plugging connection between the camera module 120 and the external image processing device 200, and can realize the connection between the external image processing device 200 and the camera module 120 at any time without affecting the operation of the external image processing device 200.

[0032] In the embodiments of the present disclosure, when the connection between the image acquisition device 100 and the external image processing device 200 is established, the image data acquired by the image acquisition device 100 can be transmitted to the external image processing device 200 through the first interface 1111. In the embodiments of the present disclosure, the specific form of the first interface 1111 is not limited, and a suitable data transmission interface can be selected as the first interface 1111 in the embodiments of the present disclosure according to the actual situation.

[0033] In some embodiments, the first interface 1111 described above can be a MIPI interface. Specifically, the MIPI interface generally includes a pair of differential data signal lines and a pair of differential clock signal lines.

[0034] The pair of differential clock signal lines (such as MIPI CLKP and MIPI CLKN as a group of differential clock signal lines) are used to transmit clock signals to achieve synchronous transmission of data. Specifically, MIPI CLKP is the positive line of the clock signal, which is used to transmit the positive part of the clock signal; MIPI CLKN is the negative line of the clock signal, which is used to transmit the negative part of the clock signal.

[0035] The pair of differential data signal lines (such as MIPI D0P and MIPI D0N as the first group of differential lines, and MIPI D1P and MIPI D1N as the second group of differential lines) are used for data signal transmission. Specifically, MIPI D0P and MIPI D0N jointly constitute a group of differential lines in differential signal transmission, wherein MIPI D0P is the positive line of the 0th data channel, which is used to transmit the positive part of the data signal, and MIPI D0N is the negative line of the 0th data channel, which is used to transmit the negative part of the data signal; MIPI D1P and MIPI D1N jointly constitute another group of differential lines in differential signal transmission, wherein MIPI D1P is the positive line of the 1st data channel, which is used to transmit the positive part of the data signal, and MIPI D1N is the negative line of the 1st data channel, which is used to transmit the negative part of the data signal.

[0036] In the MIPI interface, data signals are usually transmitted through differential lines, and this differential signal transmission method helps to resist external electromagnetic interference, because they are all transmitted on the same pair of lines, and the positive and negative phase changes are relative, so that the original signal can be recovered by comparing the voltage difference between the two at the receiving end, thereby reducing the influence of noise.

[0037] In summary, using the MIPI interface as the first interface 1111 can improve the rate and stability of data transmission from the image acquisition device 100 to the external image processing device 200.

[0038] In some embodiments, one end of the detection circuit 130 can be connected to the first connector 110 through the first test pin 1112, and the other end of the detection circuit 130 is grounded, and the second test pin 211 of the second connector 210 is connected to the pull-up power supply through a pull-up resistor.

[0039] It can be understood that the initial level signal provided by the pull-up power supply is higher than the ground signal.

[0040] When the other end of the detection circuit 130 is grounded, the constant level signal received by the detection circuit 130 is the ground signal. When the second test pin 211 of the second connector 210 is connected to the pull-up power supply through a pull-up resistor, the initial level signal of the second test pin 211 is a high level signal compared to the ground signal. Therefore, when the first connector 110 is connected to the second connector 210 through the second side 112, the second test pin 211 is lowered from the initial level signal to the ground signal; correspondingly, when the first connector 110 is disconnected from the second connector 210, the second test pin 211 is restored from the ground signal to the higher initial level signal.

[0041] Therefore, in the above-mentioned embodiments of the present disclosure, when the first connector 110 is connected to the second connector 210 through the second side 112, the external image processing device 200 will detect that the second test pin 211 is lowered from the initial level signal to the ground signal, at this time, the connection between the external image processing device 200 and the image acquisition device 100 is established.

[0042] When the second side 112 of the first connector 110 is disconnected from the second connector 210, the external image processing device 200 can detect that the second test pin 211 is raised from the ground signal to the initial level signal, at this time, the connection between the external image processing device 200 and the image acquisition device 100 is disconnected.

[0043] In the case where one end of the detection circuit 130 is connected to the ground line (GND) and the second test pin 211 is connected to the pull-up power supply through a pull-up resistor, when the connection between the external image processing device 200 and the image acquisition device 100 is not established, the level signal of the second test pin 211 remains the initial level signal provided by the pull-up power supply. In the case where the connection between the external image processing device 200 and the image acquisition device 100 is established, the level signal of the second test pin 211 is lowered from the initial level signal provided by the pull-up power supply to the ground signal received by the detection circuit 130.

[0044] In the case that the connection between the external image processing device 200 and the image acquisition device 100 is established, the level signal of the second test pin 211 is a ground signal received by the detection circuit 130. In the case that the connection between the external image processing device 200 and the image acquisition device 100 is disconnected, the level signal of the second test pin 211 is raised from the ground signal received by the detection circuit 130 to an initial level signal provided by the pull-up power supply.

[0045] In the above embodiment, whether the connection between the external image processing device 200 and the image acquisition device 100 is established or disconnected is determined according to the level signal of the second test pin 211, which can improve the timeliness and convenience of establishing or disconnecting the connection between the external image processing device 200 and the image acquisition device 100 compared with determining whether the connection between the external image processing device 200 and the image acquisition device 100 is established or disconnected through the process of signal processing.

[0046] In other embodiments, the constant level signal received by the other end of the detection circuit 130 can also be provided by the pull-up power supply. The second test pin 211 in the second connector 210 is connected to the pull-down power supply through a pull-down resistor.

[0047] The initial level signal is a level signal provided by the pull-down power supply, and the constant level signal is a level signal provided by the pull-up power supply. The initial level signal provided by the pull-down power supply is lower than the constant level signal provided by the pull-up power supply.

[0048] Hereinafter, the case that the constant level signal received by the other end of the detection circuit 130 is provided by the pull-up power supply, and the second test pin 211 in the second connector 210 is connected to the pull-down power supply through a pull-down resistor is taken as an example for description.

[0049] When the constant level signal received by the other end of the detection circuit 130 is provided by the pull-up power supply, the constant level signal received by the detection circuit 130 is a high level signal. When the second test pin 211 in the second connector 210 is connected to the pull-down power supply through a pull-down resistor, the initial level signal of the second test pin 211 is a low level signal compared with the above high level signal. Therefore, when the first connector 110 is connected to the second connector 210 through the second side surface 112, the second test pin 211 changes from the lower initial level signal to the high level signal. Correspondingly, when the first connector 110 is disconnected from the second connector 210, the second test pin 211 returns from the high level signal to the lower initial level signal.

[0050] Therefore, in the above embodiment of the present disclosure, when the first connector is connected with the second connector through the second side surface, the external image processing device can detect that the second test pin changes from the initial level signal to the high level signal, and at this time, the connection between the external image processing device and the image acquisition device is established; when the second side surface 112 of the first connector 110 is disconnected with the second connector 210 in the external image processing device 200, the external image processing device 200 can detect that the second test pin 211 changes from the constant level signal to the initial level signal, and the connection between the external image processing device 200 and the image acquisition device 100 is disconnected.

[0051] In the case that the constant level signal received by the detection circuit 130 at one end is provided by the pull-up power supply, the second test pin 211 is connected with the pull-down power supply through the pull-down resistor, and the connection between the external image processing device 200 and the image acquisition device 100 is not established, the level signal of the second test pin 211 remains the initial level signal. In the case that the connection between the external image processing device 200 and the image acquisition device 100 is established, the level signal of the second test pin 211 changes from the initial level signal to the constant level signal received by the detection circuit 130.

[0052] In the case that the connection between the external image processing device 200 and the image acquisition device 100 is established, the level signal of the second test pin 211 is the constant level signal received by the detection circuit 130 and provided by the pull-up power supply. In the case that the connection between the external image processing device 200 and the image acquisition device 100 is disconnected, the level signal of the second test pin 211 changes from the ground signal to the initial level signal provided by the pull-down power supply.

[0053] In the above embodiment, whether the connection between the external image processing device 200 and the image acquisition device 100 is established or disconnected is determined according to the level signal of the second test pin 211, compared with determining whether the connection between the external image processing device 200 and the image acquisition device 100 is established or disconnected through the process of signal processing, the method can improve the timeliness and convenience of establishing or disconnecting the connection between the external image processing device 200 and the image acquisition device 100.

[0054] In some embodiments, the detection circuit 130 can include a preset detection resistor. One end of the preset detection resistor is connected to the first connector 110 through the first test pin 1112, and the other end of the preset detection resistor receives the constant level signal.

[0055] The preset detection resistor can be arranged at one end of the detection circuit 130 for receiving a constant level signal. Arranging the preset detection resistor in the detection circuit 130 can limit the current flowing through the detection circuit 130, protect the detection circuit 130 from damage in case of overcurrent, and limit the fault current in case of detection circuit 130 failure, reducing the impact of the failure.

[0056] Figure 2 Structure diagram of the image acquisition device according to some embodiments of the present disclosure Figure 2 , Figure 3 Structure diagram of the image acquisition device according to some embodiments of the present disclosure. In combination with the diagrams shown in Figure 1 、 Figure 2 and Figure 3 , in some embodiments, the camera module 120 can include an image sensor 121, and the image acquisition device 100 can further include a power supply circuit 140 and a clock supply circuit 150.

[0057] The first side 111 of the first connector 110 is further provided with a power enable pin 1113 and a clock crystal enable pin 1114; the power supply circuit 140 is connected to the first connector 110 through the power enable pin 1113; and the clock supply circuit 150 is connected to the first connector 110 through the clock crystal enable pin 1114.

[0058] After the external image processing device 200 and the image acquisition device 100 are connected, the power supply circuit 140 is enabled based on the power enable signal received through the power enable pin 1113 to supply power to the image sensor 121. The clock supply circuit 150 is enabled based on the clock enable signal received through the clock crystal enable pin 1114 to provide a clock signal to the image sensor 121.

[0059] In some embodiments, the power supply circuit 140 can include multiple DC-DC (direct current-direct current) converters. For example, it can include a DC-DC converter that converts an input direct current voltage from 3.3V to 2.8V, a DC-DC converter that converts an input direct current voltage from 3.3V to 1.8V, and a DC-DC converter that converts an input direct current voltage from 3.3V to 1.1V. It can also be a DC-DC converter with other conversion ratios set according to actual needs.

[0060] After the external image processing device 200 and the image acquisition device 100 are connected, the power supply circuit 140 can convert the voltage of the received power according to the power enable signal received by the power enable pin 1113, and deliver the converted power to the image sensor 121 to supply power to the image sensor 121.

[0061] In some embodiments, the clock supply circuit 150 can be an oscillator with a frequency of 24 megahertz, for example, can be a crystal oscillator with a frequency of 24 megahertz, or a resistance-capacitance (RC) oscillator or a micro-electromechanical system oscillator (MEMS), etc., which is not particularly limited in the present disclosure.

[0062] In the above embodiments, the power supply circuit 140 and the clock supply circuit 150 are integrated in the image acquisition device 100. The power supply circuit 140 can provide more stable and accurate power supply for the image acquisition device 100. The clock supply circuit 150 can ensure that the image sensor 121 and other components in the image acquisition device 100 work at the same time, improving the efficiency and reliability of the functions in the image acquisition device 100.

[0063] As shown in Figure 4 , the image acquisition device according to the embodiments of the present disclosure comprises a first connector 110 and a second connector 210. Figure 4 The structure of the image acquisition device according to the embodiments of the present disclosure is shown in Figure 3 In some embodiments, a second interface 1115 is further arranged in the first side 111 of the first connector 110, and the second interface 1115 is used to initialize and configure the image acquisition device 100 by the external image processing device 200 through the second interface 1115 when the external image processing device 200 is connected to the image acquisition device 100.

[0064] In some embodiments, the second interface 1115 can be an I2C (Inter-Integrated Circuit) interface. The I2C interface can include an SDA (Serial Data Line) and an SCL (Serial Clock Line). The SDA is used to transmit data, and the SCL is used to synchronize data transmission. Since the I2C interface only uses two lines of SDA and SCL for communication, the hardware connection is simplified, and therefore, the transmission of configuration data between the external image processing device 200 and the image acquisition device 100 through the I2C interface can simplify the hardware design and save costs. In addition, the I2C protocol provides a simple communication mechanism, which is easy to control and configure through software, so it is convenient to realize the automatic image acquisition device 100 initialization and configuration process. In addition, the I2C interface also supports hot plugging, and in the case of hot plugging between the external image processing device 200 and the image acquisition device 100 through the scheme of the embodiments of the present disclosure, through the I2C interface, the connection between the external image processing device 200 and the image acquisition device 100 can be realized without affecting the operation of the device, improving the convenience of device use and maintenance.

[0065] In some embodiments, the first connector 110 and the second connector 210 can be microneedles.

[0066] The first connector 110 and the second connector 210 can be micro needles for realizing direct connection of devices. The micro needles have small size and low contact resistance, and support high-speed data transmission. By using the micro needles as the first connector 110 and the second connector 210, on one hand, the first connector 110 and the second connector 210 can occupy smaller space and be more suitable for fine devices. On the other hand, the transmission rate of data between the image acquisition device 100 and the external image processing device 200 can be improved.

[0067] Figure 5 FIG. 1 is a schematic diagram of connection of an image acquisition device and an image processing device in the related art. Figure 5 As shown in FIG. 1, in the related art, a chip (corresponding to the image processing module 220 in the above embodiment) and a camera module 120 are connected through a USB (Universal Serial Bus) interface to realize hot plug and communication connection, thereby realizing data transmission.

[0068] The camera module 120 is first connected to an adapter through an MIPI interface, and then connected to the USB interface through the adapter. When the USB interface is connected to a USB interface provided in the chip, hot plug connection and communication connection between the chip and the camera module 120 are realized.

[0069] Generally, the number of USB interfaces provided on the chip is limited. For example, a chip of some smart glasses is provided with only one USB interface, and the USB interface is usually connected to a USB external interface provided on a temple of the smart glasses. The USB external interface is used to connect to an external power supply and a content source device, so that the smart glasses without power supply can work. When the smart glasses still need to be connected to a pluggable camera module, the only USB interface on the chip cannot meet the requirement. On the other hand, the above adapter mode needs to introduce a USB interface and an adapter, and thus can cause the problem of large hardware size.

[0070] Figure 6 FIG. 2 is a schematic diagram of an image acquisition device and an external image processing device according to an embodiment of the present disclosure. Figure 6As shown, in the embodiment of the present disclosure, the communication connection between the chip (corresponding to the image processing module 220 in the above embodiment) and the camera module 120 can be realized through the connection between the MIP interface on the chip and the microneedle (corresponding to the first connector 110 and the second connector 210 in the above embodiment). The hot plug connection between the chip and the camera module 120 can be realized through the connection between the IO (Input / Output) interface and the microneedle, and the connection between the microneedle and the detection circuit 130. In this way, the original USB interface on the chip will not affect the connection between the external power supply and the content source device.

[0071] In the embodiment of the present disclosure, the communication connection between the chip and the camera module is realized through the microneedle, which takes into account the connection requirements of the chip, the camera module, the external power supply and the content source device. The microneedle can also reduce the hardware size compared with the USB interface and the adapter introduced in the above prior art.

[0072] Referring to Figure 7 , Figure 7 The connection relationship diagram of the smart glasses suitable for the embodiment of the present disclosure is shown. In combination with Figure 1 and Figure 7 , the smart glasses include a main body 10 and an image acquisition device 100, wherein the main body 10 is provided with an external image processing device 200 relative to the image acquisition device 100.

[0073] The image acquisition device 100 includes a first connector 110, the first connector 110 having a first side 111 and a second side 112, the first side 111 being opposite to the second side 112; the first side 111 is provided with a first interface 1111 and a first test pin 1112; the second side 112 is used to plugably connect the first connector 110 with a second connector 210 of the external image processing device 200.

[0074] The camera module 120 is connected to the first connector 110 through the first interface 1111.

[0075] The detection circuit 130 has one end connected to the first connector 110 through the first test pin 1112, and the other end used to receive a constant level signal.

[0076] In the state that the first connector 110 is connected with the second connector 210, the external image processing device 200 controls the connection between the external image processing device 200 and the image acquisition device 100 by detecting the level change of the second test pin 211; wherein the constant level signal is different from the initial level signal of the second test pin 211.

[0077] The intelligent glasses provided by the embodiments of the present disclosure realize the pluggable connection between the camera module 120 and the external image processing device 200 arranged in the intelligent glasses main body 10 through the adapting effect of the first connector 110; the level of the second test pin 211 of the second connector 210 in the external image processing device 200 changes when the connection state between the image acquisition device 100 and the external image processing device 200 changes, so that the external image processing device 200 in the intelligent glasses main body 10 can perceive the plugging state of the image acquisition device 100 by detecting the level change of the second test pin 211. Through simple hardware improvement, the embodiments of the present disclosure realize the hot plugging connection between the camera module 120 and the internal and external image processing device of the intelligent glasses.

[0078] In the embodiments of the present disclosure, the image acquisition device 100 can be used to acquire image and video data, and the external image processing device 200 arranged in the intelligent glasses can be used to receive the image and video data acquired by the image acquisition device 100. For example, the external image processing device 200 can further process the image and video data to make the intelligent glasses have more functions. The specific use scene of the intelligent glasses is not limited in the embodiments of the present disclosure.

[0079] According to actual needs, when the user connects the first connector in the image acquisition device 100 with the second connector 210 in the intelligent glasses main body 10, the connection relationship between the image acquisition device 100 and the external image processing device 200 can be established through the adapting effect of the first connector 110, so as to realize the image data transmission between the image acquisition device 100 and the external image processing device 200; when the user disconnects the first connector 110 in the image acquisition device 100 from the second connector 210 in the intelligent glasses main body, the connection relationship between the image acquisition device 100 and the external image processing device 200 is disconnected.

[0080] Exemplarily, in a use scenario, during wearing the smart glasses, when the user wants to shoot an image or a video containing the surrounding environment, the first connector 110 in the image acquisition device 100 can be inserted into the second connector 210 in the smart glasses body 10, the surrounding environment is imaged by the image acquisition device 100 to obtain image frame data. Then, the image acquisition device 100 can send the collected image frame data to the external image processing device 200 through the first interface 1111, and the received image frame data is processed by the external image processing device 200 to obtain the image or the video that the user wants. When the user communicates face to face with others, in order to avoid exposing the privacy of others, the first connector 110 in the image acquisition device 100 can be pulled out of the second connector 210 in the smart glasses body 10, so as to disconnect the connection relationship between the image acquisition device 100 and the external image processing device 200.

[0081] In another use scenario, when the user wants to obtain more accurate position information, the first connector 110 in the image acquisition device 100 can be inserted into the second connector 210 in the smart glasses body 10 when the smart glasses have sufficient power, and the surrounding environment is imaged by the image acquisition device 100 to obtain image frame data. Then, the image frame data collected by the image acquisition device 100 can be transmitted to the external image processing device 200 through the first interface 1111, and the visual positioning is performed based on the received image frame data by the external image processing device 200, so as to obtain the visual positioning result. Further, the visual positioning result can be combined with the IMU (Inertial Measurement Unit) data collected by the smart glasses, so as to obtain more accurate and comprehensive positioning information. When the user does not need to obtain more accurate position information, or in the case that the power of the smart glasses is low, the user can pull out the first connector 110 in the image acquisition device 100 from the second connector 210 in the smart glasses body 10, so as to disconnect the connection relationship between the image acquisition device 100 and the external image processing device 200.

[0082] It should be noted that, according to the needs of implementation, each component / step described in the embodiments of the present disclosure can be split into more components / steps, or two or more components / steps or part of the operation of the components / steps can be combined into a new component / step, to achieve the purpose of the embodiments of the present disclosure.

[0083] The above-described methods according to embodiments of the present disclosure can be implemented in hardware, firmware, or software, or a combination thereof, and can be stored in a recording medium such as a CD-ROM, a RAM, a floppy disk, a hard disk, or an optical magnetic disk, or can be implemented by computer codes stored in a remote recording medium or a non-transitory machine-readable medium downloaded through a network and stored in a local recording medium, so that the methods described herein can be processed by such software processing using a general computer, a special processor, or programmable or special hardware such as an Application Specific Integrated Circuit (ASIC) or a Field Programmable Gate Array (FPGA). It can be understood that the computer, processor, microprocessor controller, or programmable hardware includes a storage component (for example, a Random Access Memory (RAM), a Read-Only Memory (ROM), a flash memory, etc.) that can store or receive software or computer codes, which, when accessed and executed by the computer, processor, or hardware, implement the methods described herein. In addition, when a general computer accesses the codes for implementing the methods shown herein, the execution of the codes will convert the general computer into a special computer for executing the methods shown herein.

[0084] Those skilled in the art can appreciate that the units and method steps of the examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether the functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. A skilled person can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of the embodiments of the present disclosure.

[0085] The above embodiments are only used to illustrate but not limit the embodiments of the present disclosure, and a person of ordinary skill in the art can make various changes and modifications without departing from the spirit and scope of the embodiments of the present disclosure, therefore all equivalent technical solutions belong to the scope of the embodiments of the present disclosure, and the patent protection scope of the embodiments of the present disclosure should be defined by the claims.

Claims

1. An image acquisition device comprising: a first connector having a first side and a second side, the first side being opposite to the second side; a first interface and a first test pin are arranged on the first side; the second side is used to plugably connect the first connector with a second connector of an external image processing device; a camera module connected to the first connector through the first interface; and a detection circuit having one end connected to the first connector through the first test pin and the other end used to receive a constant level signal; in a state that the first connector is connected with the second connector, the external image processing device controls the connection between the external image processing device and the image acquisition device by detecting a level change of a second test pin; wherein the constant level signal is different from an initial level signal of the second test pin. the other end of the detection circuit is grounded, and the second test pin of the second connector is connected with a pull-up power supply through a pull-up resistor; 2. The apparatus of claim 1, wherein, when the first connector is connected with the second connector through the second side, the external image processing device detects that the second test pin is lowered from the initial level signal to a ground signal, and the connection between the external image processing device and the image acquisition device is established. when the second side of the first connector is disconnected with the second connector, the external image processing device can detect that the second test pin is raised from the ground signal to the initial level signal, and the connection between the external image processing device and the image acquisition device is disconnected.

3. The apparatus of claim 2, wherein, the constant level signal received by the other end of the detection circuit is provided by a pull-up power supply; and the second test pin in the second connector is connected with a pull-down power supply through a pull-down resistor; 4. The apparatus of claim 1, wherein, when the first connector is connected with the second connector of the external image processing device through the second side, the external image processing device can detect that the second test pin is raised from the initial level signal to the constant level signal, and the connection between the external image processing device and the image acquisition device is established. when the second side of the first connector is disconnected with the second connector in the external image processing device, the external image processing device can detect that the second test pin is lowered from the constant level signal to the initial level signal, and the connection between the external image processing device and the image acquisition device is disconnected.

5. The apparatus of claim 4, wherein, the detection circuit comprises a preset detection resistor; one end of the preset detection resistor is connected to the first connector through the first test pin; 6. The device of any one of claims 1-5, wherein, the other end of the preset detection resistor receives a constant level signal. the camera module comprises an image sensor; the image acquisition device further comprises a power supply circuit and a clock supply circuit.

7. The device of any one of claims 1-5, wherein, ​ The first side of the first connector is further provided with a power supply enable pin and a clock crystal enable pin; the power supply circuit is connected to the first connector through the power supply enable pin; and the clock supply circuit is connected to the first connector through the clock crystal enable pin. After the external image processing device and the image acquisition device are connected, the power supply circuit is enabled based on a power supply enable signal received through the power supply enable pin to supply power to the image sensor; and the clock supply circuit is enabled based on a clock enable signal received through the clock crystal enable pin to provide a clock signal to the image sensor.

8. The device of any one of claims 1-5, wherein, The first side of the first connector is further provided with a second interface, which is used to initialize and configure the image acquisition device through the second interface when the external image processing device and the image acquisition device are connected.

9. The device of any one of claims 1-5, wherein, The first connector and the second connector are microneedles.

10. An intelligent glasses, comprising: a main body, which is provided with an external image processing device; and an image acquisition device, which comprises: a first connector, which has a first side and a second side, the first side being opposite to the second side; the first side is provided with a first interface and a first test pin; and the second side is used to plugably connect the first connector with a second connector of an external image processing device; a camera module, which is connected to the first connector through the first interface; and a detection circuit, one end of which is connected to the first connector through the first test pin, and the other end of which is used to receive a constant level signal; in a state that the first connector and the second connector are connected, the external image processing device controls the connection between the external image processing device and the image acquisition device by detecting a level change of a second test pin; and the constant level signal is different from an initial level signal of the second test pin.

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